[labnetwork] Wafer specification requirement for RIE & DRIE cleaning recopies

[Shimon Eliav]

Hi Srinivasa,

Answering your questions, following our experience:

1.      We use Sapphire wafers as carriers. They have good heat conductance and can be used for many many times.

2.      Also for cleaning we use a Sapphire wafer. They are more expensive than Si, but can be used indefinitely and provides a better cleaning process.

Regards,

Shimon
The Hebrew University of Jerusalem
The Unit for Nano Fabrication
ISRAEL

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Srinivasa Reddy
Sent: Thursday, 4 April 2019 8:42
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Wafer specification requirement for RIE & DRIE cleaning recopies

HI,
I'm Srinivasa Reddy, Manger, Microfabrication Lab, Indian Institute of Technology, Madras, Chennai.
This is regarding Wafers specifications for Dummy wafers for RIE & DRIE process.
1. Some times we stick small prices to full 4 inch wafer and do the etching process.
Currently we are using Prime Wafers ( which costly) and I'm looking to replace with Mechanical grade or Test grade wafers.
2. We also do chamber cleaning runs with the wafers and this also consumes significant number of wafers. Here also want to replace the Prime wafer with Test or Mechanical grade wafer.

I've doubt about the Bending/Warping or TTV or backside roughness of the wafer and It may lead to higher helium leak rate and process may abort.
Could some one throw light on this issue


Thanks & Regards
Srinivasa Reddy Kuppireddi
Project Manager
Center for NEMS & Nano Photonics (CNNP)
ESB 225, Dept. of Electrical Engineering
Indian Institute of Technology(IIT) Madras
Chennai-600036, Indian
+91 44 2257 5493 (O)
+91 789 326 8010(M)
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