Figure 2

Figure 2: Close-up photomicrographs showing, in the top portion of the figure, a platelet bonded on a silicon wafer.  A close-up view of the micro-cleaved end facet and the ridge waveguide is shown in the lower portion of the figure.  Note also the stripe ohmic contact on top of the mesa and the broad-area top contact pad (insulated by a BCB support layer).