From julia.aebersold at louisville.edu  Wed May  1 10:05:33 2013
From: julia.aebersold at louisville.edu (Aebersold,Julia W.)
Date: Wed, 1 May 2013 14:05:33 +0000
Subject: [labnetwork] Accepting new tools to a shared facility
In-Reply-To: <6.2.5.6.2.20130430230733.0c152438@cnf.cornell.edu>
References: <DA25159AE3245C4F9094656F663E84D243849EE872@USFMAIL2.forest.usf.edu>
 <BAEB67F7D00AEE4F8513105A149258C0383F9182@CITESMBX2.ad.uillinois.edu>
 <6.2.5.6.2.20130430230733.0c152438@cnf.cornell.edu>
Message-ID: <D84411B2FA8CBA42BC4868D5382CA1BBC3D4BAEE@EXMBX09.ad.louisville.edu>

We have a similar policy as Cornell, but professors can limit what goes into the tool.  If it goes into our multi-user cleanroom then the tool is open for all users.

Cheers!

Julia Aebersold, Ph.D.
MNTC Cleanroom Manager
Shumaker Research Building, Room 233
2210 South Brook Street
University of Louisville
Louisville, KY  40292

502-852-1572
http://louisville.edu/micronano/

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Lynn Rathbun
Sent: Tuesday, April 30, 2013 11:18 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Accepting new tools to a shared facility

At Cornell, our agreement is even simpler. They have to give it to us, outright, no strings attached. We own it, we train on it, we take care of it, we charge for it. Co-ownership does not work in our opinion

Lynn Rathbun


At 07:57 PM 4/30/2013 +0000, you wrote:

Content-Language: en-US
Content-Type: multipart/alternative;
         boundary="_000_BAEB67F7D00AEE4F8513105A149258C0383F9182CITESMBX2aduill_"


Hi Rob,

Our criteria is very simple: They have to share it. They can set the ground rules regarding what materials/processes are acceptable, but if others want to use it for those allowed purposes, they must be given permission to do so. We also allow them to have their students do the training (and/or maintenance) on the tool if they choose, but they usually prefer to let our technical staff to do that.

 -- John

-------------------------------------------------------------
John S. Hughes                         Office: (217) 333-4674
Associate Director                        FAX: (217) 244-6375
Laboratory Operations                     hughes at illinois.edu<mailto:hughes at illinois.edu>
Micro and Nanotechnology Laboratory
University of Illinois at Urbana-Champaign
2000E Micro and Nanotechnology Laboratory
208 North Wright Street
Urbana, Illinois  61801              http://mntl.illinois.edu
-------------------------------------------------------------

On Apr 30, 2013, at 9:46 AM, "Tufts, Robert" <tufts at usf.edu<mailto:tufts at usf.edu>>
 wrote:


Dear All,

Do any of you have criteria or some sort of written agreement that you execute when a faculty member asks to have a tool of theirs taken under your shared facility?s umbrella? If so could you share it?

Thanks,
Rob

Robert Warner Tufts Jr. , MEE
Assistant Director
Nanotechnology Research & Education Center
College of Engineering, University of South Florida
<image001.png>
4202 E. Fowler Ave, ENB 118
Tampa, Florida 33620
Office Phone 813.974.5274
Cell Phone 813-505-1626
E-Mail: tufts at usf.edu<mailto:tufts at usf.edu>
Web:  http://www.nrec.usf.edu



_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

**************************************************************
Dr. Lynn Rathbun                                        Rathbun at cnf.cornell.edu<mailto:Rathbun at cnf.cornell.edu>
NNIN  Deputy Director                     (607)-254-4872
CNF Laboratory Manager
Duffield Hall                                                (607)-255-8601 Fax
Cornell University                                       (607)-592-1549 Work Cell
Ithaca, New York 14853                      (607)-342-1880 Personal Cell



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From elliscd at auburn.edu  Wed May  1 10:27:33 2013
From: elliscd at auburn.edu (Charles Ellis)
Date: Wed, 1 May 2013 14:27:33 +0000
Subject: [labnetwork] Accepting new tools to a shared facility
In-Reply-To: <6.2.5.6.2.20130430230733.0c152438@cnf.cornell.edu>
References: <DA25159AE3245C4F9094656F663E84D243849EE872@USFMAIL2.forest.usf.edu>
 <BAEB67F7D00AEE4F8513105A149258C0383F9182@CITESMBX2.ad.uillinois.edu>,
 <6.2.5.6.2.20130430230733.0c152438@cnf.cornell.edu>
Message-ID: <80AC4D64-4B6D-4DB8-9C51-D3E624D907F4@auburn.edu>

Lynn is exactly correct. Our experience has taught us that all equipment placed in the microelectronics facility must belong to and be managed by the facility. Shared ownership does not work. We have worked deals where the "former owner" is allowed some free time, as payment for the equipment. But it is scheduled by the facility.
Charles Ellis
Auburn University




On May 1, 2013, at 8:51 AM, "Lynn Rathbun" <rathbun at cnf.cornell.edu<mailto:rathbun at cnf.cornell.edu>> wrote:

At Cornell, our agreement is even simpler. They have to give it to us, outright, no strings attached. We own it, we train on it, we take care of it, we charge for it. Co-ownership does not work in our opinion

Lynn Rathbun


At 07:57 PM 4/30/2013 +0000, you wrote:
Content-Language: en-US
Content-Type: multipart/alternative;
         boundary="_000_BAEB67F7D00AEE4F8513105A149258C0383F9182CITESMBX2aduill_"


Hi Rob,

Our criteria is very simple: They have to share it. They can set the ground rules regarding what materials/processes are acceptable, but if others want to use it for those allowed purposes, they must be given permission to do so. We also allow them to have their students do the training (and/or maintenance) on the tool if they choose, but they usually prefer to let our technical staff to do that.

 -- John

-------------------------------------------------------------
John S. Hughes                         Office: (217) 333-4674
Associate Director                        FAX: (217) 244-6375
Laboratory Operations                     hughes at illinois.edu<mailto:hughes at illinois.edu>
Micro and Nanotechnology Laboratory
University of Illinois at Urbana-Champaign
2000E Micro and Nanotechnology Laboratory
208 North Wright Street
Urbana, Illinois  61801              http://mntl.illinois.edu
-------------------------------------------------------------

On Apr 30, 2013, at 9:46 AM, "Tufts, Robert" <tufts at usf.edu<mailto:tufts at usf.edu>>
 wrote:

Dear All,

Do any of you have criteria or some sort of written agreement that you execute when a faculty member asks to have a tool of theirs taken under your shared facility?s umbrella? If so could you share it?

Thanks,
Rob

Robert Warner Tufts Jr. , MEE
Assistant Director
Nanotechnology Research & Education Center
College of Engineering, University of South Florida
<image001.png>
4202 E. Fowler Ave, ENB 118
Tampa, Florida 33620
Office Phone 813.974.5274
Cell Phone 813-505-1626
E-Mail: tufts at usf.edu<mailto:tufts at usf.edu>
Web:  http://www.nrec.usf.edu



_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

**************************************************************
Dr. Lynn Rathbun                                        Rathbun at cnf.cornell.edu<mailto:Rathbun at cnf.cornell.edu>
NNIN  Deputy Director                     (607)-254-4872
CNF Laboratory Manager
Duffield Hall                                                (607)-255-8601 Fax
Cornell University                                       (607)-592-1549 Work Cell
Ithaca, New York 14853                      (607)-342-1880 Personal Cell





_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From reynolds at ece.ucsb.edu  Wed May  1 10:58:28 2013
From: reynolds at ece.ucsb.edu (Tom Reynolds)
Date: Wed, 1 May 2013 07:58:28 -0700
Subject: [labnetwork] Accepting new tools to a shared facility
In-Reply-To: <6.2.5.6.2.20130430230733.0c152438@cnf.cornell.edu>
References: <DA25159AE3245C4F9094656F663E84D243849EE872@USFMAIL2.forest.usf.edu>
 <BAEB67F7D00AEE4F8513105A149258C0383F9182@CITESMBX2.ad.uillinois.edu>
 <6.2.5.6.2.20130430230733.0c152438@cnf.cornell.edu>
Message-ID: <05a301ce467c$56879c20$0396d460$@ucsb.edu>

UCSB has the same verbal agreement as Cornell.  Lynn's statement sums it up
well. No written agreement, just a verbal understanding.

--------------------------------------------------------------

Tom Reynolds,  Lab Manager

UCSB Nanofabrication Facility

Electrical and Computer Engineering Dept.

Engineering Science Bldg #225, Room 1109E

Santa Barbara, CA 93106

805-893-3918 x215  office

805-451-3979  cell

805-893-3918  fax

reynolds at ece.ucsb.edu

 

 

 

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu]
On Behalf Of Lynn Rathbun
Sent: Tuesday, April 30, 2013 8:18 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Accepting new tools to a shared facility

 

At Cornell, our agreement is even simpler. They have to give it to us,
outright, no strings attached. We own it, we train on it, we take care of
it, we charge for it. Co-ownership does not work in our opinion

Lynn Rathbun


At 07:57 PM 4/30/2013 +0000, you wrote:



Content-Language: en-US
Content-Type: multipart/alternative;
 
boundary="_000_BAEB67F7D00AEE4F8513105A149258C0383F9182CITESMBX2aduill_"


Hi Rob, 

Our criteria is very simple: They have to share it. They can set the ground
rules regarding what materials/processes are acceptable, but if others want
to use it for those allowed purposes, they must be given permission to do
so. We also allow them to have their students do the training (and/or
maintenance) on the tool if they choose, but they usually prefer to let our
technical staff to do that. 

 -- John

-------------------------------------------------------------
John S. Hughes                         Office: (217) 333-4674
Associate Director                        FAX: (217) 244-6375
Laboratory Operations                     hughes at illinois.edu
Micro and Nanotechnology Laboratory 
University of Illinois at Urbana-Champaign
2000E Micro and Nanotechnology Laboratory
208 North Wright Street
Urbana, Illinois  61801              http://mntl.illinois.edu
-------------------------------------------------------------

On Apr 30, 2013, at 9:46 AM, "Tufts, Robert" <tufts at usf.edu>
 wrote:




Dear All,
 
Do any of you have criteria or some sort of written agreement that you
execute when a faculty member asks to have a tool of theirs taken under your
shared facility's umbrella? If so could you share it?
 
Thanks,
Rob
 
Robert Warner Tufts Jr. , MEE
Assistant Director
Nanotechnology Research & Education Center
College of Engineering, University of South Florida
<image001.png>
4202 E. Fowler Ave, ENB 118
Tampa, Florida 33620
Office Phone 813.974.5274
Cell Phone 813-505-1626
E-Mail: tufts at usf.edu 
Web:  http://www.nrec.usf.edu
 
 
 
_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

**************************************************************
Dr. Lynn Rathbun
Rathbun at cnf.cornell.edu
NNIN  Deputy Director                     (607)-254-4872
CNF Laboratory Manager                                      
Duffield Hall                                                (607)-255-8601
Fax
Cornell University                                       (607)-592-1549 Work
Cell
Ithaca, New York 14853                      (607)-342-1880 Personal Cell





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From vito.logiudice at uwaterloo.ca  Thu May  2 06:56:36 2013
From: vito.logiudice at uwaterloo.ca (Vito Logiudice)
Date: Thu, 2 May 2013 10:56:36 +0000
Subject: [labnetwork] Accepting new tools to a shared facility
In-Reply-To: <DA25159AE3245C4F9094656F663E84D243849EE872@USFMAIL2.forest.usf.edu>
Message-ID: <CDA7BBA5.E789%vlogiudi@connect.uwaterloo.ca>

Hello Rob,

Our policy is in line with what several others have already mentioned:
https://qncfab.uwaterloo.ca/vis-gov-pol/policies/equip-acquisition-policy

Regards,
Vito
--
Vito Logiudice  M.A.Sc., P.Eng.
Director of Operations, Quantum NanoFab
University of Waterloo
200 University Avenue West
Waterloo, ON      Canada   N2L 3G1
Tel:  1-519-888-4567  ext. 38703
Email: vlogiudi at uwaterloo.ca<mailto:vlogiudi at uwaterloo.ca>
Website: https://qncfab.uwaterloo.ca<https://qncfab.uwaterloo.ca/>/


From: <Tufts>, Robert <tufts at usf.edu<mailto:tufts at usf.edu>>
Date: Tuesday, 30 April, 2013 10:46 AM
To: "labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>" <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Subject: [labnetwork] Accepting new tools to a shared facility

Dear All,

Do any of you have criteria or some sort of written agreement that you execute when a faculty member asks to have a tool of theirs taken under your shared facility?s umbrella? If so could you share it?

Thanks,
Rob

Robert Warner Tufts Jr. , MEE
Assistant Director
Nanotechnology Research & Education Center
College of Engineering, University of South Florida
[Description: Description: Picture1]

4202 E. Fowler Ave, ENB 118
Tampa, Florida 33620
Office Phone 813.974.5274
Cell Phone 813-505-1626
E-Mail: tufts at usf.edu<mailto:tufts at usf.edu>
Web:  http://www.nrec.usf.edu





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From rmorrison at draper.com  Mon May  6 09:49:55 2013
From: rmorrison at draper.com (Morrison, Richard H., Jr.)
Date: Mon, 06 May 2013 13:49:55 +0000
Subject: [labnetwork] Titanium hazard
Message-ID: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>

Hi Everyone,

Last week one of the staff was wiping off some evaporator parts that were covered with Titanium metal. He was using texwipes soaked with IPA. He tossed the texwipes in the trash then accidentally dropped some wipes saturated with IPA on top of them and a fire started. It self extinguished after 1 minute but it melted the bottom of a plastic trash can.

Have any of you had that happen or something similar? Needless to say this is very alarming and I need to understand what could have caused this and develop a corrective action plan.

Rick


Draper Laboratory
Group Leader Microfabrication Operations
555 Technology Square
Cambridge Ma, 02139-3563

www.draper.com
rmorrison at draper.com
W 617-258-3420
C 508-930-3461

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From julia.aebersold at louisville.edu  Mon May  6 14:41:05 2013
From: julia.aebersold at louisville.edu (Aebersold,Julia W.)
Date: Mon, 6 May 2013 18:41:05 +0000
Subject: [labnetwork] Titanium hazard
In-Reply-To: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>
References: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>
Message-ID: <D84411B2FA8CBA42BC4868D5382CA1BBC3D4D529@EXMBX09.ad.louisville.edu>

Did you have a statically charged trash can? Or did the wiping action charged the towels with IPA?

Cheers!

Julia Aebersold, Ph.D.
MNTC Cleanroom Manager
Shumaker Research Building, Room 233
2210 South Brook Street
University of Louisville
Louisville, KY  40292

502-852-1572
http://louisville.edu/micronano/

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Morrison, Richard H., Jr.
Sent: Monday, May 06, 2013 9:50 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Titanium hazard

Hi Everyone,

Last week one of the staff was wiping off some evaporator parts that were covered with Titanium metal. He was using texwipes soaked with IPA. He tossed the texwipes in the trash then accidentally dropped some wipes saturated with IPA on top of them and a fire started. It self extinguished after 1 minute but it melted the bottom of a plastic trash can.

Have any of you had that happen or something similar? Needless to say this is very alarming and I need to understand what could have caused this and develop a corrective action plan.

Rick


Draper Laboratory
Group Leader Microfabrication Operations
555 Technology Square
Cambridge Ma, 02139-3563

www.draper.com<http://www.draper.com>
rmorrison at draper.com<mailto:rmorrison at draper.com>
W 617-258-3420
C 508-930-3461

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From rmorrison at draper.com  Mon May  6 14:47:02 2013
From: rmorrison at draper.com (Morrison, Richard H., Jr.)
Date: Mon, 06 May 2013 18:47:02 +0000
Subject: [labnetwork] Titanium hazard
In-Reply-To: <D84411B2FA8CBA42BC4868D5382CA1BBC3D4D529@EXMBX09.ad.louisville.edu>
References: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>
 <D84411B2FA8CBA42BC4868D5382CA1BBC3D4D529@EXMBX09.ad.louisville.edu>
Message-ID: <D3862732F46DEB4B93B4A7A80614D288099B0877@mbx2.draper.com>

That is a good point, we are trying to reproduce what happened and static is a good theory. The trash can was lined with a plastic bag.

Rick


From: Aebersold,Julia W. [mailto:julia.aebersold at louisville.edu]
Sent: Monday, May 06, 2013 2:41 PM
To: Morrison, Richard H., Jr.; labnetwork at mtl.mit.edu
Subject: RE: Titanium hazard

Did you have a statically charged trash can? Or did the wiping action charged the towels with IPA?

Cheers!

Julia Aebersold, Ph.D.
MNTC Cleanroom Manager
Shumaker Research Building, Room 233
2210 South Brook Street
University of Louisville
Louisville, KY  40292

502-852-1572
http://louisville.edu/micronano/

From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Morrison, Richard H., Jr.
Sent: Monday, May 06, 2013 9:50 AM
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] Titanium hazard

Hi Everyone,

Last week one of the staff was wiping off some evaporator parts that were covered with Titanium metal. He was using texwipes soaked with IPA. He tossed the texwipes in the trash then accidentally dropped some wipes saturated with IPA on top of them and a fire started. It self extinguished after 1 minute but it melted the bottom of a plastic trash can.

Have any of you had that happen or something similar? Needless to say this is very alarming and I need to understand what could have caused this and develop a corrective action plan.

Rick


Draper Laboratory
Group Leader Microfabrication Operations
555 Technology Square
Cambridge Ma, 02139-3563

www.draper.com<http://www.draper.com>
rmorrison at draper.com<mailto:rmorrison at draper.com>
W 617-258-3420
C 508-930-3461

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From evporte at uark.edu  Mon May  6 14:59:56 2013
From: evporte at uark.edu (Errol V. Porter)
Date: Mon, 6 May 2013 18:59:56 +0000
Subject: [labnetwork] ASE alumina chamber clean procedure
Message-ID: <49510757561B8E4EB8076830B69BF277417BE7F0@ex-mbx1b.uark.edu>

Greetings,

I am cleaning an alumina cylinder from an STS (now STPS) advanced silicon etcher and looking for advice on the proper procedure to remove the interior coating. I remember the OEM indicating only a CO2 blast cleaning is needed. I have a reputable vendor indicating a bead-blast, chemical clean, detail and bake is needed to properly condition the part. Has anyone else had to clean an STS ASE alumina chamber before and if so, what procedure/vendor did you use to properly clean the cylinder?

Regards,

Errol Porter
University of Arkansas / HiDEC
700 W. Research Center Blvd
Fayetteville, AR 72701
Tel. (479) 575-2519
Mobile: (479) 236-0693
Fax (479) 575-2719
email: evporte at uark.edu<mailto:evporte at uark.edu>
http://www.hidec.uark.edu<http://www.hidec.uark.edu/>

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From lej at danchip.dtu.dk  Mon May  6 16:08:35 2013
From: lej at danchip.dtu.dk (Leif Johansen)
Date: Mon, 6 May 2013 20:08:35 +0000
Subject: [labnetwork] Titanium hazard
In-Reply-To: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>
References: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>
Message-ID: <879AEF5002D70747B136D02BC86A9C980E0647@ait-pex02mbx05.win.dtu.dk>

Hello Rick,

At DTU Danchip we have an e-beam evaporation system in which we deposit Titanuim. We have had at least three incidents of wipes or other parts catching fire during maintenance work. I do believe that the root cause is that Titanuim oxidizes very fast, especially when a large, fresh surface is exposed to oxygen.

I have tried to translate our safety precautions from Danish into some sort of English:

"Before the work is started, DI water is filled in a bucket and placed next to the machine. Surface cleaning of various chamber parts must take place over the water bucket. All used cloths, with or without Ethanol/IPA are also to be deposited in the bucket, so they can absorb water.
Absorption of water in the cloths will prevent ignition. Some metals, like Titanum, when exposed to mechanical stress like hammering or scraping, form small particles which ignite as a result of fast oxidation"

Hope this could help.

Best regards,

Leif

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Morrison, Richard H., Jr.
Sent: 6. maj 2013 15:50
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Titanium hazard

Hi Everyone,

Last week one of the staff was wiping off some evaporator parts that were covered with Titanium metal. He was using texwipes soaked with IPA. He tossed the texwipes in the trash then accidentally dropped some wipes saturated with IPA on top of them and a fire started. It self extinguished after 1 minute but it melted the bottom of a plastic trash can.

Have any of you had that happen or something similar? Needless to say this is very alarming and I need to understand what could have caused this and develop a corrective action plan.

Rick


Draper Laboratory
Group Leader Microfabrication Operations
555 Technology Square
Cambridge Ma, 02139-3563

www.draper.com<http://www.draper.com>
rmorrison at draper.com<mailto:rmorrison at draper.com>
W 617-258-3420
C 508-930-3461

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From mark.walters at duke.edu  Mon May  6 17:16:17 2013
From: mark.walters at duke.edu (Mark Walters)
Date: Mon, 6 May 2013 17:16:17 -0400
Subject: [labnetwork] Recommendations for Equipment Maintenance software?
Message-ID: <001501ce4a9e$f3261310$d9723930$@duke.edu>

Is anyone using commercially available software to schedule and track
equipment maintenance tasks?  There appears to be several software products
out there that will allow you to build a schedule of equipment maintenance
tasks, automatically send you reminders about these tasks, and then track
and record when they are completed.  Any feedback on such software or
practices would be appreciated.

 

Thanks,

Mark D. Walters, Ph.D.

Director, Shared Materials Instrumentation Facility (SMIF)

Duke University

Box 90271

Durham, NC 27708-0271

 <blocked::http://smif.lab.duke.edu/> http://smif.lab.duke.edu

Phone: (919) 660-5486

Fax: (919) 660-5491

 

 

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From Alan.C.Seabaugh.1 at nd.edu  Mon May  6 20:33:41 2013
From: Alan.C.Seabaugh.1 at nd.edu (Alan Seabaugh)
Date: Mon, 6 May 2013 20:33:41 -0400
Subject: [labnetwork] ASE alumina chamber clean procedure
In-Reply-To: <49510757561B8E4EB8076830B69BF277417BE7F0@ex-mbx1b.uark.edu>
References: <49510757561B8E4EB8076830B69BF277417BE7F0@ex-mbx1b.uark.edu>
Message-ID: <FAC5D4B4-305E-475D-BCEC-04602C84BAC0@nd.edu>

I have seen this happen with Pt on several occasions.   Nanoparticles of Pt appear to catalyze the combustion of IPA.  This happened in just the way you described.  I have also seen the IPA soaked texwipe ignite in my student's hand on wiping out an evaporation chamber after a Pt evaporation.  This has not happened with any other metal.

Regards, Alan Seabaugh

On May 6, 2013, at 2:59 PM, Errol V. Porter wrote:

Greetings,

I am cleaning an alumina cylinder from an STS (now STPS) advanced silicon etcher and looking for advice on the proper procedure to remove the interior coating. I remember the OEM indicating only a CO2 blast cleaning is needed. I have a reputable vendor indicating a bead-blast, chemical clean, detail and bake is needed to properly condition the part. Has anyone else had to clean an STS ASE alumina chamber before and if so, what procedure/vendor did you use to properly clean the cylinder?

Regards,

Errol Porter
University of Arkansas / HiDEC
700 W. Research Center Blvd
Fayetteville, AR 72701
Tel. (479) 575-2519
Mobile: (479) 236-0693
Fax (479) 575-2719
email: evporte at uark.edu<mailto:evporte at uark.edu>
http://www.hidec.uark.edu<http://www.hidec.uark.edu/>

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

Alan Seabaugh
Professor of Electrical Engineering
Director, Center for Low Energy Systems Technology (LEAST)
Department of Electrical Engineering, University of Notre Dame
230A Fitzpatrick Hall, Notre Dame, IN  46556-5637
574 631-4473 (office)

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From rmorrison at draper.com  Tue May  7 07:59:21 2013
From: rmorrison at draper.com (Morrison, Richard H., Jr.)
Date: Tue, 07 May 2013 11:59:21 +0000
Subject: [labnetwork] ASE alumina chamber clean procedure
In-Reply-To: <49510757561B8E4EB8076830B69BF277417BE7F0@ex-mbx1b.uark.edu>
References: <49510757561B8E4EB8076830B69BF277417BE7F0@ex-mbx1b.uark.edu>
Message-ID: <D3862732F46DEB4B93B4A7A80614D288099B0C2C@mbx2.draper.com>

Hi,

Here at Draper we use very fine beads to bead blast the cylinder. Then a wipe down with 70% IPA/ 35% DI dry and install. After it is installed we perform a condition, which is just a series of etch/passivation steps. We perform this every year during the annual PM.

Hope this helps.

Rick


Draper Laboratory
Group Leader Microfabrication Operations
555 Technology Square
Cambridge Ma, 02139-3563

www.draper.com
rmorrison at draper.com
W 617-258-3420
C 508-930-3461



From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Errol V. Porter
Sent: Monday, May 06, 2013 3:00 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] ASE alumina chamber clean procedure

Greetings,

I am cleaning an alumina cylinder from an STS (now STPS) advanced silicon etcher and looking for advice on the proper procedure to remove the interior coating. I remember the OEM indicating only a CO2 blast cleaning is needed. I have a reputable vendor indicating a bead-blast, chemical clean, detail and bake is needed to properly condition the part. Has anyone else had to clean an STS ASE alumina chamber before and if so, what procedure/vendor did you use to properly clean the cylinder?

Regards,

Errol Porter
University of Arkansas / HiDEC
700 W. Research Center Blvd
Fayetteville, AR 72701
Tel. (479) 575-2519
Mobile: (479) 236-0693
Fax (479) 575-2719
email: evporte at uark.edu<mailto:evporte at uark.edu>
http://www.hidec.uark.edu<http://www.hidec.uark.edu/>

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From rmorrison at draper.com  Tue May  7 08:32:02 2013
From: rmorrison at draper.com (Morrison, Richard H., Jr.)
Date: Tue, 07 May 2013 12:32:02 +0000
Subject: [labnetwork] Recommendations for Equipment Maintenance software?
In-Reply-To: <001501ce4a9e$f3261310$d9723930$@duke.edu>
References: <001501ce4a9e$f3261310$d9723930$@duke.edu>
Message-ID: <D3862732F46DEB4B93B4A7A80614D288099B0DEC@mbx2.draper.com>

Hi,

At Draper we are using the EYELIT asset manager software. A little cumbersome to setup but once you have everything loaded it works very well. They are located in Canada,  www.eyelit.com<http://www.eyelit.com>

Rick


Draper Laboratory
Group Leader Microfabrication Operations
555 Technology Square
Cambridge Ma, 02139-3563

www.draper.com
rmorrison at draper.com
W 617-258-3420
C 508-930-3461



From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark Walters
Sent: Monday, May 06, 2013 5:16 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Recommendations for Equipment Maintenance software?

Is anyone using commercially available software to schedule and track equipment maintenance tasks?  There appears to be several software products out there that will allow you to build a schedule of equipment maintenance tasks, automatically send you reminders about these tasks, and then track and record when they are completed.  Any feedback on such software or practices would be appreciated.

Thanks,
Mark D. Walters, Ph.D.
Director, Shared Materials Instrumentation Facility (SMIF)
Duke University
Box 90271
Durham, NC 27708-0271
http://smif.lab.duke.edu<blocked::http://smif.lab.duke.edu/>
Phone: (919) 660-5486
Fax: (919) 660-5491


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From jpalmer at Princeton.EDU  Tue May  7 09:47:56 2013
From: jpalmer at Princeton.EDU (Joe Palmer)
Date: Tue, 07 May 2013 09:47:56 -0400
Subject: [labnetwork] Titanium hazard
In-Reply-To: <879AEF5002D70747B136D02BC86A9C980E0647@ait-pex02mbx05.win.dtu.dk>
References: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>
 <879AEF5002D70747B136D02BC86A9C980E0647@ait-pex02mbx05.win.dtu.dk>
Message-ID: <5189060C.2000903@exchange.princeton.edu>

All,

When fine particles of a metal that can oxidize (Ti, Al, Cr, Fe, Ag, 
etc) are suddenly exposed to air, they of course do oxidize, and because 
their surface area to volume ratio is so great they can reach the 
ignition temperature of acetone, methanol, or isopropanol, and in some 
cases their own ignition temperature.  This is similar, but not 
identical to the mechanism behind grainery explosions. While water is 
generally anathema to vacuum systems, in this case wiping the material 
down with water or a mixture of water and isopropanol, is not a bad idea.

Regards,

Joe Palmer
PRISM MNFL
Ops Manager

On 5/6/2013 4:08 PM, Leif Johansen wrote:
>
> Hello Rick,
>
> At DTU Danchip we have an e-beam evaporation system in which we 
> deposit Titanuim. We have had at least three incidents of wipes or 
> other parts catching fire during maintenance work. I do believe that 
> the root cause is that Titanuim oxidizes very fast, especially when a 
> large, fresh surface is exposed to oxygen.
>
> I have tried to translate our safety precautions from Danish into some 
> sort of English:
>
> "Before the work is started, DI water is filled in a bucket and placed 
> next to the machine. Surface cleaning of various chamber parts must 
> take place over the water bucket. All used cloths, with or without 
> Ethanol/IPA are also to be deposited in the bucket, so they can absorb 
> water.
>
> Absorption of water in the cloths will prevent ignition. Some metals, 
> like Titanum, when exposed to mechanical stress like hammering or 
> scraping, form small particles which ignite as a result of fast oxidation"
>
> Hope this could help.
>
> Best regards,
>
> Leif
>
> *From:*labnetwork-bounces at mtl.mit.edu 
> [mailto:labnetwork-bounces at mtl.mit.edu] *On Behalf Of *Morrison, 
> Richard H., Jr.
> *Sent:* 6. maj 2013 15:50
> *To:* labnetwork at mtl.mit.edu
> *Subject:* [labnetwork] Titanium hazard
>
> Hi Everyone,
>
> Last week one of the staff was wiping off some evaporator parts that 
> were covered with Titanium metal. He was using texwipes soaked with 
> IPA. He tossed the texwipes in the trash then accidentally dropped 
> some wipes saturated with IPA on top of them and a fire started. It 
> self extinguished after 1 minute but it melted the bottom of a plastic 
> trash can.
>
> Have any of you had that happen or something similar? Needless to say 
> this is very alarming and I need to understand what could have caused 
> this and develop a corrective action plan.
>
> Rick
>
> Draper Laboratory
>
> Group Leader Microfabrication Operations
>
> 555 Technology Square
>
> Cambridge Ma, 02139-3563
>
> www.draper.com <http://www.draper.com>
>
> rmorrison at draper.com <mailto:rmorrison at draper.com>
>
> W 617-258-3420
>
> C 508-930-3461
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From spaolini at cns.fas.harvard.edu  Tue May  7 10:13:38 2013
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Tue, 7 May 2013 10:13:38 -0400
Subject: [labnetwork] Titanium hazard
In-Reply-To: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>
References: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>
Message-ID: <8F95EA77ACBF904A861E580B44288EFD9C282C7814@FASXCH02.fasmail.priv>

I have had the unfortunate experience of witnessing this a few times over the years and I agree with Leif Johansen about the cause. In most of my experiences, the fire erupted in a HEPA vacuum used for cleaning a source chamber in an E-beam evaporator. The person cleaning the TI pocket would perform some sort of scraping followed by a wipe with isopropanol. In all cases after performing an "autopsy" of the vacuum, there was a clean room wipe or piece of clean room wipe inside the dirt chamber. We didn't believe there was a chemical reaction with the propanol but we did believe that the TI was rapidly oxidizing since it was physically removed from its place, combined with a fuel (isopropanol and wipes), in an environment of rushing air.  The fix was to have a metal bucket of water nearby to dispose of any debris produced by cleaning the TI pocket and having it removed as reactive waste when full.
Steve Paolini
Harvard University Center for Nanoscale Systems

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Morrison, Richard H., Jr.
Sent: Monday, May 06, 2013 9:50 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Titanium hazard

Hi Everyone,

Last week one of the staff was wiping off some evaporator parts that were covered with Titanium metal. He was using texwipes soaked with IPA. He tossed the texwipes in the trash then accidentally dropped some wipes saturated with IPA on top of them and a fire started. It self extinguished after 1 minute but it melted the bottom of a plastic trash can.

Have any of you had that happen or something similar? Needless to say this is very alarming and I need to understand what could have caused this and develop a corrective action plan.

Rick


Draper Laboratory
Group Leader Microfabrication Operations
555 Technology Square
Cambridge Ma, 02139-3563

www.draper.com<http://www.draper.com>
rmorrison at draper.com<mailto:rmorrison at draper.com>
W 617-258-3420
C 508-930-3461

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From bernard at mtl.mit.edu  Tue May  7 13:40:57 2013
From: bernard at mtl.mit.edu (Bernard Alamariu)
Date: Tue, 07 May 2013 13:40:57 -0400
Subject: [labnetwork] Titanium hazard
In-Reply-To: <5189060C.2000903@exchange.princeton.edu>
References: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>
 <879AEF5002D70747B136D02BC86A9C980E0647@ait-pex02mbx05.win.dtu.dk>
 <5189060C.2000903@exchange.princeton.edu>
Message-ID: <51893CA9.2090606@mtl.mit.edu>


Hello,

The Titanium is a chemical active element used in high vacuum Ion Getter 
Pumps; it could accumulate
a high volume of gas, which by a sudden expansion could generate the 
necessary flame temperature
for some gases.
The scraped material from the e-beam walls could have contained in 
addition to Ti some other highly
oxidizing elements like Al, Cr ( actually they were used in Napalm 
fabrication) and also Pt which coverts
the molecular H2 into atomic Hydrogen ( with low temperature ignition 
point), etc
I think the flame is triggered by a such thermodynamic/ chemical 
process; not by static electricity, as
it happened in a metal garbage can, too.
Thanks, Bernard


On 5/7/13 9:47 AM, Joe Palmer wrote:
> All,
>
> When fine particles of a metal that can oxidize (Ti, Al, Cr, Fe, Ag, 
> etc) are suddenly exposed to air, they of course do oxidize, and 
> because their surface area to volume ratio is so great they can reach 
> the ignition temperature of acetone, methanol, or isopropanol, and in 
> some cases their own ignition temperature. This is similar, but not 
> identical to the mechanism behind grainery explosions.  While water is 
> generally anathema to vacuum systems, in this case wiping the material 
> down with water or a mixture of water and isopropanol, is not a bad idea.
>
> Regards,
>
> Joe Palmer
> PRISM MNFL
> Ops Manager
>
> On 5/6/2013 4:08 PM, Leif Johansen wrote:
>>
>> Hello Rick,
>>
>> At DTU Danchip we have an e-beam evaporation system in which we 
>> deposit Titanuim. We have had at least three incidents of wipes or 
>> other parts catching fire during maintenance work. I do believe that 
>> the root cause is that Titanuim oxidizes very fast, especially when a 
>> large, fresh surface is exposed to oxygen.
>>
>> I have tried to translate our safety precautions from Danish into 
>> some sort of English:
>>
>> "Before the work is started, DI water is filled in a bucket and 
>> placed next to the machine. Surface cleaning of various chamber parts 
>> must take place over the water bucket. All used cloths, with or 
>> without Ethanol/IPA are also to be deposited in the bucket, so they 
>> can absorb water.
>>
>> Absorption of water in the cloths will prevent ignition. Some metals, 
>> like Titanum, when exposed to mechanical stress like hammering or 
>> scraping, form small particles which ignite as a result of fast 
>> oxidation"
>>
>> Hope this could help.
>>
>> Best regards,
>>
>> Leif
>>
>> *From:*labnetwork-bounces at mtl.mit.edu 
>> [mailto:labnetwork-bounces at mtl.mit.edu] *On Behalf Of *Morrison, 
>> Richard H., Jr.
>> *Sent:* 6. maj 2013 15:50
>> *To:* labnetwork at mtl.mit.edu
>> *Subject:* [labnetwork] Titanium hazard
>>
>> Hi Everyone,
>>
>> Last week one of the staff was wiping off some evaporator parts that 
>> were covered with Titanium metal. He was using texwipes soaked with 
>> IPA. He tossed the texwipes in the trash then accidentally dropped 
>> some wipes saturated with IPA on top of them and a fire started. It 
>> self extinguished after 1 minute but it melted the bottom of a 
>> plastic trash can.
>>
>> Have any of you had that happen or something similar? Needless to say 
>> this is very alarming and I need to understand what could have caused 
>> this and develop a corrective action plan.
>>
>> Rick
>>
>> Draper Laboratory
>>
>> Group Leader Microfabrication Operations
>>
>> 555 Technology Square
>>
>> Cambridge Ma, 02139-3563
>>
>> www.draper.com <http://www.draper.com>
>>
>> rmorrison at draper.com <mailto:rmorrison at draper.com>
>>
>> W 617-258-3420
>>
>> C 508-930-3461
>>
>>
>>
>> _______________________________________________
>> labnetwork mailing list
>> labnetwork at mtl.mit.edu
>> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From pkarulkar9 at gmail.com  Tue May  7 19:35:07 2013
From: pkarulkar9 at gmail.com (Pramod C Karulkar)
Date: Tue, 07 May 2013 16:35:07 -0700
Subject: [labnetwork] Titanium hazard
In-Reply-To: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>
References: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>
Message-ID: <51898FAB.4080603@gmail.com>

Fine particles of titanium ignite very easily. Aluminum  and many other 
metal particles do the same but little less vigorously. Vacuum chamber 
surfaces coated with titanium oxidize rapidly giving rise to "popping" 
sound if the vacuum system is opened in room air immediately after 
deposition.  That is why Ti deposition SOPs require a delay in opening 
the chamber to room air after venting it using N2.  Cleaning vacuum 
system that is used for Ti deposition creates hazardous situation, 
particularly if  very powdery matter is present.

Speculation on what happened:  (1) Static electricity could be a culprit 
but then the ignition would occur during other non-titanium cleaning 
operations at other similar fab stations.  (2) Wipes heavily soaked in 
isopropyl alcohol and the waste basket overwhelmed with alcohol vapor 
might have denied titanium particles access to oxygen. This is OK as 
long as the wipes with Ti particles sit in the basket and slowly 
dry/oxidize.   Turbulence created by dropping more wipes in the basket  
might have brought some dry fine particles of titanium in contact with 
oxygen in the turbulence resulting in ignition.

Allowing  system surfaces to oxidize slowly for an extended time may 
reduce chances of this happening again.    Typically this is what you 
would do: Vent the chamber using dry nitrogen at the end of the day but 
DO NOT EXPOSE IT TO ROOM AIR.  Thus, do not raise the bell jar chamber 
or open the chamber door/window that opens to room air. Allow the system 
to remain at atmospheric pressure overnight. Residual oxygen in the 
chamber will oxidize titanium deposits slowly.  Chamber can be wiped 
next day using IPA/Water mixture and vacuumed.  Some extra pumping, 
baking, pre-coating may be required to attain previous levels of vacuum 
when the system is reused for processes.

Allow an old fashioned chamber to "wait" similarly at atmospheric 
pressure before cleaning  if opening  it to air immediately after 
deposition  is necessary to  take out the samples/wafers.

You may consider using thin aluminum foil shields if possible that 
minimize need for cleaning the particle matter.  Some change in cleaning 
interval protocol (cleaning more often) may be needed to avoid build up 
of excess loose titanium.   Exposing the chamber to residual oxygen in 
between deposition runs might help to reduce the formation of atomically 
clean  Ti particles.

Hope this helps.
Pramod

Pramod C Karulkar Ph. D.
Home 2*5*3* 3*0*3 0*4*1*8
6024 33rd Street Ct NW
Gig Harbor WA 98335




On 5/6/2013 6:49 AM, Morrison, Richard H., Jr. wrote
>
> Hi Everyone,
>
> Last week one of the staff was wiping off some evaporator parts that 
> were covered with Titanium metal. He was using texwipes soaked with 
> IPA. He tossed the texwipes in the trash then accidentally dropped 
> some wipes saturated with IPA on top of them and a fire started. It 
> self extinguished after 1 minute but it melted the bottom of a plastic 
> trash can.
>
> Have any of you had that happen or something similar? Needless to say 
> this is very alarming and I need to understand what could have caused 
> this and develop a corrective action plan.
>
> Rick
>
> Draper Laboratory
>
> Group Leader Microfabrication Operations
>
> 555 Technology Square
>
> Cambridge Ma, 02139-3563
>
> www.draper.com
>
> rmorrison at draper.com
>
> W 617-258-3420
>
> C 508-930-3461
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

-- 

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From mtiner at masdar.ac.ae  Wed May  8 09:11:49 2013
From: mtiner at masdar.ac.ae (Mike Tiner)
Date: Wed, 8 May 2013 17:11:49 +0400
Subject: [labnetwork] Job Opportunity for Fabrication Equipment Instructor
Message-ID: <EBDF320AE603BF479E11753A72B83BA768037243B0@MAILCLUSTER.minet.ae>

Dear All,

We are looking for a person to fill a special role in our fabrication facility. Please see the following Job Posting:

Fabrication Equipment Instructor
The Fabrication Equipment Instructor will support operation and maintenance requirements of the Masdar Institute Fabrication Facility through first hand repair or co-ordination of repairs with local or international vendor support organizations as well as manage inventory of consumables and repair parts. The Fabrication Equipment Instructor will also conduct fabrication equipment operator training classes to support the research efforts of a variety of constituencies. The candidate must possess excellent communication skills along with a desire to pass on acquired experience to those new to the field. This position requires hands-on experience operating, troubleshooting and repairing semiconductor process equipment.
Specific duties include:
* Work with technical research staff to maintain and operate equipment used in device processing and
fabrication.
* Coordinate user requests and equipment maintenance needs.
* Perform trouble-shooting of equipment and process problems.
* Assist with the procurement, installation and operation of new equipment.
* Provide support to students' and researchers' process development activities.
* Participate in user training programs.
* Establish and refine standard operating procedures for equipment and processes.
* Help establish and refine laboratory monitoring practices.
* Provide recommendations and support for the general operations of the laboratories.

Requirements:
* B.S. or higher in chemical engineering, chemistry, materials science, or electrical engineering or its
equivalent.
* Minimum five years experience working with vacuum semiconductor processing tools.
* Experience with photolithographic processes.
* Experience in operation and maintenance of general metrology and characterization equipment (eg, defect inspection, ellipsometry interferometers, microscopes).
* Experience in operation and maintenance of photolithography and mask making systems, as well as direct write laser tools.
* Experience in training users and documenting procedures.
* Experience with equipment maintenance and parts inventory management.
* Experience with computer-aided fabrication and manufacturing systems.
* Fundamental understanding of cleanroom protocols
* Experience in installation, repair and maintenance of PECVD/RIE and metal deposition systems, as well as related peripheral equipment (pumps, chillers, etc)
* Experience with vacuum process recipes and development.
* Experience with statistical process control.
* Experience with parts inventory and supply management.
* Experience with tool upgrades and process migration.
* Experience with leak-detection systems and toxic gas handling.
* Experience in multi-user, multi-project environments.

Masdar Institute of Science and Technology, located in Abu Dhabi, U.A.E., is a private, not-for-profit, independent, graduate-level, research-driven institute developed with the support and cooperation of Massachusetts Institute of Technology (MIT). The goal of the Institute is to develop indigenous R&D capacity in Abu Dhabi, addressing issues of importance to the region in critical areas such as: renewable energy, sustainability, environment, water resources and microelectronics.

The Institute offers graduate degree programs (MSc & PhD) in science and engineering disciplines with a focus on advanced energy and sustainable technologies.
For Additional Information please see:
http://www.masdar.ac.ae/
Please send letter of interest and CV to: Nesma Al Mansoori   nalmansoori at masdar.ac.ae<mailto:nalmansoori at masdar.ac.ae>

Best regards,

Mike

Mike Tiner
Manager, Fabrication and Microscopy Facilities

[cid:image001.jpg at 01CE4C0D.1627B570]
PO Box 54224, Khalifa City
Abu Dhabi, United Arab Emirates
Office   +971 2 810 8122
Direct   +971 2 810 9053
Fax       +971 2 810 8121
Mobile  +971 56 733 9604
Email    mtiner at masdar.ac.ae<mailto:mpotter at masdar.ac.ae>

http://www.masdar.ac.ae<http://www.masdar.ac.ae/>
[cid:image002.jpg at 01CE4C0D.1627B570]<http://en.uaenationalday.ae/>

P Please consider the environment before printing this email

This transmission is confidential and intended solely for the person or organization to whom it is addressed. It may contain privileged and confidential information. If you are not the intended recipient, you should not copy, distribute or take any action in reliance on it. If you have received this transmission in error, please notify us immediately by e-mail at info at masdar.ac.ae<mailto:info at masdar.ac.ae>

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From mtiner at masdar.ac.ae  Wed May  8 09:15:35 2013
From: mtiner at masdar.ac.ae (Mike Tiner)
Date: Wed, 8 May 2013 17:15:35 +0400
Subject: [labnetwork] Job Posting SEM/FIB Microscopy Instructor
Message-ID: <EBDF320AE603BF479E11753A72B83BA768037243B6@MAILCLUSTER.minet.ae>

Dear All,

We have a great opportunity for a qualified SEM/FIB instructor. Please see the job posting below:

Scanning Electron/Focused Ion Beam Microscopy Instructor
This very hands-on position will give the qualified applicant many opportunities to pass on his or her experience gained through use of SEM and SEM/FIB microscopes. Key activities will be serving as the primary contact for users of Masdar Institute's SEM and dualbeam microscopes, teaching practical classes on the operation of electron microscopes, and sample preparation. Additionally, the position requires interaction with Faculty and students as an in house consultant to facilitate research and help Masdar Institute facility users obtain the best possible result from the lab facility.
The qualified applicant needs to possess hard materials experience although familiarity with hydrated, soft, and non-conductive sample techniques will be required as well. Significant weight will be given to experience in a production or commercial lab environment and less weight to microscopy experience that was adjunct to another focus. A broad understanding of semiconductor fabrication techniques as well as experience working with semiconductor materials is desirable.
Primary Responsibilities:

1.       Provide hands-on instruction on operation of SEM and dualbeam SEM/FIB systems. Prepare materials and examples for training sessions, record and track training; arrange advanced training sessions from equipment suppliers.

2.       Provide research support through consultation with users on equipment use, set-up and capabilities.

3.       Maintain operational availability of microscopes and associated equipment.Track and resolve system maintenance issues, communicate tool availability, anticipate requirements for spare parts, consumables, etc.

4.       Advise and assist users with sample preparation and maintain SEM sample preparation area.

5.       Provide operator support as an equipment expert for challenging samples and special projects.
Required Qualifications:

1.       At least 4 years experience operating SEM in full time production environment (hard materials).

2.       At least 4 years experience using FEI SEM and dualbeam equipment.

3.       Bachelors degree in science or engineering discipline (may substitute additional experience)
Additional Qualifications (not required but preferred):

1.       Semiconductor Industry experience.

2.       More than 10 years SEM and/or dualbeam experience.

3.       Experience using EDS, WDS, EBSD, nanoprober, GIS, polishing wheels, chemical etchants.

4.       Experience with circuit modification.

5.       Experience with soft materials and imaging biological materials in SEM.

Masdar Institute of Science and Technology, located in Abu Dhabi, U.A.E., is a private, not-for-profit, independent, graduate-level, research-driven institute developed with the support and cooperation of Massachusetts Institute of Technology (MIT). The goal of the Institute is to develop indigenous R&D capacity in Abu Dhabi, addressing issues of importance to the region in critical areas such as: renewable energy, sustainability, environment, water resources and microelectronics.

The Institute offers graduate degree programs (MSc & PhD) in science and engineering disciplines with a focus on advanced energy and sustainable technologies.
For Additional Information please see:
http://www.masdar.ac.ae/
https://sites.google.com/site/masdarelectronmicroscopy/

Please send letter of interest and CV to: Nesma Al Mansoori   nalmansoori at masdar.ac.ae<mailto:nalmansoori at masdar.ac.ae>

Best Regards,

Mike


Mike Tiner
Manager, Fabrication and Microscopy Facilities

[cid:image001.jpg at 01CE4C0F.9E1E2840]
PO Box 54224, Khalifa City
Abu Dhabi, United Arab Emirates
Office   +971 2 810 8122
Direct   +971 2 810 9053
Fax       +971 2 810 8121
Mobile  +971 56 733 9604
Email    mtiner at masdar.ac.ae<mailto:mpotter at masdar.ac.ae>

http://www.masdar.ac.ae<http://www.masdar.ac.ae/>
[cid:image002.jpg at 01CE4C0F.9E1E2840]<http://en.uaenationalday.ae/>

P Please consider the environment before printing this email

This transmission is confidential and intended solely for the person or organization to whom it is addressed. It may contain privileged and confidential information. If you are not the intended recipient, you should not copy, distribute or take any action in reliance on it. If you have received this transmission in error, please notify us immediately by e-mail at info at masdar.ac.ae<mailto:info at masdar.ac.ae>

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From spb1699 at rit.edu  Wed May  8 14:29:06 2013
From: spb1699 at rit.edu (Scott Blondell)
Date: Wed, 08 May 2013 14:29:06 -0400
Subject: [labnetwork] Titanium hazard
In-Reply-To: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>
References: <D3862732F46DEB4B93B4A7A80614D288099B041E@mbx2.draper.com>
Message-ID: <2A84D7901AF8C046AD78BC302AAE478A019D572D11@ex02mail03.ad.rit.edu>

Rick,

We've seen this problem with platinum in our e-gun evaporator. As a result, we no longer use IPA or other flammables on tool specific chamber cleans.
The chamber interiors are wiped down dry. Education of our users and restricting higher-risk chamber cleaning to staff members has further reduced the threat.

Our solvent waste is segregated from other lab waste by depositing in metal solvent cans with self-closing lids. That's not to say a solvent-wetted wipe from someone else's work
wouldn't ignite when exposed to metal-laden wipes improperly added to the metal can. The potential risk is minimized, however, by creating different waste streams and avoiding
the solvent cleaning whenever possible.

Scott P. Blondell
Facilities Manager
Rochester Institute of Technology
Semiconductor & Microsystems Fabrication Laboratory<http://www.smfl.rit.edu/>
82 Lomb Memorial Dr.
Bldg. 17-2519
Rochester, NY 14623

585 738-4073 c
585 475-2171 o
585 475-5041 f
spb1699 at rit.edu<mailto:spb1699 at rit.edu>
www.smfl.rit.edu<http://www.smfl.rit.edu>

[cid:image001.jpg at 01CE4B03.18281C30]



From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Morrison, Richard H., Jr.
Sent: Monday, May 06, 2013 9:50 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Titanium hazard

Hi Everyone,

Last week one of the staff was wiping off some evaporator parts that were covered with Titanium metal. He was using texwipes soaked with IPA. He tossed the texwipes in the trash then accidentally dropped some wipes saturated with IPA on top of them and a fire started. It self extinguished after 1 minute but it melted the bottom of a plastic trash can.

Have any of you had that happen or something similar? Needless to say this is very alarming and I need to understand what could have caused this and develop a corrective action plan.

Rick


Draper Laboratory
Group Leader Microfabrication Operations
555 Technology Square
Cambridge Ma, 02139-3563

www.draper.com<http://www.draper.com>
rmorrison at draper.com<mailto:rmorrison at draper.com>
W 617-258-3420
C 508-930-3461

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From raghavan at ece.iisc.ernet.in  Fri May 10 01:53:26 2013
From: raghavan at ece.iisc.ernet.in (raghavan)
Date: Fri, 10 May 2013 11:23:26 +0530
Subject: [labnetwork] ZnS sputtering
Message-ID: <013201ce4d42$b1079ed0$1316dc70$@iisc.ernet.in>

Dear all

We have a request from a tool user to sputter ZnS in our sputter tool. Our
sputter tool is a share tool used by many users. I would like to know from
experienced users if ZnS sputtering needs any extra precautions to be taken?
Does it contaminate the chamber? 

Thank you 

Best wishes

Raghavan

 

*************************************************

Dr.Vijayaraghavan

Technology Manager

National Nanofabrication Centre 

Centre for Nano Science and Engineering

Indian institute of Science ( IISc)

Bangalore - 560 012

India

Ph: 09663304316

http://sindhu.ece.iisc.ernet.in/nanofab/twikii/bin/view/Main/WebHome

***************************************************

 


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From rmorrison at draper.com  Fri May 10 08:00:12 2013
From: rmorrison at draper.com (Morrison, Richard H., Jr.)
Date: Fri, 10 May 2013 12:00:12 +0000
Subject: [labnetwork] ZnS sputtering
In-Reply-To: <013201ce4d42$b1079ed0$1316dc70$@iisc.ernet.in>
References: <013201ce4d42$b1079ed0$1316dc70$@iisc.ernet.in>
Message-ID: <D3862732F46DEB4B93B4A7A80614D288099B533D@mbx2.draper.com>

That will most likely contaminate your system. It is also tricky to sputter as the Zn and S may disassociate. I would think that the target would be a powder press target, if so you will need to be very careful with heat generation. If the target gets hot it will crack and even spray particles over the machine.

I would not allow ZnS in a general use machine, too much risk to other users.

Rick


Draper Laboratory
Group Leader Microfabrication Operations
555 Technology Square
Cambridge Ma, 02139-3563

www.draper.com
rmorrison at draper.com
W 617-258-3420
C 508-930-3461


From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of raghavan
Sent: Friday, May 10, 2013 1:53 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] ZnS sputtering

Dear all
We have a request from a tool user to sputter ZnS in our sputter tool. Our sputter tool is a share tool used by many users. I would like to know from experienced users if ZnS sputtering needs any extra precautions to be taken? Does it contaminate the chamber?
Thank you
Best wishes
Raghavan

*************************************************
Dr.Vijayaraghavan
Technology Manager
National Nanofabrication Centre
Centre for Nano Science and Engineering
Indian institute of Science ( IISc)
Bangalore - 560 012
India
Ph: 09663304316
http://sindhu.ece.iisc.ernet.in/nanofab/twikii/bin/view/Main/WebHome
***************************************************


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From savitha.p at ece.iisc.ernet.in  Fri May 10 08:23:54 2013
From: savitha.p at ece.iisc.ernet.in (Savitha P)
Date: Fri, 10 May 2013 17:53:54 +0530
Subject: [labnetwork] LPCVD pumps
Message-ID: <6f900032b19ef26899ca0f409ac9a266.squirrel@www.ece.iisc.ernet.in>

Hello!

We are using BUSCH COBRA BOB BA 100 model pumps with our LPCVD furnaces.
We have a lot of maintenance issues with the same, especially with the
silicon nitride and low temperature oxide processes. Is there anyone else
using these pumps for their LPCVD processes. If yes, could you please tell
us how you are maintaining it. Also, has anyone ever been replaced these
with similar capacity pumps from other companies?

Thanks and regards,

Savitha

-- 
Dr.Savitha P
Facility Technology Manager
National Nanofabrication Centre
Centre for Nano Science and Engineering (CeNSE)
Indian Institute of Science
Bangalore - 560012
Ph: +91 80 2293 3254
www.nano.iisc.ernet.in

-- 
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From jpalmer at Princeton.EDU  Fri May 10 09:29:28 2013
From: jpalmer at Princeton.EDU (Joe Palmer)
Date: Fri, 10 May 2013 09:29:28 -0400
Subject: [labnetwork] ZnS sputtering
In-Reply-To: <013201ce4d42$b1079ed0$1316dc70$@iisc.ernet.in>
References: <013201ce4d42$b1079ed0$1316dc70$@iisc.ernet.in>
Message-ID: <518CF638.3030708@exchange.princeton.edu>

While I have no personal experience with the material, I'd guess that 
there's the possibility of having separate Zn and S deposits, and Zn 
will contaminate the chamber.  Also, the Kurt Lesker chart that I have 
recommends a dedicated vacuum system.

Regards,

Joe Palmer

On 5/10/2013 1:53 AM, raghavan wrote:
>
> Dear all
>
> We have a request from a tool user to sputter ZnS in our sputter tool. 
> Our sputter tool is a share tool used by many users. I would like to 
> know from experienced users if ZnS sputtering needs any extra 
> precautions to be taken? Does it contaminate the chamber?
>
> Thank you
>
> Best wishes
>
> Raghavan
>
> *************************************************
>
> Dr.Vijayaraghavan
>
> Technology Manager
>
> National Nanofabrication Centre
>
> Centre for Nano Science and Engineering
>
> Indian institute of Science ( IISc)
>
> Bangalore - 560 012
>
> India
>
> Ph: 09663304316
>
> http://sindhu.ece.iisc.ernet.in/nanofab/twikii/bin/view/Main/WebHome
>
> ***************************************************
>
>
> -- 
> This message has been scanned for viruses and
> dangerous content by *MailScanner* <http://www.mailscanner.info/>, and is
> believed to be clean.
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From spaolini at cns.fas.harvard.edu  Fri May 10 16:46:08 2013
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Fri, 10 May 2013 16:46:08 -0400
Subject: [labnetwork] LPCVD pumps
In-Reply-To: <6f900032b19ef26899ca0f409ac9a266.squirrel@www.ece.iisc.ernet.in>
References: <6f900032b19ef26899ca0f409ac9a266.squirrel@www.ece.iisc.ernet.in>
Message-ID: <8F95EA77ACBF904A861E580B44288EFD9C283F8D9E@FASXCH02.fasmail.priv>

Savitha,
    I would be less concerned with the make and model of the pump as I would be about how the effluent is being handled. LPCVD nitride is a notoriously dirty process and produces large amounts of condensable ammonium chloride. The best way, in my experience is to promote the condensation in a serviceable area before it gets to the pump. I would recommend a water cooled trap in the pumping line as close to the furnace as possible. Maintenance intervals are directly proportional to processing hours. A simple flow vs pressure test with the throttle valve wide open is a great indicator of when maintenance of the trap is needed. If you were to have a spare trap, it could be swapped out with a clean one during maintenance to reduce downtime. Soaking the trap in warm water will dissolve the ammonium chloride but be sure to do this in a fume hood since it gives off ammonia gas when breaking down.

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Savitha P
Sent: Friday, May 10, 2013 8:24 AM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] LPCVD pumps

Hello!

We are using BUSCH COBRA BOB BA 100 model pumps with our LPCVD furnaces.
We have a lot of maintenance issues with the same, especially with the silicon nitride and low temperature oxide processes. Is there anyone else using these pumps for their LPCVD processes. If yes, could you please tell us how you are maintaining it. Also, has anyone ever been replaced these with similar capacity pumps from other companies?

Thanks and regards,

Savitha

--
Dr.Savitha P
Facility Technology Manager
National Nanofabrication Centre
Centre for Nano Science and Engineering (CeNSE) Indian Institute of Science Bangalore - 560012
Ph: +91 80 2293 3254
www.nano.iisc.ernet.in

--
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labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



From pkarulkar9 at gmail.com  Fri May 10 18:36:07 2013
From: pkarulkar9 at gmail.com (Pramod C Karulkar)
Date: Fri, 10 May 2013 15:36:07 -0700
Subject: [labnetwork] ZnS sputtering
In-Reply-To: <013201ce4d42$b1079ed0$1316dc70$@iisc.ernet.in>
References: <013201ce4d42$b1079ed0$1316dc70$@iisc.ernet.in>
Message-ID: <518D7657.1050300@gmail.com>

Depositing ZnS and  CdS (as you mentioned in the earlier e-mail) are 
both difficult tasks particularly for the equipment person.  There are 
several issues (1) health hazard, (2) deterioration of the vacuum system 
including the pumping station (2) equipment and process area 
contamination, (3) cross contamination for all other depositions done in 
the same system, and  (4) process and quality control for ZnS and CdS  
and, more importantly,  for other materials deposited in the same 
system.  The contamination issue itself is quite serious.

These materials will  contaminate the chamber  permanently particularly 
with all the non-stoichiometric material that will be produced during 
the deposition.  It will reach every surface including locations that 
are not in the line of sight from the source.   Removing the material 
completely from the chamber is virtually impossible.  Then you end up 
having perpetual cross contamination, out-gassing, and corrosion 
problems.  You shouldn't use the vacuum system for these materials if it 
is critical to other processes involving device quality materials (pure 
metals, silicides, nitrides, photoconductors,  superconductors, optical 
films etc).   The contamination will remain in the system for ever and 
you will see traces of it in subsequent runs.  Materials analysis 
techniques may not show it but it will manifest as bad films (e.g. 
quenched superconducting transition temperature or deterioration of 
similar other properties that are affected by extremely low level trace 
contamination).

Sometimes you can risk making a run for an extremely important project  
if the user shares in the risk.   "Somehow managing one or two runs" 
will depend on the system design and how you maintain it. The runs can 
be scheduled just before you take apart the system for a major wet 
chemical clean up and rebuilding with new  vacuum components.  I would 
install deposition shields all over the chamber and also try to use  a 
chimney (metallic tube or duct) if possible to restrict  the material in 
the target-to-substrate region only.  I have done this a number of times 
but it is extremely disruptive and time consuming.  It creates a 
precedence too.

See Zn vapor pressure on chart 14 of this presentation:
http://www.cockcroft.ac.uk/education/PG_courses_2006-7/RR_vacuum_2007/Reid_Lecture_5.ppt

There are some references to sputtering similar solar cell materials 
that would allow you to contact the authors directly or send samples out 
for deposition.
http://www.hindawi.com/journals/ijp/2011/801292/

Propose  alternate techniques. Here is info on SILAS.  This would 
involve safety precautions/systems for use of exotic vapors/gases.
http://www.sciencedirect.com/science/article/pii/S0169433297002481

Good luck....

Pramod C Karulkar Ph. D.
Home 2*5*3* 3*0*3 0*4*1*8
6024 33rd Street Ct NW
Gig Harbor WA 98335







  5/9/2013 10:53 PM, raghavan wrote:
>
> Dear all
>
> We have a request from a tool user to sputter ZnS in our sputter tool. 
> Our sputter tool is a share tool used by many users. I would like to 
> know from experienced users if ZnS sputtering needs any extra 
> precautions to be taken? Does it contaminate the chamber?
>
> Thank you
>
> Best wishes
>
> Raghavan
>
> *************************************************
>
> Dr.Vijayaraghavan
>
> Technology Manager
>
> National Nanofabrication Centre
>
> Centre for Nano Science and Engineering
>
> Indian institute of Science ( IISc)
>
> Bangalore - 560 012
>
> India
>
> Ph: 09663304316
>
> http://sindhu.ece.iisc.ernet.in/nanofab/twikii/bin/view/Main/WebHome
>
> ***************************************************
>
>
> -- 
> This message has been scanned for viruses and
> dangerous content by *MailScanner* <http://www.mailscanner.info/>, and is
> believed to be clean.
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From bob at eecs.berkeley.edu  Mon May 13 15:43:52 2013
From: bob at eecs.berkeley.edu (Robert M. Hamilton)
Date: Mon, 13 May 2013 12:43:52 -0700
Subject: [labnetwork] LPCVD nitride pumps
In-Reply-To: <7b04e47d9ebad440580e56680b51c0ef.squirrel@www.ece.iisc.ernet.in>
References: <7b04e47d9ebad440580e56680b51c0ef.squirrel@www.ece.iisc.ernet.in>
Message-ID: <51914278.8050407@eecs.berkeley.edu>

Savitha and colleagues,

I find myself in disagreement about the use of foreline 
traps in a reactive lpcvd nitride process. Adding such a 
trap, at a location between the tube and pump, requires 
dealing with a can full of reactive, corrosive and 
pyrophoric waste. Given the quantity of effluent, I suspect 
maintenance would be frequent.

I can share the UC Berkeley NanoLab, and it predecessor the 
Microlab's experience with lpcvd low-stress, silicon-rich, 
lpcvd nitride. To meet the demands of MEMS research, where 
we found our tube running virtually 24/7, we designed an 
lpcvd tube specifically for this low stress-process. We've 
run it for close to a couple of decades now with high 
reliability and excellent pump lifetimes.

The salient features of this tube are:

1) An unheated manifold from the 50 mm process tube rear 
transition to the pump. While the rear transition of the 
process tube is 50mm the manifold is ISO 75mm and about 7 
feet long from tube-to-pump. This large foreline surface 
area, operating at close to room temp, does some trapping of 
the ammonium chloride and DCS residues; however, it never 
restricts within the lifetime of a process tube.

2) The gate valve for this process is an MKS "Jalapeno" 
valve with a heater jacket?, operating at ~200C. We worked 
with Tystar Corp's Henry Heidbreder to design a unique valve 
that allows a small amount of pumping (3-4 slpm) while the 
tube is vented thus eliminating back-streaming from the 
manifold back into the process tube during wafer loading 
(and thus eliminating re-deposition, a.k.a. ?particles?). 
One of this compound valves orifice has a self-cleaning 
feature that maintains its 7 mm orifice. In addition, this 
Tystar valves has a slow-pump feature.

2) We use a 200 C heated Baratron to monitor process pressure.

3) The pump package is an Edwards QMB500/QDP80. We use a 
high-throughput pump stack to meet the ~140 mTorr process 
pressure we use in our recipes. A QDP runs at 80 C. A pump 
that ran hotter than the QDP series would likely better 
serve the process. I do not know the Bush Cobra line. It may 
run that hot or hotter. I know Kashiyama has a screw pump 
specifically designed for lpcvd nitride.

4) The effluent of this tubes pump stack exhaust is sent 
through an Edwards model 250 water-cooled abatement trap. It 
has very large surface areas. It gets continuously flooded 
with relatively high amounts of N2 from the pump-purge (35 
slpm) while in standby. It also is connected to the house 
exhaust system so it has contact with some air and moisture. 
We have not found the effluent in this trap pyrophoric (we 
have found it acidic). When we service the trap we isolate 
it and use water to react with the solids before cleaning it.

Pump lifetime for this tube is typically 2000-3000 hours of 
process run-time. For us this is presently about 2 years. 
The major "down-time" issue for this tube is the rear 
transition clogging up and pinching off because of the 
process effluent. We use a tapered reamer to clear this 
vitreous effluent and we can typically do this a few times 
before we break the rear transition. At that time we replace 
the tube and service the pumping system as necessary. I have 
found that attempting to heat this transition to a 
temperature high enough to reduce deposition destroys the 
o-ring seals.

Good luck and if you are ever in Berkeley give us a visit 
and we?ll do show & tell!

Regards,
Bob Hamilton


Bob Hamilton
Marvel NanoLab
University of CA at Berkeley
Rm 520 Sutardja Dai Hall
Berkeley, CA 94720-1754
bob at eecs.berkeley.edu
(e-mail preferred)
510-809-8600
510-325-7557 (mobile - emergencies)

On 4/30/2013 12:01 AM, Savitha P wrote:
> Hi!
>
> We wanted to buy two solutions for mainly making seed layers for plating.
> These are Gold Chloride solution (0.5%) and TRANSENE Nickelex solution.
>  From MSDS, these solutions are shown to bioaccumulate and are toxic to
> aquatic life. Nickelex comes with additional warnings of being
> carcinogenic and mutagenic with special safety requirements and disposal
> protocols.
>
> Could someone please let me know whether these chemicals are used
> routinely in the fabs and if yes, what are the disposal protocols for the
> same. Are there any other chemicals (maybe, less toxic) which can be used
> for the same purpose. We are planning to dedicate one of our general wet
> benches as the electroplating bench for the time being, so chances of
> cross contamination will be low.
>
> Thanks and regards,
>
> Savitha
>
>




From bob at eecs.berkeley.edu  Tue May 14 10:35:47 2013
From: bob at eecs.berkeley.edu (Robert M. Hamilton)
Date: Tue, 14 May 2013 07:35:47 -0700
Subject: [labnetwork] LPCVD nitride pumps
In-Reply-To: <51914278.8050407@eecs.berkeley.edu>
References: <7b04e47d9ebad440580e56680b51c0ef.squirrel@www.ece.iisc.ernet.in>
 <51914278.8050407@eecs.berkeley.edu>
Message-ID: <51924BC3.9030807@eecs.berkeley.edu>

Colleagues,
Please note there is an error in the appended text. The 
orifice size for the lpcvd constant-pump feature should read 
0.7 mm not 7 mm. Perhaps it is easier to express it as 
inches: ~.028"
Bob H.

Bob Hamilton
Marvel NanoLab
University of CA at Berkeley
Rm 520 Sutardja Dai Hall
Berkeley, CA 94720-1754
bob at eecs.berkeley.edu
(e-mail preferred)
510-809-8600
510-325-7557 (mobile - emergencies)

On 5/13/2013 12:43 PM, Robert M. Hamilton wrote:
> Savitha and colleagues,
>
> I find myself in disagreement about the use of foreline 
> traps in a reactive lpcvd nitride process. Adding such a 
> trap, at a location between the tube and pump, requires 
> dealing with a can full of reactive, corrosive and 
> pyrophoric waste. Given the quantity of effluent, I 
> suspect maintenance would be frequent.
>
> I can share the UC Berkeley NanoLab, and it predecessor 
> the Microlab's experience with lpcvd low-stress, 
> silicon-rich, lpcvd nitride. To meet the demands of MEMS 
> research, where we found our tube running virtually 24/7, 
> we designed an lpcvd tube specifically for this low 
> stress-process. We've run it for close to a couple of 
> decades now with high reliability and excellent pump 
> lifetimes.
>
> The salient features of this tube are:
>
> 1) An unheated manifold from the 50 mm process tube rear 
> transition to the pump. While the rear transition of the 
> process tube is 50mm the manifold is ISO 75mm and about 7 
> feet long from tube-to-pump. This large foreline surface 
> area, operating at close to room temp, does some trapping 
> of the ammonium chloride and DCS residues; however, it 
> never restricts within the lifetime of a process tube.
>
> 2) The gate valve for this process is an MKS "Jalapeno" 
> valve with a heater jacket?, operating at ~200C. We worked 
> with Tystar Corp's Henry Heidbreder to design a unique 
> valve that allows a small amount of pumping (3-4 slpm) 
> while the tube is vented thus eliminating back-streaming 
> from the manifold back into the process tube during wafer 
> loading (and thus eliminating re-deposition, a.k.a. 
> ?particles?). One of this compound valves orifice has a 
> self-cleaning feature that maintains its 7 mm orifice. In 
> addition, this Tystar valves has a slow-pump feature.
>
> 2) We use a 200 C heated Baratron to monitor process 
> pressure.
>
> 3) The pump package is an Edwards QMB500/QDP80. We use a 
> high-throughput pump stack to meet the ~140 mTorr process 
> pressure we use in our recipes. A QDP runs at 80 C. A pump 
> that ran hotter than the QDP series would likely better 
> serve the process. I do not know the Bush Cobra line. It 
> may run that hot or hotter. I know Kashiyama has a screw 
> pump specifically designed for lpcvd nitride.
>
> 4) The effluent of this tubes pump stack exhaust is sent 
> through an Edwards model 250 water-cooled abatement trap. 
> It has very large surface areas. It gets continuously 
> flooded with relatively high amounts of N2 from the 
> pump-purge (35 slpm) while in standby. It also is 
> connected to the house exhaust system so it has contact 
> with some air and moisture. We have not found the effluent 
> in this trap pyrophoric (we have found it acidic). When we 
> service the trap we isolate it and use water to react with 
> the solids before cleaning it.
>
> Pump lifetime for this tube is typically 2000-3000 hours 
> of process run-time. For us this is presently about 2 
> years. The major "down-time" issue for this tube is the 
> rear transition clogging up and pinching off because of 
> the process effluent. We use a tapered reamer to clear 
> this vitreous effluent and we can typically do this a few 
> times before we break the rear transition. At that time we 
> replace the tube and service the pumping system as 
> necessary. I have found that attempting to heat this 
> transition to a temperature high enough to reduce 
> deposition destroys the o-ring seals.
>
> Good luck and if you are ever in Berkeley give us a visit 
> and we?ll do show & tell!
>
> Regards,
> Bob Hamilton
>
>
> Bob Hamilton
> Marvel NanoLab
> University of CA at Berkeley
> Rm 520 Sutardja Dai Hall
> Berkeley, CA 94720-1754
> bob at eecs.berkeley.edu
> (e-mail preferred)
> 510-809-8600
> 510-325-7557 (mobile - emergencies)
>
> On 4/30/2013 12:01 AM, Savitha P wrote:
>> Hi!
>>
>> We wanted to buy two solutions for mainly making seed 
>> layers for plating.
>> These are Gold Chloride solution (0.5%) and TRANSENE 
>> Nickelex solution.
>>  From MSDS, these solutions are shown to bioaccumulate 
>> and are toxic to
>> aquatic life. Nickelex comes with additional warnings of 
>> being
>> carcinogenic and mutagenic with special safety 
>> requirements and disposal
>> protocols.
>>
>> Could someone please let me know whether these chemicals 
>> are used
>> routinely in the fabs and if yes, what are the disposal 
>> protocols for the
>> same. Are there any other chemicals (maybe, less toxic) 
>> which can be used
>> for the same purpose. We are planning to dedicate one of 
>> our general wet
>> benches as the electroplating bench for the time being, 
>> so chances of
>> cross contamination will be low.
>>
>> Thanks and regards,
>>
>> Savitha
>>
>>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork




From valli at ee.iitb.ac.in  Mon May 20 01:29:06 2013
From: valli at ee.iitb.ac.in (Satyavalli Paluri)
Date: Mon, 20 May 2013 10:59:06 +0530 (IST)
Subject: [labnetwork] First aid for Sulphuric acid-IIT Bombay, India
Message-ID: <b0c46bb87426025aa03f59afd7afcce8.squirrel@sandesh.ee.iitb.ac.in>


Hi everybody,

Writing on behalf of Centre for Excellence in Nanoelectronics, IIT Bombay.

We would like to know what kind of first aid you are providing at your
labs for Sulphuric acid.

Thanks & regards
valli



-- 
Assistant Lab Manager,
CEN, Electrical Engg Dept, Annexe,
IIT Bombay, Mumbai, Powai- 400076
Tel No. 02225764435/09820856337(M)




From vamsinittala at gmail.com  Mon May 20 09:08:39 2013
From: vamsinittala at gmail.com (N P VAMSI KRISHNA)
Date: Mon, 20 May 2013 18:38:39 +0530
Subject: [labnetwork] C4F8 polymer deposition in RIE - issues related to that
Message-ID: <CA+SWD1XBhQrBJrVW2Ck7OF75T9p6m0sWASxGM2=ZEWRxAnPNiw@mail.gmail.com>

Dear Colleagues,
Recently we had a problem in our RIE (Oxford Plasma lab system 100) tool.
The RF Lower electrode was giving very high reflected powers for some
recipes and DC bias close to 0V and we realized the auto match capacitors
are misaligned. After a long effort we could got that back to almost
normal, by manually tuning the RF auto match and doing error corrections.
The last recipe which ran on the tool was depositing C4F8 for 10 min.
Before this run chamber was clean. (We normally don't encourage polymer
deposition in our RIE tool for longer durations)

Does any one face similar problem or any idea if C4F8 polymer deposition
could do this and why?


-- 
Thanks & Regards,

*Vamsi Krishna*
Sr.Facility Technologist - Process Integration
National Nano Fabrication Center
Center for Nano Science and Engineering (CeNSE)
Indian Institute of Science(IISc)
Bangalore 560012, INDIA
Mobile:  +91 9880988239

*A bird sitting on the branch of a tree is not afraid of the branch shaking
or breaking, because it trusts not the branches but its OWN WINGS. *
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From spaolini at cns.fas.harvard.edu  Mon May 20 16:54:45 2013
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Mon, 20 May 2013 16:54:45 -0400
Subject: [labnetwork] First aid for Sulphuric acid-IIT Bombay, India
In-Reply-To: <b0c46bb87426025aa03f59afd7afcce8.squirrel@sandesh.ee.iitb.ac.in>
References: <b0c46bb87426025aa03f59afd7afcce8.squirrel@sandesh.ee.iitb.ac.in>
Message-ID: <8F95EA77ACBF904A861E580B44288EFD9C28512364@FASXCH02.fasmail.priv>

Irrigate with lots of water.  Be cautious about the water that you use causing an exothermic reaction with any standing or puddled sulfuric acid but concentrate on flushing the wound extensively.  Keep flushing until medical professionals arrive and tell you what to do.   I was an Emergency Medical Technician a long time ago.
Steve Paolini
Harvard University Center for Nanoscale Systems

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Satyavalli Paluri
Sent: Monday, May 20, 2013 1:29 AM
To: labnetwork at mtl.mit.edu
Cc: vanaparthy at ee.iitb.ac.in; diksha at ee.iitb.ac.in
Subject: [labnetwork] First aid for Sulphuric acid-IIT Bombay, India


Hi everybody,

Writing on behalf of Centre for Excellence in Nanoelectronics, IIT Bombay.

We would like to know what kind of first aid you are providing at your labs for Sulphuric acid.

Thanks & regards
valli



--
Assistant Lab Manager,
CEN, Electrical Engg Dept, Annexe,
IIT Bombay, Mumbai, Powai- 400076
Tel No. 02225764435/09820856337(M)


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



From jrweaver at purdue.edu  Tue May 21 09:55:50 2013
From: jrweaver at purdue.edu (Weaver, John R)
Date: Tue, 21 May 2013 13:55:50 +0000
Subject: [labnetwork] First aid for Sulphuric acid-IIT Bombay, India
In-Reply-To: <b0c46bb87426025aa03f59afd7afcce8.squirrel@sandesh.ee.iitb.ac.in>
References: <b0c46bb87426025aa03f59afd7afcce8.squirrel@sandesh.ee.iitb.ac.in>
Message-ID: <6A848421F695C54A9210C1A873C96AC207C065F4@WPVEXCMBX04.purdue.lcl>

Valli -

The best practice is to remove as much of the acid as possible, then douse the person with very large amounts of water. This is true only for very viscous acids with a high heat of dilution, and can cause confusion among the people being trained. For this reason, we keep it simple and say to douse the person in very large amounts of water - standing in a high-flowing safety shower for 15 minutes.

With this acid, it is important to ensure that all areas covered with the acid are very well rinsed. I carried scars on the underside of my arms for about 30 years because this area was forgotten during my safety-shower rinse - I concentrated on the visible areas (of course, I was also going into shock at the time and wasn't thinking clearly).

To recap, we train our people to move the person to a safety shower immediately and douse with copious amounts of water for a minimum of 15 minutes. If, however, you are at the scene it is best to do a QUICK wipe-down with available wipers and then douse the person in a safety shower for a minimum of 15 minutes.

Sulfuric acid is a special case because of the high viscosity and the very large heat of dilution. This causes a great deal of heat to be trapped at the acid-skin interface, thus boosting the activity of the acid and causing more severe burns. Gently rubbing the skin helps break the viscosity, but rubbing hard can cause the skin to peel off.

Sorry about the large amount of detail, but I had a personal "close encounter" with a large quantity of sulfuric acid as an undergrad. I had some pretty serious burns and had long-term scarring. Fortunately, the scarring is barely visible at this point - 41 years later.

John

John R. Weaver
Facility Manager
Birck Nanotechnology Center
Purdue University
(765) 494-5494
jrweaver at purdue.edu


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Satyavalli Paluri
Sent: Monday, May 20, 2013 1:29 AM
To: labnetwork at mtl.mit.edu
Cc: vanaparthy at ee.iitb.ac.in; diksha at ee.iitb.ac.in
Subject: [labnetwork] First aid for Sulphuric acid-IIT Bombay, India


Hi everybody,

Writing on behalf of Centre for Excellence in Nanoelectronics, IIT Bombay.

We would like to know what kind of first aid you are providing at your labs for Sulphuric acid.

Thanks & regards
valli



--
Assistant Lab Manager,
CEN, Electrical Engg Dept, Annexe,
IIT Bombay, Mumbai, Powai- 400076
Tel No. 02225764435/09820856337(M)


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



From gwatson at Princeton.EDU  Tue May 21 09:55:56 2013
From: gwatson at Princeton.EDU (George P. Watson)
Date: Tue, 21 May 2013 13:55:56 +0000
Subject: [labnetwork] C4F8 polymer deposition in RIE - issues related to
 that
In-Reply-To: <CA+SWD1XBhQrBJrVW2Ck7OF75T9p6m0sWASxGM2=ZEWRxAnPNiw@mail.gmail.com>
References: <CA+SWD1XBhQrBJrVW2Ck7OF75T9p6m0sWASxGM2=ZEWRxAnPNiw@mail.gmail.com>
Message-ID: <0565B0F370443F4CB0D9C1CDDD8533E738CE067F@CSGMBX201W.pu.win.princeton.edu>

Hi Vamsi,

We had a similar problem with a very different plasma tool, a Tepla M4L.  We used a CF4 plasma that created a deposit throughout the chamber.   We were unable to get the reflected power back to zero until we used scotchbrite to clean all of the aluminum surfaces (including the banana jack tray connections) and then ran a long O2 plasma clean.

Pat

George Patrick Watson (Pat), Ph.D.
Director of Operations
PRISM Micro/Nano Fabrication Laboratory
E-Quad J301A
Princeton University
Princeton, NJ 08544
gwatson at princeton.edu<mailto:gwatson at princeton.edu>
(609) 258 4626
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of N P VAMSI KRISHNA
Sent: Monday, May 20, 2013 9:09 AM
To: Labnetwork
Subject: [labnetwork] C4F8 polymer deposition in RIE - issues related to that

Dear Colleagues,
Recently we had a problem in our RIE (Oxford Plasma lab system 100) tool. The RF Lower electrode was giving very high reflected powers for some recipes and DC bias close to 0V and we realized the auto match capacitors are misaligned. After a long effort we could got that back to almost normal, by manually tuning the RF auto match and doing error corrections.
The last recipe which ran on the tool was depositing C4F8 for 10 min. Before this run chamber was clean. (We normally don't encourage polymer deposition in our RIE tool for longer durations)
Does any one face similar problem or any idea if C4F8 polymer deposition could do this and why?

--
Thanks & Regards,

Vamsi Krishna
Sr.Facility Technologist - Process Integration
National Nano Fabrication Center
Center for Nano Science and Engineering (CeNSE)
Indian Institute of Science(IISc)
Bangalore 560012, INDIA
Mobile:  +91 9880988239

A bird sitting on the branch of a tree is not afraid of the branch shaking or breaking, because it trusts not the branches but its OWN WINGS.
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From pkarulkar9 at gmail.com  Tue May 21 13:40:17 2013
From: pkarulkar9 at gmail.com (Pramod C Karulkar)
Date: Tue, 21 May 2013 10:40:17 -0700
Subject: [labnetwork] C4F8 polymer deposition in RIE - issues related to
 that
In-Reply-To: <CA+SWD1XBhQrBJrVW2Ck7OF75T9p6m0sWASxGM2=ZEWRxAnPNiw@mail.gmail.com>
References: <CA+SWD1XBhQrBJrVW2Ck7OF75T9p6m0sWASxGM2=ZEWRxAnPNiw@mail.gmail.com>
Message-ID: <519BB181.9060903@gmail.com>

You may  have succeeded in nearly tuning the matching network but does 
the system perform as it used to?  (process outcomes?)  You have to know 
where the RF power is going.   You may have deposited a non-insulating, 
carbon containing material all over your chamber including the electrode 
assembly.  Leakage to ground may be causing your problems. An extended, 
low power oxygen (plus inert gas optional) plasma cleaning (hour+)  
while heating the chamber components helps if  the system is set up to 
safely use oxygen.  In addition to cleaning the chamber, you may have to 
take apart, clean, and rebuild the cathode assembly with new 
insulators.   Instead of experimenting on the matching network with 
active plasma chemistries,  it is easier to use a basic discharge (e.g.  
pure argon)  to diagnose RF components and  to keep track of the 
parameters for system qualification.

Verify that the power supply is functioning properly  using a vendor 
suggested method or a dummy RF load.  Ditto for the matching network.  
You have to consider very small probability that the process you ran had 
nothing to do with the subsequent failure.

Plasma deposition is  a very complex process.  Inductively coupled 
systems that have simpler internal surfaces are easier to use instead of 
cathode based systems with intricate internal structure.

Please let the forum know about the solution to your problem once you 
resolve it.
Good luck.

Pramod Karulkar

Pramod C Karulkar Ph.D.
Home 2*5*3* 3*0*3 0*4*1*8
6024 33rd Street Ct NW
Gig Harbor WA 98335



On 5/20/2013 6:08 AM, N P VAMSI KRISHNA wrote:
> Dear Colleagues,
> Recently we had a problem in our RIE (Oxford Plasma lab system 100) 
> tool. The RF Lower electrode was giving very high reflected powers for 
> some recipes and DC bias close to 0V and we realized the auto match 
> capacitors are misaligned. After a long effort we could got that back 
> to almost normal, by manually tuning the RF auto match and doing error 
> corrections.
> The last recipe which ran on the tool was depositing C4F8 for 10 min. 
> Before this run chamber was clean. (We normally don't encourage 
> polymer deposition in our RIE tool for longer durations)
>
> Does any one face similar problem or any idea if C4F8 polymer 
> deposition could do this and why?
>
>
> -- 
> Thanks & Regards,
>
> /*Vamsi Krishna*/
> Sr.Facility Technologist - Process Integration
> National Nano Fabrication Center
> Center for Nano Science and Engineering (CeNSE)
> Indian Institute of Science(IISc)
> Bangalore560012, INDIA
> Mobile:  +91 9880988239
>
> /A bird sitting on the branch of a tree is not afraid of the branch 
> shaking or breaking, because it trusts not the branches but its OWN 
> WINGS. /
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

-- 


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From valli at ee.iitb.ac.in  Tue May 21 21:27:54 2013
From: valli at ee.iitb.ac.in (Satyavalli Paluri)
Date: Wed, 22 May 2013 06:57:54 +0530 (IST)
Subject: [labnetwork] First aid for Sulphuric acid-IIT Bombay, India
In-Reply-To: <6A848421F695C54A9210C1A873C96AC207C065F4@WPVEXCMBX04.purdue.lcl>
References: <b0c46bb87426025aa03f59afd7afcce8.squirrel@sandesh.ee.iitb.ac.in>
 <6A848421F695C54A9210C1A873C96AC207C065F4@WPVEXCMBX04.purdue.lcl>
Message-ID: <59d648c0bc4d970e80c2b9323680045f.squirrel@sandesh.ee.iitb.ac.in>

Hi John,
I am so sorry to hear about your experience. You have been kind enough in
sharing your experience.
Actually, we have received 3 responses from this group giving us
suggestions. All of you have said that we need to douse the area exposed
to sulphuric acid with plenty of water.
We are building up our emergency reponse system.
As of now, we have spill kits for clearing acid, base & solvent spills.
We have calcium gluconate cream available = for first aid for HF.
If you have any more suggestions, please let us know.
This group is a valuable resource to build any nanoelectronics centre.
Thanks so much.

Best regards
Valli


> Valli -
>
> The best practice is to remove as much of the acid as possible, then douse
> the person with very large amounts of water. This is true only for very
> viscous acids with a high heat of dilution, and can cause confusion among
> the people being trained. For this reason, we keep it simple and say to
> douse the person in very large amounts of water - standing in a
> high-flowing safety shower for 15 minutes.
>
> With this acid, it is important to ensure that all areas covered with the
> acid are very well rinsed. I carried scars on the underside of my arms for
> about 30 years because this area was forgotten during my safety-shower
> rinse - I concentrated on the visible areas (of course, I was also going
> into shock at the time and wasn't thinking clearly).
>
> To recap, we train our people to move the person to a safety shower
> immediately and douse with copious amounts of water for a minimum of 15
> minutes. If, however, you are at the scene it is best to do a QUICK
> wipe-down with available wipers and then douse the person in a safety
> shower for a minimum of 15 minutes.
>
> Sulfuric acid is a special case because of the high viscosity and the very
> large heat of dilution. This causes a great deal of heat to be trapped at
> the acid-skin interface, thus boosting the activity of the acid and
> causing more severe burns. Gently rubbing the skin helps break the
> viscosity, but rubbing hard can cause the skin to peel off.
>
> Sorry about the large amount of detail, but I had a personal "close
> encounter" with a large quantity of sulfuric acid as an undergrad. I had
> some pretty serious burns and had long-term scarring. Fortunately, the
> scarring is barely visible at this point - 41 years later.
>
> John
>
> John R. Weaver
> Facility Manager
> Birck Nanotechnology Center
> Purdue University
> (765) 494-5494
> jrweaver at purdue.edu
>
>
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu
> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Satyavalli Paluri
> Sent: Monday, May 20, 2013 1:29 AM
> To: labnetwork at mtl.mit.edu
> Cc: vanaparthy at ee.iitb.ac.in; diksha at ee.iitb.ac.in
> Subject: [labnetwork] First aid for Sulphuric acid-IIT Bombay, India
>
>
> Hi everybody,
>
> Writing on behalf of Centre for Excellence in Nanoelectronics, IIT Bombay.
>
> We would like to know what kind of first aid you are providing at your
> labs for Sulphuric acid.
>
> Thanks & regards
> valli
>
>
>
> --
> Assistant Lab Manager,
> CEN, Electrical Engg Dept, Annexe,
> IIT Bombay, Mumbai, Powai- 400076
> Tel No. 02225764435/09820856337(M)
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>


-- 
Assistant Lab Manager,
CEN, Electrical Engg Dept, Annexe,
IIT Bombay, Mumbai, Powai- 400076
Tel No. 02225764435/09820856337(M)




From agregg at abbiegregg.com  Thu May 23 00:39:46 2013
From: agregg at abbiegregg.com (Abbie Gregg)
Date: Thu, 23 May 2013 00:39:46 -0400
Subject: [labnetwork] 2-MRC type 4 target sputtering systems for sale
In-Reply-To: <003101ce571b$e8e5c970$bab15c50$@henderson@etchedintimeinc.com>
References: <003101ce571b$e8e5c970$bab15c50$@henderson@etchedintimeinc.com>
Message-ID: <5863FB4055D90542A7A7DAE0CEF2ACB0086AD0402F@E2K7CCR1.netvigour.com>

Hi Bob and Labnetwork,
Perhaps someone on the Labnetwork will have a home for these tools!

Bob's Etched in Time firm is housed in ASU's Macrotechnology works building in the ASU Research park with the Army Flexible Displays and Electronics center.

Abbie Gregg
President
Abbie Gregg, Inc.
1130 East University Drive, Suite 105
Tempe, Arizona 85281
Phone 480 446-8000 x 107
Cell 480-577-5083
FAX 480-446-8001
email agregg at abbiegregg.com<mailto:agregg at abbiegregg.com>
website www.abbiegregg.com<http://www.abbiegregg.com>

CONFIDENTIALITY NOTICE:   All information contained in or attached to this email constitutes confidential information belonging to Abbie Gregg, Inc., its affiliates and subsidiaries and/or its clients.  This email and any attachments are proprietary and/or confidential and are intended for business use of the addressee(s) only.   All other uses or disclosures are strictly prohibited.  If the reader is not the intended recipient you are hereby notified that the perusal, copying or dissemination of this email is strictly prohibited. If you have received this communication in error, please notify the sender, and delete all copies of this message and its attachments immediately.

From: Bob Henderson [mailto:bob.henderson at etchedintimeinc.com]
Sent: Wednesday, May 22, 2013 11:41 AM
To: Abbie Gregg
Subject: FW: 2-MRC type 4 target sputtering systems for sale

Abbie:

I have reduced the price on the 2 MRC 944 sputtering systems I have for sale. Was $125k now $80k for quick sale. Do you have any customers who might have an interest. Installation and warranty would be extra. Bob Henderson

From: Bob Henderson [mailto:bob.henderson at etchedintimeinc.com]
Sent: Monday, January 21, 2013 4:17 PM
To: 'Abbie Gregg'
Subject: 2-MRC type 4 target sputtering systems for sale

Abbie:

I have just purchased 2 systems that we originally build for Motorola here in Phoenix. They have been used in production for a long time. We have just finished refurbishment of the tools and are looking for homes for them. They have 4 cathodes instead of the three that are usual for MRC tools. They are in a horizontal configuration like the MRC 943 and use all MRC cathodes as standard.  RF etch station is included with AE power supply. System can come with warranty and installation in the US. Price is $125,000 each. Systems sold for $500,000 originally and are in perfect running shape. Can be demonstrated here at our facility at ASU in Tempe, Arizona. Attached are photos and I can provide a full operations manual if needed for sales support. Let me know if you need any other literature. Thanks

Bob Henderson-President
Etched In Time, Inc.
7700 S. River Parkway
Tempe, Arizona 85284
Phone: 480-967-9333
Mobile: 602-206-6154

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From bill at eecs.berkeley.edu  Fri May 31 16:36:06 2013
From: bill at eecs.berkeley.edu (Bill Flounders)
Date: Fri, 31 May 2013 13:36:06 -0700
Subject: [labnetwork] Scanning MicroDensitometer
Message-ID: <51A909B6.6010703@eecs.berkeley.edu>

Lab Network Colleagues,
I am seeking a facility with a scanning microdensitometer.
Seeking a unit with a 1um x 10um slit
able to handle a 1" by 1" square.
Request is for one time analysis of 3-5 samples.
Thank you for any leads.
Sincerely,
Bill Flounders
UC Berkeley