[labnetwork] Support for Suss SB-6

[Leif Johansen]

Hello Adam,

We have a Süss SB6 Gen2, which has many similarities with the first generation tool, SB6. We would be happy to provide you with starting points for recipes.

Best regards,

Leif



Leif Johansen

Head of Operations, Ph.D.


DTU Danchip



Technical University of Denmark

Nationalt Center for Mikro- and Nanofabrikation

Ørsteds Plads, Byg. 347

Building 347, Room 170

2800 Lyngby

Direct +45 45255713

Mobile +45 25348992

lesjo at danchip.dtu.dk<mailto:lesjo at danchip.dtu.dk>

www.dtu.dk/english<http://www.dtu.dk/english>


[http://www.dtu.dk/~/media/DTU_Generelt/Andet/DTU_email_logo_01.gif]





From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Stieg, Adam
Sent: 21. juni 2017 23:22
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Support for Suss SB-6

Dear All,

We are bringing a Suss SB6 wafer bonder back online after an extended down period and are in need of information regarding standard recipes for bonding under anodic, non-anodic, ambient low pressure, and ambient elevated temperature conditions. If anyone has such information and is willing to share, it would be greatly appreciated.

All the best,
Adam


Adam Z. Stieg Ph.D.
Associate Director, California NanoSystems Institute at UCLA
Director, Nano and Pico Characterization Laboratory
Technical Director, Integrated Systems Nanofabrication Cleanroom
(p) 310.206.2902
(e) stieg at cnsi.ucla.edu<mailto:stieg at cnsi.ucla.edu>



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