Duane S. Boning

Duane Boning is Professor and Associate Head of the Department of Electrical Engineering and Computer Science at MIT. He is affiliated with the MIT Microsystems Technology Laboratories.

Research Interests

Research interests include the modeling and control of variation in semiconductor and MEMS manufacturing. Particular emphasis is on modeling of chemical mechanical polishing (CMP) and advanced interconnect processes, and control in CMP and plasma etch.

Teaching

Spring 2005-2007: 2.830J/6.780J Manufacturing Process Control (co-lecture with D. Hardt)
Fall 2005-2007: Lectures (part) in 2.810 Manufacturing Processes and Systems, and 2.853/2.854 Introduction to Manufacturing Systems
Spring 2004: 6.001 Structure and Interpretation of Computer Programs
Spring 2003: 6.780 Semiconductor Manufacturing
Fall 2002: 6.003 Signals and Systems
Fall 2001: 6.001 Structure and Interpretation of Computer Programs
Spring 2000: 6.011 Intro to Communications, Control, and Signal Processing

Research Projects

Center for Circuits, Systems, and Solutions, with particular focus on characterization and modeling of circuit variation and design for manufacturability.
Interconnect Focus Center, with particular focus on modeling and technology assessment of future and alternative IC interconnect.
NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing, with emphasis on waste reduction in CMP
Statistical Metrology: modeling of CMP, variation in processes/devices/circuits
Semiconductor Process Control - Run by Run Control, Sensor Technology, and Data Analysis

Additional Service

Editor in Chief of the IEEE Transactions on Semiconductor Manufacturing
Keeper of the Semiconductor Subway

Associated Students (Advisor/Co-Advisor)

Karthik Balakrishnan (Ph.D., EECS)
Albert Chang (MS/Ph.D., EECS)
Nigel Drego (Ph.D., EECS)
Wei Fan (Ph.D., EECS)
Ali Farahanchi (M.Eng., EECS)
Joy Johnson (MS/Ph.D., EECS)
Zhipeng Li (UROP, EECS)
Daihyun Lim (Ph.D., EECS)
Hayden Taylor (Ph.D., EECS)

Recent Students & Degrees (Advisor/Co-Advisor)

Degrees granted in Academic Year 2006-2007: 4 PhD, 1 SM/MEng, 4 LFM
Degrees granted in Academic Year 2005-2006: 2 SM/MEng, 1 LFM
Degrees granted in Academic Year 2004-2005: 1 SM/MEng, 1 LFM
Degrees granted in Academic Year 2003-2004: 2 SM/MEng, 1 LFM
Degrees granted in Academic Year 2002-2003: 1 SM/MEng, 1 LFM
Degrees granted in Academic Year 2001-2002: 6 PhD, 4 SM/MEng, 7 LFM

Address

Prof. Duane Boning
MIT, Room 38-435
77 Massachusetts Ave
Cambridge, MA 02139
Phone: 617 253-0931
Email: boning at mtl.mit.edu
Assistant: Sharlene Blake, sblake at mtl.mit.edu, 617 253-4657

Map showing building location.

Publications

For online versions of papers, see the listings associated with particular research activities (e.g. CMP/Metrology).

Biography

Duane S. Boning received the S.B. degrees in electrical engineering and in computer science in 1984, and the S.M. and Ph.D. degrees in electrical engineering in 1986 and 1991, respectively, all from the Massachusetts Institute of Technology. He was an NSF Fellow from 1984 to 1989, and an Intel Graduate Fellow in 1990. From 1991 to 1993 he was a Member Technical Staff at the Texas Instruments Semiconductor Process and Design Center in Dallas, Texas, where he worked on semiconductor process representation, process/device simulation tool integration, and statistical modeling and optimization.

Dr. Boning is a Fellow of the IEEE, is Editor in Chief for the IEEE Transactions on Semiconductor Manufacturing, and has served as chairman of the CFI/Technology CAD Framework Semiconductor Process Representation Working Group. He is a member of the IEEE, Electrochemical Society, Eta Kappa Nu, Tau Beta Pi, Materials Research Society, Sigma Xi, and the Association of Computing Machinery.