Using MTL » Fabrication

Machine Charge Chart

This chart explains how tool usage in MTL's fabrication facilities will be billed to the user. Units of measure vary by tool. This list is updated several times a year. It is organized by lab (ICL, TRL, and EML). Please note that Javascript must be enabled to make use of all chart functionalities.

Download the chart as an Excel spreadsheet and PDF:
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ID	Lab	Process Area	Where	CORAL Name	It is:	It does:	Maker/Model	Units	per:(self-run)	if staff
1	EBL	e-beam write	24-041	Elionix	125 keV, hi-res e-beam writer		Elionix F-125	7	hr	7
2	EML	wet	pecvd-rie	acid-hood-EML	fume hood	acid wet etch		8	hr	12
3	EML	diffusion	metal dep	anneal-furnace	tube furnace	for annealing, sintering, etc		8	hr	12
4	EML	photo	photo	asher-EML	plasma photoresist stripper			8	hr	12
5	EML	metal dep	metal dep	BalzerSputterer	sputterer	Au	Balzer	8	hr + mat	12
6	EML	diffusion	metal dep	Box-Furnace	furnace	anneals, bakes		8	hr	12
7	EML	photo	photo	coater-EML	spinner	coats PR	Solitec	8	hr	12
8	EML	metrology	hall	dektak-EML	profilometer	measures surface roughness	Sloan Dektak II	8	hr	12
9	EML	metal dep	metal dep	eBeam-EML	metal evaporator	Au,Ag,Al,Cr, AuGe,Co,Pt,Si, Ti,Zr,W,Er,Mo,SiO2, Ta,Pd,Ni,Ge,Sn	Sloan	8	hr + mat	12
10	EML	metrology	Resonetics rm	filmetrics	thin film measurement system	measures film thickness	Filmetrics F20	8	hr	12
11	EML	Photo-EML	Au Bonder Rm	hotpress	hydraulic press	applies loads ~100 kN, electrically heats to ~340 C; used on thermoplastic films (eg, PMMA)	Carver 4386	8	hr	12
12	EML	photo	photo	MA4	mask aligner	contact lithography	Karl Suss MA-4	8	hr	12
13	EML	photo	photo	MJB3-BroadBand	mask aligner	contact lithography	Karl Suss MJB-3	8	hr	12
14	EML	diffusion	Resonetics rm	OxidationTube	tube furnace	wet & dry ox, anneals, bakes	Lindberg	8	hr	12
15	EML	metrology	metrology	parametric-tester	parametric-tester	measures device characteristics	Hewlett-Packard	8	hr	12
16	EML	wet	photo	photo-hood-EML	fume hood	solvent wet etch		8	hr	12
17	EML	pecvd-rie	pecvd-rie	plasmatherm	dual chamber PECVD-RIE	etches & deposits dielectrics; heated chuck	Plasmatherm	8	hr	12
18	EML	diffusion	metrology	RTA-EML	rapid thermal annealer		AG Associates Heatpulse 410	8	hr	12
19	EML	metrology	metrology	semNeo	inspection SEM	�3" samples, 20kX, ~0.2 um resolution	Joel/Nikon Neoscope JCM-5000	8	hr	12
20	EML	wet	photo	SolventHood-EML	fume hood for solvents, no drain			8	hr	12
21	EML	metal dep	metal dep	SputtererAJA	sputterer	Al, Cr, Cu, etc	AJA Orion 5	8	hr + mat	12
22	EML	metrology	metrology	wykoEML	non-contact profiler	surface topology; up to 500um vertical scan	Wyko RST	8	hr	12
23	ICL	metrology	metrology	4-pt-probe	resistivity measurement system			2	hr	4
24	ICL	diffusion	diffusion	5A-GateOx	atmosph. diffusion tube	for gate oxide, CMOS only	Thermco 10K	25	run+steam	39
25	ICL	diffusion	diffusion	5B-Anneal	atmosph. diffusion tube	for annealing, including Concept1 films	Thermco 10K	25	run+steam	39
26	ICL	diffusion	diffusion	5C-FieldOx	atmosph. diffusion tube	for oxidation	Thermco 10K	25	run+steam	39
27	ICL	diffusion	diffusion	5D-ThickOx	atmosph. diffusion tube	for oxidation, CMOS only	Thermco 10K	25	run+steam	39
28	ICL	diffusion	diffusion	6A-nPoly	low P diffusion tube	LPCVD plysilicon; CMOS only	Thermco 10K	65	run+70/um	74
29	ICL	diffusion	diffusion	6B-Poly	low P diffusion tube	LPCVD thick & P-doped polysilicon	Thermco 10K	65	run+70/um	74
30	ICL	diffusion	diffusion	6C-LTO	low P diffusion tube	LPCVD Low Temperature Oxide	Thermco 10K	65	run+70/um	74
31	ICL	diffusion	diffusion	6D-Nitride	low P diffusion tube	LPCVD stoichiometric Si nitride	Thermco 10K	65	run+70/um	74
32	ICL	metrology	photo	AFM	Atomic Force Microscope	surface topology	Veeco D3100	9	hr	12
33	ICL	MOCVD	deposition	ALD	atomic layer dep	atomic layer dep: Al,Hf,Ti ox, TiN	Cambridge Nanotech	7	wafer+thickness	14
34	ICL	MOCVD	deposition	ALD-Oxford	plasma-assisted atomic layer dep	plasma-ALD: Al,Hf,Ti ox;W,Ti nitr	Oxford FlexAl	7	wafer+thickness	14
35	ICL	plasma etch	metallizat'n	AME5000	plasma etcher	Chamber A: SiO2, BPSG, LTO; Chamber B: Si nitride, poly	AMAT Precision 5000	7	wafer+mat	14
36	ICL	photo	photo	asher-ICL	plasma asher	strip PR	Matrix 106	5	run	7
37	ICL	photo	photo	coater6	wafer track	coats PR	SVG 8860	2	wafer	4
38	ICL	pecvd	deposition	concept1	dielectric plasma dep	deposits oxide, nitride, TEOS	Novellus Concept 1	7	wafer	14
39	ICL	metrology	metrology	cv	CV bridge	measures capacitance vs voltage	Boonton	1	wafer	3
40	ICL	pecvd	diffusion	DCVD	dielectric plasma dep	deposits oxide, nitride	AMAT Centura 5200	7	wafer+thickness	14
41	ICL	pkg	packaging	diesaw	diesaw	dices wafers	Disco DAD-2H/6T	3	wafer+cut	6
42	ICL	metal dep	metallizat'n	eBeamCMOS	metal evaporator	Al, Ir, Pt, Co, W, Er, Ti, Mo, SiO2, Si, Ta	Temescal FC1800	30	run+mat	37
43	ICL	metrology	metrology	ellipsometer-ICL	ellipsometer	measures film thickness & dielectric constant	Gaertner L116BLC-26A	2	hr	4
44	ICL	metal dep	AME rm	endura	metal sputtering system	sputters Ti, TiN, Al, AlSi	AMAT Endura	7	wafer+mat	14
45	ICL	UHCVD	39-528	epi-Centura	Ultra Hi-vac chem vapor dep	grows Si & SiGe epilayers	AMAT Centura 5200	18	hr	18
46	ICL	CMP	CMP	GnP	chemo-mechanical polisher (BPSG, LTO, thermal oxide,nitride, Si)		GnP Poli-400L	7	wafer+slurry	14
47	ICL	pkg	EML Metro	goldwire	gold-ball wire bonder		Kulicke&Soffa 4124	7	hr	14
48	ICL	photo	photo	HMDS-ICL	bake oven	for hexamethyldisilazane (an adhesion promoter)	Yield.Eng.Syst.3/10	0	wafer	10
49	ICL	photo	photo	i-stepper	wafer stepper	patterns wafers, 5x reduction, 0.5 um resolution	Nikon NSR-2005i9 i-line(365nm)	6	wafer	9
50	ICL	wet	packaging	KOH-Au	wet station	Au-bearing KOH & Cu plating	Semifab WPS-400	25	run	32
51	ICL	plasma etch	etching	LAM490B	plasma etcher	for Si & nitride [gases=C2F6,SF6,Cl2,He,O2]	LAM 490B	7	wafer+thickness	14
52	ICL	plasma etch	etching	LAM590-ICL	plasma etcher	for oxide [gases=CHF3,CF4,He,O2]	LAM 590B	7	wafer+thickness	14
53	ICL	metrology	photo	microscope-ICL	inspection microscope		Nikon Optiphot 88	2	hr	4
54	ICL	wet	photo	nitrEtch-HotPhos	wet station	wet etches nitride (1st tank)	Semifab WPS-400	25	run	32
55	ICL	wet	photo	oxEtch-BOE	wet station	wet etch oxide	Semifab WPS-400	25	run	32
56	ICL	plasma etch-dep	AME rm	Oxford-100	plasma etch/dep	for Si, nitride, TEOS [gases=C2F6, SF6,Cl2,He,O2; NH3,SiH4]	Oxford Plasmalab System 100	7	wafer+thickness	14
57	ICL	metrology	metrology	P10	profilometer	measures surface roughness	Tencor/Prometrix P-10	5	hr	10
58	ICL	wet	packaging	plating-bench	wet station	Au, Ni & Cu plating	Semifab WPS-400	25	run	32
59	ICL	wet	near AME	premetal-Piranha	wet station	for piranha & HF dip	Semifab WPS-400	25	run	32
60	ICL	plasma etch	etching	rainbow	plasma etcher	for metal (Al, Ti) [gases=SF6,Cl2, BCl3,CHCl3,N2]	LAM 9600	7	wafer	14
61	ICL	diffusion	diffusion	rca-ICL	wet station	RCA clean		25	run	39
62	ICL	diffusion	diffusion	RTA2	rapid thermal annealer		AG Associates Heatpulse 410	4	wafer	5
63	ICL	diffusion	diffusion	RTA-pieces	rapid thermal annealer	non-Au, accepts �3" wf & pieces	Annealsys	4	wafer	5
64	ICL	diffusion	diffusion	RTP	rapid thermal annealer		AG Associates 8108	4	wafer	5
65	ICL	diffusion	diffusion	RTP-Si	rapid thermal annealer		AG Associates 8108	4	wafer	5
66	ICL	diffusion	diffusion	SCA	surface charge analyzer	measures surface charge, carrier lifetime	Semitest	2	hr	4
67	ICL	metrology	photo	semZeiss	low-V scanning electron microscope		Zeiss Supra 40	9	hr	12
68	ICL	pkg	EML Metro	TMAH-KOHhood	wet bath	KOH & TMAH etching	fume hood	25	run	32
69	ICL	metrology	metrology	UV1280	spectroscopic ellipsometer	measures film thickness (single, stacks, PR)	Tencor/Prometrix UV-1280	5	hr	10
70	ICL	diffusion	diffusion	VTR	vertical thermal reactor	low-stress nitride	SVG/Thermco 7000	65	run+70/um	65
71	ICL	metrology	metrology	wykoICL	non-contact profiler	surface topology; up to 500um vertical scan	Wyko NT3300	5	hr	10
72	TRL	diffusion	diffusion	A1-GateOx	atmosph. diffusion tube	for gate oxide	MRL 718	25	run+steam	39
73	TRL	diffusion	diffusion	A2-WetOxBond	atmosph. diffusion tube	wafer bonding	MRL 718	25	run+steam	39
74	TRL	diffusion	diffusion	A3-Sinter	atmosph. diffusion tube	CMOS metal sintering	MRL 718	25	run	39
75	TRL	diffusion	diffusion	A4-III-Vanneal	atmosph. diffusion tube	anneal III-Vs; has O2	MRL 718	25	run	39
76	TRL	wet	Etch Room	acid-hood	wet station	wet etch	Laminaire	25	run	32
77	TRL	wet	Ballroom	acid-hood2	wet station	wet etching in 6.152J		25	run	32
78	TRL	metal dep	metal'n	AJA-TRL	sputterer	Al, Cr, Cu, Au,Ag, Ti	AJA ATC	30	run+mat.	37
79	TRL	photo	metal'n	asherMatrix-TRL	plasma photoresist stripper (single-wafer)		Matrix 106	5	run	7
80	TRL	photo	Etch Room	asher-TRL	plasma photoresist stripper (2 chambers)		Branson	5	run	7
81	TRL	diffusion	diffusion	B1-Au	atmosph. diffusion tube	gold exposure	MRL 718	25	run+steam	39
82	TRL	diffusion	diffusion	B2-Ox-alloy-Poly	low pressure diffusion tube	LP diffusion tube; deps Poly-Si on Au wf	MRL 718	65	run+70/um	74
83	TRL	diffusion	diffusion	B3-DryOx	atmosph. diffusion tube	annealing	MRL 718	25	run	39
84	TRL	diffusion	diffusion	B4-Poly	low pressure diffusion tube	LPCVD polysilicon	MRL 718	65	run+70/um	74
85	TRL	pecvd	39-428	CCNT	plasma dep chamber	deposits carbon nanotubes from acetylene	Aixtron	7	wafer	14
86	TRL	pecvd	EML pecvd-rie	CNT	plasma dep chamber	deposits carbon nanotubes from acetylene	Home-built	7	wafer	14
87	TRL	photo	photo	coater	spinner	coats PR	Solitec 5110	2	wafer+mat	10
88	TRL	metrology	Ballroom	dek-NoAu	profilometer	measures surface roughness, no-gold wafers only	Sloan Dektak	2	hr	4
89	TRL	metrology	Ballroom	dektak	profilometer	measures surface roughness	Sloan Dektak II	2	hr	4
90	TRL	metal dep	metal'n	eBeamAu	metal evaporator	Au,Ag,Al,Cr,AuGe, Co,Pt,Si,Ti,Zr,W ,Er,Mo,SiO2,Ta, Pd,Ni,Ge,Sn	Temescal VES2550	30	run+mat.	37
91	TRL	metal'n	39-428	eBeamFP	metal evaporator	Au,Al,Cr,Pt,Ti,	Temescal FC2000	30	run+mat.	37
92	TRL	metrology	Ballroom	ellipsometer-TRL	ellipsometer	measures film thickness & index	Gaertner	2	hr	4
93	TRL	photo	photo	EV1	mask aligner	contact, w/IR	Electronic Visions 620	6	wafer	9
94	TRL	photo	photo	EV-LC	mask aligner	contact, w/IR	Electronic Visions 620	6	wafer	9
95	TRL	photo	photo	EV501-620	wafer aligner/bonder	aligns & bonds wafers (fusion,anodic,thermo-compression)	Electronic Visions	6	wafer	9
96	TRL	metrology	Ballroom	Filmetrics-TRL	thin film measurement system	measures film thickness	Filmetrics F-20	2	hr	4
97	TRL	photo	photo	fluoroscope	to check for photoresist after developing			1	wafer	3
98	TRL	metrology	Etch Room	FLX	non-contact profiler	measures wafer bow	KLA-Tencor FLX	5	hr	10
99	TRL	photo	39-430	Heidelberg	direct-write laser	laser-writes on photoresist	Heidelberg DWL-66	10	hr	16
100	TRL	photo	photo	hotplate1	hotplate	for post & pre-baking SU8 & PZT at �300oC		1	wafer	2
101	TRL	photo	photo	hotplate2	hotplate	for post & pre-baking SU8 & PZT at �300oC		1	wafer	2
102	TRL	photo	photo	hotplate300	hi-T hotplate	for post & pre-baking SU8 & PZT at �400oC		1	wafer	2
103	TRL	photo	photo	HMDS-TRL	bake oven	for hexamethyldisilazane (an adhesion promoter)		0	wafer	10
104	TRL	metrology	test area	hp-probe	prober-tester	electrical characterization	Rucker/Kolls 1032-HP4062B	2	hr	4
105	TRL	metrology	Etch Room	IV-probe	curve tracer w/probe	measures IV characteristics	Tektronics	2	hr	4
106	TRL	metrology	test area	keithley	parametric tester	electrical characterization	Keithley 450S	2	hr	4
107	TRL	rie	Etch Room	LAM590-TRL	plasma etcher	for oxide [gases=CHF3,CF4,He,O2]	LAM 590	7	wafer	14
108	TRL	photo	photo	MA-6	mask aligner	contact, w/IR	Karl Suss MA-6	6	wafer	9
109	TRL	metrology	photo	microscope-TRL	inspection microscope	w/Nomarski interference contrast	Nikon	2	hr	4
110	TRL	metrology	Ballroom	nanospec	thin film measurement system	measures film thickness	Nanometrics AFT 010-0180	2	hr	4
111	TRL	deposition	Etch Room	parylene	parylene coater	coats wafers w/parylene		5	wafer	10
112	TRL	wet	photo	photo-wet-Au	wet station	wet etch photoresist	Semifab WPS-800	25	run	32
113	TRL	wet	photo	photo-wet-l	wet station	wet etch photoresist	Semifab WPS-800	25	run	32
114	TRL	wet	photo	photo-wet-r	wet station	wet etch photoresist	Semifab WPS-800	25	run	32
115	TRL	photo	photo	pispinner	polyimide spinner	coats wafers w/polyimide	Headway Research	3	wafer	6
116	TRL	rie	Etch Room	plasmaquest	ECR-RIE	etches dielectrics on III-Vs, polyimide, etc	Plasmaquest Series 11 Model 145	7	wafer+thickness	14
117	TRL	photo	photo	PMMAspinner	PMMA spinner	coats wafers w/PMMA		3	wafer	6
118	TRL	photo	photo	postbake	oven	to bake photoresist after developing	Blue DDC-146C	0	wafer	3
119	TRL	photo	photo	prebakeovn	oven	to bake photoresist before exposure		0	wafer	3
120	TRL	spin dep	Etch Room	PZTcoater	PZT coater	deposits PZT	Specialty Coating Systems, Spin Coater 6700 Series	5	wafer	10
121	TRL	spin dep	Etch Room	PZTfurnace	PZT furnace	anneals PZT	Thermolyne Furnace, 6000	5	run	7
122	TRL	diffusion	Etch Room	rca-TRL	wet station	RCA clean		25	run	39
123	TRL	photo	EMLmetrology	Resonetics	laser ablation system	laser-writes on photoresist, glass, plastic	Resonetics	10	hr	14
124	TRL	diffusion	Etch Room	rta	rapid thermal annealer	not CMOS-compatible	AG Associates 210T-02	4	wafer	5
125	TRL	diffusion	Etch Room	rta35	rapid thermal annealer	for III-Vs	AG Associates Heatpulse 410	4	wafer	5
126	TRL	rie	Etch Room	SAMCO	ICP-RIE	etches dielectrics on III-Vs	SAMCO 200iP	7	wafer+thickness	14
127	TRL	wet	DUV	Solvent-noAu	wet station	wet solvent for non-Au wafers		25	run	32
128	TRL	wet	DUV	Solvent-hood	wet station	wet solvent for non-Au wafers		25	run	32
129	TRL	plasma etch	Etch Room	sts1	Si deep trench etcher	etches deep features in Si (4" wafers)	STS/Multiplex ICP non-MESC	15	wafer+thickness	30
130	TRL	plasma etch	Etch Room	sts2	Si deep trench etcher	etches deep features in Si (6" wafers)	STS/Multiplex ICP MESC	15	wafer+thickness	30
131	TRL	plasma etch	Etch Room	sts3	Si deep trench etcher	etches deep features in Si (6" wafers)	STS/Multiplex ICP MESC	15	wafer+thickness	30
132	TRL	pecvd	diffusion	sts-CVD	dielectric plasma dep	deposits oxide, nitride, Si carbide	STS/Multiplex PECVD	7	wafer+thickness	14
133	TRL	photo	photo	SU8oven	oven	to bake SU8		0	wafer	0
134	TRL	photo	photo	SU8spinner	oven	to coat with SU8		3	wafer+mat	6
135	TRL	metrology	Ballroom	TBM-8	alignment measurement tool		Electronic Visions	2	hr	4
136	TRL	Etch	Etch Room	UVozone-Au	ozone clean plate	removes organics w/ozone created by UV light		2	hr	4
137	TRL	Etch	Etch Room	UVozone-noAu	ozone clean plate	removes organics w/ozone created by UV light		2	hr	4
138	TRL	photo	photo	varTemp	oven	to bake photoresist; temp can be cahnged		0	wafer	0
139	TRL	metrology	Etch Room	WYKO	non-contact profiler	surface topology; up to 500um vertical scan	Wyko NT9800	5	hr	10
140	TRL	Etch	Etch Room	XeF2	XeF2 vapor system	etches Si w/XeF2 for structural release		20	hr	25

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