MTL Annual Research Report 2006

Electronic Devices & Emerging Technologies

• Amorphous Zinc-Oxide-Based Thin-film Transistors
  A. Wang, I. Kymissis, P. Mardilovich, V. Bulovic, C.G. Sodini, A.I. Akinwande
  Sponsorship: Hewlett-Packard
• Fabrication of Germanium-on-Insulator by Means of Wafer Bonding and Layer Transfer
  J. Hennessy, D.A. Antoniadis
  Sponsorship: MARCO MSD
• Strain Dependence of Mobility in Ultra-thin SOI and GOI
  A. Khakifirooz, D.A. Antoniadis
  Sponsorship: MARCO MSD
• Towards MOS Memory Devices Containing 1 nm Silicon Nanoparticles
  O.M. Nayfeh, D.A. Antoniadis, K. Mantey, M.H. Nayfeh (University of Illinois at Urbana-Champaign)
  Sponsorship: MTL, University of Illinois at Urbana-Champaign
• Study of Silicon Nanowire Growth for Electronics Applications
  O.M. Nayfeh, S. Boles, D.A. Antoniadis, C.V. Thompson, E.A. Fitzgerald
  Sponsorship: Singapore-MIT Alliance
• Bulk Germanium MOSFETs Using High-K Dielectrics
  A. Ritenour, J. Hennessy, M.L. Lee, R.Z. Lei, E.A. Fitzgerald, D.A. Antoniadis
  Sponsorship: MARCO MSD
• Variation Analysis in Optical Interconnect
  K. Balakrishnan, D.S. Boning
  Sponsorship: MARCO IFC
• Modeling of Pattern-dependencies in the Fabrication of Multilevel Copper Metallization
  H. Cai, D.S. Boning
  Sponsorship: NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing, MagnaChip
• Test Circuits for Assessment of IC Variation
  K.G.V. Gettings, D.S. Boning
  Sponsorship: Bell Labs CRFP Fellowship, IBM
• Modeling and Extraction of Variation in Physical Process Parameters
  D. Lim, D.S. Boning
  Sponsorship: MARCO C2S2, IBM
• Combined Technology and Environmental Assessment of 3D Integrated Circuit Process Alternatives
  A. Somani, P. Gschwend, D.S. Boning
  Sponsorship: NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing
• Polishing Pad Effects in CMP
  D. Truque, X. Xie, D.S. Boning
  Sponsorship: SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing
• Application of CMP Models to Issues in Shallow Trench Isolation
  X. Xie, D.S. Boning
  Sponsorship: IMEC, Infineon Technologies, Rohm and Haas, Siltronic AG
• Potential of InGaAs High-electron Mobility Transistors as a Beyond-CMOS Logic Technology
  D.H. Kim, J.A. del Alamo
  Sponsorship: Intel, MARCO MSD
• Electrical Degradation of GaN High Electron Mobility Transistors
  J. Joh, J.A. del Alamo
  Sponsorship: DARPA, ARL
• Through-substrate Interconnects for Millimeter-wave Mixed Signal Systems
  J.H. Wu, J.A. del Alamo
  Sponsorship: Applied Materials Graduate Fellowship
• Performance and Limitations of 65-nm CMOS for Integrated RF Power Applications
  J. Scholvin, D.R. Greenberg (IBM), J.A. del Alamo
  Sponsorship: IBM Faculty Award, IBM Ph.D. Fellowship
• Non-Uniform Degradation Behavior in RF Power GaAs PHEMTs
  A.A. Villanueva, J.A. del Alamo
  Sponsorship: Mitsubishi Electric
• A Self-aligned, InGaAs, High-Electron-Mobility, Transistor-Device Architecture for Future Logic Applications
  N. Waldron, J.A. del Alamo
  Sponsorship: MARCO MSD, Intel Foundation Ph.D. Fellowship
• Fabrication of Silicon on Lattice-engineered Substrate (SOLES) as a Platform for Monolithic Integration of Si- and GaAs-based Devices
  C.L. Dohrman, K. Chilukuri, D.M. Isaacson, M.L. Lee, E.A. Fitzgerald
  Sponsorship: MARCO IFC, CMSE, MTL
• Thermally Relaxed, Ultra-thin, SiGe Buffers
  S. Gupta, D.M. Isaacson, Y. Bai, E.A. Fitzgerald
  Sponsorship: MARCO MSD
• Microstructural and Electrical Characteristics of AlN Gate Dielectrics Deposited on Ge and GaAs Channels
  M.L. Lee, A. Ritenour, D.A. Antoniadis, E.A. Fitzgerald
  Sponsorship: MARCO MSD
• High-Quality InP-on-GaAs using Graded Buffers Grown by Metal Organic Vapor Phase Epitaxy (MOVPE)
  N. Quitoriano, E.A. Fitzgerald
  Sponsorship: ARO, MARCO MSD
• Hole Mobility in High-Ge-content, Strained SiGe-Channel MOSFETs
  C. Ní Chléirigh, O.O. Olubuyide, J.L. Hoyt
  Sponsorship: SRC, MARCO MSD, Applied Materials
• Strained Si/Strained Ge Heterostructure-on-Insulator
  L. Gomez, M.K. Kim, C. Ní Chléirigh, I. Åberg, J.L. Hoyt
  Sponsorship: MARCO MSD, Applied Materials
• Patterning-induced Strain Changes in Strained Si/Strained SiGe Heterostructures
  P. Hashemi, L. Gomez, J.L. Hoyt
  Sponsorship: MARCO MSD
• The Initial Stages of Ge-on-Si and Ge-on-SiGe Epitaxial Growth
  M. Kim, O.O. Olubuyide, L. Gomez, J.L. Hoyt
  Sponsorship: DARPA, NSF Graduate Research Fellowship
• CMOS-compatible Epitaxial LPCVD Ge-on-Si Photodiodes
  O.O. Olubuyide, M. Kim, J. Yasaitis, J. Michel, J. Liu, L.C. Kimerling, J.L. Hoyt
  Sponsorship: Analog Devices, IBM, SRC
• Interdiffusion in SiGe/Si Epitaxial Heterostructures
  G. Xia, J.L. Hoyt
  Sponsorship: MARCO MSD
• Magnetic Rings for Memory and Logic Devices
  F.J. Castaño, D. Morecroft, W. Jung, J.D. Suh, C.A. Ross
  Sponsorship: Cambridge-MIT Institute, Singapore-MIT Alliance, Outgoing Marie Curie Fellowship, NSF
• Surface Electromigration and Void Dynamics in Copper Interconnects
  Z.S. Choi, R. Moenig, C.V. Thompson
  Sponsorship: Intel, AMD, SRC
• Bonded Copper Interconnects and Integrated Microchannels for 3D Integrated Circuits
  R. Tadepalli, H.L. Leong, C.L. Gan, K.L. Pey, D.E. Troxel, K. Turner, C.V. Thompson
  Sponsorship: DARPA (3D Integrated Circuits), Singapore-MIT Alliance, IME

for further reading...

• Prediction of Variation in Advanced Process Technology Nodes
• Design of a High-speed, High-resolution DAC in 2-D and 3-D Processes
• Catalyst Engineering and Nanowire Growth Mechanisms
• Templated Self-Assembly for Nano-particle Organization: Solid State Dewetting
  
• Catalyst Engineering and Carbon Nanotube Growth Mechanisms
  
• Templated Self-Assembly for Nano-Particle Organization: Templated, Ordered Porous Alumina Templates
• Stress and Structure Evolution Film Formation through Island Coalescence
• Magnetically Assisted Statistical Assembly of III-V Devices on CMOS
• Dynamic Range of Strained Ge-on-Silicon Photodiodes
  
• Magnetic Oxide Films for Optical Isolators and Magneto-Electronic Devices
• Integration of Online Microelectronic Device Characterization and Simulation
  
• The ELVIS iLab: a Flexible Platform for Online LaboratoryExperiments in Electrical Engineering
• Increasing Reliability, Reusability, and Measurement Flexibility in the MIT Microelectronics WebLab
  
• A Low-cost Platform for Online Experiments

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