Hello,
I am trying to mount a packge design to the PCB. The solder ball pattern
on the package is layed out using Cadence (using icfb tool) and a cif version
of it is available from Cadence. The PCB vendors, however, require gerber
data to make the board and I don't know of any program or software that takes
cif as input and generates gerber output. How might I resolve the problem?
Thanks.
chirag
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Chirag Patel
PhD Candidate (Wafer Level Packaging)
Microelectronics Research Center
School of Electrical and Computer Engineering
Georgia Institute of Technology
Phone: (404) 894-9912
e-mail: chirag@ee.gatech.edu
"Nature has enough for everyone's need, not for their greed"
-- Mohandas K. Gandhi
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