From scoggin at uark.edu Mon Apr 14 15:38:46 2008 From: scoggin at uark.edu (steve scoggin) Date: Mon, 14 Apr 2008 14:38:46 -0500 Subject: [labnetwork] For Sale: SVG Developer and Qunitel Mask Aligner Message-ID: <004601c89e67$2ba4f470$82eedd50$@edu> Dear colleagues, Available for sale are the attached SVG 8800 developer and Quintel mask aligner. Both are currently in working condition and config'ed for 100mm wafers but can arrange to have reconfig'ed as needed. The Quintel has back side IR with auto loader. Installation, training and maintenance can be arranged and provided for both. Regards, Steve Scoggin -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: quintel1.jpg Type: image/jpeg Size: 1366827 bytes Desc: not available URL: From hbtusainc at yahoo.com Fri Apr 18 16:52:50 2008 From: hbtusainc at yahoo.com (Mario Portillo) Date: Fri, 18 Apr 2008 13:52:50 -0700 (PDT) Subject: [labnetwork] Pattern generator donation Message-ID: <790640.51321.qm@web52302.mail.re2.yahoo.com> Dear Labnetwork Members....once every few years a system pops up available for donation, almost 5 years to the day, U of Wisconsin-Madison was the recipient of an Electromask CC251. Available now is an Eelctromask PG220-H, pattern generator only. There are expenses associated for the taker, packing, moving, installation, etc, etc. This is the first announcement. First come, first serve basis. Let me know Mario A. Portillo Sr. High'born Technology USA Inc. Semiconductor Equipment Services 5970 SW 18th St. Suite 227 Boca Raton, FL 33433 561 504-0244 cell 561 470-1975 office 561 395-0074 fax hbtusainc at yahoo.com www.hbtusainc.com From npeters at email.sjsu.edu Wed Apr 23 16:06:45 2008 From: npeters at email.sjsu.edu (Neil Peters) Date: Wed, 23 Apr 2008 13:06:45 -0700 Subject: [labnetwork] Sputtering Problems Message-ID: <006201c8a57d$8ead8290$50984182@ZAD> Hi We are having trouble with our Denton Sputter System. In the past, we were able to use it to sputter metals, Silicon, SiO2, Cu, Nickel and Chromium. Currently, we are unable to sputter anything using our DC power supply. The voltage sits around 500V, but no current, and it does not create a plasma, using an Aluminum target. In addition, we have melted the insulator rings, had them rebuilt and then melted them a second time once they were returned. We are beating our heads against the wall with this problem. Since the guns have been rebuilt, we have noticed a higher reflected power for RF (~10-12% for copper targets) and the deposition rate for Silicon has gone way down. Any advice would be most appreciated. Thanks Neil Neil Peters Process Lab Engineer Department of Chemical and Materials Engineering http://www.engr.sjsu.edu/cme San Jose State University voice: (408) 924-3967 One Washington Square fax: (408) 924-4057 San Jose, CA 95192-0082 E-mail: npeters at email.sjsu.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From dan at engr.wisc.edu Fri Apr 25 09:28:21 2008 From: dan at engr.wisc.edu (Daniel Christensen) Date: Fri, 25 Apr 2008 08:28:21 -0500 Subject: [labnetwork] Sputtering Problems In-Reply-To: <006201c8a57d$8ead8290$50984182@ZAD> References: <006201c8a57d$8ead8290$50984182@ZAD> Message-ID: <7.0.1.0.2.20080425082056.02b38938@engr.wisc.edu> Neil, A couple of thoughts: - when you rebuilt the cathode did you change the magnets? we have found in some cathodes, the magnets are exposed to the cooling water and degrade over time, changing them can help. Also check that the polarity of the magnets is correct. - Have you tried to strike the plasma by increasing the pressure for a short period of time to get a plasma and then dropping it to the normal pressure. - have you put an ohmmeter from the input cathode wire to the face of the cathode... with bad DC and more reflected on RF maybe its a bad connection interior to the cathode, etc. Good luck. At 11:04 AM 4/24/2008, Neil Peters wrote: >Hi > >We are having trouble with our Denton Sputter System. In the past, >we were able to use it to sputter metals, Silicon, SiO2, Cu, Nickel >and Chromium. Currently, we are unable to sputter anything using >our DC power supply. The voltage sits around 500V, but no current, >and it does not create a plasma, using an Aluminum target. In >addition, we have melted the insulator rings, had them rebuilt and >then melted them a second time once they were returned. We are >beating our heads against the wall with this problem. Since the >guns have been rebuilt, we have noticed a higher reflected power for >RF (~10-12% for copper targets) and the deposition rate for Silicon >has gone way down. > >Any advice would be most appreciated. > >Thanks >Neil > > > >Neil Peters >Process Lab Engineer >Department of Chemical and Materials Engineering >http://www.engr.sjsu.edu/cme >San Jose State University voice: (408) 924-3967 >One Washington Square fax: (408) 924-4057 >San Jose, CA 95192-0082 >E-mail: npeters at email.sjsu.edu > >_______________________________________________ >labnetwork mailing list >labnetwork at mtl.mit.edu >https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork Daniel C. Christensen dan at engr.wisc.edu Univ of WI-Madison (608) 262-6877 FAX (608) 265-2614 From ychen98 at mail.gatech.edu Fri Apr 25 23:25:42 2008 From: ychen98 at mail.gatech.edu (ychen98 at mail.gatech.edu) Date: Fri, 25 Apr 2008 23:25:42 -0400 Subject: [labnetwork] For removal of e-beam resist HSQ Message-ID: <1209180342.4812a0b683d7a@webmail.mail.gatech.edu> Hi, We are using negative e-beam resist HSQ to pattern silicon waveguides on SOI wafers by EBL and ICP in chlorine plasma. We got difficulty in removal of the resist after dry etching. By literature, it is a compound of silicon and oxygen, but we were not able to get rid of it even by dipping the samples into BOE(6:1) for 15mins which led to the detachness of the silicon waveguides due to huge undercut in BOX. Any advice would be most appreciated. Regards Yao --