[labnetwork] Metallization on rough ceramic substrates

[ADITHI U]

Dear All,


      We are having difficulties in doing metal(Ti/Pt) lift off on ceramic substrates. Does any of you have experience on fabricating metal patterns on the rough Ceramic Substrates. Below are the details of the process done.


   The roughness of the ceramic substrates were approximately 400nm. We had used HMDS as adhesion promoter for lithography, the thickness of the Photoresist was ~ 1.5um.The thickness of the Ti/Pt layer was ~ 250nm.  Immediately after lithography the deposition was done  followed by 48 hours of lift off(Acetone) process. Ultrasonication(5-10mins) in Acetone was done after 48hours.

Best Regards


Adithi.U
Senior Facility Technologist,
National Nano Fabrication Centre,
CeNSE, Indian Institute of Science
Bangalore

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