Dr. Yu joined TSMC in 1994. He is responsible for the development of critical module technology from 0.5mm to 45nm nodes. Doug initiated the Cu and low-k technologies of TSMC in 1997. He led R&D team to deliver Foundry’s 1st 0.13 mm SoC technology with Cu. His team also developed and transferred the first Cu/low-k technology in IC industry to volume production from 0.13mm node. More recently, Dr. Yu established 2nd generation advanced interconnect technology (Cu/Ultra-Low-k, ULK) for TSMC 45/40nm node. Over these years with the company, he is also in charge of the development on self-aligned salicides (Ti-, Co-, and Ni-based). Currently, Dr. Yu is a Senior Director of Advanced Module Technology Division of TSMC R&D, in charge of the exploratory study of end-to-end module technology for 22nm and beyond nodes. His responsibility includes the development of 3D-IC (Through-Silicon-Via) and advanced packaging technologies.
Prior to this, he was with AT&T Bell Labs at Allentown, PA, USA, where he was involved in the R&D of thin film processes, SRAM local interconnect, Thin-Film-Transistor, low-voltage and low-power device development, and modular Bi-CMOS integration. He received his BS in Physics from National Tsing-Hua University in Taiwan, and Ph.D. in materials science & engineering from Georgia Institute of Technology in USA.
Doug earned several national awards from Taiwan including Outstanding Invention Award, and Outstanding Scientific and Technical Award. Many structure and process inventions from the 215 US patents he holds are implemented in TSMC manufacturing processes. He has served as general co-chairs of IITC and chaired ITRS Interconnect conferences.
