From mhofheins at unm.edu Wed Oct 2 12:46:00 2019 From: mhofheins at unm.edu (Mark Hofheins) Date: Wed, 2 Oct 2019 16:46:00 +0000 Subject: [labnetwork] Electronic parts for MA6/BA6 Karl Suss Aligner Message-ID: Hello All, Does anyone have contact or info on the toggle circuit breakers on the back of the tool? I am nursing 2 semi broken switches. One is a double pull, quad throw. The other is a double pull double throw. Thank you, Mark Hofheins mhofheins at unm.edu Cell 505-710-3527 Office 505-272-7155 Micro Electronics Technician Manufacturing Engineering University of New Mexico MTTC 800 Bradbury S.E. Suit 169 Albuquerque, New Mexico 87106-4346 -------------- next part -------------- An HTML attachment was scrubbed... URL: From stieg at cnsi.ucla.edu Wed Oct 2 15:44:20 2019 From: stieg at cnsi.ucla.edu (Stieg, Adam) Date: Wed, 2 Oct 2019 19:44:20 +0000 Subject: [labnetwork] Electronic parts for MA6/BA6 Karl Suss Aligner Message-ID: <79204567-0013-4221-AC28-4CD129B78FB2@cnsi.ucla.edu> Hi Mark, We use: https://www.hoffmanninstruments.com All the best, Adam Adam Stieg, Ph.D. Associate Director California NanoSystems Institute University of California, Los Angeles (p) 310.206.2902 (e) stieg at cnsi.ucla.edu From: on behalf of Mark Hofheins Date: Wednesday, October 2, 2019 at 12:41 PM To: "labnetwork at mtl.mit.edu" Subject: [labnetwork] Electronic parts for MA6/BA6 Karl Suss Aligner Hello All, Does anyone have contact or info on the toggle circuit breakers on the back of the tool? I am nursing 2 semi broken switches. One is a double pull, quad throw. The other is a double pull double throw. Thank you, Mark Hofheins mhofheins at unm.edu Cell 505-710-3527 Office 505-272-7155 Micro Electronics Technician Manufacturing Engineering University of New Mexico MTTC 800 Bradbury S.E. Suit 169 Albuquerque, New Mexico 87106-4346 -------------- next part -------------- An HTML attachment was scrubbed... URL: From dale at slac.stanford.edu Thu Oct 3 12:35:33 2019 From: dale at slac.stanford.edu (Miller, Dale A.) Date: Thu, 3 Oct 2019 16:35:33 +0000 Subject: [labnetwork] ISO - Sloan Model S-310 RF sputterguns Message-ID: Denizens, We had a Sloan model S-310 RF sputtergun spring a water leak. We are in search of at least one for replacement, or perhaps 2 or 3 for expanding our system. Any suggestions on used equipment vendors would be appreciated. Thanks, Dale Miller Principal Science and Engineering Technician APFD -Coating Lab SLAC National Accelerator Laboratory 926-5202 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Sloan RF sputtergun cut-away.pdf Type: application/pdf Size: 86117 bytes Desc: Sloan RF sputtergun cut-away.pdf URL: From gnair at lsu.edu Thu Oct 3 23:24:15 2019 From: gnair at lsu.edu (Greshma Nair) Date: Fri, 4 Oct 2019 03:24:15 +0000 Subject: [labnetwork] Temescal BJD 1800 E-beam evaporator Message-ID: Hello all, We at LSU have a Temescal BJD 1800 E-beam evaporator that has been unused for many years. The evaporator uses a VersaVac controller, an Autopump controller, and Temescal IC6000 Deposition controller (pictures attached). Recently we tried evacuating the system but haven't had any luck so far. The only progress we have had is to get the mechanical pump turned on and the rough valve to open. Everything after that has been erratic- VersaVac controller gauges not turning on and the rough valve not shutting down when it reaches a pressure < 5x10-2 Torr. We tried getting in touch with Temescal but they do not seem to have a manual for this version of the tool. If anyone has experience working with the Temescal BJD 1800 we would be interested to reach out to you and learn more about the tool. Or if you have an operation manual that you can share with us, it will be highly appreciated. Greshma ---- Greshma Nair, Ph.D. Cleanroom Manager, Nanofabrication Facility (NFF) Center for Advanced Microstructures and Devices (CAMD) 6980 Jefferson Highway Baton Rouge, LA 70806 Phone:?(225) 578-9378 lsu.edu/nanofabrication -------------- next part -------------- A non-text attachment was scrubbed... Name: 20190805_141045.jpg Type: image/jpeg Size: 370860 bytes Desc: 20190805_141045.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: 20190805_141057.jpg Type: image/jpeg Size: 387001 bytes Desc: 20190805_141057.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: 20190805_141136.jpg Type: image/jpeg Size: 489086 bytes Desc: 20190805_141136.jpg URL: From bryan at mfbequipment.com Fri Oct 4 09:57:15 2019 From: bryan at mfbequipment.com (bryan) Date: Fri, 04 Oct 2019 09:57:15 -0400 Subject: [labnetwork] Temescal BJD 1800 E-beam evaporator Message-ID: I can work on this.Thank you,Bryan Hackman?Bryan at mfbequipment.com?484-577-0401Sent from my Samsung Galaxy smartphone. -------- Original message --------From: Jeff Hawks Date: 10/4/19 8:49 AM (GMT-05:00) To: 'Bryan Hackman' Cc: 'Greshma Nair' , labnetwork at mtl.mit.edu Subject: RE: [labnetwork] Temescal BJD 1800 E-beam evaporator Hi Bryan,Is this something you can help with?Best regards,Jeff HawksHawks Technical Services LLC.2715 Swamp Creek Rd.Green Lane, PA. 18054C 215-872-0944-----Original Message-----From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu]On Behalf Of Greshma NairSent: Thursday, October 03, 2019 11:24 PMTo: labnetwork at mtl.mit.eduSubject: [labnetwork] Temescal BJD 1800 E-beam evaporatorHello all,We at LSU have a Temescal BJD 1800 E-beam evaporator that has been unusedfor many years. The evaporator uses a VersaVac controller, an Autopumpcontroller, and Temescal IC6000 Deposition controller (pictures attached).Recently we tried evacuating the system but haven't had any luck so far. Theonly progress we have had is to get the mechanical pump turned on and therough valve to open. Everything after that has been erratic- VersaVaccontroller gauges not turning on and the rough valve not shutting down whenit reaches a pressure < 5x10-2 Torr.We tried getting in touch with Temescal but they do not seem to have amanual for this version of the tool. If anyone has experience working withthe Temescal BJD 1800 we would be interested to reach out to you and learnmore about the tool. Or if you have an operation manual that you can sharewith us, it will be highly appreciated.Greshma----Greshma Nair, Ph.D.Cleanroom Manager,Nanofabrication Facility (NFF)Center for Advanced Microstructures and Devices (CAMD)6980 Jefferson HighwayBaton Rouge, LA 70806Phone:?(225) 578-9378lsu.edu/nanofabrication -------------- next part -------------- An HTML attachment was scrubbed... URL: From spaolini at cns.fas.harvard.edu Fri Oct 4 11:17:08 2019 From: spaolini at cns.fas.harvard.edu (Paolini, Steven) Date: Fri, 4 Oct 2019 15:17:08 +0000 Subject: [labnetwork] Temescal BJD 1800 E-beam evaporator In-Reply-To: References: Message-ID: Greshma, I owned one of these 30 or more years ago. The problems you are having sound typical of a system that has been "mothballed" for a long period of time. My approach would be to reseat all circuit boards and cable connections and test again. You would need a lot of luck finding a manual since these have been out of production for some time. I doubt that the manual would be of any help aside from the schematics. You can e-mail me directly at spaolini at cns.fas.harvard.edu if you have more details or some success. Best regards, Steve Steve Paolini Principal Equipment Engineer Harvard University Center for Nanoscale Systems 11 Oxford St. Cambridge, MA 02138 617- 496- 9816 spaolini at cns.fas.harvard.edu www.cns.fas.harvard.edu -----Original Message----- From: labnetwork-bounces at mtl.mit.edu On Behalf Of Greshma Nair Sent: Thursday, October 03, 2019 11:24 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Temescal BJD 1800 E-beam evaporator Hello all, We at LSU have a Temescal BJD 1800 E-beam evaporator that has been unused for many years. The evaporator uses a VersaVac controller, an Autopump controller, and Temescal IC6000 Deposition controller (pictures attached). Recently we tried evacuating the system but haven't had any luck so far. The only progress we have had is to get the mechanical pump turned on and the rough valve to open. Everything after that has been erratic- VersaVac controller gauges not turning on and the rough valve not shutting down when it reaches a pressure < 5x10-2 Torr. We tried getting in touch with Temescal but they do not seem to have a manual for this version of the tool. If anyone has experience working with the Temescal BJD 1800 we would be interested to reach out to you and learn more about the tool. Or if you have an operation manual that you can share with us, it will be highly appreciated. Greshma ---- Greshma Nair, Ph.D. Cleanroom Manager, Nanofabrication Facility (NFF) Center for Advanced Microstructures and Devices (CAMD) 6980 Jefferson Highway Baton Rouge, LA 70806 Phone:?(225) 578-9378 lsu.edu/nanofabrication From tobi at stanford.edu Fri Oct 4 16:38:51 2019 From: tobi at stanford.edu (Tobi Beetz) Date: Fri, 4 Oct 2019 20:38:51 +0000 Subject: [labnetwork] surplus equipment contacts for XRD instrument Message-ID: Hi All - we are looking to sell off our PANalytical X'Pert PRO XRD system (http://web.stanford.edu/group/glam/xlab/XPert1/XPert1.htm). The system is currently under service contract until March. Please let me know if you have any good contacts for possible buyers either through surplus vendors or other institutions. Thanks, Tobi Tobi Beetz, Ph.D., Associate Director, Stanford Nano Shared Facilities, Stanford University 348 Via Pueblo, Spilker Building, Room 105, Stanford, CA 94305-4088, 650-644-9541, http://snsf.stanford.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From codreanu at udel.edu Sat Oct 5 12:25:59 2019 From: codreanu at udel.edu (Iulian Codreanu) Date: Sat, 5 Oct 2019 12:25:59 -0400 Subject: [labnetwork] Career opportunity with UD NanoFab Message-ID: Hello, I am looking to fill a Process Specialist position. Could you please forward to anyone who may be interested? The main duties are to provide user support on the PVD equipment (sputterer, 2 evaporators, and PLD) and wet etch equipment. UD is located in an area with a relatively low cost of living (e.g. no sales tax) and is close to major cities in the Northeast as well as the beach and the mountains. Some benefits highlights are below: -UD contributes 11% to the 403(b) retirement plan -The employee monthly premium for HMO coverage for a family is $130. The link to the position (Job 494462) is below: https://careers.udel.edu/cw/en-us/job/494462/nano-process-specialist-research-office Thank you very much, Iulian -- iulian Codreanu, Ph.D. Director, Nanofabrication Facility University of Delaware Harker ISE Lab, Room 163 221 Academy Street Newark, DE 19716 302-831-2784 http://udnf.udel.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From wjkiethe at ncsu.edu Mon Oct 7 16:32:42 2019 From: wjkiethe at ncsu.edu (Bill Kiether) Date: Mon, 7 Oct 2019 16:32:42 -0400 Subject: [labnetwork] AJA Orion 5 Sputtering Systems Message-ID: Hello, Does anyone have experience with the operation and maintenance costs of the AJA International ATC Orion Series 5 sputtering tool? If so, would you be willing to talk offline about your experiences? Bill Kiether Photonics Lab Manager NCSU Nanofabrication Facility wjkiethe at ncsu.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From cekendri at mtu.edu Mon Oct 7 18:53:57 2019 From: cekendri at mtu.edu (Chito Kendrick) Date: Mon, 7 Oct 2019 18:53:57 -0400 Subject: [labnetwork] Dektak 6M Message-ID: <26da2f62-bce4-e7ad-5cd7-f4ea44655d8a@mtu.edu> A tiny gear on the stage position knob of our dektak 6M has been stripped by a user. Bruker does not have parts for the system so I was hoping someone on the labnetwork might know someone who has parts for these systems? I am not sure I have enough left of the gear to draw up a design to get a new one made. Chito Kendrick -- Chito Kendrick Ph.D. Chito Kendrick Website MTU Microfabrication Website Managing Director of the Microfabrication Facility Research Assistant Professor Electrical and Computer Engineering Michigan Technological University Room 436 M&M Building 1400 Townsend Dr. Houghton, Michigan 49931-1295 814-308-4255 -------------- next part -------------- An HTML attachment was scrubbed... URL: From brunson at uw.edu Mon Oct 7 20:16:49 2019 From: brunson at uw.edu (Mark A. Brunson) Date: Mon, 7 Oct 2019 17:16:49 -0700 Subject: [labnetwork] Dektak 6M In-Reply-To: <26da2f62-bce4-e7ad-5cd7-f4ea44655d8a@mtu.edu> References: <26da2f62-bce4-e7ad-5cd7-f4ea44655d8a@mtu.edu> Message-ID: <9FFF860A-4FAF-4C78-B5B2-84E38CAF7171@uw.edu> Hi Chito, You may want to contact Anthony Dao. He services a couple of our contact and optical profilometers. He may have the part you need or have a source for it. His website is here . Good luck! Mark Brunson Research Engineer Washington Nanofabrication Facility University of Washington Fluke Hall 115, Box 352143 (206) 543-6267 > On Oct 7, 2019, at 3:53 PM, Chito Kendrick wrote: > > A tiny gear on the stage position knob of our dektak 6M has been stripped by a user. Bruker does not have parts for the system so I was hoping someone on the labnetwork might know someone who has parts for these systems? I am not sure I have enough left of the gear to draw up a design to get a new one made. > > Chito Kendrick > > -- > Chito Kendrick Ph.D. > > Chito Kendrick Website > MTU Microfabrication Website > > Managing Director of the Microfabrication Facility > Research Assistant Professor > Electrical and Computer Engineering > Michigan Technological University > Room 436 M&M Building > 1400 Townsend Dr. > Houghton, Michigan 49931-1295 > > 814-308-4255 > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From na2661 at columbia.edu Tue Oct 8 10:27:16 2019 From: na2661 at columbia.edu (Nava Ariel-Sternberg) Date: Tue, 8 Oct 2019 10:27:16 -0400 Subject: [labnetwork] Search for a characterization expert - Columbia University Message-ID: <014f01d57de4$7c3f8210$74be8630$@columbia.edu> Dear all, CNI labs are recruiting an expert in characterization techniques to be the new materials characterization lab director. Minimum qualifications: Bachelor's Degree (BA/BS). A bachelor's degree in Physics, Chemistry, Materials Science and Engineering, or related field is required. A minimum of 2 years of research experience in a scientific lab using characterization equipment is required. Preferred Qualifications: More than 5 years of research experience, preferably a Ph.D. in Physics, Chemistry, Materials Science and Engineering, or a related field. Understanding of new and modern laboratory characterization and metrology techniques, including equipment operation, maintenance, and data interpretation. If you would like to join us and work in the greatest city in the world check the link for more information and in order to apply: http://pa334.peopleadmin.com/hr/postings/4337 Thanks, Nava Nava Ariel-Sternberg, Ph.D. Director of CNI Shared Labs Columbia University CEPSR/MC 8903 530 west 120th st. NY NY 10027 Office: 212-8549927 Cell: 201-5627600 -------------- next part -------------- An HTML attachment was scrubbed... URL: From na2661 at columbia.edu Tue Oct 8 13:38:51 2019 From: na2661 at columbia.edu (Nava Ariel-Sternberg) Date: Tue, 8 Oct 2019 13:38:51 -0400 Subject: [labnetwork] Search for a characterization expert - Columbia University In-Reply-To: <014f01d57de4$7c3f8210$74be8630$@columbia.edu> References: <014f01d57de4$7c3f8210$74be8630$@columbia.edu> Message-ID: <01ec01d57dff$4041bc40$c0c534c0$@columbia.edu> Apologies for the second email. I was told that the link I sent in the previous email doesn't work so here is the corrected link for the position posting: http://pa334.peopleadmin.com/postings/4337 Have a great week, Nava Nava Ariel-Sternberg, Ph.D. Director of CNI Shared Labs Columbia University CEPSR/MC 8903 530 west 120th st. NY NY 10027 Office: 212-8549927 Cell: 201-5627600 From: Nava Ariel-Sternberg Sent: Tuesday, October 8, 2019 10:27 AM To: labnetwork at mtl.mit.edu Subject: Search for a characterization expert - Columbia University Dear all, CNI labs are recruiting an expert in characterization techniques to be the new materials characterization lab director. Minimum qualifications: Bachelor's Degree (BA/BS). A bachelor's degree in Physics, Chemistry, Materials Science and Engineering, or related field is required. A minimum of 2 years of research experience in a scientific lab using characterization equipment is required. Preferred Qualifications: More than 5 years of research experience, preferably a Ph.D. in Physics, Chemistry, Materials Science and Engineering, or a related field. Understanding of new and modern laboratory characterization and metrology techniques, including equipment operation, maintenance, and data interpretation. If you would like to join us and work in the greatest city in the world check the link for more information and in order to apply: http://pa334.peopleadmin.com/hr/postings/4337 Thanks, Nava Nava Ariel-Sternberg, Ph.D. Director of CNI Shared Labs Columbia University CEPSR/MC 8903 530 west 120th st. NY NY 10027 Office: 212-8549927 Cell: 201-5627600 -------------- next part -------------- An HTML attachment was scrubbed... URL: From cenkyanik at sabanciuniv.edu Wed Oct 9 02:58:37 2019 From: cenkyanik at sabanciuniv.edu (Cenk Yanik (Alumni)) Date: Wed, 9 Oct 2019 09:58:37 +0300 Subject: [labnetwork] RIE Process Gases Message-ID: Dear All, We are wondering how often do you change the RIE process gases even the gases are not run out. We have been told that they should be changed in max 3 years even if they are almost full but we have been using some of them (SF6, C4F8, CHF3) for 5 years and we didn't realize any process-related critical problems during the dry etching process. Have you ever faced with any problems for Fluorine and Chlorine based gases in your institutes? We would appreciate if you could share your experiences and regulations considering the shell life of the process gases at your facilities Best Regards, -- Cenk YANIK, PhD Nanofabrication Team Leader Sabanci University Nanotechnology Research and Application Center ( SUNUM ) Orta Mahalle, ?niversite Caddesi No: 27 34956 Tuzla - ?stanbul Office:+90 216 483 9994 web: sunum.sabanciuniv.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From rmorrison at draper.com Wed Oct 9 09:08:49 2019 From: rmorrison at draper.com (Morrison, Richard H., Jr) Date: Wed, 9 Oct 2019 13:08:49 +0000 Subject: [labnetwork] RIE Process Gases In-Reply-To: References: Message-ID: <6582e8e4ef4d47e0a08e8a183d496260@draper.com> Hi, Here at Draper we only change the gases when they are ?empty?, by that I mean we set a bottom limit for liquids by keeping them on a scale. For true gases we send the bottle back empty if we can. Some time there is just not enough gas left in the bottle to finish a day so we would change it early. We keep a log of all weights and pressures so we can monitor and try to estimate when it would need to be changed so that we have a spare on hand. Rick Richard H. Morrison Principal Member of the Technical Staff Draper 555 Technology Square Cambridge, MA 02139-3573 Work 617-258-3420 Cell 508-930-3461 www.draper.com From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Cenk Yanik (Alumni) Sent: Wednesday, October 09, 2019 2:59 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] RIE Process Gases Dear All, We are wondering how often do you change the RIE process gases even the gases are not run out. We have been told that they should be changed in max 3 years even if they are almost full but we have been using some of them (SF6, C4F8, CHF3) for 5 years and we didn't realize any process-related critical problems during the dry etching process. Have you ever faced with any problems for Fluorine and Chlorine based gases in your institutes? We would appreciate if you could share your experiences and regulations considering the shell life of the process gases at your facilities Best Regards, -- Cenk YANIK, PhD Nanofabrication Team Leader Sabanci University Nanotechnology Research and Application Center ( SUNUM ) Orta Mahalle, ?niversite Caddesi No: 27 34956 Tuzla - ?stanbul Office:+90 216 483 9994 web: sunum.sabanciuniv.edu ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: From cekendri at mtu.edu Wed Oct 9 09:21:24 2019 From: cekendri at mtu.edu (Chito Kendrick) Date: Wed, 9 Oct 2019 09:21:24 -0400 Subject: [labnetwork] RIE Process Gases In-Reply-To: References: Message-ID: Our F-based gases have not seen the use the original manger thought would happen and the tanks that were obtained at the start were size 300, far too big for the actual user base (up to 10 years old). We have not noticed a change in the processing, for me it has been an issue that we have spent more money on bottle rental than the gas is worth. Chito Kendrick On Wed, Oct 9, 2019 at 9:05 AM Cenk Yanik (Alumni) < cenkyanik at sabanciuniv.edu> wrote: > Dear All, > We are wondering how often do you change the RIE process gases even the > gases are not run out. We have been told that they should be changed in max > 3 years even if they are almost full but we have been using some of them > (SF6, C4F8, CHF3) for 5 years and we didn't realize any process-related > critical problems during the dry etching process. > Have you ever faced with any problems for Fluorine and Chlorine based > gases in your institutes? > We would appreciate if you could share your experiences and regulations > considering the shell life of the process gases at your facilities > Best Regards, > > -- > > Cenk YANIK, PhD > Nanofabrication Team Leader > > Sabanci University > Nanotechnology Research and Application Center ( SUNUM ) > Orta Mahalle, ?niversite Caddesi No: 27 34956 Tuzla - ?stanbul > Office:+90 216 483 9994 > web: sunum.sabanciuniv.edu > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -- Chito Kendrick Ph.D. Managing Director of the Microfabrication Facility Research Assistant Professor Electrical and Computer Engineering Michigan Technological University Room 436 M&M Building 1400 Townsend Dr. Houghton, Michigan 49931-1295 814-308-4255 -------------- next part -------------- An HTML attachment was scrubbed... URL: From cenkyanik at sabanciuniv.edu Wed Oct 9 09:32:30 2019 From: cenkyanik at sabanciuniv.edu (Cenk Yanik (Alumni)) Date: Wed, 9 Oct 2019 16:32:30 +0300 Subject: [labnetwork] RIE Process Gases In-Reply-To: <6582e8e4ef4d47e0a08e8a183d496260@draper.com> References: <6582e8e4ef4d47e0a08e8a183d496260@draper.com> Message-ID: Dear Richard, Thank you for the information. We follow the same procedure as you mentioned: " keeping them on a scale" and order the new one when the weight drops under the threshold value but for some of them it takes a few years depending on the usage. Morrison, Richard H., Jr , 9 Eki 2019 ?ar, 16:08 tarihinde ?unu yazd?: > Hi, > > > > Here at Draper we only change the gases when they are ?empty?, by that I > mean we set a bottom limit for liquids by keeping them on a scale. For true > gases we send the bottle back empty if we can. Some time there is just not > enough gas left in the bottle to finish a day so we would change it early. > > > > We keep a log of all weights and pressures so we can monitor and try to > estimate when it would need to be changed so that we have a spare on hand. > > > > Rick > > > > > > Richard H. Morrison > > Principal Member of the Technical Staff > > Draper > > 555 Technology Square > > Cambridge, MA > > 02139-3573 > > > > Work 617-258-3420 > > Cell 508-930-3461 > > www.draper.com > > > > > > > > > > > > *From:* labnetwork-bounces at mtl.mit.edu [mailto: > labnetwork-bounces at mtl.mit.edu] *On Behalf Of *Cenk Yanik (Alumni) > *Sent:* Wednesday, October 09, 2019 2:59 AM > *To:* labnetwork at mtl.mit.edu > *Subject:* [labnetwork] RIE Process Gases > > > > Dear All, > > We are wondering how often do you change the RIE process gases even the > gases are not run out. We have been told that they should be changed in max > 3 years even if they are almost full but we have been using some of them > (SF6, C4F8, CHF3) for 5 years and we didn't realize any process-related > critical problems during the dry etching process. > > Have you ever faced with any problems for Fluorine and Chlorine based > gases in your institutes? > > We would appreciate if you could share your experiences and regulations > considering the shell life of the process gases at your facilities > > Best Regards, > > > > -- > > > Cenk YANIK, PhD > > Nanofabrication Team Leader > > Sabanci University > Nanotechnology Research and Application Center ( SUNUM ) > Orta Mahalle, ?niversite Caddesi No: 27 34956 Tuzla - ?stanbul > Office:+90 216 483 9994 > web: sunum.sabanciuniv.edu > ------------------------------ > Notice: This email and any attachments may contain proprietary (Draper > non-public) and/or export-controlled information of Draper. If you are not > the intended recipient of this email, please immediately notify the sender > by replying to this email and immediately destroy all copies of this email. > ------------------------------ > -- Cenk YANIK, PhD Nanofabrication Team Leader Sabanci University Nanotechnology Research and Application Center ( SUNUM ) Orta Mahalle, ?niversite Caddesi No: 27 34956 Tuzla - ?stanbul Office:+90 216 483 9994 web: sunum.sabanciuniv.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From lesjo at dtu.dk Wed Oct 9 10:12:30 2019 From: lesjo at dtu.dk (Leif Steen Johansen) Date: Wed, 9 Oct 2019 14:12:30 +0000 Subject: [labnetwork] RIE Process Gases In-Reply-To: References: Message-ID: <77270a20b7684c5489391bbf784ddf40@dtu.dk> Hello Cenk, We change our SF6 and C4F8 every year because the bottles have been emptied. However, we have had the same CHF3 bottle for over seven years without any known problem. Best regards, Leif [http://www.dtu.dk/-/media/DTU_Generelt/Andet/mail-signature-logo.png] Leif Steen Johansen Head of Operations, Ph.D. Dir. +45 45 25 57 13 Mob. +45 25 34 89 92 lesjo at dtu.dk ?rsteds Plads, Byg. 347 Building 347 2800 Lyngby www.dtu.dk/english From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Cenk Yanik (Alumni) Sent: 9. oktober 2019 08:59 To: labnetwork at mtl.mit.edu Subject: [labnetwork] RIE Process Gases Dear All, We are wondering how often do you change the RIE process gases even the gases are not run out. We have been told that they should be changed in max 3 years even if they are almost full but we have been using some of them (SF6, C4F8, CHF3) for 5 years and we didn't realize any process-related critical problems during the dry etching process. Have you ever faced with any problems for Fluorine and Chlorine based gases in your institutes? We would appreciate if you could share your experiences and regulations considering the shell life of the process gases at your facilities Best Regards, -- Cenk YANIK, PhD Nanofabrication Team Leader Sabanci University Nanotechnology Research and Application Center ( SUNUM ) Orta Mahalle, ?niversite Caddesi No: 27 34956 Tuzla - ?stanbul Office:+90 216 483 9994 web: sunum.sabanciuniv.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 2663 bytes Desc: image001.png URL: From mmoneck at andrew.cmu.edu Wed Oct 9 14:19:13 2019 From: mmoneck at andrew.cmu.edu (Matthew Moneck) Date: Wed, 9 Oct 2019 18:19:13 +0000 Subject: [labnetwork] RIE Process Gases In-Reply-To: References: Message-ID: <06c318533e9c42ff90c245a980c3a50a@andrew.cmu.edu> Hi Cenk, We try to run ours to a low point, but not quite empty if we can. For example, we typically run 2000psi cylinders to 200psi then swap the bottle. For lower pressure cylinders or liquid cylinders measured by weight, we still tend to use that 10% mark as a changeout point, although, admittedly, some cylinders do inadvertently run to complete empty. That said, cylinders do have a shelf life and most university Environmental Health and Safety groups have their own recommendations on what they consider acceptable. Many of the semi grade gases ?expire? within 3 years. We have gone well beyond this without any noticeable change in our processes. However, you have to pay attention to the cylinder itself. There is a stamped certification date typically imprinted at the top of the cylinder. This is the date on which the cylinder underwent hydrostatic testing and certification. Most high pressure gas cylinders are rated 10yrs beyond that date. If you have a cylinder that is approaching the 10yr mark, send it back (note that your cylinder may not have been filled in year 1, so do not assume that it?s 10yrs past the fill date). For Cl and other corrosive gases, I believe the limit is typically 5yrs for the cylinder, although, I would need to check that to be 100% sure. We tend to swap ours out within 2yrs. You also have to watch for cylinders containing gases that react with the cylinder material itself. For instance, anhydrous HF used in vapor HF systems can be purchased in steel (i.e. iron) cylinders. At the time of purchase, the cylinder pressure is only a couple psi or so. However, if you hold on to one of these bottles for too long, the HF can react with Fe to release hydrogen, causing the cylinder to overpressurize and possibly explode. It is typically recommended to exchange such cylinder within 2yrs. For that reason, we use nickel cylinders on this material and still follow the 2yr rule. Best Regards, Matt -- Matthew T. Moneck, Ph.D. Executive Manager, Claire & John Bertucci Nanotechnology Laboratory Electrical and Computer Engineering | Carnegie Mellon University 5000 Forbes Ave., Pittsburgh, PA 15213-3890 T: 412.268.5430 F: 412.268.3497 www.ece.cmu.edu nanofab.ece.cmu.edu From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Cenk Yanik (Alumni) Sent: Wednesday, October 09, 2019 2:59 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] RIE Process Gases Dear All, We are wondering how often do you change the RIE process gases even the gases are not run out. We have been told that they should be changed in max 3 years even if they are almost full but we have been using some of them (SF6, C4F8, CHF3) for 5 years and we didn't realize any process-related critical problems during the dry etching process. Have you ever faced with any problems for Fluorine and Chlorine based gases in your institutes? We would appreciate if you could share your experiences and regulations considering the shell life of the process gases at your facilities Best Regards, -- Cenk YANIK, PhD Nanofabrication Team Leader Sabanci University Nanotechnology Research and Application Center ( SUNUM ) Orta Mahalle, ?niversite Caddesi No: 27 34956 Tuzla - ?stanbul Office:+90 216 483 9994 web: sunum.sabanciuniv.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From sieb at 4dlabs.ca Wed Oct 9 14:56:56 2019 From: sieb at 4dlabs.ca (Nathanael Sieb) Date: Wed, 9 Oct 2019 11:56:56 -0700 Subject: [labnetwork] RIE Process Gases In-Reply-To: References: <6582e8e4ef4d47e0a08e8a183d496260@draper.com> Message-ID: <6f985ee9-7888-78fd-5b82-7543ff3e58a1@4dlabs.ca> An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: hbidfkeelnbdlhfd.png Type: image/png Size: 4353 bytes Desc: not available URL: From spaolini at cns.fas.harvard.edu Wed Oct 9 16:39:32 2019 From: spaolini at cns.fas.harvard.edu (Paolini, Steven) Date: Wed, 9 Oct 2019 20:39:32 +0000 Subject: [labnetwork] Scrubber packing Message-ID: Greetings fellow fabnetworkers, We have approximately 35 cubic feet of spherical packing ( Media balls) for a water scrubber that we no longer need. They are 3 ?" dia. And made of polypropylene. It would be a shame to dispose of them. I will be interested in trading them for a pastrami sandwich. Let me know. Equipment Dood Steve Paolini Principal Equipment Engineer Harvard University Center for Nanoscale Systems 11 Oxford St. Cambridge, MA 02138 617- 496- 9816 spaolini at cns.fas.harvard.edu www.cns.fas.harvard.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From thibeault at ece.ucsb.edu Wed Oct 9 18:02:30 2019 From: thibeault at ece.ucsb.edu (Brian Thibeault) Date: Wed, 9 Oct 2019 15:02:30 -0700 Subject: [labnetwork] Open Scientist Position at UCSB Nanofabrication Facility Message-ID: *Hello Everyone,* *The UCSB Nanofabrication Facility has an open scientist position within the facility, primarily focused in the areas of ion beam lithography and electron beam lithography. The official position posting is located here: * *https://recruit.ap.ucsb.edu/JPF01462 * *Please feel free to contact Shannon Gann, information below, with any additional questions. An awarded PhD in engineering or physical sciences is a required qualification. * *The University of California is an Equal Opportunity/Affirmative Action Employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability status, protected veteran status, or any other characteristic protected by law.* Shannon Gann University of California, Santa Barbara Electrical & Computer Engineering HFH 4102 Personnel Analyst (805) 893-8748 In Office M-F 9am-3pm -------------- next part -------------- An HTML attachment was scrubbed... URL: From cenkyanik at sabanciuniv.edu Thu Oct 10 02:37:29 2019 From: cenkyanik at sabanciuniv.edu (Cenk Yanik (Alumni)) Date: Thu, 10 Oct 2019 09:37:29 +0300 Subject: [labnetwork] RIE Process Gases In-Reply-To: <06c318533e9c42ff90c245a980c3a50a@andrew.cmu.edu> References: <06c318533e9c42ff90c245a980c3a50a@andrew.cmu.edu> Message-ID: Dear Matt, Thank you ( for a comprehensive reply) and everyone for sharing the details. Best Regards, Matthew Moneck , 9 Eki 2019 ?ar, 21:19 tarihinde ?unu yazd?: > Hi Cenk, > > > > We try to run ours to a low point, but not quite empty if we can. For > example, we typically run 2000psi cylinders to 200psi then swap the bottle. > For lower pressure cylinders or liquid cylinders measured by weight, we > still tend to use that 10% mark as a changeout point, although, > admittedly, some cylinders do inadvertently run to complete empty. > > > > That said, cylinders do have a shelf life and most university > Environmental Health and Safety groups have their own recommendations on > what they consider acceptable. Many of the semi grade gases ?expire? > within 3 years. We have gone well beyond this without any noticeable > change in our processes. However, you have to pay attention to the > cylinder itself. There is a stamped certification date typically > imprinted at the top of the cylinder. This is the date on which the > cylinder underwent hydrostatic testing and certification. Most high > pressure gas cylinders are rated 10yrs beyond that date. If you have a > cylinder that is approaching the 10yr mark, send it back (note that your > cylinder may not have been filled in year 1, so do not assume that it?s > 10yrs past the fill date). > > > > For Cl and other corrosive gases, I believe the limit is typically 5yrs > for the cylinder, although, I would need to check that to be 100% sure. We > tend to swap ours out within 2yrs. You also have to watch for cylinders > containing gases that react with the cylinder material itself. For > instance, anhydrous HF used in vapor HF systems can be purchased in steel > (i.e. iron) cylinders. At the time of purchase, the cylinder pressure is > only a couple psi or so. However, if you hold on to one of these bottles > for too long, the HF can react with Fe to release hydrogen, causing the > cylinder to overpressurize and possibly explode. It is typically > recommended to exchange such cylinder within 2yrs. For that reason, we > use nickel cylinders on this material and still follow the 2yr rule. > > > > Best Regards, > > > Matt > > > > -- > *Matthew T. Moneck, Ph.D.* > Executive Manager, Claire & John Bertucci Nanotechnology Laboratory > Electrical and Computer Engineering | Carnegie Mellon University > 5000 Forbes Ave., Pittsburgh, PA 15213-3890 > T: 412.268.5430 > F: 412.268.3497 > www.ece.cmu.edu > nanofab.ece.cmu.edu > > > > *From:* labnetwork-bounces at mtl.mit.edu [mailto: > labnetwork-bounces at mtl.mit.edu] *On Behalf Of *Cenk Yanik (Alumni) > *Sent:* Wednesday, October 09, 2019 2:59 AM > *To:* labnetwork at mtl.mit.edu > *Subject:* [labnetwork] RIE Process Gases > > > > Dear All, > > We are wondering how often do you change the RIE process gases even the > gases are not run out. We have been told that they should be changed in max > 3 years even if they are almost full but we have been using some of them > (SF6, C4F8, CHF3) for 5 years and we didn't realize any process-related > critical problems during the dry etching process. > > Have you ever faced with any problems for Fluorine and Chlorine based > gases in your institutes? > > We would appreciate if you could share your experiences and regulations > considering the shell life of the process gases at your facilities > > Best Regards, > > > > -- > > > Cenk YANIK, PhD > > Nanofabrication Team Leader > > Sabanci University > Nanotechnology Research and Application Center ( SUNUM ) > Orta Mahalle, ?niversite Caddesi No: 27 34956 Tuzla - ?stanbul > Office:+90 216 483 9994 > web: sunum.sabanciuniv.edu > -- Cenk YANIK, PhD Nanofabrication Team Leader Sabanci University Nanotechnology Research and Application Center ( SUNUM ) Orta Mahalle, ?niversite Caddesi No: 27 34956 Tuzla - ?stanbul Office:+90 216 483 9994 web: sunum.sabanciuniv.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From schweig at umich.edu Thu Oct 10 04:56:35 2019 From: schweig at umich.edu (Dennis Schweiger) Date: Thu, 10 Oct 2019 04:56:35 -0400 Subject: [labnetwork] Scrubber packing In-Reply-To: References: Message-ID: Steve, If you have no takers yet, we'll take them off of your hands.....I'm not sure how we'll get the pastrami sandwich to you though :-) For shipping purposes, we could use our UPS account number to get them here. We should talk more to finalize the details. Thanks, Dennis Schweiger University of Michigan/LNF 734.647.2055 Ofc "People can be divided into 3 groups - those that make things happen, those that watch things happen, and those that wonder what happened." Within which group do you belong? On Wed, Oct 9, 2019 at 10:16 PM Paolini, Steven < spaolini at cns.fas.harvard.edu> wrote: > Greetings fellow fabnetworkers, > > We have approximately 35 cubic feet of spherical packing ( Media balls) > for a water scrubber that we no longer need. They are 3 ?? dia. And made of > polypropylene. It would be a shame to dispose of them. I will be interested > in trading them for a pastrami sandwich. Let me know. > > Equipment Dood > > > > Steve Paolini > > Principal Equipment Engineer > > Harvard University Center for Nanoscale Systems > > 11 Oxford St. > > Cambridge, MA 02138 > > 617- 496- 9816 > > spaolini at cns.fas.harvard.edu > > www.cns.fas.harvard.edu > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From k.luongo at gmail.com Thu Oct 10 13:24:25 2019 From: k.luongo at gmail.com (Kevin luongo) Date: Thu, 10 Oct 2019 13:24:25 -0400 Subject: [labnetwork] Piezo repair of Veeco dimension 3100 AFM Message-ID: Salutations, We have a Veeco dimension 3100 that, based on diagnostic testing, requires a piezo tube repair. The suggested quote so far by ASM is ~12,500 USD. Has anyone experienced this before? Who did the repair? What was the cost? Many thanks and best regards, Kevin -- Kevin Luongo, PhD BioNIUM University of Miami https://bionium.miami.edu/ https://my.matterport.com/show/?m=ABLNvseuQgQ -------------- next part -------------- An HTML attachment was scrubbed... URL: From pilarhf at umich.edu Thu Oct 10 17:35:44 2019 From: pilarhf at umich.edu (Pilar Herrera-Fierro) Date: Thu, 10 Oct 2019 17:35:44 -0400 Subject: [labnetwork] Piezo repair of Veeco dimension 3100 AFM In-Reply-To: References: Message-ID: When ever we needed piezo repairs on our Dimension, or our ICON, we send it back to Bruker, and that amount seems correct. Pilar On Thu, Oct 10, 2019 at 5:29 PM Kevin luongo wrote: > Salutations, > > We have a Veeco dimension 3100 that, based on diagnostic testing, requires > a piezo tube repair. > The suggested quote so far by ASM is ~12,500 USD. > > Has anyone experienced this before? > Who did the repair? > What was the cost? > > Many thanks and best regards, > Kevin > > -- > Kevin Luongo, PhD > BioNIUM > University of Miami > https://bionium.miami.edu/ > https://my.matterport.com/show/?m=ABLNvseuQgQ > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -- Pilar Herrera-Fierro, Ph.D. LNF User Services Director Lurie Nanofabrication Facility University of Michigan RM 1239 EECS Building 1301 Beal Ave. Ann Arbor, MI 48109-2122 *Cell* 734 646 1399 (734) 646 1399 www.lnf.umich.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From spaolini at cns.fas.harvard.edu Thu Oct 10 17:37:31 2019 From: spaolini at cns.fas.harvard.edu (Paolini, Steven) Date: Thu, 10 Oct 2019 21:37:31 +0000 Subject: [labnetwork] Scrubber packing In-Reply-To: References:

Message-ID: Dennis, Thanks for the inquiry. I have a person local that is interested. If they don?t follow through, I?ll ship them to you. I won?t know until Tuesday though. Steve Steve Paolini Principal Equipment Engineer Harvard University Center for Nanoscale Systems 11 Oxford St. Cambridge, MA 02138 617- 496- 9816 spaolini at cns.fas.harvard.edu www.cns.fas.harvard.edu From: Dennis Schweiger Sent: Thursday, October 10, 2019 4:57 AM To: Paolini, Steven Cc: Fab Network (labnetwork at mtl.mit.edu) Subject: Re: [labnetwork] Scrubber packing Steve, If you have no takers yet, we'll take them off of your hands.....I'm not sure how we'll get the pastrami sandwich to you though :-) For shipping purposes, we could use our UPS account number to get them here. We should talk more to finalize the details. Thanks, Dennis Schweiger University of Michigan/LNF 734.647.2055 Ofc "People can be divided into 3 groups - those that make things happen, those that watch things happen, and those that wonder what happened." Within which group do you belong? On Wed, Oct 9, 2019 at 10:16 PM Paolini, Steven > wrote: Greetings fellow fabnetworkers, We have approximately 35 cubic feet of spherical packing ( Media balls) for a water scrubber that we no longer need. They are 3 ?? dia. And made of polypropylene. It would be a shame to dispose of them. I will be interested in trading them for a pastrami sandwich. Let me know. Equipment Dood Steve Paolini Principal Equipment Engineer Harvard University Center for Nanoscale Systems 11 Oxford St. Cambridge, MA 02138 617- 496- 9816 spaolini at cns.fas.harvard.edu www.cns.fas.harvard.edu _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From spritchett at eng.utah.edu Wed Oct 16 11:54:32 2019 From: spritchett at eng.utah.edu (Steve Pritchett) Date: Wed, 16 Oct 2019 09:54:32 -0600 Subject: [labnetwork] PlasmaTherm SLR 770 ICP etcher help? Message-ID: Hi Folks, We are having trouble with initial power-up of an older model PlasmaTherm etch system, SLR?770 ICP. We have the OEM disconnect with EMO circuit transformer and relay to energize the main power contactor. We have the contractor schematic and our electrician was following that wiring, but electrical enclosure connection terminals could be in question. EMO and enclosure switch are closed but EMO circuit is open. Is there anyone familiar with this system and circuit and willing to discuss the problem by phone or off-line email? I?m also looking for schematics on this system that might include the EMO circuit. PlasmaTherm responded that they have ?lost? those for this vintage of system. They did have drawing 300080219 for a modified version but it did not use the EMO circuit through the disconnect and isn?t any help. I think documents for S/N range of ~ 4500 to 6900 would likely be closest match to our system. Thanks, Steve Pritchett Sr Process Eng. 801-859-8670 https://www.nanofab.utah.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From fabien at edgehogtech.com Wed Oct 16 14:18:26 2019 From: fabien at edgehogtech.com (Fabien Dauzou) Date: Wed, 16 Oct 2019 18:18:26 +0000 Subject: [labnetwork] Subcontracting dry etching scenarios Message-ID: Dear Labnetwork, I am wondering if you can help us, or maybe give us some direction. As a startup with potential customers we are looking for subcontracting part of our process. I cannot find it but It would be nice and useful to have a list of all facilities and their possible prototyping/preproduction capacities. Let me know if you have one! Below are our possible scenarios: Scenario 1 : 10K wafers 4'' fused-silica wafer 0.55 mm ICP-RIE ~ 5 min etch time Total price or /wafer? timing? Scenario 2 : 200K wafer/year 4'' fused-silica wafer 0.55 mm ICP-RIE ~ 5 min etch time Feasibility % ? Total price or $/wafer? Timing? If any facilities is capable of these challenges, please contact me. Best regards, Bien cordialement, Fabien Dauzou (Jr. Eng.) R&D Process Engineer/Entrepreneur fabien at edgehogtech.com Mob: 438-868-1657 https://www.edgehogtech.com/ [cid:image003.png at 01D5842C.92A015D0] 780 Av. Brewster, RC-016, Montreal, QC, Canada, H4C 2K1 Think green, before printing this email. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image003.png Type: image/png Size: 71441 bytes Desc: image003.png URL: From rmorrison at draper.com Thu Oct 17 06:01:15 2019 From: rmorrison at draper.com (Morrison, Richard H., Jr) Date: Thu, 17 Oct 2019 10:01:15 +0000 Subject: [labnetwork] Subcontracting dry etching scenarios In-Reply-To: References: Message-ID: Hi, How is the wafer masked for the etch? How deep is the etch? Have you already developed the ICP/RIE process if so what tool was it on? Remember that an ICP/RIE is only going to be operational 90% of the time due to cleans and PM schedules. Then the vendor would have other customers to work in so with your wafer volumes this will be a challenge. 10K wafers per year is ~ 193 wafers per week assuming no photolitho operation a 5 minute etch with overhead is really 7-8 minutes so it would take 1544 minutes to just etch, that is 25 hours work per week. Then you need to add in inspections and clean operations. 200K wafers per year is ~3846 per week you will need 30768 minutes of etch time a week or 512 fab hours, a 24/7 fab is 168 hours per week so you would need 5 tools. Good luck with your search, Draper has a small capability nowhere what you need, try IMT in Santa Barbara Ca. Rick From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Fabien Dauzou Sent: Wednesday, October 16, 2019 2:18 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Subcontracting dry etching scenarios Dear Labnetwork, I am wondering if you can help us, or maybe give us some direction. As a startup with potential customers we are looking for subcontracting part of our process. I cannot find it but It would be nice and useful to have a list of all facilities and their possible prototyping/preproduction capacities. Let me know if you have one! Below are our possible scenarios: Scenario 1 : 10K wafers 4'' fused-silica wafer 0.55 mm ICP-RIE ~ 5 min etch time Total price or /wafer? timing? Scenario 2 : 200K wafer/year 4'' fused-silica wafer 0.55 mm ICP-RIE ~ 5 min etch time Feasibility % ? Total price or $/wafer? Timing? If any facilities is capable of these challenges, please contact me. Best regards, Bien cordialement, Fabien Dauzou (Jr. Eng.) R&D Process Engineer/Entrepreneur fabien at edgehogtech.com Mob: 438-868-1657 https://www.edgehogtech.com/ [cid:image001.png at 01D584AE.8DE070D0] 780 Av. Brewster, RC-016, Montreal, QC, Canada, H4C 2K1 Think green, before printing this email. ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 71441 bytes Desc: image001.png URL: From rlc12 at cornell.edu Thu Oct 17 12:18:29 2019 From: rlc12 at cornell.edu (Rebecca Lee Vliet) Date: Thu, 17 Oct 2019 16:18:29 +0000 Subject: [labnetwork] January 2020 CNF TCN Short Course - Registration Open! Message-ID: [cid:image003.jpg at 01D584E4.FAD7BC30]CNF Short Course: Technology & Characterization at the Nanoscale (CNF TCN) Tuesday - Friday, January 14 - 17, 2020 This intensive 3.5 day short course offered by the Cornell NanoScale Science & Technology Facility, combines lectures and laboratory demonstrations designed to impart a broad understanding of the science and technology required to undertake research in nanoscience. TCN is an ideal way for faculty, students, post docs and staff members to rapidly come up to speed in many of the technologies that users of the CNF need to employ. Members of the high tech business community will also find it an effective way to learn best practices for success in a nanofab environment. Attendance is open to the general scientific community, but class size is limited. Thanks to funding from the National Science Foundation, this course is free for graduate students from U.S. institutions outside Cornell, up to 5 students per external university. (Travel and lodging are not included.) Students who wish to attend for the course for free should contact Rebecca Vliet to ensure comp registration is available PRIOR to registering. When registering please make sure to indicate this by checking the appropriate boxes on the registration form. Cancellations must be made prior to January 6, 2020 by contacting Rebecca Vliet. If cancellation is not received and you do not show up for the course you will be responsible for the full course fee. For more information visit http://www.cnf.cornell.edu/education/tcn ________________________________ Rebecca Vliet Cornell NanoScale Facility Assistant to the Directors 607.254.4840 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 141409 bytes Desc: image001.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image003.jpg Type: image/jpeg Size: 26945 bytes Desc: image003.jpg URL: From rlc12 at cornell.edu Thu Oct 17 12:29:20 2019 From: rlc12 at cornell.edu (Rebecca Lee Vliet) Date: Thu, 17 Oct 2019 16:29:20 +0000 Subject: [labnetwork] Position Opening: Research Support Specialist III, Cornell Nanoscale Science and Technology Facility (Ithaca, NY) Message-ID: The Cornell NanoScale Facility is seeking a Thin Film Process Engineer. The responsibilities of this position include oversight of a number of thin film processing instruments including maintaining and improving their functionality and support users from application through microfabrication. The position entails process development, material characterization, process monitoring, process implementation, user training/support and the advancement of equipment and user research projects across the nanotechnology spectrum. The Thin Film Process and Tool Engineer is expected to recommend, develop and implement next generation advancement in support of technology; enhancing nanotechnology equipment, materials, processes and expertise available to CNF users. Qualifications and Education Requirements * Master's degree or equivalent; 3 to 5 years of relevant experience in Applied Physics, Electrical Engineering, Materials Science, Chemistry, Biomedical Engineering or related field. Knowledge of all aspects of microfabrication technology including thin film production, etching, lithography, and analysis is required. * Must have demonstrated ability to apply novel imaginative and innovative solutions to design, engineer, modify, and repair thin film production equipment. * Must have demonstrated ability to work safely with hazardous chemicals, ability to work calmly in a stressful environment, and ability to interact effectively as part of a team with users at all levels of processing competence. Must assist in policy-setting and decision making for Fab protocols and procedures. The job description and instructions for applying can be found here: https://cornell.wd1.myworkdayjobs.com/en-US/CornellCareerPage/job/Ithaca-Main-Campus/Thin-Film-Process-Engineer_WDR-00020856-1?shared_id=e93a311e-57b3-4f35-8244-46d4ea33c895 -------------- next part -------------- An HTML attachment was scrubbed... URL: From mark.chiappa at ntnu.no Fri Oct 18 07:19:45 2019 From: mark.chiappa at ntnu.no (Mark Chiappa) Date: Fri, 18 Oct 2019 11:19:45 +0000 Subject: [labnetwork] Open position at NTNU Head of laboratory Message-ID: <2A269F36-A576-4B36-9EF5-A114052831FC@ntnu.no> Hi, We currently have an opportunity here in Trondheim. Head of laboratory please share it with candidates you think may be suitable. Position details. https://www.finn.no/job/fulltime/ad.html?finnkode=159487685 Kind regards Mark. Mark Chiappa Senior Engineer NTNU NanoLab Sem S?landsvei 14 Trondheim 7034 Mob: (+47) 91897617 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: 18-45431 Lableder NanoLab_Utlysningstekst_176409[2].pdf Type: application/pdf Size: 100011 bytes Desc: 18-45431 Lableder NanoLab_Utlysningstekst_176409[2].pdf URL: From michael.call at maine.edu Fri Oct 25 12:00:50 2019 From: michael.call at maine.edu (Michael Call) Date: Fri, 25 Oct 2019 12:00:50 -0400 Subject: [labnetwork] Suss MA6 EISS computer Message-ID: During a recent power outage, our MA6 EISS imaging computer failed. The system starts to boot and then hangs, I've checked the power supply and the hard drive seems ok, but I suspect the motherboard has failed(swollen caps). Has anyone had any experience replacing this system? Thanks in advance, -- Mike Call Research Engineer University of Maine Frontier Institute for Research in Sensor Technologies (FIRST) Coordinated Research entities Cleanroom ESRB Barrows Hall room 294 207-581-3382 -------------- next part -------------- An HTML attachment was scrubbed... URL: From ana.sanchez at louisville.edu Fri Oct 25 14:27:05 2019 From: ana.sanchez at louisville.edu (KY Multiscale Manufacturing and Nano Integration Node) Date: Fri, 25 Oct 2019 14:27:05 -0400 (EDT) Subject: [labnetwork] Upcoming KY Multiscale Event: Workshop by Lesker on Vacuum Technology Message-ID: <1133429404965.1131404001080.2098960567.0.251426JL.2102@scheduler.constantcontact.com> ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Lesker University Vacuum Technology Workshop ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ When Thursday, November 14, 2019 from 8:00 AM to 5:00 PM EST Add to Calendar [http://r20.rs6.net/tn.jsp?f=001U45sdik3BRRKhGURU9F-kkeCAWYFNBDneP3Y7uHWla0sf-nj1bWeS7DJonWUXu527IfxX40GYauZ9kXNOUEH0ZiozGRLwIf1bwToF2QYoxEb2F9nVNrmuVu-Qfu6XKWi0_IKYZGvKUyCHHxahcHxT1edSxrkZH8iUJ_jI8f-VznuVEwCyeInR5SMUxID0lQroGqXYrtCng3tHrJZxNRJE7FbE3rnJ6yOjRS4aFR9FpK5oFnYUBuT6vfpLcyf8iJ5e2onDdt6BCU=&c=cWp6sWSa_JTVqE3WoJp6ZaraJFtXTk2xB1Vf8r_Ho7mQBmMycGSf8w==&ch=tUyH2ulu_9ODpuqUt8pJjIao3eeRP941bgrnolL6JCVUi84lKrL7Yw==] Where Vogt Building, Room 311 334 Eastern Parkway Louisville, KY 40292 Driving Directions [http://r20.rs6.net/tn.jsp?f=001U45sdik3BRRKhGURU9F-kkeCAWYFNBDneP3Y7uHWla0sf-nj1bWeS7DJonWUXu527e-AhiUxM_OfmXyBU-iuu90aaV8ibazHi1u3Ctlr6-xeHl894t0CrW-GpHlpRumIuZqI3AbUv3sYZ3DJlRqXt-k0IUB8-J50PmTm6temY5QRONL81LPF-LE9NMAtuFnbL0nV3-fUHV_a3TQlu95pkIr5CjUv89ZqTGhukrlxNA7X3mjR7caCY9XM5ED3RzXVUvE4awEctmM=&c=cWp6sWSa_JTVqE3WoJp6ZaraJFtXTk2xB1Vf8r_Ho7mQBmMycGSf8w==&ch=tUyH2ulu_9ODpuqUt8pJjIao3eeRP941bgrnolL6JCVUi84lKrL7Yw==] ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Dear Lab Network Mail list, The KY Multiscale [http://r20.rs6.net/tn.jsp?f=001U45sdik3BRRKhGURU9F-kkeCAWYFNBDneP3Y7uHWla0sf-nj1bWeS4uG3xAaHzpThWL32sMqanB7hbZaukHRszluhJS6fw37rze8F9BDKqNoHqWaeKXH5kXyrk6VlcQMCKWRoxD7D_af-ex5sLJCjDsTNUX2Hwcmafmn9mR9GRkyITmU5kgbCA==&c=cWp6sWSa_JTVqE3WoJp6ZaraJFtXTk2xB1Vf8r_Ho7mQBmMycGSf8w==&ch=tUyH2ulu_9ODpuqUt8pJjIao3eeRP941bgrnolL6JCVUi84lKrL7Yw==] and Micro/Nano Technology Center [http://r20.rs6.net/tn.jsp?f=001U45sdik3BRRKhGURU9F-kkeCAWYFNBDneP3Y7uHWla0sf-nj1bWeS6UlevRkSLxgLqKaH2bbdeK_khly-vVLHLSCbQBkKoYkYuISeSKeywL_sTC9IctdW8r7Yt90ZcxvuxuOyWDFylj_-BZ-12MJCsmwIpqXoGGS8cjTAVhQibTvZ8wm_ExlfA==&c=cWp6sWSa_JTVqE3WoJp6ZaraJFtXTk2xB1Vf8r_Ho7mQBmMycGSf8w==&ch=tUyH2ulu_9ODpuqUt8pJjIao3eeRP941bgrnolL6JCVUi84lKrL7Yw==] will be hosting a Vacuum Technology Workshop by Kurt J.Lesker [http://r20.rs6.net/tn.jsp?f=001U45sdik3BRRKhGURU9F-kkeCAWYFNBDneP3Y7uHWla0sf-nj1bWeS7DJonWUXu52TVjLCfoutT62u_cBcEgEzmbMdAVbf1tRiqYA868j-R70I_TjrTycsb4q9CbXS94OuCqwzYFL8MmS82QHYoxjJHIE8DDZovNJpNA_h9S1oDsNxzUBEtp_fA==&c=cWp6sWSa_JTVqE3WoJp6ZaraJFtXTk2xB1Vf8r_Ho7mQBmMycGSf8w==&ch=tUyH2ulu_9ODpuqUt8pJjIao3eeRP941bgrnolL6JCVUi84lKrL7Yw==] Company. The event will take place at the University of Louisville Belknap campus. We welcome you to attend this workshop and free lunch. Registration is free, RSVP is required. Please register by November 11, spots are limited to 50 participants. Course Topics and Schedule: * 8am - Registration * * 8:30am to 12:30pm - Introduction to Vacuum Science and System Design * * 12:30pm to 1pm - Lunch provided to registered attendees * * 1pm to 5pm - Physical Vapor Deposition and Thin Film Growth Models ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Click here for full agenda and more information [http://events.r20.constantcontact.com/register/event?oeidk=a07egky5ff42f284cb7&c=c77ec6f2-d328-11e9-9f7e-d4ae526edd6c&ch=c77fd010-d328-11e9-9f7e-d4ae526edd6c] Register Now! [http://events.r20.constantcontact.com/register/regform?oeidk=a07egky5ff42f284cb7&c=c77ec6f2-d328-11e9-9f7e-d4ae526edd6c&ch=c77fd010-d328-11e9-9f7e-d4ae526edd6c] I can't make it [http://events.r20.constantcontact.com/register/decline?oeidk=a07egky5ff42f284cb7&c=c77ec6f2-d328-11e9-9f7e-d4ae526edd6c&ch=c77fd010-d328-11e9-9f7e-d4ae526edd6c] ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ If you have any questions about the event or how to register please contact Ana Sanchez at ana.sanchez at louisville.edu. Thank you for your attention and response, we look forward to seeing you at this event. Sincerely, KY Multiscale Manufacturing and Nano Integration Node KY MMNIN ana.sanchez at louisville.edu 502-852-1568 ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Forward email http://ui.constantcontact.com/sa/fwtf.jsp?llr=yz46ow6ab&m=1131404001080&ea=labnetwork at mtl.mit.edu&a=1133429404965 This email was sent to labnetwork at mtl.mit.edu by ana.sanchez at louisville.edu. Update Profile/Email Address https://visitor.constantcontact.com/do?p=oo&m=001BE3R7wwbctS0f__Dt1JBWw%3D%3D&ch=c77fd010-d328-11e9-9f7e-d4ae526edd6c&ca=9588e89b-0618-40bd-9e39-17082f8ae0a5 Instant removal with SafeUnsubscribe(TM) https://visitor.constantcontact.com/do?p=un&m=001BE3R7wwbctS0f__Dt1JBWw%3D%3D&ch=c77fd010-d328-11e9-9f7e-d4ae526edd6c&ca=9588e89b-0618-40bd-9e39-17082f8ae0a5 Privacy Policy: http://www.constantcontact.com/legal/service-provider?cc=about-service-provider Online Marketing by Constant Contact(R) www.constantcontact.com KY MMNIN | 2210 South Brook St | Shumaker Research Bldg | Louisville | KY | 40208 -------------- next part -------------- An HTML attachment was scrubbed... URL: From james.beall at nist.gov Fri Oct 25 17:08:37 2019 From: james.beall at nist.gov (Beall, James A. (Fed)) Date: Fri, 25 Oct 2019 21:08:37 +0000 Subject: [labnetwork] Suss MA6 EISS computer In-Reply-To: References: Message-ID: <314C889B-D16A-4F9C-8FC4-81CA838A3C79@nist.gov> We had a similar issue once. Our IT specialist traced it to an issue with the RAID setup on the hard drive and was able to rebuild it for me. I can ask her if she remembers what she did but it has worked ever since (and it?s now on the building UPS). I?ve also replaced the PS a couple of times. Now it seems to spontaneously reboot so it may be time for another PS. Suss quoted me $10K for a replacement computer in 2016! We have had to go to Ebay to find motherboards to repair some legacy systems. Best of luck, Jim Jim Beall National Institute of Standards and Technology Quantum Sensors Group Mailcode 687.08 325 Broadway 1C-110 Boulder, CO 80305-3328 303-497-5989 303-497-3042 (fax) On Oct 25, 2019, at 10:00 AM, Michael Call > wrote: During a recent power outage, our MA6 EISS imaging computer failed. The system starts to boot and then hangs, I've checked the power supply and the hard drive seems ok, but I suspect the motherboard has failed(swollen caps). Has anyone had any experience replacing this system? Thanks in advance, -- Mike Call Research Engineer University of Maine Frontier Institute for Research in Sensor Technologies (FIRST) Coordinated Research entities Cleanroom ESRB Barrows Hall room 294 207-581-3382 _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://gcc01.safelinks.protection.outlook.com/?url=https%3A%2F%2Fmtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork&data=02%7C01%7Cjames.beall%40nist.gov%7Cf6b892ebfe684cfcfd5208d7598b8540%7C2ab5d82fd8fa4797a93e054655c61dec%7C1%7C1%7C637076328090525355&sdata=yGnAGszcmWtC8Unn23PXpzgfTXqq0PnON14T3WaPeNU%3D&reserved=0 -------------- next part -------------- An HTML attachment was scrubbed... URL: From hathaway at cns.fas.harvard.edu Fri Oct 25 17:25:42 2019 From: hathaway at cns.fas.harvard.edu (Hathaway, Malcolm R) Date: Fri, 25 Oct 2019 21:25:42 +0000 Subject: [labnetwork] Suss MA6 EISS computer In-Reply-To: References: Message-ID: Hi Mike, Is the control computer a Dell? If so, it's a fairly common failure among certain vintages of Dell PCs for bad capacitors to show up, and "recapping" kits exist and are reasonably easy to install. However, if replacement seems easier or is preferred, then give that a go. You can contact me off-list for more info regarding the re-capping business. Mac ________________________________ From: labnetwork-bounces at mtl.mit.edu on behalf of Michael Call Sent: Friday, October 25, 2019 12:00 PM To: Lab Network (labnetwork at mtl.mit.edu) Subject: [labnetwork] Suss MA6 EISS computer During a recent power outage, our MA6 EISS imaging computer failed. The system starts to boot and then hangs, I've checked the power supply and the hard drive seems ok, but I suspect the motherboard has failed(swollen caps). Has anyone had any experience replacing this system? Thanks in advance, -- Mike Call Research Engineer University of Maine Frontier Institute for Research in Sensor Technologies (FIRST) Coordinated Research entities Cleanroom ESRB Barrows Hall room 294 207-581-3382 -------------- next part -------------- An HTML attachment was scrubbed... URL: From hbtusainc at yahoo.com Fri Oct 25 20:16:14 2019 From: hbtusainc at yahoo.com (Mario Portillo) Date: Sat, 26 Oct 2019 00:16:14 +0000 (UTC) Subject: [labnetwork] Suss MA6 EISS computer In-Reply-To: References: Message-ID: <232150295.753810.1572048974636@mail.yahoo.com> Word of caution, if the electrolytic capacitors are only swollen replacement would certainly work, but if they already leaked which was the case back then, ?possibly the mother board is shorted out..... My two cents, regards. Sent from Yahoo Mail for iPhone Mario Portillo, hbtusainc at yahoo.com On Saturday, October 26, 2019, 5:25 AM, Hathaway, Malcolm R wrote: #yiv1630585256 P {margin-top:0;margin-bottom:0;}Hi Mike, Is the control computer a Dell?? If so, it's a fairly common failure among certain vintages of Dell PCs for bad capacitors to show up, and "recapping" kits exist and are reasonably easy to install. However, if replacement seems easier or is preferred, then give that a go. You can contact me off-list for more info regarding the re-capping business. Mac From: labnetwork-bounces at mtl.mit.edu on behalf of Michael Call Sent: Friday, October 25, 2019 12:00 PM To: Lab Network (labnetwork at mtl.mit.edu) Subject: [labnetwork] Suss MA6 EISS computer?During a recent power outage, our MA6 EISS imaging computer failed.? The system starts to boot and then hangs,? I've checked the power supply and the hard drive seems ok, but I suspect the motherboard has failed(swollen caps).? Has anyone had any experience replacing this system? Thanks in advance, -- Mike Call Research Engineer University of Maine Frontier Institute for Research in Sensor Technologies (FIRST)Coordinated Research entities Cleanroom?ESRB Barrows Hall room 294 207-581-3382_______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: