Using MTL » Fabrication

Machine Charge Chart

This chart explains how tool usage in MTL's fabrication facilities will be billed to the user. Units of measure vary by tool. This list is updated several times a year. It is organized by lab (ICL, TRL, and EML). Please note that Javascript must be enabled to make use of all chart functionalities.

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ID Lab Process Area Where CORAL Name It is: It does: Maker/Model Units per:(self-run) if staff
1 EBL e-beam write 24-041 Elionix 125 keV, hi-res e-beam writer   Elionix F-125 5 hr 5
2 EML wet pecvd-rie acid-hood-EML fume hood acid wet etch   8 hr 12
3 EML diffusion metal dep anneal-furnace tube furnace for annealing, sintering, etc   8 hr 12
4 EML photo photo asher-EML plasma photoresist stripper     8 hr 12
5 EML metal dep metal dep BalzerSputterer sputterer Au Balzer Union SCD 040 8 hr + mat 12
6 EML diffusion metal dep Box-Furnace furnace anneals, bakes   8 hr 12
7 EML photo photo coater-EML spinner coats PR Solitec 8 hr 12
8 EML metrology hall dektak-EML profilometer measures surface roughness Sloan Dektak II 8 hr 12
9 EML metal dep metal dep eBeam-EML metal evaporator Au, Ag, Al, Cr, AuGe, Co, Pt, Si, Ti, Zr, W, Er, Mo, SiO2, Ta, Pd, Ni, Ge, Sn Sloan 8 hr + mat 12
10 EML metrology Resonetics rm filmetrics thin film measurement system measures film thickness Filmetrics F20 8 hr 12
11 EML Photo-EML Au Bonder Rm hotpress hydraulic press applies loads ~100 kN, electrically heats to ~340 C; used on thermoplastic films (eg, PMMA) Carver 4386 8 hr 12
12 EML photo photo MA4 mask aligner contact lithography Karl Suss MA-4 8 hr 12
13 EML diffusion Resonetics rm OxidationTube tube furnace wet & dry ox, anneals, bakes Lindberg 8 hr 12
14 EML metrology metrology parametric-tester parametric-tester measures device characteristics Hewlett-Packard 8 hr 12
15 EML wet photo photo-hood-EML fume hood solvent wet etch   8 hr 12
16 EML pecvd-rie pecvd-rie plasmatherm dual chamber PECVD-RIE etches & deposits dielectrics; heated chuck Plasmatherm SL-700 8 hr 12
17 EML diffusion metrology RTA-EML rapid thermal annealer   AG Associates Heatpulse 410 8 hr 12
18 EML metrology metrology semNeo inspection SEM _3" samples, 20kX, ~0.2 um resolution Joel/Nikon Neoscope JCM-5000 8 hr 12
19 EML wet photo SolventHood-EML fume hood for solvents, no drain     8 hr 12
20 EML metal dep metal dep SputtererAJA sputterer Al, Cr, Cu, etc AJA Orion 5 30 run+mat. 37
21 EML diffusion Au Bonder Rm vac-oven vacuum oven for annealing, sintering, etc in vacuum TM Vacuum Products Model SS806NS-14 8 hr 12
22 ICL metrology metrology 4-pt-probe resistivity measurement system     2 hr 4
23 ICL diffusion diffusion 5A-GateOx atmosph. diffusion tube for gate oxide, CMOS only Thermco 10K 25 run+steam 39
24 ICL diffusion diffusion 5B-Anneal atmosph. diffusion tube for annealing, including Concept1 films Thermco 10K 25 run+steam 39
25 ICL diffusion diffusion 5C-FieldOx atmosph. diffusion tube for oxidation Thermco 10K 25 run+steam 39
26 ICL diffusion diffusion 5D-ThickOx atmosph. diffusion tube for oxidation, CMOS only Thermco 10K 25 run+steam 39
27 ICL diffusion diffusion 6A-nPoly low P diffusion tube LPCVD plysilicon; CMOS only Thermco 10K 65 run+70/um 74
28 ICL diffusion diffusion 6B-Poly low P diffusion tube LPCVD thick & P-doped polysilicon Thermco 10K 65 run+70/um 74
29 ICL diffusion diffusion 6C-LTO low P diffusion tube LPCVD Low Temperature Oxide Thermco 10K 65 run+70/um 74
30 ICL diffusion diffusion 6D-Nitride low P diffusion tube LPCVD stoichiometric Si nitride Thermco 10K 65 run+70/um 74
31 ICL metrology photo AFM Atomic Force Microscope surface topology Veeco D3100 9 hr 12
32 ICL MOCVD deposition ALD atomic layer dep atomic layer dep: Al,Hf,Ti ox, TiN Cambridge Nanotech 7 wafer + thickness 14
33 ICL MOCVD metrology ALD-Oxford plasma-assisted atomic layer dep plasma-ALD: Al,Hf,Ti ox;W,Ti nitr Oxford FlexAl 7 wafer + thickness 14
34 ICL plasma etch metallizat'n AME5000 plasma etcher Chamber A: SiO2, BPSG, LTO; Chamber B: Si nitride, poly AMAT Precision 5000 7 wafer + thickness 14
35 ICL photo photo asher-ICL plasma asher strip PR Matrix 106 5 run 7
36 ICL photo photo coater6 wafer track coats PR SVG 8860 2 wafer 4
37 ICL pecvd deposition concept1 dielectric plasma dep deposits oxide, nitride, TEOS Novellus Concept 1 7 wafer 14
38 ICL metrology metrology cv CV bridge measures capacitance vs voltage Boonton 1 wafer 3
39 ICL pecvd diffusion DCVD dielectric plasma dep deposits oxide, nitride AMAT Centura 5200 7 wafer + thickness 14
40 ICL pkg 39-558 diesaw diesaw dices wafers Disco DAD-2H/6T 3 wafer+cut 6
41 ICL pkg 39-558 diesaw-3240 high precision diesaw dices wafers, _8" Disco 3240 3 wafer+cut 6
42 ICL metal dep metallizat'n eBeamCMOS metal evaporator Al, Ir, Pt, Co, W, Er, Ti, Mo, SiO2, Si, Ta Temescal FC1800 30 run+mat 37
43 ICL metal dep AME rm endura metal sputtering system sputters Ti, TiN, Al, AlSi AMAT Endura 7 wafer+mat 14
44 ICL UHCVD 39-528 epi-Centura Ultra Hi-vac chem vapor dep grows Si & SiGe epilayers AMAT Centura 5200 18 hr 18
45 ICL CMP 39-558 GnP chemo-mechanical polisher (BPSG, LTO, thermal oxide,nitride, Si)   GnP Poli-400L 7 wafer + slurry 14
46 ICL pkg EML Metro goldwire gold-ball wire bonder   Kulicke&Soffa 4124 7 hr 14
47 ICL photo photo HMDS-ICL bake oven for hexamethyldisilazane (an adhesion promoter) Yield.Eng.Syst.3/10 0 wafer 10
48 ICL photo photo i-stepper wafer stepper patterns wafers, 5x reduction, 0.5 um resolution Nikon NSR-2005i9 i-line(365nm) 6 wafer 9
49 ICL wet packaging KOH-Au wet station Au-bearing KOH & Cu plating Semifab WPS-400 25 run 32
50 ICL plasma etch etching LAM490B plasma etcher for Si & nitride [gases=C2F6,SF6,Cl2,He,O2] LAM 490B 7 wafer + thickness 14
51 ICL plasma etch etching LAM590-ICL plasma etcher for oxide [gases=CHF3,CF4,He,O2] LAM 590B 7 wafer + thickness 14
52 ICL metrology photo microscope-ICL inspection microscope   Nikon Optiphot 88 2 hr 4
53 ICL wet photo nitrEtch-HotPhos wet station wet etches nitride (1st tank) Semifab WPS-400 25 run 32
54 ICL wet photo oxEtch-BOE wet station wet etch oxide Semifab WPS-400 25 run 32
55 ICL plasma etch-dep AME rm Oxford-100 plasma etch/dep for Si, nitride, TEOS [gases=C2F6,SF6,Cl2,He,O2; NH3,SiH4] Oxford Plasmalab System 100 7 wafer + thickness 14
56 ICL metrology metrology P10 profilometer measures surface roughness Tencor/Prometrix P-10 5 hr 10
57 ICL wet 39-558 plating-bench wet station Au, Ni & Cu plating   25 run 32
58 ICL wet near AME premetal-Piranha wet station for piranha & HF dip Semifab WPS-400 25 run 32
59 ICL plasma etch etching rainbow plasma etcher for metal (Al, Ti) [gases=SF6, Cl2, BCl3, CHCl3, N2] LAM 9600 7 wafer 14
60 ICL diffusion diffusion rca-ICL wet station RCA clean   25 run 39
61 ICL diffusion diffusion RTA2 rapid thermal annealer   AG Associates Heatpulse 410 4 wafer 5
62 ICL diffusion diffusion RTA-pieces rapid thermal annealer non-Au, accepts _3" wf & pieces Annealsys 4 wafer 5
63 ICL diffusion diffusion RTP rapid thermal annealer   AG Associates 8108 4 wafer 5
64 ICL diffusion diffusion RTP-Si rapid thermal annealer   AG Associates 8108 4 wafer 5
65 ICL diffusion diffusion SCA surface charge analyzer measures surface charge, carrier lifetime Semitest 2 hr 4
66 ICL metrology photo semZeiss low-V scanning electron microscope   Zeiss Supra 40 9 hr 12
67 ICL metrology   SM-300 optical thin film measurement tool (for unpatterned wafers)   Prometrix (now KLA-Tencor) SM-300 5 hr 10
68 ICL pkg EML Metro TMAH-KOHhood wet bath KOH & TMAH etching fume hood 25 run 32
69 ICL metrology metrology UV1280 spectroscopic ellipsometer measures film thickness (single, stacks, PR) Tencor/Prometrix UV-1280 5 hr 10
70 ICL diffusion diffusion VTR vertical thermal reactor low-stress nitride SVG/Thermco 7000 65 run+70/um 65
71 ICL metrology metrology wykoICL non-contact profiler surface topology; up to 500um vertical scan Wyko NT3300 5 hr 10
72 TRL wet 39-562 2D-transferhood wet station substrate transfer of graphene flakes   25 run 32
73 TRL diffusion diffusion A1-GateOx atmosph. diffusion tube for gate oxide MRL 718 25 run+steam 39
74 TRL diffusion diffusion A2-WetOxBond atmosph. diffusion tube wafer bonding MRL 718 25 run+steam 39
75 TRL diffusion diffusion A3-Sinter atmosph. diffusion tube CMOS metal sintering MRL 718 25 run 39
76 TRL diffusion diffusion A4-III-Vanneal atmosph. diffusion tube anneal III-Vs; has O2 MRL 718 25 run 39
77 TRL wet Etch Room acid-hood wet station wet etch Laminaire 25 run 32
78 TRL metal dep metal'n AJA-TRL sputterer Al, Cr, Cu, Au,Ag, Ti AJA ATC 30 run+mat. 37
79 TRL photo metal'n asherMatrix-TRL plasma photoresist stripper (single-wafer)   Matrix 106 5 run 7
80 TRL photo Etch Room asher-TRL plasma photoresist stripper (2 chambers)   Branson 5 run 7
81 TRL diffusion diffusion B1-Au atmosph. diffusion tube gold exposure MRL 718 25 run+steam 39
82 TRL diffusion diffusion B2-Ox-alloy-Poly low pressure diffusion tube LP diffusion tube; deps Poly-Si on Au wf MRL 718 65 run+70/um 74
83 TRL diffusion diffusion B3-DryOx atmosph. diffusion tube annealing MRL 718 25 run 39
84 TRL diffusion diffusion B4-Poly low pressure diffusion tube LPCVD polysilicon MRL 718 65 run+70/um 74
85 TRL   39-430 Balzer-Elionix small sputterer metal coats samples for e-beam imaging Balzer 8 hr+mat 12
86 TRL pecvd 39-428 CCNT plasma dep chamber deposits carbon nanotubes from acetylene Cambridge Nano Instruments 7 wafer 14
87 TRL pecvd EML pecvd-rie CNT plasma dep chamber deposits carbon nanotubes from acetylene Home-built 7 wafer 14
88 TRL photo photo coater spinner coats PR Solitec 5110 2 wafer + mat 10
89 TRL metrology Ballroom dek-NoAu profilometer measures surface roughness, no-gold wafers only Sloan Dektak 2 hr 4
90 TRL metrology Ballroom dektak profilometer measures surface roughness Sloan Dektak II 2 hr 4
91 TRL metal dep metal'n eBeamAu metal evaporator Au, Ag, Al, Cr, AuGe, Co, Pt, Si, Ti, Zr, W, Er, Mo, SiO2, Ta, Pd, Ni, Ge, Sn Temescal VES2550 30 run+mat. 37
92 TRL metal'n 39-428 eBeamFP metal evaporator Au, Al, Cr, Pt, Ti, Temescal FC2000 30 run+mat. 37
93 TRL metrology Ballroom ellipsometer-TRL ellipsometer measures film thickness & index Gaertner 2 hr 4
94 TRL photo photo EV1 mask aligner contact, w/IR Electronic Visions 620 6 wafer 9
95 TRL photo photo EV-LC mask aligner contact, w/IR Electronic Visions 620 6 wafer 9
96 TRL photo photo EV501-620 wafer aligner/bonder aligns & bonds wafers (fusion,anodic,thermo-compression) Electronic Visions 6 wafer 9
97 TRL metrology Ballroom Filmetrics-TRL thin film measurement system measures film thickness Filmetrics F-20 2 hr 4
98 TRL photo photo fluoroscope to check for photoresist after developing     1 wafer 3
99 TRL metrology Etch Room FLX non-contact profiler (_8" wf) measures wafer bow KLA-Tencor FLX 5 hr 10
100 TRL wet Ballroom Greenflo wet station wet etching; green & red sides Reynolds Tech Greenflo 25 run 32
101 TRL photo 39-430 Heidelberg direct-write laser laser-writes on photoresist Heidelberg DWL-66 10 hr 16
102 TRL photo photo hotplate1 hotplate for post & pre-baking SU8 & PZT at _300oC   1 wafer 2
103 TRL photo photo hotplate2 hotplate for post & pre-baking SU8 & PZT at _300oC   1 wafer 2
104 TRL photo photo hotplate300 hi-T hotplate for post & pre-baking SU8 & PZT at _400oC   1 wafer 2
105 TRL photo photo HMDS-TRL bake oven for hexamethyldisilazane (an adhesion promoter)   0 wafer 10
106 TRL metrology test area hp-probe prober-tester electrical characterization Rucker/Kolls 1032-HP4062B 2 hr 4
107 TRL metrology Etch Room IV-probe curve tracer w/probe measures IV characteristics Tektronics 2 hr 4
108 TRL rie Etch Room LAM590-TRL plasma etcher for oxide [gases=CHF3, CF4, He, O2] LAM 590 7 wafer 14
109 TRL photo photo MA-6 mask aligner contact, w/IR Karl Suss MA-6 6 wafer 9
110 TRL metrology photo microscope-TRL inspection microscope w/Nomarski interference contrast Nikon 2 hr 4
111 TRL metrology Ballroom nanospec thin film measurement system measures film thickness Nanometrics AFT 010-0180 2 hr 4
112 TRL Deposition-TRL Etch Room parylene parylene coater coats wafers w/parylene SCS Labcoater2 5 wafer 10
113 TRL plasma etch Etch Room Pegasus Si deep trench etcher etches deep features in Si (6" wafers) STPS Pegasus ICP 15 wafer + thickness 30
114 TRL Deposition-TRL 39-562 pentacene pentacene system deposits pentacene   5 wafer 10
115 TRL wet photo photo-wet-Au wet station wet etch photoresist Semifab WPS-800 25 run 32
116 TRL wet photo photo-wet-l wet station wet etch photoresist Semifab WPS-800 25 run 32
117 TRL wet photo photo-wet-r wet station wet etch photoresist Semifab WPS-800 25 run 32
118 TRL rie Etch Room plasmaquest ECR-RIE etches dielectrics on III-Vs, polyimide, etc Plasmaquest Series 11 Model 145 7 wafer + thickness 14
119 TRL photo photo PMMAspinner PMMA spinner coats wafers w/PMMA Cee Equipment Co. (Brewer Science); model C-100 3 wafer 6
120 TRL photo photo postbake oven to bake photoresist after developing Blue DDC-146C 0 wafer 3
121 TRL photo photo prebakeovn oven to bake photoresist before exposure   0 wafer 3
122 TRL spin dep Etch Room PZTcoater PZT coater deposits PZT Specialty Coating Systems, Spin Coater 6700 Series 5 wafer 10
123 TRL spin dep Etch Room PZTfurnace PZT furnace anneals PZT Thermolyne Furnace, 6000 5 run 7
124 TRL diffusion Etch Room rca-TRL wet station RCA clean   25 run 39
125 TRL photo EMLmetrology Resonetics laser ablation system laser-writes on photoresist, glass, plastic Resonetics LPX 200 10 hr 14
126 TRL diffusion Etch Room rta35 rapid thermal annealer for III-Vs AG Associates Heatpulse 410 4 wafer 5
127 TRL rie Etch Room SAMCO ICP-RIE etches dielectrics on III-Vs SAMCO 200iP 7 wafer + thickness 14
128 TRL wet DUV Solvent-noAu wet station wet solvent for non-Au wafers   25 run 32
129 TRL wet DUV Solvent-hood wet station wet solvent utility hood (eg, wafer dismount)   25 run 32
130 TRL plasma etch Etch Room sts1 Si deep trench etcher etches deep features in Si (4" wafers) STS/Multiplex ICP non-MESC 15 wafer + thickness 30
131 TRL plasma etch Etch Room sts2 Si deep trench etcher etches deep features in Si (6" wafers) STS/Multiplex ICP MESC 15 wafer + thickness 30
132 TRL pecvd diffusion sts-CVD dielectric plasma dep deposits oxide, nitride, Si carbide STS/Multiplex PECVD 7 wafer + thickness 14
133 TRL photo photo SU8oven oven to bake SU8   0 wafer 0
134 TRL photo photo SU8spinner oven to coat with SU8   3 wafer + mat 6
135 TRL metrology Ballroom TBM-8 alignment measurement tool   Electronic Visions 2 hr 4
136 TRL Etch Etch Room UVozone-Au ozone clean plate removes organics w/ozone created by UV light   2 hr 4
137 TRL Etch Etch Room UVozone-noAu ozone clean plate removes organics w/ozone created by UV light   2 hr 4
138 TRL photo photo varTemp oven to bake photoresist; temp can be cahnged   0 wafer 0
139 TRL metrology Etch Room WYKO non-contact profiler surface topology; up to 500┬Ám vertical scan Wyko NT9800 5 hr 10
140 TRL Etch Etch Room XeF2 XeF2 vapor system etches Si w/XeF2 for structural release   20 hr 25

Fabrication

MTL Annual Research Report 2014: View Online