[labnetwork] Anneal temp for aluminum on silicon with forming gas

[Tony Whipple]

Hello;

At the University of Minnesota we use a10 % mixture on an atmospheric 
system with
the normal alloy temperature being 425C also have a  450C alloy process, 
time of 30 min.
Besides the normal safety items like over temperature limits, we have 
limited the
time the door can be open during loading of the wafers.  If this time is 
exceeded
the recipe goes to an abort step. This is done to reduce the amount of 
firing on the
end zone if the tube was allowed to stay open too long.

Regards, Tony Whipple



On 11/13/2012 2:11 PM, Aebersold,Julia W. wrote:
>
> I wanted to gather some information of aluminum anneal on a silicon 
> wafer performed by other cleanrooms.   We are using 5% forming gas 
> with an anneal temp of  400C for ½ hour with a 20C/min ramp up and 
> ramp down  However, I have also seen higher temps up to 475C, but was 
> concerned about the flammability of 100% hydrogen per its MSDS.
>
> Cheers!
>
> Julia Aebersold, Ph.D.
>
> MNTC Cleanroom Manager
>
> Shumaker Research Building, Room 233
>
> 2210 South Brook Street
>
> University of Louisville
>
> Louisville, KY  40292
>
> 502-852-1572
>
> http://louisville.edu/micronano/
>
>
>
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