[labnetwork] EBeam Lithography on Glass substrates

Thu Aug 24 21:29:39 EDT 2017

Maybe this was mentioned earlier, but PMMA is strongly absorbing below 220 - 225 nm.

http://www.allresist.com/photorestist-other-resists-uv-patterning-of-pmma-resist/

Sent from my iPhone

> On Aug 24, 2017, at 15:41, N . Shane Patrick <patricns at uw.edu> wrote:
> 
> We use sputtered Au/Pd exclusively here as a charge dissipation layer and have not seen any adverse effects. Our system for this is a very basic tabletop coater system that runs on 120V and takes maybe 2 minutes of sputtering to get a sufficient coating for our cases. Perhaps power/duration are important to consider.
> 
> N. Shane Patrick
> Research Engineer, Washington Nanofabrication Facility (WNF) 
> National Nanotechnology Coordinated Infrastructure (NNCI)
> University of Washington
> Fluke Hall 132, Box 352143
> (206) 221-1045
> patricns at uw.edu
> http://www.wnf.washington.edu/
> 
>> On Aug 24, 2017, at 10:50 AM, Ryan Anderson <ryan at eng.ucsd.edu> wrote:
>> 
>> Hi all,
>> 
>> We have also observed adverse effects on PMMA exposure (100kV) after
>> sputter coating gold.  Since then we have used thermal evaporation.
>> 
>> Ryan Anderson
>> UC San Diego, Nano3
>> 
>> 
>> -----Original Message-----
>> From: labnetwork-bounces at mtl.mit.edu
>> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
>> Sent: Wednesday, August 23, 2017 4:15 PM
>> To: Marc Zuiddam - TNW <M.R.Zuiddam at tudelft.nl>; 'labnetwork at mtl.mit.edu'
>> <labnetwork at mtl.mit.edu>
>> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>> 
>> Dear Marc,
>> 
>> Evaporating Au on PMMA or ZEP should be done in a thermal evaporator, an
>> e-beam evaporator due to the electron beam would affect the resist. We
>> also avoid sputtering for this application as the effect of Ar plasma
>> (violet colour) can be unpredictable.
>> 
>> Regards, Fouad
>> 
>> -----Original Message-----
>> From: labnetwork-bounces at mtl.mit.edu
>> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Marc Zuiddam - TNW
>> Sent: Wednesday, 23 August 2017 10:29 PM
>> To: 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
>> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>> 
>> Dear people,
>> 
>> I always have the idea that sputting/evaporating a thin Au layer on my
>> sample is exposing the e-beam resist on my sample.. Do you also experience
>> that?
>> 
>> Regards, Marc Zuiddam
>> 
>> -----Original Message-----
>> From: labnetwork-bounces at mtl.mit.edu
>> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
>> Sent: woensdag 23 augustus 2017 1:42
>> To: Jugessur, Aju S; labnetwork at mtl.mit.edu
>> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>> 
>> Hi Aju,
>> 
>> Am echoing other voices:
>> - We use 12 nm of Au mostly on top of PMMA/ZEP to do the EBL which we
>> remove in a Ki/I2 solution.
>> - Sometime we use Cr under resist layer as well when we need Cr for
>> further processing.
>> 
>> Regards, Fouad Karouta
>> 
>> *************************************
>> Manager ANFF ACT Node
>> Australian National Fabrication Facility Research School of Physics and
>> Engineering L. Huxley Building (#56), Mills Road, Room 4.02 Australian
>> National University ACT 0200, Canberra, Australia
>> Tel: + 61 2 6125 7174
>> Mob: + 61 451 046 412
>> Email: fouad.karouta at anu.edu.au
>> http://anff-act.anu.edu.au/
>> 
>> -----Original Message-----
>> From: labnetwork-bounces at mtl.mit.edu
>> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Lino Eugene
>> Sent: Tuesday, 22 August 2017 11:49 PM
>> To: labnetwork at mtl.mit.edu
>> Cc: Steven Wei <c27wei at edu.uwaterloo.ca>
>> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>> 
>> Hi Aju,
>> 
>> We have a coop student who has worked on different anti-charging
>> materials: PEDOT:PSS, Electra 92 and sputtered Al.
>> 
>> We had also adhesion and uniformity issues with PEDOT:PSS from
>> Sigma-Aldrich. The solution was filtered and Triton X-100 was added and
>> but no noticeable improvement. I was told that surface treatment with
>> SurPass 3000 improves adhesion but we haven't tried this yet. Moreover,
>> PEDOT:PSS cross-links under certain conditions and then the layer cannot
>> be removed with water.
>> 
>> 10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is
>> expected to be high because of surface electron scattering (electron mean
>> free path in Al at room temperature is ~19nm) and oxidation. We use MF-319
>> at room temperature or 40 degC  to remove the layer.
>> 
>> Electra 92 from AllResist is easy to work with as it can be removed with
>> DI water after EBL and gives pretty good results on PMMA and on ZEP520A.
>> Surface treatment on HSQ is needed, so far treatment with IPA gives good
>> results. Also, the price is reasonable compared to ESpacer and AquaSave.
>> 
>> Best,
>> 
>> Lino Eugene, Ph.D., Jr. Eng.
>> Micro/nanofabrication process engineer
>> Quantum NanoFab
>> University of Waterloo
>> 200 University Avenue West
>> Waterloo, ON, Canada
>> N2L 3G1
>> 
>> Ph: +1 519-888-4567 #37788
>> Cell: +1 226-929-1685
>> Website: https://fab.qnc.uwaterloo.ca/
>> 
>> -----Original Message-----
>> From: labnetwork-bounces at mtl.mit.edu
>> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck
>> Sent: August 21, 2017 21:09
>> To: Mark K Mondol <mondol at mit.edu>; labnetwork at mtl.mit.edu
>> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>> 
>> Hi Aju,
>> 
>> We have commonly used Al as a conductive layer on top of PMMA on glass
>> (removal is typically done with minimal damage by using dilute AZ400K
>> photoresist developer).  However, 5nm seems to be on the thin side.  Al
>> can form native oxide that is up to 3-4nm thick.  Therefore, I would
>> confirm the answer to Mark's question of whether or not the 5nm Al layer
>> is conductive.  We typically sputter deposit films that are 10-20nm thick
>> for our applications.
>> 
>> Best Regards,
>> 
>> Matt
>> 
>> --
>> Matthew T. Moneck, Ph.D.
>> Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and
>> Computer Engineering | Carnegie Mellon University
>> 5000 Forbes Ave., Pittsburgh, PA 15213-3890
>> T: 412.268.5430
>> F: 412.268.3497
>> www.ece.cmu.edu
>> nanofab.ece.cmu.edu
>> 
>> 
>> -----Original Message-----
>> From: labnetwork-bounces at mtl.mit.edu
>> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
>> Sent: Monday, August 21, 2017 5:04 PM
>> To: labnetwork at mtl.mit.edu
>> Subject: Re: [labnetwork] EBeam Lithography on Glass substrates
>> 
>> Aju:
>> 
>> 1. Be 100% certain the layer is conductive and connected to ground in the
>> tool.
>> 
>> 2. Every time they write on glass, do the same exposure on Si, if the
>> problem shows up on both Si and glass the issue is not the insulating
>> substrate.
>> 
>> 3. Al etch can damage PMMA; not always in a repeatable way. Does your
>> process include etching the Al (I have found Transene CR-7 chrome etch to
>> be compatible with PMMA and ZEP, so usually use Cr not Al as the
>> conductive layer).
>> 
>> Regards,
>> 
>> Mark K MOndol
>> 
>> --
>> Mark K Mondol
>> Assistant Director NanoStructures Laboratory And Facility Manager Scanning
>> Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl
>> mondol at mit.edu office - 617-253-9617 cell - 617-224-8756
>> 
>> 
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