From Thomas_Ferraguto at uml.edu Mon Apr 14 13:26:47 2014 From: Thomas_Ferraguto at uml.edu (Ferraguto, Thomas) Date: Mon, 14 Apr 2014 17:26:47 +0000 Subject: [labnetwork] support of High End SEM and FIB tools Message-ID: Colleagues, With the high cost of service contracts for all of the high-end metrology equipment, has anyone sought out hiring an internal tech that could handle most of the repairs? There has been a lot of debate on , service contracts vs. time and materials vs. insurance companies,(we're trying time and materials now) but has anyone looked into hiring internal support (or do the manufactures hold too much IP and leverage). I'd appreciate your thoughts. Best, Thomas S. Ferraguto ETIC Nanofabrication Laboratory Director University of Massachusetts Lowell 1 University Avenue Lowell MA 01854-5120 978-934-1809 land 617-755-0910 mobile 978-934-1014 fax [cid:image003.png at 01CF57E5.2F8F9520] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image003.png Type: image/png Size: 57996 bytes Desc: image003.png URL: From Vincent.Luciani at nist.gov Tue Apr 15 08:11:00 2014 From: Vincent.Luciani at nist.gov (Luciani, Vincent) Date: Tue, 15 Apr 2014 12:11:00 +0000 Subject: [labnetwork] support of High End SEM and FIB tools In-Reply-To: References: Message-ID: <562b966b511449f2a00b28015ddddfaf@BLUPR09MB008.namprd09.prod.outlook.com> Good Morning Tom, 1. Service Contracts: The quality and responsiveness of the service seems to be declining. 2. Time and materials: OK for many tools but have not been able to make it work for high end metrology tools. 3. Insurance companies: Hate it. Slow, cumbersome, ineffective. One of the issues that continually comes up for these higher end tools is that the OEM's play games with spare parts availability for 3rd party buyers. In general, here at CNST and at other fabs in the past, if I have spare parts and repair expertise to mitigate the risk of long down times, the internal service tech is much more cost effective and brings so many other benefits. Of course your organizations labor burden rate is a key factor in the calculations. For example, if parts are easy to get and/or I have (functional) tool redundancy and the expertise is in my staff or can be hired...I opt for the hire. If I ever achieve that with SEM/TEM/FIB's and the like, I will not hesitate to give it a go. Good topic for the forum Vince Vincent K. Luciani NanoFab Manager Center for Nanoscale Science and Technology National Institute of Standards and Technology 100 Bureau Drive, MS 6201 Gaithersburg, MD 20899-6200 USA +1-301-975-2886 From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Ferraguto, Thomas Sent: Monday, April 14, 2014 1:27 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] support of High End SEM and FIB tools Colleagues, With the high cost of service contracts for all of the high-end metrology equipment, has anyone sought out hiring an internal tech that could handle most of the repairs? There has been a lot of debate on , service contracts vs. time and materials vs. insurance companies,(we're trying time and materials now) but has anyone looked into hiring internal support (or do the manufactures hold too much IP and leverage). I'd appreciate your thoughts. Best, Thomas S. Ferraguto ETIC Nanofabrication Laboratory Director University of Massachusetts Lowell 1 University Avenue Lowell MA 01854-5120 978-934-1809 land 617-755-0910 mobile 978-934-1014 fax [cid:image001.png at 01CF587D.750C4B50] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 57996 bytes Desc: image001.png URL: From emartin at cns.fas.harvard.edu Tue Apr 15 15:28:55 2014 From: emartin at cns.fas.harvard.edu (Martin, Eric) Date: Tue, 15 Apr 2014 19:28:55 +0000 Subject: [labnetwork] REMINDER : Register now for UGIM 2014 ! Message-ID: <2DF767B0ED5BB84FAF02C966FDAC8E95B02B0730@HARVANDMBX02.fasmail.priv> Dear Colleagues Reminder - register now for the 2014 University/Government/Industry/Micro-Nano Symposium to be held on the campus of Harvard University June 15-17, 2014. Event information, registration link, and lodging information can be found at: http://www.cns.fas.harvard.edu/UGIM2014/ The meeting focus will be on the operational aspects of research cleanrooms with topics including (but not limited to) operations, EHS, energy, lab design, and computer lab control. Event will include: * Keynote talks by SEMATECH and NSF/NNI leadership * Discussion Panels * Working Lunch * Expanded Exhibit area * Optional "New Lab Bootie Camp" half day tutorial on operations and safety. * Optional post-meeting trip to a Red Sox game at Fenway Park We look forward to seeing you here in sunny, friendly Cambridge this June. Eric Martin and Vicky Diadiuk Co-Chairs, UGIM 2014 Eric Martin, Ph.D. | UGIM2014 co-Chair Technical Director Harvard Center for Nanoscale Systems | Harvard University 11 Oxford Street | Cambridge, MA 02138 | 617-495-3161 -------------- next part -------------- An HTML attachment was scrubbed... URL: From rmorrison at draper.com Wed Apr 16 07:22:44 2014 From: rmorrison at draper.com (Morrison, Richard H., Jr.) Date: Wed, 16 Apr 2014 11:22:44 +0000 Subject: [labnetwork] support of High End SEM and FIB tools In-Reply-To: References: Message-ID: HI, At Draper we have 2 equipment technicians that can fix the tools. We have service contracts for annual PM on the most complicated tools like SEM, Sputter, DRIE ect. Repairs and simple PM we do with the in house team. Rick From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Ferraguto, Thomas Sent: Monday, April 14, 2014 1:27 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] support of High End SEM and FIB tools Colleagues, With the high cost of service contracts for all of the high-end metrology equipment, has anyone sought out hiring an internal tech that could handle most of the repairs? There has been a lot of debate on , service contracts vs. time and materials vs. insurance companies,(we're trying time and materials now) but has anyone looked into hiring internal support (or do the manufactures hold too much IP and leverage). I'd appreciate your thoughts. Best, Thomas S. Ferraguto ETIC Nanofabrication Laboratory Director University of Massachusetts Lowell 1 University Avenue Lowell MA 01854-5120 978-934-1809 land 617-755-0910 mobile 978-934-1014 fax [cid:image001.png at 01CF5944.A7A154D0] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 57996 bytes Desc: image001.png URL: From frankel at maine.edu Fri Apr 18 13:25:14 2014 From: frankel at maine.edu (David Frankel) Date: Fri, 18 Apr 2014 13:25:14 -0400 Subject: [labnetwork] Problems with ALD system Message-ID: <53515FFA.6090305@maine.edu> We have an Oxford Opal ALD system we use primarily for Al2O3 deposition using TMA. It is a thermal system, no plasma. It is pumped by a rotary vane pump with a synthetic di-ester oil (A155), same as originally supplied by Oxford. There is no trap between the pump and chamber. We are having problems getting consistent good film quality. We often see films with poor quality, micron-sized pin holes etc... We think the problem may be related to contamination of the chamber with back-streaming pump oil as we often find considerable quantities of oil in the chamber. Some questions: 1) The A155 oil has a fairly high vapor pressure, is there a lower vapor pressure oil you can suggest that would stand up to the process gas that would work with our present pump? (switching to a dry pump is cost prohibitive at this time, switching to Fomblin may be possible but would also presumably be expensive as it may require a pump rebuild or exchange) 2) Can a molecular sieve trap be added in the fore-line without creating any further problems? If so, can a standard one be used or must it have some special features (high conductance...)? Are there other types of traps that would work in this application? 3) With a trap in the line what safety measures are needed, for instance when venting to air? 4) Are there other issues that could be causing poor film quality? Thanks for your help on this, David -- David J. Frankel - Senior Research Scientist LASST - University of Maine 5708 Barrows Hall Orono, ME 04469-5708 207-581-2256 frankel at maine.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From codreanu at udel.edu Fri Apr 18 13:48:05 2014 From: codreanu at udel.edu (Iulian Codreanu) Date: Fri, 18 Apr 2014 13:48:05 -0400 Subject: [labnetwork] Negative cleanroom Message-ID: <53516555.9080908@udel.edu> Dear Colleagues, As much as I would like for my cleanroom to always be at higher pressure relative to the rest of the building, I have to be realistic. I am writing to solicit feedback on what is considered acceptable in terms of negative pressure and duration in non-catastrophic situations (loss of normal power, single fan failure, freeze stat trip, etc). Thank you very much for your help. Iulian -- iulian Codreanu, Ph.D. Director of Operations, UD NanoFab University of Delaware 163 ISE Lab 221 Academy Street Newark, DE 19716 302-831-2784 From hathaway at cns.fas.harvard.edu Fri Apr 18 18:57:16 2014 From: hathaway at cns.fas.harvard.edu (Hathaway, Malcolm) Date: Fri, 18 Apr 2014 22:57:16 +0000 Subject: [labnetwork] Problems with ALD system In-Reply-To: <53515FFA.6090305@maine.edu> References: <53515FFA.6090305@maine.edu> Message-ID: Hi David, This is Mac Hathaway, at Harvard CNS. I'm not familiar with A155, but the oil should be of a sort that is inert and appropriate for O2 service. This usually mean Fomblin, or some other perfluorinated oil of that type. If you go with fomblin, you have to make sure the pump seals are of the appropriate type, as you mentioned. To provide a place for our excess precursors to "wet out" and react before they reach our pump, we put a plain old mist filter on our Cambridge Nano/Ultratech Savannah unit. I should think you could do something similar and have a positive effect on your backstreaming. If the Opal has pressure monitoring, the pressure spikes associated with precursor pulses will be softened by the presence of the mist filter. Have you done any XPS on your film to see if there is any carbon/pump oil in it? "Dirty" wafers would presumably have nucleation issues, but if you really see copious oil in your chamber, that would seem to be the most likely cause of dirty wafers... Does the Opal have a constant N2 purge? Last thing (or perhaps first thing!): Check with Oxford to see what they recommend. If your unit is stock, they will almost certainly have seen this before, and have good suggestions... Mac ________________________________ From: labnetwork-bounces at mtl.mit.edu [labnetwork-bounces at mtl.mit.edu] on behalf of David Frankel [frankel at maine.edu] Sent: Friday, April 18, 2014 1:25 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Problems with ALD system We have an Oxford Opal ALD system we use primarily for Al2O3 deposition using TMA. It is a thermal system, no plasma. It is pumped by a rotary vane pump with a synthetic di-ester oil (A155), same as originally supplied by Oxford. There is no trap between the pump and chamber. We are having problems getting consistent good film quality. We often see films with poor quality, micron-sized pin holes etc... We think the problem may be related to contamination of the chamber with back-streaming pump oil as we often find considerable quantities of oil in the chamber. Some questions: 1) The A155 oil has a fairly high vapor pressure, is there a lower vapor pressure oil you can suggest that would stand up to the process gas that would work with our present pump? (switching to a dry pump is cost prohibitive at this time, switching to Fomblin may be possible but would also presumably be expensive as it may require a pump rebuild or exchange) 2) Can a molecular sieve trap be added in the fore-line without creating any further problems? If so, can a standard one be used or must it have some special features (high conductance...)? Are there other types of traps that would work in this application? 3) With a trap in the line what safety measures are needed, for instance when venting to air? 4) Are there other issues that could be causing poor film quality? Thanks for your help on this, David -- David J. Frankel - Senior Research Scientist LASST - University of Maine 5708 Barrows Hall Orono, ME 04469-5708 207-581-2256 frankel at maine.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From mwoonk at umich.edu Sat Apr 19 17:42:43 2014 From: mwoonk at umich.edu (Matthew Oonk) Date: Sat, 19 Apr 2014 17:42:43 -0400 Subject: [labnetwork] Problems with ALD system In-Reply-To: References: <53515FFA.6090305@maine.edu> Message-ID: Hi David I think Mac has the right idea : are you sure it backstreaming oil that is leading to you nucleation issue and if so changing oil would be the easiest of solutions. With a hot chamber and chuck, I might be tempted to run a longer pre-dep Ar purge to see if it changes the behavior. Unfortunately our OpAL is hooked up to a dry pump about 30 feet away so I don't have insight on that. Matt Oonk (Michigan LNF) On Friday, April 18, 2014, Hathaway, Malcolm wrote: > Hi David, > > This is Mac Hathaway, at Harvard CNS. I'm not familiar with A155, but the > oil should be of a sort that is inert and appropriate for O2 service. This > usually mean Fomblin, or some other perfluorinated oil of that type. If > you go with fomblin, you have to make sure the pump seals are of the > appropriate type, as you mentioned. > > To provide a place for our excess precursors to "wet out" and react before > they reach our pump, we put a plain old mist filter on our Cambridge > Nano/Ultratech Savannah unit. I should think you could do something > similar and have a positive effect on your backstreaming. If the Opal has > pressure monitoring, the pressure spikes associated with precursor pulses > will be softened by the presence of the mist filter. > > Have you done any XPS on your film to see if there is any carbon/pump oil > in it? > > "Dirty" wafers would presumably have nucleation issues, but if you really > see copious oil in your chamber, that would seem to be the most likely > cause of dirty wafers... > > Does the Opal have a constant N2 purge? > > Last thing (or perhaps first thing!): Check with Oxford to see what they > recommend. If your unit is stock, they will almost certainly have seen > this before, and have good suggestions... > > > Mac > ------------------------------ > *From:* labnetwork-bounces at mtl.mit.edu[ > labnetwork-bounces at mtl.mit.edu] > on behalf of David Frankel [frankel at maine.edu > ] > *Sent:* Friday, April 18, 2014 1:25 PM > *To:* labnetwork at mtl.mit.edu > *Subject:* [labnetwork] Problems with ALD system > > We have an Oxford Opal ALD system we use primarily for Al2O3 deposition > using TMA. It is a thermal system, no plasma. It is pumped by a rotary > vane pump with a synthetic di-ester oil (A155), same as originally supplied > by Oxford. There is no trap between the pump and chamber. We are having > problems getting consistent good film quality. We often see films with > poor quality, micron-sized pin holes etc... We think the problem may be > related to contamination of the chamber with back-streaming pump oil as we > often find considerable quantities of oil in the chamber. > Some questions: > 1) The A155 oil has a fairly high vapor pressure, is there a lower vapor > pressure oil you can suggest that would stand up to the process gas that > would work with our present pump? (switching to a dry pump is cost > prohibitive at this time, switching to Fomblin may be possible but would > also presumably be expensive as it may require a pump rebuild or exchange) > 2) Can a molecular sieve trap be added in the fore-line without creating > any further problems? If so, can a standard one be used or must it have > some special features (high conductance...)? Are there other types of > traps that would work in this application? > 3) With a trap in the line what safety measures are needed, for instance > when venting to air? > 4) Are there other issues that could be causing poor film quality? > > Thanks for your help on this, > David > > -- > David J. Frankel - Senior Research Scientist > LASST - University of Maine > 5708 Barrows Hall > Orono, ME 04469-5708 > 207-581-2256frankel at maine.edu > > -- Matthew Oonk Research Engineer Lurie Nanofabrication Facility University of Michigan 734-646-1275 mwoonk at umich.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From codreanu at udel.edu Tue Apr 22 18:00:16 2014 From: codreanu at udel.edu (Iulian Codreanu) Date: Tue, 22 Apr 2014 18:00:16 -0400 Subject: [labnetwork] Job opening at UDNF Message-ID: <5356E670.9030603@udel.edu> Dear Colleagues, I am looking for a Facility Specialist; the person who spends most of their time ensuring the smooth operation of the fab and its supporting systems. Can you please help disseminate the attached ad? Thank you very much! Iulian -- iulian Codreanu, Ph.D. Director of Operations, UD NanoFab University of Delaware 163 ISE Lab 221 Academy Street Newark, DE 19716 302-831-2784 -------------- next part -------------- A non-text attachment was scrubbed... Name: udjobs_Nanofab_specialist_toMail.pdf Type: application/pdf Size: 1206316 bytes Desc: not available URL: From codreanu at udel.edu Wed Apr 23 09:07:53 2014 From: codreanu at udel.edu (Iulian Codreanu) Date: Wed, 23 Apr 2014 09:07:53 -0400 Subject: [labnetwork] pressure independent valves on exhaust? Message-ID: <5357BB29.9020301@udel.edu> Good Morning. Do you have "pressure-independent" valves on the exhaust of the cleanroom equipment (wet benches included)? If you do not, what were the reasons and what do you use instead? Thank you very much. Iulian -- iulian Codreanu, Ph.D. Director of Operations, UD NanoFab University of Delaware 163 ISE Lab 221 Academy Street Newark, DE 19716 302-831-2784 From rmorrison at draper.com Wed Apr 23 15:03:29 2014 From: rmorrison at draper.com (Morrison, Richard H., Jr.) Date: Wed, 23 Apr 2014 19:03:29 +0000 Subject: [labnetwork] pressure independent valves on exhaust? In-Reply-To: <5357BB29.9020301@udel.edu> References: <5357BB29.9020301@udel.edu> Message-ID: We use blast gates, they just block the duct and they are pinned to get a flow that allows the 100 fpm at the face of the hood. So we have maximum exhaust 24 hours per day. We were going to use variable exhaust dampers on the duct work so that we could close the hood sash at night time to save $$. The upfront cost of the dampers and control system upgrade was high and the payback time period to long to justify the expense. Now we are stuck with a wasteful operation. It is very difficult to retrofit the systems due to lack of room to modify the duct work. So add the dampers and control software up front and it saves you many $$ in operating cost. Rick -----Original Message----- From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Iulian Codreanu Sent: Wednesday, April 23, 2014 9:08 AM To: Fab Network Subject: [labnetwork] pressure independent valves on exhaust? Good Morning. Do you have "pressure-independent" valves on the exhaust of the cleanroom equipment (wet benches included)? If you do not, what were the reasons and what do you use instead? Thank you very much. Iulian -- iulian Codreanu, Ph.D. Director of Operations, UD NanoFab University of Delaware 163 ISE Lab 221 Academy Street Newark, DE 19716 302-831-2784 _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork From reynolds at ece.ucsb.edu Wed Apr 23 18:52:36 2014 From: reynolds at ece.ucsb.edu (Tom Reynolds) Date: Wed, 23 Apr 2014 15:52:36 -0700 Subject: [labnetwork] pressure independent valves on exhaust? In-Reply-To: References: <5357BB29.9020301@udel.edu> Message-ID: <027e01cf5f46$bb1aa9f0$314ffdd0$@ece.ucsb.edu> We also just have manual blast gates. It is simple and much lower initial cost. Our lab is used 24/7 so your lab use should be considered as to how often the sash would actually be closed, either manual or automated close, and how much energy would be saved. Controls are not zero cost/upkeep/maintenance. -------------------------------------------------------------- Tom Reynolds, Lab Manager UCSB Nanofabrication Facility Electrical and Computer Engineering Dept. Engineering Science Bldg #225, Room 1109E Santa Barbara, CA 93106 805-893-3918 x215 office 805-451-3979 cell 805-893-3918 fax reynolds at ece.ucsb.edu -----Original Message----- From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Morrison, Richard H., Jr. Sent: Wednesday, April 23, 2014 12:03 PM To: Iulian Codreanu; Fab Network Subject: Re: [labnetwork] pressure independent valves on exhaust? We use blast gates, they just block the duct and they are pinned to get a flow that allows the 100 fpm at the face of the hood. So we have maximum exhaust 24 hours per day. We were going to use variable exhaust dampers on the duct work so that we could close the hood sash at night time to save $$. The upfront cost of the dampers and control system upgrade was high and the payback time period to long to justify the expense. Now we are stuck with a wasteful operation. It is very difficult to retrofit the systems due to lack of room to modify the duct work. So add the dampers and control software up front and it saves you many $$ in operating cost. Rick -----Original Message----- From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Iulian Codreanu Sent: Wednesday, April 23, 2014 9:08 AM To: Fab Network Subject: [labnetwork] pressure independent valves on exhaust? Good Morning. Do you have "pressure-independent" valves on the exhaust of the cleanroom equipment (wet benches included)? If you do not, what were the reasons and what do you use instead? Thank you very much. Iulian -- iulian Codreanu, Ph.D. Director of Operations, UD NanoFab University of Delaware 163 ISE Lab 221 Academy Street Newark, DE 19716 302-831-2784 _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork From Thomas_Ferraguto at uml.edu Tue Apr 29 15:07:41 2014 From: Thomas_Ferraguto at uml.edu (Ferraguto, Thomas) Date: Tue, 29 Apr 2014 19:07:41 +0000 Subject: [labnetwork] 300 mm wafer coating capability Message-ID: I have a customer that's looking for coating (spin coating) capability for 300mm wafers. Does anyone have a resource they could offer or recommend Best Regards Thomas S. Ferraguto ETIC Nanofabrication Laboratory Director University of Massachusetts Lowell 1 University Avenue Lowell MA 01854-5120 978-934-1809 land 617-755-0910 mobile 978-934-1014 fax [cid:image003.png at 01CF63BC.C43087B0] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image003.png Type: image/png Size: 57996 bytes Desc: image003.png URL: From bob.henderson at etchedintimeinc.com Tue Apr 29 16:57:19 2014 From: bob.henderson at etchedintimeinc.com (Bob Henderson) Date: Tue, 29 Apr 2014 13:57:19 -0700 Subject: [labnetwork] 300 mm wafer coating capability In-Reply-To: References: Message-ID: <001801cf63ed$9e5d3020$db179060$@henderson@etchedintimeinc.com> Try Brewer Science's CEE division. They make inexpensive coating systems that work well. Bob Henderson From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Ferraguto, Thomas Sent: Tuesday, April 29, 2014 12:08 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] 300 mm wafer coating capability I have a customer that's looking for coating (spin coating) capability for 300mm wafers. Does anyone have a resource they could offer or recommend Best Regards Thomas S. Ferraguto ETIC Nanofabrication Laboratory Director University of Massachusetts Lowell 1 University Avenue Lowell MA 01854-5120 978-934-1809 land 617-755-0910 mobile 978-934-1014 fax -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 57996 bytes Desc: not available URL: From rathbun at cnf.cornell.edu Tue Apr 29 17:26:32 2014 From: rathbun at cnf.cornell.edu (Lynn Rathbun) Date: Tue, 29 Apr 2014 17:26:32 -0400 Subject: [labnetwork] 300 mm wafer coating capability In-Reply-To: References: Message-ID: Thomas Cornell can, for at least some resists Have them contact Mike Skvarla 607-254-4674 skvarla at cnf.cornell.edu to discuss requirements. Lynn Rathbun >I have a customer that's looking for coating (spin coating) >capability for 300mm wafers. > >Does anyone have a resource they could offer or recommend > >Best Regards > > >Thomas S. Ferraguto >ETIC Nanofabrication Laboratory Director >University of Massachusetts Lowell >1 University Avenue >Lowell MA 01854-5120 >978-934-1809 land >617-755-0910 mobile >978-934-1014 fax >[] > > > > >_______________________________________________ >labnetwork mailing list >labnetwork at mtl.mit.edu >https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork ************************************************************** Dr. Lynn Rathbun Rathbun at cnf.cornell.edu NNIN Deputy Director (607)-254-4872 CNF Laboratory Manager Duffield Hall (607)-255-8601 Fax Cornell University (607)-592-1549 Work Cell Ithaca, New York 14853 (607)-342-1880 Personal Cell -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: 1cccc8b.png Type: image/png Size: 57996 bytes Desc: not available URL: From emartin at cns.fas.harvard.edu Wed Apr 30 10:02:04 2014 From: emartin at cns.fas.harvard.edu (Martin, Eric) Date: Wed, 30 Apr 2014 14:02:04 +0000 Subject: [labnetwork] Early Bird Registration for UGIM 2014 ends Tonight !! Message-ID: <2DF767B0ED5BB84FAF02C966FDAC8E95B02B9338@HARVANDMBX02.fasmail.priv> SAVE $50 - Register today! Reminder - register now for the 2014 University/Government/Industry/Micro-Nano Symposium to be held on the campus of Harvard University June 15-17, 2014. Event information, registration link, and lodging information can be found at: http://www.cns.fas.harvard.edu/UGIM2014/ The meeting focus will be on the operational aspects of research cleanrooms with topics including (but not limited to) operations, EHS, energy, lab design, and computer lab control. Event will include: * Keynote talks by SEMATECH and NSF/NNI leadership * Discussion Panels * Working Lunch * Expanded Exhibit area * Optional "New Lab Bootie Camp" half day tutorial on operations and safety. * CNS Laboratory Tours We look forward to seeing you here in sunny, friendly Cambridge this June. Eric Martin and Vicky Diadiuk Co-Chairs, UGIM 2014 Eric Martin, Ph.D. | UGIM2014 co-Chair Technical Director Harvard Center for Nanoscale Systems | Harvard University 11 Oxford Street | Cambridge, MA 02138 | 617-495-3161 -------------- next part -------------- An HTML attachment was scrubbed... URL: