[labnetwork] Cutting Lanthanum aluminate substrate

[Lino Eugene]

Dear all,

We have a request for cutting Lanthanum aluminate (LAO) single crystal substrate with a dicing saw.

Some SDS for this materials mention that it has low aquatic toxicity and it must not enter a regular drain. I have some concerns as our dicing saw is connected to regular drain. I thought that the substrate could be scribed/cleaved but it did not work.

Does anyone have a experience with this material?

Best,

Lino Eugene, P.Eng., Ph.D.,
Micro/nanofabrication process engineer
Quantum Nano-Fabrication and Characterization Facility
QNC 1611
University of Waterloo
200 University Avenue West
Waterloo, ON, Canada
N2L 3G1

Ph: +1 519-888-4567 #37788
Cell: +1 226-929-1685
Website: https://qnfcf.uwaterloo.ca/

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