David Kyser received the B.S. Engr (UCLA), the M.S.EE (USC), and the Ph.D.EE (USC ) with a major in Solid State Electronics. His Ph.D. thesis involved a study of cathodoluminescence in compound semiconductors. He joined the IBM San Jose Research Laboratory (1968) and conducted research in electron beam analysis methods and electron beam lithography for IC microfabrication. In 1981 he joined Philips Research Laboratory Sunnyvale (Signetics) and managed the Advanced Process Development Department composed of groups in lithography, plasma etch, and thin film process technology which was coordinated with Philips Research Labs (Eindhoven). In 1990 he joined AMD as Director of Advanced Process Development with groups in lithography, plasma etch, thin films, diffusion/implant, and polishing technology. The APD Directorate provided the key process module technology to enable AMD leadership in 3 major product technologies: X86 Microprocessors, flash EPROMS, and high density PLD. In early 1997, he was appointed to a new position as Director of Technology Research with a charter for exploring the limits of CMOS device technology and demonstrating feasibility for sub-1OOnm transistor technology. Responsibility for next-generation lithography research and high-performance interconnect research was added in 2000.
At AMD, he was part of the senior management team responsible for establishing and maintaining exchanges on flash memory technology with Fujitsu. He and his staff were involved in transferring new process technology into 3 large 200mm fabs: AMD Fab 25 (Texas), the AMD/FJ joint venture fabs (Japan), and the newer AMD Fab 30 (Germany). He was also part of the senior management team responsible for establishing and maintaining the alliances with Motorola and UMC for advanced microprocessor technology development. With the advent of the logic RID alliance established with IBM in early 2003, he was part of the senior management team responsible for maintaining technical direction and vitality of this strategic alliance, especially for sub-65nm IC technology research. In 2005. he joined Applied Materials as Senior Director for Strategic External Research, with global responsibility for identifying and implementing university research grants and consortia memberships. Under his leadership, AMAT joined the SRC in early 2006 which provides a new window into the academic research community for innovation in nanomanufacturing technology. His professional interests and activities include all aspects of IC microfabrication, life membership in the IEEE, leadership of professional conferences such as the Electronic Materials Symposium and the IEEE Lithography Workshop, with over 75 publications in the scientific literature. He served as a member of the VLSI Technology Symposium Program Committee, the SIA Lithography TWG, and is currently ETAB member from AMAT to the SRC.
