[labnetwork] E-Beam Evaporation, Ni optimization.

[Bill Flounders]

Chandrashekar S Kambar,
Lab Network is primarily for operations discussions
or facility wide issues rather than detailed nanofabrication questions.
Please consider the mems talk venue for
questions at this level of process detail.
I also encourage you to contact Process Support
at CHA Industries
http://www.chaindustries.com/

I welcome dissenting opinion from the network
if I have misrepresented our forum.

Thank you
Bill Flounders
UC Berkeley



Chandrashekar S Kambar wrote:
>
> Hi,
>
> We are trying to optimize Ni with E-Beam Evaporator (TECPORT).
>
> The E-Beam power is raised in two steps: RAISE 1, SOAK 1 AND RAISE 2, 
> SOAK 2.
> ELECTRON BEAM PATTERN: Focused to one point (to the middle of the 
> crucible).
> CRUCIBLE: Graphite.
>
> ISSUE: During the RAISE 1, everything seems to be normal and only the 
> material in the middle of the crucible gets melted. During the RAISE 2 
> the material starts to spit out of the crucible. During the deposition 
> the spitting increases drastically, thus we will be forced to stop the 
> deposition. After the deposition when we take out the crucible, 
> crucible was broken across the wall. However there was no damage done 
> to the pocket holder (Hearth).
>
> Power % : Raise 1: 5% (V= 6.99 KV and I ~ 70 mA)
>                 Raise 2: 10% (V= 6.99 KV and I ~ 120 mA)
>                 During the deposition Power % goes up to 16% and the 
> current goes up to 180 mA ( V = 6.99 KV constant).
>
> We need to know, if there is any way to reduce the crucible cracking 
> and to avoid the spitting of the material.
>
> QUESTION 2:
>
> During the deposition the crucibles are cracked and its pieces are 
> stuck with the Ni material. Is there any way to recover the material 
> by removing the graphite pieces?
>
> Thanks and Regards,
> Chandrashekar S Kambar.
>
>
>
>
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