MTL News

3-D-printed structures shrink when heated

October 26, 2016

Counterintuitive "metamaterial" may enable heat-resistant circuit boards.

MIT-Heat-Shrink-1_0.jpg
While most solid materials expand with heat, this 3-D-printed structure, designed by MIT engineers, is designed to shrink, based on the stretching and pulling of its internal beams and trusses.

Image: Qiming Wang

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