[labnetwork] Etching Alumina (ALD) using BCl3
N P VAMSI KRISHNA
vamsinittala at gmail.com
Tue Apr 18 13:25:33 EDT 2017
Dear Aju,
I had used the ALD Al2O3 long back. Here is the recipe I used in Plasmalab
100 OPT tool:
BCl3 50 sccm
Pressure 2mT
ICP Power 1250 W
Electrode 300 W
Temperature 10°C
Backside He 15 Torr
Etch Rate: 36-38 nm/min
Selectivity to PR: ~ 0.4:1
PR I used was AZ5214E for which selectivity was average, so I had used the
thick AZ4562 which has very good selectivity.
In your case as the Alumina is only 30 nm, S1813 may survive. You may want
try spinning at slightly lower rpm (~3K).
Hope it helps.
Thanks & best regards,
vamsi
On Tue, Apr 18, 2017 at 8:24 PM, Jugessur, Aju S <aju-jugessur at uiowa.edu>
wrote:
>
> Hi,
>
> Can anyone offer some advice on Alumina etch?
>
> We do have BCl3/Cl2/O2 etch on our Oxford PlasmaPro.
> We plan to use S1818 as the mask as we intend etching less than 30 nm of
> the Alumina: will this work? I am not sure what is the etch selectivity.
> We may also use an intermediate metal mask. I am aware that ChF3 and C4F8
> also etches Alumina.
>
> Can anyone advise us on this process and a benchmark recipe will help?
>
> Also, the tool is currently used for III-V etching. Can we safely use the
> tool to etch Alumina without the risk of process contamination, assuming we
> do a clean up step each time?
>
> Thanks
> Regards
> Aju
>
>
>
> Aju Jugessur *Ph.D.*
> Director, University of Iowa Microfabrication Facility
> Professor (Adj.), Physics and Astronomy
> OSTC, Iowa Advanced Technology Labs
> University of Iowa
>
> 205 N. Madison St
> Iowa City, IA 52242
> 319 -353-2342 <03193%20532%20342>
> aju-jugessur at uiowa.edu
> http://ostc.uiowa.edu/uimf
>
>
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>
--
--
Thanks & Best Regards,
-----------------
*N.P.Vamsi Krishna*
Center for Nano Science and Engineering (CeNSE),
Indian Institute of Science(IISc), Bangalore.
INDIA-560012
“Educating the mind without educating the heart is no education at all.”
-Aristotle
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