MTL Annual Research Report 2006
Electronic Devices & Emerging Technologies
- Amorphous Zinc-Oxide-Based Thin-film Transistors
A. Wang, I. Kymissis, P. Mardilovich, V. Bulovic, C.G. Sodini, A.I.
Akinwande
Sponsorship: Hewlett-Packard
- Fabrication of Germanium-on-Insulator
by Means of Wafer Bonding and Layer Transfer
J. Hennessy, D.A. Antoniadis
Sponsorship: MARCO MSD
- Strain Dependence
of Mobility in Ultra-thin SOI and GOI
A. Khakifirooz, D.A. Antoniadis
Sponsorship: MARCO MSD
- Towards
MOS Memory Devices Containing 1 nm Silicon Nanoparticles
O.M. Nayfeh, D.A. Antoniadis, K. Mantey, M.H. Nayfeh (University
of Illinois at Urbana-Champaign)
Sponsorship: MTL, University of
Illinois at Urbana-Champaign
- Study of Silicon Nanowire Growth
for Electronics Applications
O.M. Nayfeh, S. Boles, D.A. Antoniadis, C.V. Thompson, E.A. Fitzgerald
Sponsorship:
Singapore-MIT Alliance
- Bulk Germanium MOSFETs Using High-K Dielectrics
A. Ritenour, J. Hennessy, M.L. Lee, R.Z. Lei, E.A. Fitzgerald,
D.A. Antoniadis
Sponsorship: MARCO MSD
- Variation Analysis in Optical
Interconnect
K. Balakrishnan, D.S. Boning
Sponsorship: MARCO IFC
- Modeling
of Pattern-dependencies in the Fabrication of Multilevel Copper
Metallization
H. Cai, D.S. Boning
Sponsorship: NSF/SRC Engineering Research Center
for Environmentally Benign Semiconductor Manufacturing, MagnaChip
- Test Circuits for Assessment of IC Variation
K.G.V. Gettings, D.S. Boning
Sponsorship: Bell Labs CRFP Fellowship,
IBM
- Modeling and Extraction of Variation in Physical Process Parameters
D. Lim, D.S. Boning
Sponsorship: MARCO C2S2, IBM
- Combined Technology
and Environmental Assessment of 3D Integrated Circuit Process Alternatives
A. Somani, P. Gschwend, D.S. Boning
Sponsorship: NSF/SRC Engineering
Research Center for Environmentally Benign Semiconductor Manufacturing
- Polishing Pad Effects in CMP
D. Truque, X. Xie, D.S. Boning
Sponsorship: SRC Engineering Research
Center for Environmentally Benign Semiconductor Manufacturing
- Application
of CMP Models to Issues in Shallow Trench Isolation
X. Xie, D.S. Boning
Sponsorship: IMEC, Infineon Technologies, Rohm
and Haas, Siltronic AG
- Potential of InGaAs High-electron Mobility Transistors as a
Beyond-CMOS Logic Technology
D.H. Kim, J.A. del Alamo
Sponsorship: Intel, MARCO MSD
- Electrical Degradation of GaN High Electron Mobility Transistors
J. Joh, J.A. del Alamo
Sponsorship: DARPA, ARL
- Through-substrate Interconnects for Millimeter-wave Mixed Signal
Systems
J.H. Wu, J.A. del Alamo
Sponsorship: Applied Materials Graduate
Fellowship
- Performance and Limitations of 65-nm CMOS for Integrated RF
Power Applications
J. Scholvin, D.R. Greenberg (IBM), J.A. del Alamo
Sponsorship: IBM
Faculty Award, IBM Ph.D. Fellowship
- Non-Uniform Degradation Behavior in RF Power GaAs PHEMTs
A.A. Villanueva, J.A. del Alamo
Sponsorship: Mitsubishi Electric
- A Self-aligned, InGaAs, High-Electron-Mobility, Transistor-Device
Architecture for Future Logic Applications
N. Waldron, J.A. del Alamo
Sponsorship: MARCO MSD, Intel Foundation
Ph.D. Fellowship
- Fabrication of Silicon on Lattice-engineered Substrate (SOLES)
as a Platform for Monolithic Integration of Si- and GaAs-based
Devices
C.L. Dohrman, K. Chilukuri, D.M. Isaacson, M.L. Lee, E.A. Fitzgerald
Sponsorship:
MARCO IFC, CMSE, MTL
- Thermally Relaxed, Ultra-thin, SiGe Buffers
S. Gupta, D.M. Isaacson, Y. Bai, E.A. Fitzgerald
Sponsorship: MARCO
MSD
- Microstructural and Electrical Characteristics of AlN Gate Dielectrics
Deposited on Ge and GaAs Channels
M.L. Lee, A. Ritenour, D.A. Antoniadis, E.A. Fitzgerald
Sponsorship:
MARCO MSD
- High-Quality InP-on-GaAs using Graded Buffers Grown by Metal
Organic Vapor Phase Epitaxy (MOVPE)
N. Quitoriano, E.A. Fitzgerald
Sponsorship: ARO, MARCO MSD
- Hole Mobility in High-Ge-content, Strained SiGe-Channel MOSFETs
C. Ní Chléirigh, O.O. Olubuyide, J.L. Hoyt
Sponsorship:
SRC, MARCO MSD, Applied Materials
- Strained Si/Strained Ge Heterostructure-on-Insulator
L. Gomez, M.K. Kim, C. Ní Chléirigh, I. Åberg,
J.L. Hoyt
Sponsorship: MARCO MSD, Applied Materials
- Patterning-induced Strain Changes in Strained Si/Strained SiGe
Heterostructures
P. Hashemi, L. Gomez, J.L. Hoyt
Sponsorship: MARCO MSD
- The Initial Stages of Ge-on-Si and Ge-on-SiGe Epitaxial Growth
M. Kim, O.O. Olubuyide, L. Gomez, J.L. Hoyt
Sponsorship: DARPA,
NSF Graduate Research Fellowship
- CMOS-compatible Epitaxial LPCVD Ge-on-Si Photodiodes
O.O. Olubuyide, M. Kim, J. Yasaitis, J. Michel, J. Liu, L.C. Kimerling,
J.L. Hoyt
Sponsorship: Analog Devices, IBM, SRC
- Interdiffusion in SiGe/Si Epitaxial Heterostructures
G. Xia, J.L. Hoyt
Sponsorship: MARCO MSD
- Magnetic Rings for Memory and Logic Devices
F.J. Castaño, D. Morecroft, W. Jung, J.D. Suh, C.A. Ross
Sponsorship:
Cambridge-MIT Institute, Singapore-MIT Alliance, Outgoing Marie
Curie Fellowship, NSF
- Surface Electromigration and Void Dynamics in Copper Interconnects
Z.S. Choi, R. Moenig, C.V. Thompson
Sponsorship: Intel, AMD, SRC
- Bonded Copper Interconnects and Integrated Microchannels for
3D Integrated Circuits
R. Tadepalli, H.L. Leong, C.L. Gan, K.L. Pey, D.E. Troxel, K. Turner,
C.V. Thompson
Sponsorship: DARPA (3D Integrated Circuits), Singapore-MIT
Alliance, IME
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