MTL Annual Research Report 2004-2005
Emerging Technologies
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- Microelectronically Fabricated LiCoO2/SiO2/Polysilicon Power
Cells
N. Ariel, G. Ceder, D.R. Sadoway, E.A. Fitzgerald
Sponsorship: CMSE-NSF
MRSEC Program, Partial support from ARO
- RF Power Potential of 90 nm CMOS
J. Scholvin, J.A. del Alamo, in collaboration with D. Greenberg
(IBM)
Sponsorship: IBM Faculty Award, IBM PhD Fellowship
- Electron Transport in Ultra-Thin Body SOI MOSFETs
I. Lauer, D.A. Antoniadis
Sponsorship: SRC
- Raised Source/Drain Technology for Ultra-Thin Fully Depleted
SOI
L. Gomez, J.L. Hoyt, J.A. Burns, C. Chen
Sponsorship: MIT Lincoln
Laboratory
- Improved Hole Mobilities and Thermal Stability in a Strained-Si/Strained-Si1-YGey/Strained-Si
Heterostructure Grown
on a Relaxed Si1-XGex Buffer
S. Gupta, M.L. Lee, D.M. Isaacson, E.A. Fitzgerald
Sponsorship:
MARCO MSD
- Novel High Thermal Conductivity CMOS Platforms by Wafer Bonding
and Layer Transfer from Relaxed SiGe Buffer
D.M. Isaacson, A.J. Pitera, N. Ariel, S. Gupta, E.A. Fitzgerald
Sponsorship:
SMA, ARO
- Epitaxial Growth of SiGe Buffers on Si (111) and (110)
M.L. Lee, E.A. Fitzgerald, D.A. Antoniadis
Sponsorship: MARCO MSD
- Interdiffusion in Strained Si/Strained SiGe Heterostructure
Devices
G. Xia, J.L. Hoyt
- Extraction of Band Offsets in Strained Si/Strained Si1-YGey
on Relaxed Si1-XGex Dual-Channel Enhanced Mobility Structures
C. Ni Chleirigh, C. Jungemann, J. Jung, O. Olubuyide,
J.L. Hoyt
Sponsorship: MARCO MSD, SRC, Applied Materials
- Electron and Hole Mobility in Thin-Body Strained Si/Strained
SiGe/Strained Si Heterostructures on Insulator
I. Aberg, J.L. Hoyt
Sponsorship: MARCO MSD, SRC, Applied
Materials
- Germanium-on-Insulator Fabrication by Hydrogen-Induced
Layer Transfer
J. Hennessy, D.A. Antoniadis
Sponsorship: MARCO MSD
- RTP Growth of Germanium Oxynitride for MOSFET Fabrication
A. Khakifirooz, A. Ritenour, D.A. Antoniadis
Sponsorship: MARCO MSD
- Bulk
Germanium MOSFETs Using High-K Gate Dielectrics
A. Ritenour, R.Z. Lei, D.A. Antoniadis
Sponsorship: MARCO MSD
- Modeling and Simulation of Advanced Transistors with Novel
Channel Materials
O.M. Nayfeh, D.A. Antoniadis
Sponsorship: MARCO MSD, SRC
- An Equivalent Circuit Model of a Faraday Cage for Substrate
Noise Isolation
J.H. Wu, J.A. del Alamo
Sponsorship: Applied Materials Fellowship
- Approaching the InP Lattice Constant on GaAs
N.J. Quitoriano, E.A. Fitzgerald
Sponsorship: Walsin Lihwa
- The Impact of Recess Length on the RF Power Performance of
GaAs PHEMTs
M.F. Wong, J.A. del Alamo, A. Inoue, T. Hisaka, K. Hayashi
Sponsorship:
Mitsubishi Electric
- Electrically-Induced Changes in Threshold Voltage and
Source Resistance in RF Power GaAs PHEMTs
A.A. Villanueva, J.A. del Alamo
Sponsorship: Mitsubishi Electric
- InP-Based HEMTs for Large Scale Logic Applications
N. Waldron, J.A. del Alamo
Sponsorship: MARCO MSD
- Concepts and Devices for Micro-Scale Thermo-Photovoltaic
Energy Conversion
H.K.H. Choy, C.G. Fonstad, Jr., in collaboration with R. Dimatteo
(Charles Stark Draper Laboratory)
Sponsorship: Charles Stark
Draper Laboratory
- Temporal and Spatial Current Stability of the Smart
Field Emission Arrays
C.-Y. Hong, A.I. Akinwande
Sponsorship: CreaTV Micro Tech, NIH,
DARPA
- Double-Gated Silicon Field Emission Arrays
L-Y. Chen, A.I. Akinwande
Sponsorship: CreaTV Micro Tech, NIH, DARPA
- Three-Dimensional Oxidation of Shaped Silicon Surfaces
C.-Y. Hong, A.I. Akinwande
Sponsorship: CreaTV Micro Tech, NIH, DARPA
- Oxidation Sharpening Mechanism for Silicon Tip Formation
C.-Y. Hong, A.I. Akinwande
Sponsorship: CreaTV Micro Tech, NIH, DARPA
- Magnetic and Magnetooptical Films Made by Pulsed Laser Deposition
V. Sivakumar, A. Rajamani, C.A. Ross
Sponsorship: Pirelli, Ferry Fund,
MicroPhotonics Center Consortium, ISN
- Modeling of Pattern Dependencies in the Fabrication of Multilevel
Copper Metallization
H. Cai, D. Boning
Sponsorship: NSF/SRC Engineering Research
Center for Environmentally Benign Semiconductor Manufacturing,
MagnaChip
- PFC Alternatives
A. Somani, R. Reif
Sponsorship: NSF/SRC Engineering Research Center
for Environmentally Benign Semiconductor Manufacturing, Applied Materials
- Characterization and Modeling of Plasma Etch
Nonuniformities
K.O. Abrokwah, D. Boning
Sponsorship: Texas Instruments, Praesagus, Inc.,
SRC Masters Scholarship
- Three-Dimensional Integration: Analysis and Technology
Development
K.N. Chen, C.S. Tan, A. Fan, R. Reif
Sponsorship: DARPA, MARCO IFC
- Interfacial Electromigration in Cu-Based IC Metallization
Z.S. Choi, F. Wei, C.C. Wai, C.L. Gan, K.L. Pey, W.K. Choi, C.V.
Thompson
Sponsorship: SRC, SMA
- Effects of Mechanical Properties on the Reliability of
Cu/Low-K Metallization Systems
F.L. Wei, Z-S. Choi, C.C. Wai, C.L. Gan, K.L. Pey, W.K. Choi,
C.V. Thompson
Sponsorship: SRC
- Cu Bonding Technology for Three-Dimensional
Integrated Circuits
R. Tadepalli, H.L. Leong, C.L. Gan, K.L. Pey, D.E. Troxel, C.V. Thompson
Sponsorship:
DARPA (3D Integrated Circuits), SMA, IME
- Numerical Techniques in Biomolecule Design and Systems Biology
D. Vasilyev, J. Bardhan, M. Altman, S. Kuo, P. Ramirez, P. Barton,
B. Tidor, J. White
Sponsorship: NIH, SMA, NSF
- Field Emission from Organic Materials
I. Kymissis, A.I. Akinwande
Sponsorship: NSF
- Integrated Organic Electronics
I. Kymissis, K. Ryu, A.I. Akinwande, C.G. Sodini, V. Bulovic
Sponsorship:
MARCO MSD, NSF
- Charge Trapping in Layered Nanostructured Films
J. Yu, C. Madigan, S.H. Kang, I. Kymissis, V. Bulovic
Sponsorship:
MARCO MSD, MIT, NSF, MRSEC
- Threshold Voltage Modification of Organic Thin-Film Transistors
A. Wang, I. Kymissis, V. Bulovic, A.I. Akinwande
Sponsorship: U.S.
Army Natick Center, MARCO MSD
- Effect of Surface Treatments on Pentacene Organic Thin-Film
Transistor Performance
A. Wang, I. Kymissis, A.I. Akinwande
Sponsorship: U.S. Army
Natick Center
- Logic Gates on Fiber: Building
Blocks for Electronic Textiles
Y.W. Choi, A.I. Akinwande
Sponsorship: DARPA
- Low-Voltage Organic Thin Film Transistors with High-K
Bi1.5Zn1.0Nb1.5O7 Pyrochlore Gate Insulator
Y.W. Choi, I.-D. Kim, H.L. Tuller, A.I. Akinwande
Sponsorship:
DARPA
- Hybrid Nanocomposite Architectures Using
CNTs
E.J. Garcia, D.-J. Shim, B.L. Wardle, in collaboration with S.-G. Kim
Sponsorship:
La Caixa Foundation
