[labnetwork] For removal of e-beam resist HSQ

[ychen98 at mail.gatech.edu]

Hi,
We are using negative e-beam resist HSQ to pattern silicon waveguides on SOI 
wafers by EBL and ICP in chlorine plasma. We got difficulty in removal of the 
resist after dry etching. By literature, it is a compound of silicon and 
oxygen, but we were not able to get rid of it even by dipping the samples into 
BOE(6:1) for 15mins which led to the detachness of the silicon waveguides due 
to huge undercut in BOX. 
Any advice would be most appreciated.

Regards

Yao




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