Using MTL » Fabrication

Machine Charge Chart

This chart explains how tool usage in MTL's fabrication facilities will be billed to the user. Units of measure vary by tool. This list is updated several times a year. It is organized by lab (ICL, TRL, and EML). Please note that Javascript must be enabled to make use of all chart functionalities.

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ID Lab Process Area Where CORAL Name It is: It does: Maker/Model Units per:(self-run) if staff
1EBLe-beam write24-041Elionix125 keV, hi-res e-beam writer Elionix F-125 7hr7
2EMLwetpecvd-rieacid-hood-EMLfume hoodacid wet etch  8hr12
3EMLdiffusionmetal depanneal-furnacetube furnace for annealing, sintering, etc 8hr12
4EMLphotophotoasher-EMLplasma photoresist stripper  8hr12
5EMLmetal depmetal depBalzerSputterersputterer AuBalzer8hr + mat12
6EMLdiffusionmetal depBox-Furnacefurnaceanneals, bakes 8hr12
7EMLphotophotocoater-EMLspinnercoats PRSolitec 8hr12
8EMLmetrologyhalldektak-EMLprofilometermeasures surface roughnessSloan Dektak II8hr12
9EMLmetal depmetal depeBeam-EMLmetal evaporatorAu,Ag,Al,Cr,
AuGe,Co,Pt,Si,
Ti,Zr,W,Er,Mo,SiO2,
Ta,Pd,Ni,Ge,Sn
Sloan 8hr + mat12
10EMLmetrologyResonetics rmfilmetricsthin film measurement systemmeasures film thickness Filmetrics F208hr12
11EMLPhoto-EMLAu Bonder Rmhotpresshydraulic pressapplies loads ~100 kN, electrically heats to ~340 C; used on thermoplastic films (eg, PMMA)Carver 43868hr12
12EMLphotophotoMA4mask alignercontact lithographyKarl Suss MA-48hr12
13EMLphotophotoMJB3-BroadBandmask alignercontact lithographyKarl Suss MJB-38hr12
14EMLdiffusionResonetics rmOxidationTubetube furnacewet & dry ox, anneals, bakesLindberg8hr12
15EMLmetrologymetrologyparametric-testerparametric-testermeasures device characteristicsHewlett-Packard8hr12
16EMLwetphotophoto-hood-EMLfume hoodsolvent wet etch  8hr12
17EMLpecvd-riepecvd-rieplasmathermdual chamber PECVD-RIE etches & deposits dielectrics; heated chuck Plasmatherm8hr12
18EMLdiffusionmetrologyRTA-EMLrapid thermal annealer AG Associates Heatpulse 4108hr12
19EMLmetrologymetrologysemNeoinspection SEM�3" samples, 20kX, ~0.2 um resolutionJoel/Nikon Neoscope JCM-5000 8hr12
20EMLwetphotoSolventHood-EMLfume hood for solvents, no drain  8hr12
21EMLmetal depmetal depSputtererAJAsputterer Al, Cr, Cu, etcAJA Orion 58hr + mat12
22EMLmetrologymetrologywykoEMLnon-contact profilersurface topology; up to 500um vertical scanWyko RST8hr12
23ICLmetrologymetrology4-pt-proberesistivity measurement system  2hr4
24ICLdiffusiondiffusion5A-GateOxatmosph. diffusion tubefor gate oxide, CMOS onlyThermco 10K25run+steam39
25ICLdiffusiondiffusion5B-Annealatmosph. diffusion tubefor annealing, including Concept1 filmsThermco 10K25run+steam39
26ICLdiffusiondiffusion5C-FieldOxatmosph. diffusion tubefor oxidationThermco 10K25run+steam39
27ICLdiffusiondiffusion5D-ThickOxatmosph. diffusion tubefor oxidation, CMOS onlyThermco 10K25run+steam39
28ICLdiffusiondiffusion6A-nPolylow P diffusion tubeLPCVD plysilicon; CMOS onlyThermco 10K65run+70/um74
29ICLdiffusiondiffusion6B-Polylow P diffusion tubeLPCVD thick & P-doped polysiliconThermco 10K65run+70/um74
30ICLdiffusiondiffusion6C-LTOlow P diffusion tubeLPCVD Low Temperature OxideThermco 10K65run+70/um74
31ICLdiffusiondiffusion6D-Nitridelow P diffusion tubeLPCVD stoichiometric Si nitrideThermco 10K65run+70/um74
32ICLmetrologyphotoAFMAtomic Force Microscopesurface topologyVeeco D31009hr12
33ICLMOCVDdepositionALDatomic layer depatomic layer dep: Al,Hf,Ti ox, TiNCambridge Nanotech7wafer+thickness14
34ICLMOCVDdepositionALD-Oxfordplasma-assisted atomic layer depplasma-ALD: Al,Hf,Ti ox;W,Ti nitrOxford FlexAl7wafer+thickness14
35ICLplasma etchmetallizat'nAME5000plasma etcher Chamber A: SiO2, BPSG, LTO; Chamber B: Si nitride, polyAMAT Precision 5000 7 wafer+mat14
36ICLphotophotoasher-ICLplasma asherstrip PRMatrix 1065run7
37ICLphotophotocoater6wafer trackcoats PRSVG 88602wafer4
38ICLpecvddepositionconcept1dielectric plasma depdeposits oxide, nitride, TEOSNovellus Concept 17wafer14
39ICLmetrologymetrologycvCV bridgemeasures capacitance vs voltageBoonton1wafer3
40ICLpecvddiffusionDCVDdielectric plasma depdeposits oxide, nitrideAMAT Centura 52007wafer+thickness14
41ICLpkgpackagingdiesawdiesawdices wafersDisco DAD-2H/6T3wafer+cut6
42ICLmetal depmetallizat'neBeamCMOSmetal evaporator Al, Ir, Pt, Co, W, Er, Ti, Mo, SiO2, Si, TaTemescal FC180030run+mat37
43ICLmetrologymetrologyellipsometer-ICLellipsometermeasures film thickness & dielectric constantGaertner L116BLC-26A2hr4
44ICLmetal depAME rmendurametal sputtering systemsputters Ti, TiN, Al, AlSiAMAT Endura7wafer+mat14
45ICLUHCVD39-528epi-CenturaUltra Hi-vac chem vapor depgrows Si & SiGe epilayersAMAT Centura 520018hr18
46ICLCMPCMPGnPchemo-mechanical polisher (BPSG, LTO, thermal oxide,nitride, Si) GnP Poli-400L7wafer+slurry14
47ICLpkgEML Metrogoldwiregold-ball wire bonder Kulicke&Soffa 41247hr14
48ICLphotophotoHMDS-ICLbake ovenfor hexamethyldisilazane (an adhesion promoter)Yield.Eng.Syst.3/100wafer10
49ICLphotophotoi-stepperwafer stepperpatterns wafers, 5x reduction, 0.5 um resolutionNikon NSR-2005i9 i-line(365nm)6wafer9
50ICLwetpackagingKOH-Au wet stationAu-bearing KOH & Cu platingSemifab WPS-40025run32
51ICLplasma etchetchingLAM490Bplasma etcherfor Si & nitride [gases=C2F6,SF6,Cl2,He,O2]LAM 490B7wafer+thickness14
52ICLplasma etchetchingLAM590-ICLplasma etcherfor oxide [gases=CHF3,CF4,He,O2]LAM 590B7wafer+thickness14
53ICLmetrologyphotomicroscope-ICLinspection microscope Nikon Optiphot 882hr4
54ICLwetphotonitrEtch-HotPhoswet stationwet etches nitride (1st tank)Semifab WPS-40025run32
55ICLwetphotooxEtch-BOEwet stationwet etch oxideSemifab WPS-40025run32
56ICLplasma etch-depAME rmOxford-100plasma etch/dep for Si, nitride, TEOS [gases=C2F6,
SF6,Cl2,He,O2; NH3,SiH4]
Oxford Plasmalab System 1007wafer+thickness14
57ICLmetrologymetrologyP10profilometermeasures surface roughnessTencor/Prometrix P-105hr10
58ICLwetpackagingplating-benchwet stationAu, Ni & Cu platingSemifab WPS-40025run32
59ICLwetnear AMEpremetal-Piranhawet stationfor piranha & HF dipSemifab WPS-40025run32
60ICLplasma etchetchingrainbowplasma etcherfor metal (Al, Ti) [gases=SF6,Cl2,
BCl3,CHCl3,N2]
LAM 96007wafer14
61ICLdiffusiondiffusionrca-ICLwet stationRCA clean 25run39
62ICLdiffusiondiffusionRTA2rapid thermal annealer AG Associates Heatpulse 4104wafer5
63ICLdiffusiondiffusionRTA-piecesrapid thermal annealernon-Au, accepts �3" wf & piecesAnnealsys4wafer5
64ICLdiffusiondiffusionRTPrapid thermal annealer AG Associates 81084wafer5
65ICLdiffusiondiffusionRTP-Sirapid thermal annealer AG Associates 81084wafer5
66ICLdiffusiondiffusionSCAsurface charge analyzermeasures surface charge, carrier lifetimeSemitest2hr4
67ICLmetrologyphotosemZeisslow-V scanning electron microscope Zeiss Supra 409hr12
68ICLpkgEML MetroTMAH-KOHhoodwet bathKOH & TMAH etchingfume hood25run32
69ICLmetrologymetrologyUV1280spectroscopic ellipsometermeasures film thickness (single, stacks, PR)Tencor/Prometrix UV-12805hr10
70ICLdiffusiondiffusionVTRvertical thermal reactorlow-stress nitrideSVG/Thermco 700065run+70/um65
71ICLmetrologymetrologywykoICLnon-contact profilersurface topology; up to 500um vertical scanWyko NT33005hr10
72TRLdiffusiondiffusionA1-GateOxatmosph. diffusion tubefor gate oxideMRL 71825run+steam39
73TRLdiffusiondiffusionA2-WetOxBondatmosph. diffusion tubewafer bondingMRL 71825run+steam39
74TRLdiffusiondiffusionA3-Sinteratmosph. diffusion tubeCMOS metal sinteringMRL 71825run39
75TRLdiffusiondiffusionA4-III-Vannealatmosph. diffusion tubeanneal III-Vs; has O2MRL 71825run39
76TRLwetEtch Roomacid-hoodwet stationwet etch Laminaire25run32
77TRLwetBallroomacid-hood2wet stationwet etching in 6.152J 25run32
78TRLmetal depmetal'nAJA-TRLsputterer Al, Cr, Cu, Au,Ag, TiAJA ATC30run+mat.37
79TRLphotometal'nasherMatrix-TRLplasma photoresist stripper (single-wafer) Matrix 1065run7
80TRLphotoEtch Roomasher-TRLplasma photoresist stripper (2 chambers) Branson5run7
81TRLdiffusiondiffusionB1-Auatmosph. diffusion tubegold exposureMRL 71825run+steam39
82TRLdiffusiondiffusionB2-Ox-alloy-Polylow pressure diffusion tubeLP diffusion tube; deps Poly-Si on Au wfMRL 71865run+70/um74
83TRLdiffusiondiffusionB3-DryOxatmosph. diffusion tubeannealingMRL 71825run39
84TRLdiffusiondiffusionB4-Polylow pressure diffusion tubeLPCVD polysiliconMRL 71865run+70/um74
85TRLpecvd39-428CCNTplasma dep chamberdeposits carbon nanotubes from acetylene Aixtron7wafer14
86TRLpecvdEML pecvd-rieCNTplasma dep chamberdeposits carbon nanotubes from acetyleneHome-built7wafer14
87TRLphotophotocoaterspinnercoats PRSolitec 51102wafer+mat10
88TRLmetrologyBallroomdek-NoAuprofilometermeasures surface roughness, no-gold wafers onlySloan Dektak 2hr4
89TRLmetrologyBallroomdektakprofilometermeasures surface roughnessSloan Dektak II2hr4
90TRLmetal depmetal'neBeamAumetal evaporatorAu,Ag,Al,Cr,AuGe,
Co,Pt,Si,Ti,Zr,W
,Er,Mo,SiO2,Ta,
Pd,Ni,Ge,Sn
Temescal VES255030run+mat.37
91TRLmetal'n39-428eBeamFPmetal evaporatorAu,Al,Cr,Pt,Ti,Temescal FC200030run+mat.37
92TRLmetrologyBallroomellipsometer-TRLellipsometermeasures film thickness & indexGaertner2hr4
93TRLphotophotoEV1mask alignercontact, w/IRElectronic Visions 6206wafer9
94TRLphotophotoEV-LCmask alignercontact, w/IRElectronic Visions 6206wafer9
95TRLphotophotoEV501-620wafer aligner/bonderaligns & bonds wafers (fusion,anodic,thermo-compression)Electronic Visions6wafer9
96TRLmetrologyBallroomFilmetrics-TRLthin film measurement systemmeasures film thickness Filmetrics F-202hr4
97TRLphotophotofluoroscopeto check for photoresist after developing  1wafer3
98TRLmetrologyEtch RoomFLXnon-contact profilermeasures wafer bowKLA-Tencor FLX5hr10
99TRLphoto39-430Heidelbergdirect-write laserlaser-writes on photoresistHeidelberg DWL-6610hr16
100TRLphotophotohotplate1hotplatefor post & pre-baking SU8 & PZT at �300oC 1wafer2
101TRLphotophotohotplate2hotplatefor post & pre-baking SU8 & PZT at �300oC 1wafer2
102TRLphotophotohotplate300hi-T hotplatefor post & pre-baking SU8 & PZT at �400oC 1wafer2
103TRLphotophotoHMDS-TRLbake ovenfor hexamethyldisilazane (an adhesion promoter) 0wafer10
104TRLmetrologytest areahp-probeprober-testerelectrical characterizationRucker/Kolls 1032-HP4062B2hr4
105TRLmetrologyEtch RoomIV-probecurve tracer w/probemeasures IV characteristicsTektronics2hr4
106TRLmetrologytest areakeithleyparametric testerelectrical characterizationKeithley 450S2hr4
107TRLrieEtch RoomLAM590-TRLplasma etcherfor oxide [gases=CHF3,CF4,He,O2]LAM 5907wafer14
108TRLphotophotoMA-6mask alignercontact, w/IRKarl Suss MA-66wafer9
109TRLmetrologyphotomicroscope-TRLinspection microscopew/Nomarski interference contrastNikon 2hr4
110TRLmetrologyBallroomnanospecthin film measurement systemmeasures film thickness Nanometrics AFT 010-01802hr4
111TRLdepositionEtch Roomparyleneparylene coatercoats wafers w/parylene 5wafer10
112TRLwetphotophoto-wet-Auwet stationwet etch photoresistSemifab WPS-80025run32
113TRLwetphotophoto-wet-lwet stationwet etch photoresistSemifab WPS-80025run32
114TRLwetphotophoto-wet-rwet stationwet etch photoresistSemifab WPS-80025run32
115TRLphotophotopispinnerpolyimide spinnercoats wafers w/polyimide Headway Research3wafer6
116TRLrieEtch RoomplasmaquestECR-RIE etches dielectrics on III-Vs, polyimide, etcPlasmaquest Series 11 Model 1457wafer+thickness14
117TRLphotophotoPMMAspinnerPMMA spinnercoats wafers w/PMMA 3wafer6
118TRLphotophotopostbakeovento bake photoresist after developingBlue DDC-146C0wafer3
119TRLphotophotoprebakeovnovento bake photoresist before exposure 0wafer3
120TRLspin depEtch RoomPZTcoaterPZT coaterdeposits PZTSpecialty Coating Systems, Spin Coater 6700 Series5wafer10
121TRLspin depEtch RoomPZTfurnacePZT furnaceanneals PZT Thermolyne Furnace, 60005run7
122TRLdiffusionEtch Roomrca-TRLwet stationRCA clean 25run39
123TRLphotoEMLmetrologyResoneticslaser ablation systemlaser-writes on photoresist, glass, plasticResonetics10hr14
124TRLdiffusionEtch Roomrtarapid thermal annealernot CMOS-compatibleAG Associates 210T-024wafer5
125TRLdiffusionEtch Roomrta35rapid thermal annealerfor III-VsAG Associates Heatpulse 4104wafer5
126TRLrieEtch RoomSAMCOICP-RIE etches dielectrics on III-VsSAMCO 200iP7wafer+thickness14
127TRLwetDUVSolvent-noAuwet stationwet solvent for non-Au wafers 25run32
128TRLwetDUVSolvent-hoodwet stationwet solvent for non-Au wafers 25run32
129TRLplasma etchEtch Roomsts1Si deep trench etcheretches deep features in Si (4" wafers)STS/Multiplex ICP non-MESC15wafer+thickness30
130TRLplasma etchEtch Roomsts2Si deep trench etcheretches deep features in Si (6" wafers)STS/Multiplex ICP MESC15wafer+thickness30
131TRLplasma etchEtch Roomsts3Si deep trench etcheretches deep features in Si (6" wafers)STS/Multiplex ICP MESC15wafer+thickness30
132TRLpecvddiffusionsts-CVDdielectric plasma depdeposits oxide, nitride, Si carbideSTS/Multiplex PECVD7wafer+thickness14
133TRLphotophotoSU8ovenovento bake SU8  0wafer0
134TRLphotophotoSU8spinnerovento coat with SU8  3wafer+mat6
135TRLmetrologyBallroomTBM-8alignment measurement tool  Electronic Visions2hr4
136TRLEtchEtch RoomUVozone-Auozone clean plateremoves organics w/ozone created by UV light 2hr4
137TRLEtchEtch RoomUVozone-noAuozone clean plateremoves organics w/ozone created by UV light 2hr4
138TRLphotophotovarTempovento bake photoresist; temp can be cahnged 0wafer0
139TRLmetrologyEtch RoomWYKOnon-contact profilersurface topology; up to 500um vertical scanWyko NT98005hr10
140TRLEtchEtch RoomXeF2XeF2 vapor systemetches Si w/XeF2 for structural release 20hr25

Fabrication

MTL Annual Research Report 2014: View Online