Recent Publications

PFC Alternatives

List of journal articles:

  1. R. Chatterjee, S. Karecki, R. Reif, V. Vartanian, and  T. Sparks, “The Use of Unsaturated Fluorocarbons for Dielectric Etch Applications,” J. Electrochem. Soc. 149(4), April 2002.
  2. R. Chatterjee, S. Karecki, R. Reif, T. Sparks, V. Vartanian, and B. Goolsby, “The Evaluation of Hexafluorobenzene as an Environmentally Benign Dielectric Etch Chemistry,” J. Electrochem. Soc. 148(12), G721-G724, December 2001.  
  3. S. Karecki, R. Chatterjee, L. Pruette, R. Reif, V. Vartanian, T. Sparks, and L. Beu, “Characterization of iodoheptafluoropropane as a dielectric etchant III: Effluent analysis,” J. Vac. Sci. Technol. B 19(4), 1306-1318, July/August 2001.  
  4. S. Karecki, R. Chatterjee, L. Pruette, R. Reif, V. Vartanian, T. Sparks, J. Lee, L. Beu, and C. Miller, “Characterization of iodoheptafluoropropane as a dielectric etchant II: Wafer surface analysis,” J. Vac. Sci. Technol. B 19(4), 1293-1305, July/August 2001. 
  5. S. Karecki, R. Chatterjee, L. Pruette, R. Reif, V. Vartanian, T. Sparks, L. Beu, and K. Novoselov, “Characterization of iodoheptafluoropropane as a dielectric etchant I: Process performance evaluation,” J. Vac. Sci. Technol. B 19(4), 1269-1292, July/August 2001. 
  6. S. Karecki, R. Chatterjee, L. Pruette, R. Reif, T. Sparks, L. Beu, and V. Vartanian, “Evaluation of Oxalyl Fluoride for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool,” J. Electrochem. Soc. 148(3), 141-149, March, 2001. 
  7. L. Pruette, S. Karecki, R. Chatterjee, R. Reif, T. Sparks, V. Vartanian, “High Density Plasma Oxide Etching Using Nitrogen Trifluoride and Acetylene,” J. Vac. Sci. Technol. A 18(6), 2749-2758, November/December 2000. 
  8. S. Karecki, R. Chatterjee, L. Pruette, R. Reif, T. Sparks, L. Beu, and V. Vartanian, “Evaluation of Pentafluoroethane and 1,1-Difluoroethane for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool,” Jpn. J. Appl. Phys. 39, Part 1 (7B), 4666-4686, July 2000. 
  9. L. Pruette, S. Karecki, R. Reif, L. Tousignant, W. Reagan, S. Kesari, L. Zazzera, “Evaluation of C4F8O as an Alternative Plasma Enhanced Chemical Vapor Deposition Chamber Clean Chemistry,” J. Electrochem. Soc. 147(3), 1149-1153, March 2000. 
  10. C.B. Labelle, S.M. Karecki, R. Reif, and K.K. Gleason, “Fourier transform infrared spectroscopy of effluents from pulsed plasmas of 1,1,2,2-tetrafluoroethane, hexafluoropropylene oxide, and difluoromethane,” J. Vac. Sci. Technol. A 17(6), 3419-3428, November/December 1999. 
  11. L. Pruette, S. Karecki, R. Reif, W. Entley, J. Langan, V. Hazari, C. Hines, “Evaluation of a Dilute Nitrogen Trifluoride Plasma Clean in a Dielectric PECVD Reactor,” Electrochem. Solid-State Lett. 2(11), 592-594, Nov. 1999. 
  12. S. Karecki, L. Pruette, R. Reif, T. Sparks, L. Beu, and V. Vartanian, “Use of Novel Hydrofluorocarbon and Iodofluorocarbon Chemistries for a High Aspect Ratio Via Etch in a High Density Plasma Etch Tool,” J. Electrochem. Soc. 145(12),  4305-4312, Dec. 1998. 
  13. S. Karecki, L. Pruette, R. Reif, L. Beu, T. Sparks, and V. Vartanian, “Use of 2H-heptafluoropropane, 1-iodoheptafluoropropane, and 2-iodoheptafluoropropane for a high aspect ratio via etch in a high density plasma etch tool,” J. Vac. Sci. Technol. A 16(4), 2722-2724, July/August 1998.
  14. L.C. Pruette, S.M. Karecki, R. Reif, J.G. Langan, S.A. Rogers, R.J. Ciotti, and B.S. Felker, “Evaluation of trifluoroacetic anhydride as an alternative plasma enhanced chemical vapor deposition chamber clean chemistry,” J. Vac. Sci. Technol. A 16(3), 1577-1581, May/June 1998.
  15. S.M. Karecki, L.C. Pruette, and R. Reif, “Plasma etching of dielectric films with novel iodofluorocarbon chemistries: Iodotrifluoroethylene and 1-iodoheptafluoropropane,” J. Vac. Sci. Technol. A 16(2), 755-758, March/April 1998.