[labnetwork] IP-Dip Resist Properties (Nanoscribe)

[Michael Khbeis]

Norman,

We have sputtered materials on Nanoscribe resists without issues. We UV cure it when writing shells, but no other bake out needed. 

Thanks, 

Dr. Michael Khbeis
Director, Washington Nanofabrication Facility (WNF) 
National Nanotechnology Coordinated Infrastructure (NNCI)
University of Washington
Fluke Hall, Box 352143
(O) 206.543.5101
(F) 206.221.1681
(C) 443.254.5192
khbeis at uw.edu
www.wnf.washington.edu/

> On Oct 22, 2018, at 11:18 AM, Norman Gottron <ngottron at andrew.cmu.edu> wrote:
> 
> Hello All,
>  
> I would like to reach out to the community to see if anyone has experience working with IP-Dip resist in vacuum.  We have users who are requesting to sputter films on top of structures printed in a Nanoscribe 3D printing system, but I haven’t been able to get a lot of information about the vacuum properties of IP-Dip.  I’m somewhat concerned since it looks like this material is not prebaked in the normal process.  Does anyone have experience processing this material in vacuum deposition chambers?  I’d be interested to know if there are outgassing issues or other compatibility concerns.
>  
> Regards,
>  
> Norman Gottron
> Process Engineer, Carnegie Mellon University Nanofabrication Facility
> Electrical and Computer Engineering | Carnegie Mellon University
> 5000 Forbes Ave
> Pittsburgh, PA 15213
> Phone: 412-268-4205
> www.ece.cmu.edu <http://www.ece.cmu.edu/>
> www.nanofab.ece.cmu.edu <http://www.nanofab.ece.cmu.edu/>
>  
>  
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