Re: Through-hole via on Si

From: Garry J. Bordonaro (bordonaro@cnf.cornell.edu)
Date: Thu Jul 12 2001 - 13:47:21 EDT

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We use a PlasmaTherm/Unaxis RIE etcher with the Bosch process to etch
through-holes at about 2-3um/min. STS also makes one. Check our web site.

Garry

Hiren Thacker wrote:
>
> Hi:
>
> I am trying to create anisotropic through hole vias on a Si wafer. Has
> anyone done this kind of Si etch before? Please email me at
> hdt@ece.gatech.edu if you have as I'd like to get more information about
> this process.
>
> thanks,
>
> Hiren Thacker
> Georgia Institute of Technology

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Cornell Nanofabrication Facility at Cornell University G02 Knight Laboratory, Ithaca, New York 14853-5403 E-mail: bordonaro@cnf.cornell.edu URL: http://www.cnf.cornell.edu/ ****************************************************************************

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