[labnetwork] Reactive sputtering for AlN and TiN

[Guo, Jing]

Hi All,

We have a UHV sputtering system. Some users want to use reactive sputtering process to coat AlN and TiN (Al/Ti target with N2 using RF bias on substrate). Right now the deposited film did not show good quality. It also generated tons of flakes inside the gas chimney.
They want to try other conditions at a higher power. AJA warned the maximum power can not be over 240 W in our system. 
Does anyone have experience on these sputtering process? What is the sputtering conditions to get a good Nitride film? How about the pressure, power, flow rate of N2?

Thanks a lot. 



Best Regards,

Jing


Nanofabrication Facility
University of Houston
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NANOFABRICATION FACILITY
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