Labnet Users:
The Georgia Tech Microelectronics Research Center has a user that would
like to deposit PZT using our RF sputtering system. This system has in the
past been used to deposit Al2O3, SiO2, BST, CuO, ITO, ZnO, LiNbO3, MgO, Mo,
p-Si, SiNx, Ta, TaO, and TiO2.
Can anyone tell me about their experience depositing this material, in
particular:
[1] What are the cross contamination issues?
[2] What are the healtha and safety issues and cleanup procedures?
Thanks
kpm
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