Adhesion layer etchant

From: Yan Cheng (ycheng@hfm.e-technik.uni-kassel.de)
Date: Mon Sep 09 2002 - 17:51:06 EDT

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Could any one tell me the etchant for TiW or TaN or Cr, which is the
adhesion layer for the Cu film on silicon substrate? Any response would
be much appreciated.

Yan Cheng

-- --------------------------------------------------

Dipl. -Ing. Yan Cheng Fachgebiet Hochfrequenztechnik Universitaet Kassel Wilhelmshoeher Allee 73 34121 Kassel Germany

Tel: ++49 (0) 561-804-6528 Fax: ++49 (0) 561-804-6529 Email: ycheng@hfm.e-technik.uni-kassel.de

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