[labnetwork] Sputter problem

[Keith Bradshaw]

We are sputtering TiO2 .

We begin the day with a 250 angstrom rate....each subsequent run is reduced
by 10-15% in rate until we are at a 125 angstrom rate.  We are not changing
anything.

Next day we begin again at 250.

Tried argon clean between runs, tried 3 hour wait between runs, we are using
a load lock and vacuum looks stable , still rate drops on each run.

Any ideas?

cordially,

Keith Bradshaw
Dallas
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20110623/ffdd784a/attachment.html>