Design for manufacturability (DFM) of processes, devices, and integrated circuits. Characterization and modeling of variation in semiconductor and MEMS manufacturing, with emphasis on chemical-mechanical polishing (CMP), electroplating, plasma etch, and embossing processes. Statistical modeling of spatial and operating variation in advanced devices and circuits.
In this work, the virtual source (VS) charge-based compact model is validated for standard cell libraries and digital circuits. The…
Electromechanical resonators such as quartz crystals, surface acoustic wave (SAW) resonators, and ceramic resonators have become essential components in electronic…
Technology scaling has enabled low-power operations in digital integrated circuits. Therefore, the trend to move analog-to-digital operations upstream to allow…
In our previous work on CMP modeling, we developed an original physical die-level model to understand the pattern density dependence…
Previously we proposed a particle agglomeration model for chemical mechanical planarization (CMP) with the primary motivation of understanding the creation…