[labnetwork] Sapphire substrates: precision scribe & break

[Efrat Moyal]

Dear Chris,
Id like to interest you with another, new cleaving option – the FlipScribe - https://latticegear.com/flipscribe-100/ .
I think it will be of an interest to you especial because of your last sentence: “..This technique is heavily operator dependent and not suitable for large volume…”

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The FlipScribe allows one to view the target (under magnification even better), align the diamond tip to the target and scribe a fine, straight, very narrow line on the back of the sample.
This way, the front is untouched while scribing and cleaving accurately. Cleaving is done over the same diamond pin on the surface of the FlipScribe, see the following short video clips:
https://www.youtube.com/watch?v=zZ80NEpLVJc  and https://www.youtube.com/watch?v=dQg5Yz9eBAE

Best Regards,
Efrat
--------------------------------------------------------
Efrat R Moyal (Mrs.)
DIRECT: 408.455.0475
Efrat.Moyal at LatticeGear.com
[cid:image005.jpg at 01D11A49.1E463F30]

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Begin forwarded message:
From: Christopher Raum <crraum at gmail.com<mailto:crraum at gmail.com>>
Date: November 6, 2015 at 10:26:15 PM EST
To: Vito Logiudice <vito.logiudice at uwaterloo.ca<mailto:vito.logiudice at uwaterloo.ca>>
Cc: "labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>" <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Subject: Re: [labnetwork] Sapphire substrates: precision scribe & break
Hi Vito,
I've had success scribing across the length of the desired cleave location and then using the length of a hex key (1 to 2 mm) to provide a fulcrum under the scribe line. Then by placing finger tips on either side of the scribe (freshly trimmed fingernails help), push down evenly over the hex key edge. By placing a gentle but steadily increasing pressure I've been able to successfully cleave fused quartz wafers (100 to 500 um thick) this way.
This technique is heavily operator dependent and not suitable for large volume, but if you just need some experimental samples prepared it's a useful technique.

Good luck!
-Chris
--
Christopher Raum, PhD.
R&D Engineer
Experimental Cosmology Group
Radio Astronomy Lab
University of California, Berkeley
151 LeConte Hall
Berkeley, CA, 94720
Work: (510) 642-7801
Cell: (949) 677-1905
Fax:  (510) 643-5204
Email:        craum at berkeley.edu<mailto:craum at berkeley.edu>
Alt Email:   crraum at gmail.com<mailto:crraum at gmail.com>

On Fri, Nov 6, 2015 at 10:42 AM, Vito Logiudice <vito.logiudice at uwaterloo.ca<mailto:vito.logiudice at uwaterloo.ca>> wrote:
Dear Colleagues,

I would appreciate hearing from anyone whom might be able to share some insights on how to reliably scribe & break sapphire substrates. We’re attempting to help out a couple of research groups here with such a requirement.

We’ve had success with our water-cooled dicing saw but it appears this approach leads to unacceptable materials issues. We thus find ourselves having to resort to some sort of precision (& repeatable) scribe and break technique/setup which will result in consistently smooth sidewalls.

Thank you for any insights on procedures you may be using or equipment vendors you have worked with whom might be able to help.

Best regards,
Vito
--
Vito Logiudice  P.Eng.
Director of Operations, Quantum NanoFab
University of Waterloo
Lazaridis QNC 1207
200 University Avenue West
Waterloo, ON           Canada N2L 3G1
Tel.: (519) 888-4567  ext. 38703<tel:%28519%29%20888-4567%20%C2%A0ext.%2038703>
Email: vito.logiudice at uwaterloo.ca<mailto:vito.logiudice at uwaterloo.ca>
Website: https://fab.qnc.uwaterloo.ca


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