[labnetwork] Flip Chip Bonding needs

[Jeff Clarkson]

That's a great list!

We have an opening in our microfabrication lab here at Verily (Formerly
Google Life Sciences) for a packaging/assembly/flip-chip bonding process
engineer.  Most of their work will be oriented around chip bonding
processes using a Fineplacer Femto automated system.   A job description is
attached.

Please submit resumes to me directly.

Regards,

On Wed, Mar 15, 2017 at 1:36 PM, Brian Thibeault <thibeault at ece.ucsb.edu>
wrote:

> To all, Please add UCSB to the list as well.
>
>
>
> Thanks,
>
> Brian
>
>
>
>
>
> ***********************************
>
> Brian Thibeault, Ph.D
>
> Project Scientist/Manager
>
> UCSB Nanofabrication Facility
>
> Santa Barbara, CA 93106
>
>
>
> 805-893-2268 <(805)%20893-2268>
>
> www.nanotech.ucsb.edu
>
> thibeault at ece.ucsb.edu
>
>
>
>
>
>
>
> *From:* labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces@
> mtl.mit.edu] *On Behalf Of *Robert Avila
> *Sent:* Tuesday, March 14, 2017 9:16 AM
> *To:* julia.aebersold at louisville.edu; Michael Khbeis <khbeis at uw.edu>;
> Kamal Yadav <kamal.yadav at gmail.com>
>
> *Cc:* labnetwork at mtl.mit.edu
> *Subject:* Re: [labnetwork] Flip Chip Bonding needs
>
>
>
> Good to see Dr. Khbeis and others respond.
>
>
>
> Finetech has die bonders installed at many Universities…to name a few and
> my apologies for those I missed –
>
>
>
> University of Arizona,
>
> University of Arizona State
>
> Cal Berkeley
>
> Cal Davis
>
> Stanford
>
> Cal Tech
>
> University of Washington
>
> University of Louisville
>
> University of Colorado State
>
> University of Alaska
>
> University of Alberta
>
> University of Arkansas
>
> University of S.Florida
>
> MIT
>
> Harvard
>
> Rice
>
>
>
>
>
>
>
> Regards,
>
> Robert Avila
>
> (')480.231.7902 <(480)%20231-7902> mobile
>
> (')480-893-1630 <(480)%20893-1630> office
>
> finetechusa.com <http://www.finetechusa.com/> *8*
>
>
>
>
>
> *From:* labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces@
> mtl.mit.edu <labnetwork-bounces at mtl.mit.edu>] *On Behalf Of *
> julia.aebersold at louisville.edu
> *Sent:* Tuesday, March 14, 2017 7:25 AM
> *To:* Michael Khbeis <khbeis at uw.edu>; Kamal Yadav <kamal.yadav at gmail.com>
> *Cc:* labnetwork at mtl.mit.edu
> *Subject:* Re: [labnetwork] Flip Chip Bonding needs
>
>
>
> We also have flip chip bonding capabilities.  50kg seems quite a bit and
> would crush most silicon and/or glass substrates.
>
>
>
> Cheers!
>
>
>
> Julia Aebersold, Ph.D.
>
> Cleanroom Manager
>
> Micro/Nano Technology Center
>
> University of Louisville
>
> Shumaker Research Building, Room 233
>
> 2210 South Brook Street
>
> Louisville, KY  40292
>
>
>
> 502-852-1572 <(502)%20852-1572>
>
> http://louisville.edu/micronano/
>
>
>
> *From:* labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces@
> mtl.mit.edu <labnetwork-bounces at mtl.mit.edu>] *On Behalf Of *Michael
> Khbeis
> *Sent:* Tuesday, March 14, 2017 7:55 AM
> *To:* Kamal Yadav <kamal.yadav at gmail.com>
> *Cc:* labnetwork at mtl.mit.edu
> *Subject:* Re: [labnetwork] Flip Chip Bonding needs
>
>
>
> Kamal
>
>
>
> We can accommodate. What type of bond?
>
>
>
> Best,
>
> Dr. Michael Khbeis
>
> Washington Nanofab Facility
> University of Washington
> Fluke Hall, Box 352143
> (O) 206.543.5101
> (C) 443.254.5192
> khbeis at uw.edu
>
>
> On Mar 13, 2017, at 2:17 PM, Kamal Yadav <kamal.yadav at gmail.com> wrote:
>
> Dear All,
>
>
>
> Kindly let me know if you know or if you can provide flip chip bonding
> services at a University cleanroom or similar, on the west coast preferably
> [due to our own location], but we are open to other places as well.
>
>
>
> Bonding force required: Around 50 Kg
>
> Die Size: 5 mm to 35 mm.
>
> Alignment: 5 micron or better.
>
>
>
> --
>
> Thanks,
>
> Kamal
>
>
>
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-- 


Jeffrey P. Clarkson, *Ph.D.*  |  Hardware Engineer  |  jclarkson at google.com
|  650-495-2071
*v**erily*
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