From bill at mer.utexas.edu Mon Jan 4 12:05:02 2010 From: bill at mer.utexas.edu (Bill Ostler) Date: Mon, 4 Jan 2010 11:05:02 -0600 Subject: [labnetwork] Operations manual or programming of YES LPIII HMDS oven. Message-ID: Recently had received a donation of a YES LP III HMDS oven. Suspect the Minarik controller has lost its programing. Called yes Engineering and was told that system is not supported and obsolete. Does anyone have any operation manuals for the LPIII or programming manuals for the Minarik controller. Or can give advise on how to replace with an updated controller? Thanks. Bill Ostler. University of Texas -------------- next part -------------- An HTML attachment was scrubbed... URL: From anupam at uts.cc.utexas.edu Thu Jan 7 10:10:36 2010 From: anupam at uts.cc.utexas.edu (Sanjay Banerjee) Date: Thu, 07 Jan 2010 09:10:36 -0600 Subject: [labnetwork] Post-doc opening in solar cells Message-ID: <5.2.1.1.2.20100107090926.01cba570@uts.cc.utexas.edu> Sanjay Banerjee Cockrell Family Regents Chair in Electrical & Computer Eng. Director, Microelectronics Research Center University of Texas at Austin 10100 Burnet Road, Bldg. 160 MER 1.606B/R9900, TX 78758-4445 e-mail: banerjee at ece.utexas.edu Phone: (512)-471-6730 FAX: (512)-471-8420 http://www.mrc.utexas.edu -------------- next part -------------- A non-text attachment was scrubbed... Name: PostDoc-NanoSolar-2010.01.04.doc Type: application/msword Size: 27136 bytes Desc: not available URL: From rathbun at cnf.cornell.edu Thu Jan 7 15:58:41 2010 From: rathbun at cnf.cornell.edu (Lynn Rathbun) Date: Thu, 07 Jan 2010 15:58:41 -0500 Subject: [labnetwork] Contact Aligner for Sale Message-ID: <6.2.5.6.2.20100107155805.05d3cc68@cnf.cornell.edu> The Cornell Nanoscale Facility has an older surplus HTG Contact Aligner for sale. http://www.cnfusers.cornell.edu/cnf5_tool.taf?_function=detail&eq_id=10 It is in working condition and has been used daily until this week. It includes fixtures for multiple wafer/mask sizes. Front side alignment only. $25,000 or best offer. RSVP Lynn ************************************************************** Dr. Lynn Rathbun Rathbun at cnf.cornell.edu NNIN Program Manager (607)-254-4872 CNF Laboratory Manager Duffield Hall (607)-255-8601 Fax Cornell University (607)-592-1549 Work Cell Ithaca, New York 14853 (607)-342-1880 Personal Cell -------------- next part -------------- An HTML attachment was scrubbed... URL: From prk1 at sfu.ca Thu Jan 14 12:46:02 2010 From: prk1 at sfu.ca (Philip Kubik) Date: Thu, 14 Jan 2010 09:46:02 -0800 Subject: [labnetwork] Sputter Oxides & Metals in Same System? Message-ID: <5A457E7C3A2E488E965B2EC4B3B9FA6B@4dlabs.sfu.ca> We have a sputtering & evaporation system with 2 RF & 2 DC cathodes. To date, we have only sputtered metals but we are considering sputtering oxides as well. I wonder whether others think this is a good idea or not and what, if any, chamber cleaning and conditions procedures are used when switching between oxides & metals. Specifically, the metals currently used in the system are nickel, titanium, chromium, aluminum, & gold. The oxides that we are considering are SiO2, TiO2, ZnO, Al2O3, & ITO. I have heard that is not a good idea to sputter metals and oxides in the same system but I don't know the reasons for this. Also, I know that some labs have metals only & oxides only sputtering systems, whereas others have a sputtering system for both metals & oxides. My own experience is with a system in which SiO2, niobium, aluminum, & molybdenum were deposited. When metals were sputtered after SiO2 sputtering, there was a lot of arcing in the deposition chamber, which damaged the devices being fabricated on silicon wafers. Consequently, after oxide sputtering, the chamber was conditioned by oxygen glow discharge cleaning and a lengthy metal deposition until the arcing ceased. Any advice would be greatly appreciated. Regards, Philip Kubik _________________________ Philip Kubik, Ph.D. Cleanroom Engineer 4D Labs, Simon Fraser University 8888 University Dr. Burnaby, BC, Canada V5A 1S6 Office phone: 778-782-8026 Email: Kubik at 4DLabs.ca -------------- next part -------------- An HTML attachment was scrubbed... URL: From mcvittie at cis.Stanford.EDU Thu Jan 14 18:42:12 2010 From: mcvittie at cis.Stanford.EDU (Jim McVittie) Date: Thu, 14 Jan 2010 15:42:12 -0800 (PST) Subject: [labnetwork] Sputter Oxides & Metals in Same System? In-Reply-To: <5A457E7C3A2E488E965B2EC4B3B9FA6B@4dlabs.sfu.ca> Message-ID: Hi, We have an AJA sputtering system with 5 confocal sputter guns and a single wafer holder in the center. The system is configured for sputtering up. We have no problem doing metals and dielectrics in the same system. The chimneys on the guns capture most of the stay deposition. In addition, we line the chamber walls with Al foil. We clean the chimneys by bead blasting during the weekly target change if they show flaking, and we change out the foil if it shows flaking. We do rf reactive sputtering, rf sputtering from dielectric targets and DC metal sputtering in the system. We have been doing this for 4 yrs with few problems. Once in a while we have to open the system up mid-week to bead blast a chimney, which has started flaking. Jim McVittie -------------------------------------------------------------- James (Jim) P. McVittie, Ph.D. Sr. Research Scientist Paul G. Allen Building Electrical Engineering Stanford Nanofabrication Facility jmcvittie at stanford.edu Stanford University Office: (650) 725-3640 Rm. 336X, 330 Serra Mall Lab: (650) 721-6834 Stanford, CA 94305-4075 Fax: (650) 723-4659 On Thu, 14 Jan 2010, Philip Kubik wrote: > We have a sputtering & evaporation system with 2 RF & 2 DC cathodes. To > date, we have only sputtered metals but we are considering sputtering oxides > as well. I wonder whether others think this is a good idea or not and what, > if any, chamber cleaning and conditions procedures are used when switching > between oxides & metals. Specifically, the metals currently used in the > system are nickel, titanium, chromium, aluminum, & gold. The oxides that we > are considering are SiO2, TiO2, ZnO, Al2O3, & ITO. > > I have heard that is not a good idea to sputter metals and oxides in the > same system but I don't know the reasons for this. Also, I know that some > labs have metals only & oxides only sputtering systems, whereas others have > a sputtering system for both metals & oxides. My own experience is with a > system in which SiO2, niobium, aluminum, & molybdenum were deposited. When > metals were sputtered after SiO2 sputtering, there was a lot of arcing in > the deposition chamber, which damaged the devices being fabricated on > silicon wafers. Consequently, after oxide sputtering, the chamber was > conditioned by oxygen glow discharge cleaning and a lengthy metal deposition > until the arcing ceased. > > Any advice would be greatly appreciated. > > Regards, > > Philip Kubik > > Philip Kubik, Ph.D. > Cleanroom Engineer > 4D Labs, Simon Fraser University > 8888 University Dr. > Burnaby, BC, Canada V5A 1S6 > Office phone: 778-782-8026 > > Email: Kubik at 4DLabs.ca From rkilci at mail.smu.edu Fri Jan 22 11:40:25 2010 From: rkilci at mail.smu.edu (Kilci, Reyhane) Date: Fri, 22 Jan 2010 10:40:25 -0600 Subject: [labnetwork] SPM-200 PL Device Message-ID: Hi, I am a student in SMU. We have a PL Mapper, SPM-200 which was bought from Waterloo Scientific Inc. It has some working problems and we do need to solve them. Actually, I was wondering that anyone has a manual of it. We just have a manual for software and nothing for the setup of the PL system. Before getting into it, it would be really good to have the manual of the SPM-200 PL Mapper. Thank you, Reyhane KILCI From vlogiudi at iqc.ca Thu Jan 28 10:44:26 2010 From: vlogiudi at iqc.ca (Vito Logiudice) Date: Thu, 28 Jan 2010 10:44:26 -0500 Subject: [labnetwork] Recommendatiosn for manual die scriber? In-Reply-To: References: <5A457E7C3A2E488E965B2EC4B3B9FA6B@4dlabs.sfu.ca> Message-ID: <7B4ACDD2A30F444B91CB6A32223B844E01D5C451@bes0.qberry.uwaterloo.ca> Hi all, We're in the market for a good quality manual die scriber, but we have no experience purchasing such systems. If anyone would care to share their opinions or recommendations on available manufacturers/models, it would be greatly appreciated. Regards, Vito Logiudice Vito Logiudice P.Eng. Director of Operations QNC & RAC Fabrication Facilities University of Waterloo 200 University Avenue West Waterloo, ON Canada N2L 3G1 Tel: 1-519-888-4567 ext. 38703 Fax: 1-519-888-7610 Cel: 1-519-500-2538 Email: vlogiudi at uwaterloo.ca