The high-frequency variability characterization of MOSFETs is becoming more necessary due to new process developments such as high-K metal gates,…
Technology scaling has enabled low-power operations in digital integrated circuits. Therefore, the trend to move analog-to-digital operations upstream to allow…
In CMP process, the pad asperity modulus and asperity height are two important properties that affect the planarization results [1]…
In this work we propose a particle agglomeration model for CMP, to understand the creation and behavior of agglomerated slurry…
Electromechanical resonators such as quartz crystals, surface acoustic wave (SAW) resonators, and ceramic resonators have become essential components in electronic…
As continued scaling becomes increasingly difficult, 3D integration has emerged as a viable solution to achieve higher bandwidth and power…
Thin Film Bulk Acoustic Resonators (FBARs) are widely used in the design of modern radio frequency components including duplexers, filters,…
Design for manufacturability (DFM) of processes, devices, and integrated circuits. Characterization and modeling of variation in semiconductor and MEMS manufacturing, with emphasis on chemical-mechanical polishing (CMP), electroplating, plasma etch, and embossing processes.