IN TRL |
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| TRL Rules | Read before using TRL | |
| Acidhood & Acidhood 2 Procedures and Rules | Lab procedure | |
| MACHINE NAME | IT DOES: | AREA: |
| acid-hood | wet station | photolithography |
| acid-hood2 | wet station (NO Au) | photolithography |
aja-trl  |
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| asher | plasma PR stripper | photo stripper |
| ccnt |
carbon nanotube deposition system | deposition |
| e-beam | metal evaporator | vacuum deposition |
| ebeamFP |
evaporative deposition system | vacuum deposition |
| ellipsometerTRL | photolithography | |
| EV1 | mask aligner | photolithography |
| Evalig/Bond | wafer aligner/bonder | photolithography |
| hmds | resist vapor primer | photolithography |
| heidelberg |
laser pattern transfer system | photolithography |
| ksaligner-2 | mask aligner | photolithography |
| lam590-trl | Plasma etcher | etch |
| SU8spinner | specialty coater | photolithography |
| perkin-elmer | sputter system | deposition |
| photo-wet | wet station | photolithography |
| plasmaquest |
ECR pecvd-RIE | plasma etch |
| PMMA spinner | spin coater | photolithography |
| rca |
wet station | diffusion |
| rta35 | rapid thermal annealer | diffusion |
| samco |
inductively coupled plasma reactive ion etcher (ICP RIE) | etch |
| Solvent-noAU | wet station | |
| sts1 |
Si deep trench etcher | etch |
| sts2 |
etcher | etch |
| sts3 | etcher | etch |
| -- Kapton Tape | ||
| stscvd |
deposition | |
| Target mount | etch | |
| tubeA1-CMOSox |
atmospheric diffusion tube | diffusion |
| tubeA2-wetox/bond |
atmospheric diffusion tube | diffusion |
| tubeA3-CMOSinter |
atmospheric diffusion tube | diffusion |
| tubeA4-organic
bake |
atmospheric diffusion tube | diffusion |
| tubeB1-Au |
atmospheric diffusion tube | diffusion |
| tubeB2-ox/alloy |
atmospheric diffusion tube | diffusion |
| tubeB3-dryox/anneal |
atmospheric diffusion tube | diffusion |
| tubeB4-poly | low P diffusion tube | diffusion |
| XeF2 |
isotropic silicon etcher | etch |
Technical
Staff Only 
