[labnetwork] Dicing tool, saw or diamond scribe & break? Producers?

[Svenn Ove Linde]

Dear Colleagues
We consider purchasing a new dicing tool.
Today we have a Disco saw "DAD-2H/6" (1984) and a Dynatex "DX-III" (1993) diamond scribe and break system.
Approximately 95% of the dicing processing today is completed with the Dynatex diamond scriber.
Typical sample and material information
Wafer Substrate Material
GaAs, SiO2, Sapphire, Si3N4, Glass, steel alloy (only scribe), Quartz
Substrates dominant: Si
Wafer Thickness:
200 micrometer - 550 micrometer (Some samples down to 100 micrometer)
Glass slides up to 1mm (rarely).
Crystal Orientation:
For Si mostly (100) but also (111)
Any "Sensitive Material" in the street:
Si nano- and microwires.
"Front side" Surface Coatings:
Nitride, oxide, common metals <1µm
"Back side" Surface Coatings:
Nitride, oxide, common metals <1µm
Wafer or Sample Dimensions:
Wafers (2" - 6") and pieces/different shapes of wafers, like square 1x1 cm.

I want to check if any of you have recommendations whether we should go for a saw or a diamond scriber.
We are also interested in producers of this equipment.
Thanks in advance.

Best regards,
Svenn Ove Linde
NTNU - Norwegian University of Science and Technology
Faculty of Natural Sciences, NanoLab
Sem Sælandsvei 14
NO-7491 Trondheim, Norway

Homepage:  www.ntnu.no/nanolab

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