[labnetwork] dicing III-V materials

[Fouad Karouta]

Hi Kurt,
You should consider having a kind of filter and treat the solid waste as hazardous and dispose off correctly.
Note III-V are easy to cleave hence am not sure the reason behind to use a diving saw.
Best regards
Fouad Karouta

On 1 Dec 2018, at 11:59 am, Kurt Kupcho <kurt.kupcho at wisc.edu<mailto:kurt.kupcho at wisc.edu>> wrote:

Hi all

We have a few dicing saws here that we are starting to get requests for dicing materials like InAs, InP, InGaAsP, etc.  My question is about safety during dicing, like worries about airborne particles being breathed in.  Our saws have water spray and exhaust to mitigate this but normally meant for Si is this sufficient for the III-V materials as well?  My other question is the waste water with wafer dust.  If you do allow dicing of these III-V materials what do you do if anything about the water with wafer dust going down the drain?  Anything?  Some sort of trap?

Your responses are much appreciated!

Thank you - Kurt


---------------------------------------------------
Kurt Kupcho
Process Engineer/Safety Officer

NFC
1550 Engineering Drive
ECB Room 3110
Madison, WI  53706

E:  kurt.kupcho at wisc.edu<mailto:kurt.kupcho at wisc.edu>
T:  608-262-2982

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