From julia.aebersold at louisville.edu Wed Aug 3 10:32:20 2016 From: julia.aebersold at louisville.edu (julia.aebersold at louisville.edu) Date: Wed, 3 Aug 2016 14:32:20 +0000 Subject: [labnetwork] Cadmium Silicon Diphosphide (CdSiP2), Message-ID: Hello everyone! Has anyone had experience in working with this material? The cadmium aspect of it has my concerns. Cheers! Julia Aebersold, Ph.D. Cleanroom Manager Micro/Nano Technology Center University of Louisville Shumaker Research Building, Room 233 2210 South Brook Street Louisville, KY 40292 502-852-1572 http://louisville.edu/micronano/ -------------- next part -------------- An HTML attachment was scrubbed... URL: From ahryciw at ualberta.ca Wed Aug 3 14:34:10 2016 From: ahryciw at ualberta.ca (Aaron Hryciw) Date: Wed, 3 Aug 2016 12:34:10 -0600 Subject: [labnetwork] Oxidation of Si wafers with DRIE passivation polymer Message-ID: Dear colleagues, Our facility recently installed a Tystar wet/dry oxidation tube, which has so far only been used to oxidise virgin Si wafers. Recently, one of our users has requested to do a 400?1000 nm wet oxidation at 1100 ?C on DRIE (Bosch) etched Si wafers which still have DRIE passivation polymer on them, for the dual purpose of removing the polymer and growing an oxide. Given the tool's excellent performance so far, I am concerned with the possibility of contaminating the (atmospheric) tube as the polymer is burned off, adversely affecting subsequent processes. My priority is to protect the integrity of the tool, but I also do not want to be needlessly restrictive if the presence of the polymer does not in fact pose any problem. We are a multi-user facility, with academic and industrial users who primarily do MEMS and microfluidics work (i.e., no CMOS processing). My initial thought would be to have this user remove the polymer first using a dry etch (O? plasma), only oxidising the wafers once it has been verified that the polymer is no longer present. Any advice on this matter would be greatly appreciated. Many thanks. Cheers, ? Aaron Hryciw Aaron Hryciw, PhD, PEng Fabrication Group Manager University of Alberta - nanoFAB W1-060 ECERF Building 9107 - 116 Street Edmonton, Alberta Canada T6G 2V4 Ph: 780-940-7938 www.nanofab.ualberta.ca -------------- next part -------------- An HTML attachment was scrubbed... URL: From nclay at seas.upenn.edu Thu Aug 4 09:47:18 2016 From: nclay at seas.upenn.edu (Noah Clay) Date: Thu, 4 Aug 2016 09:47:18 -0400 Subject: [labnetwork] Oxidation of Si wafers with DRIE passivation polymer In-Reply-To: References: Message-ID: <42C4AB3C-55AB-488F-8F15-C7F74D1B38E0@seas.upenn.edu> Aaron, We have a rather high power density oxygen barrel asher that removes Bosch polymer. If you cross-section a test device, there?s an observable difference in SEM sidewall charging pre- and post barrel ashing. You may also note the change in polymer mushrooming at the tops of features. Definitely, use low keV SEM imaging. It?s been our experience that oxide will not burn off during furnace oxidation; rather, O2 will diffuse through the remaining carbonized layer. Wet process alternative: EKC 265 from DuPont. http://www.dupont.com/content/dam/dupont/products-and-services/electronic-and-electrical-materials/documents/ekc/EKC265.pdf Best of Luck, Noah Noah Clay Director, Quattrone Nanofabrication Facility School of Engineering & Applied Science University of Pennsylvania Philadelphia, PA (215) 898-9308 nclay at upenn.edu LinkedIn Profile > On Aug 3, 2016, at 2:34 PM, Aaron Hryciw wrote: > > Dear colleagues, > > Our facility recently installed a Tystar wet/dry oxidation tube, which has so far only been used to oxidise virgin Si wafers. Recently, one of our users has requested to do a 400?1000 nm wet oxidation at 1100 ?C on DRIE (Bosch) etched Si wafers which still have DRIE passivation polymer on them, for the dual purpose of removing the polymer and growing an oxide. > > Given the tool's excellent performance so far, I am concerned with the possibility of contaminating the (atmospheric) tube as the polymer is burned off, adversely affecting subsequent processes. My priority is to protect the integrity of the tool, but I also do not want to be needlessly restrictive if the presence of the polymer does not in fact pose any problem. We are a multi-user facility, with academic and industrial users who primarily do MEMS and microfluidics work (i.e., no CMOS processing). > > My initial thought would be to have this user remove the polymer first using a dry etch (O? plasma), only oxidising the wafers once it has been verified that the polymer is no longer present. > > Any advice on this matter would be greatly appreciated. Many thanks. > > Cheers, > > ? Aaron Hryciw > > > > Aaron Hryciw, PhD, PEng > Fabrication Group Manager > University of Alberta - nanoFAB > W1-060 ECERF Building > 9107 - 116 Street > Edmonton, Alberta > Canada T6G 2V4 Ph: 780-940-7938 > www.nanofab.ualberta.ca > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From yglian at illinois.edu Thu Aug 4 09:48:37 2016 From: yglian at illinois.edu (Lian, Yaguang) Date: Thu, 4 Aug 2016 13:48:37 +0000 Subject: [labnetwork] Oxidation of Si wafers with DRIE passivation polymer In-Reply-To: References: Message-ID: <851B39526FEED74691E4131301DE17E5285C3B87@CITESMBX1.ad.uillinois.edu> Aaron, This is a common process used to remove Teflon film and scallop from silicon after Bosch process. The Teflon film (F-C) is very hard to remove by O2 plasma. It cannot contaminate the tube. Carbon has chemical reaction with O2 to become CO2, it is gas. Fluorine is also gas. Both of them easily escape from the tube and cannot contaminate it. One more thing, we use HF to clean the tube. So I think it should be fine to use wet oxidation on Bosch silicon wafer. Thanks, Yaguang Lian Research Engineer 2306 Micro and Nanotechnology Laboratory University of Illinois at Urbana-Champaign 208 N. Wright St. Urbana, IL 61801 Phone: 217-333-8051 Email: yglian at illinois.edu From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Aaron Hryciw Sent: 2016?8?3? 13:34 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Oxidation of Si wafers with DRIE passivation polymer Dear colleagues, Our facility recently installed a Tystar wet/dry oxidation tube, which has so far only been used to oxidise virgin Si wafers. Recently, one of our users has requested to do a 400?1000 nm wet oxidation at 1100 ?C on DRIE (Bosch) etched Si wafers which still have DRIE passivation polymer on them, for the dual purpose of removing the polymer and growing an oxide. Given the tool's excellent performance so far, I am concerned with the possibility of contaminating the (atmospheric) tube as the polymer is burned off, adversely affecting subsequent processes. My priority is to protect the integrity of the tool, but I also do not want to be needlessly restrictive if the presence of the polymer does not in fact pose any problem. We are a multi-user facility, with academic and industrial users who primarily do MEMS and microfluidics work (i.e., no CMOS processing). My initial thought would be to have this user remove the polymer first using a dry etch (O? plasma), only oxidising the wafers once it has been verified that the polymer is no longer present. Any advice on this matter would be greatly appreciated. Many thanks. Cheers, ? Aaron Hryciw Aaron Hryciw, PhD, PEng Fabrication Group Manager University of Alberta - nanoFAB W1-060 ECERF Building 9107 - 116 Street Edmonton, Alberta Canada T6G 2V4 Ph: 780-940-7938 www.nanofab.ualberta.ca -------------- next part -------------- An HTML attachment was scrubbed... URL: From hromans at eng.ucsd.edu Thu Aug 4 14:46:11 2016 From: hromans at eng.ucsd.edu (J Romans) Date: Thu, 4 Aug 2016 11:46:11 -0700 Subject: [labnetwork] Bismuth Deposition Message-ID: Hello Esteemed Colleagues - We have a research group that is interested in depositing Bismuth. We are leaning towards allowing this in an ebeam evaporator, but sputtering is also a possibility. Is anyone aware of any pitfalls or tips associated with either method of deposition? Bi has health and flammability ratings of 1 ( compare Cr with health 2 and flammability 1, which we do a lot of). We are more concerned with the physical characteristics that might cause splattering, contamination, incompatibilities with other processes, difficulty cleaning shielding, etc. Any information would be greatly appreciated. Thanks, Hal Romans Senior Equipment Engineer University of California San Diego Nano 3 Cleanroom -------------- next part -------------- An HTML attachment was scrubbed... URL: From vito.logiudice at uwaterloo.ca Thu Aug 4 15:03:28 2016 From: vito.logiudice at uwaterloo.ca (Vito Logiudice) Date: Thu, 4 Aug 2016 19:03:28 +0000 Subject: [labnetwork] Oxidation of Si wafers with DRIE passivation polymer In-Reply-To: References: Message-ID: Hi Aaron, Great comments so far on this topic. I will add a suggestion that you might want to consider. I assume you typically have two, 24-wafer quartz boats loaded in this furnace at any given time. If you do decide to allow clean, previously processed wafers in this tube in the future together with your usual virgin wafers, perhaps you might want to dedicate the boat closest to the source (ie., the one furthest away from the loading end) to your virgin Si wafers and the tail end of your second boat to the previously processed wafers. The thinking here is that contaminants, if any, would likely tend to diffuse towards the load end of the furnace quartzware over time rather than the source end, thus keeping at least a good portion of the tube as pristine as possible. As an aside, I would not even consider this approach for a CMOS oxidation tube. Best, Vito -- Vito Logiudice P.Eng. Director of Operations, Quantum NanoFab University of Waterloo Lazaridis QNC 1207 200 University Avenue West Waterloo, ON Canada N2L 3G1 Tel.: (519) 888-4567 ext. 38703 Email: vito.logiudice at uwaterloo.ca Website: https://fab.qnc.uwaterloo.ca From: > on behalf of Aaron Hryciw > Date: Wednesday, August 3, 2016 at 2:34 PM To: "labnetwork at mtl.mit.edu" > Subject: [labnetwork] Oxidation of Si wafers with DRIE passivation polymer Dear colleagues, Our facility recently installed a Tystar wet/dry oxidation tube, which has so far only been used to oxidise virgin Si wafers. Recently, one of our users has requested to do a 400?1000 nm wet oxidation at 1100 ?C on DRIE (Bosch) etched Si wafers which still have DRIE passivation polymer on them, for the dual purpose of removing the polymer and growing an oxide. Given the tool's excellent performance so far, I am concerned with the possibility of contaminating the (atmospheric) tube as the polymer is burned off, adversely affecting subsequent processes. My priority is to protect the integrity of the tool, but I also do not want to be needlessly restrictive if the presence of the polymer does not in fact pose any problem. We are a multi-user facility, with academic and industrial users who primarily do MEMS and microfluidics work (i.e., no CMOS processing). My initial thought would be to have this user remove the polymer first using a dry etch (O? plasma), only oxidising the wafers once it has been verified that the polymer is no longer present. Any advice on this matter would be greatly appreciated. Many thanks. Cheers, ? Aaron Hryciw Aaron Hryciw, PhD, PEng Fabrication Group Manager University of Alberta - nanoFAB W1-060 ECERF Building 9107 - 116 Street Edmonton, Alberta Canada T6G 2V4 Ph: 780-940-7938 www.nanofab.ualberta.ca -------------- next part -------------- An HTML attachment was scrubbed... URL: From james.beall at nist.gov Thu Aug 4 18:14:49 2016 From: james.beall at nist.gov (Beall, James A. (Fed)) Date: Thu, 4 Aug 2016 22:14:49 +0000 Subject: [labnetwork] Bismuth Deposition In-Reply-To: References: Message-ID: We did this occasionally in our ebeam system. We made the user wrap the shutter and some hard to clean parts in foil to minimize the mess. It takes hardly any emission current to get a high rate - go very slowly, the spot is hard to see. In the end we built a simple thermal evaporator and use an alumina crucible in a W or Ta oven heater. Jim ________________________________ From: labnetwork-bounces at mtl.mit.edu on behalf of J Romans Sent: Thursday, August 4, 2016 12:46:11 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Bismuth Deposition Hello Esteemed Colleagues - We have a research group that is interested in depositing Bismuth. We are leaning towards allowing this in an ebeam evaporator, but sputtering is also a possibility. Is anyone aware of any pitfalls or tips associated with either method of deposition? Bi has health and flammability ratings of 1 ( compare Cr with health 2 and flammability 1, which we do a lot of). We are more concerned with the physical characteristics that might cause splattering, contamination, incompatibilities with other processes, difficulty cleaning shielding, etc. Any information would be greatly appreciated. Thanks, Hal Romans Senior Equipment Engineer University of California San Diego Nano 3 Cleanroom -------------- next part -------------- An HTML attachment was scrubbed... URL: From prabhakararaoyp at gmail.com Thu Aug 4 23:50:58 2016 From: prabhakararaoyp at gmail.com (prabhakararao yp) Date: Fri, 5 Aug 2016 09:20:58 +0530 Subject: [labnetwork] Oxidation of Si wafers with DRIE passivation polymer In-Reply-To: <42C4AB3C-55AB-488F-8F15-C7F74D1B38E0@seas.upenn.edu> References: <42C4AB3C-55AB-488F-8F15-C7F74D1B38E0@seas.upenn.edu> Message-ID: remove the polymer and do oxidation Thanks& regards, prabhakararao Dr. Y.P. Prabhakara Rao .M.Tech.Ph.D Chief Operating Officer National Nanofabrication centre Centre For Nanoscience and Engineering, Indian Institute Of Science,Bangalore-560012 Mobile: +91 9448365748 Tel: +91 80 23600129 Email: prabhakararaoyp at cense.iisc.ernet.in prabhakararaoyp at gmail.com On Thu, Aug 4, 2016 at 7:17 PM, Noah Clay wrote: > Aaron, > > We have a rather high power density oxygen barrel asher that removes Bosch > polymer. If you cross-section a test device, there?s an observable > difference in SEM sidewall charging pre- and post barrel ashing. You may > also note the change in polymer mushrooming at the tops of features. > Definitely, use low keV SEM imaging. > > It?s been our experience that oxide will not burn off during furnace > oxidation; rather, O2 will diffuse through the remaining carbonized layer. > > Wet process alternative: EKC 265 from DuPont. > http://www.dupont.com/content/dam/dupont/products-and-services/electronic-and-electrical-materials/documents/ekc/EKC265.pdf > > Best of Luck, > Noah > > *Noah Clay* > *Director, Quattrone Nanofabrication Facility* > *School of Engineering & Applied Science* > *University of Pennsylvania* > *Philadelphia, PA* > > *(215) 898-9308* > *nclay at upenn.edu * > LinkedIn Profile > > > On Aug 3, 2016, at 2:34 PM, Aaron Hryciw wrote: > > Dear colleagues, > > Our facility recently installed a Tystar wet/dry oxidation tube, which has > so far only been used to oxidise virgin Si wafers. Recently, one of our > users has requested to do a 400?1000 nm wet oxidation at 1100 ?C on DRIE > (Bosch) etched Si wafers which still have DRIE passivation polymer on them, > for the dual purpose of removing the polymer and growing an oxide. > > Given the tool's excellent performance so far, I am concerned with the > possibility of contaminating the (atmospheric) tube as the polymer is > burned off, adversely affecting subsequent processes. My priority is to > protect the integrity of the tool, but I also do not want to be needlessly > restrictive if the presence of the polymer does not in fact pose any > problem. We are a multi-user facility, with academic and industrial users > who primarily do MEMS and microfluidics work (i.e., no CMOS processing). > > My initial thought would be to have this user remove the polymer first > using a dry etch (O? plasma), only oxidising the wafers once it has been > verified that the polymer is no longer present. > > Any advice on this matter would be greatly appreciated. Many thanks. > > Cheers, > > ? Aaron Hryciw > > > > Aaron Hryciw, PhD, PEng > Fabrication Group Manager > University of Alberta - nanoFAB > W1-060 ECERF Building > 9107 - 116 Street > Edmonton, Alberta > Canada T6G 2V4 Ph: 780-940-7938 > www.nanofab.ualberta.ca > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork > > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork > > -------------- next part -------------- An HTML attachment was scrubbed... URL: From ahryciw at ualberta.ca Fri Aug 5 12:59:35 2016 From: ahryciw at ualberta.ca (Aaron Hryciw) Date: Fri, 5 Aug 2016 10:59:35 -0600 Subject: [labnetwork] Oxidation of Si wafers with DRIE passivation polymer In-Reply-To: References: <42C4AB3C-55AB-488F-8F15-C7F74D1B38E0@seas.upenn.edu> Message-ID: Dear colleagues, Thank-you all for your responses?they have been immensely helpful. Cheers, ? Aaron Aaron Hryciw, PhD, PEng Fabrication Group Manager University of Alberta - nanoFAB W1-060 ECERF Building 9107 - 116 Street Edmonton, Alberta Canada T6G 2V4 Ph: 780-940-7938 www.nanofab.ualberta.ca On Thu, Aug 4, 2016 at 9:50 PM, prabhakararao yp wrote: > remove the polymer and do oxidation > > Thanks& regards, > prabhakararao > > Dr. Y.P. Prabhakara Rao .M.Tech.Ph.D > Chief Operating Officer > National Nanofabrication centre > Centre For Nanoscience and Engineering, > Indian Institute Of Science,Bangalore-560012 > Mobile: +91 9448365748 > Tel: +91 80 23600129 > Email: prabhakararaoyp at cense.iisc.ernet.in > prabhakararaoyp at gmail.com > > On Thu, Aug 4, 2016 at 7:17 PM, Noah Clay wrote: > >> Aaron, >> >> We have a rather high power density oxygen barrel asher that removes >> Bosch polymer. If you cross-section a test device, there?s an observable >> difference in SEM sidewall charging pre- and post barrel ashing. You may >> also note the change in polymer mushrooming at the tops of features. >> Definitely, use low keV SEM imaging. >> >> It?s been our experience that oxide will not burn off during furnace >> oxidation; rather, O2 will diffuse through the remaining carbonized layer. >> >> Wet process alternative: EKC 265 from DuPont. http://www.dupont.com/ >> content/dam/dupont/products-and-services/electronic-and- >> electrical-materials/documents/ekc/EKC265.pdf >> >> Best of Luck, >> Noah >> >> *Noah Clay* >> *Director, Quattrone Nanofabrication Facility* >> *School of Engineering & Applied Science* >> *University of Pennsylvania* >> *Philadelphia, PA* >> >> *(215) 898-9308 <%28215%29%20898-9308>* >> *nclay at upenn.edu * >> LinkedIn Profile >> >> >> On Aug 3, 2016, at 2:34 PM, Aaron Hryciw wrote: >> >> Dear colleagues, >> >> Our facility recently installed a Tystar wet/dry oxidation tube, which >> has so far only been used to oxidise virgin Si wafers. Recently, one of >> our users has requested to do a 400?1000 nm wet oxidation at 1100 ?C on >> DRIE (Bosch) etched Si wafers which still have DRIE passivation polymer on >> them, for the dual purpose of removing the polymer and growing an oxide. >> >> Given the tool's excellent performance so far, I am concerned with the >> possibility of contaminating the (atmospheric) tube as the polymer is >> burned off, adversely affecting subsequent processes. My priority is to >> protect the integrity of the tool, but I also do not want to be needlessly >> restrictive if the presence of the polymer does not in fact pose any >> problem. We are a multi-user facility, with academic and industrial users >> who primarily do MEMS and microfluidics work (i.e., no CMOS processing). >> >> My initial thought would be to have this user remove the polymer first >> using a dry etch (O? plasma), only oxidising the wafers once it has been >> verified that the polymer is no longer present. >> >> Any advice on this matter would be greatly appreciated. Many thanks. >> >> Cheers, >> >> ? Aaron Hryciw >> >> >> >> Aaron Hryciw, PhD, PEng >> Fabrication Group Manager >> University of Alberta - nanoFAB >> W1-060 ECERF Building >> 9107 - 116 Street >> Edmonton, Alberta >> Canada T6G 2V4 Ph: 780-940-7938 >> www.nanofab.ualberta.ca >> >> _______________________________________________ >> labnetwork mailing list >> labnetwork at mtl.mit.edu >> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork >> >> >> >> _______________________________________________ >> labnetwork mailing list >> labnetwork at mtl.mit.edu >> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork >> >> > -------------- next part -------------- An HTML attachment was scrubbed... URL: From jfraser96 at byu.edu Wed Aug 10 18:11:34 2016 From: jfraser96 at byu.edu (Jim Fraser) Date: Wed, 10 Aug 2016 22:11:34 +0000 Subject: [labnetwork] Anyone using Perkin Elmer Micralign 240 or 340? Message-ID: <8eff6b0f198a49e597e019618dba44c4@MB10.byu.local> Is anyone using the old Perkin Elmer Micralign 240 or 340 systems? Thanks, Jim Fraser Integrated Microfabrication Lab Manager Brigham Young University 801-422-4344 -------------- next part -------------- An HTML attachment was scrubbed... URL: From p.kollensperger at ntnu.no Mon Aug 22 04:15:14 2016 From: p.kollensperger at ntnu.no (=?utf-8?B?UGV0ZXIgS8O2bGxlbnNwZXJnZXI=?=) Date: Mon, 22 Aug 2016 08:15:14 +0000 Subject: [labnetwork] Flooded ICP-RIE Message-ID: Dear Labnetwork Members, I?ve just recently started as process group leader here at NTNU NanoLab in Trondheim, Norway, but have been following the discussions on the mailing list with interest. I now have a question of my own and would very much appreciate any thoughts or advice you may be able to share. We are currently having preventive maintenance of our ICP-RIE systems carried out by the manufacturer. Unfortunately one of their engineers mixed up the helium backing line with the coolant line from the chiller unit. When the chiller was switched on, it pumped ca. 1-2 litres of a water and Hexid heat transfer fluid into the main chamber and loadlock. The system was not under vacuum at the time. The RIE section was completely filled with water and the main chamber also had water in it. The lifting pins assembly including bellows, the CM gauge the pirani gauge as well as the He line were completely submerged. The engineers realised what was going on after the chiller gave a low level alarm and they saw the coolant level continue to drop. They stopped the chiller, opened the chamber, and mopped up the liquid with PIG pads and cleanroom cloths where accessible. They then switched on both the roughing and loadlock pump. When the loadlock pump was switched on it died immediately. They realised that water vapour shouldn?t enter the scrubber and removed the exhaust line from the scrubber, but it is likely that some water vapour ++ entered the scrubber as steam was coming out of the exhaust. This means the entire system has been exposed to water/coolant mix, possibly with exception of the turbo pump, although there may have been some backstreaming from the main roughing pump. Pumping the chamber from Thursday to the following Tuesday improved the vacuum from 1x10e-2 Torr with a leakup rate of 20 mTorr/min to 5x10e-5 Torr with a leakup rate of 5 mTorr/min. Specification is less than 1 mTorr/min. Needless to say this causes a number of issues, some of which we may not even have thought to consider. In our view, the issues can be divided into immediate Health and Safety concerns, and more long term concerns regarding the performance of an ICP RIE unit that has been flooded 1. Regarding H&S issues we?re concerned about are the mixing of SF6, CHF3, Cl2 and BCl3 with water in the scrubber. We will send the scrubber for a refill and check. We have contacted the vendor of the scrubber, his main concern is clogging of the granulate. Is there anything else we should pay attention to? 2. Can a chamber be sufficiently reconditioned by in situ by cleaning, baking and running plasmas or will the coolant inside necessitate a more complete disassembly and clean? Has anyone had a similar problem and how did you proceed? How would you suggest we ask the manufacturer to verify that there are no long-term detrimental effects on the instrument, the pumps or the processes run on the instrument? I'd appreciate any thoughts you may have surrounding this issue. Kind regards, Peter ?????????????????????????????????????????????? Dr. Peter A. K?llensperger NTNU NanoLab Sem S?landsvei 14 Norwegian University of Science and Technology (NTNU) 7491 Trondheim -------------- next part -------------- An HTML attachment was scrubbed... URL: From tbritton at criticalsystemsinc.com Mon Aug 22 11:48:49 2016 From: tbritton at criticalsystemsinc.com (Tom Britton) Date: Mon, 22 Aug 2016 15:48:49 +0000 Subject: [labnetwork] Flooded ICP-RIE In-Reply-To: References: Message-ID: Hello Peter, I am so sorry for your situation. I hope you are able to recover quickly. I am be able to help with regards to the scrubber question. Can I ask what is the model of scrubber and what is the media(s) that is in it? By knowing this we should be able to assess what damage may have been done to the scrubber. If you need a replacement canister, we could help you with that as well. Best of luck sir. Tom Tom Britton Director of Sales Critical Systems, Inc. Direct: 208-890-1417 Office: 877-572-5515 www.CriticalSystemsInc.com [logo for email signature png] From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Peter K?llensperger Sent: Monday, August 22, 2016 2:15 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Flooded ICP-RIE Dear Labnetwork Members, I?ve just recently started as process group leader here at NTNU NanoLab in Trondheim, Norway, but have been following the discussions on the mailing list with interest. I now have a question of my own and would very much appreciate any thoughts or advice you may be able to share. We are currently having preventive maintenance of our ICP-RIE systems carried out by the manufacturer. Unfortunately one of their engineers mixed up the helium backing line with the coolant line from the chiller unit. When the chiller was switched on, it pumped ca. 1-2 litres of a water and Hexid heat transfer fluid into the main chamber and loadlock. The system was not under vacuum at the time. The RIE section was completely filled with water and the main chamber also had water in it. The lifting pins assembly including bellows, the CM gauge the pirani gauge as well as the He line were completely submerged. The engineers realised what was going on after the chiller gave a low level alarm and they saw the coolant level continue to drop. They stopped the chiller, opened the chamber, and mopped up the liquid with PIG pads and cleanroom cloths where accessible. They then switched on both the roughing and loadlock pump. When the loadlock pump was switched on it died immediately. They realised that water vapour shouldn?t enter the scrubber and removed the exhaust line from the scrubber, but it is likely that some water vapour ++ entered the scrubber as steam was coming out of the exhaust. This means the entire system has been exposed to water/coolant mix, possibly with exception of the turbo pump, although there may have been some backstreaming from the main roughing pump. Pumping the chamber from Thursday to the following Tuesday improved the vacuum from 1x10e-2 Torr with a leakup rate of 20 mTorr/min to 5x10e-5 Torr with a leakup rate of 5 mTorr/min. Specification is less than 1 mTorr/min. Needless to say this causes a number of issues, some of which we may not even have thought to consider. In our view, the issues can be divided into immediate Health and Safety concerns, and more long term concerns regarding the performance of an ICP RIE unit that has been flooded 1. Regarding H&S issues we?re concerned about are the mixing of SF6, CHF3, Cl2 and BCl3 with water in the scrubber. We will send the scrubber for a refill and check. We have contacted the vendor of the scrubber, his main concern is clogging of the granulate. Is there anything else we should pay attention to? 2. Can a chamber be sufficiently reconditioned by in situ by cleaning, baking and running plasmas or will the coolant inside necessitate a more complete disassembly and clean? Has anyone had a similar problem and how did you proceed? How would you suggest we ask the manufacturer to verify that there are no long-term detrimental effects on the instrument, the pumps or the processes run on the instrument? I'd appreciate any thoughts you may have surrounding this issue. Kind regards, Peter ?????????????????????????????????????????????? Dr. Peter A. K?llensperger NTNU NanoLab Sem S?landsvei 14 Norwegian University of Science and Technology (NTNU) 7491 Trondheim -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 9501 bytes Desc: image001.png URL: From rmorrison at draper.com Mon Aug 22 13:21:58 2016 From: rmorrison at draper.com (Morrison, Richard H., Jr.) Date: Mon, 22 Aug 2016 17:21:58 +0000 Subject: [labnetwork] Flooded ICP-RIE In-Reply-To: References: Message-ID: The same thing happened at Draper the FSE sent coolant into the backside cooling line after a PM. It was pumping down and the pressure rose and we shut it down before the liquid entered the vacuum lines ect, we do not have a scrubber. The cleanup was very stressful, the entire ESC chuck was removed and cleaned with solvents and the chamber wiped down many times over several days. We monitored the cleaning by running wafers with a O2 plasma process. We monitored for any liquid on the wafer backside and residue on the chamber walls. If I remember it took us a week of running and cleaning to return the chamber back to normal. I think we changed out the esc chuck to be on the safe side. We were lucky in that it did not get into the vacuum system. Rick Draper Principal Member of the Technical Staff 555 Technology Square Cambridge Ma, 02139-3563 www.draper.com rmorrison at draper.com W 617-258-3420 C 508-930-3461 From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Peter K?llensperger Sent: Monday, August 22, 2016 4:15 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Flooded ICP-RIE Dear Labnetwork Members, I?ve just recently started as process group leader here at NTNU NanoLab in Trondheim, Norway, but have been following the discussions on the mailing list with interest. I now have a question of my own and would very much appreciate any thoughts or advice you may be able to share. We are currently having preventive maintenance of our ICP-RIE systems carried out by the manufacturer. Unfortunately one of their engineers mixed up the helium backing line with the coolant line from the chiller unit. When the chiller was switched on, it pumped ca. 1-2 litres of a water and Hexid heat transfer fluid into the main chamber and loadlock. The system was not under vacuum at the time. The RIE section was completely filled with water and the main chamber also had water in it. The lifting pins assembly including bellows, the CM gauge the pirani gauge as well as the He line were completely submerged. The engineers realised what was going on after the chiller gave a low level alarm and they saw the coolant level continue to drop. They stopped the chiller, opened the chamber, and mopped up the liquid with PIG pads and cleanroom cloths where accessible. They then switched on both the roughing and loadlock pump. When the loadlock pump was switched on it died immediately. They realised that water vapour shouldn?t enter the scrubber and removed the exhaust line from the scrubber, but it is likely that some water vapour ++ entered the scrubber as steam was coming out of the exhaust. This means the entire system has been exposed to water/coolant mix, possibly with exception of the turbo pump, although there may have been some backstreaming from the main roughing pump. Pumping the chamber from Thursday to the following Tuesday improved the vacuum from 1x10e-2 Torr with a leakup rate of 20 mTorr/min to 5x10e-5 Torr with a leakup rate of 5 mTorr/min. Specification is less than 1 mTorr/min. Needless to say this causes a number of issues, some of which we may not even have thought to consider. In our view, the issues can be divided into immediate Health and Safety concerns, and more long term concerns regarding the performance of an ICP RIE unit that has been flooded 1. Regarding H&S issues we?re concerned about are the mixing of SF6, CHF3, Cl2 and BCl3 with water in the scrubber. We will send the scrubber for a refill and check. We have contacted the vendor of the scrubber, his main concern is clogging of the granulate. Is there anything else we should pay attention to? 2. Can a chamber be sufficiently reconditioned by in situ by cleaning, baking and running plasmas or will the coolant inside necessitate a more complete disassembly and clean? Has anyone had a similar problem and how did you proceed? How would you suggest we ask the manufacturer to verify that there are no long-term detrimental effects on the instrument, the pumps or the processes run on the instrument? I'd appreciate any thoughts you may have surrounding this issue. Kind regards, Peter ?????????????????????????????????????????????? Dr. Peter A. K?llensperger NTNU NanoLab Sem S?landsvei 14 Norwegian University of Science and Technology (NTNU) 7491 Trondheim ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: From spaolini at cns.fas.harvard.edu Mon Aug 22 16:52:44 2016 From: spaolini at cns.fas.harvard.edu (Paolini, Steven) Date: Mon, 22 Aug 2016 20:52:44 +0000 Subject: [labnetwork] Flooded ICP-RIE In-Reply-To: References: Message-ID: Peter, Sorry for the bad luck. I think your loadlock pump hydraulically locked. in other words, it swallowed enough water that when it went to compress the inlet ?gas?, there was no compression because of the fluid. To be honest, it?s probable trashed unless it?s a rotary vane pump. I tend to agree with Tom Britton and Rich Morrison?s responses in that you have a major clean up on your hands and it must be done meticulously. I would give the inside of the lift pin bellows special attention since the folds can hold a lot of contaminants. It?s probably best to remove all components that have been wetted and solvent clean them before re-assembly. Best of luck, Steve Paolini Equipment Dood Harvard University Center for Nanoscale Systems. From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Peter K?llensperger Sent: Monday, August 22, 2016 4:15 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Flooded ICP-RIE Dear Labnetwork Members, I?ve just recently started as process group leader here at NTNU NanoLab in Trondheim, Norway, but have been following the discussions on the mailing list with interest. I now have a question of my own and would very much appreciate any thoughts or advice you may be able to share. We are currently having preventive maintenance of our ICP-RIE systems carried out by the manufacturer. Unfortunately one of their engineers mixed up the helium backing line with the coolant line from the chiller unit. When the chiller was switched on, it pumped ca. 1-2 litres of a water and Hexid heat transfer fluid into the main chamber and loadlock. The system was not under vacuum at the time. The RIE section was completely filled with water and the main chamber also had water in it. The lifting pins assembly including bellows, the CM gauge the pirani gauge as well as the He line were completely submerged. The engineers realised what was going on after the chiller gave a low level alarm and they saw the coolant level continue to drop. They stopped the chiller, opened the chamber, and mopped up the liquid with PIG pads and cleanroom cloths where accessible. They then switched on both the roughing and loadlock pump. When the loadlock pump was switched on it died immediately. They realised that water vapour shouldn?t enter the scrubber and removed the exhaust line from the scrubber, but it is likely that some water vapour ++ entered the scrubber as steam was coming out of the exhaust. This means the entire system has been exposed to water/coolant mix, possibly with exception of the turbo pump, although there may have been some backstreaming from the main roughing pump. Pumping the chamber from Thursday to the following Tuesday improved the vacuum from 1x10e-2 Torr with a leakup rate of 20 mTorr/min to 5x10e-5 Torr with a leakup rate of 5 mTorr/min. Specification is less than 1 mTorr/min. Needless to say this causes a number of issues, some of which we may not even have thought to consider. In our view, the issues can be divided into immediate Health and Safety concerns, and more long term concerns regarding the performance of an ICP RIE unit that has been flooded 1. Regarding H&S issues we?re concerned about are the mixing of SF6, CHF3, Cl2 and BCl3 with water in the scrubber. We will send the scrubber for a refill and check. We have contacted the vendor of the scrubber, his main concern is clogging of the granulate. Is there anything else we should pay attention to? 2. Can a chamber be sufficiently reconditioned by in situ by cleaning, baking and running plasmas or will the coolant inside necessitate a more complete disassembly and clean? Has anyone had a similar problem and how did you proceed? How would you suggest we ask the manufacturer to verify that there are no long-term detrimental effects on the instrument, the pumps or the processes run on the instrument? I'd appreciate any thoughts you may have surrounding this issue. Kind regards, Peter ?????????????????????????????????????????????? Dr. Peter A. K?llensperger NTNU NanoLab Sem S?landsvei 14 Norwegian University of Science and Technology (NTNU) 7491 Trondheim -------------- next part -------------- An HTML attachment was scrubbed... URL: From M.G.Perry at soton.ac.uk Tue Aug 23 03:12:34 2016 From: M.G.Perry at soton.ac.uk (Perry M.G.) Date: Tue, 23 Aug 2016 07:12:34 +0000 Subject: [labnetwork] Flooded ICP-RIE In-Reply-To: References: Message-ID: Hello Peter, I agree with Richard about the bellows assembly. That?s one of the real traps for contaminants. Having used Hexid for many years, I?m aware of the residues it can leave. It?s made of propylene glycol, water and fluorocin (for colour). It will coat everything in greenish/white crust. I?d say you are looking at a full wipe down, water clean of all surfaces followed by solvent clean. Bellows will probably be best replaced as to clean it properly will probably weaken the edge welds. We have done a full decon of one of these systems here recently and used STS in fife for the cleanup. All chamber components were cleaned for reasonable price and they are one of the leaders in this field in Europe. http://sts.gb.net/ All the best for the clean up! Mike From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Peter K?llensperger Sent: 22 August 2016 09:15 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Flooded ICP-RIE Dear Labnetwork Members, I?ve just recently started as process group leader here at NTNU NanoLab in Trondheim, Norway, but have been following the discussions on the mailing list with interest. I now have a question of my own and would very much appreciate any thoughts or advice you may be able to share. We are currently having preventive maintenance of our ICP-RIE systems carried out by the manufacturer. Unfortunately one of their engineers mixed up the helium backing line with the coolant line from the chiller unit. When the chiller was switched on, it pumped ca. 1-2 litres of a water and Hexid heat transfer fluid into the main chamber and loadlock. The system was not under vacuum at the time. The RIE section was completely filled with water and the main chamber also had water in it. The lifting pins assembly including bellows, the CM gauge the pirani gauge as well as the He line were completely submerged. The engineers realised what was going on after the chiller gave a low level alarm and they saw the coolant level continue to drop. They stopped the chiller, opened the chamber, and mopped up the liquid with PIG pads and cleanroom cloths where accessible. They then switched on both the roughing and loadlock pump. When the loadlock pump was switched on it died immediately. They realised that water vapour shouldn?t enter the scrubber and removed the exhaust line from the scrubber, but it is likely that some water vapour ++ entered the scrubber as steam was coming out of the exhaust. This means the entire system has been exposed to water/coolant mix, possibly with exception of the turbo pump, although there may have been some backstreaming from the main roughing pump. Pumping the chamber from Thursday to the following Tuesday improved the vacuum from 1x10e-2 Torr with a leakup rate of 20 mTorr/min to 5x10e-5 Torr with a leakup rate of 5 mTorr/min. Specification is less than 1 mTorr/min. Needless to say this causes a number of issues, some of which we may not even have thought to consider. In our view, the issues can be divided into immediate Health and Safety concerns, and more long term concerns regarding the performance of an ICP RIE unit that has been flooded 1. Regarding H&S issues we?re concerned about are the mixing of SF6, CHF3, Cl2 and BCl3 with water in the scrubber. We will send the scrubber for a refill and check. We have contacted the vendor of the scrubber, his main concern is clogging of the granulate. Is there anything else we should pay attention to? 2. Can a chamber be sufficiently reconditioned by in situ by cleaning, baking and running plasmas or will the coolant inside necessitate a more complete disassembly and clean? Has anyone had a similar problem and how did you proceed? How would you suggest we ask the manufacturer to verify that there are no long-term detrimental effects on the instrument, the pumps or the processes run on the instrument? I'd appreciate any thoughts you may have surrounding this issue. Kind regards, Peter ?????????????????????????????????????????????? Dr. Peter A. K?llensperger NTNU NanoLab Sem S?landsvei 14 Norwegian University of Science and Technology (NTNU) 7491 Trondheim -------------- next part -------------- An HTML attachment was scrubbed... URL: From vamsinittala at gmail.com Tue Aug 23 03:42:00 2016 From: vamsinittala at gmail.com (N P VAMSI KRISHNA) Date: Tue, 23 Aug 2016 13:12:00 +0530 Subject: [labnetwork] Flooded ICP-RIE In-Reply-To: References: Message-ID: ?Dear Peter, We had a similar issue in one of the our tool AMC's long back. A Field Service guy messed up the He and the Chiller fluid line, and a considerable amount of chiller fluid (Julabo Chiller) ?went in the chamber. I do agree with the Steve Paolini, Tom Britton and Rich Morrison?s inputs. I remember we changed all the o-rings which went in contact with the fluid. Removed the platen and load lock bellows. Did extensive wet clean of all the parts and bellows. Flushed all the contaminated lines and chamber with huge amount of N2. Chamber liners we did a mechanical scrub. Some of the metal components we baked them in an oven for some time before we reinstall them. Took almost a week for regular vacuum and LUR. Did long O2 plasma cleans and checked all the recipes for deviation in plasma color or etch rates and profiles. Best of luck, Thanks & best regards, vamsi On Mon, Aug 22, 2016 at 1:45 PM, Peter K?llensperger < p.kollensperger at ntnu.no> wrote: > Dear Labnetwork Members, > > > > I?ve just recently started as process group leader here at NTNU NanoLab in > Trondheim, Norway, but have been following the discussions on the mailing > list with interest. > > > > I now have a question of my own and would very much appreciate any > thoughts or advice you may be able to share. > > > > We are currently having preventive maintenance of our ICP-RIE systems > carried out by the manufacturer. > > Unfortunately one of their engineers mixed up the helium backing line with > the coolant line from the chiller unit. When the chiller was switched on, > it pumped ca. 1-2 litres of a water and Hexid heat transfer fluid into the > main chamber and loadlock. The system was not under vacuum at the time. The > RIE section was completely filled with water and the main chamber also had > water in it. The lifting pins assembly including bellows, the CM gauge the > pirani gauge as well as the He line were completely submerged. > > The engineers realised what was going on after the chiller gave a low > level alarm and they saw the coolant level continue to drop. They stopped > the chiller, opened the chamber, and mopped up the liquid with PIG pads and > cleanroom cloths where accessible. They then switched on both the roughing > and loadlock pump. > > When the loadlock pump was switched on it died immediately. They realised > that water vapour shouldn?t enter the scrubber and removed the exhaust line > from the scrubber, but it is likely that some water vapour ++ entered the > scrubber as steam was coming out of the exhaust. This means the entire > system has been exposed to water/coolant mix, possibly with exception of > the turbo pump, although there may have been some backstreaming from the > main roughing pump. > > > > Pumping the chamber from Thursday to the following Tuesday improved the > vacuum from 1x10e-2 Torr with a leakup rate of 20 mTorr/min to 5x10e-5 Torr > with a leakup rate of 5 mTorr/min. Specification is less than 1 mTorr/min. > > > > Needless to say this causes a number of issues, some of which we may not > even have thought to consider. > > > > In our view, the issues can be divided into immediate Health and Safety > concerns, and more long term concerns regarding the performance of an ICP > RIE unit that has been flooded > > > > 1. Regarding H&S issues we?re concerned about are the mixing > of SF6, CHF3, Cl2 and BCl3 with water in the scrubber. > > We will send the scrubber for a refill and check. We have contacted the > vendor of the scrubber, his main concern is clogging of the granulate. Is > there anything else we should pay attention to? > > > > 2. Can a chamber be sufficiently reconditioned by in situ by > cleaning, baking and running plasmas or will the coolant inside necessitate > a more complete disassembly and clean? > > Has anyone had a similar problem and how did you proceed? How would you > suggest we ask the manufacturer to verify that there are no long-term > detrimental effects on the instrument, the pumps or the processes run on > the instrument? > > > > > > I'd appreciate any thoughts you may have surrounding this issue. > > > Kind regards, > > > > Peter > > > > ?????????????????????????????????????????????? > > Dr. Peter A. K?llensperger > NTNU NanoLab > Sem S?landsvei 14 > Norwegian University of Science and Technology (NTNU) > 7491 Trondheim > > > > > > > > > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork > > -- -- Thanks & Best Regards, ----------------- *N.P.Vamsi Krishna* ?National Nano Fabrication Centre, Center for Nano Science and Engineering (CeNSE), Indian Institute of Science(IISc), Bangalore. INDIA-560012 ?Educating the mind without educating the heart is no education at all.? -Aristotle -------------- next part -------------- An HTML attachment was scrubbed... URL: From rc at danchip.dtu.dk Tue Aug 23 03:58:25 2016 From: rc at danchip.dtu.dk (Roy Cork) Date: Tue, 23 Aug 2016 07:58:25 +0000 Subject: [labnetwork] Flooded ICP-RIE In-Reply-To: References: Message-ID: <7809901EBDB48748B6E15D4C18DD879503789285@ait-pex02mbx05.win.dtu.dk> Hi Peter, Wow what a mess. I guess if the fluid is Hex ID it?s probably an Oxford ICP, what are the bakeout possibilities with that? On our SPTS ICP?s we can heat the sidewalls (approx. 70deg) and lid (50deg) and of course the electrode but that?s it (not enough I guess to evaporate the coolant). Down in the lower bellows (slice lift and electrode area) is not that hot and is away from the plasma, it is always the place where we get most polymer dep so I guess that indicates it?s the coldest part of the chamber. Reading your post took me back a few years when I worked as an SPTS service engineer. I was working on an oxide etcher (AOE) screwing an electro static chuck to a copper electrode via a SS clamping ring. The screws sent were 12mm long instead of 10mm and where long enough to perforate the cooling cavity. When the chamber was closed Sytherm XLT oil was able to enter the chamber via the hole in the vented screws and drip down to the bottom section (the bellows were particularly bad). Of course we weren?t able to pump the chamber down and it wasn?t obvious when we opened the chamber as there wasn?t a ?pool? of oil ?just? a coating (the leak was a slow drip). We were able to recover the system by doing the following: ? Manually strip the tool down and clean all parts in isopropanol and ultra-sonic bath. Take care with the bellows if you do this as they are fragile and easily damaged. We were able to save the MAG 2000 turbo pump by removing it from the system completely and poured 2-3L of IPA directly through it. We then dried it as best we could and re-mounted it. ? Re-assemble the system and connect an RGA to the chamber. If you can try and obtain a reference RGA scan of a clean chamber ? Pump the system down manually and heat it up. Here we were lucky, because it was an oxide etcher we were able to reach approx. 150 degs. ? Leave it ? monitor the RGA scan (we could see the higher peaks which were characteristic of the oil) ? Leave it ? I think we pumped for around a week whilst it was hot) ? Eventually we were able to say the leak up rate and base pressure were good and the system became operational again If the manufacturer has created this problem during a paid service visit I think you should insist they perform the strip down and clean, RGA scans and also provide some kind of warranty on future failure. With regards the scrubber if it?s a CS Clean systems granulate system just close the inlet outlet valves, disconnect it and return it to FAB Detect maybe?? They can deal with it safely there. Be careful with the inlet and out pipes and where full breathing apparatus. If they are flexible bellows from the pump I would throw them out and replace them, be careful there is no liquid in the pipe when you remove it. Good luck, Best regards, Roy Cork DTU Danchip From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Paolini, Steven Sent: 22. august 2016 22:53 To: Peter K?llensperger; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Flooded ICP-RIE Peter, Sorry for the bad luck. I think your loadlock pump hydraulically locked. in other words, it swallowed enough water that when it went to compress the inlet ?gas?, there was no compression because of the fluid. To be honest, it?s probable trashed unless it?s a rotary vane pump. I tend to agree with Tom Britton and Rich Morrison?s responses in that you have a major clean up on your hands and it must be done meticulously. I would give the inside of the lift pin bellows special attention since the folds can hold a lot of contaminants. It?s probably best to remove all components that have been wetted and solvent clean them before re-assembly. Best of luck, Steve Paolini Equipment Dood Harvard University Center for Nanoscale Systems. From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Peter K?llensperger Sent: Monday, August 22, 2016 4:15 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Flooded ICP-RIE Dear Labnetwork Members, I?ve just recently started as process group leader here at NTNU NanoLab in Trondheim, Norway, but have been following the discussions on the mailing list with interest. I now have a question of my own and would very much appreciate any thoughts or advice you may be able to share. We are currently having preventive maintenance of our ICP-RIE systems carried out by the manufacturer. Unfortunately one of their engineers mixed up the helium backing line with the coolant line from the chiller unit. When the chiller was switched on, it pumped ca. 1-2 litres of a water and Hexid heat transfer fluid into the main chamber and loadlock. The system was not under vacuum at the time. The RIE section was completely filled with water and the main chamber also had water in it. The lifting pins assembly including bellows, the CM gauge the pirani gauge as well as the He line were completely submerged. The engineers realised what was going on after the chiller gave a low level alarm and they saw the coolant level continue to drop. They stopped the chiller, opened the chamber, and mopped up the liquid with PIG pads and cleanroom cloths where accessible. They then switched on both the roughing and loadlock pump. When the loadlock pump was switched on it died immediately. They realised that water vapour shouldn?t enter the scrubber and removed the exhaust line from the scrubber, but it is likely that some water vapour ++ entered the scrubber as steam was coming out of the exhaust. This means the entire system has been exposed to water/coolant mix, possibly with exception of the turbo pump, although there may have been some backstreaming from the main roughing pump. Pumping the chamber from Thursday to the following Tuesday improved the vacuum from 1x10e-2 Torr with a leakup rate of 20 mTorr/min to 5x10e-5 Torr with a leakup rate of 5 mTorr/min. Specification is less than 1 mTorr/min. Needless to say this causes a number of issues, some of which we may not even have thought to consider. In our view, the issues can be divided into immediate Health and Safety concerns, and more long term concerns regarding the performance of an ICP RIE unit that has been flooded 1. Regarding H&S issues we?re concerned about are the mixing of SF6, CHF3, Cl2 and BCl3 with water in the scrubber. We will send the scrubber for a refill and check. We have contacted the vendor of the scrubber, his main concern is clogging of the granulate. Is there anything else we should pay attention to? 2. Can a chamber be sufficiently reconditioned by in situ by cleaning, baking and running plasmas or will the coolant inside necessitate a more complete disassembly and clean? Has anyone had a similar problem and how did you proceed? How would you suggest we ask the manufacturer to verify that there are no long-term detrimental effects on the instrument, the pumps or the processes run on the instrument? I'd appreciate any thoughts you may have surrounding this issue. Kind regards, Peter ?????????????????????????????????????????????? Dr. Peter A. K?llensperger NTNU NanoLab Sem S?landsvei 14 Norwegian University of Science and Technology (NTNU) 7491 Trondheim -------------- next part -------------- An HTML attachment was scrubbed... URL: From lej at danchip.dtu.dk Tue Aug 23 08:27:49 2016 From: lej at danchip.dtu.dk (Leif Johansen) Date: Tue, 23 Aug 2016 12:27:49 +0000 Subject: [labnetwork] Flooded ICP-RIE In-Reply-To: References: Message-ID: <879AEF5002D70747B136D02BC86A9C980357B6FC@ait-pex02mbx05.win.dtu.dk> Hello Peter, Your mail brought back bad old memories. I once worked in a company where an ICP RIE chamber was flooded with silicone coolant oil, which leaked out from the cooled chuck and into the chamber. We were lucky that the oil leak was limited (less than half a liter). Luckily, the tool was under warranty, and the manufacturer cleaned the contamination with a combination of IPA, chamber heating and oxygen plasma. The chamber was at least partly disassembled for cleaning. I vividly remember standing with a rather big maglev turbo pump pouring IPA through it. In the end the manufacturer used a residual gas analyzer to prove that all contaminant had been removed. Best regards, Leif From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Peter K?llensperger Sent: 22. august 2016 10:15 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Flooded ICP-RIE Dear Labnetwork Members, I?ve just recently started as process group leader here at NTNU NanoLab in Trondheim, Norway, but have been following the discussions on the mailing list with interest. I now have a question of my own and would very much appreciate any thoughts or advice you may be able to share. We are currently having preventive maintenance of our ICP-RIE systems carried out by the manufacturer. Unfortunately one of their engineers mixed up the helium backing line with the coolant line from the chiller unit. When the chiller was switched on, it pumped ca. 1-2 litres of a water and Hexid heat transfer fluid into the main chamber and loadlock. The system was not under vacuum at the time. The RIE section was completely filled with water and the main chamber also had water in it. The lifting pins assembly including bellows, the CM gauge the pirani gauge as well as the He line were completely submerged. The engineers realised what was going on after the chiller gave a low level alarm and they saw the coolant level continue to drop. They stopped the chiller, opened the chamber, and mopped up the liquid with PIG pads and cleanroom cloths where accessible. They then switched on both the roughing and loadlock pump. When the loadlock pump was switched on it died immediately. They realised that water vapour shouldn?t enter the scrubber and removed the exhaust line from the scrubber, but it is likely that some water vapour ++ entered the scrubber as steam was coming out of the exhaust. This means the entire system has been exposed to water/coolant mix, possibly with exception of the turbo pump, although there may have been some backstreaming from the main roughing pump. Pumping the chamber from Thursday to the following Tuesday improved the vacuum from 1x10e-2 Torr with a leakup rate of 20 mTorr/min to 5x10e-5 Torr with a leakup rate of 5 mTorr/min. Specification is less than 1 mTorr/min. Needless to say this causes a number of issues, some of which we may not even have thought to consider. In our view, the issues can be divided into immediate Health and Safety concerns, and more long term concerns regarding the performance of an ICP RIE unit that has been flooded 1. Regarding H&S issues we?re concerned about are the mixing of SF6, CHF3, Cl2 and BCl3 with water in the scrubber. We will send the scrubber for a refill and check. We have contacted the vendor of the scrubber, his main concern is clogging of the granulate. Is there anything else we should pay attention to? 2. Can a chamber be sufficiently reconditioned by in situ by cleaning, baking and running plasmas or will the coolant inside necessitate a more complete disassembly and clean? Has anyone had a similar problem and how did you proceed? How would you suggest we ask the manufacturer to verify that there are no long-term detrimental effects on the instrument, the pumps or the processes run on the instrument? I'd appreciate any thoughts you may have surrounding this issue. Kind regards, Peter ?????????????????????????????????????????????? Dr. Peter A. K?llensperger NTNU NanoLab Sem S?landsvei 14 Norwegian University of Science and Technology (NTNU) 7491 Trondheim -------------- next part -------------- An HTML attachment was scrubbed... URL: From na2661 at columbia.edu Tue Aug 23 08:51:24 2016 From: na2661 at columbia.edu (Nava Ariel Sternberg) Date: Tue, 23 Aug 2016 08:51:24 -0400 Subject: [labnetwork] Heating of BCl3 lines Message-ID: Dear all, We have recently purchased a new Oxford Plasma Pro System100 Cobra RIE that we intend to use with Cl chemistry (III-V etc.). Oxford recommended heating the gas lines of BCl3. Does anyone have experience with it? We are low on $$$ right now. How necessary that is? What is the best way to do this? Any thought would be appreciated. Thanks! Nava Nava Ariel-Sternberg, Ph.D. Director of CNI Facilities Columbia University 530 W120th Street, NY 10027 Room 1015/MC 8903 Office: 212-854-9927 Cell: 201-562-7600 -------------- next part -------------- An HTML attachment was scrubbed... URL: From M.G.Perry at soton.ac.uk Tue Aug 23 09:05:29 2016 From: M.G.Perry at soton.ac.uk (Perry M.G.) Date: Tue, 23 Aug 2016 13:05:29 +0000 Subject: [labnetwork] Flooded ICP-RIE In-Reply-To: <7809901EBDB48748B6E15D4C18DD879503789285@ait-pex02mbx05.win.dtu.dk> References: <7809901EBDB48748B6E15D4C18DD879503789285@ait-pex02mbx05.win.dtu.dk> Message-ID: Hi again Peter, I think the routine to clean it is pretty consistent from everyone?.. If you have any issues with supplier not getting the clean up done to the spec of what?s suggested please say you?ve spoken with me and it may well help! Regards mike -------------- next part -------------- An HTML attachment was scrubbed... URL: From vito.logiudice at uwaterloo.ca Tue Aug 23 13:08:43 2016 From: vito.logiudice at uwaterloo.ca (Vito Logiudice) Date: Tue, 23 Aug 2016 17:08:43 +0000 Subject: [labnetwork] Heating of BCl3 lines In-Reply-To: References: Message-ID: <35A7132F-3C4F-48C9-AB19-766D298FEC54@connect.uwaterloo.ca> Hi Nava, I would definitely heat trace a BCl3 line as I would be concerned about the risk of condensation at any cold spots along the distribution network. I believe the initial cost of the heat trace & insulation would be cheap compared to the possible damage caused by condensing BCl3 inside the lines. I?m sure other, much more qualified people will be able to offer relevant insights on this particular point (perhaps our friends at Critical Systems ? Tom?). If it can help, I?ve attached a screenshot of the installation instructions that came with the heat trace we used for our dichlorosilane lines. If you do decide to go that route, I recommend the heat trace be kept in intimate contact with the gas line via the use of aluminum tape all along the line. One of our heat traces ended up failing because of gaps between the trace and the tubing. I think I learned of this possibility via the lab network where someone had used aluminum tape to minimize the risk of these gaps in their installation (I think it was John Shott from Stanford). If you search past posts you might come across my original posting and the related suggestions; it may have been back in early 2015 if memory serves correctly. We ended up using aluminum tape rated for 350F and subsequently insulated the entire heat traced line from gas cabinet to point of use. We?ve had no issues since then (thanks, John!). The second attachment is a photo of the insulated line when it first failed. The IR thermometer shows one of the locations (elbow) where the heat trace had failed since it had not been originally installed in intimate contact with the SS tubing at the elbow. Temperatures along the line were typically hovering at 20C but it was measured to be 31C at this particular elbow. The final attachment is a snapshot of the failed heat trace at this particular spot. Hope this helps. Best, Vito -- Vito Logiudice P.Eng. Director of Operations, Quantum NanoFab University of Waterloo Lazaridis QNC 1207 200 University Avenue West Waterloo, ON Canada N2L 3G1 Tel.: (519) 888-4567 ext. 38703 Email: vito.logiudice at uwaterloo.ca Website: https://fab.qnc.uwaterloo.ca From: > on behalf of Nava Ariel Sternberg > Date: Tuesday, August 23, 2016 at 8:51 AM To: "labnetwork at mtl.mit.edu" > Subject: [labnetwork] Heating of BCl3 lines Dear all, We have recently purchased a new Oxford Plasma Pro System100 Cobra RIE that we intend to use with Cl chemistry (III-V etc.). Oxford recommended heating the gas lines of BCl3. Does anyone have experience with it? We are low on $$$ right now. How necessary that is? What is the best way to do this? Any thought would be appreciated. Thanks! Nava Nava Ariel-Sternberg, Ph.D. Director of CNI Facilities Columbia University 530 W120th Street, NY 10027 Room 1015/MC 8903 Office: 212-854-9927 Cell: 201-562-7600 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Screen Shot 2016-08-23 at 12.41.03 PM.png Type: image/png Size: 996065 bytes Desc: Screen Shot 2016-08-23 at 12.41.03 PM.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: IMG_20150121_101032[1].jpg Type: image/jpeg Size: 96468 bytes Desc: IMG_20150121_101032[1].jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: IMG_20150218_173504[1][2].jpg Type: image/jpeg Size: 684105 bytes Desc: IMG_20150218_173504[1][2].jpg URL: From bob at eecs.berkeley.edu Tue Aug 23 13:12:37 2016 From: bob at eecs.berkeley.edu (Robert M. HAMILTON) Date: Tue, 23 Aug 2016 10:12:37 -0700 Subject: [labnetwork] Heating of BCl3 lines In-Reply-To: References: Message-ID: Nava Ariel, I recommend you do not heat (heat-trace) a BCl3 delivery line. Liquid BCL3 will then condense at any location along that line that is cooled and will pool as a liquid. I say this with decades of experience delivering BCl3 as an etch gas and as a dopant. There are several simple ways to deliver BCl3; the easiest being a low pressure or sub atmospheric pressure regulator. The vapor pressure of BCl3 at room temp is ~ 19.4 psia or about 4.7 psi gauge. Use a regulator to reduce this pressure by ~ 50% of cylinder pressure, for the delivery you are assured BCl3 will remain a gas everwhere along the delivery line and within the tool. This pressure is also low enough to preclude adiabetic expansion with an associated phase change across the orifice of a gas flow controller or mass flow controller. We have been able to deliver several hundred sccm's, to multiple etchers using this delivery scheme. Note, our typical BCL3 cylinder is a 15 lb supply kept in a ventilated gas cabinet. Air movement in the cabinet adds enough heat to keep the cylinder temperature relatively constant given our delivery rates (we the same scheme for SiCl4). The only cylinder gas issues I've seen in a research lab delivering a gas where the addition of heat was considered was at high NH3 flow rates. The cylinder temperature dramatically dropped at high flows thus reducing the available pressure and starving the line. Nitrous oxide is touted to have similar issues; however, our use rates are too small to be an issue. There's a caveat, however. We do not use outdoor storage our online cylinders and we live along a coast with moderated temperatures. A cold winter day might obviate the above approach. Regards, Bob Hamilton Robert Hamilton University of CA, Berkeley Marvell NanoLab Equipment Manager Rm 520 Sutardja Dai Hall, MC 1754 Berkeley, CA 94720 Phone 510-809-8618 (desk - preferred) Mobile 510-325-7557 (my personal mobile) E-mail preferred: bob at eecs.berkeley.edu http://nanolab.berkeley.edu/ On Tue, Aug 23, 2016 at 5:51 AM, Nava Ariel Sternberg wrote: > Dear all, > > We have recently purchased a new Oxford Plasma Pro System100 Cobra RIE > that we intend to use with Cl chemistry (III-V etc.). Oxford recommended > heating the gas lines of BCl3. Does anyone have experience with it? We are > low on $$$ right now. How necessary that is? What is the best way to do > this? > > Any thought would be appreciated. > > Thanks! > > Nava > > Nava Ariel-Sternberg, Ph.D. > Director of CNI Facilities > Columbia University > 530 W120th Street, NY 10027 > Room 1015/MC 8903 > Office: 212-854-9927 > Cell: 201-562-7600 > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork > > -------------- next part -------------- An HTML attachment was scrubbed... URL: From info at fabsurplus.com Tue Aug 23 09:32:37 2016 From: info at fabsurplus.com (Stephen Howe) Date: Tue, 23 Aug 2016 15:32:37 +0200 Subject: [labnetwork] Flooded ICP-RIE In-Reply-To: References: Message-ID: <1471959157.7503.11.camel@stephen-Q500A> Dear Peter, Not sure exactly which model you have, but I am a broker and I just bought an STS 320 PC R.I.E. from a lab here in Italy for re-sale. You might possibly be able to purchase it from me for spares use if you have the same model:- https://www.fabsurplus.com/sdi_catalog/salesItemDetails.do?id=79584 SDI ID: 79584 Manufacturer: STS Model: 320 PC Description: Reactive Ion Etcher Version: 200 mm Vintage: 01.06.1995 I recall we almost had the same kind of incident 25 years ago when I was working for Micromass in Manchester. A workman re-did our lab water supply and "helpfully" connected up the water to the house vac. and the house vac. to the water. But, luckily, my collegue double checked the connections before the workman opened the taps and averted the disaster before it occurred... Yours sincerely, Stephen Howe Company Owner SDI Fabsurplus Group +1 830 388 1071 (Mobile) Skype: Stephencshowe email: info at fabsurplus.com WWW.FABSURPLUS.COM On Mon, 2016-08-22 at 08:15 +0000, Peter K?llensperger wrote: > > > Dear Labnetwork Members, > > > > I?ve just recently started as process group leader here at NTNU > NanoLab in Trondheim, Norway, but have been following the discussions > on the mailing list with interest. > > > > I now have a question of my own and would very much appreciate any > thoughts or advice you may be able to share. > > > > We are currently having preventive maintenance of our ICP-RIE systems > carried out by the manufacturer. > > Unfortunately one of their engineers mixed up the helium backing line > with the coolant line from the chiller unit. When the chiller was > switched on, it pumped ca. 1-2 litres of a water and Hexid heat > transfer fluid into the main chamber and loadlock. The system was not > under vacuum at the time. The RIE section was completely filled with > water and the main chamber also had water in it. The lifting pins > assembly including bellows, the CM gauge the pirani gauge as well as > the He line were completely submerged. > > The engineers realised what was going on after the chiller gave a low > level alarm and they saw the coolant level continue to drop. They > stopped the chiller, opened the chamber, and mopped up the liquid with > PIG pads and cleanroom cloths where accessible. They then switched on > both the roughing and loadlock pump. > > When the loadlock pump was switched on it died immediately. They > realised that water vapour shouldn?t enter the scrubber and removed > the exhaust line from the scrubber, but it is likely that some water > vapour ++ entered the scrubber as steam was coming out of the exhaust. > This means the entire system has been exposed to water/coolant mix, > possibly with exception of the turbo pump, although there may have > been some backstreaming from the main roughing pump. > > > > Pumping the chamber from Thursday to the following Tuesday improved > the vacuum from 1x10e-2 Torr with a leakup rate of 20 mTorr/min to > 5x10e-5 Torr with a leakup rate of 5 mTorr/min. Specification is less > than 1 mTorr/min. > > > > Needless to say this causes a number of issues, some of which we may > not even have thought to consider. > > > > In our view, the issues can be divided into immediate Health and > Safety concerns, and more long term concerns regarding the performance > of an ICP RIE unit that has been flooded > > > > 1. Regarding H&S issues we?re concerned about are the mixing > of SF6, CHF3, Cl2 and BCl3 with water in the scrubber. > > We will send the scrubber for a refill and check. We have contacted > the vendor of the scrubber, his main concern is clogging of the > granulate. Is there anything else we should pay attention to? > > > > 2. Can a chamber be sufficiently reconditioned by in situ by > cleaning, baking and running plasmas or will the coolant inside > necessitate a more complete disassembly and clean? > > Has anyone had a similar problem and how did you proceed? How would > you suggest we ask the manufacturer to verify that there are no > long-term detrimental effects on the instrument, the pumps or the > processes run on the instrument? > > > > > > I'd appreciate any thoughts you may have surrounding this issue. > > > Kind regards, > > > > Peter > > > > > > > > ?????????????????????????????????????????????? > > > Dr. Peter A. K?llensperger > NTNU NanoLab > Sem S?landsvei 14 > Norwegian University of Science and Technology (NTNU) > 7491 Trondheim > > > > > > > > > > > > > > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork From reynolds at ece.ucsb.edu Tue Aug 23 18:51:47 2016 From: reynolds at ece.ucsb.edu (Tom Reynolds) Date: Tue, 23 Aug 2016 15:51:47 -0700 Subject: [labnetwork] Heating of BCl3 lines In-Reply-To: References: Message-ID: <01b201d1fd90$ed8b91c0$c8a2b540$@ece.ucsb.edu> Hi Nava, I completely agree with Bob?s comments. We do the same at UCSB. We have a negative pressure regulator and are still capable of supplying the low sccm requirements of multiple systems. Cylinder temp will make a difference as our gas rooms are not conditioned, but we are in CA so it is not drastic climate change. If your cabinet is located behind the tool you should have no problem with this technique. I would have a quality two stage reg, set it as low a pressure (+10-20%) as possible to meet your tool requirements and make sure no one readjusts after that. It will be much simpler and we have not had an issue since this was implemented in more than 10 years. Thanks, Tom -------------------------------------------------------------- Tom Reynolds, Lab Manager UCSB Nanofabrication Facility Electrical and Computer Engineering Dept. Engineering Science Bldg #225, Room 1109E Santa Barbara, CA 93106 805-893-3918 x215 office 805-451-3979 cell 805-893-3918 fax reynolds at ece.ucsb.edu From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Robert M. HAMILTON Sent: Tuesday, August 23, 2016 10:13 AM To: Nava Ariel Sternberg Cc: Labnetwork Subject: Re: [labnetwork] Heating of BCl3 lines Nava Ariel, I recommend you do not heat (heat-trace) a BCl3 delivery line. Liquid BCL3 will then condense at any location along that line that is cooled and will pool as a liquid. I say this with decades of experience delivering BCl3 as an etch gas and as a dopant. There are several simple ways to deliver BCl3; the easiest being a low pressure or sub atmospheric pressure regulator. The vapor pressure of BCl3 at room temp is ~ 19.4 psia or about 4.7 psi gauge. Use a regulator to reduce this pressure by ~ 50% of cylinder pressure, for the delivery you are assured BCl3 will remain a gas everwhere along the delivery line and within the tool. This pressure is also low enough to preclude adiabetic expansion with an associated phase change across the orifice of a gas flow controller or mass flow controller. We have been able to deliver several hundred sccm's, to multiple etchers using this delivery scheme. Note, our typical BCL3 cylinder is a 15 lb supply kept in a ventilated gas cabinet. Air movement in the cabinet adds enough heat to keep the cylinder temperature relatively constant given our delivery rates (we the same scheme for SiCl4). The only cylinder gas issues I've seen in a research lab delivering a gas where the addition of heat was considered was at high NH3 flow rates. The cylinder temperature dramatically dropped at high flows thus reducing the available pressure and starving the line. Nitrous oxide is touted to have similar issues; however, our use rates are too small to be an issue. There's a caveat, however. We do not use outdoor storage our online cylinders and we live along a coast with moderated temperatures. A cold winter day might obviate the above approach. Regards, Bob Hamilton Robert Hamilton University of CA, Berkeley Marvell NanoLab Equipment Manager Rm 520 Sutardja Dai Hall, MC 1754 Berkeley, CA 94720 Phone 510-809-8618 (desk - preferred) Mobile 510-325-7557 (my personal mobile) E-mail preferred: bob at eecs.berkeley.edu http://nanolab.berkeley.edu/ On Tue, Aug 23, 2016 at 5:51 AM, Nava Ariel Sternberg > wrote: Dear all, We have recently purchased a new Oxford Plasma Pro System100 Cobra RIE that we intend to use with Cl chemistry (III-V etc.). Oxford recommended heating the gas lines of BCl3. Does anyone have experience with it? We are low on $$$ right now. How necessary that is? What is the best way to do this? Any thought would be appreciated. Thanks! Nava Nava Ariel-Sternberg, Ph.D. Director of CNI Facilities Columbia University 530 W120th Street, NY 10027 Room 1015/MC 8903 Office: 212-854-9927 Cell: 201-562-7600 _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From dwolff at protononsite.com Fri Aug 26 16:36:05 2016 From: dwolff at protononsite.com (David Wolff at Proton OnSite) Date: Fri, 26 Aug 2016 20:36:05 +0000 Subject: [labnetwork] Valuable information from FM Global Message-ID: Ran across several valuable data sheets on the FM Global site, including on silane, cleanrooms, gas and vapor detection systems, and various types of fire suppression systems. Lots of good advice from the insurer's point of view - worth a look. See - www.fmglobal.com/research-and-resources/fm-global-data-sheets Dave Wolff - Regional Manager - Proton OnSite - 860-604-3282 - dave.wolff at protononsite.com - www.protononsite.com All the hydrogen you need; pure, dry and at the pressure required; at an attractive and predictable price; without the need for hydrogen inventory. -------------- next part -------------- An HTML attachment was scrubbed... URL: From mhofheins at unm.edu Tue Aug 30 14:29:40 2016 From: mhofheins at unm.edu (Mark Hofheins) Date: Tue, 30 Aug 2016 18:29:40 +0000 Subject: [labnetwork] Kokusai 8" diffusion furnace Message-ID: Does Anyone know what a Kokusai Vertron DJ-802V 8" furnace value is? Mark -------------- next part -------------- An HTML attachment was scrubbed... URL: From khbeis at uw.edu Tue Aug 30 20:37:33 2016 From: khbeis at uw.edu (Michael Khbeis) Date: Tue, 30 Aug 2016 17:37:33 -0700 Subject: [labnetwork] MDA System 16 service Message-ID: Dear Colleagues We are replacing our MDA system 16 in the next 6-8 weeks and are having reoccurring glitches where the MDA loses track of our hydrides monitoring module. This of course triggers a fault in our HPM panel. Does anyone have a point of contact for parts/repair of these legacy systems? We need to limp along for just a few more weeks. Gratefully, Dr. Michael Khbeis Washington Nanofab Facility University of Washington Fluke Hall, Box 352143 (O) 206.543.5101 (C) 443.254.5192 khbeis at uw.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: