[labnetwork] Low-stress Sputtered Ir

Dilan Ratnayake emailtodilan at gmail.com
Fri Dec 8 15:36:24 EST 2017


Hi Matt,
I have published a paper about engineering stress on PECVD and sputtered
thin films and attached to this email. Hope this helps you. Let me know if
you have any questions.

Dilan Ratnayake

On Thu, Nov 30, 2017 at 10:46 AM, Matthew Oonk <mwoonk at umich.edu> wrote:

> Hello all
> We are having difficulty getting a low-stress (less than +/- 200MPA)
> sputtered Ir film here for a couple of users.
>
> -It's a batch-to-batch variability so the first Ir wafer can vary between
> -100 and >1000MPA for the first wafer and then films are consistently that
> same stress wafer-to-wafer when we run 5 wafer batches.  (There is a small
> first wafer affect but not anywhere near the run-to-run magnitude shifts.)
>
> -We start with similar base pressure and we have tried pre-coating the
> chamber with Ti and running Ir burn-in but the large batch-to-batch stress
> variability persists.
>
> -We run low-stress similar metals such as Ti, W, Ta, TiW  on the same tool
> with consistent stress and these all respond typically to pressure and
> power changes as well.
>
> -The vendor has very little insight.
>
> -The Ir film stress changes as expected with pressure, power and bias. So
> we could run the film now by measuring the first wafer stress and then
> adjusting the bias but this burns thru target and makes the runs more
> likely to flake out on the shielding.
>
>
> Does anybody run sputtered Ir with consistent stress?   Any insight as to
> what else we could try?
>
> Thanks for any information
>  -Matt
>
> Matthew Oonk
> Research Engineer
> Lurie Nanofabrication Facility
> University of Michigan
> 734-646-1275 <(734)%20646-1275>
> mwoonk at umich.edu
>
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