M.A. Schmidt
- Materials/Technology/Metrology/CAD
- Wafer Bond
Alignment and Strength Characterization
- Micro/Nano Mechanics and Sensors
- A Vacuum-Bonding
Process for Packaging of High Temperature Microreactors
- Chem/Bio MEMS
- Microfabricated
Cell Analysis Device
Microreactors
for Catalyst Testing
Password-protected Documents:
- Conferences: 1-25
| 26-49 | 50-74
| 75-99
Publications
Student Theses
|