From pfluegl at pendar.tech  Wed May  1 10:27:34 2019
From: pfluegl at pendar.tech (Christian Pfluegl)
Date: Wed, 1 May 2019 14:27:34 +0000
Subject: [labnetwork] gas installation
Message-ID: <DM6PR06MB51471EB7BF3B951978192C2FA33B0@DM6PR06MB5147.namprd06.prod.outlook.com>

Hi all,

We are installing a RIE system with the following gases: CF4, O2, Ar.
I was hoping to get some advice on the gas panels for those gases. We are planning on only buying single-stage regulators for all the gas lines.
Are single stage regulators sufficient for this or do you recommend to add purge circuits or other features to avoid contamination of the gas lines during maintenance (e.g. cylinder exchange).

Thanks,

Christian

Dr. Christian Pfluegl
Pendar Technologies LLC
tel.: (857) 413-9339
www.pendartechnologies.com<http://www.pendartechnologies.com/>

[cid:30e4bce8-ff64-4988-b73c-dcd37ceee0b7]

CONFIDENTIALITY NOTICE: This message contains confidential/business sensitive information and is intended only for the individual(s) addressed in the message. If you are not the named addressee, you should not disseminate, distribute, or copy this e-mail. If you are not the intended recipient, you are notified that disclosing, distributing, or copying this e-mail is strictly prohibited.

This message may also contain Technical Information Not Releasable to Foreign Persons or Representatives of a Foreign Government / Company per ITAR Regulations.



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From sieb at 4dlabs.ca  Wed May  1 16:30:53 2019
From: sieb at 4dlabs.ca (Nathanael Sieb)
Date: Wed, 1 May 2019 13:30:53 -0700
Subject: [labnetwork] gas installation
In-Reply-To: <DM6PR06MB51471EB7BF3B951978192C2FA33B0@DM6PR06MB5147.namprd06.prod.outlook.com>
References: <DM6PR06MB51471EB7BF3B951978192C2FA33B0@DM6PR06MB5147.namprd06.prod.outlook.com>
Message-ID: <1f1dea57-449e-b991-2096-3ec4ab653f31@4dlabs.ca>

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From spaolini at cns.fas.harvard.edu  Thu May  2 07:25:22 2019
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Thu, 2 May 2019 11:25:22 +0000
Subject: [labnetwork] gas installation
In-Reply-To: <DM6PR06MB51471EB7BF3B951978192C2FA33B0@DM6PR06MB5147.namprd06.prod.outlook.com>
References: <DM6PR06MB51471EB7BF3B951978192C2FA33B0@DM6PR06MB5147.namprd06.prod.outlook.com>
Message-ID: <BL0PR07MB40045D2AC5974D023254D69BDF340@BL0PR07MB4004.namprd07.prod.outlook.com>

Christian,

  You can use single stage regulators for this. Please see me the next time you are at Harvard and I will explain how to set this up.

    Steve  Paolini


________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Christian Pfluegl <pfluegl at pendar.tech>
Sent: Wednesday, May 1, 2019 11:27 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] gas installation


Hi all,



We are installing a RIE system with the following gases: CF4, O2, Ar.

I was hoping to get some advice on the gas panels for those gases. We are planning on only buying single-stage regulators for all the gas lines.

Are single stage regulators sufficient for this or do you recommend to add purge circuits or other features to avoid contamination of the gas lines during maintenance (e.g. cylinder exchange).



Thanks,



Christian



Dr. Christian Pfluegl

Pendar Technologies LLC

tel.: (857) 413-9339

www.pendartechnologies.com<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.pendartechnologies.com_&d=DwMFAg&c=WO-RGvefibhHBZq3fL85hQ&r=-H4Z_jeDfTYjnKPXor15vLwzBllmg8gFrb9m_k9OGks&m=qbvYD5vjciEUfSff_xbrCFv8vM0-4l9C-NDweGBOTWc&s=N-2e0C8z-_UbvZLJuhxImlv1LpVNrQV9YzrjV1Z8SbI&e=>



[cid:30e4bce8-ff64-4988-b73c-dcd37ceee0b7]



CONFIDENTIALITY NOTICE: This message contains confidential/business sensitive information and is intended only for the individual(s) addressed in the message. If you are not the named addressee, you should not disseminate, distribute, or copy this e-mail. If you are not the intended recipient, you are notified that disclosing, distributing, or copying this e-mail is strictly prohibited.



This message may also contain Technical Information Not Releasable to Foreign Persons or Representatives of a Foreign Government / Company per ITAR Regulations.





CONFIDENTIALITY NOTICE: This message contains confidential information and is intended only for the individual(s) addressed in the message. If you are not the named addressee, you should not disseminate, distribute, or copy this e-mail. If you are not the intended recipient, you are notified that disclosing, distributing, or copying this e-mail is strictly prohibited.
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From julia.aebersold at louisville.edu  Thu May  2 10:46:51 2019
From: julia.aebersold at louisville.edu (Aebersold,Julia W.)
Date: Thu, 2 May 2019 14:46:51 +0000
Subject: [labnetwork] gas installation
In-Reply-To: <1f1dea57-449e-b991-2096-3ec4ab653f31@4dlabs.ca>
References: <DM6PR06MB51471EB7BF3B951978192C2FA33B0@DM6PR06MB5147.namprd06.prod.outlook.com>
 <1f1dea57-449e-b991-2096-3ec4ab653f31@4dlabs.ca>
Message-ID: <MWHPR03MB2734B989D27D6E9140269EA886340@MWHPR03MB2734.namprd03.prod.outlook.com>

We also have gas panels from AES for our non-cabineted gases that allow for purging during cylinder changes.  We also have their cabinets for the nasty ones, too.  Great people to work with and very nice.

Cheers!

Julia Aebersold
Manager, Micro/Nano Technology Center
University of Louisville
Shumaker Research Building, Room 233
2210 South Brook Street
Louisville, KY  40292
(502) 852-1572

http://louisville.edu/micronano/

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Nathanael Sieb
Sent: Wednesday, May 1, 2019 4:31 PM
To: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] gas installation


Hi Christian,

We use gas panels from Applied Energy Systems for our process gases (incl. CF4, O2, Ar).  We have manual panels with N2 purge circuits to avoid contamination during cylinder exchanges.  It has worked well for us so far!

Thanks,
Nathanael
On 2019-05-01 7:27 a.m., Christian Pfluegl wrote:
Hi all,

We are installing a RIE system with the following gases: CF4, O2, Ar.
I was hoping to get some advice on the gas panels for those gases. We are planning on only buying single-stage regulators for all the gas lines.
Are single stage regulators sufficient for this or do you recommend to add purge circuits or other features to avoid contamination of the gas lines during maintenance (e.g. cylinder exchange).

Thanks,

Christian

Dr. Christian Pfluegl
Pendar Technologies LLC
tel.: (857) 413-9339
www.pendartechnologies.com<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.pendartechnologies.com_&d=DwMF-g&c=OAG1LQNACBDguGvBeNj18Swhr9TMTjS-x4O_KuapPgY&r=l9C3cuOkWyGd6C0ye_FDTBHMFl4lPXPJztVHQPL_Bao&m=DBcptvjr9cm2D2tplNVNY51OR3i_XyRLDIWZNQBVb-U&s=lTxxAmq7TUjOlq4BxBhBgzpoJR630TWZKNZGZiyT8Ow&e=>

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This message may also contain Technical Information Not Releasable to Foreign Persons or Representatives of a Foreign Government / Company per ITAR Regulations.



CONFIDENTIALITY NOTICE: This message contains confidential information and is intended only for the individual(s) addressed in the message. If you are not the named addressee, you should not disseminate, distribute, or copy this e-mail. If you are not the intended recipient, you are notified that disclosing, distributing, or copying this e-mail is strictly prohibited.



_______________________________________________

labnetwork mailing list

labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>

https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork<https://urldefense.proofpoint.com/v2/url?u=https-3A__mtl.mit.edu_mailman_listinfo.cgi_labnetwork&d=DwMF-g&c=OAG1LQNACBDguGvBeNj18Swhr9TMTjS-x4O_KuapPgY&r=l9C3cuOkWyGd6C0ye_FDTBHMFl4lPXPJztVHQPL_Bao&m=DBcptvjr9cm2D2tplNVNY51OR3i_XyRLDIWZNQBVb-U&s=PumezCgoHCgH66TLs0Z6jdwLSR1VDPp3obDHRzGuk3s&e=>

________________________________
Nathanael Sieb
Director of Operations and Administration


4D LABS, Simon Fraser University    8888 University Drive, Burnaby, B.C. V5A 1S6

E sieb at 4dlabs.ca<mailto:sieb at 4dlabs.ca> T 778.782.8084 F 778.782.3765 W www.4dlabs.ca<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.4dlabs.ca&d=DwMF-g&c=OAG1LQNACBDguGvBeNj18Swhr9TMTjS-x4O_KuapPgY&r=l9C3cuOkWyGd6C0ye_FDTBHMFl4lPXPJztVHQPL_Bao&m=DBcptvjr9cm2D2tplNVNY51OR3i_XyRLDIWZNQBVb-U&s=2wmRw5SwQqG39aEh7tQQgSE-IzYejfN_8D4C4pTTY_g&e=>

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From nclay at seas.upenn.edu  Thu May  2 12:22:32 2019
From: nclay at seas.upenn.edu (Noah Clay)
Date: Thu, 2 May 2019 12:22:32 -0400
Subject: [labnetwork] ENRIS 2019 at University of Twente - June 16-18, 2019.
Message-ID: <413A9FF6-B2FD-4B5E-A151-0DE29062741D@seas.upenn.edu>

Dear Colleagues,

This is a reminder that ENRIS 2019 (https://www.enris2019.com <https://www.enris2019.com/>) will be held from June 16-18, 2019 at University of Twente in the Netherlands.

There?s a very strong technical program, keynote speaker lineup and sponsorship support of the conference.  

Please remember to register soon and plan your networking opportunities in advance!  

Kind regards,
Noah Clay

Noah Clay
Director, Quattrone Nanofabrication Facility
Singh Center for Nanotechnology
University of Pennsylvania
Philadelphia, PA

Steering Committee Member
UGIM, ENRIS

(215) 898-9308
nclay at upenn.edu <mailto:nclay at upenn.edu>
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From optotinker at yahoo.com  Thu May  2 12:45:36 2019
From: optotinker at yahoo.com (Opto Tinker)
Date: Thu, 2 May 2019 16:45:36 +0000 (UTC)
Subject: [labnetwork] Harbor Freight Air Compressor for a FT-IR Purging Gas
	Generator
References: <470323455.3472491.1556815536028.ref@mail.yahoo.com>
Message-ID: <470323455.3472491.1556815536028@mail.yahoo.com>

Hi,
? We are getting an FT-IR spectrometer and a purging gas generator. The purging gas generator has max inlet pressure of 125 psi. The Harbor Freight we are looking at has a pressure of 150 psi. Is there any downside for using that? Do we need additional filters etc.?

Thanks!
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From emil.piscani at viavisolutions.com  Fri May  3 10:49:49 2019
From: emil.piscani at viavisolutions.com (Emil Piscani)
Date: Fri, 3 May 2019 14:49:49 +0000
Subject: [labnetwork] Microwave curing station for thick film resist -
 Microcure 2100 systems
Message-ID: <MWHPR18MB1197485121ADE7439C72996CF2350@MWHPR18MB1197.namprd18.prod.outlook.com>

Hi All,

I am investigating the curing of thick film resist with Microwaves.
I read a promising paper about the use of Microcure 2100 VFM System (Variable Frequency Microwave) for SU-8, and am hoping to validate the method with our materials.

Has anyone else attempted this avenue of processing?
Are there any university researchers working with/have access to a Microcure system?

Best Regards,
Emil
piscaniec at gmail.com

Emil C. Piscani
RPC Photonics, Inc.
330 Clay Road
Rochester, NY 14623
Office: 585-743-1068
episcani at rpcphotonics.com<mailto:episcani at rpcphotonics.com>
emil.piscani at viavisolutions.com

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From tobi at stanford.edu  Fri May  3 11:46:35 2019
From: tobi at stanford.edu (Tobi Beetz)
Date: Fri, 3 May 2019 15:46:35 +0000
Subject: [labnetwork] Open Positions at Stanford Nano Shared Facilities
Message-ID: <BYAPR02MB581373C4EA9123B3EAF7BA05A7350@BYAPR02MB5813.namprd02.prod.outlook.com>

Dear All - please help us spread the word about our open positions:

Cleanroom Science & Engineering Associate
The Stanford Nano Shared Facilities (SNSF) is seeking a Cleanroom Science & Engineering Associate to support research operations within the Stanford Nanopatterning and Flexible Cleanrooms. The successful candidate will support the day-to-day operations, and maintenance of a number of fabrication and characterization instruments within the cleanrooms.  S(he) will provide training and support to researchers. The Cleanroom Science & Engineering Associate will report to the Associate Director of SNSF.
https://careersearch.stanford.edu/jobs/clean-room-science-engineering-associate-6422

Electron Beam Lithography Manager
The Stanford Nano Shared Facilities (SNSF) is seeking an Electron Beam Lithography (EBL) scientist to lead the operations of the facilities' Raith 150 EBL system, located at the Stanford Nanofabrication Facility (SNF), lead the operations of a new EBL system, as well as assist with the JEOL 6300FS EBL system, both located at SNSF.  The successful candidate will manage the day-to-day operations, and maintenance of the instruments.  S(he) will provide training and support to researchers, develop and implement advanced techniques and also be involved in planning for upgrades and new equipment. The EBL manager will report to the Associate Director of SNSF.
https://careersearch.stanford.edu/jobs/electron-beam-lithography-manager-4055

Tobi

Tobi Beetz, Ph.D., Associate Director, Stanford Nano Shared Facilities, Stanford University
348 Via Pueblo, Spilker Building, Room 105, Stanford, CA 94305-4088, 650-644-9541, http://snsf.stanford.edu<http://snsf.stanford.edu/>

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From kmcpeak at lsu.edu  Fri May  3 21:24:55 2019
From: kmcpeak at lsu.edu (Kevin M McPeak)
Date: Sat, 4 May 2019 01:24:55 +0000
Subject: [labnetwork] Oxford PC2000 software for ICP100
Message-ID: <DM5PR06MB2571D66CE707291AAE369B14B0360@DM5PR06MB2571.namprd06.prod.outlook.com>

Dear Colleagues,

Does anyone have a copy of an old version (Black PLC) of Oxford's PC2000 software?

Our WinXP machine running the PC2000 software died this week and we can not find the original disk. Our PC2000 software was controlling an Oxford ICP100 with a black PLC (that is the older PLC which is not upgradeable).

Any help here is most appreciated.

Regards,
Kevin
--
Assistant Professor
Department of Chemical Engineering
Director LSU Nanofabrication Facility
225.578.0058
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From kjvowen at lnf.umich.edu  Sat May  4 09:36:45 2019
From: kjvowen at lnf.umich.edu (Kevin Owen)
Date: Sat, 4 May 2019 09:36:45 -0400
Subject: [labnetwork] Oxford PC2000 software for ICP100
In-Reply-To: <DM5PR06MB2571D66CE707291AAE369B14B0360@DM5PR06MB2571.namprd06.prod.outlook.com>
References: <DM5PR06MB2571D66CE707291AAE369B14B0360@DM5PR06MB2571.namprd06.prod.outlook.com>
Message-ID: <CANLyxV0HV7uXp-ZexsFQWQaF-c6_eOVwhyC2+WB4eeodqz+NRA@mail.gmail.com>

Kevin,

Do you know what part of the computer "died"? If the hard drive is still
functional (or if you have a backup image of it), you should be able to
drop it into a new computer and run a repair using a WinXP CD to fix any
hardware discrepancies. If the hard drive is shot, well, I'll have to look
on Monday to see what model PLC our Oxford is running (and whether we have
the software CD, or could provide you with an image of our hard drive).

-Kevin

On Sat, May 4, 2019 at 8:49 AM Kevin M McPeak <kmcpeak at lsu.edu> wrote:

> Dear Colleagues,
>
> Does anyone have a copy of an old version (Black PLC) of Oxford's PC2000
> software?
>
> Our WinXP machine running the PC2000 software died this week and we can
> not find the original disk. Our PC2000 software was controlling an Oxford
> ICP100 with a black PLC (that is the older PLC which is not upgradeable).
>
> Any help here is most appreciated.
>
> Regards,
> Kevin
> --
> Assistant Professor
> Department of Chemical Engineering
> Director LSU Nanofabrication Facility
> 225.578.0058
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>


-- 
Kevin Owen
Senior Engineer in Research
Operations Group, Lurie Nanofabrication Facility
University of Michigan
(734) 545-4014
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From M.G.Perry at soton.ac.uk  Sat May  4 13:42:39 2019
From: M.G.Perry at soton.ac.uk (Perry M.G.)
Date: Sat, 4 May 2019 17:42:39 +0000
Subject: [labnetwork] Oxford PC2000 software for ICP100
In-Reply-To: <CANLyxV0HV7uXp-ZexsFQWQaF-c6_eOVwhyC2+WB4eeodqz+NRA@mail.gmail.com>
References: <DM5PR06MB2571D66CE707291AAE369B14B0360@DM5PR06MB2571.namprd06.prod.outlook.com>,
 <CANLyxV0HV7uXp-ZexsFQWQaF-c6_eOVwhyC2+WB4eeodqz+NRA@mail.gmail.com>
Message-ID: <AM6PR04MB41361E39739BCC6479747764E9360@AM6PR04MB4136.eurprd04.prod.outlook.com>

hi kevins,

A word of warning. Dropping the drive in a new PC is likely not to work.

The arcnet drivers i believe are compiled against a specific intel chipset. If you dont have it in the PC it wont run.

Its either a job for OIPT, repair what you have or find identical PC and run restore with xp cd. Also to find someone with identical pc2000 software is unlikely.

Most softwares are custom to each machine. Please clone your drives in the future!


Still working on a better fix than this when i get some spare time...



regards


mike


________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Kevin Owen <kjvowen at lnf.umich.edu>
Sent: 04 May 2019 14:36:45
To: Kevin M McPeak
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Oxford PC2000 software for ICP100

Kevin,

Do you know what part of the computer "died"? If the hard drive is still functional (or if you have a backup image of it), you should be able to drop it into a new computer and run a repair using a WinXP CD to fix any hardware discrepancies. If the hard drive is shot, well, I'll have to look on Monday to see what model PLC our Oxford is running (and whether we have the software CD, or could provide you with an image of our hard drive).

-Kevin

On Sat, May 4, 2019 at 8:49 AM Kevin M McPeak <kmcpeak at lsu.edu<mailto:kmcpeak at lsu.edu>> wrote:
Dear Colleagues,

Does anyone have a copy of an old version (Black PLC) of Oxford's PC2000 software?

Our WinXP machine running the PC2000 software died this week and we can not find the original disk. Our PC2000 software was controlling an Oxford ICP100 with a black PLC (that is the older PLC which is not upgradeable).

Any help here is most appreciated.

Regards,
Kevin
--
Assistant Professor
Department of Chemical Engineering
Director LSU Nanofabrication Facility
225.578.0058
_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
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--
Kevin Owen
Senior Engineer in Research
Operations Group, Lurie Nanofabrication Facility
University of Michigan
(734) 545-4014
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From M.G.Perry at soton.ac.uk  Sat May  4 15:08:17 2019
From: M.G.Perry at soton.ac.uk (Perry M.G.)
Date: Sat, 4 May 2019 19:08:17 +0000
Subject: [labnetwork] Oxford PC2000 software for ICP100
In-Reply-To: <AM6PR04MB41361E39739BCC6479747764E9360@AM6PR04MB4136.eurprd04.prod.outlook.com>
References: <DM5PR06MB2571D66CE707291AAE369B14B0360@DM5PR06MB2571.namprd06.prod.outlook.com>,
 <CANLyxV0HV7uXp-ZexsFQWQaF-c6_eOVwhyC2+WB4eeodqz+NRA@mail.gmail.com>,
 <AM6PR04MB41361E39739BCC6479747764E9360@AM6PR04MB4136.eurprd04.prod.outlook.com>
Message-ID: <AM6PR04MB4136A8FC71533D56030D552EE9360@AM6PR04MB4136.eurprd04.prod.outlook.com>

correction

ethernet drivers of later software is compiled against chipset.

Even though i think you will struggle. Please update on final solution for this. We have a couple of black B+R plcs here that we'd love to upgrade the PC hardware!


Comments on PC2000 stands though. Its not a one off software. Gas maps, pumping configs etc all differ from machine to machine.



________________________________
From: Perry M.G.
Sent: 04 May 2019 18:42:39
To: Kevin Owen; Kevin M McPeak
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Oxford PC2000 software for ICP100


hi kevins,

A word of warning. Dropping the drive in a new PC is likely not to work.

The arcnet drivers i believe are compiled against a specific intel chipset. If you dont have it in the PC it wont run.

Its either a job for OIPT, repair what you have or find identical PC and run restore with xp cd. Also to find someone with identical pc2000 software is unlikely.

Most softwares are custom to each machine. Please clone your drives in the future!


Still working on a better fix than this when i get some spare time...



regards


mike


________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Kevin Owen <kjvowen at lnf.umich.edu>
Sent: 04 May 2019 14:36:45
To: Kevin M McPeak
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Oxford PC2000 software for ICP100

Kevin,

Do you know what part of the computer "died"? If the hard drive is still functional (or if you have a backup image of it), you should be able to drop it into a new computer and run a repair using a WinXP CD to fix any hardware discrepancies. If the hard drive is shot, well, I'll have to look on Monday to see what model PLC our Oxford is running (and whether we have the software CD, or could provide you with an image of our hard drive).

-Kevin

On Sat, May 4, 2019 at 8:49 AM Kevin M McPeak <kmcpeak at lsu.edu<mailto:kmcpeak at lsu.edu>> wrote:
Dear Colleagues,

Does anyone have a copy of an old version (Black PLC) of Oxford's PC2000 software?

Our WinXP machine running the PC2000 software died this week and we can not find the original disk. Our PC2000 software was controlling an Oxford ICP100 with a black PLC (that is the older PLC which is not upgradeable).

Any help here is most appreciated.

Regards,
Kevin
--
Assistant Professor
Department of Chemical Engineering
Director LSU Nanofabrication Facility
225.578.0058
_______________________________________________
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--
Kevin Owen
Senior Engineer in Research
Operations Group, Lurie Nanofabrication Facility
University of Michigan
(734) 545-4014
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From shimonel at savion.huji.ac.il  Sun May  5 07:57:20 2019
From: shimonel at savion.huji.ac.il (Shimon Eliav)
Date: Sun, 5 May 2019 11:57:20 +0000
Subject: [labnetwork] Oxford PC2000 software for ICP100
In-Reply-To: <DM5PR06MB2571D66CE707291AAE369B14B0360@DM5PR06MB2571.namprd06.prod.outlook.com>
References: <DM5PR06MB2571D66CE707291AAE369B14B0360@DM5PR06MB2571.namprd06.prod.outlook.com>
Message-ID: <VI1PR10MB19834F95C9884CBEEF403EC3D6370@VI1PR10MB1983.EURPRD10.PROD.OUTLOOK.COM>

Hi Kevin,

I have the disc (see pictures attached). I can send its content to you (upload?), but I think what Mike wrote is right: each machine has its own configuration and its own software.
Please advise on how to send you the files.
Regards,

Shimon
The Hebrew University of Jerusalem
The Unit for Nano Fabrication
Jerusalem - Israel



From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Kevin M McPeak
Sent: Saturday, 4 May 2019 4:25
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Oxford PC2000 software for ICP100

Dear Colleagues,
Does anyone have a copy of an old version (Black PLC) of Oxford's PC2000 software?
Our WinXP machine running the PC2000 software died this week and we can not find the original disk. Our PC2000 software was controlling an Oxford ICP100 with a black PLC (that is the older PLC which is not upgradeable).
Any help here is most appreciated.
Regards,
Kevin
--
Assistant Professor
Department of Chemical Engineering
Director LSU Nanofabrication Facility
225.578.0058
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From nadia.court at sydney.edu.au  Mon May  6 03:06:47 2019
From: nadia.court at sydney.edu.au (Nadia Court)
Date: Mon, 6 May 2019 07:06:47 +0000
Subject: [labnetwork] Hybrid Perovskite materials
Message-ID: <1F55EE29-F2BE-44E8-86D9-A2C35A2A991F@sydney.edu.au>

Dear Colleagues,

We have a number of users enquiring about evaporating metal contacts (Au, Ag etc) on hybrid perovskite films (deposited by spin coating/sol-gel processes) in our general-purpose e-beam evaporator. We have not dealt with these materials before and whilst we are not evaporating them I?m wondering if there is any chance of these materials outgassing and creating cross-contamination issues for other users. Any feedback would be greatly appreciated.

Kind Regards,

Nadia

Dr Nadia Court
Facility and Program Manager | Research & Prototype Foundry
Core Research Facilities | Research Portfolio
The University of Sydney
Rm 4019, Sydney Nanoscience Hub  A31 | The University of Sydney | NSW | 2006
T +61 2 8627 8671
E nadia.court at sydney.edu.au<mailto:nadia.court at sydney.edu.au>  | W Sydney's <http://sydney.edu.au/research/support/facilities.shtml> Core Research Facilities <http://sydney.edu.au/research/support/facilities.shtml>
ANFF OptoFab: www.anff.org.au<http://www.anff.org.au/>
CRICOS 00026A
This email plus any attachments to it are confidential.
Any unauthorised use is strictly prohibited.
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From gpl107 at psu.edu  Mon May  6 08:27:44 2019
From: gpl107 at psu.edu (Lavallee, Guy)
Date: Mon, 6 May 2019 12:27:44 +0000
Subject: [labnetwork] Hybrid Perovskite materials
In-Reply-To: <1F55EE29-F2BE-44E8-86D9-A2C35A2A991F@sydney.edu.au>
References: <1F55EE29-F2BE-44E8-86D9-A2C35A2A991F@sydney.edu.au>
Message-ID: <DM5PR02MB281185356AD71F35F86028BE9B300@DM5PR02MB2811.namprd02.prod.outlook.com>

Hi Nadia,
   We have been working with perovskite materials for a long time and haven?t seen any issue with putting them in our evaporators.  Most of  the perovskite materials are processed at much higher temperatures than they will reach in an evaporator.  In addition most perovskite materials are also relatively stable oxides so you shouldn?t need to worry.

Thanks,
Guy Lavalle
Remote Project Manager / Lead Etch Engineer
N-105 MSC Building
Penn State University
University Park,  PA  16803

Email: gpl107 at psu.edu<mailto:gpl107 at psu.edu>
Office: 814-865-9339
Cell: 814-777-0719

From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> On Behalf Of Nadia Court
Sent: Monday, May 6, 2019 3:07 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Hybrid Perovskite materials

Dear Colleagues,

We have a number of users enquiring about evaporating metal contacts (Au, Ag etc) on hybrid perovskite films (deposited by spin coating/sol-gel processes) in our general-purpose e-beam evaporator. We have not dealt with these materials before and whilst we are not evaporating them I?m wondering if there is any chance of these materials outgassing and creating cross-contamination issues for other users. Any feedback would be greatly appreciated.

Kind Regards,

Nadia

Dr Nadia Court
Facility and Program Manager | Research & Prototype Foundry
Core Research Facilities | Research Portfolio
The University of Sydney
Rm 4019, Sydney Nanoscience Hub  A31 | The University of Sydney | NSW | 2006
T +61 2 8627 8671
E nadia.court at sydney.edu.au<mailto:nadia.court at sydney.edu.au>  | W Sydney's <https://nam01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fsydney.edu.au%2Fresearch%2Fsupport%2Ffacilities.shtml&data=02%7C01%7Cgpl107%40psu.edu%7C274d1044cc51412f6b4c08d6d2198086%7C7cf48d453ddb4389a9c1c115526eb52e%7C0%7C0%7C636927404304822302&sdata=cCb%2Bl30GsFKqOA4coRLM%2BU08Ljg6aIIGIgk%2Fvvl0sr8%3D&reserved=0> Core Research Facilities <https://nam01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fsydney.edu.au%2Fresearch%2Fsupport%2Ffacilities.shtml&data=02%7C01%7Cgpl107%40psu.edu%7C274d1044cc51412f6b4c08d6d2198086%7C7cf48d453ddb4389a9c1c115526eb52e%7C0%7C0%7C636927404304832311&sdata=IezFX0r7lH0OCldgTKKMID8nnabSmYJDwUJCzT7dgSs%3D&reserved=0>
ANFF OptoFab: www.anff.org.au<https://nam01.safelinks.protection.outlook.com/?url=http%3A%2F%2Fwww.anff.org.au%2F&data=02%7C01%7Cgpl107%40psu.edu%7C274d1044cc51412f6b4c08d6d2198086%7C7cf48d453ddb4389a9c1c115526eb52e%7C0%7C0%7C636927404304842319&sdata=u4a45cvAzGABTrllLS1mNk6voaptT2rvO7tFRgk%2BhRc%3D&reserved=0>
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From kurt.kupcho at wisc.edu  Tue May  7 15:20:41 2019
From: kurt.kupcho at wisc.edu (Kurt Kupcho)
Date: Tue, 7 May 2019 19:20:41 +0000
Subject: [labnetwork] SU-8 in a DRIE
Message-ID: <DM6PR06MB46497BC8DE1663B16819401D92310@DM6PR06MB4649.namprd06.prod.outlook.com>

Labnetwork -

We have been asked to allow SU-8 in our DRIE.  I am reluctant to do so because of reports I have read that SU-8 contaminates ICP etch chambers worse than regular photoresist and it can produce antimony contaminants on the surface from the SU-8.

Do any of you have experience in allowing SU-8 in your DRIE or denying it?  What was your decision based on?

Thank you for your help.


-          Kurt


---------------------------------------------------
Kurt Kupcho
Process Engineer/Safety Officer

NFC
1550 Engineering Drive
ECB Room 3110
Madison, WI  53706

E:  kurt.kupcho at wisc.edu<mailto:kurt.kupcho at wisc.edu>
T:  608-262-2982

[Nano-Fab_color-flush]

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From shimonel at savion.huji.ac.il  Wed May  8 01:34:28 2019
From: shimonel at savion.huji.ac.il (Shimon Eliav)
Date: Wed, 8 May 2019 05:34:28 +0000
Subject: [labnetwork] SU-8 in a DRIE
In-Reply-To: <DM6PR06MB46497BC8DE1663B16819401D92310@DM6PR06MB4649.namprd06.prod.outlook.com>
References: <DM6PR06MB46497BC8DE1663B16819401D92310@DM6PR06MB4649.namprd06.prod.outlook.com>
Message-ID: <C8748CA7-AEF4-41ED-AC50-9CB2E3340449@savion.huji.ac.il>

Hi Kurt,
We tried to use SU8 instead of photo resist and the results were not satisfactory: there were residues on Si surface (something like black Silicon) and the chamber was quite dirty. We discontinued the experiments.
Regards,
Shimon
Hebrew University of Jerusalem

Sent from my iPhone

On 8 May 2019, at 0:24, Kurt Kupcho <kurt.kupcho at wisc.edu<mailto:kurt.kupcho at wisc.edu>> wrote:

Labnetwork -

We have been asked to allow SU-8 in our DRIE.  I am reluctant to do so because of reports I have read that SU-8 contaminates ICP etch chambers worse than regular photoresist and it can produce antimony contaminants on the surface from the SU-8.

Do any of you have experience in allowing SU-8 in your DRIE or denying it?  What was your decision based on?

Thank you for your help.


-          Kurt


---------------------------------------------------
Kurt Kupcho
Process Engineer/Safety Officer

NFC
1550 Engineering Drive
ECB Room 3110
Madison, WI  53706

E:  kurt.kupcho at wisc.edu<mailto:kurt.kupcho at wisc.edu>
T:  608-262-2982

<image001.png>

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From crraum at gmail.com  Wed May  8 03:32:08 2019
From: crraum at gmail.com (Christopher Raum)
Date: Wed, 8 May 2019 00:32:08 -0700
Subject: [labnetwork] SU-8 in a DRIE
In-Reply-To: <DM6PR06MB46497BC8DE1663B16819401D92310@DM6PR06MB4649.namprd06.prod.outlook.com>
References: <DM6PR06MB46497BC8DE1663B16819401D92310@DM6PR06MB4649.namprd06.prod.outlook.com>
Message-ID: <CAK5uxHY=GopCCiDwFWLSYqkmUHcV+B7MpE3bZmJ7-1xwOcPHYQ@mail.gmail.com>

Hi Kurt,

One alternative might be KMPR. It's sort of a next generation SU-8 (also by
MicroChem/IBM), that may not have the same contamination issues. It is
highly selective in fluorine plasma etches like SU-8, can be spread thick
(I've done >100um for fused quartz etching), and also has a special solvent
designed to make stripping much more easy than SU-8. It's a negative epoxy
based resist (also like SU-8).

Draw backs are that it's quite expensive, and you should store it in a
freezer so it keeps for up to a year. One way to deal with this is buy a
bunch of single use syringes, fill them with the KMPR, and freeze the
syringes. If you're dealing with users, that also makes it easier to sell
it by the syringe.

Regards,

Chris Raum
--
R&D Engineer 3
Experimental Cosmology Group
Radio Astronomy Lab
University of California, Berkeley
151 LeConte Hall
Berkeley, CA,
Email:        crraum at gmail.com
Alt Email: craum at berkeley.edu

On Tue, May 7, 2019 at 2:26 PM Kurt Kupcho <kurt.kupcho at wisc.edu> wrote:

> Labnetwork -
>
>
>
> We have been asked to allow SU-8 in our DRIE.  I am reluctant to do so
> because of reports I have read that SU-8 contaminates ICP etch chambers
> worse than regular photoresist and it can produce antimony contaminants on
> the surface from the SU-8.
>
>
>
> Do any of you have experience in allowing SU-8 in your DRIE or denying
> it?  What was your decision based on?
>
>
>
> Thank you for your help.
>
>
>
> -          Kurt
>
>
>
>
>
> ---------------------------------------------------
>
> Kurt Kupcho
>
> Process Engineer/Safety Officer
>
>
>
> NFC
>
> 1550 Engineering Drive
>
> ECB Room 3110
>
> Madison, WI  53706
>
>
>
> E:  kurt.kupcho at wisc.edu
>
> T:  608-262-2982
>
>
>
> [image: Nano-Fab_color-flush]
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From sreevyas at gmail.com  Thu May  9 07:38:57 2019
From: sreevyas at gmail.com (Srinivasa Reddy)
Date: Thu, 9 May 2019 17:08:57 +0530
Subject: [labnetwork] Deposition ICP CVD Silicon dioxide for Lift process
Message-ID: <CAGZGR9GtoJZaK=-Y4DejAuwRkT4T7Xy4DgC9bZMvUOakJfh_Qg@mail.gmail.com>

Dear Researchers,
I want to use ICP PECVD facility for depositing silicon dioxide on
patterned *photoresist sample*.
Finally lift-off the SiO2, The sample consist of gold patterns upon glass
substrate.
We have only one ICP CVD Unit, which mostly used for semiconductor and GaN
device passivation layers along with some other MEMS process.

I suspect the Photoresist may contaminate the chamber and also getting lift
may not be possible after subjecting to ICP & RF powers.

I request experts to throw some light on this process feasibility and your
experience.


Thanks & Regards
Srinivasa Reddy Kuppireddi
Project Manager
Center for NEMS & Nano Photonics (CNNP)
ESB 225, Dept. of Electrical Engineering
Indian Institute of Technology(IIT) Madras
Chennai-600036, Indian
+91 44 2257 5493 (O)
+91 789 326 8010(M)
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From fouad.karouta at anu.edu.au  Thu May  9 12:30:29 2019
From: fouad.karouta at anu.edu.au (Fouad Karouta)
Date: Thu, 9 May 2019 16:30:29 +0000
Subject: [labnetwork] Deposition ICP CVD Silicon dioxide for Lift process
In-Reply-To: <CAGZGR9GtoJZaK=-Y4DejAuwRkT4T7Xy4DgC9bZMvUOakJfh_Qg@mail.gmail.com>
References: <CAGZGR9GtoJZaK=-Y4DejAuwRkT4T7Xy4DgC9bZMvUOakJfh_Qg@mail.gmail.com>
Message-ID: <7461D97F-8279-47D3-BFA3-CE0BD71BA24C@anu.edu.au>

Dear Srinivasa,
I did SiOx liftoff with resist in a regular PECVD system keeping the electrode temperature to 90-100 deg C. Higher temperature will hardbake the resist and makes liftoff difficult to impossible. ICP CBD will allow you to get better oxide at 100 degrees than with PECVD.
About contamination we haven?t looked at this but the system is cleaned every week so I don?t believe this is a concern.
Regards
Fouad Karouta
ANU - ANFF ACT node
Canberra, Australia

On 9 May 2019, at 8:45 am, Srinivasa Reddy <sreevyas at gmail.com<mailto:sreevyas at gmail.com>> wrote:

Dear Researchers,
I want to use ICP PECVD facility for depositing silicon dioxide on patterned photoresist sample.
Finally lift-off the SiO2, The sample consist of gold patterns upon glass substrate.
We have only one ICP CVD Unit, which mostly used for semiconductor and GaN device passivation layers along with some other MEMS process.

I suspect the Photoresist may contaminate the chamber and also getting lift may not be possible after subjecting to ICP & RF powers.

I request experts to throw some light on this process feasibility and your experience.


Thanks & Regards
Srinivasa Reddy Kuppireddi
Project Manager
Center for NEMS & Nano Photonics (CNNP)
ESB 225, Dept. of Electrical Engineering
Indian Institute of Technology(IIT) Madras
Chennai-600036, Indian
+91 44 2257 5493 (O)
+91 789 326 8010(M)
_______________________________________________
labnetwork mailing list
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https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From Aju.Jugessur at Colorado.EDU  Thu May  9 13:23:53 2019
From: Aju.Jugessur at Colorado.EDU (Aju Jugessur)
Date: Thu, 9 May 2019 17:23:53 +0000
Subject: [labnetwork] Information request: Core Facilities
Message-ID: <0E11531B-1273-4945-A7F0-CC73E9DDCB2C@colorado.edu>

Hi Lab-network members,

I am part of a group of people at the University of Colorado, Boulder,(CUB) who are researching how we may work on a variety of ways to increase the sustainability of our core facilities at CUB, in particular, by finding new ways to be more effective and develop new revenue streams.

I am reaching out to obtain your perspectives on the following:


  1.  Have you seen any financial benefit or a significant uptake on the usage of your Core if it is on a shared website and perhaps, with an online database?
If not, do you see any importance of having your Core on a campus wide shared network and website?


  1.  Do you have structure or a mechanism where data that are generated by your Core/(s) are shared among themselves and monetized to generate any revenue, both internally and with external partners. If not, do you see any potential in centralizing data sharing among Cores that could be financially beneficial.

Any relevant information or advice on the above would be helpful.

Thank you,

Regards,
Aju


Aju Jugessur Ph.D. IEEE Sr. Member
Director, Colorado Nanofabrication and Characterization Center
Discovery Learning Center
University of Colorado Boulder | College of Engineering & Applied Science
1111 Engineering Drive ? 1B09 DLC | Boulder, CO 80309-0422 | P: 303.735.5019| F: 303.492.2199
E-mail: aju.jugessur at colorado.edu<mailto:aju.jugessur at colorado.edu>
[cid:618C7437-E08A-4DB3-8E95-2E891AD4E4FD]

Signature-Strengths: Focus, Activator, Futuristic, Strategic, Achiever
(CliftonStrengths)


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From nclay at seas.upenn.edu  Thu May  9 09:56:10 2019
From: nclay at seas.upenn.edu (Noah Clay)
Date: Thu, 9 May 2019 09:56:10 -0400
Subject: [labnetwork] Bid Service Liquidation.
Message-ID: <2E655577-44A5-4EAA-81E3-3C53BBEA44E3@seas.upenn.edu>

Dear Colleagues,

Many of you may know about Bid Service?s liquidation through an auction with ~1,700 items.  There are many items that are well matched to our R&D fabs, where equipment will likely sell for pennies on the dollar, and hopefully further strengthen our infrastructure:

*******

Semiconductor, Lab and Test Equipment auction May 17 through May 23, 2019.

Due to the retirement of Bid Service founding member we will be selling off most of our assets to include Semiconductor Equipment, Vacuum Equipment and Parts, Lab and Research Equipment. Over 1600 items up for auction at GoIndustry Dovebid website see the link:
https://www.go-dove.com/en/events?cmd=details&event=502272&keywords=Online+Auction+of+Electronic+Test+and+Measurement+and+Semiconductor+Manufacturing+Assets <https://www.go-dove.com/en/events?cmd=details&event=502272&keywords=Online+Auction+of+Electronic+Test+and+Measurement+and+Semiconductor+Manufacturing+Assets>


[Bid Service color logo 351px X 50px]
The Largest Supplier of Used and Refurbished
Semiconductor, Lab Equipment and Electronics in the World

Roger Shupe
225 Willow Brook Rd.
Freehold, NJ USA 07728
732-863-9500 x123
rogers at bidservice.com <mailto:rogers at bidservice.com><mailto:rogers at bidservice.com <mailto:rogers at bidservice.com>>
www.bidservice.com <http://www.bidservice.com/><http://www.bidservice.com/ <http://www.bidservice.com/>>

*******

Kind regards,
Noah Clay

Noah Clay
Director, Quattrone Nanofabrication Facility
109 Singh Center for Nanotechnology
University of Pennsylvania
Philadelphia, PA

(215) 898-9308
nclay at upenn.edu <mailto:nclay at upenn.edu>
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From julia.aebersold at louisville.edu  Fri May 10 14:13:41 2019
From: julia.aebersold at louisville.edu (Aebersold,Julia W.)
Date: Fri, 10 May 2019 18:13:41 +0000
Subject: [labnetwork] Information request: Core Facilities
In-Reply-To: <0E11531B-1273-4945-A7F0-CC73E9DDCB2C@colorado.edu>
References: <0E11531B-1273-4945-A7F0-CC73E9DDCB2C@colorado.edu>
Message-ID: <BN6PR03MB272113C8CC3AB8DB3164CC23860C0@BN6PR03MB2721.namprd03.prod.outlook.com>

Hi Aju.  We have seen an increase from being a part of the NNCI network, but most of our growth has occurred from word of mouth references from external clients.  Being a center that is easy to work with, business oriented, protection of client IP, competitive rates and responsive to clients have been key ingredients to our growth.  If we could hire a marketing director then I think it would take off even more, but that is beyond our current budget.


Being part of the NNCI network has structured our operations to collect and report data to the NNCI, but we have not monetized the data.


Cheers!


Julia Aebersold, Ph.D.

MNTC Cleanroom Manager

University of Louisville

2210 South Brook Street

Shumaker Research Building, Room 233

Louisville, KY  40292

(502) 852-1572

http://louisville.edu/micronano/<http://louisville.edu/micronano>


________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Aju Jugessur <Aju.Jugessur at Colorado.EDU>
Sent: Thursday, May 9, 2019 1:23:53 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Information request: Core Facilities


Hi Lab-network members,



I am part of a group of people at the University of Colorado, Boulder,(CUB) who are researching how we may work on a variety of ways to increase the sustainability of our core facilities at CUB, in particular, by finding new ways to be more effective and develop new revenue streams.



I am reaching out to obtain your perspectives on the following:



  1.  Have you seen any financial benefit or a significant uptake on the usage of your Core if it is on a shared website and perhaps, with an online database?

If not, do you see any importance of having your Core on a campus wide shared network and website?



  1.  Do you have structure or a mechanism where data that are generated by your Core/(s) are shared among themselves and monetized to generate any revenue, both internally and with external partners. If not, do you see any potential in centralizing data sharing among Cores that could be financially beneficial.



Any relevant information or advice on the above would be helpful.



Thank you,



Regards,

Aju





Aju Jugessur Ph.D. IEEE Sr. Member

Director, Colorado Nanofabrication and Characterization Center

Discovery Learning Center

University of Colorado Boulder | College of Engineering & Applied Science

1111 Engineering Drive ? 1B09 DLC | Boulder, CO 80309-0422 | P: 303.735.5019| F: 303.492.2199

E-mail: aju.jugessur at colorado.edu<mailto:aju.jugessur at colorado.edu>

[cid:618C7437-E08A-4DB3-8E95-2E891AD4E4FD]



Signature-Strengths: Focus, Activator, Futuristic, Strategic, Achiever
(CliftonStrengths)




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From James.Vlahakis at tufts.edu  Fri May 10 15:52:20 2019
From: James.Vlahakis at tufts.edu (Vlahakis, James)
Date: Fri, 10 May 2019 19:52:20 +0000
Subject: [labnetwork] sputter materials - Ru & Bi
Message-ID: <676C9381B5E6AC4FAE9CD9CFCC40DF1E010BABAF26@tabvmexdag1mb03.tufts.ad.tufts.edu>

Hi everyone, one of our users is interested in sputtering materials we are unfamiliar with - bismuth and ruthenium. They would be used in our "dirty" sputter tool, which has few material restrictions and users deposit on a variety substrates -

Easy or difficult to sputter? Any hazards to consider? Contamination issues? Any info would be greatly appreciated

Thanks

jim

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From odc1n08 at soton.ac.uk  Fri May 10 17:43:40 2019
From: odc1n08 at soton.ac.uk (Clark O.D.)
Date: Fri, 10 May 2019 21:43:40 +0000
Subject: [labnetwork] sputter materials - Ru & Bi
In-Reply-To: <676C9381B5E6AC4FAE9CD9CFCC40DF1E010BABAF26@tabvmexdag1mb03.tufts.ad.tufts.edu>
References: <676C9381B5E6AC4FAE9CD9CFCC40DF1E010BABAF26@tabvmexdag1mb03.tufts.ad.tufts.edu>
Message-ID: <AM0PR04MB41474A889DF658EF0F39CE06B00C0@AM0PR04MB4147.eurprd04.prod.outlook.com>

We have some experience with RuO2 sputtering at Southampton, one user was interested but never had the time to conduct a full optimisation of the sputtering. I recall that pressure was significant in obtaining good enough adhesion to the substrate, which was possibly Pt

________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Vlahakis, James <James.Vlahakis at tufts.edu>
Sent: 10 May 2019 19:52:20
To: 'labnetwork at mtl.mit.edu'
Subject: [labnetwork] sputter materials - Ru & Bi


Hi everyone, one of our users is interested in sputtering materials we are unfamiliar with ? bismuth and ruthenium. They would be used in our ?dirty? sputter tool, which has few material restrictions and users deposit on a variety substrates -



Easy or difficult to sputter? Any hazards to consider? Contamination issues? Any info would be greatly appreciated



Thanks



jim


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From sgupta at eng.ua.edu  Fri May 10 23:41:48 2019
From: sgupta at eng.ua.edu (Gupta, Su)
Date: Sat, 11 May 2019 03:41:48 +0000
Subject: [labnetwork] sputter materials - Ru & Bi
In-Reply-To: <676C9381B5E6AC4FAE9CD9CFCC40DF1E010BABAF26@tabvmexdag1mb03.tufts.ad.tufts.edu>
References: <676C9381B5E6AC4FAE9CD9CFCC40DF1E010BABAF26@tabvmexdag1mb03.tufts.ad.tufts.edu>
Message-ID: <D93191EF-41BC-454D-8B19-393C246E3E18@eng.ua.edu>

James,

I have not sputtered Bi, but I have sputtered Ru routinely and it is an easy material to sputter.

Best regards,
Su

Sent from my iPhone

On May 10, 2019, at 3:35 PM, Vlahakis, James <James.Vlahakis at tufts.edu<mailto:James.Vlahakis at tufts.edu>> wrote:

Hi everyone, one of our users is interested in sputtering materials we are unfamiliar with ? bismuth and ruthenium. They would be used in our ?dirty? sputter tool, which has few material restrictions and users deposit on a variety substrates -

Easy or difficult to sputter? Any hazards to consider? Contamination issues? Any info would be greatly appreciated

Thanks

jim

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From swolcott at uchicago.edu  Tue May 14 15:48:54 2019
From: swolcott at uchicago.edu (Sally J. Wolcott)
Date: Tue, 14 May 2019 19:48:54 +0000
Subject: [labnetwork] Open Positions at UChicago's Pritzker Nanofabrication
	Facility
Message-ID: <BN7PR11MB2836227F4AC42FC289DA5DD4B6080@BN7PR11MB2836.namprd11.prod.outlook.com>

We are recruiting for two cleanroom engineering positions, please spread the word.

Equipment Engineer - JR04281 <https://uchicago.wd5.myworkdayjobs.com/en-US/External/job/Hyde-Park-Campus/Equipment-Engineer_JR04281>
The IME's Pritzker Nanofabrication Facility is looking for a qualified, experienced Cleanroom Equipment Engineer to help repair and maintain a suite of specialized tools that can fabricate complex, integrated electronic, mechanical, optical and fluidic structures. The engineer is responsible for preventative and corrective maintenance on a variety of tools and ancillary support equipment. This qualified individual will interface with students, scientists and engineers to provide training and support on all equipment related matters.

Process Engineer - JR04589<https://uchicago.wd5.myworkdayjobs.com/en-US/External/job/Hyde-Park-Campus/Process-Engineer_JR04589>
The IME's Pritzker Nanofabrication Facility is looking for a qualified, experienced Cleanroom Process Engineer.  As the primary function, will interface with Nanofabrication Facility users including students, faculty and staff while providing training and support on process related matters.

Thanks,
Sally Wolcott
Business Manager
Pritzker Nanofabrication Facility

Institute for Molecular Engineering
The University of Chicago
Eckhardt Research Center
5640 S. Ellis Ave., Room 105A
Chicago, IL  60637

773.834.3548 office
773.332.1196 mobile

swolcott at uchicago.edu<mailto:swolcott at uchicago.edu>  | pnf.uchicago.edu<http://ime.uchicago.edu/> | ime.uchicago.edu<https://ime.uchicago.edu/>

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From gnair at lsu.edu  Wed May 15 13:22:14 2019
From: gnair at lsu.edu (Greshma Nair)
Date: Wed, 15 May 2019 17:22:14 +0000
Subject: [labnetwork] Tencor P2 profiler calibration
Message-ID: <DM5PR06MB319424EB2804B0B3E24772D6B9090@DM5PR06MB3194.namprd06.prod.outlook.com>

Hello all,

Does anyone have the manual for step height calibration for the Tencor P2 contact profiler? We tried contacting KLA Tencor tech support, so far they have only been able to provide us the instructions for Step width calibration.

Any help will be greatly appreciated!

Greshma
----

Greshma Nair, Ph.D.
Cleanroom Manager
Nanofabrication Facility (NFF)
Center for Advanced Microstructures and Devices (CAMD)
6980 Jefferson Highway
Baton Rouge, LA  70806
Phone: (225) 578-9378
lsu.edu/nanofabrication<http://lsu.edu/nanofabrication>

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From woobc at lnf.umich.edu  Wed May 15 15:40:56 2019
From: woobc at lnf.umich.edu (Brandon Woo)
Date: Wed, 15 May 2019 15:40:56 -0400
Subject: [labnetwork]  Hot Phosphoric PPE
Message-ID: <CANfMBwkJTeL0hcGf28Y9RLLoR-LVj24usASauJy3Fk3WPsLNsQ@mail.gmail.com>

Hello all,

Does anyone have any recommendations on PPE for processing using hot
phosphoric acid?

This is the apron that we are currently using:
https://www.grainger.com/product/ANSELL-Chemical-Resistant-Bib-Apron-5EMD0

Thanks,
-- 
Brandon Woo

Engineer in Research Intermediate
Lurie Nanofabrication Facility
University of Michigan

1234 EECS
1301 Beal Ave
Ann Arbor, MI, 48105

woobc at lnf.umich.edu
989-324-0620 (C)
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From julia.aebersold at louisville.edu  Thu May 16 11:07:02 2019
From: julia.aebersold at louisville.edu (Aebersold,Julia W.)
Date: Thu, 16 May 2019 15:07:02 +0000
Subject: [labnetwork] Hot Phosphoric PPE
In-Reply-To: <CANfMBwkJTeL0hcGf28Y9RLLoR-LVj24usASauJy3Fk3WPsLNsQ@mail.gmail.com>
References: <CANfMBwkJTeL0hcGf28Y9RLLoR-LVj24usASauJy3Fk3WPsLNsQ@mail.gmail.com>
Message-ID: <MWHPR03MB2734E1F091CA062D00C80826860A0@MWHPR03MB2734.namprd03.prod.outlook.com>

We use a similar apron, but it has full arm coverage, too. Additional PPE, aside from safety glasses and nitrile gloves, include a face shield and heavy duty chemical resistant gloves when handling these types of chemicals.

Cheers!


Julia Aebersold, Ph.D.

MNTC Cleanroom Manager

University of Louisville

2210 South Brook Street

Shumaker Research Building, Room 233

Louisville, KY  40292

(502) 852-1572

http://louisville.edu/micronano/

________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Brandon Woo <woobc at lnf.umich.edu>
Sent: Wednesday, May 15, 2019 3:40:56 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Hot Phosphoric PPE

Hello all,

Does anyone have any recommendations on PPE for processing using hot phosphoric acid?

This is the apron that we are currently using: https://www.grainger.com/product/ANSELL-Chemical-Resistant-Bib-Apron-5EMD0<https://urldefense.proofpoint.com/v2/url?u=https-3A__www.grainger.com_product_ANSELL-2DChemical-2DResistant-2DBib-2DApron-2D5EMD0&d=DwMFaQ&c=OAG1LQNACBDguGvBeNj18Swhr9TMTjS-x4O_KuapPgY&r=l9C3cuOkWyGd6C0ye_FDTBHMFl4lPXPJztVHQPL_Bao&m=d8gTOXzqu08GKDgSFq-QI-hL9O2VGLBylVo_MvgKhnU&s=Gx0tVyszJJH_TgVPsITBxN8Hc2rPZwb-9X2-dqiJRYQ&e=>

Thanks,
--
Brandon Woo

Engineer in Research Intermediate
Lurie Nanofabrication Facility
University of Michigan

1234 EECS
1301 Beal Ave
Ann Arbor, MI, 48105

woobc at lnf.umich.edu<mailto:woobc at lnf.umich.edu>
989-324-0620 (C)
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From tony.olsen at utah.edu  Thu May 16 11:47:31 2019
From: tony.olsen at utah.edu (Tony L Olsen)
Date: Thu, 16 May 2019 15:47:31 +0000
Subject: [labnetwork] Hot Phosphoric PPE
In-Reply-To: <CANfMBwkJTeL0hcGf28Y9RLLoR-LVj24usASauJy3Fk3WPsLNsQ@mail.gmail.com>
References: <CANfMBwkJTeL0hcGf28Y9RLLoR-LVj24usASauJy3Fk3WPsLNsQ@mail.gmail.com>
Message-ID: <ad2358fa351d47aca99420373efd6117@utah.edu>

Brandon

I know there are better Safety Experts than me, but here is my opinion.

First, I avoid bib-style aprons entirely and only use full-sleeve aprons.  Surprisingly, that eliminates MOST available products.  It would seem to me most exposure to chemicals will be the chest and arms.  Bibs offer marginal protection to the chest and none to the shoulders and arms.  Hence, my focus on full-sleeve aprons.  (Sleevelets/arm guards are more trouble than they are worth and still leave the upper arms and shoulders unprotected.)

Second, I think the biggest problem with hot phosphoric is the hot part.  The apron you reference is a PVC apron.  One reference I found shows PVC has good (not excellent) protection for phosphoric acid.  However, it also melts at 100?C and has a maximum operating temperature of 60?C.  This will be a problem for most products.  Additionally, the thicker the apron, the longer it will hold the heat from a splash, increasing the effect of the thermal burn.

I use Tychem-SL (aka, Tychem 4000) full-sleeve aprons for all my acid/base processing.  They provide better resistance to a broader range of chemicals, including phosphoric acid.  Unfortunately, I find no information on the melting temperature of the Saranex 23-P coating on these aprons.  There is not a single product that is appropriate for all chemicals and circumstances, but we?ve been pleased with this product as a reasonable compromise ? even though it isn?t intended for cleanroom use.

Hope this helps a little,
tonyO


Tony Olsen
Nanofab Cleanroom Supervisor/Process Engineer
University of Utah
36 S Wasatch Dr, Suite 2500
Salt Lake City,  UT  84112
801-587-0651 office
801-587-3077 fax
www.nanofab.utah.edu<http://www.nanofab.utah.edu/>



From: Brandon Woo <woobc at lnf.umich.edu>
Sent: Wednesday, May 15, 2019 13:41
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Hot Phosphoric PPE

Hello all,

Does anyone have any recommendations on PPE for processing using hot phosphoric acid?

This is the apron that we are currently using: https://www.grainger.com/product/ANSELL-Chemical-Resistant-Bib-Apron-5EMD0

Thanks,
--
Brandon Woo

Engineer in Research Intermediate
Lurie Nanofabrication Facility
University of Michigan

1234 EECS
1301 Beal Ave
Ann Arbor, MI, 48105

woobc at lnf.umich.edu<mailto:woobc at lnf.umich.edu>
989-324-0620 (C)
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From jeanne.guo at rice.edu  Thu May 16 12:09:16 2019
From: jeanne.guo at rice.edu (Jing Guo)
Date: Thu, 16 May 2019 11:09:16 -0500
Subject: [labnetwork] Hot Phosphoric PPE
In-Reply-To: <MWHPR03MB2734E1F091CA062D00C80826860A0@MWHPR03MB2734.namprd03.prod.outlook.com>
References: <CANfMBwkJTeL0hcGf28Y9RLLoR-LVj24usASauJy3Fk3WPsLNsQ@mail.gmail.com>
 <MWHPR03MB2734E1F091CA062D00C80826860A0@MWHPR03MB2734.namprd03.prod.outlook.com>
Message-ID: <749C5764-3C91-416D-8128-7AD6E7B84A75@rice.edu>

We use Dupont Tychem 4000 sleeved apron for general acid. For Phosphoric acid (85%), the normalized break through time is more than 480 minutes.


Jing Guo Ph.D.
Research Scientist
SEA Cleanroom (SST 017)
Rice University
Houston, TX 
jeanne.guo at rice.edu
713-348-8227






> On May 16, 2019, at 10:07 AM, Aebersold,Julia W. <julia.aebersold at louisville.edu> wrote:
> 
> We use a similar apron, but it has full arm coverage, too. Additional PPE, aside from safety glasses and nitrile gloves, include a face shield and heavy duty chemical resistant gloves when handling these types of chemicals.
> 
> Cheers!
> 
> 
> Julia Aebersold, Ph.D.
> 
> MNTC Cleanroom Manager
> 
> University of Louisville
> 
> 2210 South Brook Street
> 
> Shumaker Research Building, Room 233
> 
> Louisville, KY  40292
> 
> (502) 852-1572
> 
> http://louisville.edu/micronano/
> 
> From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Brandon Woo <woobc at lnf.umich.edu>
> Sent: Wednesday, May 15, 2019 3:40:56 PM
> To: labnetwork at mtl.mit.edu
> Subject: [labnetwork] Hot Phosphoric PPE
>  
> Hello all,
> 
> Does anyone have any recommendations on PPE for processing using hot phosphoric acid?  
> 
> This is the apron that we are currently using: https://www.grainger.com/product/ANSELL-Chemical-Resistant-Bib-Apron-5EMD0 <https://urldefense.proofpoint.com/v2/url?u=https-3A__www.grainger.com_product_ANSELL-2DChemical-2DResistant-2DBib-2DApron-2D5EMD0&d=DwMFaQ&c=OAG1LQNACBDguGvBeNj18Swhr9TMTjS-x4O_KuapPgY&r=l9C3cuOkWyGd6C0ye_FDTBHMFl4lPXPJztVHQPL_Bao&m=d8gTOXzqu08GKDgSFq-QI-hL9O2VGLBylVo_MvgKhnU&s=Gx0tVyszJJH_TgVPsITBxN8Hc2rPZwb-9X2-dqiJRYQ&e=>
> 
> Thanks,
> -- 
> Brandon Woo
> 
> Engineer in Research Intermediate
> Lurie Nanofabrication Facility
> University of Michigan
> 
> 1234 EECS
> 1301 Beal Ave
> Ann Arbor, MI, 48105
> 
> woobc at lnf.umich.edu <mailto:woobc at lnf.umich.edu>
> 989-324-0620 (C)
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From Sa'ad.Hassan at nrc-cnrc.gc.ca  Thu May 16 13:39:51 2019
From: Sa'ad.Hassan at nrc-cnrc.gc.ca (Hassan, Sa'ad)
Date: Thu, 16 May 2019 17:39:51 +0000
Subject: [labnetwork] Diced Samples Glued to UV Release Tape
Message-ID: <73c2d3d98aef4ba7bcb040f2075b451f@DC01ZWH0014.Corp.nrc.gc.ca>

Hello All,

As part of the last step of processing, I take wafers (Si and SiC), with photoresist on top,  dice them, die expand them on a hotplate at 55 degrees Celsius. And finally UV release the tape. I've noticed that sporadically, rather than the tape losing  adhesion, the opposite happens: the die end up cemented to the tape. Has anyone experienced anything like this before?

Cheers,
Sa'ad
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From codreanu at udel.edu  Thu May 16 13:50:30 2019
From: codreanu at udel.edu (Iulian Codreanu)
Date: Thu, 16 May 2019 13:50:30 -0400
Subject: [labnetwork] Hot Phosphoric PPE
In-Reply-To: <MWHPR03MB2734E1F091CA062D00C80826860A0@MWHPR03MB2734.namprd03.prod.outlook.com>
References: <CANfMBwkJTeL0hcGf28Y9RLLoR-LVj24usASauJy3Fk3WPsLNsQ@mail.gmail.com>
 <MWHPR03MB2734E1F091CA062D00C80826860A0@MWHPR03MB2734.namprd03.prod.outlook.com>
Message-ID: <1ca1c4f3-8f59-e74b-5418-ab0788772fc7@udel.edu>

This is what we use for acids and concentrated bases:

https://www.grainger.com/product/CONDOR-Chemical-Resistant-Sleeve-11G029

iulian Codreanu, Ph.D.
Director of Operations, Nanofabrication Facility
University of Delaware
Harker ISE Lab, Room 163
221 Academy Street
Newark, DE 19716
302-831-2784
http://udnf.udel.edu

On 5/16/2019 11:07 AM, Aebersold,Julia W. wrote:
> We use a similar apron, but it has full arm coverage, too. Additional 
> PPE, aside from safety glasses and nitrile gloves, include a face 
> shield and heavy duty chemical resistant gloves when handling these 
> types of chemicals.
>
> Cheers!
>
>
> Julia Aebersold, Ph.D.
>
> MNTC Cleanroom Manager
>
> University of Louisville
>
> 2210 South Brook Street
>
> Shumaker Research Building, Room 233
>
> Louisville, KY? 40292
>
> (502) 852-1572
>
> http://louisville.edu/micronano/
>
> ------------------------------------------------------------------------
> *From:* labnetwork-bounces at mtl.mit.edu 
> <labnetwork-bounces at mtl.mit.edu> on behalf of Brandon Woo 
> <woobc at lnf.umich.edu>
> *Sent:* Wednesday, May 15, 2019 3:40:56 PM
> *To:* labnetwork at mtl.mit.edu
> *Subject:* [labnetwork] Hot Phosphoric PPE
> Hello all,
>
> Does anyone have any recommendations on PPE for processing using hot 
> phosphoric acid?
>
> This is the apron that we are currently using: 
> https://www.grainger.com/product/ANSELL-Chemical-Resistant-Bib-Apron-5EMD0 
> <https://urldefense.proofpoint.com/v2/url?u=https-3A__www.grainger.com_product_ANSELL-2DChemical-2DResistant-2DBib-2DApron-2D5EMD0&d=DwMFaQ&c=OAG1LQNACBDguGvBeNj18Swhr9TMTjS-x4O_KuapPgY&r=l9C3cuOkWyGd6C0ye_FDTBHMFl4lPXPJztVHQPL_Bao&m=d8gTOXzqu08GKDgSFq-QI-hL9O2VGLBylVo_MvgKhnU&s=Gx0tVyszJJH_TgVPsITBxN8Hc2rPZwb-9X2-dqiJRYQ&e=>
>
> Thanks,
> -- 
> Brandon Woo
>
> Engineer in Research Intermediate
> Lurie Nanofabrication Facility
> University of Michigan
>
> 1234 EECS
> 1301 Beal Ave
> Ann Arbor, MI, 48105
>
> woobc at lnf.umich.edu <mailto:woobc at lnf.umich.edu>
> 989-324-0620 (C)
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From spaolini at cns.fas.harvard.edu  Thu May 16 16:59:23 2019
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Thu, 16 May 2019 20:59:23 +0000
Subject: [labnetwork] Diced Samples Glued to UV Release Tape
In-Reply-To: <73c2d3d98aef4ba7bcb040f2075b451f@DC01ZWH0014.Corp.nrc.gc.ca>
References: <73c2d3d98aef4ba7bcb040f2075b451f@DC01ZWH0014.Corp.nrc.gc.ca>
Message-ID: <BL0PR07MB4004477424C04ADACDEA02F6DF0A0@BL0PR07MB4004.namprd07.prod.outlook.com>

Sa'ad,
  Are you applying your tape manually on the hotplate at temperature? If so, UV tape adhesive will cross link at higher temperatures than your UV source delivers. Another possibility is overexposure. Best way to handle it is with a D.O.E using different exposure times. You will find that the window between underexposing and overexposing is fairly generous. I do suspect the elevated temperature on the hotplate being the root cause if that's what you're doing.
  I hope this helps,
    Steve (Equipment Dood)

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu
www.cns.fas.harvard.edu

From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> On Behalf Of Hassan, Sa'ad
Sent: Thursday, May 16, 2019 1:40 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Diced Samples Glued to UV Release Tape

Hello All,

As part of the last step of processing, I take wafers (Si and SiC), with photoresist on top,  dice them, die expand them on a hotplate at 55 degrees Celsius. And finally UV release the tape. I've noticed that sporadically, rather than the tape losing  adhesion, the opposite happens: the die end up cemented to the tape. Has anyone experienced anything like this before?

Cheers,
Sa'ad
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From vamsinittala at gmail.com  Fri May 17 00:51:22 2019
From: vamsinittala at gmail.com (N P VAMSI KRISHNA)
Date: Fri, 17 May 2019 10:21:22 +0530
Subject: [labnetwork] Diced Samples Glued to UV Release Tape
In-Reply-To: <BL0PR07MB4004477424C04ADACDEA02F6DF0A0@BL0PR07MB4004.namprd07.prod.outlook.com>
References: <73c2d3d98aef4ba7bcb040f2075b451f@DC01ZWH0014.Corp.nrc.gc.ca>
 <BL0PR07MB4004477424C04ADACDEA02F6DF0A0@BL0PR07MB4004.namprd07.prod.outlook.com>
Message-ID: <CA+SWD1UL+h1kKv_WbVDndALkSQ5x37ux6V9yBzj8WnzhaMNCBQ@mail.gmail.com>

Dear Sa?ad,
I had seen this problem and lost a few good processed wafers.
The reason I found is overexposure to UV. If you are using EVG 620 or any
MJB tool, please expose the wafers for 90-100 mJ/Cm2 only. If you are using
any direct UV bulb, make sure you are exposing for a very brief period of
time and also the bulb or the stage is not very hot.

The best way to recover the dies which are cemented to the tape is by
dipping the whole diced wafer in PG remover solution for about 12 hours.
After that you can remove the tape very easily. However, you might see a
glue stain at the back of the wafer. Try to ash it for about 5 min and your
devices will work.

Thanks & best regards,
vamsi


On Fri, May 17, 2019 at 5:31 AM Paolini, Steven <
spaolini at cns.fas.harvard.edu> wrote:

> Sa?ad,
>
>   Are you applying your tape manually on the hotplate at temperature? If
> so, UV tape adhesive will cross link at higher temperatures than your UV
> source delivers. Another possibility is overexposure. Best way to handle it
> is with a D.O.E using different exposure times. You will find that the
> window between underexposing and overexposing is fairly generous. I do
> suspect the elevated temperature on the hotplate being the root cause if
> that?s what you?re doing.
>
>   I hope this helps,
>
>     Steve (Equipment Dood)
>
>
>
> Steve Paolini
>
> Principal Equipment Engineer
>
> Harvard University Center for Nanoscale Systems
>
> 11 Oxford St.
>
> Cambridge, MA 02138
>
> 617- 496- 9816
>
> spaolini at cns.fas.harvard.edu
>
> www.cns.fas.harvard.edu
>
>
>
> *From:* labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> *On
> Behalf Of *Hassan, Sa'ad
> *Sent:* Thursday, May 16, 2019 1:40 PM
> *To:* labnetwork at mtl.mit.edu
> *Subject:* [labnetwork] Diced Samples Glued to UV Release Tape
>
>
>
> Hello All,
>
>
>
> As part of the last step of processing, I take wafers (Si and SiC), with
> photoresist on top,  dice them, die expand them on a hotplate at 55 degrees
> Celsius. And finally UV release the tape. I?ve noticed that sporadically,
> rather than the tape losing  adhesion, the opposite happens: the die end up
> cemented to the tape. Has anyone experienced anything like this before?
>
>
>
> Cheers,
>
> Sa?ad
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>


-- 
--
Thanks & Best Regards,
-----------------
*N.P.Vamsi Krishna*
Center for Nano Science and Engineering,
Indian Institute of Science (IISc), Bangalore.
INDIA-560012
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From sivapenmetsapr at gmail.com  Tue May 21 01:07:39 2019
From: sivapenmetsapr at gmail.com (Siva Penmetsa)
Date: Tue, 21 May 2019 10:37:39 +0530
Subject: [labnetwork] Diced Samples Glued to UV Release Tape
In-Reply-To: <73c2d3d98aef4ba7bcb040f2075b451f@DC01ZWH0014.Corp.nrc.gc.ca>
References: <73c2d3d98aef4ba7bcb040f2075b451f@DC01ZWH0014.Corp.nrc.gc.ca>
Message-ID: <CAHmH2YTAEqp5WQR+fKQnvZhB8z6QmVOY++DUGq_QCDj0t8bOSQ@mail.gmail.com>

Dear  Sa?ad,

I have faced similar issue few years back,
have tried different approaches like using UV exposure with mask
aligner(MJB3)
and with a direct UV bulb encased, varying exposure time and increasing the
distance between the UV bulb and sample helped.

You need to fine tune with the UV exposure dose(varying time or intensity,
high intensity UV bulb produces heat),
decreasing temperature of hotplate, and increasing sample distance from UV
source.

With Regards,
Siva Penmetsa,
Technology Manager,
Lithography and Dry Etch,
National Nano Fabrication Centre(NNfC),
Centre for Nano Science And Engineering(CeNSE),
Indian Institute of Science(IISc), Bangalore

On Fri, May 17, 2019 at 2:00 AM Hassan, Sa'ad <Sa'ad.Hassan at nrc-cnrc.gc.ca>
wrote:

> Hello All,
>
>
>
> As part of the last step of processing, I take wafers (Si and SiC), with
> photoresist on top,  dice them, die expand them on a hotplate at 55 degrees
> Celsius. And finally UV release the tape. I?ve noticed that sporadically,
> rather than the tape losing  adhesion, the opposite happens: the die end up
> cemented to the tape. Has anyone experienced anything like this before?
>
>
>
> Cheers,
>
> Sa?ad
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>



<siva at cense.iisc.ernet.in>
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From sivapenmetsapr at gmail.com  Tue May 21 01:33:54 2019
From: sivapenmetsapr at gmail.com (Siva Penmetsa)
Date: Tue, 21 May 2019 11:03:54 +0530
Subject: [labnetwork] 10M Flatness: Photomasks
Message-ID: <CAHmH2YQ8Pifa3P7TMSrMgPWOnAU01WANZfR8yH-vUwzEb+nkvQ@mail.gmail.com>

Dear All,

We do mask writing on photomask blanks of flatness 5M,7M,
currently due to manufacturing issues the supplier
says he can provide photomasks with 10M flatness only.

Please let us to know if you have any experience writing on 10M flatness
photomask blanks,
with respect to critical dimensions, roughness,any processing issues during
mask(direct) writing and mask aligner(exposure) etc.,
and the trade offs(relative to 5M,7M).

Thanks in advance.

With Regards,
Siva Penmetsa,
Technology Manager,
Lithography and Dry Etch,
National Nano Fabrication Centre(NNfC),
Centre for Nano Science And Engineering(CeNSE),
Indian Institute of Science(IISc), Bangalore, INDIA
<siva at cense.iisc.ernet.in>
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From jtk1 at rice.edu  Tue May 21 23:34:37 2019
From: jtk1 at rice.edu (jtk1)
Date: Tue, 21 May 2019 22:34:37 -0500
Subject: [labnetwork]  Sputtering Fluorine Doped SnO2
Message-ID: <20190521223437.Horde._1V9vmq7BzRbvBZAtnctkQ8@webmail.rice.edu>

Hello All,

We have a user that is asking about sputtering fluorine doped SnO2. I  
think any SnO2 from Kurt Lesker should be should sputter as well as  
ITO, but I don't know about the fluorine doping part. That is a new  
one for me.

Does anyone have any experience with FTO?

The user seems inclined to even make their own targets somehow and  
then sputter them. Does anyone have experience with home-made sputter  
targets?

Sincerely,

James Kerwin





From p.kollensperger at ntnu.no  Wed May 22 08:04:21 2019
From: p.kollensperger at ntnu.no (=?utf-8?B?UGV0ZXIgS8O2bGxlbnNwZXJnZXI=?=)
Date: Wed, 22 May 2019 12:04:21 +0000
Subject: [labnetwork] Open Position - Process Group Leader NTNU NanoLab
Message-ID: <3212905C-AA53-4CFF-A5E7-5A2EBEF0E1FF@ntnu.no>

Dear Colleagues,

We are recruiting a new Process Group Leader for NTNU NanoLab and are looking for a researcher/engineer with significant micro- and nanofabrication experience to help us and our users reach our goals faster.
The job advert is listed here:
https://www.linkedin.com/jobs/view/1282186021/

I would be grateful if you could help spread the word and share this with prospective candidates.

Kind regards,

Peter




--------------------------------------------------------------------------------------------------------

Dr. Peter A. K?llensperger
Director NTNU NanoLab & NorFab
Sem S?landvei 14
7491 Trondheim
Norway
Tel: +47 913 70 718
www.norfab.no<http://www.norfab.no>

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From Thomas_Ferraguto at uml.edu  Wed May 22 11:46:53 2019
From: Thomas_Ferraguto at uml.edu (Ferraguto, Thomas S)
Date: Wed, 22 May 2019 15:46:53 +0000
Subject: [labnetwork] Ion Milling
Message-ID: <3079835d8bee4f91bd0636b4aed7bcdb@uml.edu>

Colleagues,

I have a customer that needs dry etch 18nm. We can't use our ICP for the process. Does anyone have an Ion Mill Tool that could provide him the service.

Regards

Tom Ferraguto
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From spaolini at cns.fas.harvard.edu  Wed May 22 16:18:47 2019
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Wed, 22 May 2019 20:18:47 +0000
Subject: [labnetwork] Ion Milling
In-Reply-To: <3079835d8bee4f91bd0636b4aed7bcdb@uml.edu>
References: <3079835d8bee4f91bd0636b4aed7bcdb@uml.edu>
Message-ID: <BL0PR07MB40049842ADF91B26DD6CA88CDF000@BL0PR07MB4004.namprd07.prod.outlook.com>

We got one! Has Ar and O2 milling capability. Have him contact me.

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu
www.cns.fas.harvard.edu

From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> On Behalf Of Ferraguto, Thomas S
Sent: Wednesday, May 22, 2019 11:47 AM
To: 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
Cc: Dennis Work <dennis.slafer at microcontinuum.com>
Subject: [labnetwork] Ion Milling

Colleagues,

I have a customer that needs dry etch 18nm. We can't use our ICP for the process. Does anyone have an Ion Mill Tool that could provide him the service.

Regards

Tom Ferraguto
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From hathaway at cns.fas.harvard.edu  Wed May 22 16:36:55 2019
From: hathaway at cns.fas.harvard.edu (Hathaway, Malcolm R)
Date: Wed, 22 May 2019 20:36:55 +0000
Subject: [labnetwork] Ion Milling
In-Reply-To: <3079835d8bee4f91bd0636b4aed7bcdb@uml.edu>
References: <3079835d8bee4f91bd0636b4aed7bcdb@uml.edu>
Message-ID: <5CE5B2E7.4070507@cns.fas.harvard.edu>

Hi Tom,

At Harvard, we have an ion beam etcher.  What is the material to be etched?


Mac

Mac Hathaway
Senior Process and Systems Engineer
Harvard Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA  02138
617-495-9012


On 5/22/2019 11:46 AM, Ferraguto, Thomas S wrote:
Colleagues,

I have a customer that needs dry etch 18nm. We can?t use our ICP for the process. Does anyone have an Ion Mill Tool that could provide him the service.

Regards

Tom Ferraguto



_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From dennis.slafer at microcontinuum.com  Wed May 22 17:00:47 2019
From: dennis.slafer at microcontinuum.com (Dennis Slafer)
Date: Wed, 22 May 2019 17:00:47 -0400
Subject: [labnetwork] Ion Milling
In-Reply-To: <BL0PR07MB40049842ADF91B26DD6CA88CDF000@BL0PR07MB4004.namprd07.prod.outlook.com>
References: <3079835d8bee4f91bd0636b4aed7bcdb@uml.edu>
 <BL0PR07MB40049842ADF91B26DD6CA88CDF000@BL0PR07MB4004.namprd07.prod.outlook.com>
Message-ID: <CAAav=uObzTCqLi+U7BrYn7rMXvcFT+UcJ804ySdVSwk4QPFj+A@mail.gmail.com>

Hi Steve and Mac,

Thanks for the quick response to Tom's question (and thanks Tom!).

We are trying to etch 18nm of Ni on a 4-in silicon wafer that has a polymer
mask to define the areas from which we want to remove the Ni.  The mask is
a UV-cured polymer, and I was also wondering if you have a feel for the
relative rates of removal of the Ni vs the polymer mask.

Much thanks in advance--Dennis






+++++++++++++++++

Hi Tom,

At Harvard, we have an ion beam etcher.  What is the material to be etched?


Mac

Mac Hathaway

Senior Process and Systems Engineer

Harvard Center for Nanoscale Systems

11 Oxford St.

Cambridge, MA  02138

617-495-9012

On Wed, May 22, 2019 at 4:18 PM Paolini, Steven <
spaolini at cns.fas.harvard.edu> wrote:

> We got one! Has Ar and O2 milling capability. Have him contact me.
>
>
>
> Steve Paolini
>
> Principal Equipment Engineer
>
> Harvard University Center for Nanoscale Systems
>
> 11 Oxford St.
>
> Cambridge, MA 02138
>
> 617- 496- 9816
>
> spaolini at cns.fas.harvard.edu
>
> www.cns.fas.harvard.edu
>
>
>
> *From:* labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> *On
> Behalf Of *Ferraguto, Thomas S
> *Sent:* Wednesday, May 22, 2019 11:47 AM
> *To:* 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
> *Cc:* Dennis Work <dennis.slafer at microcontinuum.com>
> *Subject:* [labnetwork] Ion Milling
>
>
>
> Colleagues,
>
>
>
> I have a customer that needs dry etch 18nm. We can?t use our ICP for the
> process. Does anyone have an Ion Mill Tool that could provide him the
> service.
>
>
>
> Regards
>
>
>
> Tom Ferraguto
>


-- 
Dr. W. Dennis Slafer

President & CTO
MicroContinuum, Inc.
www.microcontinuum.com
57 Smith Place
Cambridge, MA 02138

o: 617.354.1092
c: 781.635.7032
f: 617.354.1107
dennis.slafer at microcontinuum.com
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From yb2471 at columbia.edu  Thu May 23 11:22:09 2019
From: yb2471 at columbia.edu (Youry Borisenkov)
Date: Thu, 23 May 2019 18:22:09 +0300
Subject: [labnetwork] Ion Milling
In-Reply-To: <3079835d8bee4f91bd0636b4aed7bcdb@uml.edu>
References: <3079835d8bee4f91bd0636b4aed7bcdb@uml.edu>
Message-ID: <CAGOt4s30zMYvmxkkYFi4dYrR+orYdpPknmFWtT6ss-mEuVdC4g@mail.gmail.com>

Hi,

Usually a good guess would be 1:1 ratio. Metalls are usually etched faster,
in IBM, than resists. However, an important issue is the lateral
dimensions, if they are smaller than 100nm you will get a redeposition
issues. You will get Nickel on your resist sidewalls.

Regards,
Youry

On Wed, May 22, 2019, 23:20 Ferraguto, Thomas S <Thomas_Ferraguto at uml.edu>
wrote:

> Colleagues,
>
>
>
> I have a customer that needs dry etch 18nm. We can?t use our ICP for the
> process. Does anyone have an Ion Mill Tool that could provide him the
> service.
>
>
>
> Regards
>
>
>
> Tom Ferraguto
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From mmoneck at andrew.cmu.edu  Thu May 23 11:52:55 2019
From: mmoneck at andrew.cmu.edu (Matthew Moneck)
Date: Thu, 23 May 2019 15:52:55 +0000
Subject: [labnetwork] Ion Milling
In-Reply-To: <CAAav=uObzTCqLi+U7BrYn7rMXvcFT+UcJ804ySdVSwk4QPFj+A@mail.gmail.com>
References: <3079835d8bee4f91bd0636b4aed7bcdb@uml.edu>
 <BL0PR07MB40049842ADF91B26DD6CA88CDF000@BL0PR07MB4004.namprd07.prod.outlook.com>
 <CAAav=uObzTCqLi+U7BrYn7rMXvcFT+UcJ804ySdVSwk4QPFj+A@mail.gmail.com>
Message-ID: <fce99fa35b7145709bce0b1a968b6030@andrew.cmu.edu>

Hi All,

We would be happy to offer assistance as well if needed.  In regards to removal rates, we typically see polymers and resists (mostly novolac resin based resists) etch at roughly twice the rate of Ni (sometimes up to 2.5x faster depending on the resist).

Best Regards,

Matt

--
Matthew T. Moneck, Ph.D.
Executive Manager, Claire & John Bertucci Nanotechnology Laboratory
Electrical and Computer Engineering | Carnegie Mellon University
5000 Forbes Ave., Pittsburgh, PA 15213-3890
T: 412.268.5430
F: 412.268.3497
www.ece.cmu.edu<http://www.ece.cmu.edu/>
nanofab.ece.cmu.edu

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Dennis Slafer
Sent: Wednesday, May 22, 2019 5:01 PM
To: Paolini, Steven <spaolini at cns.fas.harvard.edu>; hathaway at cns.fas.harvard.edu
Cc: labnetwork at mtl.mit.edu; B. Diane Martin <diane at microcontinuum.com>
Subject: Re: [labnetwork] Ion Milling

Hi Steve and Mac,

Thanks for the quick response to Tom's question (and thanks Tom!).

We are trying to etch 18nm of Ni on a 4-in silicon wafer that has a polymer mask to define the areas from which we want to remove the Ni.  The mask is a UV-cured polymer, and I was also wondering if you have a feel for the relative rates of removal of the Ni vs the polymer mask.

Much thanks in advance--Dennis






+++++++++++++++++

Hi Tom,

At Harvard, we have an ion beam etcher.  What is the material to be etched?


Mac
Mac Hathaway
Senior Process and Systems Engineer
Harvard Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA  02138
617-495-9012

On Wed, May 22, 2019 at 4:18 PM Paolini, Steven <spaolini at cns.fas.harvard.edu<mailto:spaolini at cns.fas.harvard.edu>> wrote:
We got one! Has Ar and O2 milling capability. Have him contact me.

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu<mailto:spaolini at cns.fas.harvard.edu>
www.cns.fas.harvard.edu<http://www.cns.fas.harvard.edu>

From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu> <labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu>> On Behalf Of Ferraguto, Thomas S
Sent: Wednesday, May 22, 2019 11:47 AM
To: 'labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>' <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Cc: Dennis Work <dennis.slafer at microcontinuum.com<mailto:dennis.slafer at microcontinuum.com>>
Subject: [labnetwork] Ion Milling

Colleagues,

I have a customer that needs dry etch 18nm. We can?t use our ICP for the process. Does anyone have an Ion Mill Tool that could provide him the service.

Regards

Tom Ferraguto


--
Dr. W. Dennis Slafer

President & CTO
MicroContinuum, Inc.
www.microcontinuum.com<http://www.microcontinuum.com>
57 Smith Place
Cambridge, MA 02138

o: 617.354.1092
c: 781.635.7032
f: 617.354.1107
dennis.slafer at microcontinuum.com<mailto:dennis.slafer at microcontinuum.com>
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From paj1 at email.gwu.edu  Thu May 23 14:47:52 2019
From: paj1 at email.gwu.edu (Johnson, Patrick)
Date: Thu, 23 May 2019 14:47:52 -0400
Subject: [labnetwork] Help with Neitronix Mask Aligner power supply.
Message-ID: <CAGopbFL7XiFPj9ZPpA1rMtTBLNhkr6QkFwWaVv9RoEUu-nLtQw@mail.gmail.com>

Hello Group We are having several problems:

1. The power cannot be adjusted to 350 like in the picture you provided in
the manual.

It can only be adjusted from -179 to 59 (at 59 it starts beeping)

I think this is the biggest problem.

We tried ro adjust it in both CP and CI mode with the same bad results.

2. If we multiply the voltage shown and the current shown, then we get a
different value for power than the one shown. Why is that? In the manual,
that is not the case. The voltage (67.3) multiplied with current (5.2)
gives the power shown (350) for an intensity of 12.0.



3. We need to set the tool in intensity constant mode. Probably we need to
fix the other problems first, but right now we just tried it by following
exactly the instructions and we cannot finetune with SET button because it
doesn?t work (rotates but the intensity value doesn?t change).

Also whatever settings we try in intensity constant, it just beeps
continuously because the power goes straight to 59.

*Has anyone else encountered this problem.   Thanks  Patrick*

*Patrick Johnson*
*George Washington University*
*Nano Fabrication Lab Manager *
*Science and Engineering Hall*
*800 NW 22nd Street Rm-B2815*
*Washington D.C. 20052*
*Cell 703 258 2465*
*Desk 202 994 2346*
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From paulmaciel at outlook.com  Thu May 23 16:06:38 2019
From: paulmaciel at outlook.com (Paul Maciel)
Date: Thu, 23 May 2019 20:06:38 +0000
Subject: [labnetwork] Help with Neitronix Mask Aligner power supply.
In-Reply-To: <CAGopbFL7XiFPj9ZPpA1rMtTBLNhkr6QkFwWaVv9RoEUu-nLtQw@mail.gmail.com>
References: <CAGopbFL7XiFPj9ZPpA1rMtTBLNhkr6QkFwWaVv9RoEUu-nLtQw@mail.gmail.com>
Message-ID: <BN8PR05MB6419E30E6CA9264AD90B7103DB010@BN8PR05MB6419.namprd05.prod.outlook.com>

Hello Patrick,

How old is your lamp?  The voltage and current values listed in the manual are for a new lamp.  As the lamp ages these values change and the intensity also decreases.  You should also have the power supply in constant power mode when you take these measurements.

Regards,
---Paul

Paul Maciel
pmaciel at outlook.com<mailto:pmaciel at outlook.com>

On 5/23/2019 2:47 PM, Johnson, Patrick wrote:
Hello Group We are having several problems:

1. The power cannot be adjusted to 350 like in the picture you provided in the manual.

It can only be adjusted from -179 to 59 (at 59 it starts beeping)

I think this is the biggest problem.

We tried ro adjust it in both CP and CI mode with the same bad results.

2. If we multiply the voltage shown and the current shown, then we get a different value for power than the one shown. Why is that? In the manual, that is not the case. The voltage (67.3) multiplied with current (5.2) gives the power shown (350) for an intensity of 12.0.

[cid:part1.125B56FC.EFAD280A at outlook.com]


3. We need to set the tool in intensity constant mode. Probably we need to fix the other problems first, but right now we just tried it by following exactly the instructions and we cannot finetune with SET button because it doesn?t work (rotates but the intensity value doesn?t change).

Also whatever settings we try in intensity constant, it just beeps continuously because the power goes straight to 59.

Has anyone else encountered this problem.   Thanks  Patrick

Patrick Johnson
George Washington University
Nano Fabrication Lab Manager
Science and Engineering Hall
800 NW 22nd Street Rm-B2815
Washington D.C. 20052
Cell 703 258 2465
Desk 202 994 2346



_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork


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From beaudoin at physics.ubc.ca  Thu May 23 19:26:42 2019
From: beaudoin at physics.ubc.ca (Beaudoin, Mario)
Date: Thu, 23 May 2019 16:26:42 -0700
Subject: [labnetwork] Help with Neitronix Mask Aligner power supply.
In-Reply-To: <CAGopbFL7XiFPj9ZPpA1rMtTBLNhkr6QkFwWaVv9RoEUu-nLtQw@mail.gmail.com>
References: <CAGopbFL7XiFPj9ZPpA1rMtTBLNhkr6QkFwWaVv9RoEUu-nLtQw@mail.gmail.com>
Message-ID: <29acb78b-ced9-9efb-7e03-baab34e611ae@physics.ubc.ca>

We have a Neutronix aligner here at UBC.? It works fine for us in CP 
mode but we never managed to make it work in CI mode (would just keep on 
drifting).

On 2019-05-23 11:47 a.m., Johnson, Patrick wrote:
> Hello Group We are having several problems:
>
> 1. The power cannot be adjusted to 350 like in the picture you 
> provided in the manual.
>
> It can only be adjusted from -179 to 59 (at 59 it starts beeping)
>
> I think this is the biggest problem.
>
> We tried ro adjust it in both CP and CI mode with the same bad results.
>
> 2. If we multiply the voltage shown and the current shown, then we get 
> a different value for power than the one shown. Why is that? In the 
> manual, that is not the case. The voltage (67.3) multiplied with 
> current (5.2) gives the power shown (350) for an intensity of 12.0.
>
>
>
> 3. We need to set the tool in intensity constant mode. Probably we 
> need to fix the other problems first, but right now we just tried it 
> by following exactly the instructions and we cannot finetune with SET 
> button because it doesn?t work (rotates but the intensity value 
> doesn?t change).
>
> Also whatever settings we try in intensity constant, it just beeps 
> continuously because the power goes straight to 59.
>
> *Has anyone else encountered this problem.? ?Thanks Patrick*
>
> */Patrick Johnson/*
> /George Washington University/
> /Nano Fabrication Lab Manager /
> /Science and Engineering Hall/
> /800 NW 22nd Street Rm-B2815/
> /Washington D.C. 20052/
> /Cell 703 258 2465/
> /Desk 202 994 2346/
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
-- 
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From tobi at stanford.edu  Thu May 30 01:27:15 2019
From: tobi at stanford.edu (Tobi Beetz)
Date: Thu, 30 May 2019 05:27:15 +0000
Subject: [labnetwork] Open Positions at Stanford Nano Shared Facilities
Message-ID: <BYAPR02MB58133165DB9C66EDF5268491A7180@BYAPR02MB5813.namprd02.prod.outlook.com>

We posted an additional position to support our cleanroom facilities.  Please help us spread the word.

Thanks,

Tobi


Lab Operations Engineer - posted 5/24/2019
The Stanford Nano Shared Facilities (SNSF) is seeking a Lab Operations Engineer to support highly specialized technical research operations within the Stanford Nanopatterning Cleanroom. The successful candidate will manage the day-to-day operations, and maintenance of a number of fabrication and characterization instruments within the cleanroom. S(he) will provide training and support to researchers, develop and implement advanced techniques and also be involved in planning for upgrades and new equipment. The Lab Operations Engineer will report to the Associate Director of SNSF.
https://careersearch.stanford.edu/jobs/lab-operations-engineer-6708

Cleanroom Science & Engineering Associate - posted 5/3/2019
The Stanford Nano Shared Facilities (SNSF) is seeking a Cleanroom Science & Engineering Associate to support research operations within the Stanford Nanopatterning and Flexible Cleanrooms. The successful candidate will support the day-to-day operations, and maintenance of a number of fabrication and characterization instruments within the cleanrooms.  S(he) will provide training and support to researchers. The Cleanroom Science & Engineering Associate will report to the Associate Director of SNSF.
https://careersearch.stanford.edu/jobs/clean-room-science-engineering-associate-6422


Tobi

Tobi Beetz, Ph.D., Associate Director, Stanford Nano Shared Facilities, Stanford University
348 Via Pueblo, Spilker Building, Room 105, Stanford, CA 94305-4088, 650-644-9541, http://snsf.stanford.edu<http://snsf.stanford.edu/>

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From feargal.nolan at tyndall.ie  Thu May 30 07:15:39 2019
From: feargal.nolan at tyndall.ie (Feargal Nolan)
Date: Thu, 30 May 2019 11:15:39 +0000
Subject: [labnetwork] Exciting Semiconductor Maintenance Job Opportunity
	in Ireland
Message-ID: <BE9EE51380810B4EAD86AEF37044C7AD0108513CD0@MAILBOXSERVER.tyndall.ie>

Hi There,

We  have an opening for a Senior Maintenance Engineer in Ireland.  We are Irelands largest ICT Semiconductor Research Centre located in the south of the country in the heart of Cork city.  Cork is Irelands second city and has all the expected and associated amenities and infrastructure.   For details of the post and application instructions please click on the following link.

https://www.tyndall.ie/fn-3-senior-maintenance-engineer-_senior-technical-officer

International relocation package available.  Please feel free to contact me for any queries you might have.

For more information on the Tyndall National Institute please click on  https://www.tyndall.ie/


Best Regards,

Feargal Nolan
Maintenance Manager

Tyndall National Institute
Lee Maltings, Dyke Parade
Cork,  T12 R5CP
Ireland
t   +353 21 234 6656
m +353 87 635 7673

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From jim at photomaskportal.com  Thu May 30 16:23:34 2019
From: jim at photomaskportal.com (Jim Carroll)
Date: Thu, 30 May 2019 15:23:34 -0500
Subject: [labnetwork] Gold Deposition over Chrome
Message-ID: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>

Dear LabNetwork colleagues,

We are trying to add a thin film of gold over patterned chrome on a
standard photomask using e-beam evaporation.  We want the gold to
preferentially adhere to the chrome while lifting off the glass.

After a few tests, it appears that the gold sticks equally well to both the
glass and chrome.  Ultrasonic agitation and swabbing do not selectively
remove the gold from the glass while leaving it on the chrome.  Eventually,
after enough pressure is applied with a swab, the gold releases from both
the glass and chrome.

Does anyone have a suggested approach?

Thanks,
Jim Carroll
*PhotomaskPORTAL*
*We help you make masks*
(415) 448-6275

   -
   <http://www.photomaskportal.com>
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From aandreib at gmail.com  Thu May 30 21:35:09 2019
From: aandreib at gmail.com (Andrei Alamariu)
Date: Thu, 30 May 2019 21:35:09 -0400
Subject: [labnetwork] Gold Deposition over Chrome
In-Reply-To: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>
References: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>
Message-ID: <72E216C2-5482-4953-8C16-57B93AB1AB4C@gmail.com>

Hello,
I think of ?Reverse side exposure Lift-Off?, as:

1. Coat thick Negative photoresist on FrontSide of the mask.
2. Expose it from the BackSide of the mask and develop it.
3. Deposit the thin Gold on the FrontSide.
4. Lift-Off.

It might work depending on the layout: Cr features/spaces as the
UV light diffraction from the BackSide of the mask might affect it.
Success!
Bernard

Sent from my iPad

> On May 30, 2019, at 4:23 PM, Jim Carroll <jim at photomaskportal.com> wrote:
> 
> Dear LabNetwork colleagues,
> 
> We are trying to add a thin film of gold over patterned chrome on a standard photomask using e-beam evaporation.  We want the gold to preferentially adhere to the chrome while lifting off the glass.
> 
> After a few tests, it appears that the gold sticks equally well to both the glass and chrome.  Ultrasonic agitation and swabbing do not selectively remove the gold from the glass while leaving it on the chrome.  Eventually, after enough pressure is applied with a swab, the gold releases from both the glass and chrome.  
> 
> Does anyone have a suggested approach?
>  
> Thanks,
> Jim Carroll
> PhotomaskPORTAL
> We help you make masks
> (415) 448-6275
> 
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From rmorrison at draper.com  Fri May 31 06:40:19 2019
From: rmorrison at draper.com (Morrison, Richard H., Jr)
Date: Fri, 31 May 2019 10:40:19 +0000
Subject: [labnetwork] Gold Deposition over Chrome
In-Reply-To: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>
References: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>
Message-ID: <847898314bf749a3aa68c76b6d1b8db0@draper.com>

Here?s a crazy idea try vapor HMDS, it will react with the glass but not the Chrome and it might help. Gold does not really like to stick to glass how thick is the film?

Rick



From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Jim Carroll
Sent: Thursday, May 30, 2019 4:24 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Gold Deposition over Chrome

Dear LabNetwork colleagues,

We are trying to add a thin film of gold over patterned chrome on a standard photomask using e-beam evaporation.  We want the gold to preferentially adhere to the chrome while lifting off the glass.

After a few tests, it appears that the gold sticks equally well to both the glass and chrome.  Ultrasonic agitation and swabbing do not selectively remove the gold from the glass while leaving it on the chrome.  Eventually, after enough pressure is applied with a swab, the gold releases from both the glass and chrome.

Does anyone have a suggested approach?

Thanks,
Jim Carroll
PhotomaskPORTAL
We help you make masks
(415) 448-6275
?         [Image removed by sender.]
<http://www.photomaskportal.com>
________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From rmorrison at draper.com  Fri May 31 09:56:50 2019
From: rmorrison at draper.com (Morrison, Richard H., Jr)
Date: Fri, 31 May 2019 13:56:50 +0000
Subject: [labnetwork] furnace boat question
Message-ID: <29cfff9997d949aa82c63ba0db436a6f@draper.com>

HI Everyone,

We are having an issue controlling the quartz boats for our furnace operations. We use 4" and 6" boats with 2 different slot widths. DO you think we could lightly scribe a tube number and size on the rail of the boat? I am concerned that it would crack.

Rick


Richard H. Morrison
Principal Member of the Technical Staff
Draper
555 Technology Square
Cambridge, MA
02139-3573

Work  617-258-3420
Cell  508-930-3461
www.draper.com<http://www.draper.com>

________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From fplu at uchicago.edu  Fri May 31 10:03:24 2019
From: fplu at uchicago.edu (Felix Lu)
Date: Fri, 31 May 2019 14:03:24 +0000
Subject: [labnetwork] Gold Deposition over Chrome
In-Reply-To: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>
References: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>
Message-ID: <95446150-F13C-4619-9666-1E4308C691D2@uchicago.edu>

Jim ? How are you patterning the chrome? I would suspect that you have a thin layer of chrome in the ?blanked? areas.

___________________________________________________
Felix P. Lu, Ph.D.
Director of Corporate Engagement

Institute for Molecular Engineering
The University of Chicago
Eckhardt Research Center
5640 S. Ellis Ave., Room ACC104
Chicago, IL 60637

773.834.5063 office

fplu at uchicago.edu<mailto:fplu at uchicago.edu> | ime.uchicago.edu<http://ime.uchicago.edu/>

From: <labnetwork-bounces at mtl.mit.edu> on behalf of Jim Carroll <jim at photomaskportal.com>
Date: Thursday, May 30, 2019 at 6:45 PM
To: "labnetwork at mtl.mit.edu" <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Gold Deposition over Chrome

Dear LabNetwork colleagues,

We are trying to add a thin film of gold over patterned chrome on a standard photomask using e-beam evaporation.  We want the gold to preferentially adhere to the chrome while lifting off the glass.

After a few tests, it appears that the gold sticks equally well to both the glass and chrome.  Ultrasonic agitation and swabbing do not selectively remove the gold from the glass while leaving it on the chrome.  Eventually, after enough pressure is applied with a swab, the gold releases from both the glass and chrome.

Does anyone have a suggested approach?

Thanks,
Jim Carroll
PhotomaskPORTAL
We help you make masks
(415) 448-6275
?         [Image removed by sender.]
<http://www.photomaskportal.com>
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From markc at exper-tech.com  Fri May 31 11:53:22 2019
From: markc at exper-tech.com (Mark Cooper)
Date: Fri, 31 May 2019 15:53:22 +0000
Subject: [labnetwork] furnace boat question
In-Reply-To: <29cfff9997d949aa82c63ba0db436a6f@draper.com>
References: <29cfff9997d949aa82c63ba0db436a6f@draper.com>
Message-ID: <767156BE10188C4898D42427B3D512D720402CD7@EXEXCH1.expertech.local>

Hello Richard,
We often build different boat designs for different processes, so that its obvious what boat goes with what process. Shell and rail boats can achieve the same process results, but appear completely different.

It is more difficult to do this with automated boat loading mass transfer tools, but for hand loaded its relatively easy.

We also do this from time to time with silicon carbide paddles, 2 inch square handle for oxide, and1.75 or 1.25 square for anneal.

Scribe is fine, but the boats (any quartz) should be annealed at 1175 for 8 hours to relieve the stress. The anneal is part of the process when we manufacture boats with the various suppliers.

I am glad to review boats and quartz offline.


[Expertech]
Mark Cooper
General Manager
10 Victor Square Ste 100
Scotts Valley Ca 95066
831 440 4422 direct
831 439 9300 office
831 332 9396 mobile
markc at exper-tech.com



From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> On Behalf Of Morrison, Richard H., Jr
Sent: Friday, May 31, 2019 6:57 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] furnace boat question

HI Everyone,

We are having an issue controlling the quartz boats for our furnace operations. We use 4" and 6" boats with 2 different slot widths. DO you think we could lightly scribe a tube number and size on the rail of the boat? I am concerned that it would crack.

Rick


Richard H. Morrison
Principal Member of the Technical Staff
Draper
555 Technology Square
Cambridge, MA
02139-3573

Work  617-258-3420
Cell  508-930-3461
www.draper.com<http://www.draper.com>

________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From elliscd at auburn.edu  Fri May 31 11:56:22 2019
From: elliscd at auburn.edu (Charles Ellis)
Date: Fri, 31 May 2019 15:56:22 +0000
Subject: [labnetwork] Gold Deposition over Chrome
In-Reply-To: <95446150-F13C-4619-9666-1E4308C691D2@uchicago.edu>
References: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>,
 <95446150-F13C-4619-9666-1E4308C691D2@uchicago.edu>
Message-ID: <MWHPR19MB0063C1E3EEC239248B410941C7190@MWHPR19MB0063.namprd19.prod.outlook.com>

Try using ultrasonic agitation in alcohol or acetone

Get Outlook for iOS<https://aka.ms/o0ukef>

________________________________
From: labnetwork-bounces at mtl.mit.edu on behalf of Felix Lu <fplu at uchicago.edu>
Sent: Friday, May 31, 2019 10:44 AM
To: Jim Carroll; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Gold Deposition over Chrome

Jim ? How are you patterning the chrome? I would suspect that you have a thin layer of chrome in the ?blanked? areas.

___________________________________________________
Felix P. Lu, Ph.D.
Director of Corporate Engagement

Institute for Molecular Engineering
The University of Chicago
Eckhardt Research Center
5640 S. Ellis Ave., Room ACC104
Chicago, IL 60637

773.834.5063 office

fplu at uchicago.edu<mailto:fplu at uchicago.edu> | ime.uchicago.edu<http://ime.uchicago.edu/>

From: <labnetwork-bounces at mtl.mit.edu> on behalf of Jim Carroll <jim at photomaskportal.com>
Date: Thursday, May 30, 2019 at 6:45 PM
To: "labnetwork at mtl.mit.edu" <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Gold Deposition over Chrome

Dear LabNetwork colleagues,

We are trying to add a thin film of gold over patterned chrome on a standard photomask using e-beam evaporation.  We want the gold to preferentially adhere to the chrome while lifting off the glass.

After a few tests, it appears that the gold sticks equally well to both the glass and chrome.  Ultrasonic agitation and swabbing do not selectively remove the gold from the glass while leaving it on the chrome.  Eventually, after enough pressure is applied with a swab, the gold releases from both the glass and chrome.

Does anyone have a suggested approach?

Thanks,
Jim Carroll
PhotomaskPORTAL
We help you make masks
(415) 448-6275
?         [Image removed by sender.]
<http://www.photomaskportal.com>
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From rmorrison at draper.com  Fri May 31 12:06:04 2019
From: rmorrison at draper.com (Morrison, Richard H., Jr)
Date: Fri, 31 May 2019 16:06:04 +0000
Subject: [labnetwork] furnace boat question
In-Reply-To: <767156BE10188C4898D42427B3D512D720402CD7@EXEXCH1.expertech.local>
References: <29cfff9997d949aa82c63ba0db436a6f@draper.com>
 <767156BE10188C4898D42427B3D512D720402CD7@EXEXCH1.expertech.local>
Message-ID: <fb44ee3e40594d5aa5a378e8ba006245@draper.com>

Thank you Mark for the anneal recipe, we will try it.

Rick


From: Mark Cooper [mailto:markc at exper-tech.com]
Sent: Friday, May 31, 2019 11:53 AM
To: Morrison, Richard H., Jr <rmorrison at draper.com>; labnetwork at mtl.mit.edu
Subject: RE: furnace boat question

Hello Richard,
We often build different boat designs for different processes, so that its obvious what boat goes with what process. Shell and rail boats can achieve the same process results, but appear completely different.

It is more difficult to do this with automated boat loading mass transfer tools, but for hand loaded its relatively easy.

We also do this from time to time with silicon carbide paddles, 2 inch square handle for oxide, and1.75 or 1.25 square for anneal.

Scribe is fine, but the boats (any quartz) should be annealed at 1175 for 8 hours to relieve the stress. The anneal is part of the process when we manufacture boats with the various suppliers.

I am glad to review boats and quartz offline.


[Image removed by sender. Expertech]
Mark Cooper
General Manager
10 Victor Square Ste 100
Scotts Valley Ca 95066
831 440 4422 direct
831 439 9300 office
831 332 9396 mobile
markc at exper-tech.com



From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> On Behalf Of Morrison, Richard H., Jr
Sent: Friday, May 31, 2019 6:57 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] furnace boat question

HI Everyone,

We are having an issue controlling the quartz boats for our furnace operations. We use 4" and 6" boats with 2 different slot widths. DO you think we could lightly scribe a tube number and size on the rail of the boat? I am concerned that it would crack.

Rick


Richard H. Morrison
Principal Member of the Technical Staff
Draper
555 Technology Square
Cambridge, MA
02139-3573

Work  617-258-3420
Cell  508-930-3461
www.draper.com<http://www.draper.com>

________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From jim at photomaskportal.com  Fri May 31 12:07:29 2019
From: jim at photomaskportal.com (Jim Carroll)
Date: Fri, 31 May 2019 11:07:29 -0500
Subject: [labnetwork] Gold Deposition over Chrome
In-Reply-To: <72E216C2-5482-4953-8C16-57B93AB1AB4C@gmail.com>
References: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>
 <72E216C2-5482-4953-8C16-57B93AB1AB4C@gmail.com>
Message-ID: <CACVEG9gTfp9fgV1+xjdNOYtZnNiURgppOdwZwh-fKK1bFN2Sag@mail.gmail.com>

Thanks Bernard for the suggestion.  We'll definitely consider this.  Our
chrome lines are 10um and the minimum glass dimensions are 15um so it
should work.
[image: Screenshot 2019-05-31 08.31.57.png]
Thanks,
Jim Carroll
*PhotomaskPORTAL*
*We help you make masks*
(415) 448-6275

   -
   <http://www.photomaskportal.com>



On Thu, May 30, 2019 at 8:35 PM Andrei Alamariu <aandreib at gmail.com> wrote:

> Hello,
> I think of ?Reverse side exposure Lift-Off?, as:
>
> 1. Coat thick Negative photoresist on FrontSide of the mask.
> 2. Expose it from the BackSide of the mask and develop it.
> 3. Deposit the thin Gold on the FrontSide.
> 4. Lift-Off.
>
> It might work depending on the layout: Cr features/spaces as the
> UV light diffraction from the BackSide of the mask might affect it.
> Success!
> Bernard
>
> Sent from my iPad
>
> On May 30, 2019, at 4:23 PM, Jim Carroll <jim at photomaskportal.com> wrote:
>
> Dear LabNetwork colleagues,
>
> We are trying to add a thin film of gold over patterned chrome on a
> standard photomask using e-beam evaporation.  We want the gold to
> preferentially adhere to the chrome while lifting off the glass.
>
> After a few tests, it appears that the gold sticks equally well to both
> the glass and chrome.  Ultrasonic agitation and swabbing do not selectively
> remove the gold from the glass while leaving it on the chrome.  Eventually,
> after enough pressure is applied with a swab, the gold releases from both
> the glass and chrome.
>
> Does anyone have a suggested approach?
>
> Thanks,
> Jim Carroll
> *PhotomaskPORTAL*
> *We help you make masks*
> (415) 448-6275
>
>    -
>    <http://www.photomaskportal.com>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
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From jim at photomaskportal.com  Fri May 31 12:14:27 2019
From: jim at photomaskportal.com (Jim Carroll)
Date: Fri, 31 May 2019 11:14:27 -0500
Subject: [labnetwork] Gold Deposition over Chrome
In-Reply-To: <847898314bf749a3aa68c76b6d1b8db0@draper.com>
References: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>
 <847898314bf749a3aa68c76b6d1b8db0@draper.com>
Message-ID: <CACVEG9j_r_8vQfvY=NtkRy+jOfwq5L3x++V9yWFz_4e53vg3ZA@mail.gmail.com>

Thanks Richard for the suggestion.  Initially we have been targeting a film
thickness of 100nm, approximately the same as the chrome stack (90nm Cr,
10nm Cr203), but may try thinner.

Thanks,
Jim Carroll
*PhotomaskPORTAL*
*We help you make masks*
(415) 448-6275

   -
   <http://www.photomaskportal.com>



On Fri, May 31, 2019 at 5:40 AM Morrison, Richard H., Jr <
rmorrison at draper.com> wrote:

> Here?s a crazy idea try vapor HMDS, it will react with the glass but not
> the Chrome and it might help. Gold does not really like to stick to glass
> how thick is the film?
>
>
>
> Rick
>
>
>
>
>
>
>
> *From:* labnetwork-bounces at mtl.mit.edu [mailto:
> labnetwork-bounces at mtl.mit.edu] *On Behalf Of *Jim Carroll
> *Sent:* Thursday, May 30, 2019 4:24 PM
> *To:* labnetwork at mtl.mit.edu
> *Subject:* [labnetwork] Gold Deposition over Chrome
>
>
>
> Dear LabNetwork colleagues,
>
>
>
> We are trying to add a thin film of gold over patterned chrome on a
> standard photomask using e-beam evaporation.  We want the gold to
> preferentially adhere to the chrome while lifting off the glass.
>
>
> After a few tests, it appears that the gold sticks equally well to both
> the glass and chrome.  Ultrasonic agitation and swabbing do not selectively
> remove the gold from the glass while leaving it on the chrome.  Eventually,
> after enough pressure is applied with a swab, the gold releases from both
> the glass and chrome.
>
>
>
> Does anyone have a suggested approach?
>
>
> Thanks,
>
> Jim Carroll
> *PhotomaskPORTAL*
>
> *We help you make masks*
> (415) 448-6275
>
> ?         [image: Image removed by sender.]
> <http://www.photomaskportal.com>
> ------------------------------
> Notice: This email and any attachments may contain proprietary (Draper
> non-public) and/or export-controlled information of Draper. If you are not
> the intended recipient of this email, please immediately notify the sender
> by replying to this email and immediately destroy all copies of this email.
> ------------------------------
>
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From tony.olsen at utah.edu  Fri May 31 12:16:14 2019
From: tony.olsen at utah.edu (Tony L Olsen)
Date: Fri, 31 May 2019 16:16:14 +0000
Subject: [labnetwork] furnace boat question
In-Reply-To: <29cfff9997d949aa82c63ba0db436a6f@draper.com>
References: <29cfff9997d949aa82c63ba0db436a6f@draper.com>
Message-ID: <4a7f66b3377d4a789d949d4627d18688@utah.edu>

Richard

In industry, we used to scribe our quartz frequently.  Don't remember any resulting cracks.  However, over time the scribe fades due to growths, depositions, and cleaning.  Best long-term option was to have the quartz vendor add text with a small bead of quartz.  But, both of those options are useless if people won't look.  Better, but still not fool-proof, would be to find a way to mate a specific boat to a specific tube/cantilever - although this adds complexity and increases inventory needs.

If you use different slot width's for the same diameter wafer, you might want to consider using only the largest slot width, but cut the slots at a 3 degree angle.  This forces all wafers to lean uniformly and can accommodate different wafer thicknesses with the same slot.

tonyO


Tony Olsen
Nanofab Cleanroom Supervisor/Process Engineer
University of Utah
36 S Wasatch Dr, Suite 2500
Salt Lake City,  UT  84112
801-587-0651 office
801-587-3077 fax
www.nanofab.utah.edu<http://www.nanofab.utah.edu/>



From: Morrison, Richard H., Jr <rmorrison at draper.com>
Sent: Friday, May 31, 2019 07:57
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] furnace boat question

HI Everyone,

We are having an issue controlling the quartz boats for our furnace operations. We use 4" and 6" boats with 2 different slot widths. DO you think we could lightly scribe a tube number and size on the rail of the boat? I am concerned that it would crack.

Rick


Richard H. Morrison
Principal Member of the Technical Staff
Draper
555 Technology Square
Cambridge, MA
02139-3573

Work  617-258-3420
Cell  508-930-3461
www.draper.com<http://www.draper.com>

________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From rmorrison at draper.com  Fri May 31 12:18:04 2019
From: rmorrison at draper.com (Morrison, Richard H., Jr)
Date: Fri, 31 May 2019 16:18:04 +0000
Subject: [labnetwork] furnace boat question
In-Reply-To: <4a7f66b3377d4a789d949d4627d18688@utah.edu>
References: <29cfff9997d949aa82c63ba0db436a6f@draper.com>
 <4a7f66b3377d4a789d949d4627d18688@utah.edu>
Message-ID: <20929bfc1cf24cec9816e9c0852af3fc@draper.com>

Thanks Tony, I like the 3 degree slot

Rick


From: Tony L Olsen [mailto:tony.olsen at utah.edu]
Sent: Friday, May 31, 2019 12:16 PM
To: Morrison, Richard H., Jr <rmorrison at draper.com>; labnetwork at mtl.mit.edu
Subject: RE: furnace boat question

Richard

In industry, we used to scribe our quartz frequently.  Don't remember any resulting cracks.  However, over time the scribe fades due to growths, depositions, and cleaning.  Best long-term option was to have the quartz vendor add text with a small bead of quartz.  But, both of those options are useless if people won't look.  Better, but still not fool-proof, would be to find a way to mate a specific boat to a specific tube/cantilever - although this adds complexity and increases inventory needs.

If you use different slot width's for the same diameter wafer, you might want to consider using only the largest slot width, but cut the slots at a 3 degree angle.  This forces all wafers to lean uniformly and can accommodate different wafer thicknesses with the same slot.

tonyO


Tony Olsen
Nanofab Cleanroom Supervisor/Process Engineer
University of Utah
36 S Wasatch Dr, Suite 2500
Salt Lake City,  UT  84112
801-587-0651 office
801-587-3077 fax
www.nanofab.utah.edu<http://www.nanofab.utah.edu/>



From: Morrison, Richard H., Jr <rmorrison at draper.com<mailto:rmorrison at draper.com>>
Sent: Friday, May 31, 2019 07:57
To: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: [labnetwork] furnace boat question

HI Everyone,

We are having an issue controlling the quartz boats for our furnace operations. We use 4" and 6" boats with 2 different slot widths. DO you think we could lightly scribe a tube number and size on the rail of the boat? I am concerned that it would crack.

Rick


Richard H. Morrison
Principal Member of the Technical Staff
Draper
555 Technology Square
Cambridge, MA
02139-3573

Work  617-258-3420
Cell  508-930-3461
www.draper.com<http://www.draper.com>

________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
________________________________
Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________
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From jim at photomaskportal.com  Fri May 31 12:27:31 2019
From: jim at photomaskportal.com (Jim Carroll)
Date: Fri, 31 May 2019 11:27:31 -0500
Subject: [labnetwork] Gold Deposition over Chrome
In-Reply-To: <95446150-F13C-4619-9666-1E4308C691D2@uchicago.edu>
References: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>
 <95446150-F13C-4619-9666-1E4308C691D2@uchicago.edu>
Message-ID: <CACVEG9gt0D5k7FaXJ9gJOD-CtM8_j_jRCt5zUydPjad8ZKUexQ@mail.gmail.com>

Hi Felix,

Thank you for the suggestion.

For this mask (we have only used diced 1x1" test samples so far), the
pattern transfer to chrome was done with a classic wet etch process
(perchloric acid / ceric ammonium nitrate).  Perhaps if the mask was
underprocessed there could be some residual chrome over the glass areas, as
you speculate, increasing the adhesion of the gold to the "glass" areas.

Thanks,
Jim Carroll
*PhotomaskPORTAL*
*We help you make masks*
(415) 448-6275

   -
   <http://www.photomaskportal.com>



On Fri, May 31, 2019 at 9:03 AM Felix Lu <fplu at uchicago.edu> wrote:

> Jim ? How are you patterning the chrome? I would suspect that you have a
> thin layer of chrome in the ?blanked? areas.
>
>
>
> ___________________________________________________
>
> Felix P. Lu, Ph.D.
>
> Director of Corporate Engagement
>
>
>
> Institute for Molecular Engineering
>
> The University of Chicago
>
> Eckhardt Research Center
>
> 5640 S. Ellis Ave., Room ACC104
>
> Chicago, IL 60637
>
>
>
> 773.834.5063 office
>
>
>
> fplu at uchicago.edu | ime.uchicago.edu
>
>
>
> *From: *<labnetwork-bounces at mtl.mit.edu> on behalf of Jim Carroll <
> jim at photomaskportal.com>
> *Date: *Thursday, May 30, 2019 at 6:45 PM
> *To: *"labnetwork at mtl.mit.edu" <labnetwork at mtl.mit.edu>
> *Subject: *[labnetwork] Gold Deposition over Chrome
>
>
>
> Dear LabNetwork colleagues,
>
>
>
> We are trying to add a thin film of gold over patterned chrome on a
> standard photomask using e-beam evaporation.  We want the gold to
> preferentially adhere to the chrome while lifting off the glass.
>
>
> After a few tests, it appears that the gold sticks equally well to both
> the glass and chrome.  Ultrasonic agitation and swabbing do not selectively
> remove the gold from the glass while leaving it on the chrome.  Eventually,
> after enough pressure is applied with a swab, the gold releases from both
> the glass and chrome.
>
>
>
> Does anyone have a suggested approach?
>
>
> Thanks,
>
> Jim Carroll
> *PhotomaskPORTAL*
>
> *We help you make masks*
> (415) 448-6275
>
> ?         [image: Image removed by sender.]
> <http://www.photomaskportal.com>
>
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From vamsinittala at gmail.com  Fri May 31 12:44:22 2019
From: vamsinittala at gmail.com (N P VAMSI KRISHNA)
Date: Fri, 31 May 2019 11:44:22 -0500
Subject: [labnetwork] Gold Deposition over Chrome
In-Reply-To: <95446150-F13C-4619-9666-1E4308C691D2@uchicago.edu>
References: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>
 <95446150-F13C-4619-9666-1E4308C691D2@uchicago.edu>
Message-ID: <CA+SWD1XFUOnMQkv4yms00Xh=9rKTPpQEa9uwJRDnPbgdivS3FA@mail.gmail.com>

Hi Jim,
I think there is an adhesion issue of the patterned chrome and gold. I
would try giving a brief Argon or Oxygen plasma treatment before the gold
evaporation. This will improve the adhesion of Cr and Au. However, you
might need to sonicate a bit longer for the lift-off.

I am not very sure, but I guess Argon plasma will increase roughness and
help you in faster lift-off.

Hope this helps.

Best regards,
Vamsi


*N.P. Vamsi Krishna*

Postdoctoral Fellow

Pritzker School of Molecular Engineering
The University of Chicago
Chicago, IL  60637



On Fri, May 31, 2019 at 10:47 AM Felix Lu <fplu at uchicago.edu> wrote:

> Jim ? How are you patterning the chrome? I would suspect that you have a
> thin layer of chrome in the ?blanked? areas.
>
>
>
> ___________________________________________________
>
> Felix P. Lu, Ph.D.
>
> Director of Corporate Engagement
>
>
>
> Institute for Molecular Engineering
>
> The University of Chicago
>
> Eckhardt Research Center
>
> 5640 S. Ellis Ave., Room ACC104
>
> Chicago, IL 60637
>
>
>
> 773.834.5063 office
>
>
>
> fplu at uchicago.edu | ime.uchicago.edu
>
>
>
> *From: *<labnetwork-bounces at mtl.mit.edu> on behalf of Jim Carroll <
> jim at photomaskportal.com>
> *Date: *Thursday, May 30, 2019 at 6:45 PM
> *To: *"labnetwork at mtl.mit.edu" <labnetwork at mtl.mit.edu>
> *Subject: *[labnetwork] Gold Deposition over Chrome
>
>
>
> Dear LabNetwork colleagues,
>
>
>
> We are trying to add a thin film of gold over patterned chrome on a
> standard photomask using e-beam evaporation.  We want the gold to
> preferentially adhere to the chrome while lifting off the glass.
>
>
> After a few tests, it appears that the gold sticks equally well to both
> the glass and chrome.  Ultrasonic agitation and swabbing do not selectively
> remove the gold from the glass while leaving it on the chrome.  Eventually,
> after enough pressure is applied with a swab, the gold releases from both
> the glass and chrome.
>
>
>
> Does anyone have a suggested approach?
>
>
> Thanks,
>
> Jim Carroll
> *PhotomaskPORTAL*
>
> *We help you make masks*
> (415) 448-6275
>
> ?         [image: Image removed by sender.]
> <http://www.photomaskportal.com>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>


-- 
--
Thanks & Best Regards,
-----------------

*N.P.Vamsi Krishna *
*Postdoctoral Researcher*

*Pritzker School of Molecular Engineering *
*The University of Chicago*
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From kevin.walsh at louisville.edu  Fri May 31 13:01:53 2019
From: kevin.walsh at louisville.edu (Walsh,Kevin M.)
Date: Fri, 31 May 2019 17:01:53 +0000
Subject: [labnetwork] Gold Deposition over Chrome
In-Reply-To: <72E216C2-5482-4953-8C16-57B93AB1AB4C@gmail.com>
References: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>,
 <72E216C2-5482-4953-8C16-57B93AB1AB4C@gmail.com>
Message-ID: <05BD9C84-748B-45C4-A89E-210D85BBEBB6@louisville.edu>

Nice trick!!

Prof Kevin Walsh
Associate Dean of Research
Speed School of Engineering
University of Louisville

On May 31, 2019, at 8:48 AM, Andrei Alamariu <aandreib at gmail.com<mailto:aandreib at gmail.com>> wrote:

Hello,
I think of ?Reverse side exposure Lift-Off?, as:

1. Coat thick Negative photoresist on FrontSide of the mask.
2. Expose it from the BackSide of the mask and develop it.
3. Deposit the thin Gold on the FrontSide.
4. Lift-Off.

It might work depending on the layout: Cr features/spaces as the
UV light diffraction from the BackSide of the mask might affect it.
Success!
Bernard

Sent from my iPad

On May 30, 2019, at 4:23 PM, Jim Carroll <jim at photomaskportal.com<mailto:jim at photomaskportal.com>> wrote:

Dear LabNetwork colleagues,

We are trying to add a thin film of gold over patterned chrome on a standard photomask using e-beam evaporation.  We want the gold to preferentially adhere to the chrome while lifting off the glass.

After a few tests, it appears that the gold sticks equally well to both the glass and chrome.  Ultrasonic agitation and swabbing do not selectively remove the gold from the glass while leaving it on the chrome.  Eventually, after enough pressure is applied with a swab, the gold releases from both the glass and chrome.

Does anyone have a suggested approach?

Thanks,
Jim Carroll
PhotomaskPORTAL
We help you make masks
(415) 448-6275

  *

<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.photomaskportal.com&d=DwMFaQ&c=OAG1LQNACBDguGvBeNj18Swhr9TMTjS-x4O_KuapPgY&r=xaW_cuYe0C0wYgzm__RIHeqkGUxnC9oKNbyEasYivdE&m=AxRZa1Zz_HqSX2utOlaYa9O_QJFv6TmnCmpaAjgu4qo&s=MQlxnbLxpvpYeiIrqNXL3xDGvgNQ1Ie6M9nbZYe99y4&e=>

[http://www.photomaskportal.com/uploads/1/1/6/1/11617247/9425470.png]

_______________________________________________
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From julia.aebersold at louisville.edu  Fri May 31 13:42:47 2019
From: julia.aebersold at louisville.edu (Aebersold,Julia W.)
Date: Fri, 31 May 2019 17:42:47 +0000
Subject: [labnetwork] furnace boat question
In-Reply-To: <29cfff9997d949aa82c63ba0db436a6f@draper.com>
References: <29cfff9997d949aa82c63ba0db436a6f@draper.com>
Message-ID: <DM5PR03MB27946F19FB2DDC99B7EF64B686190@DM5PR03MB2794.namprd03.prod.outlook.com>

What would you scribe it with?  Diamond scribe that has no metal?  You will probably have to perform a clean on it after scribing if using metal.  But this may be a no-no depending on what type of processing is performed in your tube furnace.


Cheers!


Julia Aebersold, Ph.D.

MNTC Cleanroom Manager

University of Louisville

2210 South Brook Street

Shumaker Research Building, Room 233

Louisville, KY  40292

(502) 852-1572

http://louisville.edu/micronano/<http://louisville.edu/micronano>


________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Morrison, Richard H., Jr <rmorrison at draper.com>
Sent: Friday, May 31, 2019 9:56:50 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] furnace boat question


HI Everyone,



We are having an issue controlling the quartz boats for our furnace operations. We use 4? and 6? boats with 2 different slot widths. DO you think we could lightly scribe a tube number and size on the rail of the boat? I am concerned that it would crack.

Rick





Richard H. Morrison

Principal Member of the Technical Staff

Draper

555 Technology Square

Cambridge, MA

02139-3573



Work  617-258-3420

Cell  508-930-3461

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From sieb at 4dlabs.ca  Fri May 31 16:06:48 2019
From: sieb at 4dlabs.ca (Nathanael Sieb)
Date: Fri, 31 May 2019 13:06:48 -0700
Subject: [labnetwork] Gold Deposition over Chrome
In-Reply-To: <847898314bf749a3aa68c76b6d1b8db0@draper.com>
References: <CACVEG9hTnddxSNkTLHiNnoRpRaHqU4K4Ef-jsWTegMGi_vz4Ew@mail.gmail.com>
 <847898314bf749a3aa68c76b6d1b8db0@draper.com>
Message-ID: <1a80dabc-cfb9-aa23-6958-7d0e9da2a40b@4dlabs.ca>

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