From lrehn at tamu.edu  Mon May  2 17:55:45 2016
From: lrehn at tamu.edu (Rehn, Larry A)
Date: Mon, 2 May 2016 21:55:45 +0000
Subject: [labnetwork] Staff Position - EBL Staff Scientist
Message-ID: <956cea059d6a4791a8fc0dea0d728f81@exch-2p-mbx-w3.ads.tamu.edu>

Colleagues:

The Texas A&M Nanofabrication Facility is looking to hire an Associate Research Scientist to focus on operation of the Electron Beam Lithography system.  This position is located in College Station, Texas, the main campus for Texas A&M University.  The position has Job/NOV number: E00101FY16 and can be viewed at the website below.

http://apps.system.tamus.edu/jobsearch/default.aspx

Best Regards,
Larry A Rehn
Technical Lab Manager
AggieFab Nanofabrication Facility
Texas A&M University
3128 TAMU
College Station, Texas   77843-3128

(979) 845-3199 Office

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From mmoneck at andrew.cmu.edu  Thu May  5 15:28:59 2016
From: mmoneck at andrew.cmu.edu (Matt Moneck)
Date: Thu, 5 May 2016 15:28:59 -0400
Subject: [labnetwork] Occupancy Sensors in Cleanroom
Message-ID: <053c01d1a704$601e47c0$205ad740$@andrew.cmu.edu>

Hi All,

 

Our university is in the process of constructing a new 8500 sqft cleanroom.
It has been proposed that 30min occupancy sensors are to be used in the
cleanroom bays and chases (one at each end of each bay and chase).
Personally, I have a lot of reservations about using such sensors given
safety concerns created by potential blind spots, especially when staff are
working in tight spots around various processing tools.  In addition, I have
concerns about sensitivity given the noise and vibration in many areas of
the lab.  Does anyone have experience (good or bad) with such sensors in a
cleanroom environment?

 

Best Regards,


Matt

 

-- 
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility
Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
 <http://www.ece.cmu.edu> www.ece.cmu.edu
nanofab.ece.cmu.edu

 

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From nclay at upenn.edu  Thu May  5 16:11:15 2016
From: nclay at upenn.edu (Noah Clay)
Date: Thu, 5 May 2016 16:11:15 -0400
Subject: [labnetwork] Occupancy Sensors in Cleanroom
In-Reply-To: <053c01d1a704$601e47c0$205ad740$@andrew.cmu.edu>
References: <053c01d1a704$601e47c0$205ad740$@andrew.cmu.edu>
Message-ID: <C90C148A-14A2-42D3-AA7D-62A666B205F3@upenn.edu>

Matt,

     I've seen these used for lighting in the cleanroom environment but typically one would bypass the occupancy sensors Monday to Friday during normal business hours. 

     I've never experienced any issues. 

Regards,

Noah

Noah Clay
Quattrone Nanofabrication Facility
University of Pennsylvania 
Philadelphia, PA

Sent from my iPhone

> On May 5, 2016, at 15:28, Matt Moneck <mmoneck at andrew.cmu.edu> wrote:
> 
> Hi All,
>  
> Our university is in the process of constructing a new 8500 sqft cleanroom.  It has been proposed that 30min occupancy sensors are to be used in the cleanroom bays and chases (one at each end of each bay and chase).  Personally, I have a lot of reservations about using such sensors given safety concerns created by potential blind spots, especially when staff are working in tight spots around various processing tools.  In addition, I have concerns about sensitivity given the noise and vibration in many areas of the lab.  Does anyone have experience (good or bad) with such sensors in a cleanroom environment?
>  
> Best Regards,
> 
> Matt
>  
> -- 
> Matthew T. Moneck, Ph.D.
> Executive Manager, Carnegie Mellon Nanofabrication Facility
> Electrical and Computer Engineering | Carnegie Mellon University
> 5000 Forbes Ave., Pittsburgh, PA 15213-3890
> T: 412.268.5430
> F: 412.268.3497
> www.ece.cmu.edu
> nanofab.ece.cmu.edu
>  
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From john.nibarger at nist.gov  Thu May  5 16:56:46 2016
From: john.nibarger at nist.gov (Nibarger, John (Fed))
Date: Thu, 5 May 2016 20:56:46 +0000
Subject: [labnetwork] NIST Boulder Microfab Senior Engineer
Message-ID: <01E32DA5-FA90-4EE8-9B5A-29D789CC5993@nist.gov>

Colleagues,
The Boulder Micro-fabrication Facility at National Institute of Standards and Technology in Boulder, CO is looking to hire a Senior Engineer. Below and attached is the job posting. Thank you for your consideration.
Cheers,
John

Senior Engineer: Process and Facilities Engineer for the Boulder Micro-fabrication Facility

The Boulder Micro-fabrication Facility (BMF) at the National Institute of Standards and Technology (NIST) in Boulder, CO anticipates the need for a Senior Engineer to work in support of the Facility. The BMF is a world-class research cleanroom providing for the fabrication needs of the NIST, Boulder community. Housed in a 1,700 m2 ISO 5 (18,300 sqft class 100) cleanroom, the BMF furthers the NIST mission through micro- and nano-fabrication capabilities.

Reporting to the manager of the BMF, the Senior Engineer will provide leadership within the BMF and its user community for the operation/maintenance of research equipment, process development, support of facility infrastructure, development/implementation of safety policies, and training. Excellent organization, planning and oral/written communication skills required. Successful applicant will:

?   Work with staff and users to maintain laboratory tools in top working condition, with emphasis upon process monitoring, preventive maintenance, and rapid troubleshooting.
?   Provide guidance on, work directly with and train the users on various techniques for using the fabrication/metrology equipment, and work directly with a variety of fabrication/metrology equipment in a hands-on fashion. 

?   Train researchers and laboratory users in the proper operation of various laboratory tools and provide general processing procedures associated with those tools.
?   Be a key member of the BMF safety team providing assistance in a variety of areas such as: toxic gases, flammable chemicals, high voltage systems, vacuum systems, and strong acids/bases.

We are interested in selecting a highly qualified candidate for a Physicist, ZP-1310-IV. The basic qualification requirement for a Physicist position is a degree in Physics or a related field. Additional information on requirements can be found in the OPM qualifications<https://www.opm.gov/policy-data-oversight/classification-qualifications/general-schedule-qualification-standards/1300/physics-series-1310/>. The pay band IV salary ranges from $90,779 to $139,457. In addition to the basic requirements, applicants must have one year (52 weeks) of specialized experience equivalent to the GS-12 level (ZP-III at NIST). Specialized experience is defined as direct experience working in a cleanroom environment, micro-fabrication process development, and repair and troubleshooting process equipment.

Interested candidates should please email a cover letter, resume/CV and names/contact information for three references to john.nibarger at nist.gov<mailto:john.nibarger at nist.gov>.  This position requires U.S. citizenship.  Salary will be commensurate with experience.  When the position is available, a vacancy announcement will be posted on http://www.usajobs.gov/.

The Boulder Micro-fabrication Facility is part of the Physical Measurement Laboratory of the National Institute of Standards and Technology (NIST). Founded in 1901, NIST is a non-regulatory federal agency within the U.S. Department of Commerce. NIST?s mission is to promote U.S. innovation and industrial competitiveness by advancing measurement science, standards, and technology in ways that enhance economic security and improve our quality of life. The NIST Boulder laboratories are located roughly 45 minutes from Denver, Colorado. The Department of Commerce is an Equal Opportunity Employer.


John P. Nibarger, Ph.D.
Manager, Boulder Micro-Fabrication Facility
National Institute of Standards and Technology
325 Broadway, MS 817.03
Boulder, CO  80305
303-497-4575 (phone)
303-497-3042 (fax)
john.nibarger at nist.gov<mailto:john.nibarger at nist.gov>

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From jerry.bowser at nist.gov  Thu May  5 17:09:05 2016
From: jerry.bowser at nist.gov (Bowser, Jerry (Fed))
Date: Thu, 5 May 2016 21:09:05 +0000
Subject: [labnetwork] SRD inserts
In-Reply-To: <CAMO2FMC25utVP_WJH3UNa=fG5akeWbtcRAtFEKuP9nbDKqi36A@mail.gmail.com>
References: <CAMO2FMC25utVP_WJH3UNa=fG5akeWbtcRAtFEKuP9nbDKqi36A@mail.gmail.com>
Message-ID: <DM2PR09MB0318A8AC64C32609DA49C3BDEC7C0@DM2PR09MB0318.namprd09.prod.outlook.com>

Hi Keith,

Here at the CNST NanoFab, we have installed a master 4 pin rotor and have inserts for 2?, 3?, 4?, 6?, and 8? wafers as well as 5? and 6? masks.  We have this installed on 3 double stack SRDs with one rotor set for each stack.  Over time, we have found that removing and replacing rotors to accommodate different substrate sizes caused quite a bit of damage to the SRD and galled the end of the rotor shafts.  Plus, we only had staff changing rotors which became time consuming.  Now, users change their own rotors and it takes about 30 seconds.  I?m a big fan!  We purchased our setup from OEM Group.  Feel free to give me a call or email if you would like to discuss.

Best Regards,
Jerry


*******************************************
Jerry Bowser
Assistant Manager for Operations
NanoFab Operations Group
Center for Nanoscale Science and Technology
National Institute of Standards and Technology
Phone: (301) 975-8187



From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Keith Franklin
Sent: Saturday, April 30, 2016 5:36 PM
To: Labnetwork <labnetwork at mtl.mit.edu>
Subject: [labnetwork] SRD inserts

Good afternoon all,

Our lab currently supports 6" round, 4" round & 4" square substrates & are looking into efficient ways of easy start to finish processing.  Has anyone here used SRD rotor inserts?  Having learnt many years ago that allowing our users to freely change rotors was (ahem) unwise, we currently have multiple SRD's in each wet processing area, each configured for a different substrate geometry.  Based on usage, this is not an efficient use of space, and increases the overall cost of operation (meaning more things to maintain and repair).

We are currently entertaining the idea of having one SRD per wet processing area configured with a 6" round rotor, and purchasing "balanced inserts" that would then fit the appropriate cassette.  For reasons mentioned above, this is extremely attractive to us.  After engaging with the vendor (in this case Sitek), I was surprised to see the cost is quite significant.

I would value any input, advice or feedback any of you may be able to provide.

Kind Regards,
Keith


Keith Franklin

Operations Manager

University of Alberta - nanoFAB

W1-060 ECERF Building

9107 - 116 Street

Edmonton, Alberta

Canada T6G 2V4                      Ph: 780-492-0170
www.nanofab.ualberta.ca<http://www.nanofab.ualberta.ca>
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From carsen at stanford.edu  Fri May  6 01:31:15 2016
From: carsen at stanford.edu (Carsen Kline)
Date: Fri, 6 May 2016 05:31:15 +0000
Subject: [labnetwork] Occupancy Sensors in Cleanroom
In-Reply-To: <C90C148A-14A2-42D3-AA7D-62A666B205F3@upenn.edu>
References: <053c01d1a704$601e47c0$205ad740$@andrew.cmu.edu>,
 <C90C148A-14A2-42D3-AA7D-62A666B205F3@upenn.edu>
Message-ID: <CY1PR02MB20739730D3F2F7217D5F81C3BF7D0@CY1PR02MB2073.namprd02.prod.outlook.com>


Hi Matt,

At SNF we have occupancy sensors in our litho areas, satellite labs, and offices. We don't get false triggers of lights due to vibration or noise, just occasional annoyances. Yesterday I overheard a student giving an outside tour of our lab trying to describe the tools in the dark to his visitors. Noah's suggestion of a bypass option during business hours is a good one. A few of our lamps are always on and tied into emergency backup power.

Best wishes for your new lab.

Carsen

________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Noah Clay <nclay at upenn.edu>
Sent: Thursday, May 5, 2016 1:11 PM
To: Matt Moneck
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Occupancy Sensors in Cleanroom

Matt,

     I've seen these used for lighting in the cleanroom environment but typically one would bypass the occupancy sensors Monday to Friday during normal business hours.

     I've never experienced any issues.

Regards,

Noah

Noah Clay
Quattrone Nanofabrication Facility
University of Pennsylvania
Philadelphia, PA

Sent from my iPhone

On May 5, 2016, at 15:28, Matt Moneck <mmoneck at andrew.cmu.edu<mailto:mmoneck at andrew.cmu.edu>> wrote:


Hi All,



Our university is in the process of constructing a new 8500 sqft cleanroom.  It has been proposed that 30min occupancy sensors are to be used in the cleanroom bays and chases (one at each end of each bay and chase).  Personally, I have a lot of reservations about using such sensors given safety concerns created by potential blind spots, especially when staff are working in tight spots around various processing tools.  In addition, I have concerns about sensitivity given the noise and vibration in many areas of the lab.  Does anyone have experience (good or bad) with such sensors in a cleanroom environment?



Best Regards,

Matt



--
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility
Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu<http://www.ece.cmu.edu>
nanofab.ece.cmu.edu<http://nanofab.ece.cmu.edu>



_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From jmullany at sitekprocess.com  Tue May 10 17:16:03 2016
From: jmullany at sitekprocess.com (Jim Mullany)
Date: Tue, 10 May 2016 14:16:03 -0700 (PDT)
Subject: [labnetwork] SRD inserts
Message-ID: <27879095.1462914963974.JavaMail.Administrator@bat08-sitek>

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From F.W.A.Dirne at tudelft.nl  Wed May 11 09:25:33 2016
From: F.W.A.Dirne at tudelft.nl (Frank Dirne - TNW)
Date: Wed, 11 May 2016 13:25:33 +0000
Subject: [labnetwork] sample tracking
Message-ID: <D358FF69.2B70C%f.w.a.dirne@tudelft.nl>

Dear colleagues,

We are looking for a ways of logging of process data in order to enable sample tracking.
Having worked with these systems in industry before, I know it will be very difficult to get this running in our facility.
A serious option is buying a commercial system providing it has sufficient flexibility in an academic cleanroom.
Do you have any suggestions and experiences you can share ?

Maybe this question has been raised before on this forum, but I am a fresh participant and it would be a great help to learn from you.

 best regards,
Frank Dirne

Managing Director Kavli Nanolab
Delft University of Technology
Lorentzweg 1, 2628 CJ Delft
TNW (bldg 22) - room D121
Phone: +31 (0)15 27 82357 / +31 614330507
email: F.W.A.Dirne at tudelft.nl<mailto:F.W.A.Dirne at tudelft.nl>

secretary: +31 (0)15 27 81153
web site: www.qn.tudelft.nl/KN<http://www.qn.tudelft.nl/KN>

[cid:D334BC05-C28B-42F4-93E3-3839E11F0D2A]


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From lewin at illinois.edu  Wed May 11 12:50:06 2016
From: lewin at illinois.edu (Reinhart, Leslie Lewin)
Date: Wed, 11 May 2016 16:50:06 +0000
Subject: [labnetwork] University of Illinois - CVD Research Engineer - Micro
 and Nanotechnology Lab
Message-ID: <0B48381248D4954CBEE4C4CC8FD100BDAD797930@chimbx3.ad.uillinois.edu>

The Micro and Nanotechnology Laboratory at the University of Illinois at Urbana-Champaign seeks applicants for a CVD Research Engineer to facilitate research efforts being conducted in a cleanroom laboratory environment and to provide support and direction to laboratory users and co-workers including: managing equipment and tools involving hands-on equipment maintenance of the chemical vapor deposition systems and other equipment as assigned, conducting day to day growth runs grown to customer specifications and training of new users as required.

For more information regarding this position, or to apply, please visit CVD Research Engineer<https://jobs.illinois.edu/academic-job-board/job-details?jobID=63718&job=research-engineer-micro-and-nanotechnology-laboratory-a1600219>.


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From nnelsonfitzpatrick at uwaterloo.ca  Wed May 11 16:52:56 2016
From: nnelsonfitzpatrick at uwaterloo.ca (Nathan Nelson - Fitzpatrick)
Date: Wed, 11 May 2016 20:52:56 +0000
Subject: [labnetwork] Sputtering of YBCO
Message-ID: <D35913E5.31A15%nathan.nelson-fitzpatrick@uwaterloo.ca>

Hi All,

I just recently had a user request to sputter YBCO in one of our sputter systems.  This sputter system is mainly used for the deposition of pure metal films (Al, Ti, Nb) and occasionally some reactive sputtering with metal targets.  The system typically sits with a base pressure in the low 10-7 Torr range.  I don?t have any experience with YBCO I?m wondering if anyone can share some knowledge about any possible health or contamination risks associated with this material.  Also, any thoughts about how to group or segregate this process to run it safely would be great!

Thank you,
  -Nathan
--
Nathan Nelson-Fitzpatrick  PhD
Nanofabrication Process Engineer
Quantum NanoFab
University of Waterloo
200 University Avenue West
Waterloo, ON   Canada  N2L 3G1
Ph: +1 519-888-4567 ext. 31796




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From IRHarvey at eng.utah.edu  Wed May 11 17:09:30 2016
From: IRHarvey at eng.utah.edu (Ian Harvey)
Date: Wed, 11 May 2016 15:09:30 -0600
Subject: [labnetwork] =?windows-1252?q?UGIM_=2716_is_only_one_month_away?=
 =?windows-1252?q?=85___=85still_time_to_register=2E=2E=2E?=
In-Reply-To: <34255AB2-1143-4590-817A-ACEB86ABD3AB@eng.utah.edu>
References: <C0AE6876-528C-4874-B4BE-6A51089FC09C@eng.utah.edu>
 <34255AB2-1143-4590-817A-ACEB86ABD3AB@eng.utah.edu>
Message-ID: <575C66CA-14BC-440F-A593-9E2A2F7CEDC5@eng.utah.edu>

Dear UGIM afficionados!

There is still time to register for UGIM '16 and gain valuable detailed know-how in administering cleanroom/microscopy core facilities.

It is very easy to get to SLC and to all of the conference venues.  All are within walking distance from the University Guest House.  
	(The Guest House and all conference venues are easily accessed by light rail directly from the airport.)
http://ugim.nanofab.utah.edu/lodging/transportation/

Check out our UGIM 16 Visitor Guide:
http://ugim.nanofab.utah.edu/files/2016/03/visitors-guide.compressed.pdf

Register here:
http://ugim.nanofab.utah.edu/registration/

Convenient Lodging here:
http://ugim.nanofab.utah.edu/lodging-2/

Technical Program here:
http://ugim.nanofab.utah.edu/program/

Noteworthy:
? We have a great lineup of vendors and exhibitors, and many opportunities to pick the brains of (and commiserate with) peers who are dealing with the same issues you are dealing with.
http://ugim.nanofab.utah.edu/

? See what other institutions are being represented here at UGIM '16
http://ugim.nanofab.utah.edu/announcements-3/

? Sunday evening reception, dinner and wet bar at the building housing the Utah Nanofab cleanroom and microscopy suite.  We will have our staff at tour stations inside the cleanroom so you can see how we have implemented our systems and ask very specific questions to our experts.
	(Included: no extra fee in your registration and cost-offset by sponsors)

? Equipment Swap meet here: (add tools you would like to sell or trade, shop here for hand-me-down stuff that helps you quickly get to the next stage).
http://ugim.nanofab.utah.edu/fab-swap-meet/

? organized activities described below if you want to stay and play:

******************

From: Duane Bingaman <duaneb at lesker.com>
Subject: ugim
Date: May 6, 2016 11:22:48 AM MDT
To: Ian Harvey <IRHarvey at eng.utah.edu>
Cc: Duane Bingaman <duaneb at lesker.com>

Dear UGIM attendee,

The Salt Lake City Area boasts a number of outstanding recreational opportunities in the surrounding resort areas including hiking, mountain biking, camping, fly fishing, golf and zip-lines--to name a few. All venues are within 30-45 minutes of the University of Utah.

Duane Bingaman from the Kurt Lesker Company lives in Park City, UT and has offered to help arrange and connect attendees with each other and to these opportunities should you so desire.

He is currently trying to get an idea of interest level. Please contact him directly to express interest and he will coordinate with you and connect you with others that have similar interest. Duane is available to handle this for arrival times both several days before and after the conference.  Rental equipment for all activities is easily arranged. The University of Utah rents complete camping gear and bikes at much better prices than the resorts. The resorts also rent all mountain biking equipment.

Some links are included below for your reference

http://www.parkcityutahgolf.com/

http://www.troutbum2.com/

http://mountainbikingparkcity.com/about.php

http://www.wasatchhiker.com/

http://www.fs.usda.gov/recarea/uwcnf/recarea/?recid=8983

http://utaholympiclegacy.org/activity/extreme-freestyle-ziplines/

http://www.ziplineutah.com/

http://campusrec.utah.edu/programs/outdoor-adventures/equipment-rental/



Please let Duane know of interest at duaneb at lesker.com  and he can coordinate groups.

Thank you.

We hope to see you soon!

?Ian


********************************************
Ian R. Harvey, Ph.D.

Associate Director
Utah Nanofab 
Cleanroom Fabrication and Surface Analysis & nano-scale Imaging
801/585-6162 (voicemail)
www.nanofab.utah.edu
http://sal.nanofab.utah.edu

Chair, UGIM '16
http://ugim.nanofab.utah.edu/

<PastedGraphic-2.pdf>



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From sgupta at eng.ua.edu  Wed May 11 20:14:46 2016
From: sgupta at eng.ua.edu (Gupta, Su)
Date: Thu, 12 May 2016 00:14:46 +0000
Subject: [labnetwork] Sputtering of YBCO
In-Reply-To: <D35913E5.31A15%nathan.nelson-fitzpatrick@uwaterloo.ca>
References: <D35913E5.31A15%nathan.nelson-fitzpatrick@uwaterloo.ca>
Message-ID: <7C950A0523CDD047B990B0628532BF3612C90C2A@EX10MBN01.ua-net.ua.edu>

Hi Nathan:

No health risks at all with YBCO. You may notice some resputtering of the material, which is why some folks sputter it off-axis. You should sputter it reactively with oxygen. As long as you presputter your metal targets before deposition of those metals you should be fine -- YBCO will not contaminate your system.

Best,
Su Gupta
UA Micro-Fabrication Facility
________________________________
From: labnetwork-bounces at mtl.mit.edu [labnetwork-bounces at mtl.mit.edu] on behalf of Nathan Nelson - Fitzpatrick [nnelsonfitzpatrick at uwaterloo.ca]
Sent: Wednesday, May 11, 2016 3:52 PM
To: 'Labnetwork'
Subject: [labnetwork] Sputtering of YBCO

Hi All,

I just recently had a user request to sputter YBCO in one of our sputter systems.  This sputter system is mainly used for the deposition of pure metal films (Al, Ti, Nb) and occasionally some reactive sputtering with metal targets.  The system typically sits with a base pressure in the low 10-7 Torr range.  I don?t have any experience with YBCO I?m wondering if anyone can share some knowledge about any possible health or contamination risks associated with this material.  Also, any thoughts about how to group or segregate this process to run it safely would be great!

Thank you,
  -Nathan
--
Nathan Nelson-Fitzpatrick  PhD
Nanofabrication Process Engineer
Quantum NanoFab
University of Waterloo
200 University Avenue West
Waterloo, ON   Canada  N2L 3G1
Ph: +1 519-888-4567 ext. 31796




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From philipp.altpeter at physik.uni-muenchen.de  Sat May 14 15:17:24 2016
From: philipp.altpeter at physik.uni-muenchen.de (Philipp Altpeter)
Date: Sat, 14 May 2016 21:17:24 +0200
Subject: [labnetwork] How to program a hot plate
Message-ID: <573779C4.2080501@physik.uni-muenchen.de>

Hi all,

I'm wondering if someone knows a way to program a conventional hot plate
that is equipped with a RS232 serial port. I'd like to define a baking
recipe with several temperature plateaus and ramp rates. Is there a
suitable software available?

Thank you for your effort!

Philipp

-- 
Philipp Altpeter
Fakult?t f?r Physik der Ludwig-Maximilians-Universit?t und
Center for NanoScience (CeNS)
Lehrstuhl f?r Festk?rperphysik / N.N.
Geschwister-Scholl-Platz 1
D-80539 M?nchen

Tel +49 (0) 89 2180 3733
Fax +49 (0) 89 2180 5831

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From dev.c0debabe at gmail.com  Tue May 17 02:57:46 2016
From: dev.c0debabe at gmail.com (=?UTF-8?Q?Stefan_Sch=c3=b6nleitner?=)
Date: Tue, 17 May 2016 08:57:46 +0200
Subject: [labnetwork] How to program a hot plate
In-Reply-To: <573779C4.2080501@physik.uni-muenchen.de>
References: <573779C4.2080501@physik.uni-muenchen.de>
Message-ID: <573AC0EA.7050403@gmail.com>

Dear Philipp,

On 05/14/2016 09:17 PM, Philipp Altpeter wrote:
> Hi all,
> 
> I'm wondering if someone knows a way to program a conventional hot plate
> that is equipped with a RS232 serial port. I'd like to define a baking
> recipe with several temperature plateaus and ramp rates. Is there a
> suitable software available?

have a look at the manual for the heating plate. It should contain a
list of RS232 serial commands that allow you to control the hot plate.
You could probably use a serial terminal program or write a small Python
script to control the hot plate.

For instance, if you can control the heating power and read the current
temperature, it would be easy to write a script that continuously reads
the temperature and controls the plate to achieve the ramp rates you're
looking forward to.
You might need to consider a PID algorithm to good results.

On the other hand your heating plate might even be smart enough already
that you can set up your ramps via the serial commands.

HTH,
Stefan

> 
> Thank you for your effort!
> 
> Philipp
> 
> 
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
> 




From Tzumin.Ou at Colorado.EDU  Wed May 18 13:20:04 2016
From: Tzumin.Ou at Colorado.EDU (Tzu-Min Ou)
Date: Wed, 18 May 2016 11:20:04 -0600
Subject: [labnetwork] Plasma etch of chalcogenides
Message-ID: <CAG_jOFBMObA+qYNDAzzUyEY8O=ti8o9J7ggOH9MsvXRtu8HuMQ@mail.gmail.com>

Dear Colleagues in the LabNetwork,

Good day! I got a request for the plasma etch of a chalcogenide that I have
zero experience with. So, I figure I should consult LabNetwork's
professional opinions before making any rush decision. Your response will
be extremely helpful to us.

We have a STS ICP etcher dedicated for Si DRIE. The chamber is carefully
kept clean that only photoresist and Si-based dielectrics are allowed
to present so far. Now, a faculty member wanted to etch a thin film of
GeSbSe in the chamber using CHF3 + Ar on a regular basis. I remember that
both Sb and Se are poisonous to the vacuum systems, but I cannot recall
exactly why. Here are my qestions:

1. Can anyone let me know how those elements are harmful to the vacuum
systems, please?

2. I tried to ask our EH&S people about the compatibility of the exhaust,
but they are not sure either. Is there a foreseeable compatibility issue in
the exhaust? Is it likely that we will need to have an inspection from the
authority, such as the fire department, etc., to be permitted to emit the
byproducts of this chalcogenide film?

3. Is it likely that the etch will cause any irreversible
contamination/change to the ICP system that cannot be recovered by
a standard cleaning process? (I was just worried that the Si DRIE will be
runined after this etch.)

Again, your opinion will be deeply appreciated. Thank you so much for your
time and help.

Sincerely,

Tzu-Min

-- 
Tzu-Min Ou, Ph.D.
Lab Manager
Colorado Nanofabrication Laboratory
Department of Electrical, Computer, and Energy Engineering
University of Colorado at Boulder
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From gregg.cure at gmail.com  Wed May 18 17:05:13 2016
From: gregg.cure at gmail.com (Gregg Cure)
Date: Wed, 18 May 2016 14:05:13 -0700
Subject: [labnetwork] Documentation for VAT vacuum controller
Message-ID: <CAB5QBGx9Zv7_SRr567KW0My1+D1CZLJG4-5gECa+Mdv55Exuyw@mail.gmail.com>

Hello everyone,

I am putting a pump stack together, and to that end, I have the components
all staged. I have a VAT type 640PC-S pressure controller with no
documentation, manufactured in 1987. VAT themselves say they have no docs
for equipment of this vintage (no surprise there). Some casual searches
online have yielded no results either. If anyone can point me in the right
direction, I'd very much appreciate the help.

There are two photos attached with this email, but I don't recall of the
forum allows attachments. If not, I'll email anyone the photos who wants
them

Thank you and regards,
Gregg Cure`


-- 
Gregg D. Cure`
The University of Arizona
Office for Research and Discovery
Nano Fabrication and Processing Center
1230 E. Speedway Blvd.
ECE104 Rm 209
Tucson, AZ 85721-0104
Office: 520.626.1987
Cell: 520.307.2760
Fax: 520.626.7877
Website: http://mfc.engr.arizona.edu
Website: http://research.arizona.edu/
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From kamal.yadav at gmail.com  Wed May 18 18:54:12 2016
From: kamal.yadav at gmail.com (Kamal Yadav)
Date: Wed, 18 May 2016 15:54:12 -0700
Subject: [labnetwork] Cleanroom near Univ. of Connecticut
Message-ID: <CAOfoCyjyoMV9H2s=7d4q73E3NnnZitoQnD_hsB3NPQLWNg-RsQ@mail.gmail.com>

Dear All,

What are the options to use a cleanroom facility near University of
Connecticut, for fabrication of MEMS based neural biomedical probes for
somebody who will fall under academic user category.

Some of the Options are?:
1. MIT
2. Harvard
3. U Mass Amherst.
4. ?

-- 
Thanks,
Kamal
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From mmoneck at andrew.cmu.edu  Wed May 18 19:03:43 2016
From: mmoneck at andrew.cmu.edu (Matt Moneck)
Date: Wed, 18 May 2016 19:03:43 -0400
Subject: [labnetwork] Plasma etch of chalcogenides
In-Reply-To: <CAG_jOFBMObA+qYNDAzzUyEY8O=ti8o9J7ggOH9MsvXRtu8HuMQ@mail.gmail.com>
References: <CAG_jOFBMObA+qYNDAzzUyEY8O=ti8o9J7ggOH9MsvXRtu8HuMQ@mail.gmail.com>
Message-ID: <083a01d1b159$86bdb3c0$94391b40$@andrew.cmu.edu>

Hi Tzu-Min,

 

I suggest finding an alternative machine for this material if at all possible.  In addition, there are safety concerns with this material and a number of other chalcogenides (see more below).  

 

We have an STS Multiplex DRIE running the Bosch process, and we have set strict protocols (similar to yours) regarding the materials that can go into the system.  That being said, there have been a few occasions where we have deviated from those protocols and regretted it.  In some instances, those deviations have led to too much polymer formation and drops in etch rate along with changes in etch profile.  These deviations were fairly easy to recover from but did lead to some down time.  In other instances, the recovery was not as easy.  There was one instance where metal masks (metals that did not easily form volatile compounds with fluorine) were used in the tool.  Ultimately, this led to resputtering of material onto the chamber sidewalls and changes in our Si etch process.  Extensive chamber cleans were necessary to remove the metal from the ceramic liners.  

 

I don?t personally have any experience with GeSbSe, but I would have concerns about the Sb and Se components (the Ge should form a volatile compound) contaminating the chamber.  In addition, selenium hexafluoride is an acutely toxic and corrosive substance.  If you decide to use this material, I would work with your environmental health and safety group to figure out a way to properly treat the exhaust (also check whether your pump can handle corrosive exhaust).  If they don?t have any experience in this area, you may want to consult some companies that sell abatement systems (Critical Systems, Ebara, Edwards, etc.).  

 

Best Regards,

 

Matt

 

-- 
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility
Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
 <http://www.ece.cmu.edu> www.ece.cmu.edu
nanofab.ece.cmu.edu

 

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Tzu-Min Ou
Sent: Wednesday, May 18, 2016 1:20 PM
To: Labnetwork Mailing List <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Plasma etch of chalcogenides

 

Dear Colleagues in the LabNetwork,

 

Good day! I got a request for the plasma etch of a chalcogenide that I have zero experience with. So, I figure I should consult LabNetwork's professional opinions before making any rush decision. Your response will be extremely helpful to us.

 

We have a STS ICP etcher dedicated for Si DRIE. The chamber is carefully kept clean that only photoresist and Si-based dielectrics are allowed to present so far. Now, a faculty member wanted to etch a thin film of GeSbSe in the chamber using CHF3 + Ar on a regular basis. I remember that both Sb and Se are poisonous to the vacuum systems, but I cannot recall exactly why. Here are my qestions:

 

1. Can anyone let me know how those elements are harmful to the vacuum systems, please? 

 

2. I tried to ask our EH&S people about the compatibility of the exhaust, but they are not sure either. Is there a foreseeable compatibility issue in the exhaust? Is it likely that we will need to have an inspection from the authority, such as the fire department, etc., to be permitted to emit the byproducts of this chalcogenide film?

 

3. Is it likely that the etch will cause any irreversible contamination/change to the ICP system that cannot be recovered by a standard cleaning process? (I was just worried that the Si DRIE will be runined after this etch.)

 

Again, your opinion will be deeply appreciated. Thank you so much for your time and help.

 

Sincerely,

 

Tzu-Min


-- 

Tzu-Min Ou, Ph.D.

Lab Manager

Colorado Nanofabrication Laboratory

Department of Electrical, Computer, and Energy Engineering

University of Colorado at Boulder

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From myoung6 at nd.edu  Wed May 18 23:11:14 2016
From: myoung6 at nd.edu (Mike Young)
Date: Wed, 18 May 2016 23:11:14 -0400
Subject: [labnetwork] Cleanroom near Univ. of Connecticut
In-Reply-To: <CAOfoCyjyoMV9H2s=7d4q73E3NnnZitoQnD_hsB3NPQLWNg-RsQ@mail.gmail.com>
References: <CAOfoCyjyoMV9H2s=7d4q73E3NnnZitoQnD_hsB3NPQLWNg-RsQ@mail.gmail.com>
Message-ID: <6bb07c43-7a04-3895-6da5-a1537a10d690@nd.edu>

Is New Haven close enough? Yale's uELM cleanroom, 5th floor of the 
Becton Center, 15 Prospect St. Ask for Chris or Mike.


On 5/18/2016 6:54 PM, Kamal Yadav wrote:
> Dear All,
>
> What are the options to use a cleanroom facility near University of 
> Connecticut, for fabrication of MEMS based neural biomedical probes 
> for somebody who will fall under academic user category.
>
> Some of the Options are?:
> 1. MIT
> 2. Harvard
> 3. U Mass Amherst.
> 4. ?
>
> -- 
> Thanks,
> Kamal
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From agregg at abbiegregg.com  Thu May 19 02:43:55 2016
From: agregg at abbiegregg.com (Abbie Gregg)
Date: Thu, 19 May 2016 06:43:55 +0000
Subject: [labnetwork] Cleanroom near Univ. of Connecticut
In-Reply-To: <CAOfoCyjyoMV9H2s=7d4q73E3NnnZitoQnD_hsB3NPQLWNg-RsQ@mail.gmail.com>
References: <CAOfoCyjyoMV9H2s=7d4q73E3NnnZitoQnD_hsB3NPQLWNg-RsQ@mail.gmail.com>
Message-ID: <d2b5142aa4264bc0a6fec470e58e1ead@mail31.netvigour.com>

UMass Lowell ETIC, Columbia University, CUNY, SUNY Albany,  All have cleanrooms?not sure of full process capability that you need.

Abbie Gregg
President
Abbie Gregg, Inc.
1130 East University Drive, Suite 105
Tempe, Arizona 85281
Phone 480 446-8000 x 107
Cell 480-577-5083
FAX 480-446-8001
email agregg at abbiegregg.com<mailto:agregg at abbiegregg.com>
website www.abbiegregg.com<http://www.abbiegregg.com>

CONFIDENTIALITY NOTICE:   All information contained in or attached to this email constitutes confidential information belonging to Abbie Gregg, Inc., its affiliates and subsidiaries and/or its clients.  This email and any attachments are proprietary and/or confidential and are intended for business use of the addressee(s) only.   All other uses or disclosures are strictly prohibited.  If the reader is not the intended recipient you are hereby notified that the perusal, copying or dissemination of this email is strictly prohibited. If you have received this communication in error, please notify the sender, and delete all copies of this message and its attachments immediately.

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Kamal Yadav
Sent: Wednesday, May 18, 2016 3:54 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Cleanroom near Univ. of Connecticut

Dear All,

What are the options to use a cleanroom facility near University of Connecticut, for fabrication of MEMS based neural biomedical probes for somebody who will fall under academic user category.

Some of the Options are?:
1. MIT
2. Harvard
3. U Mass Amherst.
4. ?

--
Thanks,
Kamal

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From michael.rooks at yale.edu  Thu May 19 08:05:20 2016
From: michael.rooks at yale.edu (Michael Rooks)
Date: Thu, 19 May 2016 08:05:20 -0400
Subject: [labnetwork] Cleanroom near Univ. of Connecticut
In-Reply-To: <6bb07c43-7a04-3895-6da5-a1537a10d690@nd.edu>
References: <CAOfoCyjyoMV9H2s=7d4q73E3NnnZitoQnD_hsB3NPQLWNg-RsQ@mail.gmail.com>
 <6bb07c43-7a04-3895-6da5-a1537a10d690@nd.edu>
Message-ID: <573DAC00.2000401@yale.edu>

Yes, Yale is an option. But Brookhaven is a better option: great 
facilities, cheap accommodations, no fees. And from UConn, you get a fun 
ride on the ferry across Long Island Sound.

https://www.bnl.gov/cfn/user/



--------------------------------
Michael Rooks
Yale Institute of Nanoscience and Quantum Engineering
nano.yale.edu <http://nano.yale.edu>



On 05/18/2016 11:11 PM, Mike Young wrote:
>
> Is New Haven close enough? Yale's uELM cleanroom, 5th floor of the 
> Becton Center, 15 Prospect St. Ask for Chris or Mike.
>
>
> On 5/18/2016 6:54 PM, Kamal Yadav wrote:
>> Dear All,
>>
>> What are the options to use a cleanroom facility near University of 
>> Connecticut, for fabrication of MEMS based neural biomedical probes 
>> for somebody who will fall under academic user category.
>>
>> Some of the Options are?:
>> 1. MIT
>> 2. Harvard
>> 3. U Mass Amherst.
>> 4. ?
>>
>> -- 
>> Thanks,
>> Kamal
>>
>>
>>
>> _______________________________________________
>> labnetwork mailing list
>> labnetwork at mtl.mit.edu
>> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://urldefense.proofpoint.com/v2/url?u=https-3A__www-2Dmtl.mit.edu_mailman_listinfo.cgi_labnetwork&d=AwICAg&c=-dg2m7zWuuDZ0MUcV7Sdqw&r=apnDUg1OD9ejswcjrIvVgS28NpQ7-FGy7Sl7_YPlupc&m=t50SzYSW2-Q8ng65_FvcrkTwt4zq8Gh8zXCT9oG6am8&s=Xap5u0Svi8ky1u_Nz1kOZ0Cim2lBgkK9J5YiVDsBLUE&e=

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From cekendri at mtu.edu  Thu May 19 09:15:12 2016
From: cekendri at mtu.edu (Chito Kendrick)
Date: Thu, 19 May 2016 09:15:12 -0400
Subject: [labnetwork] Perkin Elmer 2400 8" sputter Arcing
Message-ID: <573DBC60.7090203@mtu.edu>

I am looking for information on how to fix an issue I have with our 
Perkin Elmer sputter tool. The system was working reasonably, but now 
when we run the system there is alot of arcing. It is not related to the 
target material or if we use a different target position. At 100 W there 
is no arcing and once we go above that, normally we use 700 W with this 
system for deposition of HfOx, we observe the arcing issue. This is not 
a continuous arc, but very sporadic events and has been leaving visible 
damage to the dark shields and the chamber walls. I have cleaned the 
dark shields, chamber wall, and sample stage with sandpaper and wipe all 
the surfaces with solvents, but that did not seem to have an affect on 
the arcing issue.

This tool has also had a long issue with RF leakage effecting the mass 
flow controllers and RF tuning unit. Past lab users have tried to ground 
all the instruments that were effected but with minimal improvement.

Any information or help would be greatly appreciated.

Chito Kendrick

-- 
Chito Kendrick Ph.D. <https://sites.google.com/site/chitokendrickphd/>

Director of the Microfabrication Facility
Research Assistant Professor
Electrical and Computer Engineering
Michigan Technological University
Room 436 M&M Building
1400 Townsend Dr.
Houghton, Michigan 49931-1295

814-308-4255
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From mariusz.martyniuk at uwa.edu.au  Thu May 19 09:15:24 2016
From: mariusz.martyniuk at uwa.edu.au (Mariusz Martyniuk)
Date: Thu, 19 May 2016 21:15:24 +0800
Subject: [labnetwork] Cleanroom near Univ. of Connecticut
In-Reply-To: <6bb07c43-7a04-3895-6da5-a1537a10d690@nd.edu>
References: <CAOfoCyjyoMV9H2s=7d4q73E3NnnZitoQnD_hsB3NPQLWNg-RsQ@mail.gmail.com>
 <6bb07c43-7a04-3895-6da5-a1537a10d690@nd.edu>
Message-ID: <557C87D8E1F1AE4F9C0CD5B31CF5C253022CECAA2F53@IS-WIN-383.staffad.uwa.edu.au>

Definitely not the closest solution, but the one with most beautiful beaches and significant MEMS expertise... Western Australia.

Cheers,
Marius

Ps. Apologies but I was not able to resist and not to respond to this this post. There are realistic avenues to secure funding for up to 6 month visits and use of our facilities.

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mike Young
Sent: Thursday, 19 May 2016 11:11 AM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Cleanroom near Univ. of Connecticut


Is New Haven close enough? Yale's uELM cleanroom, 5th floor of the Becton Center, 15 Prospect St. Ask for Chris or Mike.

On 5/18/2016 6:54 PM, Kamal Yadav wrote:
Dear All,

What are the options to use a cleanroom facility near University of Connecticut, for fabrication of MEMS based neural biomedical probes for somebody who will fall under academic user category.

Some of the Options are?:
1. MIT
2. Harvard
3. U Mass Amherst.
4. ?

--
Thanks,
Kamal





_______________________________________________

labnetwork mailing list

labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>

https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From jdeng at cns.fas.harvard.edu  Thu May 19 10:22:07 2016
From: jdeng at cns.fas.harvard.edu (Deng, Jiangdong)
Date: Thu, 19 May 2016 14:22:07 +0000
Subject: [labnetwork] Cleanroom near Univ. of Connecticut
In-Reply-To: <CAOfoCyjyoMV9H2s=7d4q73E3NnnZitoQnD_hsB3NPQLWNg-RsQ@mail.gmail.com>
References: <CAOfoCyjyoMV9H2s=7d4q73E3NnnZitoQnD_hsB3NPQLWNg-RsQ@mail.gmail.com>
Message-ID: <CY1PR07MB254006368E4C6B0C2478DE70B24A0@CY1PR07MB2540.namprd07.prod.outlook.com>

Kamal,
The cleanroom in Harvard CNS has most of MEMS solutions for your application. Several UConn groups have been using CNS facilities for a while. Please feel free to contact me (617-495-3396 or 617-875-9074) if you are interested.
-JD


From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Kamal Yadav
Sent: Wednesday, May 18, 2016 6:54 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Cleanroom near Univ. of Connecticut

Dear All,

What are the options to use a cleanroom facility near University of Connecticut, for fabrication of MEMS based neural biomedical probes for somebody who will fall under academic user category.

Some of the Options are?:
1. MIT
2. Harvard
3. U Mass Amherst.
4. ?

--
Thanks,
Kamal

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From julia.aebersold at louisville.edu  Thu May 19 10:23:54 2016
From: julia.aebersold at louisville.edu (julia.aebersold at louisville.edu)
Date: Thu, 19 May 2016 14:23:54 +0000
Subject: [labnetwork] Plasma etch of chalcogenides
In-Reply-To: <083a01d1b159$86bdb3c0$94391b40$@andrew.cmu.edu>
References: <CAG_jOFBMObA+qYNDAzzUyEY8O=ti8o9J7ggOH9MsvXRtu8HuMQ@mail.gmail.com>
 <083a01d1b159$86bdb3c0$94391b40$@andrew.cmu.edu>
Message-ID: <D84411B2FA8CBA42BC4868D5382CA1BB015580C138@exmbx17>

We have a similar protocol where metals are not allowed in our DRIE and periodically perform and chamber clean to keep etch rates in line and grass formation in check.

Cheers!

Julia Aebersold, Ph.D.
Cleanroom Manager
Micro/Nano Technology Center
University of Louisville
Shumaker Research Building, Room 233
2210 South Brook Street
Louisville, KY  40292

502-852-1572
http://louisville.edu/micronano/

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matt Moneck
Sent: Wednesday, May 18, 2016 7:04 PM
To: Tzumin.Ou at Colorado.EDU; 'Labnetwork Mailing List' <labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Plasma etch of chalcogenides

Hi Tzu-Min,

I suggest finding an alternative machine for this material if at all possible.  In addition, there are safety concerns with this material and a number of other chalcogenides (see more below).

We have an STS Multiplex DRIE running the Bosch process, and we have set strict protocols (similar to yours) regarding the materials that can go into the system.  That being said, there have been a few occasions where we have deviated from those protocols and regretted it.  In some instances, those deviations have led to too much polymer formation and drops in etch rate along with changes in etch profile.  These deviations were fairly easy to recover from but did lead to some down time.  In other instances, the recovery was not as easy.  There was one instance where metal masks (metals that did not easily form volatile compounds with fluorine) were used in the tool.  Ultimately, this led to resputtering of material onto the chamber sidewalls and changes in our Si etch process.  Extensive chamber cleans were necessary to remove the metal from the ceramic liners.

I don?t personally have any experience with GeSbSe, but I would have concerns about the Sb and Se components (the Ge should form a volatile compound) contaminating the chamber.  In addition, selenium hexafluoride is an acutely toxic and corrosive substance.  If you decide to use this material, I would work with your environmental health and safety group to figure out a way to properly treat the exhaust (also check whether your pump can handle corrosive exhaust).  If they don?t have any experience in this area, you may want to consult some companies that sell abatement systems (Critical Systems, Ebara, Edwards, etc.).

Best Regards,

Matt

--
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility
Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.ece.cmu.edu&d=AwMFaQ&c=SgMrq23dbjbGX6e0ZsSHgEZX6A4IAf1SO3AJ2bNrHlk&r=dinfzkbAbqkWVX3xF1fcv2PCcim1G4Oe9iPy5r31AUk&m=8CzABxDQOg3cP-HGAtpQL730GQN_L-xA5yGVhCkBP5s&s=O04NIPV_OAdxoNvhwge77J9gYAF_YS4sjihMXabMiW4&e=>
nanofab.ece.cmu.edu

From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Tzu-Min Ou
Sent: Wednesday, May 18, 2016 1:20 PM
To: Labnetwork Mailing List <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Subject: [labnetwork] Plasma etch of chalcogenides

Dear Colleagues in the LabNetwork,

Good day! I got a request for the plasma etch of a chalcogenide that I have zero experience with. So, I figure I should consult LabNetwork's professional opinions before making any rush decision. Your response will be extremely helpful to us.

We have a STS ICP etcher dedicated for Si DRIE. The chamber is carefully kept clean that only photoresist and Si-based dielectrics are allowed to present so far. Now, a faculty member wanted to etch a thin film of GeSbSe in the chamber using CHF3 + Ar on a regular basis. I remember that both Sb and Se are poisonous to the vacuum systems, but I cannot recall exactly why. Here are my qestions:

1. Can anyone let me know how those elements are harmful to the vacuum systems, please?

2. I tried to ask our EH&S people about the compatibility of the exhaust, but they are not sure either. Is there a foreseeable compatibility issue in the exhaust? Is it likely that we will need to have an inspection from the authority, such as the fire department, etc., to be permitted to emit the byproducts of this chalcogenide film?

3. Is it likely that the etch will cause any irreversible contamination/change to the ICP system that cannot be recovered by a standard cleaning process? (I was just worried that the Si DRIE will be runined after this etch.)

Again, your opinion will be deeply appreciated. Thank you so much for your time and help.

Sincerely,

Tzu-Min

--
Tzu-Min Ou, Ph.D.
Lab Manager
Colorado Nanofabrication Laboratory
Department of Electrical, Computer, and Energy Engineering
University of Colorado at Boulder
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From dale at slac.stanford.edu  Thu May 19 11:38:08 2016
From: dale at slac.stanford.edu (Miller, Dale A.)
Date: Thu, 19 May 2016 15:38:08 +0000
Subject: [labnetwork] Documentation for VAT vacuum controller
In-Reply-To: <CAB5QBGx9Zv7_SRr567KW0My1+D1CZLJG4-5gECa+Mdv55Exuyw@mail.gmail.com>
References: <CAB5QBGx9Zv7_SRr567KW0My1+D1CZLJG4-5gECa+Mdv55Exuyw@mail.gmail.com>
Message-ID: <f993e5801bc449c891b4601135de60b5@exch13-mail04.win.slac.stanford.edu>

Gregg,

I have the manuals you are looking for (see pic). I will scan them in the next day or so if no one else has electronic copies.

Glad to help,

Dale Miller
Principal Science & Engineering Mechanical Technician
Advanced Prototyping & Fabrication Department - Thin Films Coating Lab
SLAC National Accelerator Laboratory


From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Gregg Cure
Sent: Wednesday, May 18, 2016 2:05 PM
To: Fab Network
Subject: [labnetwork] Documentation for VAT vacuum controller

Hello everyone,
I am putting a pump stack together, and to that end, I have the components all staged. I have a VAT type 640PC-S pressure controller with no documentation, manufactured in 1987. VAT themselves say they have no docs for equipment of this vintage (no surprise there). Some casual searches online have yielded no results either. If anyone can point me in the right direction, I'd very much appreciate the help.
There are two photos attached with this email, but I don't recall of the forum allows attachments. If not, I'll email anyone the photos who wants them
Thank you and regards,
Gregg Cure`

--
Gregg D. Cure`
The University of Arizona
Office for Research and Discovery
Nano Fabrication and Processing Center
1230 E. Speedway Blvd.
ECE104 Rm 209
Tucson, AZ 85721-0104
Office: 520.626.1987
Cell: 520.307.2760
Fax: 520.626.7877
Website: http://mfc.engr.arizona.edu
Website: http://research.arizona.edu/
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From spaolini at cns.fas.harvard.edu  Thu May 19 15:33:34 2016
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Thu, 19 May 2016 19:33:34 +0000
Subject: [labnetwork] Perkin Elmer 2400 8" sputter Arcing
In-Reply-To: <573DBC60.7090203@mtu.edu>
References: <573DBC60.7090203@mtu.edu>
Message-ID: <BY2PR0701MB19912FD0EFBAE09C27AC89E5DF4A0@BY2PR0701MB1991.namprd07.prod.outlook.com>

Check to make sure that there are no ferrous fasteners or fixturing in the RF path. Any magnetic material will cause tuning issues and affect sensitive instrumentation as you have stated. This problem is common when a screw goes missing and is replaced with a black iron or galvanized fastener.

Steve Paolini
Equipment Dood
Harvard University Center for Nanoscale systems.

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Chito Kendrick
Sent: Thursday, May 19, 2016 9:15 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Perkin Elmer 2400 8" sputter Arcing

I am looking for information on how to fix an issue I have with our Perkin Elmer sputter tool. The system was working reasonably, but now when we run the system there is alot of arcing. It is not related to the target material or if we use a different target position. At 100 W there is no arcing and once we go above that, normally we use 700 W with this system for deposition of HfOx, we observe the arcing issue. This is not a continuous arc, but very sporadic events and has been leaving visible damage to the dark shields and the chamber walls. I have cleaned the dark shields, chamber wall, and sample stage with sandpaper and wipe all the surfaces with solvents, but that did not seem to have an affect on the arcing issue.

This tool has also had a long issue with RF leakage effecting the mass flow controllers and RF tuning unit. Past lab users have tried to ground all the instruments that were effected but with minimal improvement.

Any information or help would be greatly appreciated.

Chito Kendrick
--
Chito Kendrick Ph.D.<https://urldefense.proofpoint.com/v2/url?u=https-3A__sites.google.com_site_chitokendrickphd_&d=CwMCaQ&c=WO-RGvefibhHBZq3fL85hQ&r=-H4Z_jeDfTYjnKPXor15vLwzBllmg8gFrb9m_k9OGks&m=21Cmj-bdePcgPaygv1HgfQEleEWP2YFt21m64ZGEOhQ&s=Ci5f7Sm0y_yaNm8KZeNFoX3U9S4KSK-UUE57JqqIWYU&e=>

Director of the Microfabrication Facility
Research Assistant Professor
Electrical and Computer Engineering
Michigan Technological University
Room 436 M&M Building
1400 Townsend Dr.
Houghton, Michigan 49931-1295

814-308-4255
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From na2661 at columbia.edu  Fri May 20 07:32:15 2016
From: na2661 at columbia.edu (Nava Ariel Sternberg)
Date: Fri, 20 May 2016 07:32:15 -0400
Subject: [labnetwork] Cleanroom near Univ. of Connecticut
In-Reply-To: <CAOfoCyjyoMV9H2s=7d4q73E3NnnZitoQnD_hsB3NPQLWNg-RsQ@mail.gmail.com>
References: <CAOfoCyjyoMV9H2s=7d4q73E3NnnZitoQnD_hsB3NPQLWNg-RsQ@mail.gmail.com>
Message-ID: <CABJtK-nFhjY85wkWoASz-RXgvk=NDK5EWUzrcvAEbCLrx-5QEg@mail.gmail.com>

Hi Kamal, all,

We are at the final stages of renovating our clean room, here at Columbia
University, and working in close collaboration with CUNY which is a few
blocks away.

You can check our website <http://nano.columbia.edu/shared-facilities-0>
and feel free to contact me for additional information.

Nava


Nava Ariel-Sternberg, Ph.D.
Director of CNI Facilities
Columbia University
530 W120th Street, NY 10027
Room 1020/MC 8903
Office: 212-854-9927
Cell: 201-562-7600


On Wed, May 18, 2016 at 6:54 PM, Kamal Yadav <kamal.yadav at gmail.com> wrote:

> Dear All,
>
> What are the options to use a cleanroom facility near University of
> Connecticut, for fabrication of MEMS based neural biomedical probes for
> somebody who will fall under academic user category.
>
> Some of the Options are?:
> 1. MIT
> 2. Harvard
> 3. U Mass Amherst.
> 4. ?
>
> --
> Thanks,
> Kamal
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
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From kamal.yadav at gmail.com  Wed May 25 01:32:37 2016
From: kamal.yadav at gmail.com (Kamal Yadav)
Date: Tue, 24 May 2016 22:32:37 -0700
Subject: [labnetwork] Cleanroom near Univ. of Connecticut
In-Reply-To: <CABJtK-nFhjY85wkWoASz-RXgvk=NDK5EWUzrcvAEbCLrx-5QEg@mail.gmail.com>
References: <CAOfoCyjyoMV9H2s=7d4q73E3NnnZitoQnD_hsB3NPQLWNg-RsQ@mail.gmail.com>
 <CABJtK-nFhjY85wkWoASz-RXgvk=NDK5EWUzrcvAEbCLrx-5QEg@mail.gmail.com>
Message-ID: <CAOfoCyhU84z6Prs+Yaob-cGO8kQ7-nbCqMztER4XD=ffZF-3zQ@mail.gmail.com>

Dear All,

Thank you for the overwhelming response for the cleanrooms near UConn. We
will now be able to figure out most convenient cleanroom for us.

Thanks a lot!


On Fri, May 20, 2016 at 4:32 AM, Nava Ariel Sternberg <na2661 at columbia.edu>
wrote:

> Hi Kamal, all,
>
> We are at the final stages of renovating our clean room, here at Columbia
> University, and working in close collaboration with CUNY which is a few
> blocks away.
>
> You can check our website <http://nano.columbia.edu/shared-facilities-0>
> and feel free to contact me for additional information.
>
> Nava
>
>
> Nava Ariel-Sternberg, Ph.D.
> Director of CNI Facilities
> Columbia University
> 530 W120th Street, NY 10027
> Room 1020/MC 8903
> Office: 212-854-9927
> Cell: 201-562-7600
>
>
> On Wed, May 18, 2016 at 6:54 PM, Kamal Yadav <kamal.yadav at gmail.com>
> wrote:
>
>> Dear All,
>>
>> What are the options to use a cleanroom facility near University of
>> Connecticut, for fabrication of MEMS based neural biomedical probes for
>> somebody who will fall under academic user category.
>>
>> Some of the Options are?:
>> 1. MIT
>> 2. Harvard
>> 3. U Mass Amherst.
>> 4. ?
>>
>> --
>> Thanks,
>> Kamal
>>
>>
>> _______________________________________________
>> labnetwork mailing list
>> labnetwork at mtl.mit.edu
>> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>>
>>
>


-- 
Thanks,
Kamal
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From fouad.karouta at anu.edu.au  Wed May 25 03:10:37 2016
From: fouad.karouta at anu.edu.au (Fouad Karouta)
Date: Wed, 25 May 2016 07:10:37 +0000
Subject: [labnetwork] HF Vapour Setup
Message-ID: <PS1PR0601MB14174C106D73745864FAE6EEC0400@PS1PR0601MB1417.apcprd06.prod.outlook.com>

Hi all,

We are in the process of installing a commercial HF vapour setup for MEMs-like technology.
The setup will be housed in a fume hood of which the exhaust has been connected to a wet scrubber.
With respect to Work, Health and Safety aspects we need to set a protocol for the usage of this. Our starting point will be the protocol for use of HF solutions, however I am seeking inputs helping us in this process from people who already make use of such a facility.
Also please let us know any points with relation to the wet scrubber and its maintenance, etc.

Thank you,
Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility
Research School of Physics and Engineering
Australian National University
ACT 0200, Canberra, Australia
Email: fouad.karouta at anu.edu.au<mailto:fouad.karouta at anu.edu.au>
http://anff-act.anu.edu.au/

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From linda.macks at unsw.edu.au  Fri May 27 20:14:44 2016
From: linda.macks at unsw.edu.au (Linda Macks)
Date: Sat, 28 May 2016 00:14:44 +0000
Subject: [labnetwork] ZEP-520A7 e-beam resist
Message-ID: <ME1PR01MB0850CA1B4EFD2083C43AC9DEB2430@ME1PR01MB0850.ausprd01.prod.outlook.com>

Hello labnetworkers,


We are having trouble sourcing ZEP-520A7 e-beam resist - if anyone knows of a supplier who can deliver to Australia, I would appreciate contact details.


Many thanks,


Linda



Dr Linda Macks
Facility Manager, ANFF-NSW
Australian National Fabrication Facility

School of Electrical Engineering & Telecommunications
University of New South Wales
UNSW Sydney NSW 2052
Australia

Phone: +61 (2) 9385 7845
Fax: +61(2) 9385 5114
Email: linda.macks at unsw.edu.au<mailto:linda.macks at unsw.edu.au>

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From lej at danchip.dtu.dk  Mon May 30 04:52:16 2016
From: lej at danchip.dtu.dk (Leif Johansen)
Date: Mon, 30 May 2016 08:52:16 +0000
Subject: [labnetwork] ZEP-520A7 e-beam resist
In-Reply-To: <ME1PR01MB0850CA1B4EFD2083C43AC9DEB2430@ME1PR01MB0850.ausprd01.prod.outlook.com>
References: <ME1PR01MB0850CA1B4EFD2083C43AC9DEB2430@ME1PR01MB0850.ausprd01.prod.outlook.com>
Message-ID: <879AEF5002D70747B136D02BC86A9C98665815@ait-pex02mbx05.win.dtu.dk>

Hello Linda,

Last time we purchased ZEP-520 was back in May 2014. We got it from Marubeni http://www.marubeni.com/
We have actually stopped using ZEP-520 due to the very high price. Instead, we have switched to AR-P C-6200 from Allresist GmbH http://www.allresist.com/csar-62-ar-p-6200/. If you are interested, we can provide you with more process details about this resist.
Another alternative would be the gL-2000 from Gluon Lab, which we purchased through Fine Material System Inc in Japan. We have tested this resist once, but we are not using it routinely in the lab.

Best regards,
Leif

Leif S. Johansen

Head of Operations

DTU Danchip



Technical University of Denmark

[http://www.dtu.dk/images/DTU_email_logo_01.gif]

Danchip

?rsteds Plads, Byg. 347

2800  Lyngby

Direct +45 45255713
Mobile +45 25348992

lesjo at danchip.dtu.dk<mailto:lesjo at danchip.dtu.dk>

www.danchip.dtu.dk/<http://www.danchip.dtu.dk/>








From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Linda Macks
Sent: 28. maj 2016 02:15
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] ZEP-520A7 e-beam resist


Hello labnetworkers,



We are having trouble sourcing ZEP-520A7 e-beam resist - if anyone knows of a supplier who can deliver to Australia, I would appreciate contact details.



Many thanks,



Linda




Dr Linda Macks
Facility Manager, ANFF-NSW
Australian National Fabrication Facility

School of Electrical Engineering & Telecommunications
University of New South Wales
UNSW Sydney NSW 2052
Australia

Phone: +61 (2) 9385 7845
Fax: +61(2) 9385 5114
Email: linda.macks at unsw.edu.au<mailto:linda.macks at unsw.edu.au>

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From duda at uchicago.edu  Tue May 31 10:01:08 2016
From: duda at uchicago.edu (Peter J Duda III)
Date: Tue, 31 May 2016 14:01:08 +0000
Subject: [labnetwork] ZEP-520A7 e-beam resist
In-Reply-To: <879AEF5002D70747B136D02BC86A9C98665815@ait-pex02mbx05.win.dtu.dk>
References: <ME1PR01MB0850CA1B4EFD2083C43AC9DEB2430@ME1PR01MB0850.ausprd01.prod.outlook.com>
 <879AEF5002D70747B136D02BC86A9C98665815@ait-pex02mbx05.win.dtu.dk>
Message-ID: <369CF1861066C244B747413441CCF52908D194C9@xm-mbx-08-prod>

Linda, Leif et al
FYI
GL-2000 has been discontinued recently and is no longer available through Gluon Lab.  They claim to be working on other high-performance resists, but give no specifics at this time.

Thanks
Peter J Duda
Technical Manager, Pritzker Nanofabrication Facility
Institute for Molecular Engineering
University of Chicago
5640 South Ellis Avenue
ERC LL178
Chicago, IL  60637
Office: 773-702-8903
Pager/Text:  773-652-0480
duda at uchicago.edu
ime.uchicago.edu

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Leif Johansen
Sent: Monday, May 30, 2016 3:52 AM
To: 'Linda Macks' <linda.macks at unsw.edu.au>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] ZEP-520A7 e-beam resist

Hello Linda,

Last time we purchased ZEP-520 was back in May 2014. We got it from Marubeni http://www.marubeni.com/
We have actually stopped using ZEP-520 due to the very high price. Instead, we have switched to AR-P C-6200 from Allresist GmbH http://www.allresist.com/csar-62-ar-p-6200/. If you are interested, we can provide you with more process details about this resist.
Another alternative would be the gL-2000 from Gluon Lab, which we purchased through Fine Material System Inc in Japan. We have tested this resist once, but we are not using it routinely in the lab.

Best regards,
Leif

Leif S. Johansen

Head of Operations

DTU Danchip



Technical University of Denmark

[http://www.dtu.dk/images/DTU_email_logo_01.gif]

Danchip

?rsteds Plads, Byg. 347

2800  Lyngby

Direct +45 45255713
Mobile +45 25348992

lesjo at danchip.dtu.dk<mailto:lesjo at danchip.dtu.dk>

www.danchip.dtu.dk/<http://www.danchip.dtu.dk/>








From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Linda Macks
Sent: 28. maj 2016 02:15
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] ZEP-520A7 e-beam resist


Hello labnetworkers,



We are having trouble sourcing ZEP-520A7 e-beam resist - if anyone knows of a supplier who can deliver to Australia, I would appreciate contact details.



Many thanks,



Linda




Dr Linda Macks
Facility Manager, ANFF-NSW
Australian National Fabrication Facility

School of Electrical Engineering & Telecommunications
University of New South Wales
UNSW Sydney NSW 2052
Australia

Phone: +61 (2) 9385 7845
Fax: +61(2) 9385 5114
Email: linda.macks at unsw.edu.au<mailto:linda.macks at unsw.edu.au>

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From kchow10 at gmail.com  Tue May 31 12:38:33 2016
From: kchow10 at gmail.com (Edmond Chow)
Date: Tue, 31 May 2016 11:38:33 -0500
Subject: [labnetwork] ZEP-520A7 e-beam resist
In-Reply-To: <369CF1861066C244B747413441CCF52908D194C9@xm-mbx-08-prod>
References: <ME1PR01MB0850CA1B4EFD2083C43AC9DEB2430@ME1PR01MB0850.ausprd01.prod.outlook.com>
 <879AEF5002D70747B136D02BC86A9C98665815@ait-pex02mbx05.win.dtu.dk>
 <369CF1861066C244B747413441CCF52908D194C9@xm-mbx-08-prod>
Message-ID: <CAAyE23DDv9mE1mHSzg+uV+_g4t2gm7m9GhhYtDG1CRZRc00h4Q@mail.gmail.com>

Hi,

I have a related question about ebeam resist. I have been using AquaSAVE as
anticharging layer for ebeam lithography.
However, I can't seem to find the distributor which will sell AquaSAVE in US

Do you have any information about how to get AquaSAVE from US or any
replacement for AquaSAVE?

Thanks in advance.

Edmond

On Tue, May 31, 2016 at 9:01 AM, Peter J Duda III <duda at uchicago.edu> wrote:

> Linda, Leif et al
>
> FYI
>
> GL-2000 has been discontinued recently and is no longer available through
> Gluon Lab.  They claim to be working on other high-performance resists, but
> give no specifics at this time.
>
>
>
> Thanks
>
> Peter J Duda
>
> Technical Manager, Pritzker Nanofabrication Facility
>
> Institute for Molecular Engineering
>
> University of Chicago
>
> 5640 South Ellis Avenue
>
> ERC LL178
>
> Chicago, IL  60637
>
> Office: 773-702-8903
> Pager/Text:  773-652-0480
>
> duda at uchicago.edu
>
> ime.uchicago.edu
>
>
>
> *From:* labnetwork-bounces at mtl.mit.edu [mailto:
> labnetwork-bounces at mtl.mit.edu] *On Behalf Of *Leif Johansen
> *Sent:* Monday, May 30, 2016 3:52 AM
> *To:* 'Linda Macks' <linda.macks at unsw.edu.au>; labnetwork at mtl.mit.edu
> *Subject:* Re: [labnetwork] ZEP-520A7 e-beam resist
>
>
>
> Hello Linda,
>
>
>
> Last time we purchased ZEP-520 was back in May 2014. We got it from
> Marubeni http://www.marubeni.com/
>
> We have actually stopped using ZEP-520 due to the very high price.
> Instead, we have switched to AR-P C-6200 from Allresist GmbH
> http://www.allresist.com/csar-62-ar-p-6200/. If you are interested, we
> can provide you with more process details about this resist.
>
> Another alternative would be the gL-2000 from Gluon Lab, which we
> purchased through Fine Material System Inc in Japan. We have tested this
> resist once, but we are not using it routinely in the lab.
>
>
>
> Best regards,
>
> Leif
>
>
>
> *Leif S. Johansen *
>
> Head of Operations
>
> DTU Danchip
>
>
>
> *Technical University of Denmark*
>
> [image: http://www.dtu.dk/images/DTU_email_logo_01.gif]
>
> Danchip
>
> ?rsteds Plads, Byg. 347
>
> 2800  Lyngby
>
> Direct +45 45255713
>
> Mobile +45 25348992
>
> lesjo at danchip.dtu.dk
>
> www.danchip.dtu.dk/
>
>
>
>
>
>
>
>
>
>
>
>
>
>
>
> *From:* labnetwork-bounces at mtl.mit.edu [
> mailto:labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu>] *On
> Behalf Of *Linda Macks
> *Sent:* 28. maj 2016 02:15
> *To:* labnetwork at mtl.mit.edu
> *Subject:* [labnetwork] ZEP-520A7 e-beam resist
>
>
>
> Hello labnetworkers,
>
>
>
> We are having trouble sourcing ZEP-520A7 e-beam resist - if anyone knows
> of a supplier who can deliver to Australia, I would appreciate contact
> details.
>
>
>
> Many thanks,
>
>
>
> Linda
>
>
>
>
>
> *Dr Linda Macks*
>
> Facility Manager, ANFF-NSW
>
> Australian National Fabrication Facility
>
>
>
> School of Electrical Engineering & Telecommunications
>
> University of New South Wales
>
> UNSW Sydney NSW 2052
>
> Australia
>
>
>
> Phone: +61 (2) 9385 7845
>
> Fax: +61(2) 9385 5114
>
> Email: linda.macks at unsw.edu.au
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>


-- 
Edmond Chow
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From cknollen at stanford.edu  Tue May 31 13:11:33 2016
From: cknollen at stanford.edu (Clifford F Knollenberg)
Date: Tue, 31 May 2016 17:11:33 +0000
Subject: [labnetwork] Aluminimum source crucible suggestions
Message-ID: <SN1PR02MB1663A62762808793FD33E573B5460@SN1PR02MB1663.namprd02.prod.outlook.com>

Hi All,


We've been having crucible cracking issues with out Al e-beam evaporation source.  In short it cracks its crucible after just a few uses.  This wasn't so bad when it happened ever 4-5 months, but not its happening about every week or two.  I've tried a variety of crucibles, had the most luck with carbon crucible.  Is there anything else out there we should be trying?


Cheers,


Cliff


Clifford Knollenberg

Science & Engineering Associate

Stanford Nano Shared Facilities (SNSF)

Email: cknollen at stanford.edu

Tel: 650-723-1675
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From na2661 at columbia.edu  Tue May 31 13:44:44 2016
From: na2661 at columbia.edu (Nava Ariel Sternberg)
Date: Tue, 31 May 2016 13:44:44 -0400
Subject: [labnetwork] Hands-on TEM workshop - no previous experience required
Message-ID: <CABJtK-kKK38VwzK9-E_fHVJ8ZgMJ8FRZsC3XhN_rFfEkSNAfCA@mail.gmail.com>

Dear all,

I'm happy to announce that we're having a TEM workshop on our new Talos
F200x this August at Columbia and the workshop is also open to external
users. Since it's part of a marketing strategy to increase our lab user
base we're offering it relatively cheap and with actual hands-on practice
as a part of it. We have 12 spots in this workshop, a few are still
available.

Could you please circulate this message and check with your
colleagues/employees if anyone would be interested in attending this
workshop?

The program and registration link can be found here:

http://nano.columbia.edu/transmission-electron-microscopy-workshop

Thanks!

Nava

Nava Ariel-Sternberg, Ph.D.
Director of CNI Facilities
Columbia University
530 W120th Street, NY 10027
Room 1020/MC 8903
Office: 212-854-9927
Cell: 201-562-7600
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From michael.rooks at yale.edu  Tue May 31 16:12:02 2016
From: michael.rooks at yale.edu (Michael Rooks)
Date: Tue, 31 May 2016 16:12:02 -0400
Subject: [labnetwork] ZEP-520A7 e-beam resist
In-Reply-To: <CAAyE23DDv9mE1mHSzg+uV+_g4t2gm7m9GhhYtDG1CRZRc00h4Q@mail.gmail.com>
References: <ME1PR01MB0850CA1B4EFD2083C43AC9DEB2430@ME1PR01MB0850.ausprd01.prod.outlook.com>
 <879AEF5002D70747B136D02BC86A9C98665815@ait-pex02mbx05.win.dtu.dk>
 <369CF1861066C244B747413441CCF52908D194C9@xm-mbx-08-prod>
 <CAAyE23DDv9mE1mHSzg+uV+_g4t2gm7m9GhhYtDG1CRZRc00h4Q@mail.gmail.com>
Message-ID: <574DF012.4040600@yale.edu>

For pmma and zep we simply sputter 20nm Au on top, then later remove it 
with KI/I gold etch (from Transene).

For HSQ on insulators we use our own mixture of PSS, a water soluble 
polymer, with gold on top. You can find the details here 
<http://nano.yale.edu/sites/default/files/files/pssa.pdf>. It's very cheap.

--------------------------------
Michael Rooks
Yale Institute of Nanoscience and Quantum Engineering
nano.yale.edu <http://nano.yale.edu>



On 05/31/2016 12:38 PM, Edmond Chow wrote:
> Hi,
>
> I have a related question about ebeam resist. I have been using 
> AquaSAVE as anticharging layer for ebeam lithography.
> However, I can't seem to find the distributor which will sell AquaSAVE 
> in US
>
> Do you have any information about how to get AquaSAVE from US or any 
> replacement for AquaSAVE?
>
> Thanks in advance.
>
> Edmond
>
> On Tue, May 31, 2016 at 9:01 AM, Peter J Duda III <duda at uchicago.edu 
> <mailto:duda at uchicago.edu>> wrote:
>
>     Linda, Leif et al
>
>     FYI
>
>     GL-2000 has been discontinued recently and is no longer available
>     through Gluon Lab.  They claim to be working on other
>     high-performance resists, but give no specifics at this time.
>
>     Thanks
>
>     Peter J Duda
>
>     Technical Manager, Pritzker Nanofabrication Facility
>
>     Institute for Molecular Engineering
>
>     University of Chicago
>
>     5640 South Ellis Avenue
>
>     ERC LL178
>
>     Chicago, IL  60637
>
>     Office: 773-702-8903 <tel:773-702-8903>
>     Pager/Text: 773-652-0480 <tel:773-652-0480>
>
>     duda at uchicago.edu <mailto:duda at uchicago.edu>
>
>     ime.uchicago.edu
>     <https://urldefense.proofpoint.com/v2/url?u=http-3A__ime.uchicago.edu&d=AwMFaQ&c=-dg2m7zWuuDZ0MUcV7Sdqw&r=apnDUg1OD9ejswcjrIvVgS28NpQ7-FGy7Sl7_YPlupc&m=xhKoiJKzGjZ4PAyPKU31jYluvUVbH-hwaqX_vwXIYwE&s=txauFZDRNt39sv6hSAlCenH1wfF7k-cTqV80LnAh-lg&e=>
>
>     *From:*labnetwork-bounces at mtl.mit.edu
>     <mailto:labnetwork-bounces at mtl.mit.edu>
>     [mailto:labnetwork-bounces at mtl.mit.edu
>     <mailto:labnetwork-bounces at mtl.mit.edu>] *On Behalf Of *Leif Johansen
>     *Sent:* Monday, May 30, 2016 3:52 AM
>     *To:* 'Linda Macks' <linda.macks at unsw.edu.au
>     <mailto:linda.macks at unsw.edu.au>>; labnetwork at mtl.mit.edu
>     <mailto:labnetwork at mtl.mit.edu>
>     *Subject:* Re: [labnetwork] ZEP-520A7 e-beam resist
>
>     Hello Linda,
>
>     Last time we purchased ZEP-520 was back in May 2014. We got it
>     from Marubeni http://www.marubeni.com/
>     <https://urldefense.proofpoint.com/v2/url?u=http-3A__www.marubeni.com_&d=AwMFaQ&c=-dg2m7zWuuDZ0MUcV7Sdqw&r=apnDUg1OD9ejswcjrIvVgS28NpQ7-FGy7Sl7_YPlupc&m=xhKoiJKzGjZ4PAyPKU31jYluvUVbH-hwaqX_vwXIYwE&s=EtvHsu62p-Fb3Flqssz76lbw0w8FOd4Nphxsppe_X1c&e=>
>
>     We have actually stopped using ZEP-520 due to the very high price.
>     Instead, we have switched to AR-P C-6200 from Allresist GmbH
>     http://www.allresist.com/csar-62-ar-p-6200/
>     <https://urldefense.proofpoint.com/v2/url?u=http-3A__www.allresist.com_csar-2D62-2Dar-2Dp-2D6200_&d=AwMFaQ&c=-dg2m7zWuuDZ0MUcV7Sdqw&r=apnDUg1OD9ejswcjrIvVgS28NpQ7-FGy7Sl7_YPlupc&m=xhKoiJKzGjZ4PAyPKU31jYluvUVbH-hwaqX_vwXIYwE&s=V3R48he1i7j8wgR2Ongk8aobIDJeprgB8ZUFRRlBblE&e=>.
>     If you are interested, we can provide you with more process
>     details about this resist.
>
>     Another alternative would be the gL-2000 from Gluon Lab, which we
>     purchased through Fine Material System Inc in Japan. We have
>     tested this resist once, but we are not using it routinely in the
>     lab.
>
>     Best regards,
>
>     Leif
>
>     *Leif S. Johansen *
>
>     Head of Operations
>
>     DTU Danchip
>
>     *Technical University of Denmark*
>
>     	
>
>     http://www.dtu.dk/images/DTU_email_logo_01.gif
>
>     Danchip
>
>     ?rsteds Plads, Byg. 347
>
>     2800 Lyngby
>
>     Direct +45 45255713 <tel:%2B45%2045255713>
>
>     Mobile +45 25348992 <tel:%2B45%2025348992>
>
>     lesjo at danchip.dtu.dk <mailto:lesjo at danchip.dtu.dk>
>
>     www.danchip.dtu.dk/
>     <https://urldefense.proofpoint.com/v2/url?u=http-3A__www.danchip.dtu.dk_&d=AwMFaQ&c=-dg2m7zWuuDZ0MUcV7Sdqw&r=apnDUg1OD9ejswcjrIvVgS28NpQ7-FGy7Sl7_YPlupc&m=xhKoiJKzGjZ4PAyPKU31jYluvUVbH-hwaqX_vwXIYwE&s=bad6otKPG_IPaLUNRy_wPwTwiOheGoHbLQS8KTbnNz4&e=>
>
>
>     *From:*labnetwork-bounces at mtl.mit.edu
>     <mailto:labnetwork-bounces at mtl.mit.edu>
>     [mailto:labnetwork-bounces at mtl.mit.edu] *On Behalf Of *Linda Macks
>     *Sent:* 28. maj 2016 02:15
>     *To:* labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu>
>     *Subject:* [labnetwork] ZEP-520A7 e-beam resist
>
>     Hello labnetworkers,
>
>     We are having trouble sourcing ZEP-520A7 e-beam resist - if anyone
>     knows of a supplier who can deliver to Australia, I would
>     appreciate contact details.
>
>     Many thanks,
>
>     Linda
>
>     *Dr Linda Macks*
>
>     Facility Manager, ANFF-NSW
>
>     Australian National Fabrication Facility
>
>     School of Electrical Engineering & Telecommunications
>
>     University of New South Wales
>
>     UNSW Sydney NSW 2052
>
>     Australia
>
>     Phone: +61 (2) 9385 7845 <tel:%2B61%20%282%29%209385%207845>
>
>     Fax: +61(2) 9385 5114 <tel:%2B61%282%29%209385%205114>
>
>     Email: linda.macks at unsw.edu.au <mailto:linda.macks at unsw.edu.au>
>
>
>     _______________________________________________
>     labnetwork mailing list
>     labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu>
>     https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>     <https://urldefense.proofpoint.com/v2/url?u=https-3A__www-2Dmtl.mit.edu_mailman_listinfo.cgi_labnetwork&d=AwMFaQ&c=-dg2m7zWuuDZ0MUcV7Sdqw&r=apnDUg1OD9ejswcjrIvVgS28NpQ7-FGy7Sl7_YPlupc&m=xhKoiJKzGjZ4PAyPKU31jYluvUVbH-hwaqX_vwXIYwE&s=RRU0020tPG8y8qIquWl4_iFITzIBEKKmUgXezsk4jMs&e=>
>
>
>
>
> -- 
> Edmond Chow
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://urldefense.proofpoint.com/v2/url?u=https-3A__www-2Dmtl.mit.edu_mailman_listinfo.cgi_labnetwork&d=AwICAg&c=-dg2m7zWuuDZ0MUcV7Sdqw&r=apnDUg1OD9ejswcjrIvVgS28NpQ7-FGy7Sl7_YPlupc&m=xhKoiJKzGjZ4PAyPKU31jYluvUVbH-hwaqX_vwXIYwE&s=RRU0020tPG8y8qIquWl4_iFITzIBEKKmUgXezsk4jMs&e=

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From sbhas at uchicago.edu  Tue May 31 16:37:46 2016
From: sbhas at uchicago.edu (Shivakumar Bhaskaran)
Date: Tue, 31 May 2016 20:37:46 +0000
Subject: [labnetwork] Aluminimum source crucible suggestions
In-Reply-To: <SN1PR02MB1663A62762808793FD33E573B5460@SN1PR02MB1663.namprd02.prod.outlook.com>
References: <SN1PR02MB1663A62762808793FD33E573B5460@SN1PR02MB1663.namprd02.prod.outlook.com>
Message-ID: <A71ECB2B7F230841A953EFA3D299504A288ACD68@xm-mbx-08-prod>

Cliff,

Aluminum needs to be evaporated slowly. Sometimes users will ramp the power faster and due to this the Al tend to come out of the liner and get into gap between the liner and the copper pocket, and this will lead to the cracking of the crucible. With slow ramping also we have seen the liner keeps cracking. So I always use Al without any liner, we have one pocket dedicated only for Al.
If you still want to use liner then try fabmate crucible from lesker
http://www.lesker.com/newweb/evaporation_sources/ebeam_crucibles_fabmate.cfm?pgid=0

Other suggestion is using Tungsten Crucible, but I haven't tested this with Al.

-Shiva

Shivakumar Bhaskaran, Ph.D.
Searle CleanRoom Manager
The University of Chicago
5735 S.Ellis, Room 032
Chicago-60637
Ph:773-795-2297
https://searle-cleanroom.uchicago.edu/

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Clifford F Knollenberg
Sent: Tuesday, May 31, 2016 12:12 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Aluminimum source crucible suggestions


Hi All,



We've been having crucible cracking issues with out Al e-beam evaporation source.  In short it cracks its crucible after just a few uses.  This wasn't so bad when it happened ever 4-5 months, but not its happening about every week or two.  I've tried a variety of crucibles, had the most luck with carbon crucible.  Is there anything else out there we should be trying?



Cheers,



Cliff



Clifford Knollenberg

Science & Engineering Associate

Stanford Nano Shared Facilities (SNSF)

Email: cknollen at stanford.edu<mailto:cknollen at stanford.edu>

Tel: 650-723-1675
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From jasmall at ucdavis.edu  Tue May 31 17:56:46 2016
From: jasmall at ucdavis.edu (Yusha A Bey)
Date: Tue, 31 May 2016 21:56:46 +0000
Subject: [labnetwork] Aluminimum source crucible suggestions
In-Reply-To: <SN1PR02MB1663A62762808793FD33E573B5460@SN1PR02MB1663.namprd02.prod.outlook.com>
References: <SN1PR02MB1663A62762808793FD33E573B5460@SN1PR02MB1663.namprd02.prod.outlook.com>
Message-ID: <SN1PR0801MB1614F56F33E2C2798D9A524EAB460@SN1PR0801MB1614.namprd08.prod.outlook.com>

Hi Cliff,


We had the same issue with Al in graphite crucibles.


Al deposition in intermetallic crucibles has been working perfectly for us.


Regards,

Yusha


Yusha Bey, Ph.D.

Senior Development Engineer

Center for Nano-Micromanufacturing (CNM2)

University of California Davis

________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Clifford F Knollenberg <cknollen at stanford.edu>
Sent: Tuesday, May 31, 2016 10:11:33 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Aluminimum source crucible suggestions


Hi All,


We've been having crucible cracking issues with out Al e-beam evaporation source.  In short it cracks its crucible after just a few uses.  This wasn't so bad when it happened ever 4-5 months, but not its happening about every week or two.  I've tried a variety of crucibles, had the most luck with carbon crucible.  Is there anything else out there we should be trying?


Cheers,


Cliff


Clifford Knollenberg

Science & Engineering Associate

Stanford Nano Shared Facilities (SNSF)

Email: cknollen at stanford.edu

Tel: 650-723-1675
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From steffen.8 at osu.edu  Tue May 31 18:22:18 2016
From: steffen.8 at osu.edu (Steffen, Paul)
Date: Tue, 31 May 2016 22:22:18 +0000
Subject: [labnetwork] Aluminimum source crucible suggestions
In-Reply-To: <SN1PR02MB1663A62762808793FD33E573B5460@SN1PR02MB1663.namprd02.prod.outlook.com>
References: <SN1PR02MB1663A62762808793FD33E573B5460@SN1PR02MB1663.namprd02.prod.outlook.com>
Message-ID: <EB1017E1ADE1B54A89F4420830401055771F1772@CIO-TNC-D2MBX04.osuad.osu.edu>

Cliff,

We had problems with cracking liners and also aluminum wicking up intermetallic BN-TiB2 liners and bridging to the edge of the hearth pocket causing drops in the deposition rate due to heat conduction. We found out about an alternate approach used on an older CHA ebeam evaporator on campus with the same pocket size (15 cc): they dispensed with the liner and just made an aluminum melt directly in the pocket. The edges that touch the pocket are oxidized so you can still remove the melt slug. If you maintain the melt slug to the top of the pocket, then you don't have to worry about deposition on the sides of the pocket either. Please contact me if you would like more information.

-Paul

[The Ohio State University]
Paul Steffen
Lab Manager
Institute for Materials Research Nanotech West Lab
100 Science Village, 1381 Kinnear Road, Columbus, OH 43212
614-688-3546 Office / 614-688-3379 Fax
steffen.8 at osu.edu<mailto:steffen.8 at osu.edu> nanotech.osu.edu<http://nanotech.osu.edu>



From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Clifford F Knollenberg
Sent: Tuesday, May 31, 2016 1:12 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Aluminimum source crucible suggestions


Hi All,



We've been having crucible cracking issues with out Al e-beam evaporation source.  In short it cracks its crucible after just a few uses.  This wasn't so bad when it happened ever 4-5 months, but not its happening about every week or two.  I've tried a variety of crucibles, had the most luck with carbon crucible.  Is there anything else out there we should be trying?



Cheers,



Cliff



Clifford Knollenberg

Science & Engineering Associate

Stanford Nano Shared Facilities (SNSF)

Email: cknollen at stanford.edu<mailto:cknollen at stanford.edu>

Tel: 650-723-1675
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From fplu at wisc.edu  Tue May 31 18:32:19 2016
From: fplu at wisc.edu (Felix Lu)
Date: Tue, 31 May 2016 22:32:19 +0000
Subject: [labnetwork] Aluminimum source crucible suggestions
In-Reply-To: <SN1PR02MB1663A62762808793FD33E573B5460@SN1PR02MB1663.namprd02.prod.outlook.com>
References: <SN1PR02MB1663A62762808793FD33E573B5460@SN1PR02MB1663.namprd02.prod.outlook.com>
Message-ID: <13FB78B3-B153-4234-A66C-32FC82F41400@wisc.edu>

HI Cliff,

    I had the same problem a few years ago using the evaporator at UNC Chapel Hill. We were using a graphite crucible and the aluminum would creep up the side and I think the surface tension of the metal would break the crucible as it cooled - after a few cycles. I talked the guys over at Kamis (NY) and I don?t recall the crucible liner we bought from them now (some boron alloy in conjunction with graphite spacers?) but it worked (haven?t heard of a break). I would talk to them if you haven?t done so already.

Best,

Felix

On May 31, 2016, at 12:11 PM, Clifford F Knollenberg <cknollen at stanford.edu<mailto:cknollen at stanford.edu>> wrote:


Hi All,


We've been having crucible cracking issues with out Al e-beam evaporation source.  In short it cracks its crucible after just a few uses.  This wasn't so bad when it happened ever 4-5 months, but not its happening about every week or two.  I've tried a variety of crucibles, had the most luck with carbon crucible.  Is there anything else out there we should be trying?


Cheers,


Cliff


Clifford Knollenberg

Science & Engineering Associate

Stanford Nano Shared Facilities (SNSF)

Email: cknollen at stanford.edu<mailto:cknollen at stanford.edu>

Tel: 650-723-1675

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

------------------------------------------------------
Felix Lu, Ph.D.
Co-Director, Advanced Materials Industrial Consortium (AMIC) &
Faculty Associate

http://uwamic.wisc.edu

Room 3106, Engineering Centers Building
1550 Engineering Drive
Madison, WI 53706

OFFICE: (608) 262-6099
FAX: (608) 265-2614






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From cknollen at stanford.edu  Tue May 31 18:45:17 2016
From: cknollen at stanford.edu (Clifford F Knollenberg)
Date: Tue, 31 May 2016 22:45:17 +0000
Subject: [labnetwork] Aluminimum source crucible suggestions
In-Reply-To: <EB1017E1ADE1B54A89F4420830401055771F1772@CIO-TNC-D2MBX04.osuad.osu.edu>
References: <SN1PR02MB1663A62762808793FD33E573B5460@SN1PR02MB1663.namprd02.prod.outlook.com>,
 <EB1017E1ADE1B54A89F4420830401055771F1772@CIO-TNC-D2MBX04.osuad.osu.edu>
Message-ID: <SN1PR02MB1663429C7DBE4A6D7830F1CBB5460@SN1PR02MB1663.namprd02.prod.outlook.com>

Thank you all for your suggestions and comments.  I think I have some good ideas to work from.


Cheers,


Cliff



Clifford Knollenberg

Science & Engineering Associate

Stanford Nano Shared Facilities (SNSF)

Email: cknollen at stanford.edu

Tel: 650-723-1675


________________________________
From: Steffen, Paul <steffen.8 at osu.edu>
Sent: Tuesday, May 31, 2016 3:22 PM
To: Clifford F Knollenberg; labnetwork at mtl.mit.edu
Subject: RE: Aluminimum source crucible suggestions


Cliff,



We had problems with cracking liners and also aluminum wicking up intermetallic BN-TiB2 liners and bridging to the edge of the hearth pocket causing drops in the deposition rate due to heat conduction. We found out about an alternate approach used on an older CHA ebeam evaporator on campus with the same pocket size (15 cc): they dispensed with the liner and just made an aluminum melt directly in the pocket. The edges that touch the pocket are oxidized so you can still remove the melt slug. If you maintain the melt slug to the top of the pocket, then you don't have to worry about deposition on the sides of the pocket either. Please contact me if you would like more information.



-Paul



[The Ohio State University]
Paul Steffen
Lab Manager
Institute for Materials Research Nanotech West Lab
100 Science Village, 1381 Kinnear Road, Columbus, OH 43212
614-688-3546 Office / 614-688-3379 Fax
steffen.8 at osu.edu<mailto:steffen.8 at osu.edu> nanotech.osu.edu<http://nanotech.osu.edu>







From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Clifford F Knollenberg
Sent: Tuesday, May 31, 2016 1:12 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Aluminimum source crucible suggestions



Hi All,



We've been having crucible cracking issues with out Al e-beam evaporation source.  In short it cracks its crucible after just a few uses.  This wasn't so bad when it happened ever 4-5 months, but not its happening about every week or two.  I've tried a variety of crucibles, had the most luck with carbon crucible.  Is there anything else out there we should be trying?



Cheers,



Cliff



Clifford Knollenberg

Science & Engineering Associate

Stanford Nano Shared Facilities (SNSF)

Email: cknollen at stanford.edu<mailto:cknollen at stanford.edu>

Tel: 650-723-1675
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From mmoneck at andrew.cmu.edu  Tue May 31 23:04:49 2016
From: mmoneck at andrew.cmu.edu (Matt Moneck)
Date: Tue, 31 May 2016 23:04:49 -0400
Subject: [labnetwork] ZEP-520A7 e-beam resist
In-Reply-To: <574DF012.4040600@yale.edu>
References: <ME1PR01MB0850CA1B4EFD2083C43AC9DEB2430@ME1PR01MB0850.ausprd01.prod.outlook.com>
 <879AEF5002D70747B136D02BC86A9C98665815@ait-pex02mbx05.win.dtu.dk>
 <369CF1861066C244B747413441CCF52908D194C9@xm-mbx-08-prod>
 <CAAyE23DDv9mE1mHSzg+uV+_g4t2gm7m9GhhYtDG1CRZRc00h4Q@mail.gmail.com>
 <574DF012.4040600@yale.edu>
Message-ID: <09e401d1bbb2$5c97a570$15c6f050$@andrew.cmu.edu>

Hi Edmond,

 

To add to Michael?s comment, we have used a similar approach with 10nm of
sputtered Al on PMMA.  After exposure, we remove the Al with standard
potassium hydroxide or TMAH based developers, such as AZ400k or MF-CD26.
The PMMA can then be developed in MIBK/IPA without issue.  

 

Best Regards,

 

Matt

 

-- 
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility
Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu <http://www.ece.cmu.edu> 
nanofab.ece.cmu.edu

 

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu]
On Behalf Of Michael Rooks
Sent: Tuesday, May 31, 2016 4:12 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] ZEP-520A7 e-beam resist

 

For pmma and zep we simply sputter 20nm Au on top, then later remove it with
KI/I gold etch (from Transene).

For HSQ on insulators we use our own mixture of PSS, a water soluble
polymer, with gold on top. You can find the details here
<http://nano.yale.edu/sites/default/files/files/pssa.pdf> . It's very cheap.


--------------------------------
Michael Rooks 
Yale Institute of Nanoscience and Quantum Engineering 
nano.yale.edu <http://nano.yale.edu>  




On 05/31/2016 12:38 PM, Edmond Chow wrote:

Hi, 

 

I have a related question about ebeam resist. I have been using AquaSAVE as
anticharging layer for ebeam lithography.

However, I can't seem to find the distributor which will sell AquaSAVE in US

 

Do you have any information about how to get AquaSAVE from US or any
replacement for AquaSAVE?

 

Thanks in advance.

 

Edmond

 

On Tue, May 31, 2016 at 9:01 AM, Peter J Duda III <duda at uchicago.edu
<mailto:duda at uchicago.edu> > wrote:

Linda, Leif et al

FYI 

GL-2000 has been discontinued recently and is no longer available through
Gluon Lab.  They claim to be working on other high-performance resists, but
give no specifics at this time.  

 

Thanks

Peter J Duda

Technical Manager, Pritzker Nanofabrication Facility

Institute for Molecular Engineering

University of Chicago

5640 South Ellis Avenue

ERC LL178

Chicago, IL  60637

Office: 773-702-8903 <tel:773-702-8903> 
Pager/Text:  773-652-0480 <tel:773-652-0480> 

duda at uchicago.edu <mailto:duda at uchicago.edu> 

ime.uchicago.edu
<https://urldefense.proofpoint.com/v2/url?u=http-3A__ime.uchicago.edu&d=AwMF
aQ&c=-dg2m7zWuuDZ0MUcV7Sdqw&r=apnDUg1OD9ejswcjrIvVgS28NpQ7-FGy7Sl7_YPlupc&m=
xhKoiJKzGjZ4PAyPKU31jYluvUVbH-hwaqX_vwXIYwE&s=txauFZDRNt39sv6hSAlCenH1wfF7k-
cTqV80LnAh-lg&e=> 

 

From: labnetwork-bounces at mtl.mit.edu <mailto:labnetwork-bounces at mtl.mit.edu>
[mailto:labnetwork-bounces at mtl.mit.edu
<mailto:labnetwork-bounces at mtl.mit.edu> ] On Behalf Of Leif Johansen
Sent: Monday, May 30, 2016 3:52 AM
To: 'Linda Macks' <linda.macks at unsw.edu.au <mailto:linda.macks at unsw.edu.au>
>; labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu> 
Subject: Re: [labnetwork] ZEP-520A7 e-beam resist

 

Hello Linda, 

 

Last time we purchased ZEP-520 was back in May 2014. We got it from Marubeni
<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.marubeni.com_&d=AwM
FaQ&c=-dg2m7zWuuDZ0MUcV7Sdqw&r=apnDUg1OD9ejswcjrIvVgS28NpQ7-FGy7Sl7_YPlupc&m
=xhKoiJKzGjZ4PAyPKU31jYluvUVbH-hwaqX_vwXIYwE&s=EtvHsu62p-Fb3Flqssz76lbw0w8FO
d4Nphxsppe_X1c&e=> The MTL Mail Server has detected a possible fraud attempt
from "urldefense.proofpoint.com" claiming to be http://www.marubeni.com/

We have actually stopped using ZEP-520 due to the very high price. Instead,
we have switched to AR-P C-6200 from Allresist GmbH
<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.allresist.com_csar-
2D62-2Dar-2Dp-2D6200_&d=AwMFaQ&c=-dg2m7zWuuDZ0MUcV7Sdqw&r=apnDUg1OD9ejswcjrI
vVgS28NpQ7-FGy7Sl7_YPlupc&m=xhKoiJKzGjZ4PAyPKU31jYluvUVbH-hwaqX_vwXIYwE&s=V3
R48he1i7j8wgR2Ongk8aobIDJeprgB8ZUFRRlBblE&e=> The MTL Mail Server has
detected a possible fraud attempt from "urldefense.proofpoint.com" claiming
to be http://www.allresist.com/csar-62-ar-p-6200/. If you are interested, we
can provide you with more process details about this resist. 

Another alternative would be the gL-2000 from Gluon Lab, which we purchased
through Fine Material System Inc in Japan. We have tested this resist once,
but we are not using it routinely in the lab. 

 

Best regards, 

Leif

 


Leif S. Johansen 


Head of Operations


DTU Danchip 


  


Technical University of Denmark




Danchip 


?rsteds Plads, Byg. 347 


2800  Lyngby 


Direct +45 45255713 <tel:%2B45%2045255713>  

Mobile +45 25348992 <tel:%2B45%2025348992> 


lesjo at danchip.dtu.dk <mailto:lesjo at danchip.dtu.dk>  


 
<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.danchip.dtu.dk_&d=A
wMFaQ&c=-dg2m7zWuuDZ0MUcV7Sdqw&r=apnDUg1OD9ejswcjrIvVgS28NpQ7-FGy7Sl7_YPlupc
&m=xhKoiJKzGjZ4PAyPKU31jYluvUVbH-hwaqX_vwXIYwE&s=bad6otKPG_IPaLUNRy_wPwTwiOh
eGoHbLQS8KTbnNz4&e=> The MTL Mail Server has detected a possible fraud
attempt from "urldefense.proofpoint.com" claiming to be www.danchip.dtu.dk/ 

 

 

 

 

 

 

 

From: labnetwork-bounces at mtl.mit.edu <mailto:labnetwork-bounces at mtl.mit.edu>
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Linda Macks
Sent: 28. maj 2016 02:15
To: labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu> 
Subject: [labnetwork] ZEP-520A7 e-beam resist

 

Hello labnetworkers,

 

We are having trouble sourcing ZEP-520A7 e-beam resist - if anyone knows of
a supplier who can deliver to Australia, I would appreciate contact details.

 

Many thanks,

 

Linda

 

 

Dr Linda Macks

Facility Manager, ANFF-NSW

Australian National Fabrication Facility

 

School of Electrical Engineering & Telecommunications

University of New South Wales

UNSW Sydney NSW 2052

Australia

 

Phone: +61 (2) 9385 7845 <tel:%2B61%20%282%29%209385%207845> 

Fax: +61(2) 9385 5114 <tel:%2B61%282%29%209385%205114> 

Email: linda.macks at unsw.edu.au <mailto:linda.macks at unsw.edu.au> 

 


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labnetwork mailing list
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-- 

Edmond Chow






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labnetwork mailing list
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lupc&m=xhKoiJKzGjZ4PAyPKU31jYluvUVbH-hwaqX_vwXIYwE&s=RRU0020tPG8y8qIquWl4_iF
ITzIBEKKmUgXezsk4jMs&e= 

 

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