From kay.gastinger at ntnu.no  Fri Feb  2 07:23:39 2018
From: kay.gastinger at ntnu.no (Kay Gastinger)
Date: Fri, 2 Feb 2018 12:23:39 +0000
Subject: [labnetwork] Hazardous gas delivery logistics
In-Reply-To: <012c01d39ac6$a8c1c670$fa455350$@columbia.edu>
References: <012c01d39ac6$a8c1c670$fa455350$@columbia.edu>
Message-ID: <F85C0EBF-47D5-49EF-A83C-F9C0499E776A@ntnu.no>

Dear Nava,

I would not trust on the gas company. At least in Norway, the drivers have rather low competence, so take control as soon as the gas comes off the trailer. I would make sure that nobody except your experts are in the area, definitely close the corridors/elevators, nobody travels in an elevator together with the gas. Make sure the bottles are secured against falling off during transport. Be aware they come in different sizes, you might need several sizes of transport devices.

We have always 2 of our engineers with oxygen masks (both) connecting the bottles, one works - one checks. Both plan the work together and make a list of steps on how to proceed. If unplanned things happens, stop the work and make a new plan that both agree on. Write it down and follow strictly. If we handle Silane I would also recommend a fire fighter dress. We did not leak check the bottles when they came, as far as I remember. Turn on emergency ventilation under installation. Standard procedure when connecting with leak check etc. store The gas bottles in its cabinets until installation.

I assume of course your gas detection system is tested and operational. NI purging is important before connecting. Take care of the ?other end? of the pipes when starting up a new system. I would close the cleanroom and also here the gas detection system should of course be operational.

The gas pipes are leak tested? We found after some year out that the welds in our system were not tested with x-rays. That I would really recommend. We tested 10% of the joints and found considerable pits in one of the pipes, that we had to repair later-on which is much more challenging with all the other pipes and dangerous gases around.

I hope that helped.

Kay

--------------------------------------------------------------------------------------------
Kay Gastinger, PhD
Director
NTNU NanoLab, Chemistry building I / room 122,
N-7491 Trondheim
Norway

tel. +47 / 7359 1490
mob. +47 / 982 83 906

www.ntnu.edu/nanolab<http://www.ntnu.edu/nanolab>
--------------------------------------------------------------------------------------------




From: <labnetwork-bounces at mtl.mit.edu> on behalf of Nava Ariel-Sternberg <na2661 at columbia.edu>
Date: Wednesday, 31 January 2018 at 23:50
To: "labnetwork at mtl.mit.edu" <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Hazardous gas delivery logistics

Dear all,

I am very happy to say that we are finally gearing up to full operations in the Columbia University clean room (after a long renovation period, inspections, permits etc.). The final stage will be to bring on-line systems that use toxic and other hazardous gases that we do not yet have on site. As we are getting ready to receive those gases, we started discussing what would be the safest way to receive them and the logistics involved. This has brought some interesting questions and I wanted to get some inputs from other facilities.

Could you please comment on the toxic gases receiving procedures in your facility? Is the delivery done at special times in the day? Are you securing the cylinder path? (making sure no one is in the corridor/elevator etc.?) Are you performing leak checks when the cylinder arrives to campus? Are staff wearing SCBA when handling the cylinders? When is the transfer point between the gas company and the technical staff of the clean room?

Thanks,
Nava


Nava Ariel-Sternberg, Ph.D.
Director of CNI Shared Facilities
Columbia University
530 w120th st., NY 10027
Room 1015/MC 8903
Office: 212-854-9927
Cell: 201-562-7600

?

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From gcure at email.arizona.edu  Fri Feb  2 12:40:17 2018
From: gcure at email.arizona.edu (Cure, Gregg D - (gcure))
Date: Fri, 2 Feb 2018 17:40:17 +0000
Subject: [labnetwork] Astech ATL-100RA manual
Message-ID: <SN1PR19MB0304729E14589B87F7490212E4F90@SN1PR19MB0304.namprd19.prod.outlook.com>

Hello folks,

Would any of you have a PDF mannual for an Astech ATL-100AR RF matching network?

Thanks in advance,
Gregg Cure`



Gregg D. Cure`
The University of Arizona
Office for Research and Discovery
Nano Fabrication and Processing Center
1230 E. Speedway Blvd.
ECE104 Rm 209
Tucson, AZ 85721-0104
Office: 520.626.1987
Cell: 520.307.0925
Fax: 520.626.7877
Website: http://mfc.arizona.edu<http://mfc.engr.arizona.edu>
Website: http://research.arizona.edu/
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From Vincent.Luciani at nist.gov  Fri Feb  2 14:19:02 2018
From: Vincent.Luciani at nist.gov (Luciani, Vincent (Fed))
Date: Fri, 2 Feb 2018 19:19:02 +0000
Subject: [labnetwork] Hazardous gas delivery logistics
In-Reply-To: <012c01d39ac6$a8c1c670$fa455350$@columbia.edu>
References: <012c01d39ac6$a8c1c670$fa455350$@columbia.edu>
Message-ID: <BY2PR09MB10616269C1E983601CF836F39CF90@BY2PR09MB1061.namprd09.prod.outlook.com>

Hello Nava,

I recommend an inspection checklist and a hand held sniffer before a cylinder is permitted to be unloaded.  Perhaps it has changed since my last deep dive into the details but there are ?cradle-to-grave? codes and responsibilities with regard to toxic gasses.  Once the cylinder is off the truck the recipient has additional responsibilities with regard to handling that cylinder if it turns out to be a leaker.   The vendors have special mobile units to deal with such cylinders but would much rather drop it and leave, making it your problem.

Before it gets off the truck, the valve should be visually checked to make sure it is wrapped and protected from weather, no rust or debris in the outlet, that it has the right CGA fitting,  the outlet cap is in place, valve neck is not bent etc. etc. etc. and of course that the sniffer does not detect a leak.  If it checks out, you allow the driver to unload the cylinder and you can treat it as a known non-leaker and carefully transport it like any other cylinder to its safe location.  If it does not check out, you can refuse delivery and thus it is still in the vendor?s ?cradle-to-grave? responsibility and they must deal with it.


Vince


Vincent K. Luciani
NanoFab Manager
Center for Nanoscale Science and Technology<http://www.cnst.nist.gov/>
National Institute of Standards and Technology
100 Bureau Drive, MS 6201
Gaithersburg, MD 20899-6200 USA
+1-301-975-2886





From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Nava Ariel-Sternberg
Sent: Wednesday, January 31, 2018 2:07 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Hazardous gas delivery logistics

Dear all,

I am very happy to say that we are finally gearing up to full operations in the Columbia University clean room (after a long renovation period, inspections, permits etc.). The final stage will be to bring on-line systems that use toxic and other hazardous gases that we do not yet have on site. As we are getting ready to receive those gases, we started discussing what would be the safest way to receive them and the logistics involved. This has brought some interesting questions and I wanted to get some inputs from other facilities.

Could you please comment on the toxic gases receiving procedures in your facility? Is the delivery done at special times in the day? Are you securing the cylinder path? (making sure no one is in the corridor/elevator etc.?) Are you performing leak checks when the cylinder arrives to campus? Are staff wearing SCBA when handling the cylinders? When is the transfer point between the gas company and the technical staff of the clean room?

Thanks,
Nava


Nava Ariel-Sternberg, Ph.D.
Director of CNI Shared Facilities
Columbia University
530 w120th st., NY 10027
Room 1015/MC 8903
Office: 212-854-9927
Cell: 201-562-7600

?

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From schweig at umich.edu  Sat Feb  3 06:42:53 2018
From: schweig at umich.edu (Dennis Schweiger)
Date: Sat, 3 Feb 2018 06:42:53 -0500
Subject: [labnetwork] Hazardous gas delivery logistics
Message-ID: <CAKzi2_M7wQGvdtv+kO8v_tGUr_RtQ+SNoywzh_NJJBLbFwotKQ@mail.gmail.com>

Nava,

good morning. Here at the University of Michigan/LNF our gas vendor has
access to the chemical dock delivery for our lab (they deliver at 4:30-5 in
the morning) and the normal gases (N2, Ar, He, O2, H2, CH4, etc.) are
delivered by them.  When our staff arrive around 7, those cylinders will be
moved to their proper storage location.  The delivery person will also pick
up the empties at the same time.

For all of the HPM materials (SiH4, NH3, NF3, AsH3, PH3, BCl3, Cl2, etc),
we've "right sized" both the cylinders, and the fills, so that we have a
cylinder change out cadence of 12-18 months.  This means that the
physically largest HPM cylinder we have in our site is one of the Silanes.
It's about 9" diameter and 24" tall.  All of the HPM cylinders are shipped
common carrier to our building dock, however our receiving crew for the
building will call me as soon as they arrive, and either myself, or another
individual, will go pick them up.  The distance between that dock, and our
controlled service aisle is about 125' through a seldomly used building
corridor.  We use all DISS cylinder valves on our HPM's, they're shipped
blanked off, and then when the cylinder goes into one of the gas storage
rooms of our fab, those new "full" cylinders are stored in the lower half
of the gas cabinet that houses the online cylinder.  We'll wear SCBA only
when we break the cylinder valve cap to do a change out.

So far, this procedure (in place since 2008) has worked well for us, and
has not created any issues with either getting the gas in a timely fashion,
or unnecessarily exposing the building occupants to an exposure risk.

Dennis Schweiger
Facilities Manager
University of Michigan/LNF

734.647.2055 Ofc


On Wed, Jan 31, 2018 at 2:06 PM, Nava Ariel-Sternberg <na2661 at columbia.edu>
wrote:

> Dear all,
>
>
>
> I am very happy to say that we are finally gearing up to full operations
> in the Columbia University clean room (after a long renovation period,
> inspections, permits etc.). The final stage will be to bring on-line
> systems that use toxic and other hazardous gases that we do not yet have on
> site. As we are getting ready to receive those gases, we started discussing
> what would be the safest way to receive them and the logistics involved.
> This has brought some interesting questions and I wanted to get some inputs
> from other facilities.
>
>
>
> Could you please comment on the toxic gases receiving procedures in your
> facility? Is the delivery done at special times in the day? Are you
> securing the cylinder path? (making sure no one is in the corridor/elevator
> etc.?) Are you performing leak checks when the cylinder arrives to campus?
> Are staff wearing SCBA when handling the cylinders? When is the transfer
> point between the gas company and the technical staff of the clean room?
>
>
>
> Thanks,
>
> Nava
>
>
>
>
>
> Nava Ariel-Sternberg, Ph.D.
>
> Director of CNI Shared Facilities
>
> Columbia University
>
> 530 w120th st., NY 10027
>
> Room 1015/MC 8903
>
> Office: 212-854-9927 <(212)%20854-9927>
>
> Cell: 201-562-7600 <(201)%20562-7600>
>
>
>
> ?
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
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From eabelev at pitt.edu  Mon Feb  5 11:33:38 2018
From: eabelev at pitt.edu (Abelev, Esta)
Date: Mon, 5 Feb 2018 16:33:38 +0000
Subject: [labnetwork] Ge2Sb2Te5 deposition and annealing
Message-ID: <CY1PR0401MB0905D5BCCEC60A15CAB9F9D4C5FE0@CY1PR0401MB0905.namprd04.prod.outlook.com>

Dear Colleagues,

I would like to ask about deposition and annealing of Ge2Sb2Te5.
The sputtering system we use for Ge2Sb2Te5 deposition is without load lock, the smell after depositing is horrible but my main concerns is regarding toxicity. Do you know if those materials/odor toxic?
In addition, the group wants to anneal those samples in RTA at low temp (below 200C) after the deposition, I am concerns about contaminations? Please comment.

Thank you, Esta

-----------------------
Esta Abelev, PhD
Technical Director, Petersen Institute of NanoScience and Engineering
University of Pittsburgh | 3700 O'Hara Street | 636| Pittsburgh, PA 15261
412-383-4096 | eabelev at pitt.edu<mailto:eabelev at pitt.edu> | nano.pitt.edu<https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0>


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From myoung6 at nd.edu  Mon Feb  5 16:58:45 2018
From: myoung6 at nd.edu (Michael Young)
Date: Mon, 5 Feb 2018 16:58:45 -0500
Subject: [labnetwork] Ge2Sb2Te5 deposition and annealing
In-Reply-To: <CY1PR0401MB0905D5BCCEC60A15CAB9F9D4C5FE0@CY1PR0401MB0905.namprd04.prod.outlook.com>
References: <CY1PR0401MB0905D5BCCEC60A15CAB9F9D4C5FE0@CY1PR0401MB0905.namprd04.prod.outlook.com>
Message-ID: <56ae934b-75c3-ad22-c956-8f1fdad8bb9d@nd.edu>

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From bill_flounders at berkeley.edu  Mon Feb  5 16:58:28 2018
From: bill_flounders at berkeley.edu (A. William (Bill) FLOUNDERS)
Date: Mon, 5 Feb 2018 13:58:28 -0800
Subject: [labnetwork] Ge2Sb2Te5 deposition and annealing
In-Reply-To: <CY1PR0401MB0905D5BCCEC60A15CAB9F9D4C5FE0@CY1PR0401MB0905.namprd04.prod.outlook.com>
References: <CY1PR0401MB0905D5BCCEC60A15CAB9F9D4C5FE0@CY1PR0401MB0905.namprd04.prod.outlook.com>
Message-ID: <CAHxjSh=VL=b=bQGCb_pMkzEmm3HfWCc6yfp9g71gP6XWwJbhsg@mail.gmail.com>

Esta Abelev,
Consult with your campus EH&S.
Tellurium is known for its stench (same family as sulfur)
and exposure to miniscule amounts results in a condition known as tellurium
breath.
Both tellurium and antimony are considered mildly toxic and have defined
threshold exposure limits.
Multiple pump/purge cycles are recommended prior to opening your chamber.
As with any metals, avoid any operations that would generate particulates /
dust.

Bill Flounders
UC Berkeley


On Mon, Feb 5, 2018 at 8:33 AM, Abelev, Esta <eabelev at pitt.edu> wrote:

> Dear Colleagues,
>
>
>
> I would like to ask about deposition and annealing of Ge2Sb2Te5.
>
> The sputtering system we use for Ge2Sb2Te5 deposition is without load
> lock, the smell after depositing is horrible but my main concerns is
> regarding toxicity. Do you know if those materials/odor toxic?
>
> In addition, the group wants to anneal those samples in RTA at low temp
> (below 200C) after the deposition, I am concerns about contaminations?
> Please comment.
>
>
>
> Thank you, Esta
>
>
>
> -----------------------
>
> *Esta Abelev, PhD*
>
> Technical Director, Petersen Institute of NanoScience and Engineering
>
> University of Pittsburgh | 3700 O?Hara Street | 636| Pittsburgh, PA 15261
>
> 412-383-4096 <(412)%20383-4096> | eabelev at pitt.edu | nano.pitt.edu
> <https://na01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.nano.pitt.edu%2F&data=01%7C01%7Ceabelev%40pitt.edu%7C9f5bd58ba84940765cf308d4024fbe18%7C9ef9f489e0a04eeb87cc3a526112fd0d%7C1&sdata=3KfbG5VbshqdoIAPxvX%2F2s1UeU7ultmBoZmm%2FaZ2Itc%3D&reserved=0>
>
>
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
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From miller at purdue.edu  Tue Feb  6 15:54:31 2018
From: miller at purdue.edu (Miller, Timothy J)
Date: Tue, 6 Feb 2018 20:54:31 +0000
Subject: [labnetwork] Dicing Indium Antimonide?
Message-ID: <d5c9c9ea1cc240d4b668be17f36bfdf0@wppexc04.purdue.lcl>

Subject line says it all - does anyone have experience dicing Indium Antimonide?

Timothy J. Miller
Purdue University
Birck Nanotechnology Center
1205 West State Street
West Lafayette, IN 47907-2057
765-427-4712

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From nclay at upenn.edu  Tue Feb  6 21:32:51 2018
From: nclay at upenn.edu (Noah Clay)
Date: Tue, 6 Feb 2018 21:32:51 -0500
Subject: [labnetwork] Dicing Indium Antimonide?
In-Reply-To: <d5c9c9ea1cc240d4b668be17f36bfdf0@wppexc04.purdue.lcl>
References: <d5c9c9ea1cc240d4b668be17f36bfdf0@wppexc04.purdue.lcl>
Message-ID: <61F80174-E715-426F-A8BA-157222127B22@upenn.edu>

Tim,

I worked with this material in industry.  We diced it on a Loomis LSD-150, in notch and break mode.  Scribe and break mode generates excessive dust -> no go...and we couldn?t saw it without capturing the waste water - and, besides, the saw would be contaminated.

While scribing, I?d advise your PI?s researchers to wear a face mask (covering mouth/nose), double-glove and wipe-down the machine as well as nearby table surfaces after each use (alpha wipes and IPA).  The dust will be insignificant, so it can be disposed of in the regular trash along with their outer gloves.  Any wafer fragments that are left over should be placed in a III-V waste container that your EHS will dispose of when full.

You could take things to the next level with swab or wipe tests (using an industrial hygiene company) of nearby table surfaces after 6-12 months to benchmark contamination levels.

Best,
Noah

Sent from my iPhone

> On Feb 6, 2018, at 15:54, Miller, Timothy J <miller at purdue.edu> wrote:
> 
> Subject line says it all ? does anyone have experience dicing Indium Antimonide? 
>  
> Timothy J. Miller
> Purdue University
> Birck Nanotechnology Center
> 1205 West State Street
> West Lafayette, IN 47907-2057
> 765-427-4712
>  
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From mhofheins at unm.edu  Wed Feb  7 10:28:43 2018
From: mhofheins at unm.edu (Mark Hofheins)
Date: Wed, 7 Feb 2018 15:28:43 +0000
Subject: [labnetwork] Molybdenum sputtering
Message-ID: <CY4PR0701MB363339D2B1A0EAE498EC3E73A3FC0@CY4PR0701MB3633.namprd07.prod.outlook.com>

Good Morning All,

I have a customer that wants to sputter Mo.

What is a recommended wattage and what types of contamination do I need to be concerned with?


Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

505-710-3527



Micro Electronics Technician

Manufacturing Engineering

University of New Mexico MTTC

800 Bradbury S.E.  Suit 235

Albuquerque, New Mexico

87106-4346

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From mhofheins at unm.edu  Fri Feb  9 12:55:25 2018
From: mhofheins at unm.edu (Mark Hofheins)
Date: Fri, 9 Feb 2018 17:55:25 +0000
Subject: [labnetwork] ITO and N-Hexane use and handling
Message-ID: <CY4PR0701MB3633C6FD4897CE7372222E70A3F20@CY4PR0701MB3633.namprd07.prod.outlook.com>

Good Friday to All,
My Director has asked me to inquire on how other universities handle ITO and N-Hexane.   What do they use for ventilation and scrubbing for these chemicals?  How are these stored?  What PPE is used?

Please let me know and thank you,


Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

505-710-3527



Micro Electronics Technician

Manufacturing Engineering

University of New Mexico MTTC

800 Bradbury S.E.  Suit 235

Albuquerque, New Mexico

87106-4346

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From khbeis at uw.edu  Fri Feb  9 19:18:55 2018
From: khbeis at uw.edu (Michael Khbeis)
Date: Fri, 9 Feb 2018 16:18:55 -0800
Subject: [labnetwork] Best practices for chemical storage,
 cross contamination, conservation
Message-ID: <8E6984FA-E127-4CEF-8E36-B857AC6FBB52@uw.edu>

Dear Colleagues, 

We have many users avoiding shared baths for things like RCA, Piranha, and even developers because they worry about cross-contamination (and rightfully so with random things floating in the baths on a fairly regular basis). However, this has led to numerous users pouring resealable, food grade containers, that subsequently leave them cluttered on our wet process station work surfaces for up to several weeks. This of course is not an acceptable solution but prohibiting this behavior will result in a massive waste of otherwise perfectly good chemicals. So we have a challenge of balancing process integrity, safety, and chemical economy. We are looking for better temporary storage solutions that would allow transport of containers to chemical cabinets, but I am curious how other sites have resolved or administered this issue.

Gratefully,

Dr. Michael Khbeis
Director, Washington Nanofabrication Facility (WNF) 
National Nanotechnology Coordinated Infrastructure (NNCI)
University of Washington
Fluke Hall, Box 352143
(O) 206.543.5101
(F) 206.221.1681
(C) 443.254.5192
khbeis at uw.edu
www.wnf.washington.edu/

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From fouad.karouta at anu.edu.au  Sun Feb 11 17:56:51 2018
From: fouad.karouta at anu.edu.au (Fouad Karouta)
Date: Sun, 11 Feb 2018 22:56:51 +0000
Subject: [labnetwork] Best practices for chemical storage,
 cross contamination, conservation
In-Reply-To: <8E6984FA-E127-4CEF-8E36-B857AC6FBB52@uw.edu>
References: <8E6984FA-E127-4CEF-8E36-B857AC6FBB52@uw.edu>
Message-ID: <MEAPR01MB2567E271AC864B705CA87F73C0F00@MEAPR01MB2567.ausprd01.prod.outlook.com>

Hi Michael,

Working with chemicals is a delicate matter and unless you have clear rules about what can be used in shared baths and what cannot. However this description may still be misinterpreted by users.

I am not sure if you have users using wet etchants for wafer batches (25x).
If users are only using one wafer to smaller pieces at one time you can limit the amount of chemicals used by having adequate containers to use a limited amount of chemical even with a one 4" wafer (beaker with 11 cm diameter and 5-6 cm edge height). For HF I tend to get regular size containers then get it machined in workshop to reduce the height.
Each user makes his solution and use it then dispose of it upon the rules (neutralize, etc.).
You may consider the following:

*         To avoid having every user preparing upfront those chemicals and putting a pressure on the storage area, you may consider having one container of each regularly used solution prepared and topped up by your staff, this can go for RCA, HF dilutions, etc.

*         A remark about piranha solution though I suppose the purpose is just cleaning the wafer but H2O2 is unstable in acidic solution and you should consider how long such a solution can be used.
Regards,
Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility
Research School of Physics and Engineering
L. Huxley Building (#56), Mills Road, Room 4.02
Australian National University
ACT 0200, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au<mailto:fouad.karouta at anu.edu.au>
http://anff-act.anu.edu.au/

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Michael Khbeis
Sent: Saturday, 10 February 2018 11:19 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Best practices for chemical storage, cross contamination, conservation

Dear Colleagues,

We have many users avoiding shared baths for things like RCA, Piranha, and even developers because they worry about cross-contamination (and rightfully so with random things floating in the baths on a fairly regular basis). However, this has led to numerous users pouring resealable, food grade containers, that subsequently leave them cluttered on our wet process station work surfaces for up to several weeks. This of course is not an acceptable solution but prohibiting this behavior will result in a massive waste of otherwise perfectly good chemicals. So we have a challenge of balancing process integrity, safety, and chemical economy. We are looking for better temporary storage solutions that would allow transport of containers to chemical cabinets, but I am curious how other sites have resolved or administered this issue.

Gratefully,

Dr. Michael Khbeis
Director, Washington Nanofabrication Facility (WNF)
National Nanotechnology Coordinated Infrastructure (NNCI)
University of Washington
Fluke Hall, Box 352143
(O) 206.543.5101
(F) 206.221.1681
(C) 443.254.5192
khbeis at uw.edu<mailto:khbeis at uw.edu>
www.wnf.washington.edu/<http://www.wnf.washington.edu/>

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From Vincent.Luciani at nist.gov  Mon Feb 12 09:17:47 2018
From: Vincent.Luciani at nist.gov (Luciani, Vincent (Fed))
Date: Mon, 12 Feb 2018 14:17:47 +0000
Subject: [labnetwork] Best practices for chemical storage,
 cross contamination, conservation
In-Reply-To: <8E6984FA-E127-4CEF-8E36-B857AC6FBB52@uw.edu>
References: <8E6984FA-E127-4CEF-8E36-B857AC6FBB52@uw.edu>
Message-ID: <BY2PR09MB106197CC018983488D3856219CF70@BY2PR09MB1061.namprd09.prod.outlook.com>

Good Morning Michael,

I can't say we have the problem solved but we have made some headway.  This is what we have done to date:

We purchased single wafer piranha and RCA spray clean tools.  We are just about to wrap up an oxide integrity study comparing it to immersion RCA. It looks encouraging.  Works with whole wafers (75 mm - 200 mm).  This saves chemicals and manual pouring and handling of waste.

Every Friday evening at about 11 PM, we clear the benches.  Most people know this so there is not much to clean up.  During the week, any beakers that are not labelled properly are removed as soon as we find them.

I am still not happy with our resist and developer handling management.  Still very manual with users having direct access to gallon containers.  There is a session  dedicated to lithography materials management in this year's https://ugim.nano.upenn.edu/ .  I encourage anyone with something to contribute to send in an abstract.  If the upload is not functional yet, send it to me.


Best,
Vince

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Michael Khbeis
Sent: Friday, February 09, 2018 7:19 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Best practices for chemical storage, cross contamination, conservation

Dear Colleagues,

We have many users avoiding shared baths for things like RCA, Piranha, and even developers because they worry about cross-contamination (and rightfully so with random things floating in the baths on a fairly regular basis). However, this has led to numerous users pouring resealable, food grade containers, that subsequently leave them cluttered on our wet process station work surfaces for up to several weeks. This of course is not an acceptable solution but prohibiting this behavior will result in a massive waste of otherwise perfectly good chemicals. So we have a challenge of balancing process integrity, safety, and chemical economy. We are looking for better temporary storage solutions that would allow transport of containers to chemical cabinets, but I am curious how other sites have resolved or administered this issue.

Gratefully,

Dr. Michael Khbeis
Director, Washington Nanofabrication Facility (WNF)
National Nanotechnology Coordinated Infrastructure (NNCI)
University of Washington
Fluke Hall, Box 352143
(O) 206.543.5101
(F) 206.221.1681
(C) 443.254.5192
khbeis at uw.edu<mailto:khbeis at uw.edu>
www.wnf.washington.edu/<http://www.wnf.washington.edu/>

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From julia.aebersold at louisville.edu  Mon Feb 12 11:14:54 2018
From: julia.aebersold at louisville.edu (Aebersold,Julia W.)
Date: Mon, 12 Feb 2018 16:14:54 +0000
Subject: [labnetwork] Best practices for chemical storage,
 cross contamination, conservation
In-Reply-To: <MEAPR01MB2567E271AC864B705CA87F73C0F00@MEAPR01MB2567.ausprd01.prod.outlook.com>
References: <8E6984FA-E127-4CEF-8E36-B857AC6FBB52@uw.edu>
 <MEAPR01MB2567E271AC864B705CA87F73C0F00@MEAPR01MB2567.ausprd01.prod.outlook.com>
Message-ID: <DM5PR03MB2811070460CD584087B5125D9FF70@DM5PR03MB2811.namprd03.prod.outlook.com>

We have our users prepare new RCA and Piranha baths for their applications for their stability varies over time.  We tried baths for developers, but it gave us varying developer times for our clients.  So we have dedicated containers for developers and clients user new developer for each process.  We also found that it reduced our overall developer usage.

For HF we have a dedicated BOE bath that gets changed on a periodic basis.  If folks need 49% HF then they make use specific what we need.  I prefer not to keep a bath of that sort on hand due to infrequent usage and its danger factor.

Cheers!

Julia Aebersold
Manager, Micro/Nano Technology Center
University of Louisville
Shumaker Research Building, Room 233
2210 South Brook Street
Louisville, KY  40292
(502) 852-1572

http://louisville.edu/micronano/

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
Sent: Sunday, February 11, 2018 5:57 PM
To: Michael Khbeis <khbeis at uw.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Best practices for chemical storage, cross contamination, conservation

Hi Michael,

Working with chemicals is a delicate matter and unless you have clear rules about what can be used in shared baths and what cannot. However this description may still be misinterpreted by users.

I am not sure if you have users using wet etchants for wafer batches (25x).
If users are only using one wafer to smaller pieces at one time you can limit the amount of chemicals used by having adequate containers to use a limited amount of chemical even with a one 4" wafer (beaker with 11 cm diameter and 5-6 cm edge height). For HF I tend to get regular size containers then get it machined in workshop to reduce the height.
Each user makes his solution and use it then dispose of it upon the rules (neutralize, etc.).
You may consider the following:

*         To avoid having every user preparing upfront those chemicals and putting a pressure on the storage area, you may consider having one container of each regularly used solution prepared and topped up by your staff, this can go for RCA, HF dilutions, etc.

*         A remark about piranha solution though I suppose the purpose is just cleaning the wafer but H2O2 is unstable in acidic solution and you should consider how long such a solution can be used.
Regards,
Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility
Research School of Physics and Engineering
L. Huxley Building (#56), Mills Road, Room 4.02
Australian National University
ACT 0200, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au<mailto:fouad.karouta at anu.edu.au>
http://anff-act.anu.edu.au/<https://urldefense.proofpoint.com/v2/url?u=http-3A__anff-2Dact.anu.edu.au_&d=DwMFAg&c=OAG1LQNACBDguGvBeNj18Swhr9TMTjS-x4O_KuapPgY&r=l9C3cuOkWyGd6C0ye_FDTBHMFl4lPXPJztVHQPL_Bao&m=zLOqvn0UFJ0eLaK9rbui7a_VJzTCbEVlsOoxK99xVg0&s=jSavso-Du9v_hBk9HzloCYBQRY6hVTeYiUt7YtCIdCg&e=>

From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Michael Khbeis
Sent: Saturday, 10 February 2018 11:19 AM
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] Best practices for chemical storage, cross contamination, conservation

Dear Colleagues,

We have many users avoiding shared baths for things like RCA, Piranha, and even developers because they worry about cross-contamination (and rightfully so with random things floating in the baths on a fairly regular basis). However, this has led to numerous users pouring resealable, food grade containers, that subsequently leave them cluttered on our wet process station work surfaces for up to several weeks. This of course is not an acceptable solution but prohibiting this behavior will result in a massive waste of otherwise perfectly good chemicals. So we have a challenge of balancing process integrity, safety, and chemical economy. We are looking for better temporary storage solutions that would allow transport of containers to chemical cabinets, but I am curious how other sites have resolved or administered this issue.

Gratefully,

Dr. Michael Khbeis
Director, Washington Nanofabrication Facility (WNF)
National Nanotechnology Coordinated Infrastructure (NNCI)
University of Washington
Fluke Hall, Box 352143
(O) 206.543.5101
(F) 206.221.1681
(C) 443.254.5192
khbeis at uw.edu<mailto:khbeis at uw.edu>
www.wnf.washington.edu/<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.wnf.washington.edu_&d=DwMFAg&c=OAG1LQNACBDguGvBeNj18Swhr9TMTjS-x4O_KuapPgY&r=l9C3cuOkWyGd6C0ye_FDTBHMFl4lPXPJztVHQPL_Bao&m=zLOqvn0UFJ0eLaK9rbui7a_VJzTCbEVlsOoxK99xVg0&s=jlh0oXwODNfDO8TRMbLM7Ig8kkusYr4PlUXgbSNu9Bw&e=>

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From ida.noddeland at ntnu.no  Tue Feb 13 05:53:45 2018
From: ida.noddeland at ntnu.no (Ida Noddeland)
Date: Tue, 13 Feb 2018 10:53:45 +0000
Subject: [labnetwork] Vacant engineer position at Tyndall, Ireland
Message-ID: <9fb678b65d1547dd979afd3063372146@it-ex11.win.ntnu.no>

Dear all,

There is a vacancy for a senior maintenance engineer at Tyndall National Institute in Cork, Ireland. Please share this link with anyone who may be interested!
http://careers.tyndall.ie/vacancies/senior-maintenance-engineer-senior-technical-officer

Best regards
Ida Noddeland

Head of Laboratory
NTNU NanoLab
Sem S?lands vei 14, K1-123
7491 Trondheim
+47 412 88 808
www.ntnu.no/nano<http://www.ntnu.no/nano>

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From gilheart at rice.edu  Tue Feb 13 17:13:19 2018
From: gilheart at rice.edu (Tim Gilheart)
Date: Tue, 13 Feb 2018 16:13:19 -0600
Subject: [labnetwork] Research Scientist position in Rice U. cleanroom
Message-ID: <6161DF83-F15E-45FB-B5B0-CB8227624C36@rice.edu>

Greetings colleagues,

We have an opening on the cleanroom team with the Shared Equipment Authority (SEA) at Rice University. More information about the position may be found here:

https://jobs.rice.edu/postings/12671 <https://jobs.rice.edu/postings/12671>

The cleanroom at Rice is part of the SEA, a larger umbrella organization under the Vice Provost for Research, that administers a number of shared core labs (electron microscopy, nanofab cleanroom, NMR, mass spec, optical microscopy, XRD, etc) located throughout the university. This position is part of the SEA's collegial team of scientists that support research efforts from the schools of engineering and natural sciences.  More information about the SEA can be found on our website:

https://sea.rice.edu/ <https://sea.rice.edu/>

Rice is still accepting applications for this position, so if you know a good candidate, please pass this information along to them. This is an exciting time to join our team, as we are scheduled to move to our new facility in August. With the move, we are replacing some aging workhorse tools, adding altogether new capabilities, and increasing our facility size.

Interested candidates are welcome to contact me directly with any questions.

Thanks for your time and consideration,

-- 
Tim Gilheart, Ph.D.
Research Scientist - Nanofabrication Clean Room Manager,
Shared Equipment Authority (SEA), Rice University
Cell: 832-341-5488 | Office: 713-348-3159 | gilheart at rice.edu


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From julia.aebersold at louisville.edu  Fri Feb 16 13:53:11 2018
From: julia.aebersold at louisville.edu (Aebersold,Julia W.)
Date: Fri, 16 Feb 2018 18:53:11 +0000
Subject: [labnetwork] Open Position - Senior Micro/Nano Technology Process
	Engineer
Message-ID: <DM5PR03MB281164E861ABE67DBEC06FBC9FCB0@DM5PR03MB2811.namprd03.prod.outlook.com>

Hello everyone!  We have an open Process Engineering position in the Micro/Nano technology Center at the University of Louisville.  Please see the link below for details.

https://www.higheredjobs.com/institution/details.cfm?JobCode=176653413&Title=Senior%20Micro%2FNanoTechnology%20Process%20Engineer%20%28Job%20Id%3A%2034550%29&aID=7137


Cheers!

Julia Aebersold
Manager, Micro/Nano Technology Center
University of Louisville
Shumaker Research Building, Room 233
2210 South Brook Street
Louisville, KY  40292
(502) 852-1572

http://louisville.edu/micronano/

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From Vincent.Luciani at nist.gov  Fri Feb 16 15:48:31 2018
From: Vincent.Luciani at nist.gov (Luciani, Vincent (Fed))
Date: Fri, 16 Feb 2018 20:48:31 +0000
Subject: [labnetwork] Oxford ICP helium backside cooling performance
Message-ID: <BY2PR09MB10613D3A404D7A11EE7AD5209CCB0@BY2PR09MB1061.namprd09.prod.outlook.com>

Hello All,

We have 2 Oxford Plasmalab 100 ICP etch tools that are heavily used.  100 mm wafers are the most popular.  I am sure I discussed with many of you the trials and tribulations about these tools.  My question is about a yur experiences and lessons learned with regard to keeping the helium leak rate from underneath the wafer under control.  I am trying to get a general idea of what is typical and how we are doing compared to that.  We have several users that utilize the cryonic etching capability of our tools so the helium cooling is very important.  For those using the tool at -100 C, we find that 8 sccm is too high and users request repair.  We generally try to keep the leak rate < 5 sccm at all time but find this difficult to do with the variety of substrates and etch recipes.  We made some progress by ordering  specially made quartz discs with a cutout for the wafer flat for better wafer positioning.  I am happy to share the dwg if anyone would like it.

What is your experience?  What leak rate do you find tolerable and at what leak rate do you shut the tool down.  Any tricks you can share?


Thanks,
Vince


Vincent K. Luciani
NanoFab Manager
Center for Nanoscale Science and Technology<http://www.cnst.nist.gov/>
National Institute of Standards and Technology
100 Bureau Drive, MS 6201
Gaithersburg, MD 20899-6200 USA
+1-301-975-2886





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From kmcpeak at lsu.edu  Fri Feb 16 17:42:53 2018
From: kmcpeak at lsu.edu (Kevin McPeak)
Date: Fri, 16 Feb 2018 16:42:53 -0600
Subject: [labnetwork] Open Position - LSU Cleanroom Manager
Message-ID: <CAOMeMh-a-YBsO+3v66p2=frEuKA0KgFYnc9YZCQQbT4G+SPMkA@mail.gmail.com>

Dear Colleagues,

I am excited to announce an open position for a cleanroom manager here
at Louisiana State University in Baton Rouge, LA. Please visit the
link below for details.

https://lsu.wd1.myworkdayjobs.com/LSU/job/LSU---Baton-Rouge/Research-Associate-5_R00020670-1

If you know of potential candidates please pass this along. If you are
interested in learning more about the facility don't hesitate to email
me offline.

Regards,
Kevin

-- 
Kevin M. McPeak
Assistant Professor
Louisiana State University
Dept. of Chemical Engineering
110 Chemical Engineering Bldg Room 324
S. Stadium Drive
Baton Rouge, LA  70803
email: kmcpeak at lsu.edu
phone: 225-578-0058


From km at abeamtech.com  Sat Feb 17 01:22:17 2018
From: km at abeamtech.com (Keiko Munechika aBeam)
Date: Fri, 16 Feb 2018 22:22:17 -0800
Subject: [labnetwork] Open positions in Nanofabrication
Message-ID: <014201d3a7b7$a8a66fd0$f9f34f70$@abeamtech.com>

Dear all, 

 

Our company has immediate open positions for Nanofabrication Engineer and
Nanooptics Scientist. 

We are located in Hayward, CA and looking for a good candidate at MS level
or PhD who would like to continue to do nanofabrication. 

 

If you are interested, please contact me off line @ km at abeamtech.com
<mailto:km at abeamtech.com> .  Also, if you know of any potential candidate
for the positions, please pass it along. 

 

Many thanks, 

 

Keiko

 

Keiko Munechika, Ph.D.

Manager, Nanofabrication

aBeam Technologies, Inc. 

Hayward, CA, USA

 <mailto:km at abeamtech.com> km at abeamtech.com

1-(360)-402-4112



 

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From smithanair82 at gmail.com  Mon Feb 19 06:58:34 2018
From: smithanair82 at gmail.com (smitha nair)
Date: Mon, 19 Feb 2018 17:28:34 +0530
Subject: [labnetwork] Oxford ICP helium backside cooling performance
In-Reply-To: <BY2PR09MB10613D3A404D7A11EE7AD5209CCB0@BY2PR09MB1061.namprd09.prod.outlook.com>
References: <BY2PR09MB10613D3A404D7A11EE7AD5209CCB0@BY2PR09MB1061.namprd09.prod.outlook.com>
Message-ID: <CAHbmCzg0N0RuoaMsMz6sKqtVuN989-m9B_-P87hY-mUjbMpPEA@mail.gmail.com>

Hello Vincent,

We have two Oxford ICP RIE tools (No cryo cooling).

On both the tools we face issues with the Helium leak. Most of our users
have smaller sample sizes (manually cut), so we use cool grease to stick
them on the carrier wafer. The helium flow range acceptable is < 8sccm in
these tools and we do not accept anything beyond 10sccm. We address the
issue by an open chamber clean as most of the times we end up having cool
grease on the chuck.  Also if carrier wafer edges are rough or pin holes
present, leak is high and we would change the carrier wafer.

As you mentioned, is it possible to share the dwg file we could also give a
try with quartz wafers.

It would be great to know if these issues are more common to Oxford tool or
is it general?

Regards

Smitha Nair
Technology Manager
National Nanofabrication Centre (NNFC),
Centre for Nano Science and Engineering (CeNSE),
Indian Institute of  Science (IISc),
Bangalore-560012.






On Sat, Feb 17, 2018 at 2:18 AM, Luciani, Vincent (Fed) <
Vincent.Luciani at nist.gov> wrote:

> Hello All,
>
>
>
> We have 2 Oxford Plasmalab 100 ICP etch tools that are heavily used.  100
> mm wafers are the most popular.  I am sure I discussed with many of you the
> trials and tribulations about these tools.  My question is about a yur
> experiences and lessons learned with regard to keeping the helium leak rate
> from underneath the wafer under control.  I am trying to get a general idea
> of what is typical and how we are doing compared to that.  We have several
> users that utilize the cryonic etching capability of our tools so the
> helium cooling is very important.  For those using the tool at -100 C, we
> find that 8 sccm is too high and users request repair.  We generally try to
> keep the leak rate < 5 sccm at all time but find this difficult to do with
> the variety of substrates and etch recipes.  We made some progress by
> ordering  specially made quartz discs with a cutout for the wafer flat for
> better wafer positioning.  I am happy to share the dwg if anyone would like
> it.
>
>
>
> What is your experience?  What leak rate do you find tolerable and at what
> leak rate do you shut the tool down.  Any tricks you can share?
>
>
>
>
>
> Thanks,
>
> Vince
>
>
>
>
>
> Vincent K. Luciani
>
> NanoFab Manager
>
> Center for Nanoscale Science and Technology <http://www.cnst.nist.gov/>
>
> National Institute of Standards and Technology
>
> 100 Bureau Drive, MS 6201
>
> Gaithersburg, MD 20899-6200 USA
>
> +1-301-975-2886
>
>
>
>
>
>
>
>
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
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From ahad.syed at kaust.edu.sa  Mon Feb 19 07:11:26 2018
From: ahad.syed at kaust.edu.sa (Ahad Syed)
Date: Mon, 19 Feb 2018 12:11:26 +0000
Subject: [labnetwork] Cleanroom Staff Scientist Position at KAUST
Message-ID: <1519042286420.56240@kaust.edu.sa>

Dear Colleagues,


The Nanofabrication Core Lab (NCL) at KAUST has an open permanent position for a Staff Scientist to work in the Cleanroom and the Micro-Fluidics Lab. Please visit the links below for details


https://jobs.kaust.edu.sa/TGWebHost/jobdetails.aspx?SID=%5eRfrlBjD8WuAMKlLHw6rECsgef0YYYI3kxzswWkrIk3gWGzOUBYvAa93KYGYinny5&jobId=629038&type=search&JobReqLang=1&recordstart=1&JobSiteId=5182&JobSiteInfo=629038_5182&GQId=0


https://www.linkedin.com/jobs/view/579573957/


Built on the shores of the Red Sea, KAUST is a graduate level university focused on science and technology. The NCL is a part of the KAUST Core Labs, an organization which reports to the Vice-President of Research and whose mission is to provide state-of-the-art facilities, training and services to the KAUST research community, collaborators and industrial partners. The NCL Cleanroom has 2000sqm of class 100 cleanroom space and is fitted with the latest equipment for micro and nanofabrication. Our latest acquisition is a JEOL JBX-6300FX which has a proven capability to print reliable structures down to 7nm. More information about the NCL and its capabilities can be found at


https://corelabs.kaust.edu.sa/nanofabrication/



We offer competitive tax-free salary and outstanding work, living and recreational conditions. The University working language is English and we have an Internal English School (International Baccalaureate) for children on-campus (free of cost). Accommodation (fully-furnished) is provided on-campus.


Please pass this information along to any potential candidates. And if you are interested to learn more about the position or the facility, please don't hesitate to email me offline.



Thank you,

Ahad



--
?Nanofabrication Core Lab
4700 King Abdullah University of Science and Technology
0250-WS02 Building 3, Thuwal 23955-6900, Kingdom of Saudi Arabia
Tel:+966 12 808 2348
Visit The Core Labs<https://corelabs.kaust.edu.sa/visitor-information>

________________________________
This message and its contents including attachments are intended solely for the original recipient. If you are not the intended recipient or have received this message in error, please notify me immediately and delete this message from your computer system. Any unauthorized use or distribution is prohibited. Please consider the environment before printing this email.
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From julia.aebersold at louisville.edu  Mon Feb 19 10:46:58 2018
From: julia.aebersold at louisville.edu (Aebersold,Julia W.)
Date: Mon, 19 Feb 2018 15:46:58 +0000
Subject: [labnetwork] Oxford ICP helium backside cooling performance
In-Reply-To: <BY2PR09MB10613D3A404D7A11EE7AD5209CCB0@BY2PR09MB1061.namprd09.prod.outlook.com>
References: <BY2PR09MB10613D3A404D7A11EE7AD5209CCB0@BY2PR09MB1061.namprd09.prod.outlook.com>
Message-ID: <DM5PR03MB281171E61BFAA59C42FB6C439FC80@DM5PR03MB2811.namprd03.prod.outlook.com>

We emphasize a very clean backside before processing is performed.  Also, if processing has been performed prior to etching on the wafer then it can incur deformational stress that just makes it hard to sit on the chuck without an elevated leak up rate.

We also change the chuck o-rings when the rate starts to climb and perform O2 chamber cleans on a regular basis.

Cheers!

Julia Aebersold
Manager, Micro/Nano Technology Center
University of Louisville
Shumaker Research Building, Room 233
2210 South Brook Street
Louisville, KY  40292
(502) 852-1572

http://louisville.edu/micronano/

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Luciani, Vincent (Fed)
Sent: Friday, February 16, 2018 3:49 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Oxford ICP helium backside cooling performance

Hello All,

We have 2 Oxford Plasmalab 100 ICP etch tools that are heavily used.  100 mm wafers are the most popular.  I am sure I discussed with many of you the trials and tribulations about these tools.  My question is about a yur experiences and lessons learned with regard to keeping the helium leak rate from underneath the wafer under control.  I am trying to get a general idea of what is typical and how we are doing compared to that.  We have several users that utilize the cryonic etching capability of our tools so the helium cooling is very important.  For those using the tool at -100 C, we find that 8 sccm is too high and users request repair.  We generally try to keep the leak rate < 5 sccm at all time but find this difficult to do with the variety of substrates and etch recipes.  We made some progress by ordering  specially made quartz discs with a cutout for the wafer flat for better wafer positioning.  I am happy to share the dwg if anyone would like it.

What is your experience?  What leak rate do you find tolerable and at what leak rate do you shut the tool down.  Any tricks you can share?


Thanks,
Vince


Vincent K. Luciani
NanoFab Manager
Center for Nanoscale Science and Technology<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.cnst.nist.gov_&d=DwMFAg&c=OAG1LQNACBDguGvBeNj18Swhr9TMTjS-x4O_KuapPgY&r=l9C3cuOkWyGd6C0ye_FDTBHMFl4lPXPJztVHQPL_Bao&m=mdoZzuh-iVfW2dkEtxoD3tB5i278Se94ZmSWmOELTeI&s=EaRs0ZZXBmYM6V4o-hRirTnx1nBy5yHN8foZcdY62h4&e=>
National Institute of Standards and Technology
100 Bureau Drive, MS 6201
Gaithersburg, MD 20899-6200 USA
+1-301-975-2886





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From mcwilliamss at mail.smu.edu  Mon Feb 19 12:38:42 2018
From: mcwilliamss at mail.smu.edu (McWilliams, Scott)
Date: Mon, 19 Feb 2018 17:38:42 +0000
Subject: [labnetwork] Technics PlanarEtch IIA/B
Message-ID: <c6fa683793fd4803b7c314a9033d015a@mail.smu.edu>

Hello All, Has anyone used the table top Technics PlanarEtch  IIA/B for oxide and/or nitride deposition?  I understand I can get a deposition module to convert from etch mode to deposition mode.  I would appreciate any input on film quality, ease of use, etc.  Also, if know where I can get the deposition module, please let me know.


Thanks,  Scott
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From fouad.karouta at anu.edu.au  Mon Feb 19 15:39:52 2018
From: fouad.karouta at anu.edu.au (Fouad Karouta)
Date: Mon, 19 Feb 2018 20:39:52 +0000
Subject: [labnetwork] Oxford ICP helium backside cooling performance
In-Reply-To: <DM5PR03MB281171E61BFAA59C42FB6C439FC80@DM5PR03MB2811.namprd03.prod.outlook.com>
References: <BY2PR09MB10613D3A404D7A11EE7AD5209CCB0@BY2PR09MB1061.namprd09.prod.outlook.com>,
 <DM5PR03MB281171E61BFAA59C42FB6C439FC80@DM5PR03MB2811.namprd03.prod.outlook.com>
Message-ID: <81E93B8D-F8B7-4F63-A528-07EE947FAF27@anu.edu.au>

Hi all,
Adding to what others mentioned I lie to add:
We use dedicated 4? Si wafers as carrier trays when etching small piers that are fixed with Dow Corning 340 heat sink paste, we ask the users to limit the paste to sample area iso it is not exposed directly to the plasma.
About the He leak it was less than 2 sccm.
If wafer tray or quartz clamp has a chip the He flow may increase so wafer trays should be exempt of chipping. If quartz clamp is damaged it needs replacement.
Note the wafer tray should be a good thermal conductor otherwise sample temperature may go much higher than electrode temperature especially with high ICP / RF powers.
Regards
Fouad Karouta
ANFF ACT Node, Canberra, Australia

Sent from my iPhone

On 20 Feb 2018, at 3:43 am, Aebersold,Julia W. <julia.aebersold at louisville.edu<mailto:julia.aebersold at louisville.edu>> wrote:

We emphasize a very clean backside before processing is performed.  Also, if processing has been performed prior to etching on the wafer then it can incur deformational stress that just makes it hard to sit on the chuck without an elevated leak up rate.

We also change the chuck o-rings when the rate starts to climb and perform O2 chamber cleans on a regular basis.

Cheers!

Julia Aebersold
Manager, Micro/Nano Technology Center
University of Louisville
Shumaker Research Building, Room 233
2210 South Brook Street
Louisville, KY  40292
(502) 852-1572

http://louisville.edu/micronano/

From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Luciani, Vincent (Fed)
Sent: Friday, February 16, 2018 3:49 PM
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] Oxford ICP helium backside cooling performance

Hello All,

We have 2 Oxford Plasmalab 100 ICP etch tools that are heavily used.  100 mm wafers are the most popular.  I am sure I discussed with many of you the trials and tribulations about these tools.  My question is about a yur experiences and lessons learned with regard to keeping the helium leak rate from underneath the wafer under control.  I am trying to get a general idea of what is typical and how we are doing compared to that.  We have several users that utilize the cryonic etching capability of our tools so the helium cooling is very important.  For those using the tool at -100 C, we find that 8 sccm is too high and users request repair.  We generally try to keep the leak rate < 5 sccm at all time but find this difficult to do with the variety of substrates and etch recipes.  We made some progress by ordering  specially made quartz discs with a cutout for the wafer flat for better wafer positioning.  I am happy to share the dwg if anyone would like it.

What is your experience?  What leak rate do you find tolerable and at what leak rate do you shut the tool down.  Any tricks you can share?


Thanks,
Vince


Vincent K. Luciani
NanoFab Manager
Center for Nanoscale Science and Technology<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.cnst.nist.gov_&d=DwMFAg&c=OAG1LQNACBDguGvBeNj18Swhr9TMTjS-x4O_KuapPgY&r=l9C3cuOkWyGd6C0ye_FDTBHMFl4lPXPJztVHQPL_Bao&m=mdoZzuh-iVfW2dkEtxoD3tB5i278Se94ZmSWmOELTeI&s=EaRs0ZZXBmYM6V4o-hRirTnx1nBy5yHN8foZcdY62h4&e=>
National Institute of Standards and Technology
100 Bureau Drive, MS 6201
Gaithersburg, MD 20899-6200 USA
+1-301-975-2886





_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From Vincent.Luciani at nist.gov  Thu Feb 22 16:15:58 2018
From: Vincent.Luciani at nist.gov (Luciani, Vincent (Fed))
Date: Thu, 22 Feb 2018 21:15:58 +0000
Subject: [labnetwork] Helium leak rate on Oxford RIE
Message-ID: <BY2PR09MB1061EB941203CD609431C4589CCD0@BY2PR09MB1061.namprd09.prod.outlook.com>

Hello All,

Thanks for all the great feedback about the backside helium leak rate on the Oxford tools.  To sum up it sounds like most labs strive to keep it less than 10 sccm  and 6 -12 sccm is a typical range.  It is very helpful to see that what we observe is fairly typical.   We have one process that etches at -100 C with very high RF and ICP power that requires < 5 sccm.  We can get it there for this user but keeping it there is difficult.  For those who asked for the drawings of our modified quartz plate,  I will send that to you individually.   I plan to invest in some mechanical design engineering effort to make these cooled chucks perform better.  I'll share anything we come up with.

Thanks again,

Vince


Vincent K. Luciani
NanoFab Manager
Center for Nanoscale Science and Technology<http://www.cnst.nist.gov/>
National Institute of Standards and Technology
100 Bureau Drive, MS 6201
Gaithersburg, MD 20899-6200 USA
+1-301-975-2886




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From spaolini at cns.fas.harvard.edu  Thu Feb 22 18:14:59 2018
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Thu, 22 Feb 2018 23:14:59 +0000
Subject: [labnetwork] Helium leak rate on Oxford RIE
In-Reply-To: <BY2PR09MB1061EB941203CD609431C4589CCD0@BY2PR09MB1061.namprd09.prod.outlook.com>
References: <BY2PR09MB1061EB941203CD609431C4589CCD0@BY2PR09MB1061.namprd09.prod.outlook.com>
Message-ID: <BY1PR0701MB1723A858AE846A11CE351A0DDFCD0@BY1PR0701MB1723.namprd07.prod.outlook.com>

Hi Vince,
  Sorry for such a late response but I hadn't noticed anyone mentioning the pressure of the cavity behind the wafer. Assuming that your system has that capability, the flow of He should be judged by the backside pressure. As an example, we have many etching systems here with mechanical wafer clamps and we baseline them when new to flow X amount of He for a specified pressure (closed loop system). As you may expect, the flow of He increases as the backside pressure is called to increase. We use this baseline flow as criteria to either change a seal if applicable, clean the wafer backside or clean the chuck if necessary. We have gotten very good with our tool set to have a seal change or chuck clean at PM intervals. Oh yeah, beware of the photo users that neglect edge bead removal after coating, it can cause the wafer to stick to the chuck and when it begins to transfer out, the lift will "pop" it off the chuck and most certainly position it in a bad spot.
  Steve "Equipment Dood" Paolini

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu
www.cns.fas.harvard.edu

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Luciani, Vincent (Fed)
Sent: Thursday, February 22, 2018 4:16 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Helium leak rate on Oxford RIE

Hello All,

Thanks for all the great feedback about the backside helium leak rate on the Oxford tools.  To sum up it sounds like most labs strive to keep it less than 10 sccm  and 6 -12 sccm is a typical range.  It is very helpful to see that what we observe is fairly typical.   We have one process that etches at -100 C with very high RF and ICP power that requires < 5 sccm.  We can get it there for this user but keeping it there is difficult.  For those who asked for the drawings of our modified quartz plate,  I will send that to you individually.   I plan to invest in some mechanical design engineering effort to make these cooled chucks perform better.  I'll share anything we come up with.

Thanks again,

Vince


Vincent K. Luciani
NanoFab Manager
Center for Nanoscale Science and Technology<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.cnst.nist.gov_&d=DwMFAg&c=WO-RGvefibhHBZq3fL85hQ&r=-H4Z_jeDfTYjnKPXor15vLwzBllmg8gFrb9m_k9OGks&m=eV4MYPyzZNXtLwpvNj_ge_JTFFzrUWcRFDWe8LwUlSU&s=Km7eUzO368C8Iuhm32kmTVbbDD2kVN2aK_74cNJvPD4&e=>
National Institute of Standards and Technology
100 Bureau Drive, MS 6201
Gaithersburg, MD 20899-6200 USA
+1-301-975-2886




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From RobertVandusen at cunet.carleton.ca  Fri Feb 23 07:52:52 2018
From: RobertVandusen at cunet.carleton.ca (Robert Vandusen)
Date: Fri, 23 Feb 2018 12:52:52 +0000
Subject: [labnetwork] Mann PG3000 pattern generator question
Message-ID: <YQBPR0101MB2273C1C361C413BDD967A4F491CC0@YQBPR0101MB2273.CANPRD01.PROD.OUTLOOK.COM>

Hi everyone.
I was hoping to find someone who may have experience with the Mann PG1600 or PG3000 pattern generator mask making systems.
In our Microfab we have 2 working David W. Mann pattern generators: a PG1600 and a PG3000.  These units are still working fairly well, but we would like to try adjusting the lens focus
to match up with different size plate holders.
I know according to the manual it is a matter of adjusting the knurled vernier wheel at the top of the lens housing.  I have tried this and there does not seem to be any movement.
I did not want to force in case there is something else that needs to be loosened or lubricated first.
I have tried reaching out to my former contacts from the former Mann company with no luck.


Thanks in advance.
Rob
Robert Vandusen
Microfabrication and FANSSI Cleanlab Facility Manager
Electronics Department
Carleton University
room: 4184 Mackenzie Building
613-520-2600 ext 5761
Robert_vandusen at cunet.carleton.ca<mailto:Robert_vandusen at cunet.carleton.ca>


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From kjvowen at lnf.umich.edu  Fri Feb 23 16:45:26 2018
From: kjvowen at lnf.umich.edu (Kevin Owen)
Date: Fri, 23 Feb 2018 16:45:26 -0500
Subject: [labnetwork] Processing alternatives during extended etch tool
	downtime (LAM 9400)
Message-ID: <CANLyxV10NWpdKrpaiu-w7S4ZZ35bFYzKc9VC_eWjeLLLz7JScA@mail.gmail.com>

Happy Friday, everyone!

We're having some controller issues with our LAM 9400SE and LAM has now
extended us to a 6 week lead time on the board we *hope* will solve the
problem, so in the meantime we are looking for alternative locations for
some of our users to be able to continue their processing. The tool
supports a plethora of processes, many of which we should be able to
transfer in-house to other equipment, but there are some needs we won't be
able to fill. While I don't have any specific requests yet (we only just
notified the users of the extension of the downtime), I suspect the areas
we will need support in will be mostly:

   - pieces, 100, 150 mm Cl/HBr processing (mainly poly-Si)
   - 100-150 mm Cl/BCl3 processing (III-V and III-nitride and maybe a few
   others)

If your lab might be willing to help some of these users (either via remote
processing or sending the user on-site), please let me know what equipment
you have that would support these processes and any material/size/process
restrictions you have for the tools.

For reference, our tool configuration and approved materials are detailed
on our wiki (LAM 9400 <http://lnf-wiki.eecs.umich.edu/wiki/LAM_9400>).
There are some additional materials that may be approved in certain
situations (e.g. buried by PR or another material), but we will be working
with each user individually to determine what process they need and what
other materials are present on their samples in order to direct them
appropriately.

Thanks,
Kevin

-- 
Kevin Owen
Senior Engineer in Research
Operations Group, Lurie Nanofabrication Facility
University of Michigan
(734) 545-4014
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From codreanu at udel.edu  Mon Feb 26 13:49:11 2018
From: codreanu at udel.edu (Iulian Codreanu)
Date: Mon, 26 Feb 2018 13:49:11 -0500
Subject: [labnetwork] reputable vacuum pump re-builders in the NE
Message-ID: <8e08f1f4-876a-d826-f013-313c174557ef@udel.edu>

Dear Colleague,

I am looking for reputable vacuum pump rebuilders in the Northeast. 
Could you recommend anyone?

Thank you very much,

Iulian

-- 
iulian Codreanu, Ph.D.
Director of Operations, UD NanoFab
163 ISE Lab
221 Academy Street
Newark, DE 19716
302-831-2784
http://udnf.udel.edu



From mweiler at andrew.cmu.edu  Mon Feb 26 17:16:01 2018
From: mweiler at andrew.cmu.edu (Mark Weiler)
Date: Mon, 26 Feb 2018 22:16:01 +0000
Subject: [labnetwork] reputable vacuum pump re-builders in the NE
In-Reply-To: <8e08f1f4-876a-d826-f013-313c174557ef@udel.edu>
References: <8e08f1f4-876a-d826-f013-313c174557ef@udel.edu>
Message-ID: <DF3C6A86-C60C-4211-B442-5B468E2E2208@andrew.cmu.edu>

Turbo, Cryo or rough (dry or wet)?

Best,

Mark


________________________________________________________________

Mark Weiler
Fab & Facilites Manager
CMU Nanofabrication Facility
Dept. of Electrical & Computer Engineering
5000 Forbes Avenue
Pittsburgh, PA 15213
P:  412-268-2471
F:  412-268-4323
www.ece.cmu.edu<http://www.ece.cmu.edu>


[cid:2D2E01E3-CEC1-4F48-A845-224D8D7CED12 at wv.cc.cmu.edu] <https://www.linkedin.com/in/marksbasics>
<https://www.linkedin.com/in/marksbasics>

On Feb 26, 2018, at 1:49 PM, Iulian Codreanu <codreanu at udel.edu<mailto:codreanu at udel.edu>> wrote:

Dear Colleague,

I am looking for reputable vacuum pump rebuilders in the Northeast. Could you recommend anyone?

Thank you very much,

Iulian

--
iulian Codreanu, Ph.D.
Director of Operations, UD NanoFab
163 ISE Lab
221 Academy Street
Newark, DE 19716
302-831-2784
http://udnf.udel.edu


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From michael.rooks at yale.edu  Mon Feb 26 17:24:36 2018
From: michael.rooks at yale.edu (Michael Rooks)
Date: Mon, 26 Feb 2018 17:24:36 -0500
Subject: [labnetwork] reputable vacuum pump re-builders in the NE
In-Reply-To: <8e08f1f4-876a-d826-f013-313c174557ef@udel.edu>
References: <8e08f1f4-876a-d826-f013-313c174557ef@udel.edu>
Message-ID: <5A948924.9010805@yale.edu>

We use Orange County Vacuum, aka Standard Vacuum:

Richard Trivolis
Orange County Vacuum
845 283-2800 Cell
www.ocvacuum.com <http://www.ocvacuum.com>


Representing Standard Vacuum
Bohemia,NY.
www.standardvacuum.com <http://www.standardvacuum.com>

They are a good source for rebuilt roughing pumps.


--------------------------------
Michael Rooks
Yale Institute of Nanoscience and Quantum Engineering
nano.yale.edu <http://nano.yale.edu>



On 02/26/2018 01:49 PM, Iulian Codreanu wrote:
> Dear Colleague,
>
> I am looking for reputable vacuum pump rebuilders in the Northeast. 
> Could you recommend anyone?
>
> Thank you very much,
>
> Iulian
>

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From cknollen at stanford.edu  Tue Feb 27 12:58:20 2018
From: cknollen at stanford.edu (Clifford F Knollenberg)
Date: Tue, 27 Feb 2018 17:58:20 +0000
Subject: [labnetwork] EBeam Lithography on Glass substrates
In-Reply-To: <15343E46-7A29-4D8B-AE71-443F450E6D20@upenn.edu>
References: <072A267E-4725-4880-BFCE-CB65EB1B4EB5@uiowa.edu>
 <1f37445b-cd3b-c5ed-c4be-e2e496b7873b@mit.edu>
 <5e7dd2b364944e80bda4f2c16fe6ae94@PGH-MSGMLT-03.andrew.ad.cmu.edu>
 <bce11c8deb964b88b3af10917144278b@uwaterloo.ca>
 <SYXPR01MB21572BC3C7740530EDFBC7D2C0840@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <6C521A5E02323C4CB73135692FB72A8548FB46F4@SRV362.tudelft.net>
 <SYXPR01MB21570B160E1F398D2CC038FAC0850@SYXPR01MB2157.ausprd01.prod.outlook.com>
 <8c9fb7bce4e18cfd0cc2340edcff771a@mail.gmail.com>
 <D0E99571-148D-4668-8BFF-6A3192A5150D@uw.edu>,
 <15343E46-7A29-4D8B-AE71-443F450E6D20@upenn.edu>
Message-ID: <MWHPR02MB260610F51D51AE259895C306B5C00@MWHPR02MB2606.namprd02.prod.outlook.com>

The violet light you see in a plasma is going to be in the range of 380-450nm.  As the reference below shows, PMMA absorption starts at 280nm and doesn't get really get going until 225nm.


That's a pronounced energy difference.  If you really want to get emission below 350nm you need a mercury bulb or an excimer laser.


-Cliff


Clifford Knollenberg

Science & Engineering Associate

Stanford Nano Shared Facilities (SNSF)

Email: cknollen at stanford.edu

Tel: 650-723-1675


________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Noah Clay <nclay at upenn.edu>
Sent: Thursday, August 24, 2017 6:29 PM
To: N . Shane Patrick
Cc: labnetwork at mtl.mit.edu; Ryan Anderson
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Maybe this was mentioned earlier, but PMMA is strongly absorbing below 220 - 225 nm.

http://www.allresist.com/photorestist-other-resists-uv-patterning-of-pmma-resist/
[http://www.allresist.com/wp-content/themes/allresist_en/img/facebook-logo.jpg]<http://www.allresist.com/photorestist-other-resists-uv-patterning-of-pmma-resist/>

Resist-Wiki: UV-patterning of PMMA resists - Allresist EN ...<http://www.allresist.com/photorestist-other-resists-uv-patterning-of-pmma-resist/>
www.allresist.com
PMMA resists can also be patterned using UV-lithography, but only at exposure wavelengths of 200 ? 270 nm (deep UV light).




Sent from my iPhone

On Aug 24, 2017, at 15:41, N . Shane Patrick <patricns at uw.edu<mailto:patricns at uw.edu>> wrote:

We use sputtered Au/Pd exclusively here as a charge dissipation layer and have not seen any adverse effects. Our system for this is a very basic tabletop coater system that runs on 120V and takes maybe 2 minutes of sputtering to get a sufficient coating for our cases. Perhaps power/duration are important to consider.

N. Shane Patrick
Research Engineer, Washington Nanofabrication Facility (WNF)
National Nanotechnology Coordinated Infrastructure (NNCI)
University of Washington
Fluke Hall 132, Box 352143
(206) 221-1045
patricns at uw.edu<mailto:patricns at uw.edu>
http://www.wnf.washington.edu/
UW NNCI Washington Nanofabrication Facility<http://www.wnf.washington.edu/>
www.wnf.washington.edu
Nanofabrication Short Course We're pleased to offer a one-week survey course that introduces key nanofabrication techniques, tools and methods from March 19-23.



On Aug 24, 2017, at 10:50 AM, Ryan Anderson <ryan at eng.ucsd.edu<mailto:ryan at eng.ucsd.edu>> wrote:

Hi all,

We have also observed adverse effects on PMMA exposure (100kV) after
sputter coating gold.  Since then we have used thermal evaporation.

Ryan Anderson
UC San Diego, Nano3


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
Sent: Wednesday, August 23, 2017 4:15 PM
To: Marc Zuiddam - TNW <M.R.Zuiddam at tudelft.nl<mailto:M.R.Zuiddam at tudelft.nl>>; 'labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>'
<labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Dear Marc,

Evaporating Au on PMMA or ZEP should be done in a thermal evaporator, an
e-beam evaporator due to the electron beam would affect the resist. We
also avoid sputtering for this application as the effect of Ar plasma
(violet colour) can be unpredictable.

Regards, Fouad

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Marc Zuiddam - TNW
Sent: Wednesday, 23 August 2017 10:29 PM
To: 'labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>' <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Dear people,

I always have the idea that sputting/evaporating a thin Au layer on my
sample is exposing the e-beam resist on my sample.. Do you also experience
that?

Regards, Marc Zuiddam

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fouad Karouta
Sent: woensdag 23 augustus 2017 1:42
To: Jugessur, Aju S; labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

Am echoing other voices:
- We use 12 nm of Au mostly on top of PMMA/ZEP to do the EBL which we
remove in a Ki/I2 solution.
- Sometime we use Cr under resist layer as well when we need Cr for
further processing.

Regards, Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility Research School of Physics and
Engineering L. Huxley Building (#56), Mills Road, Room 4.02 Australian
National University ACT 0200, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au<mailto:fouad.karouta at anu.edu.au>
http://anff-act.anu.edu.au/
[http://anff-act.anu.edu.au/Images/sidebar/ANFF_network.jpg]<http://anff-act.anu.edu.au/>

ANFF ACT & WA Nodes - Home<http://anff-act.anu.edu.au/>
anff-act.anu.edu.au
Welcome to ANFF ACT & WA Nodes . Our Mission "To offer a state-of-the-art facility and processing capabilities open to all scientists and researchers in Australia and ...




-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Lino Eugene
Sent: Tuesday, 22 August 2017 11:49 PM
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Cc: Steven Wei <c27wei at edu.uwaterloo.ca<mailto:c27wei at edu.uwaterloo.ca>>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have a coop student who has worked on different anti-charging
materials: PEDOT:PSS, Electra 92 and sputtered Al.

We had also adhesion and uniformity issues with PEDOT:PSS from
Sigma-Aldrich. The solution was filtered and Triton X-100 was added and
but no noticeable improvement. I was told that surface treatment with
SurPass 3000 improves adhesion but we haven't tried this yet. Moreover,
PEDOT:PSS cross-links under certain conditions and then the layer cannot
be removed with water.

10-20 nm of sputtered Al should work well . The resistivity of 5 nm Al is
expected to be high because of surface electron scattering (electron mean
free path in Al at room temperature is ~19nm) and oxidation. We use MF-319
at room temperature or 40 degC  to remove the layer.

Electra 92 from AllResist is easy to work with as it can be removed with
DI water after EBL and gives pretty good results on PMMA and on ZEP520A.
Surface treatment on HSQ is needed, so far treatment with IPA gives good
results. Also, the price is reasonable compared to ESpacer and AquaSave.

Best,

Lino Eugene, Ph.D., Jr. Eng.
Micro/nanofabrication process engineer
Quantum NanoFab
University of Waterloo
200 University Avenue West
Waterloo, ON, Canada
N2L 3G1

Ph: +1 519-888-4567 #37788
Cell: +1 226-929-1685
Website: https://fab.qnc.uwaterloo.ca/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck
Sent: August 21, 2017 21:09
To: Mark K Mondol <mondol at mit.edu<mailto:mondol at mit.edu>>; labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Hi Aju,

We have commonly used Al as a conductive layer on top of PMMA on glass
(removal is typically done with minimal damage by using dilute AZ400K
photoresist developer).  However, 5nm seems to be on the thin side.  Al
can form native oxide that is up to 3-4nm thick.  Therefore, I would
confirm the answer to Mark's question of whether or not the 5nm Al layer
is conductive.  We typically sputter deposit films that are 10-20nm thick
for our applications.

Best Regards,

Matt

--
Matthew T. Moneck, Ph.D.
Executive Manager, Carnegie Mellon Nanofabrication Facility Electrical and
Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu<http://www.ece.cmu.edu>
Electrical and Computer Engineering at Carnegie Mellon ...<http://www.ece.cmu.edu/>
www.ece.cmu.edu
ECE is a department of the Carnegie Institute of Technology at Carnegie Mellon University.



nanofab.ece.cmu.edu<http://nanofab.ece.cmu.edu>
Nanofabrication Laboratory at Carnegie Mellon University<http://nanofab.ece.cmu.edu/>
nanofab.ece.cmu.edu
Nanofabrication Laboratory at Carnegie Mellon University. A lab of the Electrical and Computer Engineering Department.





-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>
[mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Mark K Mondol
Sent: Monday, August 21, 2017 5:04 PM
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] EBeam Lithography on Glass substrates

Aju:

1. Be 100% certain the layer is conductive and connected to ground in the
tool.

2. Every time they write on glass, do the same exposure on Si, if the
problem shows up on both Si and glass the issue is not the insulating
substrate.

3. Al etch can damage PMMA; not always in a repeatable way. Does your
process include etching the Al (I have found Transene CR-7 chrome etch to
be compatible with PMMA and ZEP, so usually use Cr not Al as the
conductive layer).

Regards,

Mark K MOndol

--
Mark K Mondol
Assistant Director NanoStructures Laboratory And Facility Manager Scanning
Electron Beam Lithography Facility Bldg 36  Room 229 www.rle.mit.edu/sebl<http://www.rle.mit.edu/sebl>
RLE :: SEBL at RLE :: MIT's Scanning-Electron-Beam ...<http://www.rle.mit.edu/sebl>
www.rle.mit.edu
T he scanning-electron-beam lithography (SEBL) facility enables the writing of patterns of arbitrary geometries with minimum features as fine as 17 nm.



mondol at mit.edu<mailto:mondol at mit.edu> office - 617-253-9617 cell - 617-224-8756


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From rdevito at draper.com  Tue Feb 27 13:04:34 2018
From: rdevito at draper.com (DeVito, Richard)
Date: Tue, 27 Feb 2018 18:04:34 +0000
Subject: [labnetwork] reputable vacuum pump re-builders in the NE
In-Reply-To: <8e08f1f4-876a-d826-f013-313c174557ef@udel.edu>
References: <8e08f1f4-876a-d826-f013-313c174557ef@udel.edu>
Message-ID: <00421bcdc63a4714916ab275f1aad5cd@draper.com>

Iulian

 we do a lot of work with Ebara...they rebuild other as well as their pumps-quality work

Rich D


Rich DeVito
Principle Member Technical Staff
Group Leader Microfabrication Lab
Draper
555 Technology Square,
Cambridge, MA 02139
Phone:  617-258-3819
www.draper.com



-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Iulian Codreanu
Sent: Monday, February 26, 2018 1:49 PM
To: Fab Network <labnetwork at mtl.mit.edu>
Subject: [labnetwork] reputable vacuum pump re-builders in the NE

Dear Colleague,

I am looking for reputable vacuum pump rebuilders in the Northeast.
Could you recommend anyone?

Thank you very much,

Iulian

--
iulian Codreanu, Ph.D.
Director of Operations, UD NanoFab
163 ISE Lab
221 Academy Street
Newark, DE 19716
302-831-2784
http://udnf.udel.edu


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________________________________


From jpalmer at Princeton.EDU  Tue Feb 27 15:15:57 2018
From: jpalmer at Princeton.EDU (Joseph E. Palmer)
Date: Tue, 27 Feb 2018 15:15:57 -0500
Subject: [labnetwork] reputable vacuum pump re-builders in the NE
In-Reply-To: <8e08f1f4-876a-d826-f013-313c174557ef@udel.edu>
References: <8e08f1f4-876a-d826-f013-313c174557ef@udel.edu>
Message-ID: <af880646-4516-6dcd-f6a3-73ed72e490cf@exchange.princeton.edu>

I use PolVac, and have been very happy with them.
http://www.polvac.com/

Regards,

Joe Palmer

On 2/26/2018 1:49 PM, Iulian Codreanu wrote:
> Dear Colleague,
>
> I am looking for reputable vacuum pump rebuilders in the Northeast. 
> Could you recommend anyone?
>
> Thank you very much,
>
> Iulian
>



From nadia.court at sydney.edu.au  Tue Feb 27 23:24:14 2018
From: nadia.court at sydney.edu.au (Nadia Court)
Date: Wed, 28 Feb 2018 04:24:14 +0000
Subject: [labnetwork] Micro- and Nano-fab job opportunities in Sydney
Message-ID: <A3DE1398-B254-45E3-908C-3E116A56648B@sydney.edu.au>

Dear All,

The University of Sydney is continuing to grow it?s micro and nanofabrication facility and we are looking for more skilled staff to join our team.

This is a great opportunity to contribute to the building of this new facility in a purpose-built state-of-the-art cleanroom in the Sydney Nanoscience Hub<http://sydney.edu.au/nano/hub/index.shtml>, the home of the University of Sydney Nano Institute<http://sydney.edu.au/nano/>. The facility is one of the University?s Core Research Facilities<http://sydney.edu.au/research/facilities.html>, and part of the Australian National Fabrication Facility<http://www.anff.org.au/> network.

It?s an exciting time as the Hub and cleanroom are very new and about a third of the equipment is installed and running, with new tools arriving regularly.

We are currently recruiting into two positions, and applications for both close on Sunday 11 March 2018.

Cleanroom Technical Officer<https://sydney.nga.net.au/cp/index.cfm?event=jobs.checkJobDetailsNewApplication&returnToEvent=jobs.listJobs&jobid=42B25339-4C84-4B39-B8AD-A88800DF11B3&CurATC=EXT&CurBID=949319BC-8898-4F11-AC4B-9DB401358504&JobListID=731bade1-6333-ccb4-725f-88e75150540a&jobsListKey=b8bf7705-1e77-4601-9516-590c8eae16c9&persistVariables=CurATC,CurBID,JobListID,jobsListKey,JobID&lid=23272100138>

Process Engineer: Optical Lithography<https://sydney.nga.net.au/cp/index.cfm?event=jobs.checkJobDetailsNewApplication&returnToEvent=jobs.listJobs&jobid=57A67414-41AD-49D3-B81A-A88800FFE6E0&CurATC=EXT&CurBID=949319BC-8898-4F11-AC4B-9DB401358504&JobListID=731bade1-6333-ccb4-725f-88e75150540a&jobsListKey=b8bf7705-1e77-4601-9516-590c8eae16c9&persistVariables=CurATC,CurBID,JobListID,jobsListKey,JobID&lid=23272100158>

Unfortunately, we are unable to provide visa sponsorship for this position. However, if you have the right to work in Australia through other means we encourage you to apply.

Kind Regards,

Nadia

Dr Nadia Court
Facility and Program Manager | Research & Prototype Foundry
Core Research Facilities | Research Portfolio
The University of Sydney
Rm 4025, Sydney Nanoscience Hub  A31 | The University of Sydney | NSW | 2006
T +61 2 8627 8671
E nadia.court at sydney.edu.au<mailto:nadia.court at sydney.edu.au>  | W Sydney's <http://sydney.edu.au/research/support/facilities.shtml> Core Research Facilities <http://sydney.edu.au/research/support/facilities.shtml>
ANFF OptoFab: www.anff.org.au<http://www.anff.org.au/>
CRICOS 00026A
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