From price.798 at osu.edu  Tue Aug  1 09:46:56 2017
From: price.798 at osu.edu (Price, Aimee)
Date: Tue, 1 Aug 2017 13:46:56 +0000
Subject: [labnetwork] Metamaterials deposition - Ag and SiO2
In-Reply-To: <SN2PR04MB22051A88A3546753AE080B84C5B30@SN2PR04MB2205.namprd04.prod.outlook.com>
References: <SN2PR04MB22051A88A3546753AE080B84C5B30@SN2PR04MB2205.namprd04.prod.outlook.com>
Message-ID: <83583687862B8444A85296A4944147DFB5131A16@CIO-TNC-D2MBX03.osuad.osu.edu>

Esta,
We have not, to my knowledge, done multilayer stacks.  However, we do evaporate SiO2 in our "multi-use" ebeam evaporator but not in the one we use for metal contacts.  We use a different quartz crystal monitor for SiO2 and Hafnium oxide than we do for metals.  We have found that using separate crystals works best to maintain proper z-ratios for both.

I've copied our lab manager who has worked extensively on this.

Aimee

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Abelev, Esta
Sent: Monday, July 31, 2017 8:10 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Metamaterials deposition - Ag and SiO2

Dear Colleagues,

Recently, we got a request to deposit SiO2 and Ag in our e-beam evaporator. We have only one e-beam UHV evaporator (brand new) which we planned to dedicate for metals (only). From what was discussed the group is planning to deposit alternative layers of SiO2 and Ag (10-20nm thick) to ~1micron thick overall thickness.
Did anyone have experience with similar multilayer structures, would you advise me if e-beam evaporation or sputtering would better for this project?
If we will have to go with evaporation of SiO2, will it have contamination issues with metal deposition?

Thanks for advice, Esta

-----------------------
Esta Abelev, PhD
Technical Director, Petersen Institute of NanoScience and Engineering
University of Pittsburgh | 3700 O'Hara Street | 636| Pittsburgh, PA 15261
412-383-4096 | eabelev at pitt.edu<mailto:eabelev at pitt.edu> | nano.pitt.edu<https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0>


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From zhongruiwang at umass.edu  Tue Aug  1 15:52:43 2017
From: zhongruiwang at umass.edu (Zhongrui Wang)
Date: Tue, 1 Aug 2017 15:52:43 -0400
Subject: [labnetwork] Metamaterials deposition - Ag and SiO2
In-Reply-To: <83583687862B8444A85296A4944147DFB5131A16@CIO-TNC-D2MBX03.osuad.osu.edu>
References: <SN2PR04MB22051A88A3546753AE080B84C5B30@SN2PR04MB2205.namprd04.prod.outlook.com>
 <83583687862B8444A85296A4944147DFB5131A16@CIO-TNC-D2MBX03.osuad.osu.edu>
Message-ID: <006001d30aff$bd56d8c0$38048a40$@umass.edu>

Hi Esta,

 

I have tried both. Both evaporation and sputtering could do. There should
not be contamination issue. There definitely will be evaporated SiOx
sticking to the sidewall of the evaporator chamber. However they are
chemically stable thus won't react with subsequent metal deposition. The
evaporated SiO2 and sputtered SiO2 are generally porous to some extent. And
the evaporated one seems to be even more porous. 

 

Best,

 

Zhongrui

 

Postdoc ECE UMass

 

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu]
On Behalf Of Price, Aimee
Sent: Tuesday, August 1, 2017 9:47 AM
To: Abelev, Esta <eabelev at pitt.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Metamaterials deposition - Ag and SiO2

 

Esta,

We have not, to my knowledge, done multilayer stacks.  However, we do
evaporate SiO2 in our "multi-use" ebeam evaporator but not in the one we use
for metal contacts.  We use a different quartz crystal monitor for SiO2 and
Hafnium oxide than we do for metals.  We have found that using separate
crystals works best to maintain proper z-ratios for both.

 

I've copied our lab manager who has worked extensively on this.  

 

Aimee

 

From: labnetwork-bounces at mtl.mit.edu <mailto:labnetwork-bounces at mtl.mit.edu>
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Abelev, Esta
Sent: Monday, July 31, 2017 8:10 PM
To: labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu> 
Subject: [labnetwork] Metamaterials deposition - Ag and SiO2

 

Dear Colleagues,

 

Recently, we got a request to deposit SiO2 and Ag in our e-beam evaporator.
We have only one e-beam UHV evaporator (brand new) which we planned to
dedicate for metals (only). From what was discussed the group is planning to
deposit alternative layers of SiO2 and Ag (10-20nm thick) to ~1micron thick
overall thickness. 

Did anyone have experience with similar multilayer structures, would you
advise me if e-beam evaporation or sputtering would better for this project?

If we will have to go with evaporation of SiO2, will it have contamination
issues with metal deposition?

 

Thanks for advice, Esta

 

-----------------------

Esta Abelev, PhD

Technical Director, Petersen Institute of NanoScience and Engineering 

University of Pittsburgh | 3700 O'Hara Street | 636| Pittsburgh, PA 15261

412-383-4096 |  <mailto:eabelev at pitt.edu> eabelev at pitt.edu |
<https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pi
tt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe
18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU
7ultmBoZmm%2FaZ2Itc%3D&reserved=0> nano.pitt.edu

 

 

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From msimmons at intelli-vation.com  Tue Aug  1 17:28:14 2017
From: msimmons at intelli-vation.com (Mike Simmons)
Date: Tue, 1 Aug 2017 15:28:14 -0600
Subject: [labnetwork] Metamaterials deposition - Ag and SiO2
In-Reply-To: <SN2PR04MB22051A88A3546753AE080B84C5B30@SN2PR04MB2205.namprd04.prod.outlook.com>
References: <SN2PR04MB22051A88A3546753AE080B84C5B30@SN2PR04MB2205.namprd04.prod.outlook.com>
Message-ID: <0dbc55b7-fcfd-8b40-6232-d1742144a5c0@intelli-vation.com>

Greetings Esta,

You might consider e-beam evaporation for the Ag and thermal sublimation 
for the SiO2 if this is convenient given your machine architecture.  
Keep in mind that SiO2 vapor goes everywhere in the system; much more so 
than evaporated metals.  If you are hesitant to put SiO2 into this new 
system in the first place, consider that it will try to find every nook 
and crannie in your new chamber so that you'll want to budget enough 
time to take the appropriate precautions prior to deposition.  If those 
precautions are taken and the system is properly cleaned after the SiO2 
work, I would not expect you to have troubles with future metal 
deposition in that system.

We have experience sputtering both of those materials.  They sputter 
very well and as is typical, the density of the sputter deposited layer 
is generally greater than the evaporated layer, so that could be factor 
depending upon the desired properties of the deposited film.  SiO2 via 
sputtering can be done by RF with an extremely low deposition rate, or 
with a doped Silicon or doped SiO2 target by DC or pulsed DC 
sputtering.  Aluminum is a typical dopant and just a few percent will 
make it conductive enough to DC sputter in this fashion, though you'll 
have to determine if the doped SiO2 index is acceptable.  The deposition 
rate of doped target SiO2 by pulsed DC, while significantly better than 
RF, is also rather low unless you have a good reactive sputter control 
that keeps the process running high on the hysteresis curve. Overall, 
evaporating the materials is simpler and higher rate than sputtering 
them, particularly for the SiO2, though the films will be somewhat 
denser by sputtering.

Best of luck to you!
Mike

*Mike Simmons*
President, INTELLIVATION LLC
1230 Blue Spruce Drive, Suite 3 *|* Fort Collins, CO 80524, USA
+1 (970) 692-2335 *office**|* +1 (888) 800-9561 *fax***
www.intelli-vation.com

On 7/31/2017 6:09 PM, Abelev, Esta wrote:
>
> Dear Colleagues,
>
> Recently, we got a request to deposit SiO2 and Ag in our e-beam 
> evaporator. We have only one e-beam UHV evaporator (brand new) which 
> we planned to dedicate for metals (only). From what was discussed the 
> group is planning to deposit alternative layers of SiO2 and Ag 
> (10-20nm thick) to ~1micron thick overall thickness.
>
> Did anyone have experience with similar multilayer structures, would 
> you advise me if e-beam evaporation or sputtering would better for 
> this project?
>
> If we will have to go with evaporation of SiO2, will it have 
> contamination issues with metal deposition?
>
> Thanks for advice, Esta
>
> -----------------------
>
> *Esta Abelev, PhD*
>
> Technical Director,//Petersen Institute of NanoScience and Engineering
>
> University of Pittsburgh | 3700 O?Hara Street | 636| Pittsburgh, PA 15261
>
> 412-383-4096 | eabelev at pitt.edu <mailto:eabelev at pitt.edu> | 
> nano.pitt.edu 
> <https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0>
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From fouad.karouta at anu.edu.au  Tue Aug  1 19:32:54 2017
From: fouad.karouta at anu.edu.au (Fouad Karouta)
Date: Tue, 1 Aug 2017 23:32:54 +0000
Subject: [labnetwork] Metamaterials deposition - Ag and SiO2
In-Reply-To: <83583687862B8444A85296A4944147DFB5131A16@CIO-TNC-D2MBX03.osuad.osu.edu>
References: <SN2PR04MB22051A88A3546753AE080B84C5B30@SN2PR04MB2205.namprd04.prod.outlook.com>
 <83583687862B8444A85296A4944147DFB5131A16@CIO-TNC-D2MBX03.osuad.osu.edu>
Message-ID: <SYXPR01MB2157D8E6B09899DE3494D798C0B30@SYXPR01MB2157.ausprd01.prod.outlook.com>

Dear Esta,

I agree with Aimee as you don't want to introduce oxygen in an e-beam evaporator dedicated for metals.

As to the SiO2/Ag stack I believe this can be done in a sputter system if the system can have both metals and oxides. We do have a sputter system we use for all types of materials.

Regards, Fouad

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility
Research School of Physics and Engineering
L. Huxley Building (#56), Mills Road, Room 4.02
Australian National University
ACT 0200, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au<mailto:fouad.karouta at anu.edu.au>
http://anff-act.anu.edu.au/

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Price, Aimee
Sent: Tuesday, 1 August 2017 11:47 PM
To: Abelev, Esta <eabelev at pitt.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Metamaterials deposition - Ag and SiO2

Esta,
We have not, to my knowledge, done multilayer stacks.  However, we do evaporate SiO2 in our "multi-use" ebeam evaporator but not in the one we use for metal contacts.  We use a different quartz crystal monitor for SiO2 and Hafnium oxide than we do for metals.  We have found that using separate crystals works best to maintain proper z-ratios for both.

I've copied our lab manager who has worked extensively on this.

Aimee

From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Abelev, Esta
Sent: Monday, July 31, 2017 8:10 PM
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] Metamaterials deposition - Ag and SiO2

Dear Colleagues,

Recently, we got a request to deposit SiO2 and Ag in our e-beam evaporator. We have only one e-beam UHV evaporator (brand new) which we planned to dedicate for metals (only). From what was discussed the group is planning to deposit alternative layers of SiO2 and Ag (10-20nm thick) to ~1micron thick overall thickness.
Did anyone have experience with similar multilayer structures, would you advise me if e-beam evaporation or sputtering would better for this project?
If we will have to go with evaporation of SiO2, will it have contamination issues with metal deposition?

Thanks for advice, Esta

-----------------------
Esta Abelev, PhD
Technical Director, Petersen Institute of NanoScience and Engineering
University of Pittsburgh | 3700 O'Hara Street | 636| Pittsburgh, PA 15261
412-383-4096 | eabelev at pitt.edu<mailto:eabelev at pitt.edu> | nano.pitt.edu<https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0>


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From fouad.karouta at anu.edu.au  Tue Aug  1 19:39:55 2017
From: fouad.karouta at anu.edu.au (Fouad Karouta)
Date: Tue, 1 Aug 2017 23:39:55 +0000
Subject: [labnetwork] Sputter VO2 and V2O5
Message-ID: <SYXPR01MB2157661F1B38B335FB3E05E5C0B30@SYXPR01MB2157.ausprd01.prod.outlook.com>

Dear all,

As explained in below email we opted not to use VO2 in our multi-targets sputter system.
However I wonder if any facility in the network does have a dedicated sputter capability for VO2 and V2O5 (reactive).

Thanks,
Fouad Karouta

From: Fouad Karouta
Sent: Monday, 15 May 2017 9:47 AM
To: 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
Subject: Sputter V, VO2

Dear network,

We have an AJA sputter system with over 50 different targets. It is a multi-users facility and we do change targets 2-3 times per week. To minimise possible cross-contamination every target has its own mounting accessories (housing, chimney, etc).

My question relate to possible toxic by-products and we like to share this topic within this network looking to hear your experience with same targets or targets that may produce toxic/dust by-products.

So recently we purchased Vanadium and Vanadium oxide VO2 targets. Our user intends to use reactive sputtering to produce different stoichiometry of the alloys. We found that some forms of vanadium oxide are toxic like V2O4 and V2O5 (highly toxic and poisonous, especially the dust and fumes).
So we like to share the following questions/remarks and we appreciate your comments:
1-      Does someone use targets that may produce such toxic by-products, and how you handle this in a multi-user facility?
2-      Outside an adequate mask + filters do you take any other precautions when opening chamber to change targets?
3-      After the use of such targets with the potential risk of toxic particles would a sputtering a thin layer of an Al or Cr layer would cover the toxic particles and form a possible alternative to this issue?

Thank you,
Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility
Research School of Physics and Engineering
L. Huxley Building (#56), Mills Road, Room 4.02
Australian National University
ACT 0200, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au<mailto:fouad.karouta at anu.edu.au>
http://anff-act.anu.edu.au/

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From mwoonk at umich.edu  Wed Aug  2 10:28:09 2017
From: mwoonk at umich.edu (Matthew Oonk)
Date: Wed, 2 Aug 2017 10:28:09 -0400
Subject: [labnetwork] Metamaterials deposition - Ag and SiO2
In-Reply-To: <SN2PR04MB22051A88A3546753AE080B84C5B30@SN2PR04MB2205.namprd04.prod.outlook.com>
References: <SN2PR04MB22051A88A3546753AE080B84C5B30@SN2PR04MB2205.namprd04.prod.outlook.com>
Message-ID: <CADGWrzQ71wAOhJ7_E66ZdSuazYxcNRnqDtuH=ZY_XpEwBOtbjA@mail.gmail.com>

Hi Esta,
We both sputter and evaporate the SiO2 in our shared tools.

I have two users who do a single layer of Ag/SiO2 (~1KA each) but I don't
know anyone who does multi-layer stacks on my current tool but we had an
older tool where it was done years ago.    The biggest issues have been
pointed out already:   it doesn't stick as well to the QCM (you can try a
new crystal and Ti coat just the crystal if you want), it can get in the
system (but I don't find it too unstable or harmful to the vacuum,)
multiple coatings can screw up your ion/pirani gauge readings (that is more
an issues with Al2O3, TiO2 in my tool.)

Evap vs sputtering:  If you are looking at RF off an SiO2 target, the
sputtering rates are going to be slow (reactive will be faster, not sure if
you can pulse-dc it or not.)   The sputtered film will be denser and less
likely to be as pinholed.         In terms of evap, you get the less dense
film but higher dep rate.    Depending on your crucible size, I am not sure
about your max thickness - since the SiO2 sublimates, 1um ebeam of SiO2 may
be difficult, even with a broad sweep.

Hope that helps,
 -Matt

Matthew Oonk
Research Engineer
Lurie Nanofabrication Facility
University of Michigan
734-646-1275
mwoonk at umich.edu

On Mon, Jul 31, 2017 at 8:09 PM, Abelev, Esta <eabelev at pitt.edu> wrote:

> Dear Colleagues,
>
>
>
> Recently, we got a request to deposit SiO2 and Ag in our e-beam
> evaporator. We have only one e-beam UHV evaporator (brand new) which we
> planned to dedicate for metals (only). From what was discussed the group is
> planning to deposit alternative layers of SiO2 and Ag (10-20nm thick) to
> ~1micron thick overall thickness.
>
> Did anyone have experience with similar multilayer structures, would you
> advise me if e-beam evaporation or sputtering would better for this project?
>
> If we will have to go with evaporation of SiO2, will it have contamination
> issues with metal deposition?
>
>
>
> Thanks for advice, Esta
>
>
>
> -----------------------
>
> *Esta Abelev, PhD*
>
> Technical Director, Petersen Institute of NanoScience and Engineering
>
> University of Pittsburgh | 3700 O?Hara Street | 636| Pittsburgh, PA 15261
>
> 412-383-4096 <(412)%20383-4096> | eabelev at pitt.edu | nano.pitt.edu
> <https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0>
>
>
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
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From travisgabel at boisestate.edu  Wed Aug  2 18:11:51 2017
From: travisgabel at boisestate.edu (Travis Gabel)
Date: Wed, 2 Aug 2017 16:11:51 -0600
Subject: [labnetwork] Thermco Minibrute MB-80 furnace manuals
Message-ID: <CAMjbU8d2oeoq7iPn9ed=syTDizd4zYanpp3WXTv=E9HcJ=iCMg@mail.gmail.com>

Hi Everyone,

I'm a relatively new lab engineer at the Idaho Micro-fabrication Lab at
Boise State.  I've been looking at the archives and recognize a few names.

I am in need of schematics for a thermco minibrute MB-80 furnace.
Specifically the heater controllers as I need to calibrate the temp but
when I opened the controller up there are about 20 different pots. If
anyone has a copy of the schematics or a calibration procedure that they
could send a copy to me I would greatly appreciate it.

Thanks
Travis
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From markc at exper-tech.com  Thu Aug  3 00:23:01 2017
From: markc at exper-tech.com (Mark Cooper)
Date: Thu, 3 Aug 2017 04:23:01 +0000
Subject: [labnetwork] Thermco Minibrute MB-80 furnace manuals
In-Reply-To: <CAMjbU8d2oeoq7iPn9ed=syTDizd4zYanpp3WXTv=E9HcJ=iCMg@mail.gmail.com>
References: <CAMjbU8d2oeoq7iPn9ed=syTDizd4zYanpp3WXTv=E9HcJ=iCMg@mail.gmail.com>
Message-ID: <767156BE10188C4898D42427B3D512D7069E81AF@EXEXCH1.expertech.local>

Travis,
Expertech does still support some of the legacy tools including the Analock/Minibrute packages. I sent you some information offline.
While Expertech does focus on new lab equipment, much of our installed base includes furnaces that have been running wafers for more than 40 years.
We do offer technical and parts support on the Thermco, Bruce, Tempress, and smaller brands that may have just built a few tools.
Hope to be able to help you with this one.

 [Expertech]

Mark Cooper
General Manager
10 Victor Square Ste 100
Scotts Valley Ca 95066
Main: 831-439-9300
Fax: 831-439-8139
Direct: 831-440-4422
Mobile: 831-332-9396
cooper at exper-tech.com<mailto:cooper at exper-tech.com>



This email message is for the sole use of the addressee(s) and may contain Expertech confidential and legally privileged information.  Access, review, use, disclosure or distribution of this email by anyone other than the intended addressee is unauthorized and prohibited.  If you are not the intended recipient, please notify the sender immediately and destroy all paper and electronic copies of the original message and any attachments.

________________________________
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Travis Gabel
Sent: Wednesday, August 02, 2017 3:12 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Thermco Minibrute MB-80 furnace manuals

Hi Everyone,
I'm a relatively new lab engineer at the Idaho Micro-fabrication Lab at Boise State.  I've been looking at the archives and recognize a few names.

I am in need of schematics for a thermco minibrute MB-80 furnace. Specifically the heater controllers as I need to calibrate the temp but when I opened the controller up there are about 20 different pots. If anyone has a copy of the schematics or a calibration procedure that they could send a copy to me I would greatly appreciate it.
Thanks
Travis
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From na2661 at columbia.edu  Thu Aug  3 15:21:13 2017
From: na2661 at columbia.edu (Nava Ariel-Sternberg)
Date: Thu, 3 Aug 2017 15:21:13 -0400
Subject: [labnetwork] EM Lab Director,
	Columbia University in the city of New York - Job Posting
Message-ID: <016301d30c8d$abf5efa0$03e1cee0$@columbia.edu>

Dear all, 

 

The Columbia Nano Initiative at Columbia University is looking for an Electron Microscopy Lab Director. 

 

Reporting to the Shared Facilities Director, the Electron Microscopy lab director will be responsible for all aspects of the Electron Microscopy Facility, including: implementing safety regulations and procedures, monitoring the performance of equipment; performing routine maintenance, calibration, and repairs and coordinating service calls; assisting in the development and upgrade of instruments including benchmarking and negotiating with vendors; assisting in writing proposals and raising funds for instrument acquisition and upgrade and other microscopy-related projects and equipment; preparation of usage forecasts and assistance with strategic planning; supervising lab assistants. 
The EM Lab Director will prepare user training documents; perform training of new users; monitor usage and maintain user records; assist in teaching classes, modules and short courses that address the needs of facility users; assist in preparation and teaching of specialized course materials and Electron Microscopy courses. 
The EM director also will provide training, technical assistance, and advice to users on specimen preparation, operation of instruments and interpretation of data; provide advice and assistance and/or assign an appropriate subordinate to meet requests of users; operate instruments, obtain and interpret data in accordance with specific requests from users; provide tours and demonstrations of the Electron Microscopy Facility; develop a vibrant external users program.  

 

Requirements: 

Bachelor?s degree or higher in an engineering or science field. Minimum of four years' experience in operation and/or maintenance of scanning and transmission electron microscopes. Preference given to candidates with electron microscopy related thesis projects.

 

Direct link <https://academicjobs.columbia.edu/applicants/jsp/shared/frameset/Frameset.jsp?time=1501787818465>  for application: 

 

https://academicjobs.columbia.edu/applicants/jsp/shared/frameset/Frameset.jsp?time=1501787818465

 

Thanks, 

Nava

 

 

Nava Ariel-Sternberg, Ph.D.

Director of CNI Shared Facilities

Columbia University

530 w120th st., NY 10027

Room 1015/MC 8903

Office: 212-854-9927

Cell: 201-562-7600

 

?

 

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From tonyes at umich.edu  Fri Aug  4 13:18:40 2017
From: tonyes at umich.edu (Tony Sebastian)
Date: Fri, 4 Aug 2017 13:18:40 -0400
Subject: [labnetwork] Job Posting: Lithography Engineer at University of
	Michigan
Message-ID: <CAKmNRCSF=LRTdH5L4xKka+PrD_PM6btjOX5GTzH=XoOuGktUVA@mail.gmail.com>

*Lithography and Packaging Engineer **Job Opening ID 145444*
<http://careers.umich.edu/job_detail/145444/senior_engineer_in_research_-_lnf_operations>

*University of Michigan*

*Lurie Nanofabrication Facility (LNF)*



The Lurie Nanofabrication Facility (LNF) at the University of Michigan is
seeking a *Lithography and Packaging Engineer*.



The LNF is a 24/7 shared user facility available to research groups from
government, industry and universities, currently serving ~500 users working
on a wide variety of applications in engineering, physical and life
sciences. It currently consists of a 13,500 SF class 10/100/1000/ 10000
cleanroom with a wide array of the technologies needed for research on
electronic, photonics, MEMS and other devices.



A minimum of a Bachelor?s degree in EE, ME, or an equivalent combination of
education and experience. Preferred candidates will have a thorough
understanding of semiconductor process technology with at least two years
of demonstrated processing and metrology skills related to Photolithography
and Packaging equipment.



The candidate must have a strong background in the use of micro- and
nanofabrication techniques, equipment, and clean room protocols. This
position will be primarily responsible for performing preventive,
corrective, and diagnostic maintenance on photolithography, packaging, and
inspection equipment in the Lurie Nanofabrication Facility. Primary
equipment that fall under the responsibilities of this position include the
GCA AS200 stepper, Heidelberg ?PG 501 mask maker, Suss Microtec ACS 200
cluster tool, and Suss Microtec MA/BA6 mask/ bond aligner.



*For a full position description and how to apply, please visit:*

http://careers.umich.edu/job_detail/145444
<http://careers.umich.edu/job_detail/145444%0d>



All applications must be completed online. The selected candidate will be
responsible for ensuring eligibility for employment in the United States on
or before the effective date of the appointment. University sponsorship is
not available for this position.


The University of Michigan is an equal opportunity/affirmative action
employer.

Please feel free to contact me if you have questions.

Tony Sebastian
University of Michigan
Senior Director- LNF Operations
1247 EECS
1301 Beal Ave
Ann Arbor, MI 48109
tonyes at umich.edu
www.LNF.umich.edu <http://www.lnf.umich.edu/>
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From betemc at rit.edu  Wed Aug  9 10:33:21 2017
From: betemc at rit.edu (Bruce Tolleson)
Date: Wed, 9 Aug 2017 14:33:21 +0000
Subject: [labnetwork] Leice Polyvar SC Service manual
Message-ID: <5a4b5c1bd7a4480199b604f250dd1990@ex04mail01d.ad.rit.edu>

Dear Labnetwork,
Does anyone have a service manual or illustrated parts break down for the Leica Polyvar SC microscope.
  We have an issue with ours and it appears to be missing a small part on the focus control.

Bruce E. Tolleson
Rochester Institute of Technology
82  Lomb Memorial Drive, Bldg 17-2627
Rochester, NY 14623-5604
(585) 478-3836
[http://www.rit.edu/~962www/logos/tiger_walking_rit_color.jpg]

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From rreger at purdue.edu  Wed Aug  9 12:45:48 2017
From: rreger at purdue.edu (Reger, Ronald K)
Date: Wed, 9 Aug 2017 16:45:48 +0000
Subject: [labnetwork] Research Scientist Opportunity/Opening
Message-ID: <f57ad06a047a426fa46dd93d167299c4@wppexc01.purdue.lcl>

The Birck Nanotechnology Center at Purdue University is seeking a PhD-level scientist for our Smart Materials development group.  Below is the job description, and qualified candidates are encouraged to apply at:

http://purdue.taleo.net/careersection/wl/joblist.ftl?lang=en&portal=10140480283

Search for Job #:  1701140


Position Description:

Support development of low cost smart materials in the areas of energy, sensors, food, pharmaceutical and agriculture. Fill the expertise gap identified in processing utilizing roll to roll manufacturing line(s); one is currently available at Birck Nanotechnology Center and another is to be installed in mid-summer in clean room environment. It is expected that scientists/engineers from a wide range of fields will use these capabilities for scale up which is a critical step in commercializing new and innovative technologies developed from within and outside the Purdue campus. The various faculty who are part of the nanomanufacturing pre-eminent team and new hires will be supported through the staff member who will perform materials processing and characterization, device fabrication, and wide range of related measurements.

Required Qualifications:

  *   Ph.D. Degree in Material Science, Polymer Science, Polymer Engineering, Mechanical Engineering, Physical Chemistry or related field.
  *   Consideration will be given to an equivalent combination of related education and required work experience.
  *   Proven experience in solution or polymer film processing.
  *   Extensive experience in functional film fabrication and characterization.
  *   Extensive knowledge of specialized lab techniques, trouble shooting and problem solving skills.
  *   Excellent oral/written communication and interpersonal skills as well as time management skills
  *   Ability to collaborate with diverse group of researchers both internal and external to Purdue University.
Preferred Qualifications:

  *   Experience in printed electronic/optoelectronic devices, characterization (mechanical, thermal, rheological).
  *   Proven experience in any of the printing technologies (ink jet, gravure, screen printing).



Best regards,

Ron Reger
Engineering Manager, Birck Nanotechnology Center
Purdue University
West Lafayette,  IN

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From fouad.karouta at anu.edu.au  Wed Aug  9 19:52:13 2017
From: fouad.karouta at anu.edu.au (Fouad Karouta)
Date: Wed, 9 Aug 2017 23:52:13 +0000
Subject: [labnetwork] Sputtering PTFE
Message-ID: <SYXPR01MB215780E2C558F84EF091B7E1C08B0@SYXPR01MB2157.ausprd01.prod.outlook.com>

Hi all,

We have a suer looking to sputter teflon (PTFE), I wonder if there is any facility in the network capable of sputtering PTFE.

Thanks, Fouad

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility
Research School of Physics and Engineering
L. Huxley Building (#56), Mills Road, Room 4.02
Australian National University
ACT 0200, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au<mailto:fouad.karouta at anu.edu.au>
http://anff-act.anu.edu.au/

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From bill_flounders at berkeley.edu  Wed Aug  9 22:07:26 2017
From: bill_flounders at berkeley.edu (A. William (Bill) FLOUNDERS)
Date: Wed, 9 Aug 2017 19:07:26 -0700
Subject: [labnetwork] Sputtering PTFE
In-Reply-To: <SYXPR01MB215780E2C558F84EF091B7E1C08B0@SYXPR01MB2157.ausprd01.prod.outlook.com>
References: <SYXPR01MB215780E2C558F84EF091B7E1C08B0@SYXPR01MB2157.ausprd01.prod.outlook.com>
Message-ID: <CAHxjSh=f1p0g0XuHq2su=vqoEf4j=Jsfy6uL=gAZs7=wGLZ3gA@mail.gmail.com>

Use the C4F8 step only of your pulsed gas (Bosch Process) etcher
Bill Flounders
UC Berkeley



On Wed, Aug 9, 2017 at 4:52 PM, Fouad Karouta <fouad.karouta at anu.edu.au>
wrote:

> Hi all,
>
>
>
> We have a suer looking to sputter teflon (PTFE), I wonder if there is any
> facility in the network capable of sputtering PTFE.
>
>
>
> Thanks, Fouad
>
>
>
> *************************************
>
> Manager ANFF ACT Node
>
> Australian National Fabrication Facility
>
> Research School of Physics and Engineering
>
> L. Huxley Building (#56), Mills Road, Room 4.02
>
> Australian National University
>
> ACT 0200, Canberra, Australia
>
> Tel: + 61 2 6125 7174 <+61%202%206125%207174>
>
> Mob: + 61 451 046 412 <+61%20451%20046%20412>
>
> Email: fouad.karouta at anu.edu.au
>
> http://anff-act.anu.edu.au/
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
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From msimmons at intelli-vation.com  Thu Aug 10 10:57:05 2017
From: msimmons at intelli-vation.com (Mike Simmons)
Date: Thu, 10 Aug 2017 08:57:05 -0600
Subject: [labnetwork] Sputtering PTFE
In-Reply-To: <SYXPR01MB215780E2C558F84EF091B7E1C08B0@SYXPR01MB2157.ausprd01.prod.outlook.com>
References: <SYXPR01MB215780E2C558F84EF091B7E1C08B0@SYXPR01MB2157.ausprd01.prod.outlook.com>
Message-ID: <f71344b1-40b2-fb5d-ca20-34dd099d2b41@intelli-vation.com>

Hi Fouad,

We can sputter PTFE in our application lab in roll to roll format by DC 
or pulsed DC planar magnetron, and by mid frequency AC dual rotary 
magnetrons, on widths up to 330 mm.  We can also coat discrete parts if 
thin enough to be relatively flexible or if rigid and small in size.  
The machine we use for this, an R2R330, also has inline plasma treatment 
prior to deposition which is important for materials like PTFE.  We'd be 
glad to speak further with your user.

Best regards,
Mike

*Mike Simmons, P.E.*
President, INTELLIVATION LLC
1230 Blue Spruce Drive, Suite 3 *|* Fort Collins, CO 80524, USA
+1 (970) 692-2335 *office**|* +1 (888) 800-9561 *fax***
www.intelli-vation.com

On 8/9/2017 5:52 PM, Fouad Karouta wrote:
>
> Hi all,
>
> We have a suer looking to sputter teflon (PTFE), I wonder if there is 
> any facility in the network capable of sputtering PTFE.
>
> Thanks, Fouad
>
> *************************************
>
> Manager ANFF ACT Node
>
> Australian National Fabrication Facility
>
> Research School of Physics and Engineering
>
> L. Huxley Building (#56), Mills Road, Room 4.02
>
> Australian National University
>
> ACT 0200, Canberra, Australia
>
> Tel: + 61 2 6125 7174
>
> Mob: + 61 451 046 412
>
> Email: fouad.karouta at anu.edu.au <mailto:fouad.karouta at anu.edu.au>
>
> http://anff-act.anu.edu.au/
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From bob.henderson at etchedintimeinc.com  Thu Aug 10 12:51:45 2017
From: bob.henderson at etchedintimeinc.com (Bob Henderson)
Date: Thu, 10 Aug 2017 09:51:45 -0700
Subject: [labnetwork] Sputtering PTFE
In-Reply-To: <CAHxjSh=f1p0g0XuHq2su=vqoEf4j=Jsfy6uL=gAZs7=wGLZ3gA@mail.gmail.com>
References: <SYXPR01MB215780E2C558F84EF091B7E1C08B0@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <CAHxjSh=f1p0g0XuHq2su=vqoEf4j=Jsfy6uL=gAZs7=wGLZ3gA@mail.gmail.com>
Message-ID: <000c01d311f8$f3b05ea0$db111be0$@henderson@etchedintimeinc.com>

Fouad:

 

I agree with Bill Flounders that using C4F8 produces a very uniform Teflon-like film. We produced films in our linear source PECVD system for waterproofing various circuit boards for cell phones and it worked well to a depth of 80 meters in salt water. Bob Henderson

 

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of A. William (Bill) FLOUNDERS
Sent: Wednesday, August 9, 2017 7:07 PM
To: Fouad Karouta
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Sputtering PTFE

 

Use the C4F8 step only of your pulsed gas (Bosch Process) etcher

Bill Flounders

UC Berkeley



 

On Wed, Aug 9, 2017 at 4:52 PM, Fouad Karouta <fouad.karouta at anu.edu.au> wrote:

Hi all,

 

We have a suer looking to sputter teflon (PTFE), I wonder if there is any facility in the network capable of sputtering PTFE.

 

Thanks, Fouad

 

*************************************

Manager ANFF ACT Node

Australian National Fabrication Facility

Research School of Physics and Engineering

L. Huxley Building (#56), Mills Road, Room 4.02

Australian National University

ACT 0200, Canberra, Australia

Tel: + 61 2 6125 7174 <tel:+61%202%206125%207174> 

Mob: + 61 451 046 412 <tel:+61%20451%20046%20412> 

Email: fouad.karouta at anu.edu.au

http://anff-act.anu.edu.au/

 


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

 

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From mathilde.i.barriet at ntnu.no  Fri Aug 11 09:03:06 2017
From: mathilde.i.barriet at ntnu.no (Mathilde Isabelle Barriet)
Date: Fri, 11 Aug 2017 13:03:06 +0000
Subject: [labnetwork] KOH etch of silicon
Message-ID: <4e953489fda344f3adbcb0e6dadbc813@it-ex11.win.ntnu.no>

Dear All,

I have a user who wants to do KOH etch of silicon but since we do not have an established process in the lab, I am wondering if I could get some practical guidance on the best set ups.

Also, this user is especially concerned about contaminating his Si wafers with metals so I wonder what degree of purity of KOH is commonly used and if buying the best quality available make a difference on the Si contamination or not.

If anyone has experience with this, please let me know.

Thanks
Mathilde

Senior Engineer
NTNU NanoLab
----------------------------
Sem S?lands vei 14, K1-113
NO-7491 Trondheim
+47 91 89 72 08
www.ntnu.no/nanolab





From kckeenan at seas.upenn.edu  Fri Aug 11 12:38:28 2017
From: kckeenan at seas.upenn.edu (Kyle Keenan)
Date: Fri, 11 Aug 2017 12:38:28 -0400
Subject: [labnetwork] FREE to a university: Lesker PVD75 heated substrate
	platen assembly
Message-ID: <b8f5fe0d-ad82-4913-8ebe-c38ee84e50a4@seas.upenn.edu>

Hello All,

I have a complete heated substrate platen assembly for a Lesker PVD75 
evaporator. Included are the entire rotational assembly (heat lamps, 
thermocouples, drive motor, etc.), water-cooled shield, and two 
substrate holders. See attached pix (new/unused holder not pictured).

Free to the first university to ask for it. Must take everything. 
Looking to ship a.s.a.p..

Thank you,
-- 
Kyle Keenan

Laboratory Manager
Quattrone Nanofabrication Facility
University of Pennsylvania
P: 215-898-7560
F: 215-573-4925
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From kckeenan at seas.upenn.edu  Fri Aug 11 16:59:08 2017
From: kckeenan at seas.upenn.edu (Kyle Keenan)
Date: Fri, 11 Aug 2017 16:59:08 -0400
Subject: [labnetwork] FREE to a university: Lesker PVD75 heated
 substrate platen assembly
In-Reply-To: <b8f5fe0d-ad82-4913-8ebe-c38ee84e50a4@seas.upenn.edu>
References: <b8f5fe0d-ad82-4913-8ebe-c38ee84e50a4@seas.upenn.edu>
Message-ID: <6fa84885-b218-e6d8-7577-bc05ec53d29f@seas.upenn.edu>

Hi Folks,

These items have been claimed. I'll let you know if anything changes.

Thank you,
Kyle Keenan

Laboratory Manager
Quattrone Nanofabrication Facility
University of Pennsylvania
P: 215-898-7560
F: 215-573-4925

On 8/11/2017 12:38 PM, Kyle Keenan wrote:
> Hello All,
> 
> I have a complete heated substrate platen assembly for a Lesker PVD75 
> evaporator. Included are the entire rotational assembly (heat lamps, 
> thermocouples, drive motor, etc.), water-cooled shield, and two 
> substrate holders. See attached pix (new/unused holder not pictured).
> 
> Free to the first university to ask for it. Must take everything. 
> Looking to ship a.s.a.p..
> 
> Thank you,



From michael.rooks at yale.edu  Fri Aug 11 17:16:56 2017
From: michael.rooks at yale.edu (Michael Rooks)
Date: Fri, 11 Aug 2017 17:16:56 -0400
Subject: [labnetwork] KOH etch of silicon
In-Reply-To: <4e953489fda344f3adbcb0e6dadbc813@it-ex11.win.ntnu.no>
References: <4e953489fda344f3adbcb0e6dadbc813@it-ex11.win.ntnu.no>
Message-ID: <598E1EC8.6080805@yale.edu>

Long ago in 1995 I wrote a paper that includes the KOH etching process. 
See http://avs.scitation.org/doi/10.1116/1.588258  also known as JVST B 
v13(6) 2745 (1995).

If your customer is concerned about potassium ions then you can use a 
strong solution of TMAH instead. You can purchase 25% TMAH pre-mixed. 
It's a lot more expensive than KOH.

--------------------------------
Michael Rooks
Yale Institute of Nanoscience and Quantum Engineering
nano.yale.edu <http://nano.yale.edu>



On 08/11/2017 09:03 AM, Mathilde Isabelle Barriet wrote:
> Dear All,
>
> I have a user who wants to do KOH etch of silicon but since we do not have an established process in the lab, I am wondering if I could get some practical guidance on the best set ups.
>
> Also, this user is especially concerned about contaminating his Si wafers with metals so I wonder what degree of purity of KOH is commonly used and if buying the best quality available make a difference on the Si contamination or not.
>
> If anyone has experience with this, please let me know.
>
> Thanks
> Mathilde
>
> Senior Engineer
> NTNU NanoLab
> ----------------------------
> Sem S?lands vei 14, K1-113
> NO-7491 Trondheim
> +47 91 89 72 08
> www.ntnu.no/nanolab
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From mpleil at unm.edu  Fri Aug 11 18:40:56 2017
From: mpleil at unm.edu (Matthias Pleil)
Date: Fri, 11 Aug 2017 22:40:56 +0000
Subject: [labnetwork] KOH etch of silicon
In-Reply-To: <4e953489fda344f3adbcb0e6dadbc813@it-ex11.win.ntnu.no>
References: <4e953489fda344f3adbcb0e6dadbc813@it-ex11.win.ntnu.no>
Message-ID: <MWHPR07MB3200453F1292121F9BD63379C7890@MWHPR07MB3200.namprd07.prod.outlook.com>

Hello Mathilde,


We use KOH in a heated bath to etch crystalline silicon.  Etch rates vary depending on concentration and temperature.  We add a small amount of IPA for smoother etching (results in less cavitation - smaller bubbles).


We dilute 45% KOH by weight down to about 25% or so - it actually etches faster at the lower concentration.  We start at approximately 100-105C at the start and then reduce down to 85C at the end (we etch through the wafer to a silicon nitride membrane on the opposite, front side, of the wafer)  Temperature reduction is to reduce the cavitation effects and the chance of "blowing" the membrane.  KOH can be purchased at a very pure level - it is the bath you put it in which could be an issue.  I've included an image or our device, a basic pressure sensor we use to teach MEMS fabrication.


[cid:ca080029-6a86-4b61-9b30-1067e3167748]


Kind Regards,

Matthias Pleil, Ph.D.
Research Professor & Lecturer III of Mech. Eng - UNM
UNM MTTC Cleanroom Manager
PI - Southwest Center for Microsystems Education
scme-nm.org
(505)272-7157
________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Mathilde Isabelle Barriet <mathilde.i.barriet at ntnu.no>
Sent: Friday, August 11, 2017 7:03:06 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] KOH etch of silicon

Dear All,

I have a user who wants to do KOH etch of silicon but since we do not have an established process in the lab, I am wondering if I could get some practical guidance on the best set ups.

Also, this user is especially concerned about contaminating his Si wafers with metals so I wonder what degree of purity of KOH is commonly used and if buying the best quality available make a difference on the Si contamination or not.

If anyone has experience with this, please let me know.

Thanks
Mathilde

Senior Engineer
NTNU NanoLab
----------------------------
Sem S?lands vei 14, K1-113
NO-7491 Trondheim
+47 91 89 72 08
www.ntnu.no/nanolab<http://www.ntnu.no/nanolab>



_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From rmorrison at draper.com  Mon Aug 14 11:16:48 2017
From: rmorrison at draper.com (Morrison, Richard H., Jr)
Date: Mon, 14 Aug 2017 15:16:48 +0000
Subject: [labnetwork] materials question
Message-ID: <b53db926b94b489c827802bba6b8c3d7@draper.com>

HI Everyone,

Does anybody have any experience with evaporation or sputter of Zinc? Any concerns out there?

Thanks
Rick


Richard H. Morrison
Principal Member of the Technical Staff
Draper
555 Technology Square
Cambridge, MA
02139-3573

Work  617-258-3420
Cell  508-930-3461
www.draper.com<http://www.draper.com>

________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
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From carsen at stanford.edu  Mon Aug 14 11:56:39 2017
From: carsen at stanford.edu (Carsen Kline)
Date: Mon, 14 Aug 2017 08:56:39 -0700
Subject: [labnetwork] materials question
In-Reply-To: <b53db926b94b489c827802bba6b8c3d7@draper.com>
References: <b53db926b94b489c827802bba6b8c3d7@draper.com>
Message-ID: <c945d724-ce7c-5dbd-aa06-9f9eb197e629@stanford.edu>

Hello Rick,

We avoid zinc and its alloys (brass etc) in all of our deposition 
systems. This is to do with its high vapor pressure, especially when 
heated, and tendency to poison a vacuum system, keeping you from 
achieving historically good base pressures. I'd refer you to this site 
for a scratch-the-surface explanation:
http://www.mtm-inc.com/ac-20120328-vacuum-compatible-metals-and-alloys.html

You might be able to approach it if you had a high confidence method of 
switching to zinc-mode and capturing all the sputtered or evaporated 
material. Lots of shielding, foil, and minimized time in the chamber. A 
dedicated "dirty" system would be preferable.

We're open to zinc oxide, though no one has tried it. In this case I 
would start from a zinc oxide target and add a little oxygen to keep it 
in oxide form, rather than trying to reactively sputter from a zinc target.

Regards,

Carsen

On 8/14/2017 8:16 AM, Morrison, Richard H., Jr wrote:
>
> HI Everyone,
>
> Does anybody have any experience with evaporation or sputter of Zinc? 
> Any concerns out there?
>
> Thanks
>
> Rick
>
> Richard H. Morrison
>
> Principal Member of the Technical Staff
>
> Draper
>
> 555 Technology Square
>
> Cambridge, MA
>
> 02139-3573
>
> Work  617-258-3420
>
> Cell  508-930-3461
>
> www.draper.com <http://www.draper.com>
>
> ------------------------------------------------------------------------
> Notice: This email and any attachments may contain proprietary (Draper 
> non-public) and/or export-controlled information of Draper. If you are 
> not the intended recipient of this email, please immediately notify 
> the sender by replying to this email and immediately destroy all 
> copies of this email.
> ------------------------------------------------------------------------
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

-- 
Carsen Kline
Lab Operations Manager
Stanford Nanofabrication Facility
Paul G. Allen Bldg 131
Stanford, CA  94305
(650)724-8214
carsen at stanford.edu
http://snf.stanford.edu

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From bill_flounders at berkeley.edu  Mon Aug 14 13:15:15 2017
From: bill_flounders at berkeley.edu (A. William (Bill) FLOUNDERS)
Date: Mon, 14 Aug 2017 10:15:15 -0700
Subject: [labnetwork] materials question
In-Reply-To: <b53db926b94b489c827802bba6b8c3d7@draper.com>
References: <b53db926b94b489c827802bba6b8c3d7@draper.com>
Message-ID: <CAHxjSh=ZugCJt8A3LBpRJYkdzUsdxDnD44=7mOw5bf73w4ZggQ@mail.gmail.com>

Rick,
We separate our evaporators into high, medium, and low volatility metals.
Zn is about the highest volatility metal we allow. (~0.1torr at ~400 C).
This translates into the possibility of Zn "boiling off" shields and other
surfaces
if you use the evaporator for a medium or low volatility metal in the
future.

Bottom Line - dedicated chamber for high volatility materials recommended.
Chamber clean and shield change recommended after Zn processing if you plan
to return tool to medium and low volatility materials in the future.

Lesker has a useful evap / sputter materials deposition chart:
https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm?pgid=0

Bill Flounders
UC Berkeley

On Mon, Aug 14, 2017 at 8:16 AM, Morrison, Richard H., Jr <
rmorrison at draper.com> wrote:

> HI Everyone,
>
>
>
> Does anybody have any experience with evaporation or sputter of Zinc? Any
> concerns out there?
>
>
>
> Thanks
>
> Rick
>
>
>
>
>
> Richard H. Morrison
>
> Principal Member of the Technical Staff
>
> Draper
>
> 555 Technology Square
>
> Cambridge, MA
>
> 02139-3573
>
>
>
> Work  617-258-3420 <(617)%20258-3420>
>
> Cell  508-930-3461 <(508)%20930-3461>
>
> www.draper.com
>
>
> ------------------------------
> Notice: This email and any attachments may contain proprietary (Draper
> non-public) and/or export-controlled information of Draper. If you are not
> the intended recipient of this email, please immediately notify the sender
> by replying to this email and immediately destroy all copies of this email.
> ------------------------------
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
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From rmorrison at draper.com  Tue Aug 15 06:20:14 2017
From: rmorrison at draper.com (Morrison, Richard H., Jr)
Date: Tue, 15 Aug 2017 10:20:14 +0000
Subject: [labnetwork] materials question
In-Reply-To: <c945d724-ce7c-5dbd-aa06-9f9eb197e629@stanford.edu>
References: <b53db926b94b489c827802bba6b8c3d7@draper.com>
 <c945d724-ce7c-5dbd-aa06-9f9eb197e629@stanford.edu>
Message-ID: <77d59fc47dcc41898f79c02c32e9a87d@draper.com>

Thanks very much and thanks to the other responses. This helped me to decide to refuse to use this material as I have only one evaporation tool.

Rick


From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Carsen Kline
Sent: Monday, August 14, 2017 11:57 AM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] materials question

Hello Rick,

We avoid zinc and its alloys (brass etc) in all of our deposition systems. This is to do with its high vapor pressure, especially when heated, and tendency to poison a vacuum system, keeping you from achieving historically good base pressures. I'd refer you to this site for a scratch-the-surface explanation:
http://www.mtm-inc.com/ac-20120328-vacuum-compatible-metals-and-alloys.html

You might be able to approach it if you had a high confidence method of switching to zinc-mode and capturing all the sputtered or evaporated material. Lots of shielding, foil, and minimized time in the chamber. A dedicated "dirty" system would be preferable.

We're open to zinc oxide, though no one has tried it. In this case I would start from a zinc oxide target and add a little oxygen to keep it in oxide form, rather than trying to reactively sputter from a zinc target.

Regards,

Carsen
On 8/14/2017 8:16 AM, Morrison, Richard H., Jr wrote:
HI Everyone,

Does anybody have any experience with evaporation or sputter of Zinc? Any concerns out there?

Thanks
Rick


Richard H. Morrison
Principal Member of the Technical Staff
Draper
555 Technology Square
Cambridge, MA
02139-3573

Work  617-258-3420
Cell  508-930-3461
www.draper.com<http://www.draper.com>

________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________




_______________________________________________

labnetwork mailing list

labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>

https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



--

Carsen Kline

Lab Operations Manager

Stanford Nanofabrication Facility

Paul G. Allen Bldg 131

Stanford, CA  94305

(650)724-8214

carsen at stanford.edu<mailto:carsen at stanford.edu>

http://snf.stanford.edu

________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From fgavin at wafabintl.com  Tue Aug 15 17:11:01 2017
From: fgavin at wafabintl.com (Gavin, Frank)
Date: Tue, 15 Aug 2017 21:11:01 +0000
Subject: [labnetwork] Looking for cleaning advice - post wire-saw - removing
 slurry from wafers
Message-ID: <BN6PR1701MB1905D898889058B6D41271EAC88D0@BN6PR1701MB1905.namprd17.prod.outlook.com>

I am looking for a process to clean post wire sawing Silicon Carbide substrates.  The material being cleaning is SiC substrates and the abrasive that needs to be removed is a synthetic glycol based fluid mixed with diamond powder.  During the wire sawing process there is also kerf from the SiC as well as the steel cord wire that abrades as well.  It is a very aggressive process and heavy solids need to be removed.  Operators are spending the day hand wiping wafers.  Any advice is welcomed.

Best Regards,
FRANK GAVIN, Sales Eng.
[WaFab_Logo200px]<http://www.wafabintl.com/>
6161 Industrial Way, Livermore CA 94551
(925) 455-5252 ext 2420  Fax: (925) 455-5351




Beyond Zero - The KINETICS Culture of Safety

This e-mail and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. Please notify the sender immediately by e-mail if you have received this e-mail by mistake and delete this e-mail from your system. Any views or opinions presented in this e-mail are solely those of the author and do not necessarily represent those of Kinetic Systems, Inc. Kinetic Systems, Inc. accepts no liability for any damage caused by any virus transmitted by this e-mail.
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From cekendri at mtu.edu  Tue Aug 15 19:53:48 2017
From: cekendri at mtu.edu (Chito Kendrick)
Date: Tue, 15 Aug 2017 19:53:48 -0400
Subject: [labnetwork] Looking for cleaning advice - post wire-saw -
 removingslurry from wafers
In-Reply-To: <BN6PR1701MB1905D898889058B6D41271EAC88D0@BN6PR1701MB1905.namprd17.prod.outlook.com>
References: <BN6PR1701MB1905D898889058B6D41271EAC88D0@BN6PR1701MB1905.namprd17.prod.outlook.com>
Message-ID: <5993898f.52946b0a.c3243.bdef@mx.google.com>

Can you apply a coating before dicing? I normally have old 1827 around that users can use as a pre-dice coating. Also never let the samples dry out before rinsing and then removing the 1827 in acetone.

Chito Kendrick 

-----Original Message-----
From: "Gavin, Frank" <fgavin at wafabintl.com>
Sent: ?8/?15/?2017 19:33
To: "labnetwork at mtl.mit.edu" <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Looking for cleaning advice - post wire-saw - removingslurry from wafers

I am looking for a process to clean post wire sawing Silicon Carbide substrates.  The material being cleaning is SiC substrates and the abrasive that needs to be removed is a synthetic glycol based fluid mixed with diamond powder.  During the wire sawing process there is also kerf from the SiC as well as the steel cord wire that abrades as well.  It is a very aggressive process and heavy solids need to be removed.  Operators are spending the day hand wiping wafers.  Any advice is welcomed.
 
Best Regards,
FRANK GAVIN, Sales Eng.

6161 Industrial Way, Livermore CA 94551
(925) 455-5252 ext 2420  Fax: (925) 455-5351


 


Beyond Zero ? The KINETICS Culture of Safety 
This e-mail and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. Please notify the sender immediately by e-mail if you have received this e-mail by mistake and delete this e-mail from your system. Any views or opinions presented in this e-mail are solely those of the author and do not necessarily represent those of Kinetic Systems, Inc. Kinetic Systems, Inc. accepts no liability for any damage caused by any virus transmitted by this e-mail. 
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From rmorrison at draper.com  Wed Aug 16 07:54:49 2017
From: rmorrison at draper.com (Morrison, Richard H., Jr)
Date: Wed, 16 Aug 2017 11:54:49 +0000
Subject: [labnetwork] Looking for cleaning advice - post wire-saw -
 removing slurry from wafers
In-Reply-To: <BN6PR1701MB1905D898889058B6D41271EAC88D0@BN6PR1701MB1905.namprd17.prod.outlook.com>
References: <BN6PR1701MB1905D898889058B6D41271EAC88D0@BN6PR1701MB1905.namprd17.prod.outlook.com>
Message-ID: <69a646a57f1249549e0bd0bbca8fcb35@draper.com>

Hi,

We use a modified mask cleaner sold by Ultra-T (California company). It uses a high pressure water jet that scans across a moving wafer it knocks of debris. We alos have a single wafer/mask cleaner that uses RCA type chemicals and brushes to clean photo mask. I bet a snow clean (air blast with CO2 ice) might work, you get purchases automated snow clean tools.

Ultra T web site is   http://www.ultrat.com/index.html
Mask cleaner is sold by Hamatech   now owned by Suss Microtech
Snow cleaners   http://www.cryosnow.com/index.php/en/Products/


Rick


Richard H. Morrison
Principal Member of the Technical Staff
Draper
555 Technology Square
Cambridge, MA
02139-3573

Work  617-258-3420
Cell  508-930-3461
www.draper.com<http://www.draper.com>



From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Gavin, Frank
Sent: Tuesday, August 15, 2017 5:11 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Looking for cleaning advice - post wire-saw - removing slurry from wafers

I am looking for a process to clean post wire sawing Silicon Carbide substrates.  The material being cleaning is SiC substrates and the abrasive that needs to be removed is a synthetic glycol based fluid mixed with diamond powder.  During the wire sawing process there is also kerf from the SiC as well as the steel cord wire that abrades as well.  It is a very aggressive process and heavy solids need to be removed.  Operators are spending the day hand wiping wafers.  Any advice is welcomed.

Best Regards,
FRANK GAVIN, Sales Eng.
[WaFab_Logo200px]<http://www.wafabintl.com/>
6161 Industrial Way, Livermore CA 94551
(925) 455-5252 ext 2420  Fax: (925) 455-5351



Beyond Zero - The KINETICS Culture of Safety
This e-mail and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. Please notify the sender immediately by e-mail if you have received this e-mail by mistake and delete this e-mail from your system. Any views or opinions presented in this e-mail are solely those of the author and do not necessarily represent those of Kinetic Systems, Inc. Kinetic Systems, Inc. accepts no liability for any damage caused by any virus transmitted by this e-mail.
________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From carsen at stanford.edu  Wed Aug 16 10:19:55 2017
From: carsen at stanford.edu (Carsen Kline)
Date: Wed, 16 Aug 2017 07:19:55 -0700
Subject: [labnetwork] Looking for cleaning advice - post wire-saw -
 removingslurry from wafers
In-Reply-To: <5993898f.52946b0a.c3243.bdef@mx.google.com>
References: <BN6PR1701MB1905D898889058B6D41271EAC88D0@BN6PR1701MB1905.namprd17.prod.outlook.com>
 <5993898f.52946b0a.c3243.bdef@mx.google.com>
Message-ID: <2ec5f44d-9987-d996-97fb-8959f18f10e3@stanford.edu>

Keeping the wafers wet, as Chito said, is key. I used to work with lab 
members who had good results using solid PVA foam sponges to remove 
tough CMP slurry from delicate wafers. The foam is quite soft when wet 
but traps the small particles effectively without causing further damage.

Good luck!

On 8/15/2017 4:53 PM, Chito Kendrick wrote:
> Can you apply a coating before dicing? I normally have old 1827 around 
> that users can use as a pre-dice coating. Also never let the samples 
> dry out before rinsing and then removing the 1827 in acetone.
>
> Chito Kendrick
> ------------------------------------------------------------------------
> From: Gavin, Frank <mailto:fgavin at wafabintl.com>
> Sent: ?8/?15/?2017 19:33
> To: labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu>
> Subject: [labnetwork] Looking for cleaning advice - post wire-saw - 
> removingslurry from wafers
>
> I am looking for a process to clean post wire sawing Silicon Carbide 
> substrates.  The material being cleaning is SiC substrates and the 
> abrasive that needs to be removed is a synthetic glycol based fluid 
> mixed with diamond powder.  During the wire sawing process there is 
> also kerf from the SiC as well as the steel cord wire that abrades as 
> well.  It is a very aggressive process and heavy solids need to be 
> removed.  Operators are spending the day hand wiping wafers.  Any 
> advice is welcomed.
>
> Best Regards,
>
> FRANK GAVIN, Sales Eng.
>
> WaFab_Logo200px <http://www.wafabintl.com/>
>
> 6161 Industrial Way, Livermore CA 94551
> *(925) 455-5252 ext 2420*  Fax: (925) 455-5351
>
>
>
> Beyond Zero ? The *KINETICS* Culture of Safety
>
>
>             This e-mail and any files transmitted with it are
>             confidential and intended solely for the use of the
>             individual or entity to whom they are addressed. Please
>             notify the sender immediately by e-mail if you have
>             received this e-mail by mistake and delete this e-mail
>             from your system. Any views or opinions presented in this
>             e-mail are solely those of the author and do not
>             necessarily represent those of Kinetic Systems, Inc.
>             Kinetic Systems, Inc. accepts no liability for any damage
>             caused by any virus transmitted by this e-mail.
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

-- 
Carsen Kline
Lab Operations Manager
Stanford Nanofabrication Facility
Paul G. Allen Bldg 131
Stanford, CA  94305
(650)724-8214
carsen at stanford.edu
http://snf.stanford.edu

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From dylan.klomparens at nist.gov  Wed Aug 16 15:55:27 2017
From: dylan.klomparens at nist.gov (Klomparens, Dylan L. (Fed))
Date: Wed, 16 Aug 2017 19:55:27 +0000
Subject: [labnetwork] Lab management software
Message-ID: <SN1PR09MB0830B02BBC9398A67E0ACED3E4820@SN1PR09MB0830.namprd09.prod.outlook.com>

Hello everyone,
The CNST NanoFab at NIST<https://www.nist.gov/cnst/nanofab> has developed and used custom lab management software for the last 5 years. The NanoFab Equipment Management & Operations (NEMO) web application manages logistics for our NanoFab, including reservations, tool access control, maintenance tracking, and more. Other organizations have indicated that they are interested in using NEMO for their NanoFabs.
CNST has decided to make NEMO open source and free, with an invitational closed beta test beforehand. The purpose of the closed beta is to ensure there are no significant undiscovered problems in NEMO and work towards improving project documentation. After completing the beta test, CNST plans to release a full open source version of NEMO on January 1st, 2018. Our hope is to build a community of users and developers to improve NEMO, and work towards a shared resource that can benefit NanoFabs everywhere.
CNST feels it is important to set expectations properly during this open sourcing process. The source code would have a public domain license, which is essentially unrestricted. Furthermore, the NEMO project would follow open source software convention, which implies no official support or warranty. This is also why we feel it will be important for NEMO to have strong documentation and deployment instructions before the targeted full open source release.
NEMO is written in the Python programming language, and uses the Django web framework. It is operating system independent (can run on Linux or Windows) and has no hardware requirements. The NEMO source code is currently privately hosted on GitHub<https://github.com/>.
If your organization would like to consider using NEMO to manage your NanoFab and participate in the closed beta test, then please respond to this email (directly to me) with the following information:

*                     The organization you represent

*                     Your organization's level of interest in using NEMO for lab management

*                     Name and contact information of the person(s) who will perform technical setup and deployment of NEMO at your organization

*                     The approximate amount of time and effort your staff can commit to assisting with bugs, improvements, and documentation
We hope the nanofabrication community is excited about the release of this software, and we look forward to sharing it! Some screenshots of sample NEMO pages are attached.
-- Dylan Klomparens

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From jsamsoon at eng.ucsd.edu  Wed Aug 16 15:55:57 2017
From: jsamsoon at eng.ucsd.edu (John Sam Soon)
Date: Wed, 16 Aug 2017 12:55:57 -0700
Subject: [labnetwork] SU-8 Thickness Uniformity
Message-ID: <CAAmkCjWHtvh=cAvRRz_2zeNPc_492JAH5A1UKk2jJ9VGr5NW5A@mail.gmail.com>

Hello
We've been running uniformity thickness tests of SU8-2025 on 4 in prime Si
wafers (measured with a mechanical profilometer), and have gotten results
around 13% (Max-Min/(Max+min)). Far from Microchem's reported 5%). I wanted
to reach out to the community as to:
1) What are some of the uniformity numbers that other users are getting? and
2) for those getting good uniformity, are there any process control tips
that can be shared?


-- 
Nicholas Sam-Soon
Microfabrication Process Engineer
Calit2 Qualcomm Institute
UC San Diego
http://nano3.calit2.net/
Email: jsamsoon at ucsd.edu
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From cekendri at mtu.edu  Wed Aug 16 20:39:50 2017
From: cekendri at mtu.edu (Chito Kendrick)
Date: Wed, 16 Aug 2017 20:39:50 -0400
Subject: [labnetwork] SU-8 Thickness Uniformity
In-Reply-To: <CAAmkCjWHtvh=cAvRRz_2zeNPc_492JAH5A1UKk2jJ9VGr5NW5A@mail.gmail.com>
References: <CAAmkCjWHtvh=cAvRRz_2zeNPc_492JAH5A1UKk2jJ9VGr5NW5A@mail.gmail.com>
Message-ID: <68f00639-c4ac-239e-6ff7-cac4f717fba8@mtu.edu>

Can you add how you are applying the SU-8 and does your calculation 
include the edge bead or are you using an edge bead remover.

I am also interested in this as I have a biochip company work in my lab 
that is try to get an edge bead free film without just cutting it off as 
they are losing to many devices in there mind. Currently, been looking 
at using a screen printer and also there was a paper on spraying edge 
bead remover on the SU-8 after spinning to get a edge bead free film.

Chito Kendrick


On 8/16/2017 3:55 PM, John Sam Soon wrote:
> Hello
> We've been running uniformity thickness tests of SU8-2025 on 4 in 
> prime Si wafers (measured with a mechanical profilometer), and have 
> gotten results around 13% (Max-Min/(Max+min)). Far from Microchem's 
> reported 5%). I wanted to reach out to the community as to:
> 1) What are some of the uniformity numbers that other users are 
> getting? and
> 2) for those getting good uniformity, are there any process control 
> tips that can be shared?
>
>
> -- 
> Nicholas Sam-Soon
> Microfabrication Process Engineer
> Calit2 Qualcomm Institute
> UC San Diego
> http://nano3.calit2.net/
> Email: jsamsoon at ucsd.edu <mailto:jsamsoon at ucsd.edu>
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

-- 
Chito Kendrick Ph.D. <https://sites.google.com/site/chitokendrickphd/>

Managing Director of the Microfabrication Facility
Research Assistant Professor
Electrical and Computer Engineering
Michigan Technological University
Room 436 M&M Building
1400 Townsend Dr.
Houghton, Michigan 49931-1295

814-308-4255
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From hbtusainc at yahoo.com  Wed Aug 16 20:40:17 2017
From: hbtusainc at yahoo.com (Mario Portillo)
Date: Thu, 17 Aug 2017 00:40:17 +0000 (UTC)
Subject: [labnetwork] Looking for cleaning advice - post wire-saw -
 removing slurry from wafers
In-Reply-To: <69a646a57f1249549e0bd0bbca8fcb35@draper.com>
References: <BN6PR1701MB1905D898889058B6D41271EAC88D0@BN6PR1701MB1905.namprd17.prod.outlook.com>
 <69a646a57f1249549e0bd0bbca8fcb35@draper.com>
Message-ID: <1370513277.3109626.1502930417594@mail.yahoo.com>

After 35 some years working with Photomask , I recommend a cleaning system be high pressure jets or the chemical ones , but NOT the use of any brushes, they damage more than they help.. soft cleaning tissues n cleaning solutions by hand works just well.?


Sent from Yahoo Mail for iPhone
Mario Portillo, hbtusainc at yahoo.com

On Wednesday, August 16, 2017, 4:54 AM, Morrison, Richard H., Jr <rmorrison at draper.com> wrote:

 <!--#yiv5869762293 _filtered #yiv5869762293 {font-family:"Cambria Math";panose-1:2 4 5 3 5 4 6 3 2 4;} _filtered #yiv5869762293 {font-family:Calibri;panose-1:2 15 5 2 2 2 4 3 2 4;}#yiv5869762293 #yiv5869762293 p.yiv5869762293MsoNormal, #yiv5869762293 li.yiv5869762293MsoNormal, #yiv5869762293 div.yiv5869762293MsoNormal {margin:0in;margin-bottom:.0001pt;font-size:11.0pt;font-family:"Calibri", sans-serif;}#yiv5869762293 h6 {margin-right:0in;margin-left:0in;font-size:7.5pt;font-family:"Times New Roman", serif;font-weight:bold;}#yiv5869762293 a:link, #yiv5869762293 span.yiv5869762293MsoHyperlink {color:#0563C1;text-decoration:underline;}#yiv5869762293 a:visited, #yiv5869762293 span.yiv5869762293MsoHyperlinkFollowed {color:#954F72;text-decoration:underline;}#yiv5869762293 p {margin-right:0in;margin-left:0in;font-size:12.0pt;font-family:"Times New Roman", serif;}#yiv5869762293 span.yiv5869762293Heading6Char {font-family:"Calibri Light", sans-serif;color:#1F4D78;}#yiv5869762293 span.yiv5869762293EmailStyle19 {font-family:"Calibri", sans-serif;color:windowtext;}#yiv5869762293 span.yiv5869762293EmailStyle20 {font-family:"Calibri", sans-serif;color:#1F497D;}#yiv5869762293 span.yiv5869762293EmailStyle21 {font-family:"Calibri", sans-serif;color:windowtext;}#yiv5869762293 .yiv5869762293MsoChpDefault {font-size:10.0pt;} _filtered #yiv5869762293 {margin:1.0in 1.0in 1.0in 1.0in;}#yiv5869762293 div.yiv5869762293WordSection1 {}-->
Hi,
 
 ?
 
We use a modified mask cleaner sold by Ultra-T (California company). It uses a high pressure water jet that scans across a moving wafer it knocks of debris. We alos have a single wafer/mask cleaner that uses RCA type chemicals and brushes to clean photo mask. I bet a snow clean (air blast with CO2 ice) might work, you get purchases automated snow clean tools.
 
 ?
 
Ultra T web site is?? http://www.ultrat.com/index.html
 
Mask cleaner is sold by Hamatech?? now owned by Suss Microtech
 
Snow cleaners?? http://www.cryosnow.com/index.php/en/Products/
 
 ?
 
 ?
 
Rick
 
 ?
 
 ?
 
Richard H. Morrison
 
Principal Member of the Technical Staff
 
Draper
 
555 Technology Square
 
Cambridge, MA
 
02139-3573
 
 ?
 
Work? 617-258-3420
 
Cell? 508-930-3461
 
www.draper.com
 
 ?
 
 ?
 
 ?
 
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu]On Behalf Of Gavin, Frank
Sent: Tuesday, August 15, 2017 5:11 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Looking for cleaning advice - post wire-saw - removing slurry from wafers
 
 ?
 
I am looking for a process to clean post wire sawing Silicon Carbide substrates.? The material being cleaning is SiC substrates and the abrasive that needs to be removed is a synthetic glycol based fluid mixed with diamond powder.? During the wire sawing process there is also kerf from the SiC as well as the steel cord wire that abrades as well.? It is a very aggressive process and heavy solids need to be removed.? Operators are spending the day hand wiping wafers.? Any advice is welcomed.
 
 ?
 
Best Regards,
 
FRANK GAVIN, Sales Eng.
 

 
6161 Industrial Way, Livermore CA 94551
(925) 455-5252 ext 2420? Fax: (925) 455-5351
 
 ?
 


Beyond Zero ? The KINETICS Culture of Safety 
 
This e-mail and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. Please notify the sender immediately by e-mail if you have received this e-mail by mistake and delete this e-mail from your system. Any views or opinions presented in this e-mail are solely those of the author and do not necessarily represent those of Kinetic Systems, Inc. Kinetic Systems, Inc. accepts no liability for any damage caused by any virus transmitted by this e-mail. 
 Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email._______________________________________________
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From crraum at gmail.com  Wed Aug 16 21:00:32 2017
From: crraum at gmail.com (Christopher Raum)
Date: Wed, 16 Aug 2017 18:00:32 -0700
Subject: [labnetwork] SU-8 Thickness Uniformity
In-Reply-To: <CAAmkCjWHtvh=cAvRRz_2zeNPc_492JAH5A1UKk2jJ9VGr5NW5A@mail.gmail.com>
References: <CAAmkCjWHtvh=cAvRRz_2zeNPc_492JAH5A1UKk2jJ9VGr5NW5A@mail.gmail.com>
Message-ID: <CAK5uxHbwqFTj7_P9A43bU2fBsoGUj+-34yXO2qi4ntEj7QdsWQ@mail.gmail.com>

Hi John,

You may need multiple spin speeds to first spread and then coat the
surface, followed by a final short high-speed spin to minimize edge bead.

-Chris
--
R&D Engineer 3
Experimental Cosmology Group
Radio Astronomy Lab
University of California, Berkeley
151 LeConte Hall
Berkeley, CA, 94720

On Aug 16, 2017 5:27 PM, "John Sam Soon" <jsamsoon at eng.ucsd.edu> wrote:

> Hello
> We've been running uniformity thickness tests of SU8-2025 on 4 in prime Si
> wafers (measured with a mechanical profilometer), and have gotten results
> around 13% (Max-Min/(Max+min)). Far from Microchem's reported 5%). I wanted
> to reach out to the community as to:
> 1) What are some of the uniformity numbers that other users are getting?
> and
> 2) for those getting good uniformity, are there any process control tips
> that can be shared?
>
>
> --
> Nicholas Sam-Soon
> Microfabrication Process Engineer
> Calit2 Qualcomm Institute
> UC San Diego
> http://nano3.calit2.net/
> Email: jsamsoon at ucsd.edu
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
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From mhofheins at unm.edu  Thu Aug 17 10:02:04 2017
From: mhofheins at unm.edu (Mark Hofheins)
Date: Thu, 17 Aug 2017 14:02:04 +0000
Subject: [labnetwork] Fw: Implementing Lock-out/Logins on AJA Phase II J
	sputter system
In-Reply-To: <DM2PR0701MB1359CC5E58819E5BA32B33E8A3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
References: <DM2PR0701MB1359CC5E58819E5BA32B33E8A3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
Message-ID: <DM2PR0701MB135913B9F9C2F688FD833E9FA3830@DM2PR0701MB1359.namprd07.prod.outlook.com>



Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

505-710-3527



Micro Electronics Technician

Manufacturing Engineering

University of New Mexico MTTC

800 Bradbury S.E.  Suit 235

Albuquerque, New Mexico

87106-4346



________________________________
From: Mark Hofheins
Sent: Thursday, August 17, 2017 7:46 AM
To: labnetwork-bounces at mtl.mit.edu
Subject: Implementing Lock-out/Logins on AJA Phase II J sputter system


Hello all,

We have an AJA Phase II J sputter tool that we need to implement our "Login" system on.

The system allows for  a open /closed circuit at 24v or 115v.

Most all of the sputter system is 230v. I do not want to have to power up the computer each time for someone to login and be able to use the tool.

At this point I believe that my best option is to have an electronic valve in the main plasma gas line as all gasses are routed through a single line.

I am looking for suggestions if anyone has a similar system in place on an AJA.

Thank you,


Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

505-710-3527



Micro Electronics Technician

Manufacturing Engineering

University of New Mexico MTTC

800 Bradbury S.E.  Suit 235

Albuquerque, New Mexico

87106-4346

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From lvchang at Central.UH.EDU  Thu Aug 17 11:06:32 2017
From: lvchang at Central.UH.EDU (Chang, Long)
Date: Thu, 17 Aug 2017 10:06:32 -0500
Subject: [labnetwork] Implementing Lock-out/Logins on AJA Phase II J
 sputter system
In-Reply-To: <DM2PR0701MB135913B9F9C2F688FD833E9FA3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
References: <DM2PR0701MB1359CC5E58819E5BA32B33E8A3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
 <DM2PR0701MB135913B9F9C2F688FD833E9FA3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
Message-ID: <F509E354-F58C-4247-B232-6F3202AE9E94@central.uh.edu>

Hi Mark,

We use a "Login" system that simply show/hide the control panel. This is installed in our SEM and Ebeam Writer which runs on Window NT and Windows XP respectively. I suspect it will work for you if you're interested in trying it out.

I've attached a photo of the Login screen and the Account Managing screen. When a person with "Staff" credentials logs in, a "Settings" button will appear under the "Log In" button, enabling a staff to access the Account Manager. Installation is as simple as configuring a parameter file.

Best,
Long
[cid:EB0D75F8-3590-44B1-9718-1621F641787E at e.uh.edu][cid:3DD8E5A5-60EA-4AF5-9CBD-6536980DB063 at e.uh.edu]
On Aug 17, 2017, at 9:02 AM, Mark Hofheins <mhofheins at unm.edu<mailto:mhofheins at unm.edu>> wrote:




Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

505-710-3527


Micro Electronics Technician
Manufacturing Engineering
University of New Mexico MTTC
800 Bradbury S.E.  Suit 235
Albuquerque, New Mexico
87106-4346



________________________________
From: Mark Hofheins
Sent: Thursday, August 17, 2017 7:46 AM
To: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>
Subject: Implementing Lock-out/Logins on AJA Phase II J sputter system

Hello all,
We have an AJA Phase II J sputter tool that we need to implement our "Login" system on.
The system allows for  a open /closed circuit at 24v or 115v.
Most all of the sputter system is 230v. I do not want to have to power up the computer each time for someone to login and be able to use the tool.
At this point I believe that my best option is to have an electronic valve in the main plasma gas line as all gasses are routed through a single line.
I am looking for suggestions if anyone has a similar system in place on an AJA.
Thank you,


Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

505-710-3527


Micro Electronics Technician
Manufacturing Engineering
University of New Mexico MTTC
800 Bradbury S.E.  Suit 235
Albuquerque, New Mexico
87106-4346


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From myoung6 at nd.edu  Thu Aug 17 11:06:01 2017
From: myoung6 at nd.edu (Michael Young)
Date: Thu, 17 Aug 2017 11:06:01 -0400
Subject: [labnetwork] Fw: Implementing Lock-out/Logins on AJA Phase II J
 sputter system
In-Reply-To: <DM2PR0701MB135913B9F9C2F688FD833E9FA3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
References: <DM2PR0701MB1359CC5E58819E5BA32B33E8A3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
 <DM2PR0701MB135913B9F9C2F688FD833E9FA3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
Message-ID: <e3a18317-061a-0d09-38d8-ac684047427f@nd.edu>

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From eslim at mtl.mit.edu  Thu Aug 17 12:23:40 2017
From: eslim at mtl.mit.edu (Eric Lim)
Date: Thu, 17 Aug 2017 12:23:40 -0400
Subject: [labnetwork] Fw: Implementing Lock-out/Logins on AJA Phase II J
	sputter system
In-Reply-To: <DM2PR0701MB135913B9F9C2F688FD833E9FA3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
References: <DM2PR0701MB1359CC5E58819E5BA32B33E8A3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
 <DM2PR0701MB135913B9F9C2F688FD833E9FA3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
Message-ID: <E5AF8B0F-31ED-4968-B352-B70BEB128F48@mtl.mit.edu>

Hi Mark, I've got the phase II J laptop hooked up to an external monitor/keyboard, and interlock the power to the monitor. 
Eric

Sent from my phone

> On Aug 17, 2017, at 10:02, Mark Hofheins <mhofheins at unm.edu> wrote:
> 
> 
> 
> Mark Hofheins
> 
> mhofheins at unm.edu
> 
> 505-710-3527
> 
>  
> 
> Micro Electronics Technician 
> 
> Manufacturing Engineering
> 
> University of New Mexico MTTC
> 
> 800 Bradbury S.E.  Suit 235
> 
> Albuquerque, New Mexico
> 
> 87106-4346
> 
> 
> 
> 
>  
> From: Mark Hofheins
> Sent: Thursday, August 17, 2017 7:46 AM
> To: labnetwork-bounces at mtl.mit.edu
> Subject: Implementing Lock-out/Logins on AJA Phase II J sputter system
>  
> Hello all,
> 
> We have an AJA Phase II J sputter tool that we need to implement our "Login" system on.
> 
> The system allows for  a open /closed circuit at 24v or 115v.
> 
> Most all of the sputter system is 230v. I do not want to have to power up the computer each time for someone to login and be able to use the tool. 
> 
> At this point I believe that my best option is to have an electronic valve in the main plasma gas line as all gasses are routed through a single line.
> 
> I am looking for suggestions if anyone has a similar system in place on an AJA.
> Thank you,
> 
> 
> 
> Mark Hofheins
> 
> mhofheins at unm.edu
> 
> 505-710-3527
> 
>  
> 
> Micro Electronics Technician 
> 
> Manufacturing Engineering
> 
> University of New Mexico MTTC
> 
> 800 Bradbury S.E.  Suit 235
> 
> Albuquerque, New Mexico
> 
> 87106-4346
> 
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From jsamsoon at eng.ucsd.edu  Thu Aug 17 12:45:42 2017
From: jsamsoon at eng.ucsd.edu (John Sam Soon)
Date: Thu, 17 Aug 2017 09:45:42 -0700
Subject: [labnetwork] SU-8 Thickness Uniformity
In-Reply-To: <68f00639-c4ac-239e-6ff7-cac4f717fba8@mtu.edu>
References: <CAAmkCjWHtvh=cAvRRz_2zeNPc_492JAH5A1UKk2jJ9VGr5NW5A@mail.gmail.com>
 <68f00639-c4ac-239e-6ff7-cac4f717fba8@mtu.edu>
Message-ID: <CAAmkCjVJJ7FdChhV33yBP+nOXpvdqnAJomSHxiR_EZV3kE8usA@mail.gmail.com>

We are following the manufacturer's recommendation for processing, but not
doing EBR. This is taken into consideration during measurement however.  We
don't have edge bead or uniformity issues if we use dry film.
Nic

On Wed, Aug 16, 2017 at 5:39 PM, Chito Kendrick <cekendri at mtu.edu> wrote:

> Can you add how you are applying the SU-8 and does your calculation
> include the edge bead or are you using an edge bead remover.
>
> I am also interested in this as I have a biochip company work in my lab
> that is try to get an edge bead free film without just cutting it off as
> they are losing to many devices in there mind. Currently, been looking at
> using a screen printer and also there was a paper on spraying edge bead
> remover on the SU-8 after spinning to get a edge bead free film.
>
> Chito Kendrick
>
> On 8/16/2017 3:55 PM, John Sam Soon wrote:
>
> Hello
> We've been running uniformity thickness tests of SU8-2025 on 4 in prime Si
> wafers (measured with a mechanical profilometer), and have gotten results
> around 13% (Max-Min/(Max+min)). Far from Microchem's reported 5%). I wanted
> to reach out to the community as to:
> 1) What are some of the uniformity numbers that other users are getting?
> and
> 2) for those getting good uniformity, are there any process control tips
> that can be shared?
>
>
> --
> Nicholas Sam-Soon
> Microfabrication Process Engineer
> Calit2 Qualcomm Institute
> UC San Diego
> http://nano3.calit2.net/
> Email: jsamsoon at ucsd.edu
>
>
>
> _______________________________________________
> labnetwork mailing listlabnetwork at mtl.mit.eduhttps://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
> --
> Chito Kendrick Ph.D. <https://sites.google.com/site/chitokendrickphd/>
>
> Managing Director of the Microfabrication Facility
> Research Assistant Professor
> Electrical and Computer Engineering
> Michigan Technological University
> Room 436 M&M Building
> 1400 Townsend Dr.
> Houghton, Michigan 49931-1295
>
> 814-308-4255 <(814)%20308-4255>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>


-- 
Nicholas Sam-Soon
Microfabrication Process Engineer

Calit2 Qualcomm Institute
UC San Diego
http://nano3.calit2.net/
Email: jsamsoon at ucsd.edu
Phone: (714) 248-6050
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From jshepar at purdue.edu  Thu Aug 17 14:10:21 2017
From: jshepar at purdue.edu (Shepard, Jeremiah J)
Date: Thu, 17 Aug 2017 18:10:21 +0000
Subject: [labnetwork] Fw: Implementing Lock-out/Logins on AJA Phase II J
 sputter system
In-Reply-To: <e3a18317-061a-0d09-38d8-ac684047427f@nd.edu>
References: <DM2PR0701MB1359CC5E58819E5BA32B33E8A3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
 <DM2PR0701MB135913B9F9C2F688FD833E9FA3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
 <e3a18317-061a-0d09-38d8-ac684047427f@nd.edu>
Message-ID: <24a6e6fb7085479f87cf24829eb62091@wppexc06.purdue.lcl>

We interlock out PVD Sputtering systems via the Process Cooling Water flow meter.  We interrupt that signal with a simple contact closure so the system sees no water flow and will not start up.  Once it is "enabled" we close that contact via IP addressable relay, and the system sees the water flowing again.  (we never interrupt the water in reality, just the signal to the controller)  This has been working quite well for us, hope this helps.

Jerry Shepard
Birck Nanotechnology Center
West Lafayette, IN 47909-2057
Phone: 765-494-3480

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Michael Young
Sent: Thursday, August 17, 2017 11:06 AM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Fw: Implementing Lock-out/Logins on AJA Phase II J sputter system


Hi Mark. If not the computer, how about just the monitor? Or instead of the plasma gas line, how about the vent valve?



--Mike

On 8/17/17 10:02 AM, Mark Hofheins wrote:





Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

505-710-3527



Micro Electronics Technician

Manufacturing Engineering

University of New Mexico MTTC

800 Bradbury S.E.  Suit 235

Albuquerque, New Mexico

87106-4346



________________________________
From: Mark Hofheins
Sent: Thursday, August 17, 2017 7:46 AM
To: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>
Subject: Implementing Lock-out/Logins on AJA Phase II J sputter system


Hello all,

We have an AJA Phase II J sputter tool that we need to implement our "Login" system on.

The system allows for  a open /closed circuit at 24v or 115v.

Most all of the sputter system is 230v. I do not want to have to power up the computer each time for someone to login and be able to use the tool.

At this point I believe that my best option is to have an electronic valve in the main plasma gas line as all gasses are routed through a single line.

I am looking for suggestions if anyone has a similar system in place on an AJA.

Thank you,



Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

505-710-3527



Micro Electronics Technician

Manufacturing Engineering

University of New Mexico MTTC

800 Bradbury S.E.  Suit 235

Albuquerque, New Mexico

87106-4346






_______________________________________________

labnetwork mailing list

labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>

https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork<https://secure-web.cisco.com/1s7oVhRH0bXlHXrUg7ZafxALs77PK7EE-da3WLWQ2hHIcDyCNlIQeTxL6mTEytOMFkhF-5sdTlGp5_FYVwIypxm4SwFot5bY83qNULsCTbEdJNdqy3Bq-Lji_1Kp1Pe___oBf2sm4wGB-PEwq3sNcfPskRDtbgaOnbkNlpSJu1u4GY8mhUUdYh-wPWcZNTPMjUtXGmGE_JcbKDNeMo8daYcSJ1bqpP6O1jg1JcDH2USiCmh9cYZAvN8h8VfhiQCrALgcwj1AK4s_HAVRnSDqNl620CNO1Cdx63ozu3kNqDhpSR9Qsu_e_9MralPp1laFrP87ke8k793Q3-AcfP2VTFmg9ECUGCBH6MKWxf-hmjgE/https%3A%2F%2Fwww-mtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork>



--

Michael P. Young                                (574) 631-3268 (office)

Nanofabrication Specialist                      (574) 631-4393 (fax)

Department of Electrical Engineering            (765) 637-3784 (cell)

University of Notre Dame                         mike.young at nd.edu<mailto:mike.young at nd.edu>

B-38 Stinson-Remick Hall

Notre Dame, IN 46556-5637
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From myoung6 at nd.edu  Thu Aug 17 15:33:01 2017
From: myoung6 at nd.edu (Michael Young)
Date: Thu, 17 Aug 2017 15:33:01 -0400
Subject: [labnetwork] Implementing Lock-out/Logins on AJA Phase II J
 sputter system
In-Reply-To: <E72699FC7A523A4BACF848960958590246481FCF@CIO-KRC-D2MBX08.osuad.osu.edu>
References: <E72699FC7A523A4BACF848960958590246481FCF@CIO-KRC-D2MBX08.osuad.osu.edu>
Message-ID: <a1267aeb-be23-1077-8288-b51bf410ef0c@nd.edu>

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From cekendri at mtu.edu  Thu Aug 17 16:00:01 2017
From: cekendri at mtu.edu (Chito Kendrick)
Date: Thu, 17 Aug 2017 16:00:01 -0400
Subject: [labnetwork] Fw: Implementing Lock-out/Logins on AJA Phase II J
 sputter system
In-Reply-To: <24a6e6fb7085479f87cf24829eb62091@wppexc06.purdue.lcl>
References: <DM2PR0701MB1359CC5E58819E5BA32B33E8A3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
 <DM2PR0701MB135913B9F9C2F688FD833E9FA3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
 <e3a18317-061a-0d09-38d8-ac684047427f@nd.edu>
 <24a6e6fb7085479f87cf24829eb62091@wppexc06.purdue.lcl>
Message-ID: <2d29c0cd-d590-8662-6c0b-5529420ec80e@mtu.edu>

I like the vent line for deposition tools as it is likely the first 
thing they have to do to get a sample in, but then it might depend on 
how you log their usage.


Also, it is very easy to put a solenoid/relay on a air line or control 
line to cut the pressure.


Chito Kendrick


On 8/17/2017 2:10 PM, Shepard, Jeremiah J wrote:
>
> We interlock out PVD Sputtering systems via the Process Cooling Water 
> flow meter.  We interrupt that signal with a simple contact closure so 
> the system sees no water flow and will not start up.  Once it is 
> ?enabled? we close that contact via IP addressable relay, and the 
> system sees the water flowing again.  (we never interrupt the water in 
> reality, just the signal to the controller)  This has been working 
> quite well for us, hope this helps.
>
> Jerry Shepard
>
> Birck Nanotechnology Center
>
> West Lafayette, IN 47909-2057
>
> Phone: 765-494-3480
>
> *From:*labnetwork-bounces at mtl.mit.edu 
> [mailto:labnetwork-bounces at mtl.mit.edu] *On Behalf Of *Michael Young
> *Sent:* Thursday, August 17, 2017 11:06 AM
> *To:* labnetwork at mtl.mit.edu
> *Subject:* Re: [labnetwork] Fw: Implementing Lock-out/Logins on AJA 
> Phase II J sputter system
>
> Hi Mark. If not the computer, how about just the monitor? Or instead 
> of the plasma gas line, how about the vent valve?
>
> --Mike
>
> On 8/17/17 10:02 AM, Mark Hofheins wrote:
>
>     Mark Hofheins
>
>     mhofheins at unm.edu <mailto:mhofheins at unm.edu>
>
>     505-710-3527
>
>     Micro Electronics Technician
>
>     Manufacturing Engineering
>
>     University of New Mexico MTTC
>
>     800 Bradbury S.E.  Suit 235
>
>     Albuquerque, New Mexico
>
>     87106-4346
>
>     ------------------------------------------------------------------------
>
>     *From:*Mark Hofheins
>     *Sent:* Thursday, August 17, 2017 7:46 AM
>     *To:* labnetwork-bounces at mtl.mit.edu
>     <mailto:labnetwork-bounces at mtl.mit.edu>
>     *Subject:* Implementing Lock-out/Logins on AJA Phase II J sputter
>     system
>
>     Hello all,
>
>     We have an AJA Phase II J sputter tool that we need to implement
>     our "Login" system on.
>
>     The system allows for  a open /closed circuit at 24v or 115v.
>
>     Most all of the sputter system is 230v. I do not want to have to
>     power up the computer each time for someone to login and be able
>     to use the tool.
>
>     At this point I believe that my best option is to have an
>     electronic valve in the main plasma gas line as all gasses are
>     routed through a single line.
>
>     I am looking for suggestions if anyone has a similar system in
>     place on an AJA.
>
>     Thank you,
>
>     Mark Hofheins
>
>     mhofheins at unm.edu <mailto:mhofheins at unm.edu>
>
>     505-710-3527
>
>     Micro Electronics Technician
>
>     Manufacturing Engineering
>
>     University of New Mexico MTTC
>
>     800 Bradbury S.E.  Suit 235
>
>     Albuquerque, New Mexico
>
>     87106-4346
>
>
>
>
>     _______________________________________________
>
>     labnetwork mailing list
>
>     labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu>
>
>     https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>     <https://secure-web.cisco.com/1s7oVhRH0bXlHXrUg7ZafxALs77PK7EE-da3WLWQ2hHIcDyCNlIQeTxL6mTEytOMFkhF-5sdTlGp5_FYVwIypxm4SwFot5bY83qNULsCTbEdJNdqy3Bq-Lji_1Kp1Pe___oBf2sm4wGB-PEwq3sNcfPskRDtbgaOnbkNlpSJu1u4GY8mhUUdYh-wPWcZNTPMjUtXGmGE_JcbKDNeMo8daYcSJ1bqpP6O1jg1JcDH2USiCmh9cYZAvN8h8VfhiQCrALgcwj1AK4s_HAVRnSDqNl620CNO1Cdx63ozu3kNqDhpSR9Qsu_e_9MralPp1laFrP87ke8k793Q3-AcfP2VTFmg9ECUGCBH6MKWxf-hmjgE/https%3A%2F%2Fwww-mtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork>
>
>
>
> -- 
> Michael P. Young                                (574) 631-3268 (office)
> Nanofabrication Specialist                      (574) 631-4393 (fax)
> Department of Electrical Engineering            (765) 637-3784 (cell)
> University of Notre Damemike.young at nd.edu <mailto:mike.young at nd.edu>
> B-38 Stinson-Remick Hall
> Notre Dame, IN 46556-5637
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

-- 
Chito Kendrick Ph.D. <https://sites.google.com/site/chitokendrickphd/>

Managing Director of the Microfabrication Facility
Research Assistant Professor
Electrical and Computer Engineering
Michigan Technological University
Room 436 M&M Building
1400 Townsend Dr.
Houghton, Michigan 49931-1295

814-308-4255
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From derose at caltech.edu  Thu Aug 17 16:42:15 2017
From: derose at caltech.edu (DeRose, Guy A.)
Date: Thu, 17 Aug 2017 20:42:15 +0000
Subject: [labnetwork] Implementing Lock-out/Logins on AJA Phase II J
 sputter system
In-Reply-To: <a1267aeb-be23-1077-8288-b51bf410ef0c@nd.edu>
References: <E72699FC7A523A4BACF848960958590246481FCF@CIO-KRC-D2MBX08.osuad.osu.edu>
 <a1267aeb-be23-1077-8288-b51bf410ef0c@nd.edu>
Message-ID: <A8DB9E5D-95F9-490C-9135-ED88296AA2CD@caltech.edu>

On most of my tools with a PC interface, I interrupt the mouse or keyboard with a USB hub that is powered by a network-controlled relay.

Guy DeRose, PhD, Member of the Professional Staff
Associate Director, Kavli Nanoscience Institute
California Institute of Technology, Pasadena, CA USA
(O) 1-626-395-3423 (M) 1-626-676-8529
http://kni.caltech.edu Skype: guy_derose


From: <labnetwork-bounces at mtl.mit.edu> on behalf of Michael Young <myoung6 at nd.edu>
Date: Thursday, August 17, 2017 at 3:33 PM
To: "labnetwork at mtl.mit.edu" <labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Implementing Lock-out/Logins on AJA Phase II J sputter system


Forwarding from Peter to the list...


-------- Forwarded Message --------
Subject:

RE: [labnetwork] Fw: Implementing Lock-out/Logins on AJA Phase II J sputter system

Date:

Thu, 17 Aug 2017 19:30:45 +0000

From:

Janney, Peter J. <janney.9 at osu.edu><mailto:janney.9 at osu.edu>

To:

Michael Young <myoung6 at nd.edu><mailto:myoung6 at nd.edu>




We just interrupt the interlock for the RF and DC power supplies.

Best regards,
Peter Janney

[he Ohio                 State University]
Peter Janney
Lab Services Coordinator
Nanotech West Lab
100 Science Village, 1381 Kinnear Road, Columbus, OH 43212
614-688-4213 Office
614-753-3926 Cell
janney.9 at osu.edu<mailto:janney.9 at osu.edu> nanotech.osu.edu<http://nanotech.osu.edu/>

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From eabelev at pitt.edu  Fri Aug 18 09:17:29 2017
From: eabelev at pitt.edu (Abelev, Esta)
Date: Fri, 18 Aug 2017 13:17:29 +0000
Subject: [labnetwork] Quartz plates for mask making
Message-ID: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>

Dear Colleagues,

Our facility getting it first Heidelberg laser write tool. I would like to get advice where to buy quartz or Soda lime plates with Cr (maybe even with resist) to make masks.
In addition, if some can comment how to store them in the cleanroom.

Thank you, Esta


-----------------------
Esta Abelev, PhD
Technical Director, Petersen Institute of NanoScience and Engineering
University of Pittsburgh | 3700 O'Hara Street | 636| Pittsburgh, PA 15261
412-383-4096 | eabelev at pitt.edu<mailto:eabelev at pitt.edu> | nano.pitt.edu<https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0>


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From sieb at 4dlabs.ca  Fri Aug 18 12:30:12 2017
From: sieb at 4dlabs.ca (Nathanael Sieb)
Date: Fri, 18 Aug 2017 09:30:12 -0700
Subject: [labnetwork] Quartz plates for mask making
In-Reply-To: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
References: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
Message-ID: <423c5cf8-809d-e15a-ec54-3c40d5dd7b00@4dlabs.ca>

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From ngottron at andrew.cmu.edu  Fri Aug 18 12:41:34 2017
From: ngottron at andrew.cmu.edu (Norman Gottron)
Date: Fri, 18 Aug 2017 16:41:34 +0000
Subject: [labnetwork] Quartz plates for mask making
In-Reply-To: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
References: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
Message-ID: <3d63f4e5d7c046cf88f9a3b53fb44c68@PGH-MSGMLT-02.andrew.ad.cmu.edu>

Hi Esta,

We buy our 4", 5", 6", and 7" plates from Nanofilm (all borosilicate), but I believe they have soda lime, too (and maybe quartz).  We buy them pre-coated with AZ1518.

We don't do anything special for storage other than keep them in the boxes (which are opaque) under the yellow lights in the cleanroom.  The resist is fairly stable as far as I can tell - even after months and months on the shelf they perform consistently for us.

Regards,

Norman Gottron
Process Engineer, Carnegie Mellon University Nanofabrication Facility
Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave
Pittsburgh, PA 15213
Phone: 412-268-4205
Fax: 412-268-3497
www.ece.cmu.edu<http://www.ece.cmu.edu/>
www.nanofab.ece.cmu.edu<http://www.nanofab.ece.cmu.edu/>




From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Abelev, Esta
Sent: Friday, August 18, 2017 9:17 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Quartz plates for mask making

Dear Colleagues,

Our facility getting it first Heidelberg laser write tool. I would like to get advice where to buy quartz or Soda lime plates with Cr (maybe even with resist) to make masks.
In addition, if some can comment how to store them in the cleanroom.

Thank you, Esta


-----------------------
Esta Abelev, PhD
Technical Director, Petersen Institute of NanoScience and Engineering
University of Pittsburgh | 3700 O'Hara Street | 636| Pittsburgh, PA 15261
412-383-4096 | eabelev at pitt.edu<mailto:eabelev at pitt.edu> | nano.pitt.edu<https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0>


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From James.Vlahakis at tufts.edu  Fri Aug 18 12:44:46 2017
From: James.Vlahakis at tufts.edu (Vlahakis, James)
Date: Fri, 18 Aug 2017 16:44:46 +0000
Subject: [labnetwork] Quartz plates for mask making
In-Reply-To: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
References: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
Message-ID: <676C9381B5E6AC4FAE9CD9CFCC40DF1ED240815F@tabvmexdag1mb03.tufts.ad.tufts.edu>

Hi Esta, in the past we have purchased glass photomask blanks from Telic - http://www.teliccompany.com/ - with a photoresist coating (iirc AZ1500).  They were delivered in an opaque, sealed carrier which worked well for storage

jim

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Abelev, Esta
Sent: Friday, August 18, 2017 9:17 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Quartz plates for mask making

Dear Colleagues,

Our facility getting it first Heidelberg laser write tool. I would like to get advice where to buy quartz or Soda lime plates with Cr (maybe even with resist) to make masks.
In addition, if some can comment how to store them in the cleanroom.

Thank you, Esta


-----------------------
Esta Abelev, PhD
Technical Director, Petersen Institute of NanoScience and Engineering
University of Pittsburgh | 3700 O'Hara Street | 636| Pittsburgh, PA 15261
412-383-4096 | eabelev at pitt.edu<mailto:eabelev at pitt.edu> | nano.pitt.edu<https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0>


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From nclay at upenn.edu  Fri Aug 18 12:44:24 2017
From: nclay at upenn.edu (Noah Clay)
Date: Fri, 18 Aug 2017 12:44:24 -0400
Subject: [labnetwork] Quartz plates for mask making
In-Reply-To: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
References: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
Message-ID: <A9168D04-194C-482F-B1B9-201ED77BF664@upenn.edu>

Hi Esta,

Congrats on the new tool.

For photomasks, we use Telic: 

http://www.telicco.com/

Charles Veith can provide pricing and contact information for this vendor.

Once opened, masks are stored in a cage in the cleanroom (yellow area, no desiccators or N2 purge).  We go through a box of masks every 1-2 weeks.  You're welcome to visit Penn to work with staff for any process development needs as you get going.

Best,
Noah

Sent from my iPhone

> On Aug 18, 2017, at 09:17, Abelev, Esta <eabelev at pitt.edu> wrote:
> 
> Dear Colleagues,
>  
> Our facility getting it first Heidelberg laser write tool. I would like to get advice where to buy quartz or Soda lime plates with Cr (maybe even with resist) to make masks.
> In addition, if some can comment how to store them in the cleanroom.
>  
> Thank you, Esta
>  
>  
> -----------------------
> Esta Abelev, PhD
> Technical Director, Petersen Institute of NanoScience and Engineering 
> University of Pittsburgh | 3700 O?Hara Street | 636| Pittsburgh, PA 15261
> 412-383-4096 | eabelev at pitt.edu | nano.pitt.edu
>  
>  
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From p.kollensperger at ntnu.no  Fri Aug 18 14:13:24 2017
From: p.kollensperger at ntnu.no (=?iso-8859-1?Q?Peter_K=F6llensperger?=)
Date: Fri, 18 Aug 2017 18:13:24 +0000
Subject: [labnetwork] Quartz plates for mask making
In-Reply-To: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
References: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
Message-ID: <6E285D27-2F71-427B-BD34-ADCBC43A3AE3@ntnu.no>

Hi Esta,

Heidelberg Instruments may sell mask blanks precoated with CR and resist directly.
The other source is http://www.townetech.com/feo.htm, not Cr but ferroxo coated plates. I've used those and they worked well.

Best regards,

Peter




----------------------------------------------

Dr. Peter A. K?llensperger
Director NanoLab
Norwegian University of Science and Technology (NTNU)
7491 Trondheim

Tel: +47 913 70 718<tel:+47%20931%2070%20718>



On 18 Aug 2017, at 18:01, Abelev, Esta <eabelev at pitt.edu<mailto:eabelev at pitt.edu>> wrote:

Dear Colleagues,

Our facility getting it first Heidelberg laser write tool. I would like to get advice where to buy quartz or Soda lime plates with Cr (maybe even with resist) to make masks.
In addition, if some can comment how to store them in the cleanroom.

Thank you, Esta


-----------------------
Esta Abelev, PhD
Technical Director, Petersen Institute of NanoScience and Engineering
University of Pittsburgh | 3700 O'Hara Street | 636| Pittsburgh, PA 15261
412-383-4096 | eabelev at pitt.edu<mailto:eabelev at pitt.edu> | nano.pitt.edu<https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0>


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From bgila at ufl.edu  Fri Aug 18 14:21:09 2017
From: bgila at ufl.edu (Brent Gila)
Date: Fri, 18 Aug 2017 14:21:09 -0400
Subject: [labnetwork] Quartz plates for mask making
In-Reply-To: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
References: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
Message-ID: <31efe641-c523-5399-f3ea-1ed6d4149214@ufl.edu>

We get very good product and support from Nanofilm. 
(http://www.nanofilm.com/)


-- 
Brent P. Gila, PhD.
Director, Nanoscale Research Facility
1041 Center Drive
University of Florida
Gainesville, Florida 32611
Tel:352-273-2245
Fax:352-846-2877
email:bgila at ufl.edu

On 8/18/2017 9:17 AM, Abelev, Esta wrote:
>
> Dear Colleagues,
>
> Our facility getting it first Heidelberg laser write tool. I would 
> like to get advice where to buy quartz or Soda lime plates with Cr 
> (maybe even with resist) to make masks.
>
> In addition, if some can comment how to store them in the cleanroom.
>
> Thank you, Esta
>
> -----------------------
>
> *Esta Abelev, PhD*
>
> Technical Director,//Petersen Institute of NanoScience and Engineering
>
> University of Pittsburgh | 3700 O?Hara Street | 636| Pittsburgh, PA 15261
>
> 412-383-4096 | eabelev at pitt.edu <mailto:eabelev at pitt.edu> | 
> nano.pitt.edu 
> <https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0>
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From ahryciw at ualberta.ca  Fri Aug 18 14:56:03 2017
From: ahryciw at ualberta.ca (Aaron Hryciw)
Date: Fri, 18 Aug 2017 12:56:03 -0600
Subject: [labnetwork] Quartz plates for mask making
In-Reply-To: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
References: <SN2PR04MB22054AF319BFFD6F4E342130C5800@SN2PR04MB2205.namprd04.prod.outlook.com>
Message-ID: <CAPt+QB_2O=won_aRewcsGjtT31EwKu+X2HuLrCXfrP_vzmr-6w@mail.gmail.com>

Hi Esta,

We have a Heidelberg DWL-200 in our cleanroom, which we use to process
quite a few photomasks (mostly 5", some 7").  We purchase our mask blanks
from Nanofilm (http://www.nanofilm.com/about_us.php).  As for storage, we
keep the mask blanks in their (opaque) cassette within the litho area of
our cleanroom, but without any other special storage conditions.  We keep
finished masks in individual storage boxes from Pozzett
<http://www.pozzetta.com/products/products-overview.html>a.

Hope this helps.

Cheers,

 ? Aaron




Aaron Hryciw, PhD, PEng

Fabrication Group Manager

University of Alberta - nanoFAB

W1-060 ECERF Building

9107 - 116 Street

Edmonton, Alberta

Canada T6G 2V4 Ph: 780-940-7938
www.nanofab.ualberta.ca


On Fri, Aug 18, 2017 at 7:17 AM, Abelev, Esta <eabelev at pitt.edu> wrote:

> Dear Colleagues,
>
>
>
> Our facility getting it first Heidelberg laser write tool. I would like to
> get advice where to buy quartz or Soda lime plates with Cr (maybe even with
> resist) to make masks.
>
> In addition, if some can comment how to store them in the cleanroom.
>
>
>
> Thank you, Esta
>
>
>
>
>
> -----------------------
>
> *Esta Abelev, PhD*
>
> Technical Director, Petersen Institute of NanoScience and Engineering
>
> University of Pittsburgh | 3700 O?Hara Street | 636| Pittsburgh, PA 15261
>
> 412-383-4096 <(412)%20383-4096> | eabelev at pitt.edu | nano.pitt.edu
> <https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0>
>
>
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
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From ahad.syed at kaust.edu.sa  Sat Aug 19 04:49:12 2017
From: ahad.syed at kaust.edu.sa (Ahad Syed)
Date: Sat, 19 Aug 2017 08:49:12 +0000
Subject: [labnetwork] Fw: Implementing Lock-out/Logins on AJA Phase II
	J	sputter system
In-Reply-To: <DM2PR0701MB135913B9F9C2F688FD833E9FA3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
References: <DM2PR0701MB1359CC5E58819E5BA32B33E8A3830@DM2PR0701MB1359.namprd07.prod.outlook.com>,
 <DM2PR0701MB135913B9F9C2F688FD833E9FA3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
Message-ID: <1503132552389.82768@kaust.edu.sa>

Hi Mark,


Most of our tools are inter-locked on the monitor. We use Badger LMS at the KAUST. The PC stays on, but without the monitor they wouldn't know what button to press to even vent the system. For some tools, we have the inter-lock on the gas-pod (RIE by Oxford Instruments).


We have been running this for more than 3 years now without any issues.


All the best,

Ahad


--
Nanofabrication Core Lab
4700 King Abdullah University of Science and Technology
0250-WS02 Building 3, Thuwal 23955-6900, Kingdom of Saudi Arabia
Tel:+966 12 808 2348
________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Mark Hofheins <mhofheins at unm.edu>
Sent: Thursday, August 17, 2017 5:02 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Fw: Implementing Lock-out/Logins on AJA Phase II J sputter system




Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

505-710-3527



Micro Electronics Technician

Manufacturing Engineering

University of New Mexico MTTC

800 Bradbury S.E.  Suit 235

Albuquerque, New Mexico

87106-4346



________________________________
From: Mark Hofheins
Sent: Thursday, August 17, 2017 7:46 AM
To: labnetwork-bounces at mtl.mit.edu
Subject: Implementing Lock-out/Logins on AJA Phase II J sputter system


Hello all,

We have an AJA Phase II J sputter tool that we need to implement our "Login" system on.

The system allows for  a open /closed circuit at 24v or 115v.

Most all of the sputter system is 230v. I do not want to have to power up the computer each time for someone to login and be able to use the tool.

At this point I believe that my best option is to have an electronic valve in the main plasma gas line as all gasses are routed through a single line.

I am looking for suggestions if anyone has a similar system in place on an AJA.

Thank you,


Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

505-710-3527



Micro Electronics Technician

Manufacturing Engineering

University of New Mexico MTTC

800 Bradbury S.E.  Suit 235

Albuquerque, New Mexico

87106-4346


________________________________
This message and its contents including attachments are intended solely for the original recipient. If you are not the intended recipient or have received this message in error, please notify me immediately and delete this message from your computer system. Any unauthorized use or distribution is prohibited. Please consider the environment before printing this email.
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From aju-jugessur at uiowa.edu  Mon Aug 21 12:26:55 2017
From: aju-jugessur at uiowa.edu (Jugessur, Aju S)
Date: Mon, 21 Aug 2017 16:26:55 +0000
Subject: [labnetwork] EBeam Lithography on Glass substrates
Message-ID: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>

Hi,

I have a user who is having inconsistent results when exposing patterns (100-200 nm in size) on glass substrate.
He is using a 5 nm Al layer between the 100nm ZEP and glass substrate. He obtained good results but it does not seem reproducible all the times.
He is also ensuring that there is good contact between the sample clips and the metal layer. Another approach would be to place the metal on top of the resist.

He has also used the conducting polymer PDOT on ZEP but it does not seem to adhere too well. He could also be doing a step or steps consistently wrong and be unaware.

This is quite a common and established process but I would like to see if the members have any suggestions to ensure reproducible and consistent results for ebeam lithography on glass substrates.
I will provide more information/details once I receive some feedback.

Thanks,
Regards
Aju




Aju Jugessur, Ph.D.
Director, University of Iowa Microfabrication Facility (UIMF)
Optical Science and Technology Center
Professor Adjunct, Physics and Astronomy
University of Iowa
Office: IATL 202, Tel: 319-3532342
Labs: IATL 170, 172, 174
https://ostc.uiowa.edu/uimf






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From mondol at mit.edu  Mon Aug 21 17:04:02 2017
From: mondol at mit.edu (Mark K Mondol)
Date: Mon, 21 Aug 2017 17:04:02 -0400
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
Message-ID: <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>

Aju:

1. Be 100% certain the layer is conductive and connected to ground in 
the tool.

2. Every time they write on glass, do the same exposure on Si, if the 
problem shows up on both Si and glass the issue is not the insulating 
substrate.

3. Al etch can damage PMMA; not always in a repeatable way. Does your 
process include etching the Al (I have found Transene CR-7 chrome etch 
to be compatible with PMMA and ZEP, so usually use Cr not Al as the 
conductive layer).

Regards,

Mark K MOndol

-- 
Mark K Mondol
Assistant Director NanoStructures Laboratory
And
Facility Manager
Scanning Electron Beam Lithography Facility
Bldg 36  Room 229
www.rle.mit.edu/sebl
mondol at mit.edu
office - 617-253-9617
cell - 617-224-8756




From michael.rooks at yale.edu  Mon Aug 21 17:25:51 2017
From: michael.rooks at yale.edu (Michael Rooks)
Date: Mon, 21 Aug 2017 17:25:51 -0400
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
Message-ID: <599B4FDF.3010702@yale.edu>

We commonly use a 10 nm gold film, sputtered on top of ZEP or PMMA. The 
film can be removed with KI/I solution (Transene TFA etchant) before 
development.

The University of Minnesota has a nice web page about conducting layers 
for ebeam: http://apps.mnc.umn.edu/archive/ebpgwiki/Charging.html


--------------------------------
Michael Rooks
Yale Institute of Nanoscience and Quantum Engineering
nano.yale.edu <http://nano.yale.edu>



On 08/21/2017 12:26 PM, Jugessur, Aju S wrote:
> Hi,
>
> I have a user who is having inconsistent results when exposing 
> patterns (100-200 nm in size) on glass substrate.
> He is using a 5 nm Al layer between the 100nm ZEP and glass substrate. 
> He obtained good results but it does not seem reproducible all the times.
> He is also ensuring that there is good contact between the sample 
> clips and the metal layer. Another approach would be to place the 
> metal on top of the resist.
>
> He has also used the conducting polymer PDOT on ZEP but it does not 
> seem to adhere too well. He could also be doing a step or steps 
> consistently wrong and be unaware.
>
> This is quite a common and established process but I would like to see 
> if the members have any suggestions to ensure reproducible and 
> consistent results for ebeam lithography on glass substrates.
> I will provide more information/details once I receive some feedback.
>
> Thanks,
> Regards
> Aju
>
>
>
>
> /Aju Jugessur, Ph.D.
> Director, University of Iowa Microfabrication Facility (UIMF)
> Optical Science and Technology Center
> Professor Adjunct, Physics and Astronomy
> University of Iowa
> Office: IATL 202, Tel: 319-3532342
> Labs: IATL 170, 172, 174
> https://ostc.uiowa.edu/uimf/
>
>
>
>
>
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From price.798 at osu.edu  Mon Aug 21 17:39:53 2017
From: price.798 at osu.edu (Price, Aimee)
Date: Mon, 21 Aug 2017 21:39:53 +0000
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
Message-ID: <83583687862B8444A85296A4944147DFBFB75645@CIO-KRC-D2MBX09.osuad.osu.edu>

Aju,
Does the problem look like charging (pattern misplacement, some distorted patterns that look a bit broken up, etc.) or does it look like a focus problem?  Depending on what kind of EBL tool you have not only do you have to be concerned about charging, but also making sure that the tool can find the right focus.  Many tool platforms use a laser height meter to determine the height of the sample locally and then locally adjust the final focus.

You can email me directly if you wish.  At Ohio State, we pattern on quartz, ceramics, SiC, sapphire, etc. more often than not so we have several options for processing fixes.

You'll likely need to get some images from him for anyone who offers to help.

My email is price.798 at osu.edu<mailto:price.798 at osu.edu>.

Regards,
Aimee Price



From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Jugessur, Aju S
Sent: Monday, August 21, 2017 12:27 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] EBeam Lithography on Glass substrates

Hi,

I have a user who is having inconsistent results when exposing patterns (100-200 nm in size) on glass substrate.
He is using a 5 nm Al layer between the 100nm ZEP and glass substrate. He obtained good results but it does not seem reproducible all the times.
He is also ensuring that there is good contact between the sample clips and the metal layer. Another approach would be to place the metal on top of the resist.

He has also used the conducting polymer PDOT on ZEP but it does not seem to adhere too well. He could also be doing a step or steps consistently wrong and be unaware.

This is quite a common and established process but I would like to see if the members have any suggestions to ensure reproducible and consistent results for ebeam lithography on glass substrates.
I will provide more information/details once I receive some feedback.

Thanks,
Regards
Aju




Aju Jugessur, Ph.D.
Director, University of Iowa Microfabrication Facility (UIMF)
Optical Science and Technology Center
Professor Adjunct, Physics and Astronomy
University of Iowa
Office: IATL 202, Tel: 319-3532342
Labs: IATL 170, 172, 174
https://ostc.uiowa.edu/uimf





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From mmoneck at andrew.cmu.edu  Mon Aug 21 21:09:17 2017
From: mmoneck at andrew.cmu.edu (Matthew Moneck)
Date: Tue, 22 Aug 2017 01:09:17 +0000
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
Message-ID: <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>

Hi Aju,

We have commonly used Al as a conductive layer on top of PMMA on glass (removal is typically done with minimal damage by using dilute AZ400K photoresist developer).  However, 5nm seems to be on the thin side.  Al can form native oxide that is up to 3-4nm thick.  Therefore, I would confirm the answer to Mark's question of whether or not the 5nm Al layer is conductive.  We typically sputter deposit films that are 10-20nm thick for our applications.

Best Regards,

Matt

-- 
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility
Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu
nanofab.ece.cmu.edu


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
Sent: Monday, August 21, 2017 5:04 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Aju:

1. Be 100% certain the layer is conductive and connected to ground in the tool.

2. Every time they write on glass, do the same exposure on Si, if the problem shows up on both Si and glass the issue is not the insulating substrate.

3. Al etch can damage PMMA; not always in a repeatable way. Does your process include etching the Al (I have found Transene CR-7 chrome etch to be compatible with PMMA and ZEP, so usually use Cr not Al as the conductive layer).

Regards,

Mark K MOndol

--
Mark K Mondol
Assistant Director NanoStructures Laboratory And Facility Manager Scanning Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl mondol at mit.edu office - 617-253-9617 cell - 617-224-8756


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



From mark.chiappa at ntnu.no  Tue Aug 22 03:52:02 2017
From: mark.chiappa at ntnu.no (Mark Giulio Chiappa)
Date: Tue, 22 Aug 2017 07:52:02 +0000
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <599B4FDF.3010702@yale.edu>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <599B4FDF.3010702@yale.edu>
Message-ID: <4a9b6085741a4cf3b9a635a1044d570f@it-ex11.win.ntnu.no>

Here at NTNU we use electra from Allresist  http://www.allresist.com/ar-pc-5090-5091-electra-92/  It's a cheaper alternative.  Instead of three variants there are two, with one for novolac resists.  This works well and we are able to patter large areas with patterns smaller than 100nm.  If you are unaware the CSAR 62 they mention is an affordable alternative to ZEP.  http://www.allresist.com/wp-content/uploads/sites/2/2016/12/allresist_produktinfos_ar-p6200_englisch.pdf.

Kind regards
Mark

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Michael Rooks
Sent: Monday, August 21, 2017 11:26 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

We commonly use a 10 nm gold film, sputtered on top of ZEP or PMMA. The film can be removed with KI/I solution (Transene TFA etchant) before development.

The University of Minnesota has a nice web page about conducting layers for ebeam: http://apps.mnc.umn.edu/archive/ebpgwiki/Charging.html

--------------------------------
Michael Rooks
Yale Institute of Nanoscience and Quantum Engineering
nano.yale.edu<http://nano.yale.edu>


On 08/21/2017 12:26 PM, Jugessur, Aju S wrote:
Hi,

I have a user who is having inconsistent results when exposing patterns (100-200 nm in size) on glass substrate.
He is using a 5 nm Al layer between the 100nm ZEP and glass substrate. He obtained good results but it does not seem reproducible all the times.
He is also ensuring that there is good contact between the sample clips and the metal layer. Another approach would be to place the metal on top of the resist.

He has also used the conducting polymer PDOT on ZEP but it does not seem to adhere too well. He could also be doing a step or steps consistently wrong and be unaware.

This is quite a common and established process but I would like to see if the members have any suggestions to ensure reproducible and consistent results for ebeam lithography on glass substrates.
I will provide more information/details once I receive some feedback.

Thanks,
Regards
Aju




Aju Jugessur, Ph.D.
Director, University of Iowa Microfabrication Facility (UIMF)
Optical Science and Technology Center
Professor Adjunct, Physics and Astronomy
University of Iowa
Office: IATL 202, Tel: 319-3532342
Labs: IATL 170, 172, 174
https://ostc.uiowa.edu/uimf









_______________________________________________

labnetwork mailing list

labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>

https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From chenyl at mail.sustc.edu.cn  Tue Aug 22 05:17:27 2017
From: chenyl at mail.sustc.edu.cn (Chen Yulong (Frank))
Date: Tue, 22 Aug 2017 17:17:27 +0800
Subject: [labnetwork] e-beam crucible liner recommendation for high quality
	deposition of platinum
Message-ID: <2017082217172674342610@mail.sustc.edu.cn>

Hi,

I would like to use e-beam evaporator to deposition platinum thin film on silicon nitride substrate.
company kurt j. lesker recommend fabmate or graphite crucible liner for platinum. (http://www.lesker.com/newweb/deposition_materials/depositionmaterials_evaporationmaterials_1.cfm?pgid=pt1)

but according johnson matthey technology, carbon diffused rapidly into platinum (www.technology.matthey.com/pdf/pmr-v14-i1-014-020.pdf). So, if there is better recommendation for crucible liner for platinum, such as PBN (Pyrolytic Boron Nitride) and tungsten.

Thanks.



???(CHEN Yulong) PhD Student
Department of Materials Science and Engineering
Southern University of Science and Technology
1088 Xueyuan Blvd, Nanshan District, Shenzhen
Guangdong, PRChina
Post code:518055 
Tel: +86-18589050065
 
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From lino.eugene at uwaterloo.ca  Tue Aug 22 09:48:33 2017
From: lino.eugene at uwaterloo.ca (Lino Eugene)
Date: Tue, 22 Aug 2017 13:48:33 +0000
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
 <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
Message-ID: <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>

Hi Aju,

We have a coop student who has worked on different anti-charging materials: PEDOT:PSS, Electra 92 and sputtered Al.

We had also adhesion and uniformity issues with PEDOT:PSS from Sigma-Aldrich. The solution was filtered and Triton X-100 was added and but no noticeable improvement. I was told that surface treatment with SurPass 3000 improves adhesion but we haven't tried this yet. Moreover, PEDOT:PSS cross-links under certain conditions and then the layer cannot be removed with water.

10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is expected to be high because of surface electron scattering (electron mean free path in Al at room temperature is ~19nm) and oxidation. We use MF-319 at room temperature or 40 degC  to remove the layer.

Electra 92 from AllResist is easy to work with as it can be removed with DI water after EBL and gives pretty good results on PMMA and on ZEP520A. Surface treatment on HSQ is needed, so far treatment with IPA gives good results. Also, the price is reasonable compared to ESpacer and AquaSave.

Best,

Lino Eugene, Ph.D., Jr. Eng.
Micro/nanofabrication process engineer
Quantum NanoFab
University of Waterloo
200 University Avenue West
Waterloo, ON, Canada  
N2L 3G1
 
Ph: +1 519-888-4567 #37788
Cell: +1 226-929-1685
Website: https://fab.qnc.uwaterloo.ca/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck
Sent: August 21, 2017 21:09
To: Mark K Mondol <mondol at mit.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have commonly used Al as a conductive layer on top of PMMA on glass (removal is typically done with minimal damage by using dilute AZ400K photoresist developer).  However, 5nm seems to be on the thin side.  Al can form native oxide that is up to 3-4nm thick.  Therefore, I would confirm the answer to Mark's question of whether or not the 5nm Al layer is conductive.  We typically sputter deposit films that are 10-20nm thick for our applications.

Best Regards,

Matt

--
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu
nanofab.ece.cmu.edu


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
Sent: Monday, August 21, 2017 5:04 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Aju:

1. Be 100% certain the layer is conductive and connected to ground in the tool.

2. Every time they write on glass, do the same exposure on Si, if the problem shows up on both Si and glass the issue is not the insulating substrate.

3. Al etch can damage PMMA; not always in a repeatable way. Does your process include etching the Al (I have found Transene CR-7 chrome etch to be compatible with PMMA and ZEP, so usually use Cr not Al as the conductive layer).

Regards,

Mark K MOndol

--
Mark K Mondol
Assistant Director NanoStructures Laboratory And Facility Manager Scanning Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl mondol at mit.edu office - 617-253-9617 cell - 617-224-8756


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



From peter.hung at aero.org  Tue Aug 22 12:21:26 2017
From: peter.hung at aero.org (Peter Hung)
Date: Tue, 22 Aug 2017 16:21:26 +0000
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
 <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
 <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
Message-ID: <SN1PR09MB0800917AFE00A46B4BC80022FB840@SN1PR09MB0800.namprd09.prod.outlook.com>

Hi Everyone,

I've heard of using a variable pressure SEM to reduce charging (http://pubs.acs.org/doi/full/10.1021/nl0601278) It seems to work for us. Has anyone else used this and/or does anyone know the disadvantages to this method? Thanks.

Peter

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Lino Eugene
Sent: Tuesday, August 22, 2017 6:49 AM
To: labnetwork at mtl.mit.edu
Cc: Steven Wei <c27wei at edu.uwaterloo.ca>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have a coop student who has worked on different anti-charging materials: PEDOT:PSS, Electra 92 and sputtered Al.

We had also adhesion and uniformity issues with PEDOT:PSS from Sigma-Aldrich. The solution was filtered and Triton X-100 was added and but no noticeable improvement. I was told that surface treatment with SurPass 3000 improves adhesion but we haven't tried this yet. Moreover, PEDOT:PSS cross-links under certain conditions and then the layer cannot be removed with water.

10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is expected to be high because of surface electron scattering (electron mean free path in Al at room temperature is ~19nm) and oxidation. We use MF-319 at room temperature or 40 degC  to remove the layer.

Electra 92 from AllResist is easy to work with as it can be removed with DI water after EBL and gives pretty good results on PMMA and on ZEP520A. Surface treatment on HSQ is needed, so far treatment with IPA gives good results. Also, the price is reasonable compared to ESpacer and AquaSave.

Best,

Lino Eugene, Ph.D., Jr. Eng.
Micro/nanofabrication process engineer
Quantum NanoFab
University of Waterloo
200 University Avenue West
Waterloo, ON, Canada  
N2L 3G1
 
Ph: +1 519-888-4567 #37788
Cell: +1 226-929-1685
Website: https://fab.qnc.uwaterloo.ca/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck
Sent: August 21, 2017 21:09
To: Mark K Mondol <mondol at mit.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have commonly used Al as a conductive layer on top of PMMA on glass (removal is typically done with minimal damage by using dilute AZ400K photoresist developer).  However, 5nm seems to be on the thin side.  Al can form native oxide that is up to 3-4nm thick.  Therefore, I would confirm the answer to Mark's question of whether or not the 5nm Al layer is conductive.  We typically sputter deposit films that are 10-20nm thick for our applications.

Best Regards,

Matt

--
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu
nanofab.ece.cmu.edu


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
Sent: Monday, August 21, 2017 5:04 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Aju:

1. Be 100% certain the layer is conductive and connected to ground in the tool.

2. Every time they write on glass, do the same exposure on Si, if the problem shows up on both Si and glass the issue is not the insulating substrate.

3. Al etch can damage PMMA; not always in a repeatable way. Does your process include etching the Al (I have found Transene CR-7 chrome etch to be compatible with PMMA and ZEP, so usually use Cr not Al as the conductive layer).

Regards,

Mark K MOndol

--
Mark K Mondol
Assistant Director NanoStructures Laboratory And Facility Manager Scanning Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl mondol at mit.edu office - 617-253-9617 cell - 617-224-8756


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



From beaudoin at physics.ubc.ca  Tue Aug 22 14:26:18 2017
From: beaudoin at physics.ubc.ca (Mario Beaudoin)
Date: Tue, 22 Aug 2017 11:26:18 -0700
Subject: [labnetwork] KOH etch of silicon
In-Reply-To: <4e953489fda344f3adbcb0e6dadbc813@it-ex11.win.ntnu.no>
References: <4e953489fda344f3adbcb0e6dadbc813@it-ex11.win.ntnu.no>
Message-ID: <0f90b80c-b9d6-0a71-2d5b-abb6f18e0c9e@physics.ubc.ca>

Transene sells Si etchants and the condensing glassware to do these 
types of jobs.? http://transene.com/si/


Le 11/08/2017 ? 6:03 AM, Mathilde Isabelle Barriet a ?crit?:
> Dear All,
>
> I have a user who wants to do KOH etch of silicon but since we do not have an established process in the lab, I am wondering if I could get some practical guidance on the best set ups.
>
> Also, this user is especially concerned about contaminating his Si wafers with metals so I wonder what degree of purity of KOH is commonly used and if buying the best quality available make a difference on the Si contamination or not.
>
> If anyone has experience with this, please let me know.
>
> Thanks
> Mathilde
>
> Senior Engineer
> NTNU NanoLab
> ----------------------------
> Sem S?lands vei 14, K1-113
> NO-7491 Trondheim
> +47 91 89 72 08
> www.ntnu.no/nanolab
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>

-- 

*Mario Beaudoin, Ph.D.*

Research Associate

Advanced Nanofabrication Facility (ANF)

Advanced Materials and Process Engineering Lab (AMPEL)

University of British Columbia

2355 East Mall, Vancouver, BC V6T 1Z4

Tel: 604-822-1853

web: www.nanofab.ubc.ca

Reply To: beaudoin at physics.ubc.ca <mailto:beaudoin at physics.ubc.ca>

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From fouad.karouta at anu.edu.au  Tue Aug 22 19:41:36 2017
From: fouad.karouta at anu.edu.au (Fouad Karouta)
Date: Tue, 22 Aug 2017 23:41:36 +0000
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
 <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
 <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
Message-ID: <SYXPR01MB21572BC3C7740530EDFBC7D2C0840@SYXPR01MB2157.ausprd01.prod.outlook.com>

Hi Aju,

Am echoing other voices:
- We use 12 nm of Au mostly on top of PMMA/ZEP to do the EBL which we remove in a Ki/I2 solution.
- Sometime we use Cr under resist layer as well when we need Cr for further processing.

Regards, Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility
Research School of Physics and Engineering
L. Huxley Building (#56), Mills Road, Room 4.02
Australian National University
ACT 0200, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au
http://anff-act.anu.edu.au/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Lino Eugene
Sent: Tuesday, 22 August 2017 11:49 PM
To: labnetwork at mtl.mit.edu
Cc: Steven Wei <c27wei at edu.uwaterloo.ca>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have a coop student who has worked on different anti-charging materials: PEDOT:PSS, Electra 92 and sputtered Al.

We had also adhesion and uniformity issues with PEDOT:PSS from Sigma-Aldrich. The solution was filtered and Triton X-100 was added and but no noticeable improvement. I was told that surface treatment with SurPass 3000 improves adhesion but we haven't tried this yet. Moreover, PEDOT:PSS cross-links under certain conditions and then the layer cannot be removed with water.

10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is expected to be high because of surface electron scattering (electron mean free path in Al at room temperature is ~19nm) and oxidation. We use MF-319 at room temperature or 40 degC  to remove the layer.

Electra 92 from AllResist is easy to work with as it can be removed with DI water after EBL and gives pretty good results on PMMA and on ZEP520A. Surface treatment on HSQ is needed, so far treatment with IPA gives good results. Also, the price is reasonable compared to ESpacer and AquaSave.

Best,

Lino Eugene, Ph.D., Jr. Eng.
Micro/nanofabrication process engineer
Quantum NanoFab
University of Waterloo
200 University Avenue West
Waterloo, ON, Canada  
N2L 3G1
 
Ph: +1 519-888-4567 #37788
Cell: +1 226-929-1685
Website: https://fab.qnc.uwaterloo.ca/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck
Sent: August 21, 2017 21:09
To: Mark K Mondol <mondol at mit.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have commonly used Al as a conductive layer on top of PMMA on glass (removal is typically done with minimal damage by using dilute AZ400K photoresist developer).  However, 5nm seems to be on the thin side.  Al can form native oxide that is up to 3-4nm thick.  Therefore, I would confirm the answer to Mark's question of whether or not the 5nm Al layer is conductive.  We typically sputter deposit films that are 10-20nm thick for our applications.

Best Regards,

Matt

--
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu
nanofab.ece.cmu.edu


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
Sent: Monday, August 21, 2017 5:04 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Aju:

1. Be 100% certain the layer is conductive and connected to ground in the tool.

2. Every time they write on glass, do the same exposure on Si, if the problem shows up on both Si and glass the issue is not the insulating substrate.

3. Al etch can damage PMMA; not always in a repeatable way. Does your process include etching the Al (I have found Transene CR-7 chrome etch to be compatible with PMMA and ZEP, so usually use Cr not Al as the conductive layer).

Regards,

Mark K MOndol

--
Mark K Mondol
Assistant Director NanoStructures Laboratory And Facility Manager Scanning Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl mondol at mit.edu office - 617-253-9617 cell - 617-224-8756


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



From chenyl at mail.sustc.edu.cn  Wed Aug 23 01:52:33 2017
From: chenyl at mail.sustc.edu.cn (Chen Yulong (Frank))
Date: Wed, 23 Aug 2017 13:52:33 +0800
Subject: [labnetwork] KOH etch of silicon
References: <4e953489fda344f3adbcb0e6dadbc813@it-ex11.win.ntnu.no>, 
 <0f90b80c-b9d6-0a71-2d5b-abb6f18e0c9e@physics.ubc.ca>
Message-ID: <2017082313523297654614@mail.sustc.edu.cn>

Hi mario beaudoin and Mathilde Isabelle Barriet

The KOH etch condition used in my lab is 40% by weight and 50 degree Celsius.

You can get the etch rate by http://www.lelandstanfordjunior.com/KOH.html, 

I use electronic grade KOH solution provided by China supplier, so I didn`t check the metal contamination. If you want to remove the potassium ion after the etch process is done, I recommend you put the wafer into hot or boiled water or SC-2 of the RCA clean.

Regards,



???(CHEN Yulong) PhD Student
Department of Materials Science and Engineering
SUSTech  http://www.sustc.edu.cn/en/
Tel: +86-18589050065
 
 
From: Mario Beaudoin
Date: 2017-08-23 02:26
To: labnetwork
Subject: Re: [labnetwork] KOH etch of silicon
Transene sells Si etchants and the condensing glassware to do these types of jobs.  http://transene.com/si/

Le 11/08/2017 ? 6:03 AM, Mathilde Isabelle Barriet a ?crit :
Dear All,
I have a user who wants to do KOH etch of silicon but since we do not have an established process in the lab, I am wondering if I could get some practical guidance on the best set ups.
Also, this user is especially concerned about contaminating his Si wafers with metals so I wonder what degree of purity of KOH is commonly used and if buying the best quality available make a difference on the Si contamination or not.
If anyone has experience with this, please let me know.
Thanks
Mathilde
Senior Engineer
NTNU NanoLab
----------------------------
Sem S?lands vei 14, K1-113
NO-7491 Trondheim
+47 91 89 72 08
www.ntnu.no/nanolab
_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

-- 
Mario Beaudoin, Ph.D.
Research Associate
Advanced Nanofabrication Facility (ANF)
Advanced Materials and Process Engineering Lab (AMPEL)
University of British Columbia
2355 East Mall, Vancouver, BC V6T 1Z4
Tel: 604-822-1853
web: www.nanofab.ubc.ca
Reply To: beaudoin at physics.ubc.ca
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From M.R.Zuiddam at tudelft.nl  Wed Aug 23 08:28:42 2017
From: M.R.Zuiddam at tudelft.nl (Marc Zuiddam - TNW)
Date: Wed, 23 Aug 2017 12:28:42 +0000
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <SYXPR01MB21572BC3C7740530EDFBC7D2C0840@SYXPR01MB2157.ausprd01.prod.outlook.com>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
 <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
 <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
 <SYXPR01MB21572BC3C7740530EDFBC7D2C0840@SYXPR01MB2157.ausprd01.prod.outlook.com>
Message-ID: <6C521A5E02323C4CB73135692FB72A8548FB46F4@SRV362.tudelft.net>

Dear people,

I always have the idea that sputting/evaporating a thin Au layer on my sample is exposing the e-beam resist on my sample.. Do you also experience that?

 Regards, Marc Zuiddam

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
Sent: woensdag 23 augustus 2017 1:42
To: Jugessur, Aju S; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

Am echoing other voices:
- We use 12 nm of Au mostly on top of PMMA/ZEP to do the EBL which we remove in a Ki/I2 solution.
- Sometime we use Cr under resist layer as well when we need Cr for further processing.

Regards, Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility Research School of Physics and Engineering L. Huxley Building (#56), Mills Road, Room 4.02 Australian National University ACT 0200, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au
http://anff-act.anu.edu.au/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Lino Eugene
Sent: Tuesday, 22 August 2017 11:49 PM
To: labnetwork at mtl.mit.edu
Cc: Steven Wei <c27wei at edu.uwaterloo.ca>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have a coop student who has worked on different anti-charging materials: PEDOT:PSS, Electra 92 and sputtered Al.

We had also adhesion and uniformity issues with PEDOT:PSS from Sigma-Aldrich. The solution was filtered and Triton X-100 was added and but no noticeable improvement. I was told that surface treatment with SurPass 3000 improves adhesion but we haven't tried this yet. Moreover, PEDOT:PSS cross-links under certain conditions and then the layer cannot be removed with water.

10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is expected to be high because of surface electron scattering (electron mean free path in Al at room temperature is ~19nm) and oxidation. We use MF-319 at room temperature or 40 degC  to remove the layer.

Electra 92 from AllResist is easy to work with as it can be removed with DI water after EBL and gives pretty good results on PMMA and on ZEP520A. Surface treatment on HSQ is needed, so far treatment with IPA gives good results. Also, the price is reasonable compared to ESpacer and AquaSave.

Best,

Lino Eugene, Ph.D., Jr. Eng.
Micro/nanofabrication process engineer
Quantum NanoFab
University of Waterloo
200 University Avenue West
Waterloo, ON, Canada
N2L 3G1
 
Ph: +1 519-888-4567 #37788
Cell: +1 226-929-1685
Website: https://fab.qnc.uwaterloo.ca/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck
Sent: August 21, 2017 21:09
To: Mark K Mondol <mondol at mit.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have commonly used Al as a conductive layer on top of PMMA on glass (removal is typically done with minimal damage by using dilute AZ400K photoresist developer).  However, 5nm seems to be on the thin side.  Al can form native oxide that is up to 3-4nm thick.  Therefore, I would confirm the answer to Mark's question of whether or not the 5nm Al layer is conductive.  We typically sputter deposit films that are 10-20nm thick for our applications.

Best Regards,

Matt

--
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu
nanofab.ece.cmu.edu


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
Sent: Monday, August 21, 2017 5:04 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Aju:

1. Be 100% certain the layer is conductive and connected to ground in the tool.

2. Every time they write on glass, do the same exposure on Si, if the problem shows up on both Si and glass the issue is not the insulating substrate.

3. Al etch can damage PMMA; not always in a repeatable way. Does your process include etching the Al (I have found Transene CR-7 chrome etch to be compatible with PMMA and ZEP, so usually use Cr not Al as the conductive layer).

Regards,

Mark K MOndol

--
Mark K Mondol
Assistant Director NanoStructures Laboratory And Facility Manager Scanning Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl mondol at mit.edu office - 617-253-9617 cell - 617-224-8756


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



From myoung6 at nd.edu  Wed Aug 23 18:02:12 2017
From: myoung6 at nd.edu (Mike Young)
Date: Wed, 23 Aug 2017 18:02:12 -0400
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <6C521A5E02323C4CB73135692FB72A8548FB46F4@SRV362.tudelft.net>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
 <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
 <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
 <SYXPR01MB21572BC3C7740530EDFBC7D2C0840@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <6C521A5E02323C4CB73135692FB72A8548FB46F4@SRV362.tudelft.net>
Message-ID: <1d5f3852-6cdb-bc2e-b8f3-b82f980cf4f3@nd.edu>

If you *e-beam* evaporate Au, you will get soft X-rays which can expose 
most any resist. Thermal evaporation should be safer - you'll only have 
to worry about thermal degradation in that case.

--Mike


On 8/23/2017 8:28 AM, Marc Zuiddam - TNW wrote:
> Dear people,
>
> I always have the idea that sputting/evaporating a thin Au layer on my sample is exposing the e-beam resist on my sample.. Do you also experience that?
>
>   Regards, Marc Zuiddam
>
>

-- 
Michael P. Young                        (574) 631-3268 (office)
Nanofabrication Specialist              (574) 631-4393 (fax)
Department of Electrical Engineering    (765) 637-3784 (cell)
University of Notre Dame                 mike.young at nd.edu
B-38 Stinson-Remick Hall
Notre Dame, IN 46556-5637

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From price.798 at osu.edu  Wed Aug 23 18:03:53 2017
From: price.798 at osu.edu (Price, Aimee)
Date: Wed, 23 Aug 2017 22:03:53 +0000
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <6C521A5E02323C4CB73135692FB72A8548FB46F4@SRV362.tudelft.net>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
 <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
 <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
 <SYXPR01MB21572BC3C7740530EDFBC7D2C0840@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <6C521A5E02323C4CB73135692FB72A8548FB46F4@SRV362.tudelft.net>
Message-ID: <83583687862B8444A85296A4944147DFBFB7BDF5@CIO-TNC-D2MBX03.osuad.osu.edu>

Sputtering is ok as is thermal evaporation.  Ebeam evaporation tends to expose your resist (I believe it is the x-rays generated not the electrons).  We sputter Al and have in the past (hopefully will again soon) thermally evaporated Au on top.  I need both a conductive and reflective layer, so just using conductive polymers is an issue if the sample is transparent (glass, SiC, sapphire, etc.).

Hope that helps.

Aimee

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Marc Zuiddam - TNW
Sent: Wednesday, August 23, 2017 8:29 AM
To: 'labnetwork at mtl.mit.edu'
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Dear people,

I always have the idea that sputting/evaporating a thin Au layer on my sample is exposing the e-beam resist on my sample.. Do you also experience that?

 Regards, Marc Zuiddam

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
Sent: woensdag 23 augustus 2017 1:42
To: Jugessur, Aju S; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

Am echoing other voices:
- We use 12 nm of Au mostly on top of PMMA/ZEP to do the EBL which we remove in a Ki/I2 solution.
- Sometime we use Cr under resist layer as well when we need Cr for further processing.

Regards, Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility Research School of Physics and Engineering L. Huxley Building (#56), Mills Road, Room 4.02 Australian National University ACT 0200, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au
http://anff-act.anu.edu.au/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Lino Eugene
Sent: Tuesday, 22 August 2017 11:49 PM
To: labnetwork at mtl.mit.edu
Cc: Steven Wei <c27wei at edu.uwaterloo.ca>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have a coop student who has worked on different anti-charging materials: PEDOT:PSS, Electra 92 and sputtered Al.

We had also adhesion and uniformity issues with PEDOT:PSS from Sigma-Aldrich. The solution was filtered and Triton X-100 was added and but no noticeable improvement. I was told that surface treatment with SurPass 3000 improves adhesion but we haven't tried this yet. Moreover, PEDOT:PSS cross-links under certain conditions and then the layer cannot be removed with water.

10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is expected to be high because of surface electron scattering (electron mean free path in Al at room temperature is ~19nm) and oxidation. We use MF-319 at room temperature or 40 degC  to remove the layer.

Electra 92 from AllResist is easy to work with as it can be removed with DI water after EBL and gives pretty good results on PMMA and on ZEP520A. Surface treatment on HSQ is needed, so far treatment with IPA gives good results. Also, the price is reasonable compared to ESpacer and AquaSave.

Best,

Lino Eugene, Ph.D., Jr. Eng.
Micro/nanofabrication process engineer
Quantum NanoFab
University of Waterloo
200 University Avenue West
Waterloo, ON, Canada
N2L 3G1
 
Ph: +1 519-888-4567 #37788
Cell: +1 226-929-1685
Website: https://fab.qnc.uwaterloo.ca/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck
Sent: August 21, 2017 21:09
To: Mark K Mondol <mondol at mit.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have commonly used Al as a conductive layer on top of PMMA on glass (removal is typically done with minimal damage by using dilute AZ400K photoresist developer).  However, 5nm seems to be on the thin side.  Al can form native oxide that is up to 3-4nm thick.  Therefore, I would confirm the answer to Mark's question of whether or not the 5nm Al layer is conductive.  We typically sputter deposit films that are 10-20nm thick for our applications.

Best Regards,

Matt

--
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu
nanofab.ece.cmu.edu


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
Sent: Monday, August 21, 2017 5:04 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Aju:

1. Be 100% certain the layer is conductive and connected to ground in the tool.

2. Every time they write on glass, do the same exposure on Si, if the problem shows up on both Si and glass the issue is not the insulating substrate.

3. Al etch can damage PMMA; not always in a repeatable way. Does your process include etching the Al (I have found Transene CR-7 chrome etch to be compatible with PMMA and ZEP, so usually use Cr not Al as the conductive layer).

Regards,

Mark K MOndol

--
Mark K Mondol
Assistant Director NanoStructures Laboratory And Facility Manager Scanning Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl mondol at mit.edu office - 617-253-9617 cell - 617-224-8756


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



From fouad.karouta at anu.edu.au  Wed Aug 23 19:14:48 2017
From: fouad.karouta at anu.edu.au (Fouad Karouta)
Date: Wed, 23 Aug 2017 23:14:48 +0000
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <6C521A5E02323C4CB73135692FB72A8548FB46F4@SRV362.tudelft.net>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
 <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
 <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
 <SYXPR01MB21572BC3C7740530EDFBC7D2C0840@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <6C521A5E02323C4CB73135692FB72A8548FB46F4@SRV362.tudelft.net>
Message-ID: <SYXPR01MB21570B160E1F398D2CC038FAC0850@SYXPR01MB2157.ausprd01.prod.outlook.com>

Dear Marc,

Evaporating Au on PMMA or ZEP should be done in a thermal evaporator, an e-beam evaporator due to the electron beam would affect the resist. We also avoid sputtering for this application as the effect of Ar plasma (violet colour) can be unpredictable.

Regards, Fouad

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Marc Zuiddam - TNW
Sent: Wednesday, 23 August 2017 10:29 PM
To: 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Dear people,

I always have the idea that sputting/evaporating a thin Au layer on my sample is exposing the e-beam resist on my sample.. Do you also experience that?

 Regards, Marc Zuiddam

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
Sent: woensdag 23 augustus 2017 1:42
To: Jugessur, Aju S; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

Am echoing other voices:
- We use 12 nm of Au mostly on top of PMMA/ZEP to do the EBL which we remove in a Ki/I2 solution.
- Sometime we use Cr under resist layer as well when we need Cr for further processing.

Regards, Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility Research School of Physics and Engineering L. Huxley Building (#56), Mills Road, Room 4.02 Australian National University ACT 0200, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au
http://anff-act.anu.edu.au/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Lino Eugene
Sent: Tuesday, 22 August 2017 11:49 PM
To: labnetwork at mtl.mit.edu
Cc: Steven Wei <c27wei at edu.uwaterloo.ca>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have a coop student who has worked on different anti-charging materials: PEDOT:PSS, Electra 92 and sputtered Al.

We had also adhesion and uniformity issues with PEDOT:PSS from Sigma-Aldrich. The solution was filtered and Triton X-100 was added and but no noticeable improvement. I was told that surface treatment with SurPass 3000 improves adhesion but we haven't tried this yet. Moreover, PEDOT:PSS cross-links under certain conditions and then the layer cannot be removed with water.

10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is expected to be high because of surface electron scattering (electron mean free path in Al at room temperature is ~19nm) and oxidation. We use MF-319 at room temperature or 40 degC  to remove the layer.

Electra 92 from AllResist is easy to work with as it can be removed with DI water after EBL and gives pretty good results on PMMA and on ZEP520A. Surface treatment on HSQ is needed, so far treatment with IPA gives good results. Also, the price is reasonable compared to ESpacer and AquaSave.

Best,

Lino Eugene, Ph.D., Jr. Eng.
Micro/nanofabrication process engineer
Quantum NanoFab
University of Waterloo
200 University Avenue West
Waterloo, ON, Canada
N2L 3G1
 
Ph: +1 519-888-4567 #37788
Cell: +1 226-929-1685
Website: https://fab.qnc.uwaterloo.ca/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck
Sent: August 21, 2017 21:09
To: Mark K Mondol <mondol at mit.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have commonly used Al as a conductive layer on top of PMMA on glass (removal is typically done with minimal damage by using dilute AZ400K photoresist developer).  However, 5nm seems to be on the thin side.  Al can form native oxide that is up to 3-4nm thick.  Therefore, I would confirm the answer to Mark's question of whether or not the 5nm Al layer is conductive.  We typically sputter deposit films that are 10-20nm thick for our applications.

Best Regards,

Matt

--
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu
nanofab.ece.cmu.edu


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
Sent: Monday, August 21, 2017 5:04 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Aju:

1. Be 100% certain the layer is conductive and connected to ground in the tool.

2. Every time they write on glass, do the same exposure on Si, if the problem shows up on both Si and glass the issue is not the insulating substrate.

3. Al etch can damage PMMA; not always in a repeatable way. Does your process include etching the Al (I have found Transene CR-7 chrome etch to be compatible with PMMA and ZEP, so usually use Cr not Al as the conductive layer).

Regards,

Mark K MOndol

--
Mark K Mondol
Assistant Director NanoStructures Laboratory And Facility Manager Scanning Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl mondol at mit.edu office - 617-253-9617 cell - 617-224-8756


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



From fouad.karouta at anu.edu.au  Wed Aug 23 21:48:34 2017
From: fouad.karouta at anu.edu.au (Fouad Karouta)
Date: Thu, 24 Aug 2017 01:48:34 +0000
Subject: [labnetwork] Sputtering CuS and Y2O3
Message-ID: <SYXPR01MB2157AE972273C4FB648D6C59C09A0@SYXPR01MB2157.ausprd01.prod.outlook.com>

Hi all,

I am looking for feedback about the use of CuS and/or Y2O3 targets in a multi users facility.

1-      Is there any risk that CuS may decompose during sputtering and contaminate the system with sulphur?

2-      The SDS I consulted for Y2O3 mentioned some hazards and I wonder if there are experiences with this material in the network especially if there are any health concerns.

Thanks,
Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility
Research School of Physics and Engineering
L. Huxley Building (#56), Mills Road, Room 4.02
Australian National University
ACT 0200, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au<mailto:fouad.karouta at anu.edu.au>
http://anff-act.anu.edu.au/

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From Jacob.Trevino at asrc.cuny.edu  Thu Aug 24 08:44:23 2017
From: Jacob.Trevino at asrc.cuny.edu (Jacob Trevino)
Date: Thu, 24 Aug 2017 12:44:23 +0000
Subject: [labnetwork] Inventory Management System
Message-ID: <6B714B3B-D684-4BBB-9747-D14A867CA9B7@asrc.cuny.edu>

Hello All,

I?m curious to know what people are using for inventory management in your respective facilities. I?m sure the responses will be quite diverse. I can image many people are either using an Excel sheet or maybe something built into their lab management software. We utilize Badger LMS here and it has inventory capabilities; however, it is a bit cumbersome. I was hoping someone has found something that integrates well with mobile devices, maybe app driven. As we have grown our facility, inventory management has become a more complex beast. Also, I?d be curious who manages your inventory. Do you have a dedicated person or is it a team effort? Is it staff driven or do your users participate in any way?

Happy new academic year to all!

Best regards,
Jacob

--
Jacob Trevino, PhD
NanoFabrication Facility Director |Research Associate Professor
CUNY Advanced Science Research Center
85 St. Nicholas Terrace, New York, NY 10031
212-413-3310 | jacob.trevino at asrc.cuny.edu
http://www.trevinolab.com/| http://nanofab.asrc.cuny.edu/
NanoFab Blogsite: https://www.nanonotes.org/
Twitter: @JTrevinoNano | @ASRCNanoFab


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From bgila at ufl.edu  Thu Aug 24 08:48:59 2017
From: bgila at ufl.edu (Brent Gila)
Date: Thu, 24 Aug 2017 08:48:59 -0400
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <SYXPR01MB21570B160E1F398D2CC038FAC0850@SYXPR01MB2157.ausprd01.prod.outlook.com>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
 <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
 <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
 <SYXPR01MB21572BC3C7740530EDFBC7D2C0840@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <6C521A5E02323C4CB73135692FB72A8548FB46F4@SRV362.tudelft.net>
 <SYXPR01MB21570B160E1F398D2CC038FAC0850@SYXPR01MB2157.ausprd01.prod.outlook.com>
Message-ID: <662aeb89-503c-3ada-e522-0973d2996dc4@ufl.edu>

Hi Marc,

We use 10nm of Cr on PMMA with no issues at all.? The Cr is deposited by 
e-beam deposition at a rate of 1A/s.? Then we use the Cr etchant for 
making standard photomasks to strip the Cr before the standard PMMA 
development.? Exposures from 10kV to 30kV show no issues or biasing from 
the additional Cr process steps.

Best Regards,
Brent

On 8/23/2017 7:14 PM, Fouad Karouta wrote:
> Dear Marc,
>
> Evaporating Au on PMMA or ZEP should be done in a thermal evaporator, an e-beam evaporator due to the electron beam would affect the resist. We also avoid sputtering for this application as the effect of Ar plasma (violet colour) can be unpredictable.
>
> Regards, Fouad
>
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Marc Zuiddam - TNW
> Sent: Wednesday, 23 August 2017 10:29 PM
> To: 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>
> Dear people,
>
> I always have the idea that sputting/evaporating a thin Au layer on my sample is exposing the e-beam resist on my sample.. Do you also experience that?
>
>   Regards, Marc Zuiddam
>
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
> Sent: woensdag 23 augustus 2017 1:42
> To: Jugessur, Aju S; labnetwork at mtl.mit.edu
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>
> Hi Aju,
>
> Am echoing other voices:
> - We use 12 nm of Au mostly on top of PMMA/ZEP to do the EBL which we remove in a Ki/I2 solution.
> - Sometime we use Cr under resist layer as well when we need Cr for further processing.
>
> Regards, Fouad Karouta
>
> *************************************
> Manager ANFF ACT Node
> Australian National Fabrication Facility Research School of Physics and Engineering L. Huxley Building (#56), Mills Road, Room 4.02 Australian National University ACT 0200, Canberra, Australia
> Tel: + 61 2 6125 7174
> Mob: + 61 451 046 412
> Email: fouad.karouta at anu.edu.au
> http://anff-act.anu.edu.au/
>
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Lino Eugene
> Sent: Tuesday, 22 August 2017 11:49 PM
> To: labnetwork at mtl.mit.edu
> Cc: Steven Wei <c27wei at edu.uwaterloo.ca>
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>
> Hi Aju,
>
> We have a coop student who has worked on different anti-charging materials: PEDOT:PSS, Electra 92 and sputtered Al.
>
> We had also adhesion and uniformity issues with PEDOT:PSS from Sigma-Aldrich. The solution was filtered and Triton X-100 was added and but no noticeable improvement. I was told that surface treatment with SurPass 3000 improves adhesion but we haven't tried this yet. Moreover, PEDOT:PSS cross-links under certain conditions and then the layer cannot be removed with water.
>
> 10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is expected to be high because of surface electron scattering (electron mean free path in Al at room temperature is ~19nm) and oxidation. We use MF-319 at room temperature or 40 degC  to remove the layer.
>
> Electra 92 from AllResist is easy to work with as it can be removed with DI water after EBL and gives pretty good results on PMMA and on ZEP520A. Surface treatment on HSQ is needed, so far treatment with IPA gives good results. Also, the price is reasonable compared to ESpacer and AquaSave.
>
> Best,
>
> Lino Eugene, Ph.D., Jr. Eng.
> Micro/nanofabrication process engineer
> Quantum NanoFab
> University of Waterloo
> 200 University Avenue West
> Waterloo, ON, Canada
> N2L 3G1
>   
> Ph: +1 519-888-4567 #37788
> Cell: +1 226-929-1685
> Website: https://fab.qnc.uwaterloo.ca/
>
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck
> Sent: August 21, 2017 21:09
> To: Mark K Mondol <mondol at mit.edu>; labnetwork at mtl.mit.edu
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>
> Hi Aju,
>
> We have commonly used Al as a conductive layer on top of PMMA on glass (removal is typically done with minimal damage by using dilute AZ400K photoresist developer).  However, 5nm seems to be on the thin side.  Al can form native oxide that is up to 3-4nm thick.  Therefore, I would confirm the answer to Mark's question of whether or not the 5nm Al layer is conductive.  We typically sputter deposit films that are 10-20nm thick for our applications.
>
> Best Regards,
>
> Matt
>
> --
> Matthew T. Moneck, Ph.D.
> Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and Computer Engineering | Carnegie Mellon University
> 5000 Forbes Ave., Pittsburgh, PA 15213-3890
> T: 412.268.5430
> F: 412.268.3497
> www.ece.cmu.edu
> nanofab.ece.cmu.edu
>
>
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
> Sent: Monday, August 21, 2017 5:04 PM
> To: labnetwork at mtl.mit.edu
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>
> Aju:
>
> 1. Be 100% certain the layer is conductive and connected to ground in the tool.
>
> 2. Every time they write on glass, do the same exposure on Si, if the problem shows up on both Si and glass the issue is not the insulating substrate.
>
> 3. Al etch can damage PMMA; not always in a repeatable way. Does your process include etching the Al (I have found Transene CR-7 chrome etch to be compatible with PMMA and ZEP, so usually use Cr not Al as the conductive layer).
>
> Regards,
>
> Mark K MOndol
>
> --
> Mark K Mondol
> Assistant Director NanoStructures Laboratory And Facility Manager Scanning Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl mondol at mit.edu office - 617-253-9617 cell - 617-224-8756
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>




From bgila at ufl.edu  Thu Aug 24 09:32:49 2017
From: bgila at ufl.edu (Brent Gila)
Date: Thu, 24 Aug 2017 09:32:49 -0400
Subject: [labnetwork] Sputtering CuS and Y2O3
In-Reply-To: <SYXPR01MB2157AE972273C4FB648D6C59C09A0@SYXPR01MB2157.ausprd01.prod.outlook.com>
References: <SYXPR01MB2157AE972273C4FB648D6C59C09A0@SYXPR01MB2157.ausprd01.prod.outlook.com>
Message-ID: <017e3a15-36aa-a205-f595-6cab24124624@ufl.edu>

Hi Fouad,

We avoid S containing materials in our multi user tools, you will get 
contamination.? Sulfur has a high vapor pressure and if there is any 
heating on the sputter chimney or if you have a substrate heater, you 
will redeposit/redistribute S in the system and into films.? I have 
always used 1E-4 Torr as the "line in the sand" for an elements vapor 
pressure vs temperature.? Below this pressure, there is a very small 
amount of flux from the element source.? Above this pressure, the 
element can produce a high enough flux for MBE growth.? On a vapor 
pressure/temperature curve, S has a vapor pressure of 1E-4 Torr at the 
50C-60C range and I would imaging that the chimney and shutter will get 
hotter than that during a sputter run.

We have a Y2O3 target and we have no known issues with this material.? 
We do store our targets in a desiccator and Y2O3 is hygroscopic, so you 
will want to keep it in a dry ambient when not in the sputter tool.

Best Regards,
Brent

On 8/23/2017 9:48 PM, Fouad Karouta wrote:
>
> Hi all,
>
> I am looking for feedback about the use of CuS and/or Y2O3 targets in 
> a multi users facility.
>
> 1-Is there any risk that CuS may decompose during sputtering and 
> contaminate the system with sulphur?
>
> 2-The SDS I consulted for Y2O3 mentioned some hazards and I wonder if 
> there are experiences with this material in the network especially if 
> there are any health concerns.
>
> Thanks,
>
> Fouad Karouta
>
> *************************************
>
> Manager ANFF ACT Node
>
> Australian National Fabrication Facility
>
> Research School of Physics and Engineering
>
> L. Huxley Building (#56), Mills Road, Room 4.02
>
> Australian National University
>
> ACT 0200, Canberra, Australia
>
> Tel: + 61 2 6125 7174
>
> Mob: + 61 451 046 412
>
> Email: fouad.karouta at anu.edu.au <mailto:fouad.karouta at anu.edu.au>
>
> http://anff-act.anu.edu.au/
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From aju-jugessur at uiowa.edu  Thu Aug 24 12:17:16 2017
From: aju-jugessur at uiowa.edu (Jugessur, Aju S)
Date: Thu, 24 Aug 2017 16:17:16 +0000
Subject: [labnetwork] EBeam Lithography on glass substrates
In-Reply-To: <4225E2D5-8BA1-42BE-BA01-8D11BA129008@uiowa.edu>
References: <DM2PR0701MB1359CC5E58819E5BA32B33E8A3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
 <DM2PR0701MB135913B9F9C2F688FD833E9FA3830@DM2PR0701MB1359.namprd07.prod.outlook.com>
 <1503132552389.82768@kaust.edu.sa>
 <4225E2D5-8BA1-42BE-BA01-8D11BA129008@uiowa.edu>
Message-ID: <3C01A7AC-0F1D-4488-8AFB-6FB62F4D5438@uiowa.edu>

Hi all,

I would like to thank you all for responding on this issue. We have obtained several excellent suggestions that we are working on.

Thanks
Regards
Aju


On Aug 21, 2017, at 12:20 PM, Jugessur, Aju S <aju-jugessur at uiowa.edu<mailto:aju-jugessur at uiowa.edu>> wrote:


Hi,

I have a user who is having inconsistent results when exposing patterns (100-200 nm in size) on glass substrate.
He is using a 5 nm Al layer between the 100nm ZEP and glass substrate. He obtained good results but it does not seem reproducible all the times.
He is also ensuring that there is good contact between the sample clips and the metal layer. Another approach would be to place the metal on top of the resist.

He has also used the conducting polymer PDOT on ZEP but it does not seem to adhere too well. He could also be doing a step or steps consistently wrong and be unaware.

This is quite a common and established process but I would like to see if the members have any suggestions to ensure reproducible and consistent results for ebeam lithography on glass substrates.
I will provide more information/details once I receive some feedback.

Thanks,
Regards
Aju


Aju Jugessur, Ph.D.
Director, University of Iowa Microfabrication Facility (UIMF)
Optical Science and Technology Center
Professor Adjunct, Physics and Astronomy
University of Iowa
Office: IATL 202, Tel: 319-3532342
Labs: IATL 170, 172, 174
https://ostc.uiowa.edu/uimf







Aju Jugessur, Ph.D.
Director, University of Iowa Microfabrication Facility (UIMF)
Optical Science and Technology Center
Professor Adjunct, Physics and Astronomy
University of Iowa
Office: IATL 202, Tel: 319-3532342
Labs: IATL 170, 172, 174
https://ostc.uiowa.edu/uimf






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From lvchang at Central.UH.EDU  Thu Aug 24 13:16:10 2017
From: lvchang at Central.UH.EDU (Chang, Long)
Date: Thu, 24 Aug 2017 12:16:10 -0500
Subject: [labnetwork] Inventory Management System
In-Reply-To: <6B714B3B-D684-4BBB-9747-D14A867CA9B7@asrc.cuny.edu>
References: <6B714B3B-D684-4BBB-9747-D14A867CA9B7@asrc.cuny.edu>
Message-ID: <DEF4EA96-360A-48BE-AE8C-10DB1217A113@central.uh.edu>

Hi Jacob,

The majority of our chemical inventory is supplied by the user. We have a computer and label maker dedicated for chemical registration. Our custom software allows a user to register the chemical. Upon registration, a label is printed and the details is uploaded to a google spreadsheet. The label contains a storage code that new students use to match with a appropriate storage cabinet. Here's what our spreadsheet looks like now:
https://docs.google.com/spreadsheets/d/1cUVMhzxE6NiS3t1xE1GWebd9wTs2n9D1IoqtdzN6Osw/edit#gid=1440247124
This googlesheet is shared with every user to facilitate sharing of chemicals.

When we need room, we announce a purge. All active users need to visit the cleanroom to put a sticker on their chemicals within a month. Offsite users can send staff and email. Then staff removes all inactive chemicals and decide what to do with them.

Best,
Long
On Aug 24, 2017, at 7:44 AM, Jacob Trevino <Jacob.Trevino at asrc.cuny.edu<mailto:Jacob.Trevino at asrc.cuny.edu>> wrote:

Hello All,

I?m curious to know what people are using for inventory management in your respective facilities. I?m sure the responses will be quite diverse. I can image many people are either using an Excel sheet or maybe something built into their lab management software. We utilize Badger LMS here and it has inventory capabilities; however, it is a bit cumbersome. I was hoping someone has found something that integrates well with mobile devices, maybe app driven. As we have grown our facility, inventory management has become a more complex beast. Also, I?d be curious who manages your inventory. Do you have a dedicated person or is it a team effort? Is it staff driven or do your users participate in any way?

Happy new academic year to all!

Best regards,
Jacob

--
Jacob Trevino, PhD
NanoFabrication Facility Director |Research Associate Professor
CUNY Advanced Science Research Center
85 St. Nicholas Terrace, New York, NY 10031
212-413-3310 | jacob.trevino at asrc.cuny.edu<mailto:jacob.trevino at asrc.cuny.edu>
http://www.trevinolab.com/| http://nanofab.asrc.cuny.edu<http://nanofab.asrc.cuny.edu/>/
NanoFab Blogsite: https://www.nanonotes.org/
Twitter: @JTrevinoNano | @ASRCNanoFab


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From ryan at eng.ucsd.edu  Thu Aug 24 13:50:22 2017
From: ryan at eng.ucsd.edu (Ryan Anderson)
Date: Thu, 24 Aug 2017 10:50:22 -0700
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <SYXPR01MB21570B160E1F398D2CC038FAC0850@SYXPR01MB2157.ausprd01.prod.outlook.com>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
 <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
 <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
 <SYXPR01MB21572BC3C7740530EDFBC7D2C0840@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <6C521A5E02323C4CB73135692FB72A8548FB46F4@SRV362.tudelft.net>
 <SYXPR01MB21570B160E1F398D2CC038FAC0850@SYXPR01MB2157.ausprd01.prod.outlook.com>
Message-ID: <8c9fb7bce4e18cfd0cc2340edcff771a@mail.gmail.com>

Hi all,

We have also observed adverse effects on PMMA exposure (100kV) after
sputter coating gold.  Since then we have used thermal evaporation.

Ryan Anderson
UC San Diego, Nano3


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
Sent: Wednesday, August 23, 2017 4:15 PM
To: Marc Zuiddam - TNW <M.R.Zuiddam at tudelft.nl>; 'labnetwork at mtl.mit.edu'
<labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Dear Marc,

Evaporating Au on PMMA or ZEP should be done in a thermal evaporator, an
e-beam evaporator due to the electron beam would affect the resist. We
also avoid sputtering for this application as the effect of Ar plasma
(violet colour) can be unpredictable.

Regards, Fouad

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Marc Zuiddam - TNW
Sent: Wednesday, 23 August 2017 10:29 PM
To: 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Dear people,

I always have the idea that sputting/evaporating a thin Au layer on my
sample is exposing the e-beam resist on my sample.. Do you also experience
that?

 Regards, Marc Zuiddam

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
Sent: woensdag 23 augustus 2017 1:42
To: Jugessur, Aju S; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

Am echoing other voices:
- We use 12 nm of Au mostly on top of PMMA/ZEP to do the EBL which we
remove in a Ki/I2 solution.
- Sometime we use Cr under resist layer as well when we need Cr for
further processing.

Regards, Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility Research School of Physics and
Engineering L. Huxley Building (#56), Mills Road, Room 4.02 Australian
National University ACT 0200, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au
http://anff-act.anu.edu.au/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Lino Eugene
Sent: Tuesday, 22 August 2017 11:49 PM
To: labnetwork at mtl.mit.edu
Cc: Steven Wei <c27wei at edu.uwaterloo.ca>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have a coop student who has worked on different anti-charging
materials: PEDOT:PSS, Electra 92 and sputtered Al.

We had also adhesion and uniformity issues with PEDOT:PSS from
Sigma-Aldrich. The solution was filtered and Triton X-100 was added and
but no noticeable improvement. I was told that surface treatment with
SurPass 3000 improves adhesion but we haven't tried this yet. Moreover,
PEDOT:PSS cross-links under certain conditions and then the layer cannot
be removed with water.

10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is
expected to be high because of surface electron scattering (electron mean
free path in Al at room temperature is ~19nm) and oxidation. We use MF-319
at room temperature or 40 degC  to remove the layer.

Electra 92 from AllResist is easy to work with as it can be removed with
DI water after EBL and gives pretty good results on PMMA and on ZEP520A.
Surface treatment on HSQ is needed, so far treatment with IPA gives good
results. Also, the price is reasonable compared to ESpacer and AquaSave.

Best,

Lino Eugene, Ph.D., Jr. Eng.
Micro/nanofabrication process engineer
Quantum NanoFab
University of Waterloo
200 University Avenue West
Waterloo, ON, Canada
N2L 3G1

Ph: +1 519-888-4567 #37788
Cell: +1 226-929-1685
Website: https://fab.qnc.uwaterloo.ca/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck
Sent: August 21, 2017 21:09
To: Mark K Mondol <mondol at mit.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have commonly used Al as a conductive layer on top of PMMA on glass
(removal is typically done with minimal damage by using dilute AZ400K
photoresist developer).  However, 5nm seems to be on the thin side.  Al
can form native oxide that is up to 3-4nm thick.  Therefore, I would
confirm the answer to Mark's question of whether or not the 5nm Al layer
is conductive.  We typically sputter deposit films that are 10-20nm thick
for our applications.

Best Regards,

Matt

--
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and
Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu
nanofab.ece.cmu.edu


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
Sent: Monday, August 21, 2017 5:04 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Aju:

1. Be 100% certain the layer is conductive and connected to ground in the
tool.

2. Every time they write on glass, do the same exposure on Si, if the
problem shows up on both Si and glass the issue is not the insulating
substrate.

3. Al etch can damage PMMA; not always in a repeatable way. Does your
process include etching the Al (I have found Transene CR-7 chrome etch to
be compatible with PMMA and ZEP, so usually use Cr not Al as the
conductive layer).

Regards,

Mark K MOndol

--
Mark K Mondol
Assistant Director NanoStructures Laboratory And Facility Manager Scanning
Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl
mondol at mit.edu office - 617-253-9617 cell - 617-224-8756


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



From aju-jugessur at uiowa.edu  Thu Aug 24 14:48:37 2017
From: aju-jugessur at uiowa.edu (Jugessur, Aju S)
Date: Thu, 24 Aug 2017 18:48:37 +0000
Subject: [labnetwork] Inventory Management System
In-Reply-To: <6B714B3B-D684-4BBB-9747-D14A867CA9B7@asrc.cuny.edu>
References: <6B714B3B-D684-4BBB-9747-D14A867CA9B7@asrc.cuny.edu>
Message-ID: <A26ADA2D-02A4-4C42-A604-FF02B0A5F97E@uiowa.edu>

Jacob,

We are using bookitlab for almost 6 months now and it is working well. It has all sorts of capabilities and we are using the inventory management feature as well. There is an app for it too but users mainly use it to schedule tools and check tool status etc.
http://bookit-lab.com

Our staff manage the inventory on a weekly basis and since we are a medium size facility, it is not an issue for us right now.
Please let me know if you have other questions about bookitlab.

Thanks
Aju



On Aug 24, 2017, at 7:44 AM, Jacob Trevino <Jacob.Trevino at asrc.cuny.edu<mailto:Jacob.Trevino at asrc.cuny.edu>> wrote:

Hello All,

I?m curious to know what people are using for inventory management in your respective facilities. I?m sure the responses will be quite diverse. I can image many people are either using an Excel sheet or maybe something built into their lab management software. We utilize Badger LMS here and it has inventory capabilities; however, it is a bit cumbersome. I was hoping someone has found something that integrates well with mobile devices, maybe app driven. As we have grown our facility, inventory management has become a more complex beast. Also, I?d be curious who manages your inventory. Do you have a dedicated person or is it a team effort? Is it staff driven or do your users participate in any way?

Happy new academic year to all!

Best regards,
Jacob

--
Jacob Trevino, PhD
NanoFabrication Facility Director |Research Associate Professor
CUNY Advanced Science Research Center
85 St. Nicholas Terrace, New York, NY 10031
212-413-3310 | jacob.trevino at asrc.cuny.edu<mailto:jacob.trevino at asrc.cuny.edu>
http://www.trevinolab.com/| http://nanofab.asrc.cuny.edu<http://nanofab.asrc.cuny.edu/>/
NanoFab Blogsite: https://www.nanonotes.org/
Twitter: @JTrevinoNano | @ASRCNanoFab


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

Aju Jugessur, Ph.D.
Director, University of Iowa Microfabrication Facility (UIMF)
Optical Science and Technology Center
Professor Adjunct, Physics and Astronomy
University of Iowa
Office: IATL 202, Tel: 319-3532342
Labs: IATL 170, 172, 174
https://ostc.uiowa.edu/uimf






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From patricns at uw.edu  Thu Aug 24 15:41:39 2017
From: patricns at uw.edu (N . Shane Patrick)
Date: Thu, 24 Aug 2017 12:41:39 -0700
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <8c9fb7bce4e18cfd0cc2340edcff771a@mail.gmail.com>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
 <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
 <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
 <SYXPR01MB21572BC3C7740530EDFBC7D2C0840@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <6C521A5E02323C4CB73135692FB72A8548FB46F4@SRV362.tudelft.net>
 <SYXPR01MB21570B160E1F398D2CC038FAC0850@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <8c9fb7bce4e18cfd0cc2340edcff771a@mail.gmail.com>
Message-ID: <D0E99571-148D-4668-8BFF-6A3192A5150D@uw.edu>

We use sputtered Au/Pd exclusively here as a charge dissipation layer and have not seen any adverse effects. Our system for this is a very basic tabletop coater system that runs on 120V and takes maybe 2 minutes of sputtering to get a sufficient coating for our cases. Perhaps power/duration are important to consider.

N. Shane Patrick
Research Engineer, Washington Nanofabrication Facility (WNF) 
National Nanotechnology Coordinated Infrastructure (NNCI)
University of Washington
Fluke Hall 132, Box 352143
(206) 221-1045
patricns at uw.edu <mailto:patricns at uw.edu>
http://www.wnf.washington.edu/ <http://www.wnf.washington.edu/>
> On Aug 24, 2017, at 10:50 AM, Ryan Anderson <ryan at eng.ucsd.edu> wrote:
> 
> Hi all,
> 
> We have also observed adverse effects on PMMA exposure (100kV) after
> sputter coating gold.  Since then we have used thermal evaporation.
> 
> Ryan Anderson
> UC San Diego, Nano3
> 
> 
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu
> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
> Sent: Wednesday, August 23, 2017 4:15 PM
> To: Marc Zuiddam - TNW <M.R.Zuiddam at tudelft.nl>; 'labnetwork at mtl.mit.edu'
> <labnetwork at mtl.mit.edu>
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
> 
> Dear Marc,
> 
> Evaporating Au on PMMA or ZEP should be done in a thermal evaporator, an
> e-beam evaporator due to the electron beam would affect the resist. We
> also avoid sputtering for this application as the effect of Ar plasma
> (violet colour) can be unpredictable.
> 
> Regards, Fouad
> 
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu
> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Marc Zuiddam - TNW
> Sent: Wednesday, 23 August 2017 10:29 PM
> To: 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
> 
> Dear people,
> 
> I always have the idea that sputting/evaporating a thin Au layer on my
> sample is exposing the e-beam resist on my sample.. Do you also experience
> that?
> 
> Regards, Marc Zuiddam
> 
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu
> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
> Sent: woensdag 23 augustus 2017 1:42
> To: Jugessur, Aju S; labnetwork at mtl.mit.edu
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
> 
> Hi Aju,
> 
> Am echoing other voices:
> - We use 12 nm of Au mostly on top of PMMA/ZEP to do the EBL which we
> remove in a Ki/I2 solution.
> - Sometime we use Cr under resist layer as well when we need Cr for
> further processing.
> 
> Regards, Fouad Karouta
> 
> *************************************
> Manager ANFF ACT Node
> Australian National Fabrication Facility Research School of Physics and
> Engineering L. Huxley Building (#56), Mills Road, Room 4.02 Australian
> National University ACT 0200, Canberra, Australia
> Tel: + 61 2 6125 7174
> Mob: + 61 451 046 412
> Email: fouad.karouta at anu.edu.au
> http://anff-act.anu.edu.au/
> 
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu
> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Lino Eugene
> Sent: Tuesday, 22 August 2017 11:49 PM
> To: labnetwork at mtl.mit.edu
> Cc: Steven Wei <c27wei at edu.uwaterloo.ca>
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
> 
> Hi Aju,
> 
> We have a coop student who has worked on different anti-charging
> materials: PEDOT:PSS, Electra 92 and sputtered Al.
> 
> We had also adhesion and uniformity issues with PEDOT:PSS from
> Sigma-Aldrich. The solution was filtered and Triton X-100 was added and
> but no noticeable improvement. I was told that surface treatment with
> SurPass 3000 improves adhesion but we haven't tried this yet. Moreover,
> PEDOT:PSS cross-links under certain conditions and then the layer cannot
> be removed with water.
> 
> 10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is
> expected to be high because of surface electron scattering (electron mean
> free path in Al at room temperature is ~19nm) and oxidation. We use MF-319
> at room temperature or 40 degC  to remove the layer.
> 
> Electra 92 from AllResist is easy to work with as it can be removed with
> DI water after EBL and gives pretty good results on PMMA and on ZEP520A.
> Surface treatment on HSQ is needed, so far treatment with IPA gives good
> results. Also, the price is reasonable compared to ESpacer and AquaSave.
> 
> Best,
> 
> Lino Eugene, Ph.D., Jr. Eng.
> Micro/nanofabrication process engineer
> Quantum NanoFab
> University of Waterloo
> 200 University Avenue West
> Waterloo, ON, Canada
> N2L 3G1
> 
> Ph: +1 519-888-4567 #37788
> Cell: +1 226-929-1685
> Website: https://fab.qnc.uwaterloo.ca/
> 
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu
> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck
> Sent: August 21, 2017 21:09
> To: Mark K Mondol <mondol at mit.edu>; labnetwork at mtl.mit.edu
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
> 
> Hi Aju,
> 
> We have commonly used Al as a conductive layer on top of PMMA on glass
> (removal is typically done with minimal damage by using dilute AZ400K
> photoresist developer).  However, 5nm seems to be on the thin side.  Al
> can form native oxide that is up to 3-4nm thick.  Therefore, I would
> confirm the answer to Mark's question of whether or not the 5nm Al layer
> is conductive.  We typically sputter deposit films that are 10-20nm thick
> for our applications.
> 
> Best Regards,
> 
> Matt
> 
> --
> Matthew T. Moneck, Ph.D.
> Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and
> Computer Engineering | Carnegie Mellon University
> 5000 Forbes Ave., Pittsburgh, PA 15213-3890
> T: 412.268.5430
> F: 412.268.3497
> www.ece.cmu.edu
> nanofab.ece.cmu.edu
> 
> 
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu
> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
> Sent: Monday, August 21, 2017 5:04 PM
> To: labnetwork at mtl.mit.edu
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
> 
> Aju:
> 
> 1. Be 100% certain the layer is conductive and connected to ground in the
> tool.
> 
> 2. Every time they write on glass, do the same exposure on Si, if the
> problem shows up on both Si and glass the issue is not the insulating
> substrate.
> 
> 3. Al etch can damage PMMA; not always in a repeatable way. Does your
> process include etching the Al (I have found Transene CR-7 chrome etch to
> be compatible with PMMA and ZEP, so usually use Cr not Al as the
> conductive layer).
> 
> Regards,
> 
> Mark K MOndol
> 
> --
> Mark K Mondol
> Assistant Director NanoStructures Laboratory And Facility Manager Scanning
> Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl
> mondol at mit.edu office - 617-253-9617 cell - 617-224-8756
> 
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From michael.rooks at yale.edu  Thu Aug 24 16:04:17 2017
From: michael.rooks at yale.edu (Michael Rooks)
Date: Thu, 24 Aug 2017 16:04:17 -0400
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <8c9fb7bce4e18cfd0cc2340edcff771a@mail.gmail.com>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
 <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
 <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
 <SYXPR01MB21572BC3C7740530EDFBC7D2C0840@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <6C521A5E02323C4CB73135692FB72A8548FB46F4@SRV362.tudelft.net>
 <SYXPR01MB21570B160E1F398D2CC038FAC0850@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <8c9fb7bce4e18cfd0cc2340edcff771a@mail.gmail.com>
Message-ID: <599F3141.3040506@yale.edu>

We have use sputtered gold routinely, on PMMA, for many years, and have 
observed no adverse effects.
We use a small Cressington coater, using argon. There is no deep-UV 
emission from an argon plasma, and neither PMMA nor ZEP are sensitive to 
visible light.

I'm sorry for chiming in a second time, but I wouldn't want to see a red 
herring become common wisdom.

(Of course, evaporation from a boat works great also, but it takes longer.)

--------------------------------
Michael Rooks
Yale Institute of Nanoscience and Quantum Engineering
nano.yale.edu <http://nano.yale.edu>



On 08/24/2017 01:50 PM, Ryan Anderson wrote:
> Hi all,
>
> We have also observed adverse effects on PMMA exposure (100kV) after
> sputter coating gold.  Since then we have used thermal evaporation.
>
> Ryan Anderson
> UC San Diego, Nano3
>
>
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu
> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
> Sent: Wednesday, August 23, 2017 4:15 PM
> To: Marc Zuiddam - TNW <M.R.Zuiddam at tudelft.nl>; 'labnetwork at mtl.mit.edu'
> <labnetwork at mtl.mit.edu>
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>
> Dear Marc,
>
> Evaporating Au on PMMA or ZEP should be done in a thermal evaporator, an
> e-beam evaporator due to the electron beam would affect the resist. We
> also avoid sputtering for this application as the effect of Ar plasma
> (violet colour) can be unpredictable.
>
> Regards, Fouad
>
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu
> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Marc Zuiddam - TNW
> Sent: Wednesday, 23 August 2017 10:29 PM
> To: 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>
> Dear people,
>
> I always have the idea that sputting/evaporating a thin Au layer on my
> sample is exposing the e-beam resist on my sample.. Do you also experience
> that?
>
>   Regards, Marc Zuiddam
>
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu
> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
> Sent: woensdag 23 augustus 2017 1:42
> To: Jugessur, Aju S; labnetwork at mtl.mit.edu
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>
> Hi Aju,
>
> Am echoing other voices:
> - We use 12 nm of Au mostly on top of PMMA/ZEP to do the EBL which we
> remove in a Ki/I2 solution.
> - Sometime we use Cr under resist layer as well when we need Cr for
> further processing.
>
> Regards, Fouad Karouta
>
> *************************************
> Manager ANFF ACT Node
> Australian National Fabrication Facility Research School of Physics and
> Engineering L. Huxley Building (#56), Mills Road, Room 4.02 Australian
> National University ACT 0200, Canberra, Australia
> Tel: + 61 2 6125 7174
> Mob: + 61 451 046 412
> Email: fouad.karouta at anu.edu.au
> http://anff-act.anu.edu.au/
>
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu
> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Lino Eugene
> Sent: Tuesday, 22 August 2017 11:49 PM
> To: labnetwork at mtl.mit.edu
> Cc: Steven Wei <c27wei at edu.uwaterloo.ca>
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>
> Hi Aju,
>
> We have a coop student who has worked on different anti-charging
> materials: PEDOT:PSS, Electra 92 and sputtered Al.
>
> We had also adhesion and uniformity issues with PEDOT:PSS from
> Sigma-Aldrich. The solution was filtered and Triton X-100 was added and
> but no noticeable improvement. I was told that surface treatment with
> SurPass 3000 improves adhesion but we haven't tried this yet. Moreover,
> PEDOT:PSS cross-links under certain conditions and then the layer cannot
> be removed with water.
>
> 10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is
> expected to be high because of surface electron scattering (electron mean
> free path in Al at room temperature is ~19nm) and oxidation. We use MF-319
> at room temperature or 40 degC  to remove the layer.
>
> Electra 92 from AllResist is easy to work with as it can be removed with
> DI water after EBL and gives pretty good results on PMMA and on ZEP520A.
> Surface treatment on HSQ is needed, so far treatment with IPA gives good
> results. Also, the price is reasonable compared to ESpacer and AquaSave.
>
> Best,
>
> Lino Eugene, Ph.D., Jr. Eng.
> Micro/nanofabrication process engineer
> Quantum NanoFab
> University of Waterloo
> 200 University Avenue West
> Waterloo, ON, Canada
> N2L 3G1
>
> Ph: +1 519-888-4567 #37788
> Cell: +1 226-929-1685
> Website: https://fab.qnc.uwaterloo.ca/
>
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu
> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck
> Sent: August 21, 2017 21:09
> To: Mark K Mondol <mondol at mit.edu>; labnetwork at mtl.mit.edu
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>
> Hi Aju,
>
> We have commonly used Al as a conductive layer on top of PMMA on glass
> (removal is typically done with minimal damage by using dilute AZ400K
> photoresist developer).  However, 5nm seems to be on the thin side.  Al
> can form native oxide that is up to 3-4nm thick.  Therefore, I would
> confirm the answer to Mark's question of whether or not the 5nm Al layer
> is conductive.  We typically sputter deposit films that are 10-20nm thick
> for our applications.
>
> Best Regards,
>
> Matt
>
> --
> Matthew T. Moneck, Ph.D.
> Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and
> Computer Engineering | Carnegie Mellon University
> 5000 Forbes Ave., Pittsburgh, PA 15213-3890
> T: 412.268.5430
> F: 412.268.3497
> www.ece.cmu.edu
> nanofab.ece.cmu.edu
>
>
> -----Original Message-----
> From: labnetwork-bounces at mtl.mit.edu
> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
> Sent: Monday, August 21, 2017 5:04 PM
> To: labnetwork at mtl.mit.edu
> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>
> Aju:
>
> 1. Be 100% certain the layer is conductive and connected to ground in the
> tool.
>
> 2. Every time they write on glass, do the same exposure on Si, if the
> problem shows up on both Si and glass the issue is not the insulating
> substrate.
>
> 3. Al etch can damage PMMA; not always in a repeatable way. Does your
> process include etching the Al (I have found Transene CR-7 chrome etch to
> be compatible with PMMA and ZEP, so usually use Cr not Al as the
> conductive layer).
>
> Regards,
>
> Mark K MOndol
>
> --
> Mark K Mondol
> Assistant Director NanoStructures Laboratory And Facility Manager Scanning
> Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl
> mondol at mit.edu office - 617-253-9617 cell - 617-224-8756
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From nclay at upenn.edu  Thu Aug 24 21:29:39 2017
From: nclay at upenn.edu (Noah Clay)
Date: Thu, 24 Aug 2017 21:29:39 -0400
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <D0E99571-148D-4668-8BFF-6A3192A5150D@uw.edu>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
 <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
 <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
 <SYXPR01MB21572BC3C7740530EDFBC7D2C0840@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <6C521A5E02323C4CB73135692FB72A8548FB46F4@SRV362.tudelft.net>
 <SYXPR01MB21570B160E1F398D2CC038FAC0850@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <8c9fb7bce4e18cfd0cc2340edcff771a@mail.gmail.com>
 <D0E99571-148D-4668-8BFF-6A3192A5150D@uw.edu>
Message-ID: <15343E46-7A29-4D8B-AE71-443F450E6D20@upenn.edu>

Maybe this was mentioned earlier, but PMMA is strongly absorbing below 220 - 225 nm.

http://www.allresist.com/photorestist-other-resists-uv-patterning-of-pmma-resist/

Sent from my iPhone

> On Aug 24, 2017, at 15:41, N . Shane Patrick <patricns at uw.edu> wrote:
> 
> We use sputtered Au/Pd exclusively here as a charge dissipation layer and have not seen any adverse effects. Our system for this is a very basic tabletop coater system that runs on 120V and takes maybe 2 minutes of sputtering to get a sufficient coating for our cases. Perhaps power/duration are important to consider.
> 
> N. Shane Patrick
> Research Engineer, Washington Nanofabrication Facility (WNF) 
> National Nanotechnology Coordinated Infrastructure (NNCI)
> University of Washington
> Fluke Hall 132, Box 352143
> (206) 221-1045
> patricns at uw.edu
> http://www.wnf.washington.edu/
> 
>> On Aug 24, 2017, at 10:50 AM, Ryan Anderson <ryan at eng.ucsd.edu> wrote:
>> 
>> Hi all,
>> 
>> We have also observed adverse effects on PMMA exposure (100kV) after
>> sputter coating gold.  Since then we have used thermal evaporation.
>> 
>> Ryan Anderson
>> UC San Diego, Nano3
>> 
>> 
>> -----Original Message-----
>> From: labnetwork-bounces at mtl.mit.edu
>> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
>> Sent: Wednesday, August 23, 2017 4:15 PM
>> To: Marc Zuiddam - TNW <M.R.Zuiddam at tudelft.nl>; 'labnetwork at mtl.mit.edu'
>> <labnetwork at mtl.mit.edu>
>> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>> 
>> Dear Marc,
>> 
>> Evaporating Au on PMMA or ZEP should be done in a thermal evaporator, an
>> e-beam evaporator due to the electron beam would affect the resist. We
>> also avoid sputtering for this application as the effect of Ar plasma
>> (violet colour) can be unpredictable.
>> 
>> Regards, Fouad
>> 
>> -----Original Message-----
>> From: labnetwork-bounces at mtl.mit.edu
>> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Marc Zuiddam - TNW
>> Sent: Wednesday, 23 August 2017 10:29 PM
>> To: 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
>> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>> 
>> Dear people,
>> 
>> I always have the idea that sputting/evaporating a thin Au layer on my
>> sample is exposing the e-beam resist on my sample.. Do you also experience
>> that?
>> 
>> Regards, Marc Zuiddam
>> 
>> -----Original Message-----
>> From: labnetwork-bounces at mtl.mit.edu
>> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
>> Sent: woensdag 23 augustus 2017 1:42
>> To: Jugessur, Aju S; labnetwork at mtl.mit.edu
>> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>> 
>> Hi Aju,
>> 
>> Am echoing other voices:
>> - We use 12 nm of Au mostly on top of PMMA/ZEP to do the EBL which we
>> remove in a Ki/I2 solution.
>> - Sometime we use Cr under resist layer as well when we need Cr for
>> further processing.
>> 
>> Regards, Fouad Karouta
>> 
>> *************************************
>> Manager ANFF ACT Node
>> Australian National Fabrication Facility Research School of Physics and
>> Engineering L. Huxley Building (#56), Mills Road, Room 4.02 Australian
>> National University ACT 0200, Canberra, Australia
>> Tel: + 61 2 6125 7174
>> Mob: + 61 451 046 412
>> Email: fouad.karouta at anu.edu.au
>> http://anff-act.anu.edu.au/
>> 
>> -----Original Message-----
>> From: labnetwork-bounces at mtl.mit.edu
>> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Lino Eugene
>> Sent: Tuesday, 22 August 2017 11:49 PM
>> To: labnetwork at mtl.mit.edu
>> Cc: Steven Wei <c27wei at edu.uwaterloo.ca>
>> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>> 
>> Hi Aju,
>> 
>> We have a coop student who has worked on different anti-charging
>> materials: PEDOT:PSS, Electra 92 and sputtered Al.
>> 
>> We had also adhesion and uniformity issues with PEDOT:PSS from
>> Sigma-Aldrich. The solution was filtered and Triton X-100 was added and
>> but no noticeable improvement. I was told that surface treatment with
>> SurPass 3000 improves adhesion but we haven't tried this yet. Moreover,
>> PEDOT:PSS cross-links under certain conditions and then the layer cannot
>> be removed with water.
>> 
>> 10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is
>> expected to be high because of surface electron scattering (electron mean
>> free path in Al at room temperature is ~19nm) and oxidation. We use MF-319
>> at room temperature or 40 degC  to remove the layer.
>> 
>> Electra 92 from AllResist is easy to work with as it can be removed with
>> DI water after EBL and gives pretty good results on PMMA and on ZEP520A.
>> Surface treatment on HSQ is needed, so far treatment with IPA gives good
>> results. Also, the price is reasonable compared to ESpacer and AquaSave.
>> 
>> Best,
>> 
>> Lino Eugene, Ph.D., Jr. Eng.
>> Micro/nanofabrication process engineer
>> Quantum NanoFab
>> University of Waterloo
>> 200 University Avenue West
>> Waterloo, ON, Canada
>> N2L 3G1
>> 
>> Ph: +1 519-888-4567 #37788
>> Cell: +1 226-929-1685
>> Website: https://fab.qnc.uwaterloo.ca/
>> 
>> -----Original Message-----
>> From: labnetwork-bounces at mtl.mit.edu
>> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck
>> Sent: August 21, 2017 21:09
>> To: Mark K Mondol <mondol at mit.edu>; labnetwork at mtl.mit.edu
>> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>> 
>> Hi Aju,
>> 
>> We have commonly used Al as a conductive layer on top of PMMA on glass
>> (removal is typically done with minimal damage by using dilute AZ400K
>> photoresist developer).  However, 5nm seems to be on the thin side.  Al
>> can form native oxide that is up to 3-4nm thick.  Therefore, I would
>> confirm the answer to Mark's question of whether or not the 5nm Al layer
>> is conductive.  We typically sputter deposit films that are 10-20nm thick
>> for our applications.
>> 
>> Best Regards,
>> 
>> Matt
>> 
>> --
>> Matthew T. Moneck, Ph.D.
>> Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and
>> Computer Engineering | Carnegie Mellon University
>> 5000 Forbes Ave., Pittsburgh, PA 15213-3890
>> T: 412.268.5430
>> F: 412.268.3497
>> www.ece.cmu.edu
>> nanofab.ece.cmu.edu
>> 
>> 
>> -----Original Message-----
>> From: labnetwork-bounces at mtl.mit.edu
>> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
>> Sent: Monday, August 21, 2017 5:04 PM
>> To: labnetwork at mtl.mit.edu
>> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>> 
>> Aju:
>> 
>> 1. Be 100% certain the layer is conductive and connected to ground in the
>> tool.
>> 
>> 2. Every time they write on glass, do the same exposure on Si, if the
>> problem shows up on both Si and glass the issue is not the insulating
>> substrate.
>> 
>> 3. Al etch can damage PMMA; not always in a repeatable way. Does your
>> process include etching the Al (I have found Transene CR-7 chrome etch to
>> be compatible with PMMA and ZEP, so usually use Cr not Al as the
>> conductive layer).
>> 
>> Regards,
>> 
>> Mark K MOndol
>> 
>> --
>> Mark K Mondol
>> Assistant Director NanoStructures Laboratory And Facility Manager Scanning
>> Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl
>> mondol at mit.edu office - 617-253-9617 cell - 617-224-8756
>> 
>> 
>> _______________________________________________
>> labnetwork mailing list
>> labnetwork at mtl.mit.edu
>> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>> 
>> _______________________________________________
>> labnetwork mailing list
>> labnetwork at mtl.mit.edu
>> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>> 
>> _______________________________________________
>> labnetwork mailing list
>> labnetwork at mtl.mit.edu
>> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>> 
>> _______________________________________________
>> labnetwork mailing list
>> labnetwork at mtl.mit.edu
>> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>> 
>> _______________________________________________
>> labnetwork mailing list
>> labnetwork at mtl.mit.edu
>> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>> 
>> _______________________________________________
>> labnetwork mailing list
>> labnetwork at mtl.mit.edu
>> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>> 
>> _______________________________________________
>> labnetwork mailing list
>> labnetwork at mtl.mit.edu
>> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From chenyl at mail.sustc.edu.cn  Fri Aug 25 09:07:27 2017
From: chenyl at mail.sustc.edu.cn (Chen Yulong (Frank))
Date: Fri, 25 Aug 2017 21:07:27 +0800
Subject: [labnetwork] Dry etch test pattern for investigation of micro
	loading effect
Message-ID: <201708252107273497084@mail.sustc.edu.cn>

Hi

I am current using an ICP RIE etch tool to fabricate silicon mold for microfluidic. Since the dry etch process have the micro loading effect, I would like to use some test pattern to find the appropriate process.

Does anyone that has some recommend test pattern to investigate the micro loading effect?

Regards,



???(CHEN Yulong) PhD Student
Department of Materials Science and Engineering
SUSTech  http://www.sustc.edu.cn/en/
Tel: +86-18589050065
 
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From fouad.karouta at anu.edu.au  Sun Aug 27 19:27:02 2017
From: fouad.karouta at anu.edu.au (Fouad Karouta)
Date: Sun, 27 Aug 2017 23:27:02 +0000
Subject: [labnetwork] Dry etch test pattern for investigation of
	micro	loading effect
In-Reply-To: <201708252107273497084@mail.sustc.edu.cn>
References: <201708252107273497084@mail.sustc.edu.cn>
Message-ID: <SYXPR01MB21573E9612A39037FD40A676C0990@SYXPR01MB2157.ausprd01.prod.outlook.com>

Hi Frank,

I am not sure what you mean by loading effect. To me, loading effect means: etch rate depends on sample size, sample size small etch rate higher as compared  to same patterns with larger sample. Maybe it is better to explain more in details what you?re after.
Maybe you are mixing up with what is called leg effect which means higher etch rate with larger pattern as compared to smaller patterns.
Regards, Fouad

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Chen Yulong (Frank)
Sent: Friday, 25 August 2017 11:07 PM
To: labnetwork <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Dry etch test pattern for investigation of micro loading effect

Hi

I am current using an ICP RIE etch tool to fabricate silicon mold for microfluidic. Since the dry etch process have the micro loading effect, I would like to use some test pattern to find the appropriate process.

Does anyone that has some recommend test pattern to investigate the micro loading effect?

Regards,

________________________________
[https://exmail.qq.com/cgi-bin/viewfile?type=logo&domain=sustc.edu.cn]
???(CHEN Yulong) PhD Student

Department of Materials Science and Engineering
SUSTech  http://www.sustc.edu.cn/en/
Tel: +86-18589050065

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From jungyeom at gmail.com  Sun Aug 27 20:49:39 2017
From: jungyeom at gmail.com (Junghoon Yeom)
Date: Sun, 27 Aug 2017 20:49:39 -0400
Subject: [labnetwork] Dry etch test pattern for investigation of micro
 loading effect
In-Reply-To: <SYXPR01MB21573E9612A39037FD40A676C0990@SYXPR01MB2157.ausprd01.prod.outlook.com>
References: <201708252107273497084@mail.sustc.edu.cn>
 <SYXPR01MB21573E9612A39037FD40A676C0990@SYXPR01MB2157.ausprd01.prod.outlook.com>
Message-ID: <CACt_nk=VmnWS2QvHf3DXHgrjMy++YeYiFzWySiiqe0Bj2r0Z8g@mail.gmail.com>

Frank,

There have been a lot of literature and studies on microloading effect and
aspect ratio dependent etching (ARDE) in RIE and DRIE technology. See the
following two papers which discuss the mask design to study microloading
and ARDE effects.

Critical aspect ratio dependence in deep reactive ion etching of silicon
http://ieeexplore.ieee.org/abstract/document/1217094/

Maximum achievable aspect ratio in deep reactive ion etching of silicon due
to aspect ratio dependent transport and the microloading effect
http://avs.scitation.org/doi/abs/10.1116/1.2101678

Hope this helps.

Junghoon Yeom


On Sun, Aug 27, 2017 at 7:27 PM, Fouad Karouta <fouad.karouta at anu.edu.au>
wrote:

> Hi Frank,
>
>
>
> I am not sure what you mean by loading effect. To me, loading effect
> means: etch rate depends on sample size, sample size small etch rate higher
> as compared  to same patterns with larger sample. Maybe it is better to
> explain more in details what you?re after.
>
> Maybe you are mixing up with what is called leg effect which means higher
> etch rate with larger pattern as compared to smaller patterns.
>
> Regards, Fouad
>
>
>
> *From:* labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces@
> mtl.mit.edu] *On Behalf Of *Chen Yulong (Frank)
> *Sent:* Friday, 25 August 2017 11:07 PM
> *To:* labnetwork <labnetwork at mtl.mit.edu>
> *Subject:* [labnetwork] Dry etch test pattern for investigation of micro
> loading effect
>
>
>
> Hi
>
>
>
> I am current using an ICP RIE etch tool to fabricate silicon mold for
> microfluidic. Since the dry etch process have the micro loading effect, I
> would like to use some test pattern to find the appropriate process.
>
>
>
> Does anyone that has some recommend test pattern to investigate the micro
> loading effect?
>
>
>
> Regards,
>
>
> ------------------------------
> ???(CHEN Yulong) PhD Student
>
> Department of Materials Science and Engineering
> SUSTech  http://www.sustc.edu.cn/en/
> Tel: +86-18589050065 <+86%20185%208905%200065>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
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From mariusz.martyniuk at uwa.edu.au  Tue Aug 29 00:37:54 2017
From: mariusz.martyniuk at uwa.edu.au (Mariusz Martyniuk)
Date: Tue, 29 Aug 2017 04:37:54 +0000
Subject: [labnetwork] Manual wanted
Message-ID: <MEXPR01MB04692FE8AC3432EBE040E756D69F0@MEXPR01MB0469.ausprd01.prod.outlook.com>

Dear All,

I am seeking help to obtain a copy of the ball bearing replacement manual for Alcatel Adixen ATP 400 HPC Turbomoluecular Pump. I am happy to buy or borrow if anyone is able to help.

This manual comes with the bearing replacement tool kit (PN 101930 below), which is not essential for us but the manual is.

[cid:image001.png at 01D320BC.26AD52F0]



Cheers,
Mariusz

Mariusz Martyniuk
-----------------------------
Associate Professor, ANFF-WA Managing Director
Microelectronics Research Group
School of Electrical, Electronic & Computer Engineering, Rm 4.17, M018
The University of Western Australia
35 Stirling Highway, Crawley WA 6009, Australia<%20%20>
Tel: +61 8 6488 1905<tel:+61%208%206488%201905>, Fax: +61 8 6488 1095<tel:+61%208%206488%201095>
Secretary Tel: +61 8 6488 3801<tel:+61%208%206488%203801>, Rm 1.73, http://www.mrg.uwa.edu.au/
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From mathilde.i.barriet at ntnu.no  Tue Aug 29 09:17:06 2017
From: mathilde.i.barriet at ntnu.no (Mathilde Isabelle Barriet)
Date: Tue, 29 Aug 2017 13:17:06 +0000
Subject: [labnetwork] Table top RTP oven
Message-ID: <9e03d5264c8c43c3ad4b176bfd3a2219@it-ex11.win.ntnu.no>

Hi

We are looking into purchasing a table top style RTP oven for our cleanroom and I wanted to check if any of you have any brand recommendations for such a system.
Any input will be welcome.

Thanks in advance.
Kind regards,
Mathilde

Senior Engineer
NTNU NanoLab
----------------------------
Sem S?lands vei 14, K1-113
NO-7491 Trondheim
+47 91 89 72 08
www.ntnu.no/nanolab





From spaolini at cns.fas.harvard.edu  Tue Aug 29 17:26:59 2017
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Tue, 29 Aug 2017 21:26:59 +0000
Subject: [labnetwork] Table top RTP oven
In-Reply-To: <9e03d5264c8c43c3ad4b176bfd3a2219@it-ex11.win.ntnu.no>
References: <9e03d5264c8c43c3ad4b176bfd3a2219@it-ex11.win.ntnu.no>
Message-ID: <BLUPR0701MB1009A5AE717821A1247BF1C4DF9F0@BLUPR0701MB1009.namprd07.prod.outlook.com>

Mathilde,
   Table top rapid thermal processers are very effective for a variety of tasks. Most are powerful enough to have a ramp rate of 35 deg C./sec or even faster. The major drawback is uniformity since the gradient across the quartz lamps is generally not tunable unlike some of the larger AG units. You will need to define what type of processing you will be doing in order to make the right selection. Most units are fitted or can be fitted with an optical pyrometer which gives the most accurate temperature control over 500 deg. C. For processing under that temperature, a thermocouple is what controls the temp. We have two tabletop systems here at Hahvid, one is a Jipelec Jetfirst and the other is an MPTC. We have had good luck with both but the MPTC is easier to get parts for since Jipelec is based in France. The other difference is that the Jipelec has a vacuum chamber that can be used if you desire and the chamber is fixed with a hinged lid. I prefer the graphical software of the Jipelec unit over the other system. The MPTC has a drawer that slides out to reveal a quartz "lolipop" that can accept graphite or silicon carbide susceptors to protect a sample from excessive radiant heat. Both systems have inlets for 3 process gases. Keep in mind that you need to feed these systems with 100A three phase power.
  Hope this helps,
    Steve

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu
www.cns.fas.harvard.edu


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mathilde Isabelle Barriet
Sent: Tuesday, August 29, 2017 9:17 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Table top RTP oven

Hi

We are looking into purchasing a table top style RTP oven for our cleanroom and I wanted to check if any of you have any brand recommendations for such a system.
Any input will be welcome.

Thanks in advance.
Kind regards,
Mathilde

Senior Engineer
NTNU NanoLab
----------------------------
Sem S?lands vei 14, K1-113
NO-7491 Trondheim
+47 91 89 72 08
www.ntnu.no/nanolab



_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



From lej at danchip.dtu.dk  Wed Aug 30 03:06:55 2017
From: lej at danchip.dtu.dk (Leif Johansen)
Date: Wed, 30 Aug 2017 07:06:55 +0000
Subject: [labnetwork] Table top RTP oven
In-Reply-To: <9e03d5264c8c43c3ad4b176bfd3a2219@it-ex11.win.ntnu.no>
References: <9e03d5264c8c43c3ad4b176bfd3a2219@it-ex11.win.ntnu.no>
Message-ID: <879AEF5002D70747B136D02BC86A9C980C6E4C8B@ait-pex02mbx05.win.dtu.dk>

Hello Mathilde, 

I know that several labs use AG Associates Heatpulse (http://www.ag-rtp.com/). I do believe that MC2 in Gotenburg, Sweden has two. Try asking them about their experiences. We had such a system in our lab more than 15 years ago. It draws a lot of current but is a good little R&D tool.

Jipelec also manufactures table-top RTPs (http://semco-tech.com/jetfirst). We have an older version that is cooled by CDA, so it makes quite a bit of noise. However, nowadays I think they are water cooled. 

ATV Technologie GmbH (https://www.atv-tech.com/) manufactures table-top vacuum solder reflow ovens. I have worked with those systems. Nice for R&D and small-scale production. 

Best regards, 

Leif

Leif S. Johansen 
Head of Operations
DTU Danchip 
? 
Technical University of Denmark
Danchip 
?rsteds Plads, Byg. 347 
2800? Lyngby 
Direct +45 45255713 
Mobile +45 25348992
lesjo at danchip.dtu.dk 
www.danchip.dtu.dk/ 







-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mathilde Isabelle Barriet
Sent: 29. august 2017 15:17
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Table top RTP oven

Hi

We are looking into purchasing a table top style RTP oven for our cleanroom and I wanted to check if any of you have any brand recommendations for such a system.
Any input will be welcome.

Thanks in advance.
Kind regards,
Mathilde

Senior Engineer
NTNU NanoLab
----------------------------
Sem S?lands vei 14, K1-113
NO-7491 Trondheim
+47 91 89 72 08
www.ntnu.no/nanolab



_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork



From paj1 at email.gwu.edu  Wed Aug 30 08:17:12 2017
From: paj1 at email.gwu.edu (Johnson, Patrick)
Date: Wed, 30 Aug 2017 08:17:12 -0400
Subject: [labnetwork] PCW Process Chilled Water Service support
Message-ID: <CAGopbFJg6c-dg5-Y6JXOQ0X+b3=V+hCHFVQP48FrXPtmvoLtZA@mail.gmail.com>

Good Morning,  We are in the start up phase and bringing up the clean room
tools and have encountered maintenance support issues with the PCW skid.
Im curious to know how the other Nanofabs are handling the service of the
PCW systems.    Thanks Patrick




*Patrick Johnson*
*George Washington University*
*Nano Fabrication Lab Manager *
*Science and Engineering Hall*
*800 NW 22nd Street Rm-B2815*
*Washington D.C. 20052*
*Cell 703 258 2465*
*Desk 202 994 2346*
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From spaolini at cns.fas.harvard.edu  Wed Aug 30 12:11:55 2017
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Wed, 30 Aug 2017 16:11:55 +0000
Subject: [labnetwork] PCW Process Chilled Water Service support
In-Reply-To: <CAGopbFJg6c-dg5-Y6JXOQ0X+b3=V+hCHFVQP48FrXPtmvoLtZA@mail.gmail.com>
References: <CAGopbFJg6c-dg5-Y6JXOQ0X+b3=V+hCHFVQP48FrXPtmvoLtZA@mail.gmail.com>
Message-ID: <BLUPR0701MB1009A14835A86D7237114514DF9C0@BLUPR0701MB1009.namprd07.prod.outlook.com>

Can you be more specific with the problems that you are encountering? Please keep in mind that a huge volume of air must be bled out before a centrifugal pump can run properly.

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu
www.cns.fas.harvard.edu

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Johnson, Patrick
Sent: Wednesday, August 30, 2017 8:17 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] PCW Process Chilled Water Service support

Good Morning,  We are in the start up phase and bringing up the clean room tools and have encountered maintenance support issues with the PCW skid.  Im curious to know how the other Nanofabs are handling the service of the PCW systems.    Thanks Patrick




Patrick Johnson
George Washington University
Nano Fabrication Lab Manager
Science and Engineering Hall
800 NW 22nd Street Rm-B2815
Washington D.C. 20052
Cell 703 258 2465
Desk 202 994 2346
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From mmoneck at andrew.cmu.edu  Wed Aug 30 17:30:21 2017
From: mmoneck at andrew.cmu.edu (Matthew Moneck)
Date: Wed, 30 Aug 2017 21:30:21 +0000
Subject: [labnetwork] PCW Process Chilled Water Service support
In-Reply-To: <CAGopbFJg6c-dg5-Y6JXOQ0X+b3=V+hCHFVQP48FrXPtmvoLtZA@mail.gmail.com>
References: <CAGopbFJg6c-dg5-Y6JXOQ0X+b3=V+hCHFVQP48FrXPtmvoLtZA@mail.gmail.com>
Message-ID: <c8ee06b681534942b68f92d1953213dd@PGH-MSGMLT-03.andrew.ad.cmu.edu>

Hi Patrick,

We are currently operating two fabs, one of which just opened this year.  Both fabs utilize a custom built PCW system, which means it is not as easy to go to a company for a maintenance agreement (note we did opt to do a 3yr service contract with the supplier of our new DI water skid, and I?d be happy to discuss the reasoning behind this decision).  Therefore, we do most of the maintenance ourselves (especially in the old facility) or in collaboration with our Facilities group (especially for larger projects or for tuning/repair of controls).

In the new fab, I would say the general rule of thumb is that almost all components located in the cleanroom are maintained by Nanofab staff and most components in the mechanical room are maintained with the assistance of Facilities.  For instance, filter changes, monitoring and calibration of the conductivity sensor, tie-ins to the cleanroom process tools, and most piping or valve maintenance on cleanroom laterals is handled by Nanofab staff.  Repairs or maintenance of the water pumps, heat exchangers, and PCW water mains are performed by our Facilities group (typically on a time and materials basis).  Our new system also includes redundant heat exchangers and pumps with automated valves that allow us to run one heat exchanger and pump at a time.  We rotate pumps and heat exchangers on a weekly basis.  This sequencing and the automated valves that control the crossover from one pump/exchanger to another are also maintained by our Facilities group.  The same is true for the automated sequencing and valves that control the PCW drain and DI fill sequence that is used to maintain water resistivity.  Despite a heavy reliance on our Facilities group for the larger components of the system, we still closely monitor everything and work with them as much as possible during any maintenance and repairs.

One additional item to note is that chilled water for all of our air handlers (makeup and recirculating air handlers included) comes from a separate system and is maintained by Facilities.

Hope this helps.  I would be happy to discuss any items further if needed.

Best Regards,

Matt

--
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility
Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu<http://www.ece.cmu.edu>
nanofab.ece.cmu.edu

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Johnson, Patrick
Sent: Wednesday, August 30, 2017 8:17 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] PCW Process Chilled Water Service support

Good Morning,  We are in the start up phase and bringing up the clean room tools and have encountered maintenance support issues with the PCW skid.  Im curious to know how the other Nanofabs are handling the service of the PCW systems.    Thanks Patrick




Patrick Johnson
George Washington University
Nano Fabrication Lab Manager
Science and Engineering Hall
800 NW 22nd Street Rm-B2815
Washington D.C. 20052
Cell 703 258 2465
Desk 202 994 2346
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From schweig at umich.edu  Thu Aug 31 05:43:23 2017
From: schweig at umich.edu (Dennis Schweiger)
Date: Thu, 31 Aug 2017 05:43:23 -0400
Subject: [labnetwork] PCW Process Chilled Water Service support
Message-ID: <CAKzi2_MQZTOiZYt+T6jJvpV_WpX3eAKcc1nEQawB-ggcRKto0g@mail.gmail.com>

Patrick,

good morning.  Here at the UofMichigan, we have two PCW systems, supporting
separate areas of our cleanroom facility, as well as surrounding ancillary
labs.  Our UofM plant facilities group maintains all of the associated
hardware, except for the polishing tanks, and their filters.  However,
since these two systems are extremely critical to our labs operation, on
occasion we have had to use the "carrot and/or stick" method to keep them
operational.

Dennis Schweiger
University of Michigan/LNF

734.647.2055 Ofc

On Wed, Aug 30, 2017 at 8:17 AM, Johnson, Patrick <paj1 at email.gwu.edu>
wrote:

> Good Morning,  We are in the start up phase and bringing up the clean room
> tools and have encountered maintenance support issues with the PCW skid.
> Im curious to know how the other Nanofabs are handling the service of the
> PCW systems.    Thanks Patrick
>
>
>
>
> *Patrick Johnson*
> *George Washington University*
> *Nano Fabrication Lab Manager *
> *Science and Engineering Hall*
> *800 NW 22nd Street Rm-B2815*
> *Washington D.C. 20052*
> *Cell 703 258 2465 <(703)%20258-2465>*
> *Desk 202 994 2346 <(202)%20994-2346>*
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
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From aju-jugessur at uiowa.edu  Thu Aug 31 11:03:06 2017
From: aju-jugessur at uiowa.edu (Jugessur, Aju S)
Date: Thu, 31 Aug 2017 15:03:06 +0000
Subject: [labnetwork] Sputter Ni/Cr (50/50 wt%)
Message-ID: <AF40008B-9B32-42D0-8D39-076D71FBADA0@uiowa.edu>

Hi all,

We will be trying to sputter Ni/Cr (50/50 wt%) on Alumina wafers and the thickness range will be between 30-50 nm. We are using the tool, Intlvac Nanochrome 1.
Since the material is magnetic, I was wondering if anyone would send us some suggestions on the process parameters to be used. There are several published reports on this but I wanted to check with
anyone who has some experience with this specific material.

Any comments/suggestions will be much appreciated.

Thanks
Aju



Aju Jugessur, Ph.D.
Director, University of Iowa Microfabrication Facility (UIMF)
Optical Science and Technology Center
Professor Adjunct, Physics and Astronomy
University of Iowa
Office: IATL 202, Tel: 319-3532342
Labs: IATL 170, 172, 174
https://ostc.uiowa.edu/uimf






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From aju-jugessur at uiowa.edu  Thu Aug 31 15:43:42 2017
From: aju-jugessur at uiowa.edu (Jugessur, Aju S)
Date: Thu, 31 Aug 2017 19:43:42 +0000
Subject: [labnetwork] Coating TiN or TiAlN
Message-ID: <587E84FB-69D8-4840-985A-C3542972FC61@uiowa.edu>


Hi all,

I have an industrial user in our lab who is looking into coating TiN or TiAlN: please see note below. Would Sputter technique be suitable for this application?

Any input will be appreciated. Let me know if you need more information.
Thanks
Aju


"I am looking for someone with the capability to deposit micron thick or more (up to say 3 microns)
of erosion/corrosion resistant coatings of TiAlN (Titanium Aluminum nitride) or TiN (Titanium Nitride) on polished metal surfaces.
Some of the metal surfaces will be U-shaped, possibly causing difficulties in obtaining uniformly thick layers.
The sample sizes for preliminary testing are 2-inch diameter in size.  The films
cannot taper off at the edges, otherwise the thin films will be easily removed during polishing with the forces at the edge."







Aju Jugessur, Ph.D.
Director, University of Iowa Microfabrication Facility (UIMF)
Optical Science and Technology Center
Professor Adjunct, Physics and Astronomy
University of Iowa
Office: IATL 202, Tel: 319-3532342
Labs: IATL 170, 172, 174
https://ostc.uiowa.edu/uimf






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