From derose at caltech.edu Sun Feb 2 16:39:36 2020 From: derose at caltech.edu (DeRose, Guy A.) Date: Sun, 2 Feb 2020 21:39:36 +0000 Subject: [labnetwork] Microscopist position at California Institute of Technology Message-ID: <0D42017D-E18A-4969-8C9D-A62994767970@caltech.edu> Hello Labnetwork colleagues: The Kavli Nanoscience Institute at The California Institute of Technology (Caltech) has an opening on our technical staff for a Microscopist. The position is full-time exempt (salary), and we are looking to fill asap. Check out the detailed posting, below, and/or pass along to others who you think might be interested. For more details about the Kavli Nanoscience Institute laboratory, see our wiki. If the link doesn?t work, the address is https://lab.kni.caltech.edu. Best regards, Guy Guy DeRose, PhD, Member of the Professional Staff Associate Director of Technical Operations, Kavli Nanoscience Institute California Institute of Technology, Pasadena, CA USA (O) 1-626-395-3423 (M) 1-626-676-8529 derose_at_caltech.edu http://kni.caltech.edu Title: Microscopist Company: Caltech Click the link below to see the details of the position: https://chm.tbe.taleo.net/chm03/ats/careers/requisition.jsp?org=CALTECH&cws=37&rid=5201 Caltech is a world-renowned science and engineering institute that marshals some of the world's brightest minds and most innovative tools to address fundamental scientific questions. We thrive on finding and cultivating talented people who are passionate about what they do. Join us and be a part of the diverse Caltech community. ________________________________ Job Summary The Kavli Nanoscience Institute is seeking an electron, ion, and scanning probe microscopist with nanofabrication research and/or industry experience to help manage a suite of advanced microscopy instruments within its class 10,000/1,000/100 cleanroom facilities. This position will oversee the management of ? and training responsibilities associated with ? instrumentation used in lab research, primarily two transmission electron microscopes (TEMs), three scanning electron microscopes (SEMs), two focused ion beam (FIB) systems (one He/Ne/Ga-FIB and one SEM/Ga-FIB), an atomic force microscope (AFM), and associated analytical and sample preparation equipment. The candidate will be expected to engage in process development and verification related to the microscopes and, because of this, familiarity with the basics of nanofabrication processes and instrumentation ? particularly related to lithography, etching, and deposition ? is a plus. The successful candidate will develop educational resources and provide technical engineering support to researchers in the design and setup of experiments and interpretation of results. The ideal candidate can work independently and collaboratively with students, postdocs, staff, and faculty members to assess their needs and address the technical requirements for laboratory experiments. Job Duties Primary area of responsibility will be managing the SEM, FIB, TEM and AFM suite of equipment (see microscope models and existing resources: https://lab.kni.caltech.edu/index.php/Equipment_List#Microscopy), including managing a lab technician, approximately 25% of whose time can be used to assist in the lab?s overall microscopy operation: ? Serve as the primary point of contact with users of SEM, FIB, TEM, AFM and auxiliary equipment, providing training in imaging and analysis techniques, sample preparation, and overall user supervision. ? Educate users on the proper use of equipment from a procedural standpoint, and on the underlying physics of the various techniques. ? Perform scheduled maintenance and alignments, order and monitor use of supplies/consumables, and perform any necessary troubleshooting to ensure optimal functionality of instruments. ? Review and implement best practices and standard operating procedures, which already exist for the lab?s microscopy equipment; modify and add to these resources, as needed. ? Develop new educational resources and training materials (e.g. presentations, posters, instructional videos). ? Develop and execute new skills and techniques in SEM, FIB, TEM and AFM, in order to add to the overall microscopy capabilities of the lab. ? Help to assess needs for new microscopy equipment, and evaluate and install new hardware, when necessary, ? Remain aware of the current state-of-the-art equipment and techniques in order to advance the KNI research community?s proficiency; this includes an ongoing review of relevant scientific literature, participation in professional societies, and attending conferences and training opportunities. ? Work with vendors and service engineers, as needed. ? Act as an advocate for lab members by helping to voice their concerns, needs, etc. to senior management. ? Develop and execute innovative methodologies to improve facility management. ? Take initiative to improve work processes that affect the functions of the facility; anticipate problems and work proactively to resolve them. ? Ensure compliance with Institute policies, scientific protocols, regulatory agencies, and safety practices. ? Nurture on- and off-campus contacts to drive awareness of the facility. ? Assume additional responsibilities to promote the KNI?s mission as needed. Participate in staff-led research initiatives: ? Contribute to short-term studies and projects that aim to produce process recipes that serve as experimental starting points for lab users. ? Opportunity to contribute to longer-term studies aimed at publishing in journals, in conjunction with other KNI staff members, student researchers, and Caltech PIs; may include participating in writing research proposals where microscopy expertise is needed. Basic Qualifications ? Bachelor's degree in Engineering, Materials Science, Physics or related field. ? Minimum of four years direct experience operating electron and ion microscopes in a research or production environment. ? Proficient in common SEM and FIB techniques, e.g. secondary electron and backscattered electron imaging, EDS, electron beam lithography, direct ion beam etching, cutting and imaging cross-sections, TEM lamella sample preparation, microscope automation. ? Experience in common TEM techniques, e.g. TEM and STEM imaging, bright field and dark field imaging, electron diffraction, EDS, HAADF, EFTEM, EELS. ? Experience creating training documentation and educational resources. ? Excellent time management, organization, and attention to detail. ? Highly proficient in listening and communicating with students, staff, faculty, and vendors. ? Maintain a dedicated and flexible mindset, and a continued interest in developing new skills. Preferred Qualifications ? M.S. in Engineering, Materials Science, Physics or related field. ? Experience operating etching and/or deposition and/or lithography equipment. ? Experience in AFM imaging and related techniques, e.g. tapping mode, contact mode, image analysis. ? Instructional experience. ? Lab management experience. Required Documents ? Resume ? Cover Letter ? List of Three Professional References -------------- next part -------------- An HTML attachment was scrubbed... URL: From James.Grant at glasgow.ac.uk Mon Feb 3 16:02:51 2020 From: James.Grant at glasgow.ac.uk (James Grant) Date: Mon, 3 Feb 2020 21:02:51 +0000 Subject: [labnetwork] Manual for Plasmafab 505 Barrel Asher Message-ID: Hello all, We have a Plasmafab 505 Barrel Asher. It is a very old unit, circa 40 years, and as a result all documentation on it has been lost. Have scoured the internet but unable to find a manual. Wondering if anyone has a soft copy that they could share? Best wishes, James Dr. James Paul Grant Plasma Etch Group Plasma Processing Research Engineer Tel: +44(0) 141 330 3157; Mob: 07881 818864 james.grant at glasgow.ac.uk | www.jwnc.gla.ac.uk [cid:image001.jpg at 01D5DAD5.3FD60EE0] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 2299 bytes Desc: image001.jpg URL: From jcn8004 at rit.edu Tue Feb 4 08:06:43 2020 From: jcn8004 at rit.edu (John Nash) Date: Tue, 4 Feb 2020 13:06:43 +0000 Subject: [labnetwork] XeF2 supplier? Message-ID: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> Does anyone know of a reliable supplier of XeF2? We have a Xactics XeF2 system that will be running out soon. I have reached out to Pelchem, Electronic fluorocarbons and Linde over the last 6 months and none are able to help. Thanks in advance for all recommendations. Regards, John C Nash SMFL - Technician Rochester Institute of Technology Semiconductor & Microsystems Fabrication Laboratory 82 Lomb Memorial Dr. Bldg. 17-2627 Rochester, NY 14623 585 478-3835 cell john.nash at rit.edu www.smfl.rit.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From rmorrison at draper.com Tue Feb 4 12:31:46 2020 From: rmorrison at draper.com (Morrison, Richard H., Jr) Date: Tue, 4 Feb 2020 17:31:46 +0000 Subject: [labnetwork] XeF2 supplier? In-Reply-To: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> References: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> Message-ID: Hi, At Draper we use Pelchem and the lead time was 6 months the last time Rick Richard H. Morrison Principal Member of the Technical Staff Draper 555 Technology Square Cambridge, MA 02139-3573 Work 617-258-3420 Cell 508-930-3461 www.draper.com From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of John Nash Sent: Tuesday, February 04, 2020 8:07 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] XeF2 supplier? Does anyone know of a reliable supplier of XeF2? We have a Xactics XeF2 system that will be running out soon. I have reached out to Pelchem, Electronic fluorocarbons and Linde over the last 6 months and none are able to help. Thanks in advance for all recommendations. Regards, John C Nash SMFL - Technician Rochester Institute of Technology Semiconductor & Microsystems Fabrication Laboratory 82 Lomb Memorial Dr. Bldg. 17-2627 Rochester, NY 14623 585 478-3835 cell john.nash at rit.edu www.smfl.rit.edu ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: From mmoneck at andrew.cmu.edu Tue Feb 4 12:43:28 2020 From: mmoneck at andrew.cmu.edu (Matthew Moneck) Date: Tue, 4 Feb 2020 17:43:28 +0000 Subject: [labnetwork] XeF2 supplier? In-Reply-To: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> References: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> Message-ID: Hi John, I'm curious if the issue is with the bottle itself. We ordered XeF2 last summer, but after 8 weeks or so, we had not received the bottle. We were told by our vendor that there was delay on Pelchem's side and that ship date was to be determined. We didn't receive much feedback beyond that. After waiting another couple weeks, we asked more questions, and found that the issue was the bottle type used on the Xactix tool. Our tool, and I assume most, use the bottle with a right angle valve. We were told Pelchem was having trouble sourcing those valves and it was not known when a new bottle could be delivered. After more questions, we found out our vendor was able to provide a bottle with a straight valve in a short time frame. As a result, we ordered the alternative bottle and had a new pigtail fabricated to accommodate the change in orientation. Best Regards, Matt -- Matthew T. Moneck, Ph.D Executive Manager, Claire & John Bertucci Nanotechnology Laboratory Electrical & Computer Engineering | Carnegie Mellon University 5000 Forbes Avenue, Pittsburgh, PA 15213-3890 Phone: 412-268-5430 ece.cmu.edu nanofab.ece.cmu.edu From: labnetwork-bounces at mtl.mit.edu On Behalf Of John Nash Sent: Tuesday, February 4, 2020 8:07 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] XeF2 supplier? Does anyone know of a reliable supplier of XeF2? We have a Xactics XeF2 system that will be running out soon. I have reached out to Pelchem, Electronic fluorocarbons and Linde over the last 6 months and none are able to help. Thanks in advance for all recommendations. Regards, John C Nash SMFL - Technician Rochester Institute of Technology Semiconductor & Microsystems Fabrication Laboratory 82 Lomb Memorial Dr. Bldg. 17-2627 Rochester, NY 14623 585 478-3835 cell john.nash at rit.edu www.smfl.rit.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From julia.aebersold at louisville.edu Tue Feb 4 12:44:29 2020 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Tue, 4 Feb 2020 17:44:29 +0000 Subject: [labnetwork] XeF2 supplier? In-Reply-To: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> References: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> Message-ID: Hmmm, we typically use Pelchem. Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville 2210 South Brook Street Shumaker Research Building, Room 233 Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ ________________________________ From: labnetwork-bounces at mtl.mit.edu on behalf of John Nash Sent: Tuesday, February 4, 2020 8:06 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] XeF2 supplier? Does anyone know of a reliable supplier of XeF2? We have a Xactics XeF2 system that will be running out soon. I have reached out to Pelchem, Electronic fluorocarbons and Linde over the last 6 months and none are able to help. Thanks in advance for all recommendations. Regards, John C Nash SMFL - Technician Rochester Institute of Technology Semiconductor & Microsystems Fabrication Laboratory 82 Lomb Memorial Dr. Bldg. 17-2627 Rochester, NY 14623 585 478-3835 cell john.nash at rit.edu www.smfl.rit.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From clark at cnf.cornell.edu Tue Feb 4 13:16:11 2020 From: clark at cnf.cornell.edu (Jeremy Clark) Date: Tue, 4 Feb 2020 13:16:11 -0500 Subject: [labnetwork] XeF2 supplier? In-Reply-To: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> References: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> Message-ID: <5ac3006f-f8ba-262e-f155-7b5aecac4eab@cnf.cornell.edu> Hi John, We had the same issue dealing with Pelchem the last time around. We were able to make the purchase through Linde without issue- the division's email is: ElectronicMaterials.ESG.us.lg at linde.com Good luck, Jeremy On 2/4/20 8:06 AM, John Nash wrote: > > Does anyone know of a reliable supplier of XeF2? We have a Xactics > XeF2 system that will be running out soon. I have reached out to > Pelchem, Electronic fluorocarbons and Linde over the last 6 months and > none are able to help. Thanks in advance for all recommendations. > > Regards, > > John C Nash > > SMFL - Technician > > Rochester Institute of Technology > > Semiconductor & Microsystems Fabrication Laboratory > > 82 Lomb Memorial Dr. > > Bldg. 17-2627 > > Rochester, NY 14623 > > 585 478-3835 cell > > john.nash at rit.edu > > www.smfl.rit.edu > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From gewatson at seas.upenn.edu Tue Feb 4 15:34:43 2020 From: gewatson at seas.upenn.edu (Pat Watson) Date: Tue, 4 Feb 2020 15:34:43 -0500 Subject: [labnetwork] XeF2 supplier? In-Reply-To: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> References: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> Message-ID: Hi John, Charlie Veith, on our staff here at Penn, has been negotiating with the vendor to ensure we have a steady supply at a very reasonable price. We have some 600g bottles that we can resell. Please contact Charlie at cveith at seas.upenn.edu . for details. Best, Pat George Patrick Watson (Pat) Director of User Programs Singh Center for Nanotechnology University of Pennsylvania 3205 Walnut Street Philadelphia, PA 19104 gewatson at seas.upenn.edu 215 573 2251 > On Feb 4, 2020, at 8:06 AM, John Nash wrote: > > Does anyone know of a reliable supplier of XeF2? We have a Xactics XeF2 system that will be running out soon. I have reached out to Pelchem, Electronic fluorocarbons and Linde over the last 6 months and none are able to help. Thanks in advance for all recommendations. > > Regards, > > John C Nash > SMFL - Technician > Rochester Institute of Technology > Semiconductor & Microsystems Fabrication Laboratory > 82 Lomb Memorial Dr. > Bldg. 17-2627 > Rochester, NY 14623 > > 585 478-3835 cell > john.nash at rit.edu > www.smfl.rit.edu > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From scholvin at mit.edu Tue Feb 4 16:10:21 2020 From: scholvin at mit.edu (Jorg Scholvin) Date: Tue, 4 Feb 2020 21:10:21 +0000 Subject: [labnetwork] Job opening, Aberration Corrected S/TEM Domain Expert/Research Scientist, MIT.nano Message-ID: We have a job opening at MIT.nano for an "Aberration Corrected S/TEM Domain Expert/Research Scientist", details and links below: ABERRATION CORRECTED S/TEM DOMAIN EXPERT/RESEARCH SCIENTIST, MIT.nano to join the state-of-the-art electron microscopy shared experimental facilities (SEF). Will be responsible for overseeing the facility's capabilities in imaging and analysis for a broad range of applications and sample preparation for electron microscopy. The main responsibility will be to support users in the day-to-day operations of the probe corrected Themis Z Scanning Transmission Electron Microscope (STEM) equipped with an ultrahigh energy resolution monochromator, 4D STEM detector, Super-X EDS detector, tomography, and in situ holders. The position involves extensive collaboration with MIT internal and external users for experimental design, training, experiment execution, data analysis, and development of new methodologies. Will report directly to the assistant director of user services (Metrology.nano) and the MIT.nano faculty and operation leadership. MIT.nano facility is in the early days of its operation and it is likely that the responsibilities will evolve as the facility grows. Job Requirements REQUIRED: Ph.D. in material science or similar scientific discipline; at least four years TEM/STEM imaging research experience; strong working knowledge of TEM theory and data analysis; full proficiency operating aberration corrected S/TEM and with analytical microscopy; knowledge of TEM sample preparation techniques; proven ability to independently design, execute, and optimize microscopy experiments; ability to work independently and collaborate as part of a team with a diverse group of researchers, including providing training and services; excellent organizational, troubleshooting, critical thinking, interpersonal, and oral and written communication skills; attention to detail; and willingness to learn and perform a wide range of tasks. PREFERRED: expertise in data management, and Python and/or MATLAB programming experience. Job #18313 Link to posting: https://careers.peopleclick.com/careerscp/client_mit/external/jobDetails/jobDetail.html?jobPostId=17514&localeCode=en-us https://hr.mit.edu/careers From mtkhbeis at gmail.com Tue Feb 4 16:46:32 2020 From: mtkhbeis at gmail.com (mtkhbeis at gmail.com) Date: Tue, 4 Feb 2020 13:46:32 -0800 Subject: [labnetwork] XeF2 supplier? In-Reply-To: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> References: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> Message-ID: <296A77EF-840A-45D8-AB75-28F1F47575C3@gmail.com> John Is Pelchem non-responsive? I had difficulty last time because the POC listed was on long term leave. I managed to finally get a response by finding other POCs via LinkedIn. We ended up sourcing via Air Products since they stocked material. Good luck, Dr. Michael Khbeis (C) 443.254.5192 > On Feb 4, 2020, at 9:23 AM, John Nash wrote: > > ? > Does anyone know of a reliable supplier of XeF2? We have a Xactics XeF2 system that will be running out soon. I have reached out to Pelchem, Electronic fluorocarbons and Linde over the last 6 months and none are able to help. Thanks in advance for all recommendations. > > Regards, > > John C Nash > SMFL - Technician > Rochester Institute of Technology > Semiconductor & Microsystems Fabrication Laboratory > 82 Lomb Memorial Dr. > Bldg. 17-2627 > Rochester, NY 14623 > > 585 478-3835 cell > john.nash at rit.edu > www.smfl.rit.edu > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From ana.sanchez at louisville.edu Wed Feb 5 09:55:25 2020 From: ana.sanchez at louisville.edu (Micro/nano/additive Manufacturing Research Experience for Undergrad) Date: Wed, 5 Feb 2020 09:55:25 -0500 (EST) Subject: [labnetwork] UofL Engineering - REU 2020 Message-ID: <1133884423678.1131404001080.2098960567.0.310955JL.2002@scheduler.constantcontact.com> Please Invite your students to apply Research Experience for Undergraduates INTERDISCIPLINARY MICRO/NANO/ADDITIVE MANUFACTURING PROGRAM ADDRESSING CHALLENGES TODAY. The University of Louisville J.B. Speed School of Engineering is now accepting applications for Summer 2020 Recruiting and training students into the interdisciplinary field of advanced micro/nano/additive manufacturing engineering through exciting hands-on research projects with applications in healthcare, energy, advance manufacturing, security and the environment. $6,000 Stipend Travel Expenses Included ?Free Housing Professional Development Training 10 Weeks of Research Micro/Nano Cleanroom Experience Please share with your students this announcement for a fully paid summer research opportunity for undergraduates at the University of Louisville Campus. Thank you for your support! See event flyer Visit our website Please visit our website for program specifics, eligibility, dates, etc...If you have any questions about this program, don't hesitate to touch base with us. Sincerely, Ana Sanchez Galiano ana.sanchez at louisville.edu (502)852-1568 KY MMNIN | 2210 South Brook St, Shumaker Research Bldg , Louisville, KY 40208 Unsubscribe labnetwork at mtl.mit.edu Update Profile | About Constant Contact Sent by ana.sanchez at louisville.edu in collaboration with Try email marketing for free today! -------------- next part -------------- An HTML attachment was scrubbed... URL: From brian.wajdyk at uky.edu Thu Feb 6 13:09:30 2020 From: brian.wajdyk at uky.edu (Wajdyk, Brian L.) Date: Thu, 6 Feb 2020 18:09:30 +0000 Subject: [labnetwork] Cambridge Savanah 100 (1st gen) ALD fast acting solenoid valve no longer made Message-ID: Hello, We have a first generation Cambridge ALD system. They have changed the system and the custom fast acting solenoid valves used to pulse the precursor are no longer made. They are sealed unit so there is no chance at a repair. Has anyone found a drop in replacement? Any replacement? Design for new heather block with different valve? Its a good system but the valves have gummed up over the last 12 years. Here is the part # for the Parker Valve that is no longer made: 099?0381?900 Parker Solenoid Valve for Savannah S100 ? 3?way N.C. (2?way) valve, 1/4" Vacuseal female fittings, 0.116" orifice, Kalrez, 0.5 amp @ 24 V Thanks! Brian ********************************************* Brian Wajdyk Facility Manager / Research Center for Nanoscale Science and Engineering. University of Kentucky Office: ASTeCC 372 Email: Brian.Wajdyk at uky.edu Ph: 859-218-6548 ********************************************* -------------- next part -------------- An HTML attachment was scrubbed... URL: From ana.sanchez at louisville.edu Thu Feb 6 15:47:46 2020 From: ana.sanchez at louisville.edu (KY Multiscale) Date: Thu, 6 Feb 2020 15:47:46 -0500 (EST) Subject: [labnetwork] Spreading the word - 2020 KY NANO + AM Symposium Message-ID: <1133893768550.1131404001080.2098960567.0.291547JL.2002@scheduler.constantcontact.com> You don't want to miss this. Tell your friends about our upcoming event POSTER PRESENTATIONS * SPEAKERS * FACILITY TOURS * NETWORKING www.nanoamsymposium.com The KY Nano+AM Symposium is an annual event that brings together researchers and industry in advanced manufacturing. We converge to discuss additive manufacturing and micro/nanotechnology -- what's new and what's next. Nano/AM Symposium is open to all scientists, engineers, and students from a variety of disciplines including microtechnology, nanotechnology, 3D printing, additive manufacturing, healthcare, energy, advanced materials, MEMS, biotechnology, commercial products, defense, and nano-education. REGISTRATION NOW OPEN Share ? ? ? KY Multiscale | 2210 South Brook St, Shumaker Research Bldg , Louisville, KY 40208 www.kymultiscale.net Unsubscribe labnetwork at mtl.mit.edu Update Profile | About Constant Contact Sent by ana.sanchez at louisville.edu in collaboration with Try email marketing for free today! -------------- next part -------------- An HTML attachment was scrubbed... URL: From edeguns at gmail.com Fri Feb 7 09:41:57 2020 From: edeguns at gmail.com (Eric Deguns) Date: Fri, 7 Feb 2020 09:41:57 -0500 Subject: [labnetwork] Cambridge Savanah 100 (1st gen) ALD fast acting solenoid valve no longer made In-Reply-To: References: Message-ID: Hello Brian, You may have seen one of the most recent notes regarding a Savannah - I'm one of the original Cambridge NanoTech folks. The original ALD team is now a part of Veeco. The electromechanical valves from this system were discontinued by Parker in 2008 and we stopped selling them in 2006. Unfortunately, we haven't found a electromechanical replacement which exhibits any of the reliability or heat tolerance of the industry standard Swagelok ALD valves. The long story short is that we don't have a drop in replacement for the Parker valves. That being said, we do have some upgrade options for you to get you into a modern setup but they'd involve replacing the entire ALD valve manifold. Please reach out to me at edeguns at veeco.com and/or ALDsupport at veeco.com and we can discuss some options for you. Thanks in advance, Eric On Thu, Feb 6, 2020 at 7:04 PM Wajdyk, Brian L. wrote: > Hello, > > We have a first generation Cambridge ALD system. They have changed the > system and the custom fast acting solenoid valves used to pulse the > precursor are no longer made. They are sealed unit so there is no chance > at a repair. Has anyone found a drop in replacement? Any replacement? > Design for new heather block with different valve? Its a good system but > the valves have gummed up over the last 12 years. > > Here is the part # for the Parker Valve that is no longer made: > 099?0381?900 Parker Solenoid Valve for Savannah S100 ? 3?way N.C. (2?way) > valve, 1/4" Vacuseal female fittings, 0.116" orifice, Kalrez, 0.5 amp @ 24 V > > Thanks! > Brian > > > > ********************************************* > Brian Wajdyk > Facility Manager / Research > Center for Nanoscale Science and Engineering. > University of Kentucky > Office: ASTeCC 372 > Email: Brian.Wajdyk at uky.edu > Ph: 859-218-6548 > ********************************************* > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From brian.wajdyk at uky.edu Fri Feb 7 09:46:19 2020 From: brian.wajdyk at uky.edu (Wajdyk, Brian L.) Date: Fri, 7 Feb 2020 14:46:19 +0000 Subject: [labnetwork] Cambridge Savanah 100 (1st gen) ALD fast acting solenoid valve no longer made In-Reply-To: References: , Message-ID: Thanks, Eric What is the modern replacement valve? I understand that it will not fit the current manifold. I have replaced one that required some creative plumbing. It was only usable at that position due to the space requirements. Is the modern valve another custom? Thanks, Brian ********************************************* Brian Wajdyk Facility Manager / Research Center for Nanoscale Science and Engineering. University of Kentucky Office: ASTeCC 372 Email: Brian.Wajdyk at uky.edu Ph: 859-218-6548 ********************************************* ________________________________ From: Eric Deguns Sent: Friday, February 7, 2020 9:41 AM To: Wajdyk, Brian L. Cc: labnetwork at mtl.mit.edu ; Eric Deguns Subject: Re: [labnetwork] Cambridge Savanah 100 (1st gen) ALD fast acting solenoid valve no longer made Hello Brian, You may have seen one of the most recent notes regarding a Savannah - I'm one of the original Cambridge NanoTech folks. The original ALD team is now a part of Veeco. The electromechanical valves from this system were discontinued by Parker in 2008 and we stopped selling them in 2006. Unfortunately, we haven't found a electromechanical replacement which exhibits any of the reliability or heat tolerance of the industry standard Swagelok ALD valves. The long story short is that we don't have a drop in replacement for the Parker valves. That being said, we do have some upgrade options for you to get you into a modern setup but they'd involve replacing the entire ALD valve manifold. Please reach out to me at edeguns at veeco.com and/or ALDsupport at veeco.com and we can discuss some options for you. Thanks in advance, Eric On Thu, Feb 6, 2020 at 7:04 PM Wajdyk, Brian L. > wrote: Hello, We have a first generation Cambridge ALD system. They have changed the system and the custom fast acting solenoid valves used to pulse the precursor are no longer made. They are sealed unit so there is no chance at a repair. Has anyone found a drop in replacement? Any replacement? Design for new heather block with different valve? Its a good system but the valves have gummed up over the last 12 years. Here is the part # for the Parker Valve that is no longer made: 099?0381?900 Parker Solenoid Valve for Savannah S100 ? 3?way N.C. (2?way) valve, 1/4" Vacuseal female fittings, 0.116" orifice, Kalrez, 0.5 amp @ 24 V Thanks! Brian ********************************************* Brian Wajdyk Facility Manager / Research Center for Nanoscale Science and Engineering. University of Kentucky Office: ASTeCC 372 Email: Brian.Wajdyk at uky.edu Ph: 859-218-6548 ********************************************* _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From demis at ucsb.edu Tue Feb 11 13:22:53 2020 From: demis at ucsb.edu (Demis D. John) Date: Tue, 11 Feb 2020 13:22:53 -0500 Subject: [labnetwork] wet etching InGaAlAs In-Reply-To: <46FF502D-F43C-4E41-BF5D-27ABF3A129A1@mail.smu.edu> References: <46FF502D-F43C-4E41-BF5D-27ABF3A129A1@mail.smu.edu> Message-ID: <14F991E1-CC3B-473F-AB01-F9253B75E2ED@ucsb.edu> That etchant sounds correct. Clawson usually works. If it?s not etching at all, then there is a residual layer left from previous etches. Things I would do in your situation: -Observe surface wetting before/during each wet etch. If surface is slightly hydrophilic, then wet etchants may not attack (or be significantly slowed down in) smaller etching regions due to caught air bubbles. Common remedy to this is O2 plasma RIE to make surface hydrophilic. For us, 15sec in this O2 Asher does the trick (want ion bombardment, not Ozone for example) https://wiki.nanotech.ucsb.edu/wiki/index.php/Ashers_(Technics_PEII) Nothing wrong with just doing an O2 plasma before any of these wet etches since they?re all usually oxidation-reduction (so generating an oxide is acceptable). - overetch the previous wet etches, inspect depth change and/or color change at every step. If etches are highly selective, should see identical uniform color in etched regions across the sample. Look closely by eye, but also microscope. Sometimes can observe during the etch itself, through beaker. Use same microscope/settings each time to ensure same color, take photos for reference. In extreme cases I would also save known etched pieces in order to check color against my sample (to ensure surface had exposed the material I expected), although this is dependent on the absorption of visible light in the materials being observed, so beware of optical interference. -- Demis > On Jan 7, 2020, at 19:58, McWilliams, Scott wrote: > > ? Thank you all for your replies, I will check to see if the peroxide is the issue. I did etch the nitride with BOE, so didn?t dry etch it. After the BOE etch I stripped off the photoresist with solvents. For these wafers, I need to remove an InP layer and then an InGaAsP layer before etching the InGaAlAs. Regards, Scott > > Sent from my iPhone > >>> On Jan 7, 2020, at 4:38 PM, Fouad Karouta wrote: >>> >> ? >> Hi Scott, >> >> Usually the solution you mentioned should be able to etch the material. You may consider using smaller amount of water. >> Do you have any other layers on top of the InGaAlAs layer? >> >> Note H2O2 solutions should be made fresh every time of usage. >> I used a same solution to etch GaAs/AlAs at RT. Also we did sometime at 0?C. >> >> CH4/H2 process will etch very slowly Al containing materials. >> >> Hope this helps, >> Fouad Karouta >> >> ************************************* >> Manager ANFF ACT Node >> Australian National Fabrication Facility >> Research School of Physics >> L. Huxley Building (#56), Mills Road, Room 4.02 >> Australian National University >> ACT 2601, Canberra, Australia >> Tel: + 61 2 6125 7174 >> Mob: + 61 451 046 412 >> Email: fouad.karouta at anu.edu.au >> http://anff-act.anu.edu.au/ >> >> >> >> From: labnetwork-bounces at mtl.mit.edu On Behalf Of McWilliams, Scott >> Sent: Wednesday, 8 January 2020 7:32 AM >> To: labnetwork at mtl.mit.edu >> Subject: [labnetwork] wet etching InGaAlAs >> >> Hello All, >> >> I?m processing some wafers and need to wet etch layers of InGaAlAs of various compositions (Alx values of x = 0.48 to 0.27). I pulled a reference from the A.W. Clawson III-V etch reference guide that H3PO4/H202/H20 1:1:10 should etch this material, but it is not etching. The referenced paper does not provide the etchant temperature. >> >> I suspect that I need to perform a surface etch of some type before etching the InGaAlAs. We do have the limitation that our current mask is 600 angstroms of silicon nitride, so we may be prohibited from performing HF containing surface etches. >> >> Does anyone have experience with this material and a recommended surface clean? Is there a better etchant to use? Has anyone attempted to dry etch this material with a CH4/H2 process? >> >> Thank you, Scott > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From jshepar at purdue.edu Wed Feb 12 15:42:00 2020 From: jshepar at purdue.edu (Shepard, Jeremiah J) Date: Wed, 12 Feb 2020 20:42:00 +0000 Subject: [labnetwork] Dry etching Zinc Sulfide and/or Zinc Selenide bulk samples Message-ID: Does anyone have experience etching Zinc Sulfide and Zinc Selenide? It appears chemistry would involve BCL3. My primary concern is chamber contamination, any experience or thoughts? Thank you in advance! Thank you, Jerry Shepard Research Engineer Purdue University Birck Nanotechnology Center -------------- next part -------------- An HTML attachment was scrubbed... URL: From codreanu at udel.edu Wed Feb 12 16:28:51 2020 From: codreanu at udel.edu (Iulian Codreanu) Date: Wed, 12 Feb 2020 16:28:51 -0500 Subject: [labnetwork] Polishing tool Message-ID: <6532ba6c-4331-1698-9ae9-870b1fb967b9@udel.edu> Hello, I am looking into offering capabilities for polishing the edge of chips to our users working on optical devices. If you have equipment in your lab that does that, I hope you can share your experience and recommendations with me or the network. Thank you in advance for your help. Best regards, Iulian -- iulian Codreanu, Ph.D. Director, Nanofabrication Facility University of Delaware Harker ISE Lab, Room 163 221 Academy Street Newark, DE 19716 302-831-2784 http://udnf.udel.edu From fouad.karouta at anu.edu.au Wed Feb 12 20:17:07 2020 From: fouad.karouta at anu.edu.au (Fouad Karouta) Date: Thu, 13 Feb 2020 01:17:07 +0000 Subject: [labnetwork] Dry etching Zinc Sulfide and/or Zinc Selenide bulk samples In-Reply-To: References: Message-ID: Dear Jerry, Though I have never etched these materials the best way to check the adequate chemistry for dry etching is to look in the Handbook, Section "Physical Constants of compounds" at the melting/boiling points of the possible etching products. You cannot etch a compound if etching products are not volatile. Most common chemistries used in dry etching are: chlorinated, fluorinated or a mixture of H2/CH4. S and Se products with fluorine are very volatile however ZnF2 is not volatile Best etch for zinc is CH4/H2 with organic compound of zinc very volatile. Am not sure if you mix the two chemistries like SF6 + CH4 and you find a regime where Zn is combined with organic CH3 group and S or Se is combined with F then you may get a decent etch. Maybe using something like CHF3 may work providing CH group reacts with Zn and F with S/Se. Of course a chlorinated chemistry would do the job but as boiling point of ZnCl2 is relatively high you need to ehat the table to 180-200?C and work at low pressure to increase the volatility while S/SE chlorides are quite volatile. Hope this helps, Fouad ************************************* Manager ANFF ACT Node Australian National Fabrication Facility Research School of Physics L. Huxley Building (#56), Mills Road, Room 4.02 Australian National University ACT 2601, Canberra, Australia Tel: + 61 2 6125 7174 Mob: + 61 451 046 412 Email: fouad.karouta at anu.edu.au http://anff-act.anu.edu.au/ From: labnetwork-bounces at mtl.mit.edu On Behalf Of Shepard, Jeremiah J Sent: Thursday, 13 February 2020 7:42 AM To: labnetwork at mtl.mit.edu Cc: Raghunathan, Nithin ; Dilley, Neil R Subject: [labnetwork] Dry etching Zinc Sulfide and/or Zinc Selenide bulk samples Does anyone have experience etching Zinc Sulfide and Zinc Selenide? It appears chemistry would involve BCL3. My primary concern is chamber contamination, any experience or thoughts? Thank you in advance! Thank you, Jerry Shepard Research Engineer Purdue University Birck Nanotechnology Center -------------- next part -------------- An HTML attachment was scrubbed... URL: From cekendri at mtu.edu Wed Feb 12 20:45:52 2020 From: cekendri at mtu.edu (Chito Kendrick) Date: Wed, 12 Feb 2020 20:45:52 -0500 Subject: [labnetwork] Polishing tool In-Reply-To: <6532ba6c-4331-1698-9ae9-870b1fb967b9@udel.edu> References: <6532ba6c-4331-1698-9ae9-870b1fb967b9@udel.edu> Message-ID: Are you wanting to do solid state devices or polymer? We have uses that polish optical waveguides from a GGG material after dicing using a polishing system for doing TEM samples and sample prep for SEM - this is not in out microfab but electron microscopy facility. I could get you more information from the post doc that is working on that research. I have users that would like to polish polymer waveguides, but have not got a solution for that, they end up using the as diced edge with some success. Chito Kendrick On Wed, Feb 12, 2020 at 7:45 PM Iulian Codreanu wrote: > Hello, > > I am looking into offering capabilities for polishing the edge of chips > to our users working on optical devices. If you have equipment in your > lab that does that, I hope you can share your experience and > recommendations with me or the network. > > Thank you in advance for your help. > > Best regards, > > Iulian > > > -- > iulian Codreanu, Ph.D. > Director, Nanofabrication Facility > University of Delaware > Harker ISE Lab, Room 163 > 221 Academy Street > Newark, DE 19716 > 302-831-2784 > http://udnf.udel.edu > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -- Chito Kendrick Ph.D. Managing Director of the Microfabrication Facility Research Assistant Professor Electrical and Computer Engineering Michigan Technological University Room 436 M&M Building 1400 Townsend Dr. Houghton, Michigan 49931-1295 814-308-4255 -------------- next part -------------- An HTML attachment was scrubbed... URL: From michael.rooks at yale.edu Thu Feb 13 09:48:27 2020 From: michael.rooks at yale.edu (Michael Rooks) Date: Thu, 13 Feb 2020 09:48:27 -0500 Subject: [labnetwork] Polishing tool In-Reply-To: <6532ba6c-4331-1698-9ae9-870b1fb967b9@udel.edu> References: <6532ba6c-4331-1698-9ae9-870b1fb967b9@udel.edu> Message-ID: We have a low-cost polisher from Allied High Tech http://www.alliedhightech.com/Equipment/metprep-1?-grinder-polisher which is used to polish the ends of waveguides. Wafers are mounted on either a wedge polishing or cross-sectioning jig (also from Allied High Tech). It's best to put it next to a sink, in a dirty lab. I suggest plugging it into a foot-pedal which acts as a dead-man's switch. It's handy for stopping the wheel without taking your hands off the jig, and it's a good safety device to reduce the risk of injury. It's a spinning wheel that you'll want to supervise much like a band saw or a drill press. Keep some bandaids nearby. -------------------------------- Michael Rooks Yale Institute of Nanoscience and Quantum Engineering nano.yale.edu On Wed, Feb 12, 2020 at 7:55 PM Iulian Codreanu wrote: > Hello, > > I am looking into offering capabilities for polishing the edge of chips > to our users working on optical devices. If you have equipment in your > lab that does that, I hope you can share your experience and > recommendations with me or the network. > > Thank you in advance for your help. > > Best regards, > > Iulian > > > -- > iulian Codreanu, Ph.D. > Director, Nanofabrication Facility > University of Delaware > Harker ISE Lab, Room 163 > 221 Academy Street > Newark, DE 19716 > 302-831-2784 > http://udnf.udel.edu > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From julia.aebersold at louisville.edu Thu Feb 13 16:45:00 2020 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Thu, 13 Feb 2020 21:45:00 +0000 Subject: [labnetwork] XeF2 supplier? In-Reply-To: References: <4f3e06ebdec14c998254efde541917a5@ex04mail01d.ad.rit.edu> Message-ID: Has anyone tried to reload the cylinder with XeF2 cylinders in a glove box? Or is Pelchem the only supplier of the crystals needed for the Xactix system? Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville Shumaker Research Building, Room 233 2210 South Brook Street Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Matthew Moneck Sent: Tuesday, February 4, 2020 12:43 PM To: John Nash ; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] XeF2 supplier? Hi John, I'm curious if the issue is with the bottle itself. We ordered XeF2 last summer, but after 8 weeks or so, we had not received the bottle. We were told by our vendor that there was delay on Pelchem's side and that ship date was to be determined. We didn't receive much feedback beyond that. After waiting another couple weeks, we asked more questions, and found that the issue was the bottle type used on the Xactix tool. Our tool, and I assume most, use the bottle with a right angle valve. We were told Pelchem was having trouble sourcing those valves and it was not known when a new bottle could be delivered. After more questions, we found out our vendor was able to provide a bottle with a straight valve in a short time frame. As a result, we ordered the alternative bottle and had a new pigtail fabricated to accommodate the change in orientation. Best Regards, Matt -- Matthew T. Moneck, Ph.D Executive Manager, Claire & John Bertucci Nanotechnology Laboratory Electrical & Computer Engineering | Carnegie Mellon University 5000 Forbes Avenue, Pittsburgh, PA 15213-3890 Phone: 412-268-5430 ece.cmu.edu nanofab.ece.cmu.edu From: labnetwork-bounces at mtl.mit.edu > On Behalf Of John Nash Sent: Tuesday, February 4, 2020 8:07 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] XeF2 supplier? Does anyone know of a reliable supplier of XeF2? We have a Xactics XeF2 system that will be running out soon. I have reached out to Pelchem, Electronic fluorocarbons and Linde over the last 6 months and none are able to help. Thanks in advance for all recommendations. Regards, John C Nash SMFL - Technician Rochester Institute of Technology Semiconductor & Microsystems Fabrication Laboratory 82 Lomb Memorial Dr. Bldg. 17-2627 Rochester, NY 14623 585 478-3835 cell john.nash at rit.edu www.smfl.rit.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From julia.aebersold at louisville.edu Thu Feb 13 17:43:13 2020 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Thu, 13 Feb 2020 22:43:13 +0000 Subject: [labnetwork] Dry etching Zinc Sulfide and/or Zinc Selenide bulk samples In-Reply-To: References: Message-ID: We haven't etched that material, but any plasma processing with BCL3 we raise the processing temp of the cooling water. BCL3 loves to condense at room temps, so we take our chiller up to 35 degrees C to make sure it stays in vapor form. And wrap the gas lines with heat tape. Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville Shumaker Research Building, Room 233 2210 South Brook Street Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Shepard, Jeremiah J Sent: Wednesday, February 12, 2020 3:42 PM To: labnetwork at mtl.mit.edu Cc: Raghunathan, Nithin ; Dilley, Neil R Subject: [labnetwork] Dry etching Zinc Sulfide and/or Zinc Selenide bulk samples Does anyone have experience etching Zinc Sulfide and Zinc Selenide? It appears chemistry would involve BCL3. My primary concern is chamber contamination, any experience or thoughts? Thank you in advance! Thank you, Jerry Shepard Research Engineer Purdue University Birck Nanotechnology Center -------------- next part -------------- An HTML attachment was scrubbed... URL: From demis at ece.ucsb.edu Fri Feb 14 00:02:28 2020 From: demis at ece.ucsb.edu (Demis D. John) Date: Fri, 14 Feb 2020 00:02:28 -0500 Subject: [labnetwork] Dry etching Zinc Sulfide and/or Zinc Selenide bulk samples In-Reply-To: References: Message-ID: We have a relatively successful recipe which works with both ZnS & ZnSe: https://wiki.nanotech.ucsb.edu/wiki/index.php/RIE_Etching_Recipes#ZnS_Etching_.28RIE_2.29 ? Methane/Hydrogen RIE etch. This is on one of our older Capacitive RIE systems: https://wiki.nanotech.ucsb.edu/wiki/index.php/RIE_2_(MRC) We do have some very sensitive etches on this tool, and long ZnS etches did not appear to cause any visible problems to those. -- Demis ---------------------------------------- demis at ucsb.edu * Process Scientist Manager* UCSB Nanofabrication Facility ---------------------------------------- On Thu, Feb 13, 2020 at 5:43 PM Aebersold,Julia W. < julia.aebersold at louisville.edu> wrote: > We haven?t etched that material, but any plasma processing with BCL3 we > raise the processing temp of the cooling water. BCL3 loves to condense at > room temps, so we take our chiller up to 35 degrees C to make sure it stays > in vapor form. And wrap the gas lines with heat tape. > > > > Cheers! > > > > Julia Aebersold, Ph.D. > > Manager, Micro/Nano Technology Center > > University of Louisville > > Shumaker Research Building, Room 233 > > 2210 South Brook Street > > Louisville, KY 40292 > > (502) 852-1572 > > > > http://louisville.edu/micronano/ > > > > *From:* labnetwork-bounces at mtl.mit.edu [mailto: > labnetwork-bounces at mtl.mit.edu] *On Behalf Of *Shepard, Jeremiah J > *Sent:* Wednesday, February 12, 2020 3:42 PM > *To:* labnetwork at mtl.mit.edu > *Cc:* Raghunathan, Nithin ; Dilley, Neil R < > ndilley at purdue.edu> > *Subject:* [labnetwork] Dry etching Zinc Sulfide and/or Zinc Selenide > bulk samples > > > > Does anyone have experience etching Zinc Sulfide and Zinc Selenide? > > > > It appears chemistry would involve BCL3. > > > > My primary concern is chamber contamination, any experience or thoughts? > Thank you in advance! > > > > Thank you, > > Jerry Shepard > > Research Engineer > > Purdue University > > Birck Nanotechnology Center > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From kjvowen at lnf.umich.edu Fri Feb 14 08:59:49 2020 From: kjvowen at lnf.umich.edu (Kevin Owen) Date: Fri, 14 Feb 2020 08:59:49 -0500 Subject: [labnetwork] Dry etching Zinc Sulfide and/or Zinc Selenide bulk samples In-Reply-To: References: Message-ID: I would expect that a CCP may be less susceptible to process shift in this case, at least in my experience redeposition onto a cathode is not nearly as detrimental as onto a coil ceramic (as in the case of ICP). And as was already mentioned, it's unlikely to be completely volatile. I'll also add that at the LNF, we decided a few years ago that we would not allow any selenides into any system that has a fluorine gas plumbed. Selenium fluorides are highly toxic (SeF6 has an IDLH of 2 ppm), and we were concerned that even if the gas isn't used in that specific etch, in theory there could be reactions with any fluorinated chamber wall deposition from a previous process. This may be overkill (and I'm curious what others think), but that was the decision we made. We'll be moving pretty much all of our chalcogenide processes to our ion mill (as well as all other materials with predominantly nonvolatile etch byproducts). -Kevin On Fri, Feb 14, 2020 at 8:00 AM Demis D. John wrote: > We have a relatively successful recipe which works with both ZnS & ZnSe: > > https://wiki.nanotech.ucsb.edu/wiki/index.php/RIE_Etching_Recipes#ZnS_Etching_.28RIE_2.29 > ? Methane/Hydrogen RIE etch. > > This is on one of our older Capacitive RIE systems: > https://wiki.nanotech.ucsb.edu/wiki/index.php/RIE_2_(MRC) > We do have some very sensitive etches on this tool, and long ZnS etches > did not appear to cause any visible problems to those. > -- Demis > > ---------------------------------------- > demis at ucsb.edu > * Process Scientist Manager* > UCSB Nanofabrication Facility > ---------------------------------------- > > > > On Thu, Feb 13, 2020 at 5:43 PM Aebersold,Julia W. < > julia.aebersold at louisville.edu> wrote: > >> We haven?t etched that material, but any plasma processing with BCL3 we >> raise the processing temp of the cooling water. BCL3 loves to condense at >> room temps, so we take our chiller up to 35 degrees C to make sure it stays >> in vapor form. And wrap the gas lines with heat tape. >> >> >> >> Cheers! >> >> >> >> Julia Aebersold, Ph.D. >> >> Manager, Micro/Nano Technology Center >> >> University of Louisville >> >> Shumaker Research Building, Room 233 >> >> 2210 South Brook Street >> >> Louisville, KY 40292 >> >> (502) 852-1572 >> >> >> >> http://louisville.edu/micronano/ >> >> >> >> *From:* labnetwork-bounces at mtl.mit.edu [mailto: >> labnetwork-bounces at mtl.mit.edu] *On Behalf Of *Shepard, Jeremiah J >> *Sent:* Wednesday, February 12, 2020 3:42 PM >> *To:* labnetwork at mtl.mit.edu >> *Cc:* Raghunathan, Nithin ; Dilley, Neil R < >> ndilley at purdue.edu> >> *Subject:* [labnetwork] Dry etching Zinc Sulfide and/or Zinc Selenide >> bulk samples >> >> >> >> Does anyone have experience etching Zinc Sulfide and Zinc Selenide? >> >> >> >> It appears chemistry would involve BCL3. >> >> >> >> My primary concern is chamber contamination, any experience or thoughts? >> Thank you in advance! >> >> >> >> Thank you, >> >> Jerry Shepard >> >> Research Engineer >> >> Purdue University >> >> Birck Nanotechnology Center >> >> >> _______________________________________________ >> labnetwork mailing list >> labnetwork at mtl.mit.edu >> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork >> > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -- Kevin Owen Senior Engineer in Research Operations Group, Lurie Nanofabrication Facility University of Michigan (734) 545-4014 -------------- next part -------------- An HTML attachment was scrubbed... URL: From travisgabel at boisestate.edu Fri Feb 14 17:17:33 2020 From: travisgabel at boisestate.edu (Travis Gabel) Date: Fri, 14 Feb 2020 15:17:33 -0700 Subject: [labnetwork] Veeco Nt1100 PSI mode Message-ID: Hi Everyone, Our Veeco Nt1100 optical profiler has started having problems with PSI mode measurements. We have tested multiple samples on both our stylus profilometer and optical. All the PSI mode measurements are having values about half the value from the stylus profilometer as well as half the value of VSI mode measurements. Has anyone had similar issues and been able to correct them? Thanks Travis -------------- next part -------------- An HTML attachment was scrubbed... URL: From zlewicka at princeton.edu Fri Feb 14 17:58:27 2020 From: zlewicka at princeton.edu (Zuzanna A. Lewicka) Date: Fri, 14 Feb 2020 22:58:27 +0000 Subject: [labnetwork] Polishing tool In-Reply-To: References: <6532ba6c-4331-1698-9ae9-870b1fb967b9@udel.edu> Message-ID: Hello, Here at PRISM Cleanroom facility, in packaging room, we have Logitech Lapping/Polishing system (https://prism-cleanroom.princeton.edu/instrument.php?iid=39) and handmade holder for die edge polishing (see attached picture). This setup was used once for polishing III-V edge emitting semiconductor lasers. Currently, in packaging laboratory, we also have new Loomis cleaving tool (https://prism-cleanroom.princeton.edu/instrument.php?iid=71 ). The cleaved facets have a quality of a mirror and do not need subsequent polishing. Best regards, Zuzanna Zuzanna Lewicka Senior Research Specialist PRISM Cleanroom Laboratory Princeton Institute for the Science and Technology of Materials Princeton University From: labnetwork-bounces at mtl.mit.edu On Behalf Of Michael Rooks Sent: Thursday, February 13, 2020 9:48 AM To: Iulian Codreanu Cc: Fab Network Subject: Re: [labnetwork] Polishing tool We have a low-cost polisher from Allied High Tech http://www.alliedhightech.com/Equipment/metprep-1?-grinder-polisher which is used to polish the ends of waveguides. Wafers are mounted on either a wedge polishing or cross-sectioning jig (also from Allied High Tech). It's best to put it next to a sink, in a dirty lab. I suggest plugging it into a foot-pedal which acts as a dead-man's switch. It's handy for stopping the wheel without taking your hands off the jig, and it's a good safety device to reduce the risk of injury. It's a spinning wheel that you'll want to supervise much like a band saw or a drill press. Keep some bandaids nearby. -------------------------------- Michael Rooks Yale Institute of Nanoscience and Quantum Engineering nano.yale.edu On Wed, Feb 12, 2020 at 7:55 PM Iulian Codreanu > wrote: Hello, I am looking into offering capabilities for polishing the edge of chips to our users working on optical devices. If you have equipment in your lab that does that, I hope you can share your experience and recommendations with me or the network. Thank you in advance for your help. Best regards, Iulian -- iulian Codreanu, Ph.D. Director, Nanofabrication Facility University of Delaware Harker ISE Lab, Room 163 221 Academy Street Newark, DE 19716 302-831-2784 http://udnf.udel.edu _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: IMG_20200213_120939740.jpg Type: image/jpeg Size: 3460516 bytes Desc: IMG_20200213_120939740.jpg URL: From gloriaq0331 at gmail.com Sun Feb 16 23:20:36 2020 From: gloriaq0331 at gmail.com (Gloria Qiu) Date: Mon, 17 Feb 2020 15:20:36 +1100 Subject: [labnetwork] Potential Cu contamination in sputtering chamber used for superconducting material deposition Message-ID: Dear all, Here at Research and Prototype Foundry (Sydney, Australia), users have been using the sputtering system extensively for superconducting materials, i.e. NbTiN and MoRe. I am wondering if it is OK to add an alloy of Si/Al/Cu (0.95/0.025/0.025) to the chamber. Is there any potential contamination for the superconducting materials? Any input is appreciated. Thanks in advance. Gloria -------------- next part -------------- An HTML attachment was scrubbed... URL: From sean.rinehart at yale.edu Tue Feb 18 09:41:32 2020 From: sean.rinehart at yale.edu (Rinehart, Sean) Date: Tue, 18 Feb 2020 14:41:32 +0000 Subject: [labnetwork] BCl3 Condensation Message-ID: Hi all, I know that BCl3 condensation and line heating have been brought up several times in the past so this seemed like a good place to ask about the consequences of BCl3 condensation. Barring subsequent exposure to moisture is there any permanent damage to the delivery system, or does it just affect process gas mixture and block gas flow until it evaporates off? Also, if the delivery pressure is regulated to below the vapor pressure at the coldest point in the delivery system would that effectively eliminate the risk of condensation? Thank you, Sean Rinehart Assistant Director, Cleanroom Operations Yale University -------------- next part -------------- An HTML attachment was scrubbed... URL: From jshepar at purdue.edu Tue Feb 18 11:45:09 2020 From: jshepar at purdue.edu (Shepard, Jeremiah J) Date: Tue, 18 Feb 2020 16:45:09 +0000 Subject: [labnetwork] Dry etching Zinc Sulfide and/or Zinc Selenide bulk samples In-Reply-To: References: Message-ID: Thank you all for your input, it helps and I greatly appreciate it! Jerry From: Kevin Owen Sent: Friday, February 14, 2020 9:00 AM To: demis at ucsb.edu Cc: Shepard, Jeremiah J ; labnetwork at mtl.mit.edu; Raghunathan, Nithin ; Dilley, Neil R Subject: Re: [labnetwork] Dry etching Zinc Sulfide and/or Zinc Selenide bulk samples I would expect that a CCP may be less susceptible to process shift in this case, at least in my experience redeposition onto a cathode is not nearly as detrimental as onto a coil ceramic (as in the case of ICP). And as was already mentioned, it's unlikely to be completely volatile. I'll also add that at the LNF, we decided a few years ago that we would not allow any selenides into any system that has a fluorine gas plumbed. Selenium fluorides are highly toxic (SeF6 has an IDLH of 2 ppm), and we were concerned that even if the gas isn't used in that specific etch, in theory there could be reactions with any fluorinated chamber wall deposition from a previous process. This may be overkill (and I'm curious what others think), but that was the decision we made. We'll be moving pretty much all of our chalcogenide processes to our ion mill (as well as all other materials with predominantly nonvolatile etch byproducts). -Kevin On Fri, Feb 14, 2020 at 8:00 AM Demis D. John > wrote: We have a relatively successful recipe which works with both ZnS & ZnSe: https://wiki.nanotech.ucsb.edu/wiki/index.php/RIE_Etching_Recipes#ZnS_Etching_.28RIE_2.29 ? Methane/Hydrogen RIE etch. This is on one of our older Capacitive RIE systems: https://wiki.nanotech.ucsb.edu/wiki/index.php/RIE_2_(MRC) We do have some very sensitive etches on this tool, and long ZnS etches did not appear to cause any visible problems to those. -- Demis ---------------------------------------- demis at ucsb.edu Process Scientist Manager UCSB Nanofabrication Facility ---------------------------------------- On Thu, Feb 13, 2020 at 5:43 PM Aebersold,Julia W. > wrote: We haven?t etched that material, but any plasma processing with BCL3 we raise the processing temp of the cooling water. BCL3 loves to condense at room temps, so we take our chiller up to 35 degrees C to make sure it stays in vapor form. And wrap the gas lines with heat tape. Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville Shumaker Research Building, Room 233 2210 South Brook Street Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Shepard, Jeremiah J Sent: Wednesday, February 12, 2020 3:42 PM To: labnetwork at mtl.mit.edu Cc: Raghunathan, Nithin >; Dilley, Neil R > Subject: [labnetwork] Dry etching Zinc Sulfide and/or Zinc Selenide bulk samples Does anyone have experience etching Zinc Sulfide and Zinc Selenide? It appears chemistry would involve BCL3. My primary concern is chamber contamination, any experience or thoughts? Thank you in advance! Thank you, Jerry Shepard Research Engineer Purdue University Birck Nanotechnology Center _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -- Kevin Owen Senior Engineer in Research Operations Group, Lurie Nanofabrication Facility University of Michigan (734) 545-4014 -------------- next part -------------- An HTML attachment was scrubbed... URL: From spaolini at cns.fas.harvard.edu Tue Feb 18 12:15:36 2020 From: spaolini at cns.fas.harvard.edu (Paolini, Steven) Date: Tue, 18 Feb 2020 17:15:36 +0000 Subject: [labnetwork] BCl3 Condensation In-Reply-To: References: Message-ID: Sean, If the BCl3 is being delivered to a vacuum system such as an etcher, I would highly recommend delivering the gas at sub-atmospheric pressures. As we all know, the lower the pressure, the lower the boiling point. I have struggled with heating gas lines and increasing the room temperature gradient for some years until I started delivering at sub-atmospheric (~5" Hg). I have never had a problem since. Good luck, Equipment Dood Steve Paolini Principal Equipment Engineer Harvard University Center for Nanoscale Systems 11 Oxford St. Cambridge, MA 02138 617- 496- 9816 spaolini at cns.fas.harvard.edu www.cns.fas.harvard.edu From: labnetwork-bounces at mtl.mit.edu On Behalf Of Rinehart, Sean Sent: Tuesday, February 18, 2020 9:42 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] BCl3 Condensation Hi all, I know that BCl3 condensation and line heating have been brought up several times in the past so this seemed like a good place to ask about the consequences of BCl3 condensation. Barring subsequent exposure to moisture is there any permanent damage to the delivery system, or does it just affect process gas mixture and block gas flow until it evaporates off? Also, if the delivery pressure is regulated to below the vapor pressure at the coldest point in the delivery system would that effectively eliminate the risk of condensation? Thank you, Sean Rinehart Assistant Director, Cleanroom Operations Yale University -------------- next part -------------- An HTML attachment was scrubbed... URL: From ccheney at infinityhps.com Tue Feb 18 12:44:11 2020 From: ccheney at infinityhps.com (Craig Cheney) Date: Tue, 18 Feb 2020 17:44:11 +0000 Subject: [labnetwork] BCl3 Condensation In-Reply-To: References: Message-ID: Sean, There are several things that can happen if you get BCL3 line condensation. The first is incorrect gas flow control through an MFC, most (Gas Calibrated) MFC's are designed to work in the gaseous phase, if the gas you are flowing condensates into a liquid the MFC loses its ability to properly control. MFC's measure gas flow using thermal mass flow, if they are calibrated for gas then flowing a liquid through them will give erratic results. The second problem is insufficient gas supply, if you the gas delivery for the BCL3 contains numerous changes in direction then the possibility exists that you can actually create a trap if the BCL3 condensates to a level that does not permit gas to flow. We have seen this in installations where the line run actually had a trap built into it and due to temperature differences along the line run, this line would literally stop gas flow due to the condensation building up to a point that it completely blocked the line. Here are industry standard designs considerations that are employed for the proper delivery of BCL3 or other low vapor pressure/low vapor temperature gases. * Control the temperature of the cylinder. Most installations utilize a blanket that flows coolant through them that is connected to an independent chiller. The temperature of the cylinder is kept at room temperature or 1 or 2 degrees warmer then room temperature. * The gas line itself (and it should be coaxial), should be heated and insulated. The temperature of the gas line and gas panel components should be 10 to 15 degrees warmer then room temperature. * The gas line itself should be designed and built to incorporate the following; o Minimal changes in direction. o Should be located as close as possible to the use point. o There should be no traps built into the line, even if run path requires it. This will cause big problems. o The line (if possible) should be sloped or designed so that it would naturally drain to the delivery source. I hope that helps. Let me know if you would like any more information. Thank you, Craig Cheney [Description: cid:image001.jpg at 01C7E19F.47FFBAE0] Desk: (608)834-4200 Fax: (608)834-4299 Cell: (608)438-8714 Aviation in itself is not inherently dangerous. But to an even greater degree than the sea, it is terribly unforgiving of any carelessness, incapacity or neglect. - Captain A. G. Lamplugh This e-mail transmission and any attachments to it are intended solely for the use of the individual or entity to whom it is addressed and may contain confidential and privileged information. If you are not the intended recipient, your use, forwarding, printing, storing, disseminating, distribution, or copying of this communication is prohibited. If you received this communication in error, please notify the sender immediately by replying to this message and delete it from your computer. From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Rinehart, Sean Sent: Tuesday, February 18, 2020 8:42 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] BCl3 Condensation Hi all, I know that BCl3 condensation and line heating have been brought up several times in the past so this seemed like a good place to ask about the consequences of BCl3 condensation. Barring subsequent exposure to moisture is there any permanent damage to the delivery system, or does it just affect process gas mixture and block gas flow until it evaporates off? Also, if the delivery pressure is regulated to below the vapor pressure at the coldest point in the delivery system would that effectively eliminate the risk of condensation? Thank you, Sean Rinehart Assistant Director, Cleanroom Operations Yale University -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 5517 bytes Desc: image001.jpg URL: From fnewman at uw.edu Tue Feb 18 16:34:48 2020 From: fnewman at uw.edu (Fred Newman) Date: Tue, 18 Feb 2020 13:34:48 -0800 Subject: [labnetwork] Thermal uniformity measurement of RTA/RTP tools Message-ID: Hi All, Does anyone have any experience with characterizing the thermal uniformity of RTA tools? I am aware of using instrumented TC wafers, dry thermal oxide, Ti silicidation, and Al-Si eutectic to name a few, but am not so clear on all the advantages and disadvantages, particularly the true sensitivity vs. potential to be misled by results. Any advice, anecdotes, or words of wisdom would be most appreciated. For background, we have a couple of Heatpulse 610 units that we operate at the WNF using quartz holders for 100 - 150 mm wafers. The holders we have make 3 asperity contact points with the wafer, so basically the configuration inside the tube is nominally nothing absorbing besides the wafer being annealed (usually Si) and the thermocouple wire tip (held by spring force against the wafer back), and little thermal interaction between the chamber fixture and the wafer. Various users employ a broad range of temperatures, though the ones from whom I get the most questions about uniformity operate in the 500-600C range. Many thanks! Fred -- Fred Newman Research Engineer University of Washington, Washington Nanofabrication Facility 4000 Mason Rd, Fluke Hall Room 115 Seattle WA 98195-2143 office 206-616-3534 mobile 505-450-4447 fnewman at uw.edu https://www.wnf.washington.edu/ -------------- next part -------------- An HTML attachment was scrubbed... URL: From ana.sanchez at louisville.edu Wed Feb 19 09:26:08 2020 From: ana.sanchez at louisville.edu (KY Multiscale) Date: Wed, 19 Feb 2020 09:26:08 -0500 (EST) Subject: [labnetwork] Spreading the word - 2020 KY NANO + AM Symposium Message-ID: <1133940558093.1131404001080.2098960567.0.290926JL.2002@scheduler.constantcontact.com> Register today! - You don't want to miss this. Tell your friends about our upcoming event POSTER PRESENTATIONS * SPEAKERS * FACILITY TOURS * NETWORKING www.nanoamsymposium.com The KY Nano+AM Symposium is an annual event that brings together researchers and industry in advanced manufacturing. We converge to discuss additive manufacturing and micro/nanotechnology -- what's new and what's next. Nano/AM Symposium is open to all scientists, engineers, and students from a variety of disciplines including microtechnology, nanotechnology, 3D printing, additive manufacturing, healthcare, energy, advanced materials, MEMS, biotechnology, commercial products, defense, and nano-education. REGISTER TODAY! Share ? ? ? KY Multiscale | 2210 South Brook St, Shumaker Research Bldg , Louisville, KY 40208 www.kymultiscale.net Unsubscribe labnetwork at mtl.mit.edu Update Profile | About Constant Contact Sent by ana.sanchez at louisville.edu in collaboration with Try email marketing for free today! -------------- next part -------------- An HTML attachment was scrubbed... URL: From jsalzmann at pcb.com Wed Feb 19 09:35:42 2020 From: jsalzmann at pcb.com (Jeff Salzmann) Date: Wed, 19 Feb 2020 14:35:42 +0000 Subject: [labnetwork] Thermal uniformity measurement of RTA/RTP tools In-Reply-To: References: Message-ID: <6082E83331E49D41A9DE3F109A76690C7C9C9A6E@NYDMS11.pcb.com> Fred, I?ve had success getting the uniformity characterized by growing a thin oxide on a bare Si wafer. I ran it flowing oxygen at 1100?C, no chlorine or anything else. Use a <111> wafer if possible, that?ll grow faster so you?ll get a thicker oxide for less process time. I can?t recall if you can get lamp intensity control on the 610; that said, what I did was design an experiment around the bank intensities and grow oxides until the oxide uniformity was as good as I was able to set it. Using the Deal-Grove model, I was able to get ? 3?C thermal uniformity at 1100?C. Good luck!! Jeff Jeff Salzmann Design Engineer III, Research and Development PCB Piezotronics 3425 Walden Avenue Depew, NY 14043 O: 716.684.0002 x2907 C: 716.867.1302 From: labnetwork-bounces at mtl.mit.edu On Behalf Of Fred Newman Sent: Tuesday, February 18, 2020 4:35 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Thermal uniformity measurement of RTA/RTP tools Hi All, Does anyone have any experience with characterizing the thermal uniformity of RTA tools? I am aware of using instrumented TC wafers, dry thermal oxide, Ti silicidation, and Al-Si eutectic to name a few, but am not so clear on all the advantages and disadvantages, particularly the true sensitivity vs. potential to be misled by results. Any advice, anecdotes, or words of wisdom would be most appreciated. For background, we have a couple of Heatpulse 610 units that we operate at the WNF using quartz holders for 100 - 150 mm wafers. The holders we have make 3 asperity contact points with the wafer, so basically the configuration inside the tube is nominally nothing absorbing besides the wafer being annealed (usually Si) and the thermocouple wire tip (held by spring force against the wafer back), and little thermal interaction between the chamber fixture and the wafer. Various users employ a broad range of temperatures, though the ones from whom I get the most questions about uniformity operate in the 500-600C range. Many thanks! Fred -- Fred Newman Research Engineer University of Washington, Washington Nanofabrication Facility 4000 Mason Rd, Fluke Hall Room 115 Seattle WA 98195-2143 office 206-616-3534 mobile 505-450-4447 fnewman at uw.edu https://www.wnf.washington.edu/ -------------- next part -------------- An HTML attachment was scrubbed... URL: From dcchrist at wisc.edu Wed Feb 19 15:16:29 2020 From: dcchrist at wisc.edu (Daniel Christensen) Date: Wed, 19 Feb 2020 20:16:29 +0000 Subject: [labnetwork] Call for papers, UGIM 2020 Message-ID: [cid:image001.jpg at 01D5E72F.2D46EE00] https://ugim2020.wisc.edu/ CALL FOR PAPERS The time to participate in the 2020 University - Government-Industry Micro-nanotechnology Symposium is upon us. Please submit your abstracts via the symposium website at: https://ugim2020.wisc.edu/abstract-submission-2/ Topics include: Safety Staffing Financial administration Operations Growing your facility Education and training New facility startup Managing mixed use facilities Interacting with your administration Registration Now Open! Early Registration closes on 4/30/2020. Resister here: https://ugim2020.wisc.edu/registration/ Daniel C. Christensen Laboratory Manager Nanoscale Fabrication Center University of Wisconsin-Madison -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 11523 bytes Desc: image001.jpg URL: From michael.call at maine.edu Fri Feb 21 09:50:11 2020 From: michael.call at maine.edu (Michael Call) Date: Fri, 21 Feb 2020 09:50:11 -0500 Subject: [labnetwork] Suss MA6 EISS software version 1.34 Message-ID: We recently had a failure of the computer that provides the image capture for backside alignment on our MA6 aligner. We have recovered the computer operation, but still need to reinstall the EISS system software. There is a backup copy, but the batch file that executes during installation looks for files that are located on a floppy disk which we don't have. Has anyone successfully reloaded the EISS program on an MA6 that could assist me? Thanks, -- Mike Call Research Engineer University of Maine Frontier Institute for Research in Sensor Technologies (FIRST) Coordinated Research entities Cleanroom ESRB Barrows Hall room 294 207-581-3382 [image: image.png] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image.png Type: image/png Size: 53624 bytes Desc: not available URL: From steelxu at stanford.edu Fri Feb 21 20:12:14 2020 From: steelxu at stanford.edu (Xiaoqing Xu) Date: Sat, 22 Feb 2020 01:12:14 +0000 Subject: [labnetwork] DISCO wafersaw software freeze PROBLEM In-Reply-To: <485c3527-d5f8-b285-afb7-2525f4d4add1@mtl.mit.edu> References: , <485c3527-d5f8-b285-afb7-2525f4d4add1@mtl.mit.edu> Message-ID: Hi All, We have constantly seen our DISCO wafersaw software freeze (it started by reading some init files then stopped responding) at the boot up step when turning on the tool using the "start" key. We were able to eventually turn on the software by trying reboot multiple times, but it got harder and harder. Initially we suspected maybe the tool run out of storage (ONLY 2GB), but we downloaded all the files and they only counted for over 100KB, which indicating not a storage issue. Did anyone see a similar problem, and how did you solve it? Any input is much appreciated! Thanks, Xiaoqing -------------- next part -------------- An HTML attachment was scrubbed... URL: From martin at algoshift.com Sat Feb 22 02:55:03 2020 From: martin at algoshift.com (martin at algoshift.com) Date: Fri, 21 Feb 2020 23:55:03 -0800 Subject: [labnetwork] LED Lights for Lithography Message-ID: <44801d9e2f2bf7974f71ab12b61abfe0@algoshift.com> I am currently working on the development of LED-based lights for lithography applications. I came across this list and was kindly allowed to join. I have a background in high-performance, high accuracy LED-based applications going back some twenty years. In addition to that I worked in aerospace engineering, robotics and other work I can't talk about (most recently, SpaceX). At this stage in my new mission I am trying to confirm what I have learned in order to start developing a few prototypes for testing. This is what I know and don't know so far: - Energy above 500 nm should be below 0.001% - Operator metamerism doesn't seem to be much of a concern in these environments (?) - Outgassing is not desirable (I don't have any kind of a specification for this) - No specification on acceptable flicker - No specification on required efficiency (Lumen/Watt) - No specification on the amount of light required, either: - Illuminance (intensity of light on a surface, lux) or, - Luminance (light energy emitted, lumens) Frankly, there really isn't very much data out there. It also seems that semiconductor companies keep their lithography illumination requirements somewhat close to the vest. At least this is what I've come across. I wonder if this is because these kinds of specifications might reveal process details? Don't know. The three main trades I have in front of me at the moment for this design are: - White LEDs with carefully selected film or coating-based filter to cut blue + UV - Green and Red LEDs only, no blue; filtration is still needed - A combination of carefully selected white LEDs with low spectral power above 500 nm along with, perhaps, green and red to enhance; filtration still needed To clarify, the Green+Red LED option still requires filtration because green LEDs produce some energy above 500 nm. If I am to take the 0.001% specification to be true, an optical filter would still be required. White LED's, which, of course, are nothing more than blue LEDs with a phosphor coating are the most readily available high efficiency units in the market. Frankly, if high light output at the lowest possible cost is a requirement it is hard to beat them with a combination of red and green LEDs. That said, depending on how they are selected, a significant portion of the spectral power they emit will have to be converted into heat at a filter or bad things will happen in the lab. The third option involves selecting very warm white LEDs that have almost no blue spike. This means less heating of the filter element and, likely, longer life. This could be an interesting solution. Plastic film based filters degrade over time, particularly if there's a lot of heating due to having too much energy in the undesirable portion of the spectrum. This is where thin film deposition (sputtering?) could exhibit far more favorable band-pass characteristics as long a longevity. Cost, of course, could be an issue. I am very familiar with material out-gassing issues in the context of aerospace applications. Not so for lab usage. Understanding where these limits might lie would be very useful. The perfectionist in me wants to design a T5-class 4 ft LED light fully encased and appropriately sealed in a durable glass tube that is both internally and externally coated to not pass light above 500 nm. At the same time, I do understand that a real solution has to fit a budget as well as technical specifications. Not sure where that intersection lies but I am aware of it. I introduced a term above that might not be familiar to everyone here; observer metamerism. This is a by-product of the spectral power distributions of light, reflection and the human vision system interacting in such a way that two colors that are different might appear the same (or, in general, you have trouble discerning colors that are easy to see under different conditions). If you've ever tried to determine if a steak is well done under a typical white LED light and could not, that's observer metamerism. Mitigation requires "filling in" the emitted spectra in areas relevant to the task at hand. This is why I asked myself this question in the red+green LED case. Both of these have narrow emission spectra. Our brains can function with this kind of light and, yes, we will see it as yellow. However, any colors in the portion of the visible spectrum lacking energy will become challenging to deal with. It's like being color blind. Given that lithography labs are already built to work with yellow light, I find myself wondering how much of a problem, if any, might be posed by observer metamerism in the case of the proposed red+green LED solution. I think that's the basics at this point. I would appreciate any and all feedback, questions and even a good shove in the right direction. Thank you, Martin Euredjian AlgoShift, LLC Los Angeles, CA 661-305-9320 From James.Vlahakis at tufts.edu Sat Feb 22 08:10:28 2020 From: James.Vlahakis at tufts.edu (Vlahakis, James) Date: Sat, 22 Feb 2020 13:10:28 +0000 Subject: [labnetwork] Facility tour for students in micro/nanofabrication class Message-ID: <676C9381B5E6AC4FAE9CD9CFCC40DF1E01353B492D@SSVMEXDAG01MB05.tufts.ad.tufts.edu> Hi everyone, This semester I am lucky enough to be teaching the micro/nanofab course at Tufts Univ, the students and I are having a lot of fun in the lab. Safely though of course! I hope to arrange a tour of, ideally, a more production oriented fabrication space, although seeing *any* different facility would be worthwhile. If you are willing, can accommodate up to nine people (8 students + 1 instructor) and are located within an hour or so of Boston please contact me at your earliest convenience. Thanks for your consideration! jim -------------- next part -------------- An HTML attachment was scrubbed... URL: From yb2471 at columbia.edu Sat Feb 22 08:52:57 2020 From: yb2471 at columbia.edu (Youry Borisenkov) Date: Sat, 22 Feb 2020 08:52:57 -0500 Subject: [labnetwork] DISCO wafersaw software freeze PROBLEM In-Reply-To: References: <485c3527-d5f8-b285-afb7-2525f4d4add1@mtl.mit.edu> Message-ID: Hi, We had similar symptoms on our Disco (in Tel Aviv University). Eventually the hard drive was replaced by the vendor. This solved the problem. The vendor also helped to backup tool?s settings, and then rewind to the new hard drive. Regards, Youry On Sat, Feb 22, 2020 at 8:45 AM Xiaoqing Xu wrote: > Hi All, > > We have constantly seen our DISCO wafersaw software freeze (it started by > reading some init files then stopped responding) at the boot up step when > turning on the tool using the "start" key. We were able to eventually turn > on the software by trying reboot multiple times, but it got harder and > harder. Initially we suspected maybe the tool run out of storage (ONLY > 2GB), but we downloaded all the files and they only counted for over 100KB, > which indicating not a storage issue. Did anyone see a similar problem, and > how did you solve it? > > Any input is much appreciated! > Thanks, > Xiaoqing > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From martin at algoshift.com Sat Feb 22 16:47:35 2020 From: martin at algoshift.com (martin at algoshift.com) Date: Sat, 22 Feb 2020 13:47:35 -0800 Subject: [labnetwork] LED Lights for Lithography In-Reply-To: <44801d9e2f2bf7974f71ab12b61abfe0@algoshift.com> References: <44801d9e2f2bf7974f71ab12b61abfe0@algoshift.com> Message-ID: Based on a couple of responses it looks like I did a confusing job of explaining what I am working on. I am focusing on lights to illuminate the lab, the room, not to cure PMMA. So, yes, this is about lights on the ceiling. Also, I said "above 500 nm" when I was thinking frequency. I should have said "below 500 nm". The point is, as I understand it today, the goal is to not have much energy in the blue and UV range of emissions. Sorry for the confusion. Thanks, -Martin --- On 2020-02-21 23:55, martin at algoshift.com wrote: > I am currently working on the development of LED-based lights for > lithography applications. I came across this list and was kindly > allowed to join. > > I have a background in high-performance, high accuracy LED-based > applications going back some twenty years. In addition to that I > worked in aerospace engineering, robotics and other work I can't talk > about (most recently, SpaceX). > > At this stage in my new mission I am trying to confirm what I have > learned in order to start developing a few prototypes for testing. > This is what I know and don't know so far: > > - Energy above 500 nm should be below 0.001% > - Operator metamerism doesn't seem to be much of a concern in these > environments (?) > - Outgassing is not desirable (I don't have any kind of a > specification for this) > - No specification on acceptable flicker > - No specification on required efficiency (Lumen/Watt) > - No specification on the amount of light required, either: > - Illuminance (intensity of light on a surface, lux) or, > - Luminance (light energy emitted, lumens) > > Frankly, there really isn't very much data out there. It also seems > that semiconductor companies keep their lithography illumination > requirements somewhat close to the vest. At least this is what I've > come across. I wonder if this is because these kinds of > specifications might reveal process details? Don't know. > > The three main trades I have in front of me at the moment for this > design are: > > - White LEDs with carefully selected film or coating-based filter to > cut blue + UV > - Green and Red LEDs only, no blue; filtration is still needed > - A combination of carefully selected white LEDs with low spectral > power above 500 nm along with, perhaps, green and red to enhance; > filtration still needed > > To clarify, the Green+Red LED option still requires filtration because > green LEDs produce some energy above 500 nm. If I am to take the > 0.001% specification to be true, an optical filter would still be > required. > > White LED's, which, of course, are nothing more than blue LEDs with a > phosphor coating are the most readily available high efficiency units > in the market. Frankly, if high light output at the lowest possible > cost is a requirement it is hard to beat them with a combination of > red and green LEDs. That said, depending on how they are selected, a > significant portion of the spectral power they emit will have to be > converted into heat at a filter or bad things will happen in the lab. > > The third option involves selecting very warm white LEDs that have > almost no blue spike. This means less heating of the filter element > and, likely, longer life. This could be an interesting solution. > > Plastic film based filters degrade over time, particularly if there's > a lot of heating due to having too much energy in the undesirable > portion of the spectrum. This is where thin film deposition > (sputtering?) could exhibit far more favorable band-pass > characteristics as long a longevity. Cost, of course, could be an > issue. > > I am very familiar with material out-gassing issues in the context of > aerospace applications. Not so for lab usage. Understanding where > these limits might lie would be very useful. The perfectionist in me > wants to design a T5-class 4 ft LED light fully encased and > appropriately sealed in a durable glass tube that is both internally > and externally coated to not pass light above 500 nm. At the same > time, I do understand that a real solution has to fit a budget as well > as technical specifications. Not sure where that intersection lies > but I am aware of it. > > I introduced a term above that might not be familiar to everyone here; > observer metamerism. This is a by-product of the spectral power > distributions of light, reflection and the human vision system > interacting in such a way that two colors that are different might > appear the same (or, in general, you have trouble discerning colors > that are easy to see under different conditions). If you've ever > tried to determine if a steak is well done under a typical white LED > light and could not, that's observer metamerism. Mitigation requires > "filling in" the emitted spectra in areas relevant to the task at > hand. > > This is why I asked myself this question in the red+green LED case. > Both of these have narrow emission spectra. Our brains can function > with this kind of light and, yes, we will see it as yellow. However, > any colors in the portion of the visible spectrum lacking energy will > become challenging to deal with. It's like being color blind. Given > that lithography labs are already built to work with yellow light, I > find myself wondering how much of a problem, if any, might be posed by > observer metamerism in the case of the proposed red+green LED > solution. > > I think that's the basics at this point. I would appreciate any and > all feedback, questions and even a good shove in the right direction. > > Thank you, > > Martin Euredjian > AlgoShift, LLC > Los Angeles, CA > 661-305-9320 > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork From hbtusainc at yahoo.com Sun Feb 23 07:37:48 2020 From: hbtusainc at yahoo.com (Mario Portillo) Date: Sun, 23 Feb 2020 12:37:48 +0000 (UTC) Subject: [labnetwork] LED Lights for Lithography In-Reply-To: References: <44801d9e2f2bf7974f71ab12b61abfe0@algoshift.com> Message-ID: <1131015632.5021469.1582461468161@mail.yahoo.com> I have to say that I was very interested in responding to your first email, as I am looking for ways to eliminate the use of mercury arc lamps to LEDs.... Anybody out there with the same thought let me know, Regards? Sent from Yahoo Mail for iPhone Mario Portillo, hbtusainc at yahoo.com On Sunday, February 23, 2020, 11:40 AM, martin at algoshift.com wrote: Based on a couple of responses it looks like I did a confusing job of explaining what I am working on. I am focusing on lights to illuminate the lab, the room, not to cure PMMA.? So, yes, this is about lights on the ceiling. Also, I said "above 500 nm" when I was thinking frequency.? I should have said "below 500 nm".? The point is, as I understand it today, the goal is to not have much energy in the blue and UV range of emissions. Sorry for the confusion. Thanks, -Martin --- On 2020-02-21 23:55, martin at algoshift.com wrote: > I am currently working on the development of LED-based lights for > lithography applications.? I came across this list and was kindly > allowed to join. > > I have a background in high-performance, high accuracy LED-based > applications going back some twenty years.? In addition to that I > worked in aerospace engineering, robotics and other work I can't talk > about (most recently, SpaceX). > > At this stage in my new mission I am trying to confirm what I have > learned in order to start developing a few prototypes for testing. > This is what I know and don't know so far: > > - Energy above 500 nm should be below 0.001% > - Operator metamerism doesn't seem to be much of a concern in these > environments (?) > - Outgassing is not desirable (I don't have any kind of a > specification for this) > - No specification on acceptable flicker > - No specification on required efficiency (Lumen/Watt) > - No specification on the amount of light required, either: >? ? - Illuminance (intensity of light on a surface, lux) or, >? ? - Luminance (light energy emitted, lumens) > > Frankly, there really isn't very much data out there.? It also seems > that semiconductor companies keep their lithography illumination > requirements somewhat close to the vest.? At least this is what I've > come across.? I wonder if this is because these kinds of > specifications might reveal process details?? Don't know. > > The three main trades I have in front of me at the moment for this > design are: > > - White LEDs with carefully selected film or coating-based filter to > cut blue + UV > - Green and Red LEDs only, no blue; filtration is still needed > - A combination of carefully selected white LEDs with low spectral > power above 500 nm along with, perhaps, green and red to enhance; > filtration still needed > > To clarify, the Green+Red LED option still requires filtration because > green LEDs produce some energy above 500 nm.? If I am to take the > 0.001% specification to be true, an optical filter would still be > required. > > White LED's, which, of course, are nothing more than blue LEDs with a > phosphor coating are the most readily available high efficiency units > in the market.? Frankly, if high light output at the lowest possible > cost is a requirement it is hard to beat them with a combination of > red and green LEDs.? That said, depending on how they are selected, a > significant portion of the spectral power they emit will have to be > converted into heat at a filter or bad things will happen in the lab. > > The third option involves selecting very warm white LEDs that have > almost no blue spike.? This means less heating of the filter element > and, likely, longer life.? This could be an interesting solution. > > Plastic film based filters degrade over time, particularly if there's > a lot of heating due to having too much energy in the undesirable > portion of the spectrum.? This is where thin film deposition > (sputtering?) could exhibit far more favorable band-pass > characteristics as long a longevity.? Cost, of course, could be an > issue. > > I am very familiar with material out-gassing issues in the context of > aerospace applications.? Not so for lab usage.? Understanding where > these limits might lie would be very useful.? The perfectionist in me > wants to design a T5-class 4 ft LED light fully encased and > appropriately sealed in a durable glass tube that is both internally > and externally coated to not pass light above 500 nm.? At the same > time, I do understand that a real solution has to fit a budget as well > as technical specifications.? Not sure where that intersection lies > but I am aware of it. > > I introduced a term above that might not be familiar to everyone here; > observer metamerism.? This is a by-product of the spectral power > distributions of light, reflection and the human vision system > interacting in such a way that two colors that are different might > appear the same (or, in general, you have trouble discerning colors > that are easy to see under different conditions).? If you've ever > tried to determine if a steak is well done under a typical white LED > light and could not, that's observer metamerism.? Mitigation requires > "filling in" the emitted spectra in areas relevant to the task at > hand. > > This is why I asked myself this question in the red+green LED case. > Both of these have narrow emission spectra.? Our brains can function > with this kind of light and, yes, we will see it as yellow.? However, > any colors in the portion of the visible spectrum lacking energy will > become challenging to deal with.? It's like being color blind.? Given > that lithography labs are already built to work with yellow light, I > find myself wondering how much of a problem, if any, might be posed by > observer metamerism in the case of the proposed red+green LED > solution. > > I think that's the basics at this point.? I would appreciate any and > all feedback, questions and even a good shove in the right direction. > > Thank you, > > Martin Euredjian > AlgoShift, LLC > Los Angeles, CA > 661-305-9320 > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From martin at algoshift.com Sun Feb 23 11:55:53 2020 From: martin at algoshift.com (martin at algoshift.com) Date: Sun, 23 Feb 2020 08:55:53 -0800 Subject: [labnetwork] LED Lights for Lithography In-Reply-To: <1131015632.5021469.1582461468161@mail.yahoo.com> References: <44801d9e2f2bf7974f71ab12b61abfe0@algoshift.com> <1131015632.5021469.1582461468161@mail.yahoo.com> Message-ID: <5a36d9ed97d7152892718ec1b2ffd9dd@algoshift.com> > I have to say that I was very interested in responding to your first email, as I am looking for ways to eliminate the use of mercury arc lamps to LEDs.... I could work on that problem as well. It's a worthy cause, on more than one front. In general terms, I am currently working on a range of scientific applications of advanced LED technology. I thought illumination of lithography environments (the rooms), critical as it is, is a perfect fit for this focus. You have identified another area that would warrant attention. I'm happy to look into it and do the necessary research and prototyping. All I need is specifications. If anyone can help with that I'll take it from there. Thank you, -Martin --- On 2020-02-23 04:37, Mario Portillo wrote: > I have to say that I was very interested in responding to your first email, as I am looking for ways to eliminate the use of mercury arc lamps to LEDs.... > > Anybody out there with the same thought let me know, > > Regards > > Sent from Yahoo Mail for iPhone [1] > Mario Portillo, hbtusainc at yahoo.com > On Sunday, February 23, 2020, 11:40 AM, martin at algoshift.com wrote: > >> Based on a couple of responses it looks like I did a confusing job of >> explaining what I am working on. >> >> I am focusing on lights to illuminate the lab, the room, not to cure >> PMMA. So, yes, this is about lights on the ceiling. >> >> Also, I said "above 500 nm" when I was thinking frequency. I should >> have said "below 500 nm". The point is, as I understand it today, the >> goal is to not have much energy in the blue and UV range of emissions. >> >> Sorry for the confusion. >> >> Thanks, >> >> -Martin >> >> --- >> >> On 2020-02-21 23:55, martin at algoshift.com wrote: >>> I am currently working on the development of LED-based lights for >>> lithography applications. I came across this list and was kindly >>> allowed to join. >>> >>> I have a background in high-performance, high accuracy LED-based >>> applications going back some twenty years. In addition to that I >>> worked in aerospace engineering, robotics and other work I can't talk >>> about (most recently, SpaceX). >>> >>> At this stage in my new mission I am trying to confirm what I have >>> learned in order to start developing a few prototypes for testing. >>> This is what I know and don't know so far: >>> >>> - Energy above 500 nm should be below 0.001% >>> - Operator metamerism doesn't seem to be much of a concern in these >>> environments (?) >>> - Outgassing is not desirable (I don't have any kind of a >>> specification for this) >>> - No specification on acceptable flicker >>> - No specification on required efficiency (Lumen/Watt) >>> - No specification on the amount of light required, either: >>> - Illuminance (intensity of light on a surface, lux) or, >>> - Luminance (light energy emitted, lumens) >>> >>> Frankly, there really isn't very much data out there. It also seems >>> that semiconductor companies keep their lithography illumination >>> requirements somewhat close to the vest. At least this is what I've >>> come across. I wonder if this is because these kinds of >>> specifications might reveal process details? Don't know. >>> >>> The three main trades I have in front of me at the moment for this >>> design are: >>> >>> - White LEDs with carefully selected film or coating-based filter to >>> cut blue + UV >>> - Green and Red LEDs only, no blue; filtration is still needed >>> - A combination of carefully selected white LEDs with low spectral >>> power above 500 nm along with, perhaps, green and red to enhance; >>> filtration still needed >>> >>> To clarify, the Green+Red LED option still requires filtration because >>> green LEDs produce some energy above 500 nm. If I am to take the >>> 0.001% specification to be true, an optical filter would still be >>> required. >>> >>> White LED's, which, of course, are nothing more than blue LEDs with a >>> phosphor coating are the most readily available high efficiency units >>> in the market. Frankly, if high light output at the lowest possible >>> cost is a requirement it is hard to beat them with a combination of >>> red and green LEDs. That said, depending on how they are selected, a >>> significant portion of the spectral power they emit will have to be >>> converted into heat at a filter or bad things will happen in the lab. >>> >>> The third option involves selecting very warm white LEDs that have >>> almost no blue spike. This means less heating of the filter element >>> and, likely, longer life. This could be an interesting solution. >>> >>> Plastic film based filters degrade over time, particularly if there's >>> a lot of heating due to having too much energy in the undesirable >>> portion of the spectrum. This is where thin film deposition >>> (sputtering?) could exhibit far more favorable band-pass >>> characteristics as long a longevity. Cost, of course, could be an >>> issue. >>> >>> I am very familiar with material out-gassing issues in the context of >>> aerospace applications. Not so for lab usage. Understanding where >>> these limits might lie would be very useful. The perfectionist in me >>> wants to design a T5-class 4 ft LED light fully encased and >>> appropriately sealed in a durable glass tube that is both internally >>> and externally coated to not pass light above 500 nm. At the same >>> time, I do understand that a real solution has to fit a budget as well >>> as technical specifications. Not sure where that intersection lies >>> but I am aware of it. >>> >>> I introduced a term above that might not be familiar to everyone here; >>> observer metamerism. This is a by-product of the spectral power >>> distributions of light, reflection and the human vision system >>> interacting in such a way that two colors that are different might >>> appear the same (or, in general, you have trouble discerning colors >>> that are easy to see under different conditions). If you've ever >>> tried to determine if a steak is well done under a typical white LED >>> light and could not, that's observer metamerism. Mitigation requires >>> "filling in" the emitted spectra in areas relevant to the task at >>> hand. >>> >>> This is why I asked myself this question in the red+green LED case. >>> Both of these have narrow emission spectra. Our brains can function >>> with this kind of light and, yes, we will see it as yellow. However, >>> any colors in the portion of the visible spectrum lacking energy will >>> become challenging to deal with. It's like being color blind. Given >>> that lithography labs are already built to work with yellow light, I >>> find myself wondering how much of a problem, if any, might be posed by >>> observer metamerism in the case of the proposed red+green LED >>> solution. >>> >>> I think that's the basics at this point. I would appreciate any and >>> all feedback, questions and even a good shove in the right direction. >>> >>> Thank you, >>> >>> Martin Euredjian >>> AlgoShift, LLC >>> Los Angeles, CA >>> 661-305-9320 >>> >>> _______________________________________________ >>> labnetwork mailing list >>> labnetwork at mtl.mit.edu >>> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork >> >> _______________________________________________ >> labnetwork mailing list >> labnetwork at mtl.mit.edu >> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork Links: ------ [1] https://yho.com/footer0 -------------- next part -------------- An HTML attachment was scrubbed... URL: From mtang at stanford.edu Sun Feb 23 13:37:46 2020 From: mtang at stanford.edu (Mary Tang) Date: Sun, 23 Feb 2020 10:37:46 -0800 Subject: [labnetwork] LED Lights for Lithography In-Reply-To: <1131015632.5021469.1582461468161@mail.yahoo.com> References: <44801d9e2f2bf7974f71ab12b61abfe0@algoshift.com> <1131015632.5021469.1582461468161@mail.yahoo.com> Message-ID: <6a8c40af-5c21-cb2c-23c0-3168f9c09e8a@stanford.edu> Hi all - Last summer, Phil Himmer and I met with a European company that produces a conversion kit for the common contact aligner models (Suss, EV Group).? If anyone is interested, we can send you the contact info.? We've been seriously thinking about this, but the cost is not trivial and it's not clear that the lamp replacements and energy savings can fully justify.? Certainly, there is other value added, process-wise.? But as an upgrade, the costs would need to come out of our limited, precious capital budget.? We'd be interested in hearing about what other labs are considering and why. Cheers - Mary ___ Mary X. Tang, Ph.D. Managing Director Stanford Nanofabrication Facility Paul G. Allen Building, Room 141 Stanford, CA.? 94305 mtang at stanford.edu https://snf.stanford.edu On 2/23/2020 4:37 AM, Mario Portillo wrote: > I have to say that I was very interested in responding to your first > email, as I am looking for ways to eliminate the use of mercury arc > lamps to LEDs.... > > Anybody out there with the same thought let me know, > > Regards > > > Sent from Yahoo Mail for iPhone > Mario Portillo, hbtusainc at yahoo.com > > On Sunday, February 23, 2020, 11:40 AM, martin at algoshift.com wrote: > > Based on a couple of responses it looks like I did a confusing job of > explaining what I am working on. > > I am focusing on lights to illuminate the lab, the room, not to cure > PMMA.? So, yes, this is about lights on the ceiling. > > Also, I said "above 500 nm" when I was thinking frequency. I should > have said "below 500 nm".? The point is, as I understand it today, > the > goal is to not have much energy in the blue and UV range of emissions. > > Sorry for the confusion. > > Thanks, > > -Martin > > --- > > > On 2020-02-21 23:55, martin at algoshift.com > wrote: > > I am currently working on the development of LED-based lights for > > lithography applications.? I came across this list and was kindly > > allowed to join. > > > > I have a background in high-performance, high accuracy LED-based > > applications going back some twenty years.? In addition to that I > > worked in aerospace engineering, robotics and other work I can't > talk > > about (most recently, SpaceX). > > > > At this stage in my new mission I am trying to confirm what I have > > learned in order to start developing a few prototypes for testing. > > This is what I know and don't know so far: > > > > - Energy above 500 nm should be below 0.001% > > - Operator metamerism doesn't seem to be much of a concern in these > > environments (?) > > - Outgassing is not desirable (I don't have any kind of a > > specification for this) > > - No specification on acceptable flicker > > - No specification on required efficiency (Lumen/Watt) > > - No specification on the amount of light required, either: > >? ? - Illuminance (intensity of light on a surface, lux) or, > >? ? - Luminance (light energy emitted, lumens) > > > > Frankly, there really isn't very much data out there. It also seems > > that semiconductor companies keep their lithography illumination > > requirements somewhat close to the vest.? At least this is what I've > > come across.? I wonder if this is because these kinds of > > specifications might reveal process details?? Don't know. > > > > The three main trades I have in front of me at the moment for this > > design are: > > > > - White LEDs with carefully selected film or coating-based filter to > > cut blue + UV > > - Green and Red LEDs only, no blue; filtration is still needed > > - A combination of carefully selected white LEDs with low spectral > > power above 500 nm along with, perhaps, green and red to enhance; > > filtration still needed > > > > To clarify, the Green+Red LED option still requires filtration > because > > green LEDs produce some energy above 500 nm.? If I am to take the > > 0.001% specification to be true, an optical filter would still be > > required. > > > > White LED's, which, of course, are nothing more than blue LEDs > with a > > phosphor coating are the most readily available high efficiency > units > > in the market.? Frankly, if high light output at the lowest possible > > cost is a requirement it is hard to beat them with a combination of > > red and green LEDs.? That said, depending on how they are > selected, a > > significant portion of the spectral power they emit will have to be > > converted into heat at a filter or bad things will happen in the > lab. > > > > The third option involves selecting very warm white LEDs that have > > almost no blue spike.? This means less heating of the filter element > > and, likely, longer life.? This could be an interesting solution. > > > > Plastic film based filters degrade over time, particularly if > there's > > a lot of heating due to having too much energy in the undesirable > > portion of the spectrum.? This is where thin film deposition > > (sputtering?) could exhibit far more favorable band-pass > > characteristics as long a longevity.? Cost, of course, could be an > > issue. > > > > I am very familiar with material out-gassing issues in the > context of > > aerospace applications.? Not so for lab usage. Understanding where > > these limits might lie would be very useful.? The perfectionist > in me > > wants to design a T5-class 4 ft LED light fully encased and > > appropriately sealed in a durable glass tube that is both internally > > and externally coated to not pass light above 500 nm. At the same > > time, I do understand that a real solution has to fit a budget > as well > > as technical specifications.? Not sure where that intersection lies > > but I am aware of it. > > > > I introduced a term above that might not be familiar to everyone > here; > > observer metamerism.? This is a by-product of the spectral power > > distributions of light, reflection and the human vision system > > interacting in such a way that two colors that are different might > > appear the same (or, in general, you have trouble discerning colors > > that are easy to see under different conditions).? If you've ever > > tried to determine if a steak is well done under a typical white LED > > light and could not, that's observer metamerism. Mitigation requires > > "filling in" the emitted spectra in areas relevant to the task at > > hand. > > > > This is why I asked myself this question in the red+green LED case. > > Both of these have narrow emission spectra.? Our brains can function > > with this kind of light and, yes, we will see it as yellow.? > However, > > any colors in the portion of the visible spectrum lacking energy > will > > become challenging to deal with.? It's like being color blind.? > Given > > that lithography labs are already built to work with yellow light, I > > find myself wondering how much of a problem, if any, might be > posed by > > observer metamerism in the case of the proposed red+green LED > > solution. > > > > I think that's the basics at this point.? I would appreciate any and > > all feedback, questions and even a good shove in the right > direction. > > > > Thank you, > > > > Martin Euredjian > > AlgoShift, LLC > > Los Angeles, CA > > 661-305-9320 > > > > _______________________________________________ > > labnetwork mailing list > > labnetwork at mtl.mit.edu > > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From paulmaciel at outlook.com Sun Feb 23 19:28:41 2020 From: paulmaciel at outlook.com (Paul Maciel) Date: Mon, 24 Feb 2020 00:28:41 +0000 Subject: [labnetwork] LED Lights for Lithography In-Reply-To: <1131015632.5021469.1582461468161@mail.yahoo.com> References: <44801d9e2f2bf7974f71ab12b61abfe0@algoshift.com> <1131015632.5021469.1582461468161@mail.yahoo.com> Message-ID: Hello Mario, If you looking to learn more about UV LED light sources for resist exposure please take a look at the Idonus SARL web page . Idonus offers UV LED sources for mask aligner retrofits and stand alone, with or without tooling. Drop me an email and I'd be glad to help you find a configuration that works best for your application. Regards, ---Paul Paul Maciel paulmaciel at outlook.com On 2/23/2020 7:37 AM, Mario Portillo wrote: I have to say that I was very interested in responding to your first email, as I am looking for ways to eliminate the use of mercury arc lamps to LEDs.... Anybody out there with the same thought let me know, Regards Sent from Yahoo Mail for iPhone Mario Portillo, hbtusainc at yahoo.com On Sunday, February 23, 2020, 11:40 AM, martin at algoshift.com wrote: Based on a couple of responses it looks like I did a confusing job of explaining what I am working on. I am focusing on lights to illuminate the lab, the room, not to cure PMMA. So, yes, this is about lights on the ceiling. Also, I said "above 500 nm" when I was thinking frequency. I should have said "below 500 nm". The point is, as I understand it today, the goal is to not have much energy in the blue and UV range of emissions. Sorry for the confusion. Thanks, -Martin --- On 2020-02-21 23:55, martin at algoshift.com wrote: > I am currently working on the development of LED-based lights for > lithography applications. I came across this list and was kindly > allowed to join. > > I have a background in high-performance, high accuracy LED-based > applications going back some twenty years. In addition to that I > worked in aerospace engineering, robotics and other work I can't talk > about (most recently, SpaceX). > > At this stage in my new mission I am trying to confirm what I have > learned in order to start developing a few prototypes for testing. > This is what I know and don't know so far: > > - Energy above 500 nm should be below 0.001% > - Operator metamerism doesn't seem to be much of a concern in these > environments (?) > - Outgassing is not desirable (I don't have any kind of a > specification for this) > - No specification on acceptable flicker > - No specification on required efficiency (Lumen/Watt) > - No specification on the amount of light required, either: > - Illuminance (intensity of light on a surface, lux) or, > - Luminance (light energy emitted, lumens) > > Frankly, there really isn't very much data out there. It also seems > that semiconductor companies keep their lithography illumination > requirements somewhat close to the vest. At least this is what I've > come across. I wonder if this is because these kinds of > specifications might reveal process details? Don't know. > > The three main trades I have in front of me at the moment for this > design are: > > - White LEDs with carefully selected film or coating-based filter to > cut blue + UV > - Green and Red LEDs only, no blue; filtration is still needed > - A combination of carefully selected white LEDs with low spectral > power above 500 nm along with, perhaps, green and red to enhance; > filtration still needed > > To clarify, the Green+Red LED option still requires filtration because > green LEDs produce some energy above 500 nm. If I am to take the > 0.001% specification to be true, an optical filter would still be > required. > > White LED's, which, of course, are nothing more than blue LEDs with a > phosphor coating are the most readily available high efficiency units > in the market. Frankly, if high light output at the lowest possible > cost is a requirement it is hard to beat them with a combination of > red and green LEDs. That said, depending on how they are selected, a > significant portion of the spectral power they emit will have to be > converted into heat at a filter or bad things will happen in the lab. > > The third option involves selecting very warm white LEDs that have > almost no blue spike. This means less heating of the filter element > and, likely, longer life. This could be an interesting solution. > > Plastic film based filters degrade over time, particularly if there's > a lot of heating due to having too much energy in the undesirable > portion of the spectrum. This is where thin film deposition > (sputtering?) could exhibit far more favorable band-pass > characteristics as long a longevity. Cost, of course, could be an > issue. > > I am very familiar with material out-gassing issues in the context of > aerospace applications. Not so for lab usage. Understanding where > these limits might lie would be very useful. The perfectionist in me > wants to design a T5-class 4 ft LED light fully encased and > appropriately sealed in a durable glass tube that is both internally > and externally coated to not pass light above 500 nm. At the same > time, I do understand that a real solution has to fit a budget as well > as technical specifications. Not sure where that intersection lies > but I am aware of it. > > I introduced a term above that might not be familiar to everyone here; > observer metamerism. This is a by-product of the spectral power > distributions of light, reflection and the human vision system > interacting in such a way that two colors that are different might > appear the same (or, in general, you have trouble discerning colors > that are easy to see under different conditions). If you've ever > tried to determine if a steak is well done under a typical white LED > light and could not, that's observer metamerism. Mitigation requires > "filling in" the emitted spectra in areas relevant to the task at > hand. > > This is why I asked myself this question in the red+green LED case. > Both of these have narrow emission spectra. Our brains can function > with this kind of light and, yes, we will see it as yellow. However, > any colors in the portion of the visible spectrum lacking energy will > become challenging to deal with. It's like being color blind. Given > that lithography labs are already built to work with yellow light, I > find myself wondering how much of a problem, if any, might be posed by > observer metamerism in the case of the proposed red+green LED > solution. > > I think that's the basics at this point. I would appreciate any and > all feedback, questions and even a good shove in the right direction. > > Thank you, > > Martin Euredjian > AlgoShift, LLC > Los Angeles, CA > 661-305-9320 > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From julia.aebersold at louisville.edu Mon Feb 24 11:56:34 2020 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Mon, 24 Feb 2020 16:56:34 +0000 Subject: [labnetwork] Best locations to sell SEM's Message-ID: We are in the process of purchasing a new SEM and have (2) Zeiss SEMs available for sale. One is a Zeiss Supra 35VP and the other is a Zeiss Evo 40. What contacts and locations do most folks use to sell their SEMs and equipment in general? Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville Shumaker Research Building, Room 233 2210 South Brook Street Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ -------------- next part -------------- An HTML attachment was scrubbed... URL: From ytousimis at tousimis.com Mon Feb 24 16:42:50 2020 From: ytousimis at tousimis.com (Yianni Tousimis) Date: Mon, 24 Feb 2020 16:42:50 -0500 Subject: [labnetwork] Best locations to sell SEM's In-Reply-To: References: Message-ID: <021801d5eb5b$5d744570$185cd050$@tousimis.com> Hi Julia- Take a look at these guys: https://www.tssmicroscopy.com/ Tom Richards and his brother Hobie have been in the EM industry for decades going back to Amray..he knows scopes and is now in the business of buying, refurbishing and selling, etc. Good luck! Best Regards- Yianni Cell # 443.254.5423 Ofc.# 301.881.2450 Autosamdri-931 CPD Microscopy Today Innovation Award Winner ...45 years of Innovation and Quality... www.tousimis.com CONFIDENTIALITY NOTICE: This e-mail transmission, and any documents, files or previous e-mail messages attached to it, may contain confidential information that is legally privileged. If you are not the intended recipient, or a person responsible for delivering it to the intended recipient, you are hereby notified that any disclosure, copying, distribution or use of any of the information contained in or attached to this message is STRICTLY PROHIBITED. If you have received this transmission in error, please immediately notify us by reply e-mail at ytousimis at tousimis.com or by telephone at (301) 881-2450, and destroy the original transmission and its attachments without reading them or saving them to any memory device. Thank you From: labnetwork-bounces at mtl.mit.edu On Behalf Of Aebersold,Julia W. Sent: Monday, February 24, 2020 11:57 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Best locations to sell SEM's We are in the process of purchasing a new SEM and have (2) Zeiss SEMs available for sale. One is a Zeiss Supra 35VP and the other is a Zeiss Evo 40. What contacts and locations do most folks use to sell their SEMs and equipment in general? Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville Shumaker Research Building, Room 233 2210 South Brook Street Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ -------------- next part -------------- An HTML attachment was scrubbed... URL: From kchow10 at gmail.com Mon Feb 24 17:42:58 2020 From: kchow10 at gmail.com (Edmond Chow) Date: Mon, 24 Feb 2020 16:42:58 -0600 Subject: [labnetwork] KLA P7 profiler and Bruker DektakXT DXT-A Message-ID: Hi, We are trying to decide whether to purchase KLA P7 profiler or Bruker Dektak DXT-A profiler. We will appreciate your feedback if you have those systems in your lab. Bruker system seems to slightly cheaper, but they limit to 55mm scan range, I wonder how good is their stitching process if we need to scan 100mm wafer. Thanks. -- Edmond Chow -------------- next part -------------- An HTML attachment was scrubbed... URL: From shimonel at savion.huji.ac.il Tue Feb 25 01:57:07 2020 From: shimonel at savion.huji.ac.il (Shimon Eliav) Date: Tue, 25 Feb 2020 06:57:07 +0000 Subject: [labnetwork] KLA P7 profiler and Bruker DektakXT DXT-A In-Reply-To: References: Message-ID: Hi Edmond, I passed for this purchase process some years ago. Then I decided for Bruker and we are really satisfied: the system is simple to use, robust and have nice automation features. Regarding the stitching: it works just fine, also for long ranges also for 3D topography. Regards, Shimon The Hebrew University of Jerusalem The Unit for Nano Fabrication - UNF From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Edmond Chow Sent: Tuesday, 25 February 2020 0:43 To: Fab Network Subject: [labnetwork] KLA P7 profiler and Bruker DektakXT DXT-A Hi, We are trying to decide whether to purchase KLA P7 profiler or Bruker Dektak DXT-A profiler. We will appreciate your feedback if you have those systems in your lab. Bruker system seems to slightly cheaper, but they limit to 55mm scan range, I wonder how good is their stitching process if we need to scan 100mm wafer. Thanks. -- Edmond Chow -------------- next part -------------- An HTML attachment was scrubbed... URL: From patricns at uw.edu Tue Feb 25 11:01:15 2020 From: patricns at uw.edu (N Shane Patrick) Date: Tue, 25 Feb 2020 08:01:15 -0800 Subject: [labnetwork] KLA P7 profiler and Bruker DektakXT DXT-A In-Reply-To: References: Message-ID: <16771D74-08B5-43B1-8959-1EA8D4769D77@uw.edu> Hi Edmond, We have a ~5 year old Dektak-XT that was bought to support our two other older profilometers. We?ve been pleased with the accuracy and general performance, but the software can be a bit glitchy at times. We?ve also found KLA/Tencor?s software?s automation functions (for scanning repetitive features across a large area) to be easier and more reliable than than Bruker?s. I still personally prefer the Dektak, but it has its drawbacks as with any tool. N. Shane Patrick Manager, Lab Operations and Safety Electron Beam Lithography Washington Nanofabrication Facility (WNF) National Nanotechnology Coordinated Infrastructure (NNCI) University of Washington - NanoES Fluke Hall 129, Box 352143 (206) 221-1045 patricns at uw.edu http://www.wnf.washington.edu/ > On Feb 24, 2020, at 2:42 PM, Edmond Chow wrote: > > Hi, > > We are trying to decide whether to purchase KLA P7 profiler or Bruker Dektak DXT-A profiler. > > We will appreciate your feedback if you have those systems in your lab. > > Bruker system seems to slightly cheaper, but they limit to 55mm scan range, I wonder how good is their stitching process if we need to scan 100mm wafer. > > Thanks. > > -- > Edmond Chow > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From cekendri at mtu.edu Tue Feb 25 11:12:05 2020 From: cekendri at mtu.edu (Chito Kendrick) Date: Tue, 25 Feb 2020 11:12:05 -0500 Subject: [labnetwork] HF compatible container for single wafer dipping Message-ID: Dear, Before I spend a whole lot of time fabricating a container, I do have a plastic welder, I want to see if anyone knows of a company that sells narrow containers with a flat stable bottom for single wafer dipping of wafers. We have a fairly standard wet bench for processing wafers by RCA/HF/solvents. However this means we need to have at least 10L of chemicals to cover 25 4" wafers in a standard carrier if we want to use the bench baths. For single wafers we have flat containers to use less HF, but students have a lot of issues with getting wafers in/out with teflon tweezers and with the extra PPE gloves. We do have holders for single wafers, but with the amount of processing we are currently doing 10L of 5% HF or 6:1 BOE is just a waste for the odd wafer and leaving HF in the bath does lead to it reducing in volume. Therefore, I am looking for a container that is 1"x5"x8" (WxDxH) and has a large base as it will be top heavy being so narrow. This will allow wafer dipping with the holders and removes handling issues. Regards, Chito Kendrick -- Chito Kendrick Ph.D. Managing Director of the Microfabrication Facility Research Assistant Professor Electrical and Computer Engineering Michigan Technological University Room 436 M&M Building 1400 Townsend Dr. Houghton, Michigan 49931-1295 814-308-4255 -------------- next part -------------- An HTML attachment was scrubbed... URL: From bill_flounders at berkeley.edu Tue Feb 25 11:55:20 2020 From: bill_flounders at berkeley.edu (Albert William (Bill) Flounders) Date: Tue, 25 Feb 2020 08:55:20 -0800 Subject: [labnetwork] HF compatible container for single wafer dipping In-Reply-To: References: Message-ID: Take a look here: https://www.shape-master.com/silicon-wafer-dippers or here: https://www.ptfeparts.com/applications/teflon-ptfe-labware/ They offer "horizontal" dippers and baskets that may meet your needs. The big supplier is Entegris. They often have minimum orders. They have vertical dippers; unsure if they have any horizontal products. https://www.entegris.com/shop/en/USD/products/wafer-handling/wafer-processing/labware/Dippers/p/Dippers Custom chucks (vertical) for single sided processing: https://www.idonus.com/activities/products/mems-products/wet-processing-wafer-chucks.html Bill Flounders UC Berkeley On Tue, Feb 25, 2020 at 8:41 AM Chito Kendrick wrote: > Dear, > > Before I spend a whole lot of time fabricating a container, I do have a > plastic welder, I want to see if anyone knows of a company that sells > narrow containers with a flat stable bottom for single wafer dipping of > wafers. > > We have a fairly standard wet bench for processing wafers by > RCA/HF/solvents. However this means we need to have at least 10L of > chemicals to cover 25 4" wafers in a standard carrier if we want to use the > bench baths. For single wafers we have flat containers to use less HF, but > students have a lot of issues with getting wafers in/out with teflon > tweezers and with the extra PPE gloves. We do have holders for single > wafers, but with the amount of processing we are currently doing 10L of 5% > HF or 6:1 BOE is just a waste for the odd wafer and leaving HF in the bath > does lead to it reducing in volume. > > Therefore, I am looking for a container that is 1"x5"x8" (WxDxH) and has a > large base as it will be top heavy being so narrow. This will allow wafer > dipping with the holders and removes handling issues. > > Regards, > > Chito Kendrick > > -- > Chito Kendrick Ph.D. > > Managing Director of the Microfabrication Facility > Research Assistant Professor > Electrical and Computer Engineering > Michigan Technological University > Room 436 M&M Building > 1400 Townsend Dr. > Houghton, Michigan 49931-1295 > > 814-308-4255 > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From rmorrison at draper.com Tue Feb 25 11:58:24 2020 From: rmorrison at draper.com (Morrison, Richard H., Jr) Date: Tue, 25 Feb 2020 16:58:24 +0000 Subject: [labnetwork] HF compatible container for single wafer dipping In-Reply-To: References: Message-ID: <7fdebc9c67694e049811892e2250a499@draper.com> Rick Morrison here from Draper, I would look at Cole-Parmer and VWR they have many different poly and Teflon tanks pre made and ready for sale. https://www.coleparmer.com/p/rectangular-tanks-with-cover-hdpe-and-pp/5697?searchterm=Rectangular%20Tanks%20with%20Cover%2C%20HDPE%20and%20PP https://us.vwr.com/store/product?categoryId=4952954&catName=Rectangular%20Tanks A 4? wafer in a Teflon wand can go into a 1.5L beaker such as below, we do that all the time, saves on chemicals. Beakers at: https://us.vwr.com/store/catalog/product.jsp?product_id=4537528 Single wafer wand used to be sold Entegris We have also just cut a cassette down to only hold 2 wafers and this reduces the size. Rick Richard H. Morrison Principal Member of the Technical Staff Draper 555 Technology Square Cambridge, MA 02139-3573 Work 617-258-3420 Cell 508-930-3461 www.draper.com From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Chito Kendrick Sent: Tuesday, February 25, 2020 11:12 AM To: Fab Network Subject: [labnetwork] HF compatible container for single wafer dipping Dear, Before I spend a whole lot of time fabricating a container, I do have a plastic welder, I want to see if anyone knows of a company that sells narrow containers with a flat stable bottom for single wafer dipping of wafers. We have a fairly standard wet bench for processing wafers by RCA/HF/solvents. However this means we need to have at least 10L of chemicals to cover 25 4" wafers in a standard carrier if we want to use the bench baths. For single wafers we have flat containers to use less HF, but students have a lot of issues with getting wafers in/out with teflon tweezers and with the extra PPE gloves. We do have holders for single wafers, but with the amount of processing we are currently doing 10L of 5% HF or 6:1 BOE is just a waste for the odd wafer and leaving HF in the bath does lead to it reducing in volume. Therefore, I am looking for a container that is 1"x5"x8" (WxDxH) and has a large base as it will be top heavy being so narrow. This will allow wafer dipping with the holders and removes handling issues. Regards, Chito Kendrick -- Chito Kendrick Ph.D. Managing Director of the Microfabrication Facility Research Assistant Professor Electrical and Computer Engineering Michigan Technological University Room 436 M&M Building 1400 Townsend Dr. Houghton, Michigan 49931-1295 814-308-4255 ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: From cekendri at mtu.edu Tue Feb 25 12:09:06 2020 From: cekendri at mtu.edu (Chito Kendrick) Date: Tue, 25 Feb 2020 12:09:06 -0500 Subject: [labnetwork] HF compatible container for single wafer dipping In-Reply-To: <7fdebc9c67694e049811892e2250a499@draper.com> References: <7fdebc9c67694e049811892e2250a499@draper.com> Message-ID: Hi Rick and Bill, I just saw the horizontal dippers. Some reason I never found them before when I was looking. Thank you for your help. Chito Kendrick On Tue, Feb 25, 2020 at 11:58 AM Morrison, Richard H., Jr < rmorrison at draper.com> wrote: > Rick Morrison here from Draper, I would look at Cole-Parmer and VWR they > have many different poly and Teflon tanks pre made and ready for sale. > > > > > > > https://www.coleparmer.com/p/rectangular-tanks-with-cover-hdpe-and-pp/5697?searchterm=Rectangular%20Tanks%20with%20Cover%2C%20HDPE%20and%20PP > > > > > https://us.vwr.com/store/product?categoryId=4952954&catName=Rectangular%20Tanks > > > > A 4? wafer in a Teflon wand can go into a 1.5L beaker such as below, we do > that all the time, saves on chemicals. Beakers at: > > > > https://us.vwr.com/store/catalog/product.jsp?product_id=4537528 > > > > Single wafer wand used to be sold Entegris We have also just cut a > cassette down to only hold 2 wafers and this reduces the size. > > > > > > Rick > > > > > > Richard H. Morrison > > Principal Member of the Technical Staff > > Draper > > 555 Technology Square > > Cambridge, MA > > 02139-3573 > > > > Work 617-258-3420 > > Cell 508-930-3461 > > www.draper.com > > > > > > > > > > *From:* labnetwork-bounces at mtl.mit.edu [mailto: > labnetwork-bounces at mtl.mit.edu] *On Behalf Of *Chito Kendrick > *Sent:* Tuesday, February 25, 2020 11:12 AM > *To:* Fab Network > *Subject:* [labnetwork] HF compatible container for single wafer dipping > > > > Dear, > > > > Before I spend a whole lot of time fabricating a container, I do have a > plastic welder, I want to see if anyone knows of a company that sells > narrow containers with a flat stable bottom for single wafer dipping of > wafers. > > > > We have a fairly standard wet bench for processing wafers by > RCA/HF/solvents. However this means we need to have at least 10L of > chemicals to cover 25 4" wafers in a standard carrier if we want to use the > bench baths. For single wafers we have flat containers to use less HF, but > students have a lot of issues with getting wafers in/out with teflon > tweezers and with the extra PPE gloves. We do have holders for single > wafers, but with the amount of processing we are currently doing 10L of 5% > HF or 6:1 BOE is just a waste for the odd wafer and leaving HF in the bath > does lead to it reducing in volume. > > > > Therefore, I am looking for a container that is 1"x5"x8" (WxDxH) and has a > large base as it will be top heavy being so narrow. This will allow wafer > dipping with the holders and removes handling issues. > > > > Regards, > > > > Chito Kendrick > > > -- > > Chito Kendrick Ph.D. > > Managing Director of the Microfabrication Facility > Research Assistant Professor > Electrical and Computer Engineering > Michigan Technological University > Room 436 M&M Building > 1400 Townsend Dr. > Houghton, Michigan 49931-1295 > > 814-308-4255 > ------------------------------ > Notice: This email and any attachments may contain proprietary (Draper > non-public) and/or export-controlled information of Draper. If you are not > the intended recipient of this email, please immediately notify the sender > by replying to this email and immediately destroy all copies of this email. > ------------------------------ > -- Chito Kendrick Ph.D. Managing Director of the Microfabrication Facility Research Assistant Professor Electrical and Computer Engineering Michigan Technological University Room 436 M&M Building 1400 Townsend Dr. Houghton, Michigan 49931-1295 814-308-4255 -------------- next part -------------- An HTML attachment was scrubbed... URL: From tbritton at criticalsystemsinc.com Tue Feb 25 14:17:11 2020 From: tbritton at criticalsystemsinc.com (Tom Britton) Date: Tue, 25 Feb 2020 19:17:11 +0000 Subject: [labnetwork] FW: HF compatible container for single wafer dipping In-Reply-To: <007601d5ec0d$fb5fd7b0$f21f8710$@spfco.net> References: <807DA18A-8871-43AE-B67F-DCBF74D16D4D@criticalsystemsinc.com> <7859219F820944C79404EE2C46AD697B@BrucePC> <316F6329D4694BB8BF7B5AE26BE24F72@BrucePC> <007601d5ec0d$fb5fd7b0$f21f8710$@spfco.net> Message-ID: Hi Chito, I sent your question to a company that I think highly of and they sent back a quote for this tank. I?m forwarding it on to you as you?re the one needing it. Specialty Plastics manufactures wet benches, tanks, totes and most anything related to plastic manufacturing. They will treat you well. Contact information is attached and is below. Regards, Tom Tom Britton Director of Sales Critical Systems, Inc. Direct: 208.890.1417 Office: 877.572.5515 Skype: tombrittoncsi www.CriticalSystemsInc.com [logo for email signature png] From: cblevins at spfco.net Sent: Tuesday, February 25, 2020 12:01 PM To: Tom Britton Cc: 'Tyree Sibert' ; 'Brian Johnson' ; bbente at spfco.net Subject: RE: [labnetwork] HF compatible container for single wafer dipping Hi Tom, Please see the attached quotation and let me know if there is anything else I can assist with. Thanks, Cody Blevins FAB Manager [cid:image001.png at 01D5EBD3.4BB7A110] 11562 W. President Dr., Boise, ID 83713, USA T: (208) 378-1195 / (800) 347-3602 F: (208) 378-1198 M: (208) 841-1981 E: cblevins at spfco.net W: www.spfco.net CONFIDENTIALITY: This message is intended only for the personal use of the individual(s) named as a recipient. This message may also be protected from disclosure by other laws. If you are not a named recipient, please (a) promptly call (208) 378-1195, (b) do not forward or in any way disclose the contents to anyone, (c) delete this e-mail (and each attachment) and all copies (printed, electronic or other) you have as soon as possible, and (d) do not take any action based on the information contained in this e-mail message or any attachment. From: Chito Kendrick > Date: February 25, 2020 at 9:45:19 AM MST To: Fab Network > Subject: [labnetwork] HF compatible container for single wafer dipping ? Dear, Before I spend a whole lot of time fabricating a container, I do have a plastic welder, I want to see if anyone knows of a company that sells narrow containers with a flat stable bottom for single wafer dipping of wafers. We have a fairly standard wet bench for processing wafers by RCA/HF/solvents. However this means we need to have at least 10L of chemicals to cover 25 4" wafers in a standard carrier if we want to use the bench baths. For single wafers we have flat containers to use less HF, but students have a lot of issues with getting wafers in/out with teflon tweezers and with the extra PPE gloves. We do have holders for single wafers, but with the amount of processing we are currently doing 10L of 5% HF or 6:1 BOE is just a waste for the odd wafer and leaving HF in the bath does lead to it reducing in volume. Therefore, I am looking for a container that is 1"x5"x8" (WxDxH) and has a large base as it will be top heavy being so narrow. This will allow wafer dipping with the holders and removes handling issues. Regards, Chito Kendrick -- Chito Kendrick Ph.D. Managing Director of the Microfabrication Facility Research Assistant Professor Electrical and Computer Engineering Michigan Technological University Room 436 M&M Building 1400 Townsend Dr. Houghton, Michigan 49931-1295 814-308-4255 _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork This email and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. If you have received this email in error please notify the system manager. This message contains confidential information and is intended only for the individual named. If you are not the named addressee you should not disseminate, distribute or copy this e-mail. Please notify the sender immediately by e-mail if you have received this e-mail by mistake and delete this e-mail from your system. If you are not the intended recipient you are notified that disclosing, copying, distributing or taking any action in reliance on the contents of this information is strictly prohibited.'. If the disclaimer can't be applied, attach the message to a new disclaimer message. This email and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. If you have received this email in error please notify the system manager. This message contains confidential information and is intended only for the individual named. If you are not the named addressee you should not disseminate, distribute or copy this e-mail. Please notify the sender immediately by e-mail if you have received this e-mail by mistake and delete this e-mail from your system. If you are not the intended recipient you are notified that disclosing, copying, distributing or taking any action in reliance on the contents of this information is strictly prohibited.'. If the disclaimer can't be applied, attach the message to a new disclaimer message. This email and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. If you have received this email in error please notify the system manager. This message contains confidential information and is intended only for the individual named. If you are not the named addressee you should not disseminate, distribute or copy this e-mail. Please notify the sender immediately by e-mail if you have received this e-mail by mistake and delete this e-mail from your system. If you are not the intended recipient you are notified that disclosing, copying, distributing or taking any action in reliance on the contents of this information is strictly prohibited.'. If the disclaimer can't be applied, attach the message to a new disclaimer message. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 2453 bytes Desc: image001.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image002.png Type: image/png Size: 9501 bytes Desc: image002.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Single 4 Wafer Tank_022520-01CB.pdf Type: application/pdf Size: 119683 bytes Desc: Single 4 Wafer Tank_022520-01CB.pdf URL: From paulmaciel at outlook.com Tue Feb 25 14:46:33 2020 From: paulmaciel at outlook.com (Paul Maciel) Date: Tue, 25 Feb 2020 19:46:33 +0000 Subject: [labnetwork] HF compatible container for single wafer dipping In-Reply-To: References: Message-ID: Hi Chito, Idonus SARL has fabricated similar basins, see the brochure attached. Drop me an email if your interested and I can generate a quotation. Regards and have a good day, ---Paul Paul Maciel Sales and Technical Support paulmaciel at outlook.com On 2/25/2020 11:12 AM, Chito Kendrick wrote: Dear, Before I spend a whole lot of time fabricating a container, I do have a plastic welder, I want to see if anyone knows of a company that sells narrow containers with a flat stable bottom for single wafer dipping of wafers. We have a fairly standard wet bench for processing wafers by RCA/HF/solvents. However this means we need to have at least 10L of chemicals to cover 25 4" wafers in a standard carrier if we want to use the bench baths. For single wafers we have flat containers to use less HF, but students have a lot of issues with getting wafers in/out with teflon tweezers and with the extra PPE gloves. We do have holders for single wafers, but with the amount of processing we are currently doing 10L of 5% HF or 6:1 BOE is just a waste for the odd wafer and leaving HF in the bath does lead to it reducing in volume. Therefore, I am looking for a container that is 1"x5"x8" (WxDxH) and has a large base as it will be top heavy being so narrow. This will allow wafer dipping with the holders and removes handling issues. Regards, Chito Kendrick -- Chito Kendrick Ph.D. Managing Director of the Microfabrication Facility Research Assistant Professor Electrical and Computer Engineering Michigan Technological University Room 436 M&M Building 1400 Townsend Dr. Houghton, Michigan 49931-1295 814-308-4255 _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: wet_process_basin_rev0_130321.pdf Type: application/pdf Size: 642306 bytes Desc: wet_process_basin_rev0_130321.pdf URL: From hbtusainc at yahoo.com Wed Feb 26 01:20:26 2020 From: hbtusainc at yahoo.com (Mario Portillo) Date: Wed, 26 Feb 2020 06:20:26 +0000 (UTC) Subject: [labnetwork] LED Lights for Lithography In-Reply-To: References: <44801d9e2f2bf7974f71ab12b61abfe0@algoshift.com> <1131015632.5021469.1582461468161@mail.yahoo.com> Message-ID: <1211225425.433667.1582698026827@mail.yahoo.com> Paul, thank you for your response, I am familiar with the LED?s used for resist exposure. ?FYI, I have been in photolithography 45 years now, 35 independently as Hbtusainc, I am very interested into switching 9 microlithography systems from using Ushio 350 watts short arc lamps to LEDs, 405nm(h-line) and 436nm(g-line) the light sources I use were?manufacture by Tamarack many moons ago, they can be reconfigured with the LED upgrade, ir has been done before on these systems . What added info I can give you to look into this at your end. Regards? Sent from Yahoo Mail for iPhone Mario Portillo, hbtusainc at yahoo.com On Monday, February 24, 2020, 8:28 AM, Paul Maciel wrote: Hello Mario, If you looking to learn more about UV LED light sources for resist exposure please take a look at the Idonus SARL web page. Idonus offers UV LED sources for mask aligner retrofits and stand alone, with or without tooling. Drop me an email and I'd be glad to help you find a configuration that works best for your application. Regards, ---Paul Paul Maciel paulmaciel at outlook.com On 2/23/2020 7:37 AM, Mario Portillo wrote: I have to say that I was very interested in responding to your first email, as I am looking for ways to eliminate the use of mercury arc lamps to LEDs.... Anybody out there with the same thought let me know, Regards? Sent from Yahoo Mail for iPhone Mario Portillo, hbtusainc at yahoo.com On Sunday, February 23, 2020, 11:40 AM, martin at algoshift.com wrote: Based on a couple of responses it looks like I did a confusing job of explaining what I am working on. I am focusing on lights to illuminate the lab, the room, not to cure PMMA.? So, yes, this is about lights on the ceiling. Also, I said "above 500 nm" when I was thinking frequency.? I should have said "below 500 nm".? The point is, as I understand it today, the goal is to not have much energy in the blue and UV range of emissions. Sorry for the confusion. Thanks, -Martin --- On 2020-02-21 23:55, martin at algoshift.com wrote: > I am currently working on the development of LED-based lights for > lithography applications.? I came across this list and was kindly > allowed to join. > > I have a background in high-performance, high accuracy LED-based > applications going back some twenty years.? In addition to that I > worked in aerospace engineering, robotics and other work I can't talk > about (most recently, SpaceX). > > At this stage in my new mission I am trying to confirm what I have > learned in order to start developing a few prototypes for testing. > This is what I know and don't know so far: > > - Energy above 500 nm should be below 0.001% > - Operator metamerism doesn't seem to be much of a concern in these > environments (?) > - Outgassing is not desirable (I don't have any kind of a > specification for this) > - No specification on acceptable flicker > - No specification on required efficiency (Lumen/Watt) > - No specification on the amount of light required, either: >? ? - Illuminance (intensity of light on a surface, lux) or, >? ? - Luminance (light energy emitted, lumens) > > Frankly, there really isn't very much data out there.? It also seems > that semiconductor companies keep their lithography illumination > requirements somewhat close to the vest.? At least this is what I've > come across.? I wonder if this is because these kinds of > specifications might reveal process details?? Don't know. > > The three main trades I have in front of me at the moment for this > design are: > > - White LEDs with carefully selected film or coating-based filter to > cut blue + UV > - Green and Red LEDs only, no blue; filtration is still needed > - A combination of carefully selected white LEDs with low spectral > power above 500 nm along with, perhaps, green and red to enhance; > filtration still needed > > To clarify, the Green+Red LED option still requires filtration because > green LEDs produce some energy above 500 nm.? If I am to take the > 0.001% specification to be true, an optical filter would still be > required. > > White LED's, which, of course, are nothing more than blue LEDs with a > phosphor coating are the most readily available high efficiency units > in the market.? Frankly, if high light output at the lowest possible > cost is a requirement it is hard to beat them with a combination of > red and green LEDs.? That said, depending on how they are selected, a > significant portion of the spectral power they emit will have to be > converted into heat at a filter or bad things will happen in the lab. > > The third option involves selecting very warm white LEDs that have > almost no blue spike.? This means less heating of the filter element > and, likely, longer life.? This could be an interesting solution. > > Plastic film based filters degrade over time, particularly if there's > a lot of heating due to having too much energy in the undesirable > portion of the spectrum.? This is where thin film deposition > (sputtering?) could exhibit far more favorable band-pass > characteristics as long a longevity.? Cost, of course, could be an > issue. > > I am very familiar with material out-gassing issues in the context of > aerospace applications.? Not so for lab usage.? Understanding where > these limits might lie would be very useful.? The perfectionist in me > wants to design a T5-class 4 ft LED light fully encased and > appropriately sealed in a durable glass tube that is both internally > and externally coated to not pass light above 500 nm.? At the same > time, I do understand that a real solution has to fit a budget as well > as technical specifications.? Not sure where that intersection lies > but I am aware of it. > > I introduced a term above that might not be familiar to everyone here; > observer metamerism.? This is a by-product of the spectral power > distributions of light, reflection and the human vision system > interacting in such a way that two colors that are different might > appear the same (or, in general, you have trouble discerning colors > that are easy to see under different conditions).? If you've ever > tried to determine if a steak is well done under a typical white LED > light and could not, that's observer metamerism.? Mitigation requires > "filling in" the emitted spectra in areas relevant to the task at > hand. > > This is why I asked myself this question in the red+green LED case. > Both of these have narrow emission spectra.? Our brains can function > with this kind of light and, yes, we will see it as yellow.? However, > any colors in the portion of the visible spectrum lacking energy will > become challenging to deal with.? It's like being color blind.? Given > that lithography labs are already built to work with yellow light, I > find myself wondering how much of a problem, if any, might be posed by > observer metamerism in the case of the proposed red+green LED > solution. > > I think that's the basics at this point.? I would appreciate any and > all feedback, questions and even a good shove in the right direction. > > Thank you, > > Martin Euredjian > AlgoShift, LLC > Los Angeles, CA > 661-305-9320 > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From ana.sanchez at louisville.edu Wed Feb 26 10:18:10 2020 From: ana.sanchez at louisville.edu (KY Multiscale) Date: Wed, 26 Feb 2020 10:18:10 -0500 (EST) Subject: [labnetwork] Call for Abstracts - 2020 KY NANO + AM Symposium Message-ID: <1133967599234.1131404001080.2098960567.0.321018JL.2002@scheduler.constantcontact.com> Submit your Abstract Today! Now Accepting Abstracts! POSTER PRESENTATIONS * SPEAKERS * FACILITY TOURS * NETWORKING Submit your Abstract Today Visit the Symposium Website for Instructions www.nanoamsymposium.com The KY Nano+AM Symposium is an annual event that brings together researchers and industry in advanced manufacturing. We converge to discuss additive manufacturing and micro/nanotechnology -- what's new and what's next. Nano/AM Symposium is open to all scientists, engineers, and students from a variety of disciplines including microtechnology, nanotechnology, 3D printing, additive manufacturing, healthcare, energy, advanced materials, MEMS, biotechnology, commercial products, defense, and nano-education. REGISTER NOW! KY Multiscale | 2210 South Brook St, Shumaker Research Bldg , Louisville, KY 40208 www.kymultiscale.net Unsubscribe labnetwork at mtl.mit.edu Update Profile | About Constant Contact Sent by ana.sanchez at louisville.edu in collaboration with Try email marketing for free today! -------------- next part -------------- An HTML attachment was scrubbed... URL: From Thomas_Ferraguto at uml.edu Wed Feb 26 08:03:13 2020 From: Thomas_Ferraguto at uml.edu (Ferraguto, Thomas S) Date: Wed, 26 Feb 2020 13:03:13 +0000 Subject: [labnetwork] PCBA component rebuild... Message-ID: <0086518f3fbc4e09855b4de69f839204@uml.edu> Colleagues, We had a control board for our Oxford Plasma Lab 80 get wet and fail. Oxford is doing their best to source a new board for us , but they've been having trouble with their OEM. Does anyone have a vendor that could do a thorough component check and replacement of bad components on the board? Thank you... Tom Thomas S. Ferraguto Saab ETIC Nanofabrication Laboratory Director Saab ETIC Building Director 1 University Avenue Lowell MA 01854 Mobile 617-755-0910 Land 978-934-1809 Fax 978-934-1014 -------------- next part -------------- An HTML attachment was scrubbed... URL: From saba.sadeghi at uwaterloo.ca Wed Feb 26 13:23:11 2020 From: saba.sadeghi at uwaterloo.ca (Saba Sadeghi) Date: Wed, 26 Feb 2020 18:23:11 +0000 Subject: [labnetwork] liquefaction of O2 on MBE walls cooled with LN2 Message-ID: <2875bde4c71d416390100c78c9308d91@uwaterloo.ca> Dear all, I have a question about MBE systems that are used for metal-oxide growth. In our MBE system we use oxygen flow rate of 0.3 - 0.4 sccm, which leaves the chamber pressure at about 1E-5 Torr. The chamber incorporated LN2 cooling shrouds. My question is that do you think that there is any concern regrading liquefaction of oxygen on the chamber's wall, that might end up dripping down the walls, evaporating and causing a pressure burst. I have not encountered the problem yet, but I was wondering if over time, and for long growth time this might become an issue. Has anyone encountered this issue before? Any input is much appreciated, Best, -- Saba Sadeghi, PhD Quantum Devices Fabrication Scientist Institute for Quantum Computing, University of Waterloo Email: saba.sadeghi at uwaterloo.ca -------------- next part -------------- An HTML attachment was scrubbed... URL: From spaolini at cns.fas.harvard.edu Wed Feb 26 15:08:12 2020 From: spaolini at cns.fas.harvard.edu (Paolini, Steven) Date: Wed, 26 Feb 2020 20:08:12 +0000 Subject: [labnetwork] PCBA component rebuild... In-Reply-To: <0086518f3fbc4e09855b4de69f839204@uml.edu> References: <0086518f3fbc4e09855b4de69f839204@uml.edu> Message-ID: Tom, I have used Foss industries over the years to troubleshoot board level components and they have bailed me out many times. https://www.fossind.com/ Equipment Dood Steve Paolini Principal Equipment Engineer Harvard University Center for Nanoscale Systems 11 Oxford St. Cambridge, MA 02138 617- 496- 9816 spaolini at cns.fas.harvard.edu www.cns.fas.harvard.edu From: labnetwork-bounces at mtl.mit.edu On Behalf Of Ferraguto, Thomas S Sent: Wednesday, February 26, 2020 8:03 AM To: 'labnetwork at mtl.mit.edu' Subject: [labnetwork] PCBA component rebuild... Colleagues, We had a control board for our Oxford Plasma Lab 80 get wet and fail. Oxford is doing their best to source a new board for us , but they've been having trouble with their OEM. Does anyone have a vendor that could do a thorough component check and replacement of bad components on the board? Thank you... Tom Thomas S. Ferraguto Saab ETIC Nanofabrication Laboratory Director Saab ETIC Building Director 1 University Avenue Lowell MA 01854 Mobile 617-755-0910 Land 978-934-1809 Fax 978-934-1014 -------------- next part -------------- An HTML attachment was scrubbed... URL: From bgila at ufl.edu Wed Feb 26 16:51:56 2020 From: bgila at ufl.edu (Gila,Brent P) Date: Wed, 26 Feb 2020 16:51:56 -0500 Subject: [labnetwork] liquefaction of O2 on MBE walls cooled with LN2 In-Reply-To: <2875bde4c71d416390100c78c9308d91@uwaterloo.ca> References: <2875bde4c71d416390100c78c9308d91@uwaterloo.ca> Message-ID: Hello Saba, I have done a lot of oxide MBE growth using RF O2 plasma (similar flow rates and pressures as you have listed) and have never had any issue with liquid O2 in the chamber.? We did quick regens of the cryo pumps after long runs (warm the pump up to 125K while pumping on it with a turbo) then cool it back down.? This removed all the N2 and O2 from the pump.? As with any gas based MBE system, you want to have a fail safe pressure relief valve somewhere in the vacuum side just in case the power fails or the pumps goes out while you are warming up the cryo panels.? I have had a lot of gas come off the panels during the warm up process, but nothing that created a pressure spike. If you have a mass spec on the chamber, record the N2 and O2 spectra during the warm up cycle and see how much evolves. Best Regards, Brent -- Brent P. Gila, PhD. Director of the Nanoscale Research Facility University of Florida 1041 Center Drive Gainesville, Florida 32611 Tel:352-273-2245, Fax:352-846-2877 email: bgila at ufl.edu On 2/26/2020 1:23 PM, Saba Sadeghi wrote: > *[External Email]* > > Dear all, > > > I have a question about MBE systems?that are used for?metal-oxide growth. > > In our MBE system we use?oxygen flow rate?of 0.3?-?0.4?sccm, > which?leaves the chamber pressure?at about?1E-5 Torr. > > The chamber incorporated?LN2 cooling shrouds.? My question is that do > you think that?there is?any concern regrading liquefaction of > oxygen?on the chamber's wall, that might end up?dripping down the > walls,?evaporating and?causing a pressure burst. > > > I have not encountered?the problem yet, but I was wondering if over > time, and for long growth time this might become an issue.?Has anyone > encountered this?issue before? > > > Any input is much appreciated, > > > Best, > > -- > > /Saba Sadeghi, PhD/ > /Quantum Devices Fabrication Scientist/ > /Institute for Quantum Computing, University of Waterloo/ > /Email: //saba.sadeghi at uwaterloo.ca / > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://urldefense.proofpoint.com/v2/url?u=https-3A__mtl.mit.edu_mailman_listinfo.cgi_labnetwork&d=DwICAg&c=sJ6xIWYx-zLMB3EPkvcnVg&r=gl_2fLZA_-_JfH_dOmx7ug&m=N4fIASMo5bjmKte1gIZ9_wY341LyC_xPRaLUXkSRI4s&s=onZNPpDgly9xtvLUQTFQBUWcRFpYKXiq8QKwh1MCyEI&e= -------------- next part -------------- An HTML attachment was scrubbed... URL: From bob.henderson at etchedintimeinc.com Thu Feb 27 12:15:48 2020 From: bob.henderson at etchedintimeinc.com (bob.henderson at etchedintimeinc.com) Date: Thu, 27 Feb 2020 10:15:48 -0700 Subject: [labnetwork] SPTS DRIE Question Message-ID: <000201d5ed91$8e5f0390$ab1d0ab0$@etchedintimeinc.com> I know a number of you have SPTS DRIE systems and I would like to ask what hardware configuration is necessary to prevent undercut (Footing) at the sacrificial stop layer at completion of etch. I have been told that it requires a different frequency generator than 13.56 MHz used for the bulk etch. Do the newer tools also have some method of endpoint on the stop layer or is it just a timed etch? Your help is appreciated Bob Henderson Etched In Time, Inc 941 S. Park Lane Tempe, Arizona 85281 Phone: 602-206-6154 -------------- next part -------------- An HTML attachment was scrubbed... URL: From lino.eugene at uwaterloo.ca Fri Feb 28 08:53:49 2020 From: lino.eugene at uwaterloo.ca (Lino Eugene) Date: Fri, 28 Feb 2020 13:53:49 +0000 Subject: [labnetwork] Exposure control for flake exfoliation Message-ID: <2cbe1c3abc414073ac5efcbd01c44ece@uwaterloo.ca> Dear all, We have users who want to exfoliate flakes on substrate in our cleanroom. These flakes are attached to a Scoth tape. I am wondering how you deal with this transfer in your fab, especially with hazardous materials like tellurides. Do you allow this process in your fab? If so, is it done under a fume hood or in a glove box? Best, Lino Eugene, P.Eng., Ph.D., Micro/nanofabrication process engineer Quantum-Nano Fabrication and Characterization Facility QNC 1611 University of Waterloo 200 University Avenue West Waterloo, ON, Canada N2L 3G1 Ph: +1 519-888-4567 #37788 Cell: +1 226-929-1685 Website: https://fab.qnc.uwaterloo.ca/ -------------- next part -------------- An HTML attachment was scrubbed... URL: From jshepar at purdue.edu Fri Feb 28 14:30:38 2020 From: jshepar at purdue.edu (Shepard, Jeremiah J) Date: Fri, 28 Feb 2020 19:30:38 +0000 Subject: [labnetwork] SPTS DRIE Question In-Reply-To: <000201d5ed91$8e5f0390$ab1d0ab0$@etchedintimeinc.com> References: <000201d5ed91$8e5f0390$ab1d0ab0$@etchedintimeinc.com> Message-ID: Page 38 of the presentation linked below discusses the issue you are having I think. https://www.purdue.edu/discoverypark/birck/files/Plasma_RIE_Etching_Fundamentals_and_Applications.pdf Jerry Shepard Purdue University Birck Nanotechnology Center From: labnetwork-bounces at mtl.mit.edu On Behalf Of bob.henderson at etchedintimeinc.com Sent: Thursday, February 27, 2020 12:16 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] SPTS DRIE Question I know a number of you have SPTS DRIE systems and I would like to ask what hardware configuration is necessary to prevent undercut (Footing) at the sacrificial stop layer at completion of etch. I have been told that it requires a different frequency generator than 13.56 MHz used for the bulk etch. Do the newer tools also have some method of endpoint on the stop layer or is it just a timed etch? Your help is appreciated Bob Henderson Etched In Time, Inc 941 S. Park Lane Tempe, Arizona 85281 Phone: 602-206-6154 -------------- next part -------------- An HTML attachment was scrubbed... URL: From Greg.Hollingshead at spts.com Fri Feb 28 15:52:14 2020 From: Greg.Hollingshead at spts.com (Greg Hollingshead) Date: Fri, 28 Feb 2020 20:52:14 +0000 Subject: [labnetwork] SPTS Technologies Message-ID: Hello Dr. Michael Khbeis and Bob Henderson; We can usually control undercutting (footing) at a stop layer and/or provide endpoint on a stop layer. However, not knowing the stop layer material or the system you are using it is difficult to advise further. If you are using a legacy system this may or may not be possible. Can you give Steve and I more information on the etch process? Depths, feature sizes, stop layer material? Also what model of DRIE system from SPTS is it? Regards, From: mtkhbeis at gmail.com > Sent: Thursday, February 27, 2020 10:42 PM To: Mick Krieg > Subject: Fwd: [labnetwork] SPTS DRIE Question FYI Dr. Michael Khbeis (C) 443.254.5192 Begin forwarded message: From: bob.henderson at etchedintimeinc.com Date: February 27, 2020 at 1:05:26 PM PST To: labnetwork at mtl.mit.edu Subject: [labnetwork] SPTS DRIE Question ? I know a number of you have SPTS DRIE systems and I would like to ask what hardware configuration is necessary to prevent undercut (Footing) at the sacrificial stop layer at completion of etch. I have been told that it requires a different frequency generator than 13.56 MHz used for the bulk etch. Do the newer tools also have some method of endpoint on the stop layer or is it just a timed etch? Your help is appreciated Bob Henderson Etched In Time, Inc 941 S. Park Lane Tempe, Arizona 85281 Phone: 602-206-6154 _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork Greg Hollingshead, Southwestern Regional Sales Manager SPTS Technologies Ltd, A KLA Company M. +1 (972) 342 9722 (Austin TX) spts.com -------------- next part -------------- An HTML attachment was scrubbed... URL: From Steve.Vargo at spts.com Fri Feb 28 16:21:16 2020 From: Steve.Vargo at spts.com (Steve Vargo) Date: Fri, 28 Feb 2020 21:21:16 +0000 Subject: [labnetwork] SPTS Technologies In-Reply-To: References: Message-ID: Hi All, The key to controlling the footing (also called notching, this is the sidewall attack seen on insulating stop layers) is using pulsed bias power. This can be done with either HF or LF bias power operation, as long as the bias generator can apply it in a controllable and pulsed mode operation. On newer SPTS DRIE etch modules (Rapier or DSi-v) this is done with either HF (13.56 MHz) or LF (380 kHz) pulsing with recipe controlled setpoints for the pulsing ON time and pulsing OFF time. In most applications the use of HF pulsed bias power is the default operation but in some unique applications the use of LF pulsed bias power yields better results. Our default offering on new DRIE etch modules uses HF bias power but LF bias power is an optional upgrade should it be needed. If you let me know model or serial no. of the SPTS system in question I can advise further on what might be best for notch control. And as Greg mentioned, the use of endpoint control for monitoring the actual Si etch will enable the best path for minimal notch size. Our newer DRIE modules utilize our Claritas OES endpoint system which is class-leading in terms of operations for all applications. This monitors the Si etch process and can be setup to change the DRIE recipe conditions based on Si etch feedback. This enable process time control as well as soft-landing conditions on etch stop layers. Hope that helps. Regards, Steve Stephen Vargo, Ph.D., Senior Global Applications Manager SPTS Technologies, Inc., A KLA Company T. | M. +1 (626) 233-0687 spts.com From: Greg Hollingshead Sent: Friday, February 28, 2020 12:52 PM To: mtkhbeis at gmail.com; labnetwork at mtl.mit.edu; bob.henderson at etchedintimeinc.com Cc: Steve Vargo Subject: SPTS Technologies Hello Dr. Michael Khbeis and Bob Henderson; We can usually control undercutting (footing) at a stop layer and/or provide endpoint on a stop layer. However, not knowing the stop layer material or the system you are using it is difficult to advise further. If you are using a legacy system this may or may not be possible. Can you give Steve and I more information on the etch process? Depths, feature sizes, stop layer material? Also what model of DRIE system from SPTS is it? Regards, From: mtkhbeis at gmail.com > Sent: Thursday, February 27, 2020 10:42 PM To: Mick Krieg > Subject: Fwd: [labnetwork] SPTS DRIE Question FYI Dr. Michael Khbeis (C) 443.254.5192 Begin forwarded message: From: bob.henderson at etchedintimeinc.com Date: February 27, 2020 at 1:05:26 PM PST To: labnetwork at mtl.mit.edu Subject: [labnetwork] SPTS DRIE Question ? I know a number of you have SPTS DRIE systems and I would like to ask what hardware configuration is necessary to prevent undercut (Footing) at the sacrificial stop layer at completion of etch. I have been told that it requires a different frequency generator than 13.56 MHz used for the bulk etch. Do the newer tools also have some method of endpoint on the stop layer or is it just a timed etch? Your help is appreciated Bob Henderson Etched In Time, Inc 941 S. Park Lane Tempe, Arizona 85281 Phone: 602-206-6154 _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork Greg Hollingshead, Southwestern Regional Sales Manager SPTS Technologies Ltd, A KLA Company M. +1 (972) 342 9722 (Austin TX) spts.com -------------- next part -------------- An HTML attachment was scrubbed... URL: