Dr. Duane S. Boning is Professor of Electrical Engineering and Computer Science in the EECS Department at MIT. He is affiliated with the MIT Microsystems Technology Laboratories, and serves as MTL Associate Director for Computation and CAD. From 2004 to 2011, he served as Associate Head of the EECS Department at MIT, and from 2011 through 2013 as Director/Faculty Lead of the MIT Skoltech Initiative. He is currently Director of the MIT/Masdar Institute Cooperative Program.
Dr. Boning received his S.B. degrees in electrical engineering and in computer science in 1984, and his S.M. and Ph.D. degrees in electrical engineering in 1986 and 1991, respectively, all from the Massachusetts Institute of Technology. He was an NSF Fellow from 1984 to 1989, and an Intel Graduate Fellow in 1990. From 1991 to 1993 he was a Member Technical Staff at the Texas Instruments Semiconductor Process and Design Center in Dallas, Texas, where he worked on semiconductor process representation, process/device simulation tool integration, and statistical modeling and optimization.
Dr. Boning is a Fellow of the IEEE, and has served as Editor in Chief for the IEEE Transactions on Semiconductor Manufacturing, and as chairman of the CFI/Technology CAD Framework Semiconductor Process Representation Working Group. He is a member of the IEEE, Electrochemical Society, Eta Kappa Nu, Tau Beta Pi, Materials Research Society, Sigma Xi, and the Association of Computing Machinery.
His research interests include the modeling and control of variation in IC and MEMS processes, devices, and circuits. Particular emphasis is on modeling of chemical mechanical polishing (CMP), plasma etch, and imprint/embossing processes; and statistical characterization and design for manufacturing of devices and circuits in advanced IC technologies.
- Fall 2015: 6.01 Intro to EECS I
- Spring 2005-2015: 6.780J/2.830J Manufacturing Process Control (co-lecture with D. Hardt)
- Spring 2014: 6.01 Intro to EECS I
- Fall 2005-2013: Lectures (part) in 2.853/2.854 Introduction to Manufacturing Systems
- Fall 2005-2008: Lectures (part) in 2.810 Manufacturing Processes and Systems
- Spring 2004: 6.001 Structure and Interpretation of Computer Programs
- Spring 2003: 6.780 Semiconductor Manufacturing
- Fall 2002: 6.003 Signals and Systems
- Fall 2001: 6.001 Structure and Interpretation of Computer Programs
- Spring 2000: 6.011 Intro to Communications, Control, and Signal Processing
- SEMATECH/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing, with emphasis on waste reduction in CMP.
- Statistical Metrology: modeling of CMP, variation in processes/devices/circuits
- Semiconductor Process Control – Run by Run Control, Sensor Technology, and Data Analysis