From julia.aebersold at louisville.edu  Thu Jan  2 10:41:18 2020
From: julia.aebersold at louisville.edu (Aebersold,Julia W.)
Date: Thu, 2 Jan 2020 15:41:18 +0000
Subject: [labnetwork] Flood Cleanup
In-Reply-To: <334FC05B-BF7C-42CF-A92A-E4DCF6C72A13@verizon.net>
References: <273272b205834c4db395632d6881ea8b@engr.ucr.edu>
 <334FC05B-BF7C-42CF-A92A-E4DCF6C72A13@verizon.net>
Message-ID: <DM6PR03MB4123DDAA7501B7A3C98D2F8B86200@DM6PR03MB4123.namprd03.prod.outlook.com>

Servpro is the same outfit our University has used for major flooding, too.

Cheers!

Julia Aebersold, Ph.D.
Manager, Micro/Nano Technology Center
University of Louisville
Shumaker Research Building, Room 233
2210 South Brook Street
Louisville, KY  40292
(502) 852-1572

http://louisville.edu/micronano/

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Jeff Hawks
Sent: Friday, December 27, 2019 7:56 PM
To: Mark Heiden <mheiden at engr.ucr.edu>
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Flood Cleanup

Hi Mark

Happy new year

You might want to try Servpro.

Best regards,

Jeff Hawks

Sent from my iPhone

On Dec 27, 2019, at 1:14 PM, Mark Heiden <mheiden at engr.ucr.edu<mailto:mheiden at engr.ucr.edu>> wrote:
Happy Holidays,
Does anyone have experience with cleaning up a flood of water and mud in their Cleanroom?
We had a major event from a water line up the street that flooded water and mud throughout our Cleanbays.
Once the water is removed and dried, the mud will become dirt and ultimately dust which is of course disastrous.
Is there a company that is experienced at de-contaminating this level of mess that can be hired?
We are in Southern California.

Thanks in advance,


Mark Heiden
NanoFab Cleanroom Manager
University of California, Riverside
951-827-2551
https://nanofabucr.edu/<https://nam03.safelinks.protection.outlook.com/?url=https%3A%2F%2Fnanofab.ucr.edu%2F&data=02%7C01%7Cjulia.aebersold%40louisville.edu%7Cdae5c98141ee486f6eec08d78bb69b64%7Cdd246e4a54344e158ae391ad9797b209%7C0%7C0%7C637131488729447697&sdata=kXEjZKfw9SrZPHYSJWR2r09D9NozJr03MojAVwhayBg%3D&reserved=0>


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork<https://nam03.safelinks.protection.outlook.com/?url=https%3A%2F%2Fmtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork&data=02%7C01%7Cjulia.aebersold%40louisville.edu%7Cdae5c98141ee486f6eec08d78bb69b64%7Cdd246e4a54344e158ae391ad9797b209%7C0%7C0%7C637131488729457689&sdata=phmQ5oZB%2F%2FvpC5A7FYtdoS2Xls9iZJymcHo296P5Fs4%3D&reserved=0>
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From mheiden at engr.ucr.edu  Thu Jan  2 12:49:37 2020
From: mheiden at engr.ucr.edu (Mark Heiden)
Date: Thu, 2 Jan 2020 17:49:37 +0000
Subject: [labnetwork] Flood Cleanup
In-Reply-To: <DM6PR03MB4123DDAA7501B7A3C98D2F8B86200@DM6PR03MB4123.namprd03.prod.outlook.com>
References: <273272b205834c4db395632d6881ea8b@engr.ucr.edu>
 <334FC05B-BF7C-42CF-A92A-E4DCF6C72A13@verizon.net>
 <DM6PR03MB4123DDAA7501B7A3C98D2F8B86200@DM6PR03MB4123.namprd03.prod.outlook.com>
Message-ID: <9e8702ea5b4648d494f4ba8df214f461@engr.ucr.edu>

Thanks to all that have provided input and suggestions.
The campus has contracted Belfor property restoration who has Cleanroom and surgical suite expertise. They have begun the process with good progress already.

Best Regards,


Mark Heiden
NanoFab Cleanroom Manager
University of California, Riverside
951-827-2551
https://nanofab.ucr.edu/



From: Aebersold,Julia W. <julia.aebersold at louisville.edu>
Sent: Thursday, January 02, 2020 7:41 AM
To: labnetwork at mtl.mit.edu
Cc: Mark Heiden <mheiden at engr.ucr.edu>; Jeff Hawks <jeffhawks at verizon.net>
Subject: RE: [labnetwork] Flood Cleanup

Servpro is the same outfit our University has used for major flooding, too.

Cheers!

Julia Aebersold, Ph.D.
Manager, Micro/Nano Technology Center
University of Louisville
Shumaker Research Building, Room 233
2210 South Brook Street
Louisville, KY  40292
(502) 852-1572

http://louisville.edu/micronano/

From: labnetwork-bounces at mtl.mit.edu<mailto:labnetwork-bounces at mtl.mit.edu> [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Jeff Hawks
Sent: Friday, December 27, 2019 7:56 PM
To: Mark Heiden <mheiden at engr.ucr.edu<mailto:mheiden at engr.ucr.edu>>
Cc: labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Flood Cleanup

Hi Mark

Happy new year

You might want to try Servpro.

Best regards,

Jeff Hawks

Sent from my iPhone

On Dec 27, 2019, at 1:14 PM, Mark Heiden <mheiden at engr.ucr.edu<mailto:mheiden at engr.ucr.edu>> wrote:
Happy Holidays,
Does anyone have experience with cleaning up a flood of water and mud in their Cleanroom?
We had a major event from a water line up the street that flooded water and mud throughout our Cleanbays.
Once the water is removed and dried, the mud will become dirt and ultimately dust which is of course disastrous.
Is there a company that is experienced at de-contaminating this level of mess that can be hired?
We are in Southern California.

Thanks in advance,


Mark Heiden
NanoFab Cleanroom Manager
University of California, Riverside
951-827-2551
https://nanofabucr.edu/<https://nam03.safelinks.protection.outlook.com/?url=https%3A%2F%2Fnanofab.ucr.edu%2F&data=02%7C01%7Cjulia.aebersold%40louisville.edu%7Cdae5c98141ee486f6eec08d78bb69b64%7Cdd246e4a54344e158ae391ad9797b209%7C0%7C0%7C637131488729447697&sdata=kXEjZKfw9SrZPHYSJWR2r09D9NozJr03MojAVwhayBg%3D&reserved=0>


_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork<https://nam03.safelinks.protection.outlook.com/?url=https%3A%2F%2Fmtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork&data=02%7C01%7Cjulia.aebersold%40louisville.edu%7Cdae5c98141ee486f6eec08d78bb69b64%7Cdd246e4a54344e158ae391ad9797b209%7C0%7C0%7C637131488729457689&sdata=phmQ5oZB%2F%2FvpC5A7FYtdoS2Xls9iZJymcHo296P5Fs4%3D&reserved=0>
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From cschnitzer at stonehill.edu  Fri Jan  3 16:46:30 2020
From: cschnitzer at stonehill.edu (Schnitzer, Cheryl)
Date: Fri, 3 Jan 2020 21:46:30 +0000
Subject: [labnetwork] Post for the lab network, please
Message-ID: <HE1PR0102MB316300BBB1709161C917A1F9C7230@HE1PR0102MB3163.eurprd01.prod.exchangelabs.com>

Opening: Photonics Lab Manager Position, Stonehill College

Please help increase our applicant pool by inviting and circulating the following information for anyone who may be interested in this position. The deadline for the first round of applications is Wednesday, January 15th. This information is available at Indeed.com as well.

Working at Stonehill College offers an opportunity to work in a brand new, state-of-the-art Lab for Education and Application Prototypes (LEAP) photonics lab with faculty, students, staff, and industry partners. This LEAP focuses on photonics materials testing and characterization and high-speed testing for photonics devices and systems, complementing the other LEAPs in Massachusetts at MIT, WPI/QCC, and BSU. The LEAP network is funded by the Commonwealth of Massachusetts to support AIM Photonics.

The applicant will join an interdisciplinary program housed in the Physics and Astronomy Department. We have a wide range of disciplinary expertise, ranging from astrophysics to geophysics, quantum field theory, theoretical and experimental optics, engineering photonics and physical chemistry. We value independence and self-reliance, teamwork and collegiality. We are looking for an energetic person who can bring their contribution to further academic growth of the department and the photonics program.

The Photonics program at Stonehill College invites applicants for a lab manager position, applications will close on January 15, or as soon as the position is filled.

Essential Duties and Responsibilities

The Lab Manager will report to the Program Director in Photonics. The job responsibilities include


  *   Setting up equipment in the new Photonics lab.
  *   Providing equipment operation training for students, researchers or industry partners.
  *   Providing technical support for researchers and their projects.
  *   Practicing safe working conditions and communicating in written and oral forms.
  *   Maintaining laboratory equipment performance by establishing quality standards; developing operations, quality, and troubleshooting procedures; ensuring workers? compliance; certifying instrument performance; arranging equipment replacement, service, and repair.
  *   Developing new tests, methods, instrumental programs, and procedures
  *   Investigating alternative methods and new projects; developing and performing parallel testing; monitoring progress.
  *   Maintaining professional and technical knowledge by attending educational workshops; reviewing professional publications; establishing personal networks; participating in professional societies.
  *   Collaborating with photonics team in the development of grant proposals.

Education and/or Experience

  *   Earned Master?s degrees in Physics/Optics/Photonics, or closely related disciplines, and required to have a record of quality scholarship.
  *   Possess organizational skills, attention to detail, and the personality to train others.
  *   Have laser and optics/photonics lab experience and motivation to learn new skills and techniques

Preferred Qualifications Knowledge, Skills, and Abilities

A working knowledge of some instruments such as FTIR, Raman, XRD, OSA, LCA, AWG, Oscilloscope, etc, will be a plus.

Physical Demands Work Environment Licenses/Certifications Competencies

Posting Detail Information

Special Instructions to Applicants

Please apply electronically, including a cover letter, a research statement, a resume and three references. You can additionally contact us directly at the following address:

Dr. Ruby Gu, Chair of the search committee.
320 Washington St, N. Easton, MA, 02357
ggu at stonehill.edu<mailto:ggu at stonehill.edu>

Stonehill College embraces diversity and inclusion in its teaching, learning, living, and working. Stonehill values a diversity of persons, opinions, and cultural and religious perspectives. Women and minorities are strongly encouraged to apply to this position.
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From dcchrist at wisc.edu  Mon Jan  6 08:23:38 2020
From: dcchrist at wisc.edu (Daniel Christensen)
Date: Mon, 6 Jan 2020 13:23:38 +0000
Subject: [labnetwork] Cleanroom Staff Position open at Univ of Wisconsin
Message-ID: <BN7PR06MB403645407D3347A92FE5F290BE3C0@BN7PR06MB4036.namprd06.prod.outlook.com>

Cleanroom Staff Position open at Univ of Wisconsin
Only 10 days left to apply!

Job Opening: University of Wisconsin-Madison

The Wisconsin Centers for Nanoscale Technology supports a broad range of research by students, staff, and faculty and industrial clients with interests in micro and nano fabrication, device development including CMOS and a variety of experimental devices and characterization using a wide range of methods. This position's responsibilities will include, but are not limited to:

Position Summary:
The Wisconsin Centers for Nanoscale Technology supports a broad range of research by students, staff, and faculty and industrial clients with interests in micro and nano fabrication, device development including CMOS and a variety of experimental devices and characterization using a wide range of methods. This position's responsibilities will include, but are not limited to:

-Maintenance, repair, and operation of fabrication and characterization equipment in the research labs. Maintenance of fabrication or characterization instruments will be performed independently by the candidate and in close collaboration with field service engineers assigned to particular instruments, as the case requires.

For additional information, please visit our web site at: https://wcnt.wisc.edu/

Principal duties:
The position responsibilities will include, but are not limited to:

- Interaction with users of the Center. The position will be responsible for developing documentation and training materials for the proper use of instrumentation in the centers. The position will teach proper protocols including safety and laboratory etiquette. The candidate will write standard operating procedures and train students in the use of center instrumentation. The candidate will be expected to assist students and other researchers in all areas of tool use and process development for common WCNT applications. (50%)

-Maintenance, repair, and construction of laboratory instrumentation. Maintenance of center instrumentation will be performed independently by the candidate and in close collaboration with field service engineers assigned to particular instruments, as the case requires. (40%)

-Interaction with the lead PI groups and the lab manager to identify research trends and new instrumentation. The candidate will advise researchers, industrial and academic scientists, and faculty in developing or acquiring instruments and may participate in the preparation of grant and contract proposals. (10%)

Required Qualifications:
Minimum of 5 years in semiconductor/device fabrication or materials characterization. A minimum of seven years' experience required for appointment at the senior level. The candidate must have a strong background in the use of micro- and nanofabrication techniques, characterization techniques, equipment, and clean room protocols. Experience and expertise in electrical and electronic, mechanical, pneumatic, and vacuum components as related to semiconductor/device fabrication or characterization equipment is essential. Experience in student instruction or development of instructional materials will be critical to the success of the candidate. Strong interpersonal and communications skills and the ability to work well in a team are essential requirements. The candidate must have experience and expertise in safety procedures in a research laboratory environment.

Desired Qualifications
Experience with optical lithography, electron beam lithography or experience in characterization techniques (SEM, TEM, FTIR, Raman, XPS, SIMS, optical microscopy, AFM, etc.) are a plus.
For additional information, please visit our web site at: https://wcnt.wisc.edu/

Link to job posting;
https://jobs.hr.wisc.edu/en-us/job/503885/core-facility-engineer


Daniel C. Christensen
Nanoscale Fabrication Center
University of Wisconsin-Madison
1550 Engineering Dr
Madison, WI 53706

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From mmoneck at andrew.cmu.edu  Mon Jan  6 14:20:01 2020
From: mmoneck at andrew.cmu.edu (Matthew Moneck)
Date: Mon, 6 Jan 2020 19:20:01 +0000
Subject: [labnetwork] Parylene Coater Concerns
In-Reply-To: <CAHxjShkshQJBicVxs6ouyt=FJPA8_VqjZ2QceBs+_yDJsHAkYQ@mail.gmail.com>
References: <8560e0aa534d44b1acbc3b903cc59436@andrew.cmu.edu>
 <CAHxjShkshQJBicVxs6ouyt=FJPA8_VqjZ2QceBs+_yDJsHAkYQ@mail.gmail.com>
Message-ID: <d9e95909a44e410e9719add1d79fcf7c@andrew.cmu.edu>

Happy New Year all!  Thanks to everyone who responded.  Your input has been very helpful.

--
Matthew T. Moneck, Ph.D
Executive Manager, Claire & John Bertucci Nanotechnology Laboratory
Electrical & Computer Engineering | Carnegie Mellon University
5000 Forbes Avenue, Pittsburgh, PA 15213-3890
Phone:  412-268-5430
ece.cmu.edu<http://www.ece.cmu.edu>
nanofab.ece.cmu.edu<http://www.nanofab.ece.cmu.edu>

From: Albert William (Bill) Flounders <bill_flounders at berkeley.edu>
Sent: Friday, December 13, 2019 7:54 PM
To: Matthew Moneck <mmoneck at andrew.cmu.edu>
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Parylene Coater Concerns

Matt,
Building a whole separate enclosure for just this tool seems overkill.
Our parylene tool is in a Class100 cleanroom.
We installed a hepa vac next to the tool and instruct staff and researchers to use it as needed
Scraping the cold finger or other messy jobs are done in a hood or in the chase area.
I think the tool deserves to be in the cleanroom and recommend controls/protocols to address the debris issue.
Good luck keeping all parties satisfied.
Bill

Bill Flounders
UC Berkeley

On Fri, Dec 13, 2019 at 4:34 PM Matthew Moneck <mmoneck at andrew.cmu.edu<mailto:mmoneck at andrew.cmu.edu>> wrote:
Dear Colleagues,

Happy Holidays!  I would like to poll this community for some feedback.  We have an SCS Labcoter 2 parylene system in our old cleanroom facility.  That facility will soon shut down, and we are planning to relocate the tool.  Due to the particulate and debris this tool generates, especially during maintenance cycles, we prefer not to move it into our new class 10, class 100 cleanroom facility.  At the same time, we have faculty using the tool for applications where particulate contamination during sample loading is a concern.  They would like to have it in the cleanroom.

It is my understanding that many labs have either moved their parylene systems out of their cleanroom or they have installed the system in a lower class environment (class 10,000 for example).  Our plan to satisfy all parties is move the system to a lab not currently operated as a cleanroom (i.e we are less worried about debris generated from the tool) and to build a relatively inexpensive softwall cleanroom around the tool to mitigate the particulate concerns during sample handling/loading.  We have used these mini environments before for other equipment we could not put in our cleanroom, and they have served us well.  However, there are still concerns from the researchers using the tool.

My questions to this community are as follows:


1.       Where to do you have your parylene system installed (e.g. class 100, 1000, or 10,000 cleanroom or in a standard lab environment)?

2.       Do you have any comments or feedback on the benefits or pitfalls of using a softwall cleanroom for similar applications?

3.       Do you have any other feedback or options we should consider?

As always, we appreciate the input from this group.

Best Regards,

Matt

--
Matthew T. Moneck, Ph.D
Executive Manager, Claire & John Bertucci Nanotechnology Laboratory
Electrical & Computer Engineering | Carnegie Mellon University
5000 Forbes Avenue, Pittsburgh, PA 15213-3890
Phone:  412-268-5430
ece.cmu.edu<http://www.ece.cmu.edu>
nanofab.ece.cmu.edu<http://www.nanofab.ece.cmu.edu>

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From hayes186 at purdue.edu  Tue Jan  7 09:24:19 2020
From: hayes186 at purdue.edu (Hayes, Matthew David)
Date: Tue, 7 Jan 2020 14:24:19 +0000
Subject: [labnetwork] SCS Labcoater 2 parylene system
Message-ID: <DM5PR2201MB148340DE102A012544B7DAEDFA3F0@DM5PR2201MB1483.namprd22.prod.outlook.com>

Hello all!

I'm interested in hearing how others are cleaning the chambers in these systems. Including:


  1.  Cleaning after every run or at some interval?
  2.  Procedures used to clean?
  3.  Using Micro 90 on chamber surfaces to promote removal of parylene film?

Also, some users will get a cloudy film. Could this be from too thick of coating of Micro 90? Usually, I'll check vacuum then run a deposition of my own and the film looks better than the users.

Matthew D Hayes
Engineering Technician
Birck Nanotechnology Center
Purdue University
765-494-6522
hayes186 at purdue.edu<mailto:hayes186 at purdue.edu>

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From cekendri at mtu.edu  Tue Jan  7 13:28:20 2020
From: cekendri at mtu.edu (Chito Kendrick)
Date: Tue, 7 Jan 2020 13:28:20 -0500
Subject: [labnetwork] SCS Labcoater 2 parylene system
In-Reply-To: <DM5PR2201MB148340DE102A012544B7DAEDFA3F0@DM5PR2201MB1483.namprd22.prod.outlook.com>
References: <DM5PR2201MB148340DE102A012544B7DAEDFA3F0@DM5PR2201MB1483.namprd22.prod.outlook.com>
Message-ID: <CAAy7OCHsvSD_Q3NMJBzgAYJcuEGtPaviHXF6-SuXi+n7jv5Qeg@mail.gmail.com>

I follow the process outlined in the manual pretty closely for our system.

1. Treating the chamber with Micro90 to help release the parylene, spray
all parts and then wipe off excess pooling of Micro90
2. Peeling off any parylene that is bubbling or may come off during pump
down. For the thickness we normally do this is after every run. Mainly
using plastic tweezers to help peel off the film in one sheet and then
rubbing with a cleanroom wipe soaked with the Micro90 solution to help
remove anything still stuck, if it does not come off then we assume it will
not peel off layer during pumping.
3. We also do regular pump oil changes and removal of the flex line from
the chamber to the cold finger to peel out any build up that can not be
accessed with it on the system
4. Recently we had to drill out the baffle to clear a blockage in baffle
tubing, it caused a build up of parylene in the vaporizer as the vapor flow
was restricted
5. We are getting to the point where I will have to replace the stage as
the coating is too rough to peel off. Several screws on our rotating plate
are so bound up with parylene I am going to have to drill out the screws
and retap them to completely clean some parts.

The only cloudy films we have had I have associated to a bad base pressure
or the micro90 has not completely dried.

Chito Kendrick


On Tue, Jan 7, 2020 at 12:47 PM Hayes, Matthew David <hayes186 at purdue.edu>
wrote:

> Hello all!
>
>
>
> I?m interested in hearing how others are cleaning the chambers in these
> systems. Including:
>
>
>
>    1. Cleaning after every run or at some interval?
>    2. Procedures used to clean?
>    3. Using Micro 90 on chamber surfaces to promote removal of parylene
>    film?
>
>
>
> Also, some users will get a cloudy film. Could this be from too thick of
> coating of Micro 90? Usually, I?ll check vacuum then run a deposition of my
> own and the film looks better than the users.
>
>
>
> *Matthew D Hayes*
>
> Engineering Technician
>
> Birck Nanotechnology Center
>
> Purdue University
>
> 765-494-6522
>
> hayes186 at purdue.edu
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>


-- 
Chito Kendrick Ph.D. <https://sites.google.com/site/chitokendrickphd/>

Managing Director of the Microfabrication Facility
Research Assistant Professor
Electrical and Computer Engineering
Michigan Technological University
Room 436 M&M Building
1400 Townsend Dr.
Houghton, Michigan 49931-1295

814-308-4255
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From hayes186 at purdue.edu  Tue Jan  7 15:25:37 2020
From: hayes186 at purdue.edu (Hayes, Matthew David)
Date: Tue, 7 Jan 2020 20:25:37 +0000
Subject: [labnetwork] SCS Labcoater 2 parylene system
In-Reply-To: <CAAy7OCHsvSD_Q3NMJBzgAYJcuEGtPaviHXF6-SuXi+n7jv5Qeg@mail.gmail.com>
References: <DM5PR2201MB148340DE102A012544B7DAEDFA3F0@DM5PR2201MB1483.namprd22.prod.outlook.com>
 <CAAy7OCHsvSD_Q3NMJBzgAYJcuEGtPaviHXF6-SuXi+n7jv5Qeg@mail.gmail.com>
Message-ID: <DM5PR2201MB1483ADFBF3D6404271B6F2E0FA3F0@DM5PR2201MB1483.namprd22.prod.outlook.com>

Very good information!
After your input, I?m thinking the difference in some of our users films (cloudy) and when I do a run (clearer) is that they may be starting run with too much or wet Micro 90 in the chamber.

Thanks for your input!


Matthew D Hayes
Engineering Technician
Birck Nanotechnology Center
Purdue University
765-494-6522
hayes186 at purdue.edu<mailto:hayes186 at purdue.edu>



From: Chito Kendrick <cekendri at mtu.edu>
Sent: Tuesday, January 7, 2020 1:28 PM
To: Hayes, Matthew David <hayes186 at purdue.edu>
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] SCS Labcoater 2 parylene system

I follow the process outlined in the manual pretty closely for our system.

1. Treating the chamber with Micro90 to help release the parylene, spray all parts and then wipe off excess pooling of Micro90
2. Peeling off any parylene that is bubbling or may come off during pump down. For the thickness we normally do this is after every run. Mainly using plastic tweezers to help peel off the film in one sheet and then rubbing with a cleanroom wipe soaked with the Micro90 solution to help remove anything still stuck, if it does not come off then we assume it will not peel off layer during pumping.
3. We also do regular pump oil changes and removal of the flex line from the chamber to the cold finger to peel out any build up that can not be accessed with it on the system
4. Recently we had to drill out the baffle to clear a blockage in baffle tubing, it caused a build up of parylene in the vaporizer as the vapor flow was restricted
5. We are getting to the point where I will have to replace the stage as the coating is too rough to peel off. Several screws on our rotating plate are so bound up with parylene I am going to have to drill out the screws and retap them to completely clean some parts.

The only cloudy films we have had I have associated to a bad base pressure or the micro90 has not completely dried.

Chito Kendrick


On Tue, Jan 7, 2020 at 12:47 PM Hayes, Matthew David <hayes186 at purdue.edu<mailto:hayes186 at purdue.edu>> wrote:
Hello all!

I?m interested in hearing how others are cleaning the chambers in these systems. Including:


  1.  Cleaning after every run or at some interval?
  2.  Procedures used to clean?
  3.  Using Micro 90 on chamber surfaces to promote removal of parylene film?

Also, some users will get a cloudy film. Could this be from too thick of coating of Micro 90? Usually, I?ll check vacuum then run a deposition of my own and the film looks better than the users.

Matthew D Hayes
Engineering Technician
Birck Nanotechnology Center
Purdue University
765-494-6522
hayes186 at purdue.edu<mailto:hayes186 at purdue.edu>

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork


--
Chito Kendrick Ph.D.<https://sites.google.com/site/chitokendrickphd/>

Managing Director of the Microfabrication Facility
Research Assistant Professor
Electrical and Computer Engineering
Michigan Technological University
Room 436 M&M Building
1400 Townsend Dr.
Houghton, Michigan 49931-1295

814-308-4255<tel:814-308-4255>
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From cekendri at mtu.edu  Tue Jan  7 15:31:13 2020
From: cekendri at mtu.edu (Chito Kendrick)
Date: Tue, 7 Jan 2020 15:31:13 -0500
Subject: [labnetwork] SCS Labcoater 2 parylene system
In-Reply-To: <DM5PR2201MB1483ADFBF3D6404271B6F2E0FA3F0@DM5PR2201MB1483.namprd22.prod.outlook.com>
References: <DM5PR2201MB148340DE102A012544B7DAEDFA3F0@DM5PR2201MB1483.namprd22.prod.outlook.com>
 <CAAy7OCHsvSD_Q3NMJBzgAYJcuEGtPaviHXF6-SuXi+n7jv5Qeg@mail.gmail.com>
 <DM5PR2201MB1483ADFBF3D6404271B6F2E0FA3F0@DM5PR2201MB1483.namprd22.prod.outlook.com>
Message-ID: <CAAy7OCEC6TtKDg8McjQ9iYqVqtFkJK87h1w_9iHBY6KkRq8pbw@mail.gmail.com>

In the manual I looked at there is several pieces of information on cloudy
coatings:

1 - The vacuum controller set point value is factory-set at 15 units above
base pressure. By changing this setting up or down, the process will speed
up or slow down respectively. Take care not to set this value too high, as
it will result in cloudy coatings

2 - Generally, the slower the deposition, the more uniform and clear the
Parylene will be. From the standpoint of coating quality, you cannot coat
too slowly, but coating too quickly can cause cloudy or whitish Parylene
and uneven coating thickness. For Parylene C, the deposition rate will
typically be about .0002" per hour

3 - It is best to distribute the substrate evenly within the Deposition
Chamber. Relatively large spaces with little or no surface area will tend
to result in Parylene coating that is cloudy.


On Tue, Jan 7, 2020 at 3:25 PM Hayes, Matthew David <hayes186 at purdue.edu>
wrote:

> Very good information!
>
> After your input, I?m thinking the difference in some of our users films
> (cloudy) and when I do a run (clearer) is that they may be starting run
> with too much or wet Micro 90 in the chamber.
>
>
>
> Thanks for your input!
>
>
>
>
>
> *Matthew D Hayes*
>
> Engineering Technician
>
> Birck Nanotechnology Center
>
> Purdue University
>
> 765-494-6522
>
> hayes186 at purdue.edu
>
>
>
>
>
>
>
> *From:* Chito Kendrick <cekendri at mtu.edu>
> *Sent:* Tuesday, January 7, 2020 1:28 PM
> *To:* Hayes, Matthew David <hayes186 at purdue.edu>
> *Cc:* labnetwork at mtl.mit.edu
> *Subject:* Re: [labnetwork] SCS Labcoater 2 parylene system
>
>
>
> I follow the process outlined in the manual pretty closely for our system.
>
>
>
> 1. Treating the chamber with Micro90 to help release the parylene, spray
> all parts and then wipe off excess pooling of Micro90
>
> 2. Peeling off any parylene that is bubbling or may come off during pump
> down. For the thickness we normally do this is after every run. Mainly
> using plastic tweezers to help peel off the film in one sheet and then
> rubbing with a cleanroom wipe soaked with the Micro90 solution to help
> remove anything still stuck, if it does not come off then we assume it will
> not peel off layer during pumping.
>
> 3. We also do regular pump oil changes and removal of the flex line from
> the chamber to the cold finger to peel out any build up that can not be
> accessed with it on the system
>
> 4. Recently we had to drill out the baffle to clear a blockage in baffle
> tubing, it caused a build up of parylene in the vaporizer as the vapor flow
> was restricted
>
> 5. We are getting to the point where I will have to replace the stage as
> the coating is too rough to peel off. Several screws on our rotating plate
> are so bound up with parylene I am going to have to drill out the screws
> and retap them to completely clean some parts.
>
>
>
> The only cloudy films we have had I have associated to a bad base pressure
> or the micro90 has not completely dried.
>
>
>
> Chito Kendrick
>
>
>
>
>
> On Tue, Jan 7, 2020 at 12:47 PM Hayes, Matthew David <hayes186 at purdue.edu>
> wrote:
>
> Hello all!
>
>
>
> I?m interested in hearing how others are cleaning the chambers in these
> systems. Including:
>
>
>
>    1. Cleaning after every run or at some interval?
>    2. Procedures used to clean?
>    3. Using Micro 90 on chamber surfaces to promote removal of parylene
>    film?
>
>
>
> Also, some users will get a cloudy film. Could this be from too thick of
> coating of Micro 90? Usually, I?ll check vacuum then run a deposition of my
> own and the film looks better than the users.
>
>
>
> *Matthew D Hayes*
>
> Engineering Technician
>
> Birck Nanotechnology Center
>
> Purdue University
>
> 765-494-6522
>
> hayes186 at purdue.edu
>
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
>
> --
>
> Chito Kendrick Ph.D. <https://sites.google.com/site/chitokendrickphd/>
>
> Managing Director of the Microfabrication Facility
> Research Assistant Professor
> Electrical and Computer Engineering
> Michigan Technological University
> Room 436 M&M Building
> 1400 Townsend Dr.
> Houghton, Michigan 49931-1295
>
> 814-308-4255
>


-- 
Chito Kendrick Ph.D. <https://sites.google.com/site/chitokendrickphd/>

Managing Director of the Microfabrication Facility
Research Assistant Professor
Electrical and Computer Engineering
Michigan Technological University
Room 436 M&M Building
1400 Townsend Dr.
Houghton, Michigan 49931-1295

814-308-4255
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From mcwilliamss at mail.smu.edu  Tue Jan  7 15:31:51 2020
From: mcwilliamss at mail.smu.edu (McWilliams, Scott)
Date: Tue, 7 Jan 2020 20:31:51 +0000
Subject: [labnetwork] wet etching InGaAlAs
Message-ID: <bf9026089107421cb206ef2f37f2eea3@mail.smu.edu>

Hello All,

I'm processing some wafers and need to wet etch layers of InGaAlAs of various compositions (Alx values of x = 0.48 to 0.27).  I pulled a reference from the A.W. Clawson III-V etch reference guide that H3PO4/H202/H20 1:1:10 should etch this material, but it is not etching.  The referenced paper does not provide the etchant temperature.

I suspect that I need to perform a surface etch of some type before etching the InGaAlAs.  We do have the limitation that our current mask is 600 angstroms of silicon nitride, so we may be prohibited from performing  HF containing surface etches.

Does anyone have experience with this material and a recommended surface clean?  Is there a better etchant to use?  Has anyone attempted to dry etch this material with a CH4/H2 process?

Thank you,  Scott
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From patricns at uw.edu  Tue Jan  7 16:06:10 2020
From: patricns at uw.edu (N Shane Patrick)
Date: Tue, 7 Jan 2020 13:06:10 -0800
Subject: [labnetwork] SCS Labcoater 2 parylene system
In-Reply-To: <DM5PR2201MB1483ADFBF3D6404271B6F2E0FA3F0@DM5PR2201MB1483.namprd22.prod.outlook.com>
References: <DM5PR2201MB1483ADFBF3D6404271B6F2E0FA3F0@DM5PR2201MB1483.namprd22.prod.outlook.com>
Message-ID: <62AC5D7F-69E3-4C0D-A5A0-B06EC8453401@uw.edu>

Just a quick chime in - we place tape (scotch or polyimide both work depending on what you have/allow) over the stage screws to protect them from build up. Obviously the tape gets covered but a gentle (or not) application of a razor blade easilly solves that we find.

Everything else we pretty much do by the book.

N. Shane Patrick
Direct Write and Stepper Lithography
Research Engineer, Washington Nanofabrication Facility (WNF) 
National Nanotechnology Coordinated Infrastructure (NNCI)
University of Washington
Fluke Hall 129, Box 352143
(206) 221-1045
patricns at uw.edu
http://www.wnf.washington.edu/

>> On Jan 7, 2020, at 12:59 PM, Hayes, Matthew David <hayes186 at purdue.edu> wrote:
> ?
> Very good information!
> After your input, I?m thinking the difference in some of our users films (cloudy) and when I do a run (clearer) is that they may be starting run with too much or wet Micro 90 in the chamber.
>  
> Thanks for your input!
>  
>  
> Matthew D Hayes
> Engineering Technician
> Birck Nanotechnology Center
> Purdue University
> 765-494-6522
> hayes186 at purdue.edu
>  
>  
>  
> From: Chito Kendrick <cekendri at mtu.edu> 
> Sent: Tuesday, January 7, 2020 1:28 PM
> To: Hayes, Matthew David <hayes186 at purdue.edu>
> Cc: labnetwork at mtl.mit.edu
> Subject: Re: [labnetwork] SCS Labcoater 2 parylene system
>  
> I follow the process outlined in the manual pretty closely for our system.
>  
> 1. Treating the chamber with Micro90 to help release the parylene, spray all parts and then wipe off excess pooling of Micro90
> 2. Peeling off any parylene that is bubbling or may come off during pump down. For the thickness we normally do this is after every run. Mainly using plastic tweezers to help peel off the film in one sheet and then rubbing with a cleanroom wipe soaked with the Micro90 solution to help remove anything still stuck, if it does not come off then we assume it will not peel off layer during pumping.
> 3. We also do regular pump oil changes and removal of the flex line from the chamber to the cold finger to peel out any build up that can not be accessed with it on the system
> 4. Recently we had to drill out the baffle to clear a blockage in baffle tubing, it caused a build up of parylene in the vaporizer as the vapor flow was restricted
> 5. We are getting to the point where I will have to replace the stage as the coating is too rough to peel off. Several screws on our rotating plate are so bound up with parylene I am going to have to drill out the screws and retap them to completely clean some parts.
>  
> The only cloudy films we have had I have associated to a bad base pressure or the micro90 has not completely dried.
>  
> Chito Kendrick
>  
>  
> On Tue, Jan 7, 2020 at 12:47 PM Hayes, Matthew David <hayes186 at purdue.edu> wrote:
> Hello all!
>  
> I?m interested in hearing how others are cleaning the chambers in these systems. Including:
>  
> Cleaning after every run or at some interval?
> Procedures used to clean?
> Using Micro 90 on chamber surfaces to promote removal of parylene film?
>  
> Also, some users will get a cloudy film. Could this be from too thick of coating of Micro 90? Usually, I?ll check vacuum then run a deposition of my own and the film looks better than the users.
>  
> Matthew D Hayes
> Engineering Technician
> Birck Nanotechnology Center
> Purdue University
> 765-494-6522
> hayes186 at purdue.edu
>  
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
> 
> 
> --
> Chito Kendrick Ph.D.
> 
> Managing Director of the Microfabrication Facility
> Research Assistant Professor
> Electrical and Computer Engineering
> Michigan Technological University
> Room 436 M&M Building
> 1400 Townsend Dr.
> Houghton, Michigan 49931-1295
> 
> 814-308-4255
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From km at highrioptics.com  Tue Jan  7 17:37:13 2020
From: km at highrioptics.com (Keiko Munechika)
Date: Tue, 7 Jan 2020 22:37:13 +0000
Subject: [labnetwork] Nanophotonics Engineer position available immediately
	in Berkeley, CA.
Message-ID: <DM5PR18MB1564DD6CB0F6CB4965927B79B43F0@DM5PR18MB1564.namprd18.prod.outlook.com>

Nanophotonics Engineer position available immediately in Berkeley, CA.

Dear All,

Happy 2020! We have an immediate opening for a Nanophotonics Engineer position in Berkeley CA.
This position is suitable for a recent PhD graduate with a strong background in nano/micro fabrication and optics.

I'd appreciate it if you can help spread the word. Job description is attached.

Many thank for your help in advance!

With warm regards,

Keiko Munechika, Ph.D.
Chief Executive Officer
HighRI Optics, Inc.
https://highrioptics.com/
[logo_white_background]

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From fouad.karouta at anu.edu.au  Tue Jan  7 17:38:08 2020
From: fouad.karouta at anu.edu.au (Fouad Karouta)
Date: Tue, 7 Jan 2020 22:38:08 +0000
Subject: [labnetwork] wet etching InGaAlAs
In-Reply-To: <bf9026089107421cb206ef2f37f2eea3@mail.smu.edu>
References: <bf9026089107421cb206ef2f37f2eea3@mail.smu.edu>
Message-ID: <ME1PR01MB066096F15C5CF2479D7E2747C03F0@ME1PR01MB0660.ausprd01.prod.outlook.com>

Hi Scott,

Usually the solution you mentioned should be able to etch the material. You may consider using smaller amount of water.
Do you have any other layers on top of the InGaAlAs layer?

Note H2O2 solutions should be made fresh every time of usage.
I used a same solution to etch GaAs/AlAs at RT. Also we did sometime at 0?C.

CH4/H2 process will etch very slowly Al containing materials.

Hope this helps,
Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility
Research School of Physics
L. Huxley Building (#56), Mills Road, Room 4.02
Australian National University
ACT 2601, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au<mailto:fouad.karouta at anu.edu.au>
http://anff-act.anu.edu.au/



From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> On Behalf Of McWilliams, Scott
Sent: Wednesday, 8 January 2020 7:32 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] wet etching InGaAlAs

Hello All,

I'm processing some wafers and need to wet etch layers of InGaAlAs of various compositions (Alx values of x = 0.48 to 0.27).  I pulled a reference from the A.W. Clawson III-V etch reference guide that H3PO4/H202/H20 1:1:10 should etch this material, but it is not etching.  The referenced paper does not provide the etchant temperature.

I suspect that I need to perform a surface etch of some type before etching the InGaAlAs.  We do have the limitation that our current mask is 600 angstroms of silicon nitride, so we may be prohibited from performing  HF containing surface etches.

Does anyone have experience with this material and a recommended surface clean?  Is there a better etchant to use?  Has anyone attempted to dry etch this material with a CH4/H2 process?

Thank you,  Scott
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From mcwilliamss at mail.smu.edu  Tue Jan  7 18:56:04 2020
From: mcwilliamss at mail.smu.edu (McWilliams, Scott)
Date: Tue, 7 Jan 2020 23:56:04 +0000
Subject: [labnetwork] wet etching InGaAlAs
In-Reply-To: <ME1PR01MB066096F15C5CF2479D7E2747C03F0@ME1PR01MB0660.ausprd01.prod.outlook.com>
References: <bf9026089107421cb206ef2f37f2eea3@mail.smu.edu>,
 <ME1PR01MB066096F15C5CF2479D7E2747C03F0@ME1PR01MB0660.ausprd01.prod.outlook.com>
Message-ID: <46FF502D-F43C-4E41-BF5D-27ABF3A129A1@mail.smu.edu>

Thank you all for your replies, I will check to see if the peroxide is the issue.  I did etch the nitride with BOE, so didn?t dry etch it.  After the BOE etch I stripped off the photoresist with solvents.  For these wafers, I need to remove an InP layer and then an InGaAsP layer before etching the InGaAlAs.  Regards, Scott

Sent from my iPhone

On Jan 7, 2020, at 4:38 PM, Fouad Karouta <fouad.karouta at anu.edu.au> wrote:

?
Hi Scott,

Usually the solution you mentioned should be able to etch the material. You may consider using smaller amount of water.
Do you have any other layers on top of the InGaAlAs layer?

Note H2O2 solutions should be made fresh every time of usage.
I used a same solution to etch GaAs/AlAs at RT. Also we did sometime at 0?C.

CH4/H2 process will etch very slowly Al containing materials.

Hope this helps,
Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility
Research School of Physics
L. Huxley Building (#56), Mills Road, Room 4.02
Australian National University
ACT 2601, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au<mailto:fouad.karouta at anu.edu.au>
http://anff-act.anu.edu.au/



From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> On Behalf Of McWilliams, Scott
Sent: Wednesday, 8 January 2020 7:32 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] wet etching InGaAlAs

Hello All,

I?m processing some wafers and need to wet etch layers of InGaAlAs of various compositions (Alx values of x = 0.48 to 0.27).  I pulled a reference from the A.W. Clawson III-V etch reference guide that H3PO4/H202/H20 1:1:10 should etch this material, but it is not etching.  The referenced paper does not provide the etchant temperature.

I suspect that I need to perform a surface etch of some type before etching the InGaAlAs.  We do have the limitation that our current mask is 600 angstroms of silicon nitride, so we may be prohibited from performing  HF containing surface etches.

Does anyone have experience with this material and a recommended surface clean?  Is there a better etchant to use?  Has anyone attempted to dry etch this material with a CH4/H2 process?

Thank you,  Scott
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From scholvin at mit.edu  Thu Jan  9 15:58:26 2020
From: scholvin at mit.edu (Jorg Scholvin)
Date: Thu, 9 Jan 2020 20:58:26 +0000
Subject: [labnetwork] Job opening, Technician A, MIT.nano
Message-ID: <d56b2cdf92c24737b6bfdeb9ac2857b9@oc11expo12.exchange.mit.edu>

We have a job opening for "Technician A" at MIT.nano, details and links below:





TECHNICIAN A, ELECTRO-MECHANICAL, MIT.nano

to assist with laboratory, research or analytical work under the direction/supervision of scientific personnel.  Will operate and maintain highly technical experimental apparatus in semiconductor processing facility.  Will operate and maintain chemical and wafer cleaning stations, wet benches and fume hoods, vacuum systems (e.g., RF plasma etchers, oxygen-plasma asher), metrology systems, CMP, e-beam, sputter and chemical vapor deposition, and back-end/packaging tools; process wafers for lab and research purposes; interface with vendors for equipment service, repair, and troubleshooting; support all areas of the facilities, including all building infrastructure systems; clean and stock laboratory supplies; help with the moving and installation of tools; and assist with training students in the proper use of equipment.



Job Requirements

graduation from a two-year technical school or its equivalent; at least two years' applicable experience; experience with leak detectors, plumbing, and wiring of vacuum systems; strong mechanical and electrical aptitudes; ability to troubleshoot control electronics at board and component levels; basic computer skills for the purpose of data collection and maintenance of equipment logs and records; lab experience in semiconductor device fabrication and practices; basic knowledge of safety procedures in the handling of chemicals and toxic gases; experience with the repair and maintenance of electronic and mechanical equipment; ability to work on multiple tasks simultaneously and remain organized; good interpersonal skills; and ability to work independently with minimal day-to-day supervision and as part of a team with other technicians, staff, and students.  Experience operating and maintaining high temperature oxidation and diffusion furnaces highly desirable.    Job #18311



Normal work hours will be 7:30 A.M. to 3:30 P.M., Monday through Friday.



Link to posting:
https://careers.peopleclick.com/careerscp/client_mit/external/jobDetails/jobDetail.html?jobPostId=17689&localeCode=en-us


https://hr.mit.edu/careers


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From na2661 at columbia.edu  Fri Jan 10 16:41:57 2020
From: na2661 at columbia.edu (Nava Ariel-Sternberg)
Date: Fri, 10 Jan 2020 16:41:57 -0500
Subject: [labnetwork] Job opening, Equipment Engineer - Columbia University
Message-ID: <039601d5c7fe$c8a93290$59fb97b0$@columbia.edu>

Greetings and happy new year to all, 

 

We are hiring! Looking for a lab equipment engineer that would work in our
clean room and support our materials characterization and electron
microscopy labs as well. Candidates must have a bachelor degree at
Engineering or a related degree and must be able to work independently. 

 

For more information and in order to apply please see this link (and feel
free to pass it on):

 

http://pa334.peopleadmin.com/postings/5030

 

Come and join us to work in the greatest city in the world!

 

Nava Ariel-Sternberg, Ph.D.

Director of CNI Shared Labs

Columbia University

CEPSR/MC 8903 

530 west 120th st. NY

NY 10027

Office: 212-8549927

Cell: 201-5627600

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From mhofheins at unm.edu  Thu Jan 16 16:52:03 2020
From: mhofheins at unm.edu (Mark Hofheins)
Date: Thu, 16 Jan 2020 21:52:03 +0000
Subject: [labnetwork] HMDS Vapor dispense system
Message-ID: <DM6PR07MB43291474BFC01DF4B35C24A5A3360@DM6PR07MB4329.namprd07.prod.outlook.com>

Good Afternoon All,
At the University of New Mexico we have a small clean room facility.
We are in the process of bringing up another Lithography bay.
We are looking for another HMDS Vapor dispense system that will fit on a table top.
Please respond if you might know of any systems like this that is available.
Best regards,


Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

Cell  505-710-3527

Office 505-272-7155



Micro Electronics Technician

Manufacturing Engineering Program

University of New Mexico MTTC

800 Bradbury S.E.  Suit 169

Albuquerque, New Mexico

87106-4346

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From scholvin at mit.edu  Fri Jan 17 23:54:57 2020
From: scholvin at mit.edu (Jorg Scholvin)
Date: Sat, 18 Jan 2020 04:54:57 +0000
Subject: [labnetwork] Job opening, Technician B, MIT.nano
Message-ID: <3ae4fc854cdc4c36b99a7b4f0e44b31d@oc11expo12.exchange.mit.edu>

We have another job opening, this one for "Technician B" at MIT.nano, details and links below:


TECHNICIAN B, ELECTRO-MECHANICAL, MIT.nano
to assist with laboratory maintenance and operations, as well as research and/or analytical work, under the direct supervision of scientific and technical personnel. Will operate and maintain highly technical experimental tools in semiconductor processing facility; interface with vendors for equipment service, repairs, and troubleshooting; support all areas of the laboratories, including facilities; and clean and stock supplies and order replacement parts for equipment.  May process wafers for lab control and research purposes and assist with training students in the proper use of equipment.  Responsibilities include routine lab upkeep functions, including lab cleaning; responding to user requests for chemicals and lab supplies; monitoring and maintaining specified inventory levels of chemicals and lab supplies; interacting with vendors; assisting with the installation of new and removal of old equipment; keeping storage and chase areas in a clean and orderly state; working with technical research staff to maintain and operate equipment used in device processing and fabrication; assisting with user training as requested; helping to establish and refine laboratory monitoring practices; and providing support in all areas of the facilities.

Job Requirements
graduation from two-year technical school or its equivalent, knowledge of safety procedures for handling chemicals and toxic gases, ability to troubleshoot control electronics at board level, basic computer skills and experience repairing and maintaining electronic equipment, and ability to lift weights of up to 40 lbs.  PREFERRED: two years' applicable experience and lab experience in cleanroom fabrication and practices.  Job #18412

Normal work hours will be 7:30 A.M. to 3:30 P.M., Monday through Friday.

Link to posting:
https://careers.peopleclick.com/careerscp/client_mit/external/jobDetails/jobDetail.html?jobPostId=17866&localeCode=en-us 

https://hr.mit.edu/careers 



From John.Watson at microsoft.com  Sat Jan 18 03:17:03 2020
From: John.Watson at microsoft.com (John Watson)
Date: Sat, 18 Jan 2020 08:17:03 +0000
Subject: [labnetwork] Microsoft Quantum Lab site manager positions
Message-ID: <VI1PR83MB0319F48CE246470D752C8BB0FC300@VI1PR83MB0319.EURPRD83.prod.outlook.com>

Dear Colleagues,
The Microsoft Quantum program has a number of positions open for site managers at our global lab sites.  See links below for more information.

Delft Quantum Site Manager<https://careers.microsoft.com/us/en/job/775548/Quantum-Site-Manager>
Redmond Quantum Site Director<https://careers.microsoft.com/us/en/job/772960/Quantum-Site-Director>
Copenhagen Quantum Site Manager<https://careers.microsoft.com/us/en/job/767167/Quantum-Site-Manager>
Sydney Quantum Site Manager<https://careers.microsoft.com/us/en/job/767169/Quantum-Site-Manager>

Best,
John

--
John Watson
Senior Research Manager
Microsoft Quantum Lab Delft
Lorentzweg 1
2628CJ Delft
The Netherlands

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From demis at ece.ucsb.edu  Sun Jan 19 17:43:24 2020
From: demis at ece.ucsb.edu (Demis D. John)
Date: Sun, 19 Jan 2020 14:43:24 -0800
Subject: [labnetwork] Fwd: U. Oregon Cleanroom director job
In-Reply-To: <CADGhxRtp4OroO_3GV60gk7+yCSr3aVUuWRdRbaCc8OS13VDoJQ@mail.gmail.com>
References: <CADGhxRtp4OroO_3GV60gk7+yCSr3aVUuWRdRbaCc8OS13VDoJQ@mail.gmail.com>
Message-ID: <CAJ4njZ_B+SawSUjfmOTN+SOmEjYnQLtE=V=ZpMzhA7_UPHGPdg@mail.gmail.com>

FYI see this link.
https://careers.uoregon.edu/en-us/job/524959/clean-room-manager
-- Demis

----------------------------------------
           demis at ucsb.edu
*   Process Scientist Manager*
 UCSB Nanofabrication Facility <https://www.nanotech.ucsb.edu/>
----------------------------------------



---------- Forwarded message ---------
From: Benjam?n J. Alem?n <baleman at uoregon.edu>
Date: Thu, Jan 9, 2020 at 1:07 PM
Subject: Clean room director job
To: Demis D. John <demis at ucsb.edu>, Brian Thibeault <thibeault at ece.ucsb.edu>


Dear Brian and Demis,

We are building a new $1B campus with a sweet clean room and we are looking
for excellent candidates to run the clean room. Please pass this posting to
anyone you think might be interested:

https://careers.uoregon.edu/en-us/job/524959/clean-room-manager

Best,

Benjam?n

--------------------------------------
Benjam?n J. Alem?n (he, him, his)
Assistant Professor
Department of Physics
Material Science Institute,
Oregon Center for Optical, Molecular, and Quantum Science &
Phil and Penny Knight Campus for Accelerating Scientific Impact
University of Oregon
Eugene, Oregon  97403

Willamette Hall 178
http://alemanlab.uoregon.edu/
541.346.3321
--------------------------------------
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From kmcpeak at lsu.edu  Thu Jan 23 08:42:15 2020
From: kmcpeak at lsu.edu (Kevin M McPeak)
Date: Thu, 23 Jan 2020 13:42:15 +0000
Subject: [labnetwork] Plumbing new gases in ICP-RIE gas pod
Message-ID: <CH2PR06MB66307CDF0F94C631781ECBF2B00F0@CH2PR06MB6630.namprd06.prod.outlook.com>

Dear Colleagues,

Here at LSU, we want to add C4F8 and CHF3 gases to our Oxford ICP100 system. The gas pod (see attached photo) currently has the following gases plumbed from top to bottom: O2, N2, CF4, and SF6. Notice, the current CF4 and SF6 lines have additional valves and plumbing. 

When I add the C4F8 and CHF3 do you recommend I plumb them like the O2 and N2 gases (filter -> MFC -> valve) are or do I need to add the additional valves and plumbing like the SF6 and CF8 lines are? We can do either but the SF6/CF4 method is a lot more money and time. This is an old gas pod, circa 1995 and Oxford has limited information. and advice. 

NOTE: The two output lines (top line and 3rd from top) from the gas pod get merged at the tool before entering the instrument. I am not sure why it was plumbed this way back in 1995.

Regards,
Kevin

--
Kevin M. McPeak
Assistant Professor | LSU Dept. of Chemical Engineering
225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication

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From rmorrison at draper.com  Thu Jan 23 12:04:34 2020
From: rmorrison at draper.com (Morrison, Richard H., Jr)
Date: Thu, 23 Jan 2020 17:04:34 +0000
Subject: [labnetwork] Plumbing new gases in ICP-RIE gas pod
In-Reply-To: <CH2PR06MB66307CDF0F94C631781ECBF2B00F0@CH2PR06MB6630.namprd06.prod.outlook.com>
References: <CH2PR06MB66307CDF0F94C631781ECBF2B00F0@CH2PR06MB6630.namprd06.prod.outlook.com>
Message-ID: <af59bcdf1189405aab6b4ddc93188467@draper.com>

Rick Morrison here from Draper, seems very curious that the CF4 and SF6 lines have a bypass and an input valve. Looks like this is a bypass to maybe vacuum pump the lines during gas bottle hookup or some other function. If that is what those are used for then I would plumb the new gas the same way.

What part of the manifold are you tying the new gases into looks like you have 2 slots open where the SF6 and CF4 lines are.

Rick


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Kevin M McPeak
Sent: Thursday, January 23, 2020 8:42 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Plumbing new gases in ICP-RIE gas pod

Dear Colleagues,

Here at LSU, we want to add C4F8 and CHF3 gases to our Oxford ICP100 system. The gas pod (see attached photo) currently has the following gases plumbed from top to bottom: O2, N2, CF4, and SF6. Notice, the current CF4 and SF6 lines have additional valves and plumbing.

When I add the C4F8 and CHF3 do you recommend I plumb them like the O2 and N2 gases (filter -> MFC -> valve) are or do I need to add the additional valves and plumbing like the SF6 and CF8 lines are? We can do either but the SF6/CF4 method is a lot more money and time. This is an old gas pod, circa 1995 and Oxford has limited information. and advice.

NOTE: The two output lines (top line and 3rd from top) from the gas pod get merged at the tool before entering the instrument. I am not sure why it was plumbed this way back in 1995.

Regards,
Kevin

--
Kevin M. McPeak
Assistant Professor | LSU Dept. of Chemical Engineering
225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication

________________________________
 Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________


From spaolini at cns.fas.harvard.edu  Thu Jan 23 13:09:02 2020
From: spaolini at cns.fas.harvard.edu (Paolini, Steven)
Date: Thu, 23 Jan 2020 18:09:02 +0000
Subject: [labnetwork] Plumbing new gases in ICP-RIE gas pod
In-Reply-To: <CH2PR06MB66307CDF0F94C631781ECBF2B00F0@CH2PR06MB6630.namprd06.prod.outlook.com>
References: <CH2PR06MB66307CDF0F94C631781ECBF2B00F0@CH2PR06MB6630.namprd06.prod.outlook.com>
Message-ID: <BL0PR07MB4004BC42F7B692E2904B220FDF0F0@BL0PR07MB4004.namprd07.prod.outlook.com>

Kevin,
  What you have is an early version of a gas pod that is capable of handling two flammable/toxic/pyrophoric gases. On the SF6 and CF4 channels, you have pneumatic two way shut offs that are upstream and downstream of the MFC. The manual toggle valve is there as a bypass to purge the circuit should the MFC fail and you lose your means of evacuating and purging for replacement. This is overkill for the gases you intend to run. 
The output lines are separate with O2 and N2 going to one line to the machine and the other one is for the reactive gases which, I presume, were toxic when the machine was commissioned. This arrangement was most likely set up to keep the nasty gas separated from the O2  as far away and remix as close to the chamber as possible.
  Steve Paolini   Equipment Dood
  Harvard University Center for Nanoscale Systems.

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu
www.cns.fas.harvard.edu

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> On Behalf Of Kevin M McPeak
Sent: Thursday, January 23, 2020 8:42 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Plumbing new gases in ICP-RIE gas pod

Dear Colleagues,

Here at LSU, we want to add C4F8 and CHF3 gases to our Oxford ICP100 system. The gas pod (see attached photo) currently has the following gases plumbed from top to bottom: O2, N2, CF4, and SF6. Notice, the current CF4 and SF6 lines have additional valves and plumbing. 

When I add the C4F8 and CHF3 do you recommend I plumb them like the O2 and N2 gases (filter -> MFC -> valve) are or do I need to add the additional valves and plumbing like the SF6 and CF8 lines are? We can do either but the SF6/CF4 method is a lot more money and time. This is an old gas pod, circa 1995 and Oxford has limited information. and advice. 

NOTE: The two output lines (top line and 3rd from top) from the gas pod get merged at the tool before entering the instrument. I am not sure why it was plumbed this way back in 1995.

Regards,
Kevin

--
Kevin M. McPeak
Assistant Professor | LSU Dept. of Chemical Engineering
225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication



From beaudoin at physics.ubc.ca  Thu Jan 23 13:23:51 2020
From: beaudoin at physics.ubc.ca (Beaudoin, Mario)
Date: Thu, 23 Jan 2020 10:23:51 -0800
Subject: [labnetwork] Plumbing new gases in ICP-RIE gas pod
In-Reply-To: <CH2PR06MB66307CDF0F94C631781ECBF2B00F0@CH2PR06MB6630.namprd06.prod.outlook.com>
References: <CH2PR06MB66307CDF0F94C631781ECBF2B00F0@CH2PR06MB6630.namprd06.prod.outlook.com>
Message-ID: <e27deacc-c497-8d33-cc92-3473bc5fbc48@physics.ubc.ca>

If it helps, we've just received our new COBRA system with a similar gas 
pod.? All lines are plumbed like the O2, N2, including CF4, SF6 and C4F8.

Mario

On 2020-01-23 5:42 a.m., Kevin M McPeak wrote:
> Dear Colleagues,
>
> Here at LSU, we want to add C4F8 and CHF3 gases to our Oxford ICP100 system. The gas pod (see attached photo) currently has the following gases plumbed from top to bottom: O2, N2, CF4, and SF6. Notice, the current CF4 and SF6 lines have additional valves and plumbing.
>
> When I add the C4F8 and CHF3 do you recommend I plumb them like the O2 and N2 gases (filter -> MFC -> valve) are or do I need to add the additional valves and plumbing like the SF6 and CF8 lines are? We can do either but the SF6/CF4 method is a lot more money and time. This is an old gas pod, circa 1995 and Oxford has limited information. and advice.
>
> NOTE: The two output lines (top line and 3rd from top) from the gas pod get merged at the tool before entering the instrument. I am not sure why it was plumbed this way back in 1995.
>
> Regards,
> Kevin
>
> --
> Kevin M. McPeak
> Assistant Professor | LSU Dept. of Chemical Engineering
> 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
-- 
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From schweig at umich.edu  Thu Jan 23 14:47:09 2020
From: schweig at umich.edu (Dennis Schweiger)
Date: Thu, 23 Jan 2020 14:47:09 -0500
Subject: [labnetwork] Plumbing new gases in ICP-RIE gas pod
In-Reply-To: <CH2PR06MB66307CDF0F94C631781ECBF2B00F0@CH2PR06MB6630.namprd06.prod.outlook.com>
References: <CH2PR06MB66307CDF0F94C631781ECBF2B00F0@CH2PR06MB6630.namprd06.prod.outlook.com>
Message-ID: <CAKzi2_MaU4ngimvRrvVZw-SqVKrCTZwXTOtiiN4w9H-_-CsM_Q@mail.gmail.com>

Kevin,

good afternoon.  You have an interesting assortment of technologies in your
gas box, micro-fit, and the older TB7 weld hardware.  Since your two "new"
gases are relatively inert, I would pick the simplest install to make them
active.  Typically the bypass arrangement you see on a couple of the
channels is for when you need to remove the MFC, and it's plugged.  If you
were using a reactive gas, the bypass gives you a way to evacuate both ends
of the MFC, making it "safe" to remove.

Dennis Schweiger
University of Michigan/LNF
Facilities

734.647.2055 Ofc


On Thu, Jan 23, 2020 at 11:52 AM Kevin M McPeak <kmcpeak at lsu.edu> wrote:

> Dear Colleagues,
>
> Here at LSU, we want to add C4F8 and CHF3 gases to our Oxford ICP100
> system. The gas pod (see attached photo) currently has the following gases
> plumbed from top to bottom: O2, N2, CF4, and SF6. Notice, the current CF4
> and SF6 lines have additional valves and plumbing.
>
> When I add the C4F8 and CHF3 do you recommend I plumb them like the O2 and
> N2 gases (filter -> MFC -> valve) are or do I need to add the additional
> valves and plumbing like the SF6 and CF8 lines are? We can do either but
> the SF6/CF4 method is a lot more money and time. This is an old gas pod,
> circa 1995 and Oxford has limited information. and advice.
>
> NOTE: The two output lines (top line and 3rd from top) from the gas pod
> get merged at the tool before entering the instrument. I am not sure why it
> was plumbed this way back in 1995.
>
> Regards,
> Kevin
>
> --
> Kevin M. McPeak
> Assistant Professor | LSU Dept. of Chemical Engineering
> 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From codreanu at udel.edu  Thu Jan 23 16:01:09 2020
From: codreanu at udel.edu (Iulian Codreanu)
Date: Thu, 23 Jan 2020 16:01:09 -0500
Subject: [labnetwork] Plumbing new gases in ICP-RIE gas pod
In-Reply-To: <CAKzi2_MaU4ngimvRrvVZw-SqVKrCTZwXTOtiiN4w9H-_-CsM_Q@mail.gmail.com>
References: <CH2PR06MB66307CDF0F94C631781ECBF2B00F0@CH2PR06MB6630.namprd06.prod.outlook.com>
 <CAKzi2_MaU4ngimvRrvVZw-SqVKrCTZwXTOtiiN4w9H-_-CsM_Q@mail.gmail.com>
Message-ID: <5b277a98-98a5-3b68-0de6-a33619b84257@udel.edu>

Hi Kevin,

I second Dennis' recommendation. I have the MFC bypass arrangement for 
flammable, pyrophoric, toxic, and corrosive gases.

Best,

Iulian

iulian Codreanu, Ph.D.
Director, Nanofabrication Facility
University of Delaware
Harker ISE Lab, Room 163
221 Academy Street
Newark, DE 19716
302-831-2784
http://udnf.udel.edu

On 1/23/2020 2:47 PM, Dennis Schweiger wrote:
> Kevin,
>
> good afternoon.? You have an interesting assortment?of technologies in 
> your gas box, micro-fit, and the older TB7 weld hardware. Since your 
> two "new" gases are relatively inert, I would pick the simplest 
> install to make them active.? Typically the bypass arrangement you see 
> on a couple of the channels is for when you need to remove the MFC, 
> and it's plugged.? If you were using a reactive?gas, the bypass gives 
> you a way to evacuate both ends of the MFC, making it "safe" to remove.
>
> DennisSchweiger
> University of Michigan/LNF
> Facilities
> 734.647.2055 Ofc
>
>
> On Thu, Jan 23, 2020 at 11:52 AM Kevin M McPeak <kmcpeak at lsu.edu 
> <mailto:kmcpeak at lsu.edu>> wrote:
>
>     Dear Colleagues,
>
>     Here at LSU, we want to add C4F8 and CHF3 gases to our Oxford
>     ICP100 system. The gas pod (see attached photo) currently has the
>     following gases plumbed from top to bottom: O2, N2, CF4, and SF6.
>     Notice, the current CF4 and SF6 lines have additional valves and
>     plumbing.
>
>     When I add the C4F8 and CHF3 do you recommend I plumb them like
>     the O2 and N2 gases (filter -> MFC -> valve) are or do I need to
>     add the additional valves and plumbing like the SF6 and CF8 lines
>     are? We can do either but the SF6/CF4 method is a lot more money
>     and time. This is an old gas pod, circa 1995 and Oxford has
>     limited information. and advice.
>
>     NOTE: The two output lines (top line and 3rd from top) from the
>     gas pod get merged at the tool before entering the instrument. I
>     am not sure why it was plumbed this way back in 1995.
>
>     Regards,
>     Kevin
>
>     --
>     Kevin M. McPeak
>     Assistant Professor | LSU Dept. of Chemical Engineering
>     225-578-0058 | mcpeaklab.com <http://mcpeaklab.com> |
>     lsu.edu/nanofabrication <http://lsu.edu/nanofabrication>
>
>     _______________________________________________
>     labnetwork mailing list
>     labnetwork at mtl.mit.edu <mailto:labnetwork at mtl.mit.edu>
>     https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork

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From fouad.karouta at anu.edu.au  Thu Jan 23 17:35:10 2020
From: fouad.karouta at anu.edu.au (Fouad Karouta)
Date: Thu, 23 Jan 2020 22:35:10 +0000
Subject: [labnetwork] Plumbing new gases in ICP-RIE gas pod
In-Reply-To: <af59bcdf1189405aab6b4ddc93188467@draper.com>
References: <CH2PR06MB66307CDF0F94C631781ECBF2B00F0@CH2PR06MB6630.namprd06.prod.outlook.com>
 <af59bcdf1189405aab6b4ddc93188467@draper.com>
Message-ID: <ME3P282MB1201581BEAC9C5C4A7F19C09C00F0@ME3P282MB1201.AUSP282.PROD.OUTLOOK.COM>

Hi Kevin,

I agree with previous comments about the bypass not required for CF4 and SF6 and hence not required for CHF3 and C4F8.

About C4F8 we had some flow issues ever and we ended up heating the line that solved the issue. Am not sure if this was related to a different cause but I thought to share the information here.

Best regards,
Fouad Karouta

*************************************
Manager ANFF ACT Node
Australian National Fabrication Facility
Research School of Physics
L. Huxley Building (#56), Mills Road, Room 4.02
Australian National University
ACT 2601, Canberra, Australia
Tel: + 61 2 6125 7174
Mob: + 61 451 046 412
Email: fouad.karouta at anu.edu.au
http://anff-act.anu.edu.au/

-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> On Behalf Of Morrison, Richard H., Jr
Sent: Friday, 24 January 2020 4:05 AM
To: Kevin M McPeak <kmcpeak at lsu.edu>; labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Plumbing new gases in ICP-RIE gas pod

Rick Morrison here from Draper, seems very curious that the CF4 and SF6 lines have a bypass and an input valve. Looks like this is a bypass to maybe vacuum pump the lines during gas bottle hookup or some other function. If that is what those are used for then I would plumb the new gas the same way.

What part of the manifold are you tying the new gases into looks like you have 2 slots open where the SF6 and CF4 lines are.

Rick


-----Original Message-----
From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Kevin M McPeak
Sent: Thursday, January 23, 2020 8:42 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Plumbing new gases in ICP-RIE gas pod

Dear Colleagues,

Here at LSU, we want to add C4F8 and CHF3 gases to our Oxford ICP100 system. The gas pod (see attached photo) currently has the following gases plumbed from top to bottom: O2, N2, CF4, and SF6. Notice, the current CF4 and SF6 lines have additional valves and plumbing.

When I add the C4F8 and CHF3 do you recommend I plumb them like the O2 and N2 gases (filter -> MFC -> valve) are or do I need to add the additional valves and plumbing like the SF6 and CF8 lines are? We can do either but the SF6/CF4 method is a lot more money and time. This is an old gas pod, circa 1995 and Oxford has limited information. and advice.

NOTE: The two output lines (top line and 3rd from top) from the gas pod get merged at the tool before entering the instrument. I am not sure why it was plumbed this way back in 1995.

Regards,
Kevin

--
Kevin M. McPeak
Assistant Professor | LSU Dept. of Chemical Engineering
225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication

________________________________
 Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email.
________________________________

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork


From yb2471 at columbia.edu  Mon Jan 27 16:13:37 2020
From: yb2471 at columbia.edu (Youry Borisenkov)
Date: Mon, 27 Jan 2020 16:13:37 -0500
Subject: [labnetwork] Savannah ALD GUI crash - empties the N2 cylinder
Message-ID: <CAGOt4s2RqR1EWd1+G6yoEEi5fTgRVcOSkMmx60U-KXqdQGozQQ@mail.gmail.com>

Dear All,
We are experiencing a strange fault with our savannah ALD.
It was hard to catch but, when the Lab View GUI crashes or friezes (this
happens every once in a while and the system is in Idle mode), it just sets
the Nitrogen purge MFC to the max open position and empties the N2 cylinder
unless we are fast to respond.
Did any of you had such a problem? If so, what was the solution?

-- 
Thanks and Best Regards,
Youry Borisenkov
Cleanroom Process Engineer
Columbia University
530 W 120th Street Room 1017
New York, NY 10027
*Columbia Nano Initiative | Cleanroom*
<http://cni.columbia.edu/columbia-university-clean-room>
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From hathaway at cns.fas.harvard.edu  Tue Jan 28 09:35:34 2020
From: hathaway at cns.fas.harvard.edu (Hathaway, Malcolm R)
Date: Tue, 28 Jan 2020 14:35:34 +0000
Subject: [labnetwork] Savannah ALD GUI crash - empties the N2 cylinder
In-Reply-To: <CAGOt4s2RqR1EWd1+G6yoEEi5fTgRVcOSkMmx60U-KXqdQGozQQ@mail.gmail.com>
References: <CAGOt4s2RqR1EWd1+G6yoEEi5fTgRVcOSkMmx60U-KXqdQGozQQ@mail.gmail.com>
Message-ID: <DM6PR07MB53230D0C30EB189FECD07B6DCB0A0@DM6PR07MB5323.namprd07.prod.outlook.com>

Hi Youry,

I have not come across that particular issue so far.  Typically, when the GUI freezes (USB errors in our case) my sense has been that everything stops in a "fail-safe" mode, i.e. heaters off, and everything else with them.

I have been dealing with a fault in our controller lately, wherein the MFC circuit does not enter "bypass" when venting, instead shutting off, and preventing venting.  This is a different issue, however, in that it is hardware related.  Yours sounds like it's control signal-related.  Perhaps a soft-ware reload?  Or update?  Which rev. of Savannah software do you have?


Mac
Harvard CNS
________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Youry Borisenkov <yb2471 at columbia.edu>
Sent: Monday, January 27, 2020 4:13 PM
To: labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Savannah ALD GUI crash - empties the N2 cylinder

Dear All,
We are experiencing a strange fault with our savannah ALD.
It was hard to catch but, when the Lab View GUI crashes or friezes (this happens every once in a while and the system is in Idle mode), it just sets the Nitrogen purge MFC to the max open position and empties the N2 cylinder unless we are fast to respond.
Did any of you had such a problem? If so, what was the solution?

--
Thanks and Best Regards,
Youry Borisenkov
Cleanroom Process Engineer
Columbia University
530 W 120th Street Room 1017
New York, NY 10027
Columbia Nano Initiative | Cleanroom<https://urldefense.proofpoint.com/v2/url?u=http-3A__cni.columbia.edu_columbia-2Duniversity-2Dclean-2Droom&d=DwMFaQ&c=WO-RGvefibhHBZq3fL85hQ&r=TEMLD8-VsxCGtcVzmvpT5GFNSczskEKHzW6aYlttmIY&m=m_0M5aEvuhPmDFEcFpwAUsH1CTe4zveQpyoppGDAcz4&s=RK1NDmOxYEyXG2eybL2Qpk2_W_6lMNLAqNPOt3ieCSM&e=>
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From jeanne.guo at rice.edu  Tue Jan 28 11:21:19 2020
From: jeanne.guo at rice.edu (Jing Guo)
Date: Tue, 28 Jan 2020 10:21:19 -0600
Subject: [labnetwork] FTO sputtering using AJA Orion system?
Message-ID: <B6F30602-3951-4446-A078-29B625D54CCB@rice.edu>

Hi All, 

We have a user target request to use our AJA Orion sputter system (7 targets). The target request is FTO, Fluorine Doped (20%) Tin Oxide. 
Does anyone have experience on this target sputtering process?
Is there any risk that FTO contaminates the muti-targets chamber or create potential damage of the system because of doped Fluorine?

Any information will be appreciated.

Thanks!

Best,

Jing

---------------------------------------
Jing Guo Ph.D.
Research Scientist
SEA Cleanroom (SST 017)
Rice University
Houston, TX 
jeanne.guo at rice.edu
713-348-8227







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From mhofheins at unm.edu  Tue Jan 28 11:47:17 2020
From: mhofheins at unm.edu (Mark Hofheins)
Date: Tue, 28 Jan 2020 16:47:17 +0000
Subject: [labnetwork] CEE 200CB model coater
Message-ID: <DM6PR07MB4329D4FA6FF36037FF336CE4A30A0@DM6PR07MB4329.namprd07.prod.outlook.com>

We are having problems with our program software. We are not getting screen options we need for operation.
Would anyone have the software that is applicable to this model? I really would rather re-load the software as opposed to send the whole tool to CEE for them to do it.
Best regards,


Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

Cell  505-710-3527

Office 505-272-7155



Micro Electronics Technician

Manufacturing Engineering Program

University of New Mexico MTTC

800 Bradbury S.E.  Suit 169

Albuquerque, New Mexico

87106-4346

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From edeguns at gmail.com  Tue Jan 28 13:10:54 2020
From: edeguns at gmail.com (Eric Deguns)
Date: Tue, 28 Jan 2020 13:10:54 -0500
Subject: [labnetwork] Savannah ALD GUI crash - empties the N2 cylinder
In-Reply-To: <CAGOt4s2RqR1EWd1+G6yoEEi5fTgRVcOSkMmx60U-KXqdQGozQQ@mail.gmail.com>
References: <CAGOt4s2RqR1EWd1+G6yoEEi5fTgRVcOSkMmx60U-KXqdQGozQQ@mail.gmail.com>
Message-ID: <CAAtdMmL8udUbry_8Sx54WrgV7uO34DWfpVERQNFAsnky09iFhg@mail.gmail.com>

Dear Youry,

I'm one of the original folks from Cambridge Nanotech.  I (along with the
rest of the Cambridge NanoTech ALD group) am/arewith Veeco and we are still
supporting these tools.

We haven't seen the situation you describe (with the MFC failing open) with
over 400 installed Savannahs.  Indeed the safety concepts for the system
are supposed to prevent this.  A few years back I recall that Columbia had
their MFC reworked/refurbished via a third party. I'm wondering if this is
the root cause of the situation that you describe - there is some subtle
differences between the vent/fast-vent of the MFCs.

Please feel free to contact me directly at edeguns at veeco.com or my
colleagues at ALDsupport at veeco.com and we can try and help you as best we
can.

Many thanks in advance,

Eric

On Mon, Jan 27, 2020 at 8:08 PM Youry Borisenkov <yb2471 at columbia.edu>
wrote:

> Dear All,
> We are experiencing a strange fault with our savannah ALD.
> It was hard to catch but, when the Lab View GUI crashes or friezes (this
> happens every once in a while and the system is in Idle mode), it just sets
> the Nitrogen purge MFC to the max open position and empties the N2 cylinder
> unless we are fast to respond.
> Did any of you had such a problem? If so, what was the solution?
>
> --
> Thanks and Best Regards,
> Youry Borisenkov
> Cleanroom Process Engineer
> Columbia University
> 530 W 120th Street Room 1017
> New York, NY 10027
> *Columbia Nano Initiative | Cleanroom*
> <http://cni.columbia.edu/columbia-university-clean-room>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From yb2471 at columbia.edu  Tue Jan 28 16:53:26 2020
From: yb2471 at columbia.edu (Youry Borisenkov)
Date: Tue, 28 Jan 2020 16:53:26 -0500
Subject: [labnetwork] Savannah ALD GUI crash - empties the N2 cylinder
In-Reply-To: <DM6PR07MB53230D0C30EB189FECD07B6DCB0A0@DM6PR07MB5323.namprd07.prod.outlook.com>
References: <CAGOt4s2RqR1EWd1+G6yoEEi5fTgRVcOSkMmx60U-KXqdQGozQQ@mail.gmail.com>
 <DM6PR07MB53230D0C30EB189FECD07B6DCB0A0@DM6PR07MB5323.namprd07.prod.outlook.com>
Message-ID: <CAGOt4s1N59bbe8Lvg2LcxNM=yfY+f5N9Ez6UhuECL=pfJEH6YQ@mail.gmail.com>

Hi Tony,
We are on LabView V8.0; and the Savannah ALD software is V18-24.vi
The situation I described, it indeed different.
As a matter of fact, I got a response from Veeco representative and I hope
he will be able to provide valuable input.

Thank you and have a great week!
Best regards,
Youry

On Tue, Jan 28, 2020 at 9:35 AM Hathaway, Malcolm R <
hathaway at cns.fas.harvard.edu> wrote:

> Hi Youry,
>
> I have not come across that particular issue so far.  Typically, when the
> GUI freezes (USB errors in our case) my sense has been that everything
> stops in a "fail-safe" mode, i.e. heaters off, and everything else with
> them.
>
> I have been dealing with a fault in our controller lately, wherein the MFC
> circuit does not enter "bypass" when venting, instead shutting off, and
> preventing venting.  This is a different issue, however, in that it is
> hardware related.  Yours sounds like it's control signal-related.  Perhaps
> a soft-ware reload?  Or update?  Which rev. of Savannah software do you
> have?
>
>
> Mac
> Harvard CNS
> ------------------------------
> *From:* labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu>
> on behalf of Youry Borisenkov <yb2471 at columbia.edu>
> *Sent:* Monday, January 27, 2020 4:13 PM
> *To:* labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
> *Subject:* [labnetwork] Savannah ALD GUI crash - empties the N2 cylinder
>
> Dear All,
> We are experiencing a strange fault with our savannah ALD.
> It was hard to catch but, when the Lab View GUI crashes or friezes (this
> happens every once in a while and the system is in Idle mode), it just sets
> the Nitrogen purge MFC to the max open position and empties the N2 cylinder
> unless we are fast to respond.
> Did any of you had such a problem? If so, what was the solution?
>
> --
> Thanks and Best Regards,
> Youry Borisenkov
> Cleanroom Process Engineer
> Columbia University
> 530 W 120th Street Room 1017
> New York, NY 10027
> *Columbia Nano Initiative | Cleanroom
> <https://urldefense.proofpoint.com/v2/url?u=http-3A__cni.columbia.edu_columbia-2Duniversity-2Dclean-2Droom&d=DwMFaQ&c=WO-RGvefibhHBZq3fL85hQ&r=TEMLD8-VsxCGtcVzmvpT5GFNSczskEKHzW6aYlttmIY&m=m_0M5aEvuhPmDFEcFpwAUsH1CTe4zveQpyoppGDAcz4&s=RK1NDmOxYEyXG2eybL2Qpk2_W_6lMNLAqNPOt3ieCSM&e=>*
>
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From cekendri at mtu.edu  Thu Jan 30 11:24:50 2020
From: cekendri at mtu.edu (Chito Kendrick)
Date: Thu, 30 Jan 2020 11:24:50 -0500
Subject: [labnetwork] EV620 not initializing
Message-ID: <CAAy7OCG3ay=543PwPmKjrcp_LPkf6_mw2vD-jOU6gjB9xzuubA@mail.gmail.com>

We have a EV620 Aligner at MTU and this tuesday it did not complete the
initialization process after logging in, all reboots and attempts have
failed. We have software version 2.64 and we are still running a Win98
system. I am talking to EVG about this problem to get a solution, but being
an older system and software version they are still working on it.
Therefore I was hoping this community might have faced this issue and have
some advice.

After typing in the password and hitting run the system starts
initialization. It moves the optical head, mask stage, WEC, and then gives
a double beep - all of this is normal. Instead of bringing up the recipes
it has ERROR and look at the log. The log has as the last entry - "Check
distance measurement !". All menus are greyed out so I can not access any
other part of the software.

Regards,

Chito Kendrick



-- 
Chito Kendrick Ph.D. <https://sites.google.com/site/chitokendrickphd/>

Managing Director of the Microfabrication Facility
Research Assistant Professor
Electrical and Computer Engineering
Michigan Technological University
Room 436 M&M Building
1400 Townsend Dr.
Houghton, Michigan 49931-1295

814-308-4255
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From vamsinittala at gmail.com  Thu Jan 30 13:23:37 2020
From: vamsinittala at gmail.com (N P VAMSI KRISHNA)
Date: Thu, 30 Jan 2020 12:23:37 -0600
Subject: [labnetwork] EV620 not initializing
In-Reply-To: <CAAy7OCG3ay=543PwPmKjrcp_LPkf6_mw2vD-jOU6gjB9xzuubA@mail.gmail.com>
References: <CAAy7OCG3ay=543PwPmKjrcp_LPkf6_mw2vD-jOU6gjB9xzuubA@mail.gmail.com>
Message-ID: <CA+SWD1VKOFAiNws-dFi+p-B1SQx2dcv=1NC298caSssHyDCUQg@mail.gmail.com>

Dear Chito,
I saw this kind of error in my previous workplace during a couple of
instances. Like, sudden power failure, someone pressed EMO and CPU power
unplugged accidentally. I believe this problem is due to not shutting down
the operating system properly.
EVG guys logged into our machine through online and created a key. They
have a random key generation method which is associated with the windows 98
OS.
In another instance, there was a problem with the stage sensor as well.

Hope this helps.

Best regards,
Vamsi


On Thu, Jan 30, 2020 at 11:53 AM Chito Kendrick <cekendri at mtu.edu> wrote:

> We have a EV620 Aligner at MTU and this tuesday it did not complete the
> initialization process after logging in, all reboots and attempts have
> failed. We have software version 2.64 and we are still running a Win98
> system. I am talking to EVG about this problem to get a solution, but being
> an older system and software version they are still working on it.
> Therefore I was hoping this community might have faced this issue and have
> some advice.
>
> After typing in the password and hitting run the system starts
> initialization. It moves the optical head, mask stage, WEC, and then gives
> a double beep - all of this is normal. Instead of bringing up the recipes
> it has ERROR and look at the log. The log has as the last entry - "Check
> distance measurement !". All menus are greyed out so I can not access any
> other part of the software.
>
> Regards,
>
> Chito Kendrick
>
>
>
> --
> Chito Kendrick Ph.D. <https://sites.google.com/site/chitokendrickphd/>
>
> Managing Director of the Microfabrication Facility
> Research Assistant Professor
> Electrical and Computer Engineering
> Michigan Technological University
> Room 436 M&M Building
> 1400 Townsend Dr.
> Houghton, Michigan 49931-1295
>
> 814-308-4255
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>


-- 

___________________________________________________

N.P.  Vamsi Krishna, PhD

Postdoctoral Fellow

Pritzker School of Molecular Engineering, *The University of Chicago *

Center for Nanoscale Materials, *Argonne National Laboratory *

Phone: 1 (331) 757-8565
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From mheiden at engr.ucr.edu  Thu Jan 30 13:29:56 2020
From: mheiden at engr.ucr.edu (Mark Heiden)
Date: Thu, 30 Jan 2020 18:29:56 +0000
Subject: [labnetwork] Older Unaxis 790 PECVD Service
Message-ID: <b699e9f549e74af6adf23621e7840c41@engr.ucr.edu>

We have a vintage 2005 or so Unaxis 790 PECVD that has come up with an error "Disk Scan Error"  There is a problem with your display settings. The adapter type is incorrect.

Does anyone have experience with this or know of a vendor that can repair this age Unaxis tools?

Thanks in advance,


Mark Heiden
NanoFab Cleanroom Manager
University of California, Riverside
951-827-2551
https://nanofab.ucr.edu/


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From hit.kamble at gmail.com  Thu Jan 30 14:41:41 2020
From: hit.kamble at gmail.com (Hitesh Kamble)
Date: Fri, 31 Jan 2020 01:11:41 +0530
Subject: [labnetwork] EV620 not initializing
In-Reply-To: <CAAy7OCG3ay=543PwPmKjrcp_LPkf6_mw2vD-jOU6gjB9xzuubA@mail.gmail.com>
References: <CAAy7OCG3ay=543PwPmKjrcp_LPkf6_mw2vD-jOU6gjB9xzuubA@mail.gmail.com>
Message-ID: <CANpP3DTmnwTvZ5NiPOX66ZS4WyD041kqW3sYNtsvadWKWTgqgg@mail.gmail.com>

Hello Chito,

What i understood from your description is optics initialise, cover down
but it doesn't reach to upper position? And gives initialisation error at
"UC04:*" ?

This is related to Way measurements system which is combination of Z-motor
control and hardware settings.

To identify issue>> access software in service mode: At login window, enter
id password and click 3 times on EVG logo. You'll bypass initialisation and
can access tool in High-level mode. There try to operate cover up/down. If
this function does not work then try below troubleshooting.


Checks1 : Open electronic box where you will see Z-motor controller. It
should not be "F" on 7-segment display. If yes battery could have drained
completely or firmware lost.
Solution: Replace battery and install firmware again.

Checks 2: There is a limiting screw in the Top side of the cover.It?s a M10
Nut screw near the center of the cover when you look onto the cover.

When this screw is loosen, the cover can?t reach it?s upper position for
initialization.





Thanks,
Hitesh Kamble,
CEN, IIT Bombay, India.



On Thu, Jan 30, 2020, 11:17 PM Chito Kendrick <cekendri at mtu.edu> wrote:

> We have a EV620 Aligner at MTU and this tuesday it did not complete the
> initialization process after logging in, all reboots and attempts have
> failed. We have software version 2.64 and we are still running a Win98
> system. I am talking to EVG about this problem to get a solution, but being
> an older system and software version they are still working on it.
> Therefore I was hoping this community might have faced this issue and have
> some advice.
>
> After typing in the password and hitting run the system starts
> initialization. It moves the optical head, mask stage, WEC, and then gives
> a double beep - all of this is normal. Instead of bringing up the recipes
> it has ERROR and look at the log. The log has as the last entry - "Check
> distance measurement !". All menus are greyed out so I can not access any
> other part of the software.
>
> Regards,
>
> Chito Kendrick
>
>
>
> --
> Chito Kendrick Ph.D. <https://sites.google.com/site/chitokendrickphd/>
>
> Managing Director of the Microfabrication Facility
> Research Assistant Professor
> Electrical and Computer Engineering
> Michigan Technological University
> Room 436 M&M Building
> 1400 Townsend Dr.
> Houghton, Michigan 49931-1295
>
> 814-308-4255
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
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From mark.chiappa at ntnu.no  Fri Jan 31 04:18:30 2020
From: mark.chiappa at ntnu.no (Mark Chiappa)
Date: Fri, 31 Jan 2020 09:18:30 +0000
Subject: [labnetwork] EV620 not initializing
In-Reply-To: <CANpP3DTmnwTvZ5NiPOX66ZS4WyD041kqW3sYNtsvadWKWTgqgg@mail.gmail.com>
References: <CAAy7OCG3ay=543PwPmKjrcp_LPkf6_mw2vD-jOU6gjB9xzuubA@mail.gmail.com>
 <CANpP3DTmnwTvZ5NiPOX66ZS4WyD041kqW3sYNtsvadWKWTgqgg@mail.gmail.com>
Message-ID: <8D8E4F3E-11B9-4538-A17B-5DD2F52BDD58@ntnu.no>

Hi Chito,

I agree with Hitesh.  I?ve had similar issues in the past with my own 620 (similar vintage running Wn98) and in both instances is was the battery on the motor controllers.

Best of luck
Kind regards
Mark

From: <labnetwork-bounces at mtl.mit.edu> on behalf of Hitesh Kamble <hit.kamble at gmail.com>
Date: Thursday, 30 January 2020 at 21:49
To: Chito Kendrick <cekendri at mtu.edu>
Cc: "labnetwork at mtl.mit.edu" <labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] EV620 not initializing

Hello Chito,

What i understood from your description is optics initialise, cover down but it doesn't reach to upper position? And gives initialisation error at "UC04:*" ?

This is related to Way measurements system which is combination of Z-motor control and hardware settings.

To identify issue>> access software in service mode: At login window, enter id password and click 3 times on EVG logo. You'll bypass initialisation and can access tool in High-level mode. There try to operate cover up/down. If this function does not work then try below troubleshooting.


Checks1 : Open electronic box where you will see Z-motor controller. It should not be "F" on 7-segment display. If yes battery could have drained completely or firmware lost.
Solution: Replace battery and install firmware again.


Checks 2: There is a limiting screw in the Top side of the cover.It?s a M10 Nut screw near the center of the cover when you look onto the cover.

When this screw is loosen, the cover can?t reach it?s upper position for initialization.





Thanks,
Hitesh Kamble,
CEN, IIT Bombay, India.


On Thu, Jan 30, 2020, 11:17 PM Chito Kendrick <cekendri at mtu.edu<mailto:cekendri at mtu.edu>> wrote:
We have a EV620 Aligner at MTU and this tuesday it did not complete the initialization process after logging in, all reboots and attempts have failed. We have software version 2.64 and we are still running a Win98 system. I am talking to EVG about this problem to get a solution, but being an older system and software version they are still working on it. Therefore I was hoping this community might have faced this issue and have some advice.

After typing in the password and hitting run the system starts initialization. It moves the optical head, mask stage, WEC, and then gives a double beep - all of this is normal. Instead of bringing up the recipes it has ERROR and look at the log. The log has as the last entry - "Check distance measurement !". All menus are greyed out so I can not access any other part of the software.

Regards,

Chito Kendrick



--
Chito Kendrick Ph.D.<https://sites.google.com/site/chitokendrickphd/>

Managing Director of the Microfabrication Facility
Research Assistant Professor
Electrical and Computer Engineering
Michigan Technological University
Room 436 M&M Building
1400 Townsend Dr.
Houghton, Michigan 49931-1295

814-308-4255<tel:814-308-4255>
_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
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From sb86922 at usc.edu  Fri Jan 31 09:01:46 2020
From: sb86922 at usc.edu (Shivakumar Bhaskaran)
Date: Fri, 31 Jan 2020 14:01:46 +0000
Subject: [labnetwork] Job Opening - Lab Operation Engineer at University of
 Southern California
Message-ID: <BYAPR07MB605327B22EDB2A086C33D591E3040@BYAPR07MB6053.namprd07.prod.outlook.com>

Dear LabNetwork members,

The USC Viterbi School of Engineering in Los Angeles is looking for Lab Operation Engineer to work at our new cleanroom John D. O Brien Nanofabrication Laboratory. Please forward to anyone interested

Job Description:

We are looking for a highly-motivatedLab Operation Engineer. Reporting to the Associate Director, this individual will support the cleanroom users with training, developing nanofabrication process and collaborate with facility staff and research users to identify tool operation issues and address those issues promptly with proper maintenance, repair, and troubleshooting. The ideal candidate should be customer service oriented and contribute towards improving the operation of the facility.

Please see the link for more information.

  *   https://usccareers.usc.edu/job/los-angeles/nanofabrication-lab-operation-engineer/1209/15068243
  *   Requisition ID: REQ20084972
Job Title: Nanofabrication Lab Operation Engineer

Best Regards,
Shiva

Shivakumar Bhaskaran, Ph.D.,
Associate Director,
John D. O?Brien Nanofabrication Laboratory
Michelson Hall, 1002 Childs Way, MCB LL121,
Los Angeles, California 90089, 213 821 2374
[Sign]

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From bob.henderson at etchedintimeinc.com  Fri Jan 31 14:16:31 2020
From: bob.henderson at etchedintimeinc.com (bob.henderson at etchedintimeinc.com)
Date: Fri, 31 Jan 2020 12:16:31 -0700
Subject: [labnetwork] Wafer fabrication capability expanding to industry
	users
Message-ID: <001501d5d86a$f27f4e20$d77dea60$@etchedintimeinc.com>

Arizona State University is now partnering with industry users as well as
academic users to make wafer and panel processing available for a variety of
MEMS and other projects that require prototype or other R&D type
fabrication. For additional details and available equipment sets you can
contact me offline. Bob Henderson

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From derose at caltech.edu  Fri Jan 31 15:05:43 2020
From: derose at caltech.edu (DeRose, Guy A.)
Date: Fri, 31 Jan 2020 20:05:43 +0000
Subject: [labnetwork] Laboratory Technician position at California Institute
	of Technology
In-Reply-To: <A87D315D-79AF-4922-9277-4D73A6FC3F14@caltech.edu>
References: <BAD17DB1-0C95-49CB-B8E6-FEB8E934B994@contoso.com>
 <A87D315D-79AF-4922-9277-4D73A6FC3F14@caltech.edu>
Message-ID: <B58A54FF-16AB-4C12-B21A-4B74874EF859@caltech.edu>

Hello Labnetwork colleagues:

The Kavli Nanoscience Institute at The California Institute of Technology (Caltech) is looking to expand our technical staff, and we are planning to hire a laboratory technician.  The position is full-time exempt (salary), and we are looking to fill asap.  Check out the detailed posting, below, and/or pass along to others who you think might be interested. For more details about the Kavli Nanoscience Institute laboratory, see our wiki<https://lab.kni.caltech.edu/index.php/The_Kavli_Nanoscience_Institute_Laboratory_at_Caltech>. If the link doesn?t work, the address is https://lab.kni.caltech.edu.

Title: Laboratory Technician
Company: Caltech
Click the link below to see the details of the position:
https://chm.tbe.taleo.net/chm03/ats/careers/requisition.jsp?org=CALTECH&cws=37&rid=5147

Job Summary
The Kavli Nanoscience Institute (KNI) is seeking a Laboratory Technician to assist in the day-to-day technical maintenance operations of its 7,500 sq. ft. cleanroom facility and affiliated lab spaces on the Caltech campus. The Laboratory Technician will assist the lab?s technical staff in the upkeep and repair of state-of-the-art nanofabrication equipment (e.g. material etching and deposition systems, lithographic tools, and electron microscopes) by servicing vacuum systems, mechanical components, and other laboratory infrastructure such as the electrical, gas, and water lines that connect to the equipment. When repairs are needed, the successful applicant will be able to combine problem solving skills with mechanical and electrical knowhow to return equipment to optimal working order, then document the solutions to make future repairs more efficient. The Laboratory Technician will also establish effective test protocols and preventative maintenance plans that minimize the chance of equipment failure, thereby maximizing its uptime for the KNI Lab?s 100+ researchers. The Laboratory Technician will have the opportunity to learn basic operation of advanced equipment so that he/she may run common maintenance routines, and will assume primary responsibility for certain tools (e.g. wire bonder, tube furnaces), which will include training lab members ? graduate students, post-docs, and industrial users ? to operate them.
Job Duties
? Administer preventative maintenance and repairs of equipment (e.g. material etching and deposition systems, lithographic tools, electron microscopes) to ensure proper working conditions, and coordinate maintenance and repairs done by external entities (e.g. vendors, Caltech facilities workers) when needed.
? Create, update, and maintain equipment troubleshooting documents for use by both lab members and other KNI technical staff.
? Assist in reviewing, revising, and implementing quality control practices, such as lab walkthrough checklists.
? Create standard operating procedures for lab equipment for which the Laboratory Technician is the primary manager (e.g. wire bonder, tube furnaces).
? Assist KNI technical staff with the day-to-day, routine operations of various pieces of equipment in the lab.
? Communicate progress and problems to supervisors via email/phone, in meetings, and in reports, depending on the urgency and scope.
? In response to new technical challenges, research and reference ? and then implement ? established scientific/technical practices, standards, and/or policies.
? Contribute to the planning, installation, and commissioning of new equipment in the laboratory, then establish operational protocols and maintenance plans for such equipment.
? Help to maintain, upgrade, and back up computer systems in the lab (e.g. computers for individual instruments, login terminals, and new computer networking projects).
? Participate in the discussion of laboratory protocols and objectives with other staff members.
? Maintain awareness of laws and regulations affecting the management of the laboratory; ensure compliance with Institute policies, scientific protocols, regulatory agencies, and safety practices.
? Assist in the maintenance of stock levels/inventory of lab supplies such as solvents, wet etchants, personal protective equipment, and other general supplies, as needed. May assist in the purchase of equipment and supplies, contact vendors, conduct product comparisons or assist in forecasting/planning future equipment and resource needs.
? Promote lab safety by assisting the KNI safety officer in the training of lab members on safety procedures and communicating with the campus safety office; document and communicate laboratory and facility safety procedures.
Basic Qualifications
? Bachelor?s degree in engineering or sciences or equivalent education and experience.
? At least 4 years of relevant experience in equipment maintenance, repair, installation, and/or the fabrication industry.
? A high level of craftsmanship and a thorough knowledge of mechanical design, materials, tools, units, and basic measurement techniques.
? Attention to detail and excellent problem-solving and debugging skills.
? An ability to learn quickly and adequately transfer that knowledge to others through teaching/documentation.
? Ability to work independently and with a high level of responsibility and organization.
? Teamwork skills and an ability to collaborate with coworkers who have diverse skills and backgrounds.
? Strong communication skills.
? Must be able to work evenings and weekends as needed; though flexible working hours may be available.
? Must be able to work in a cleanroom setting, following all established protocols for gowning and safety.
? Must be able to occasionally lift 20-50 lbs.
Preferred Qualifications
? Proficiency with the following software: Word, Excel, Outlook, and PowerPoint.
? Basic computer maintenance and troubleshooting skills, e.g. new hardware installs, networking, performing hard drive back ups.
Required Documents
? Resume

All the best,

Guy DeRose, PhD, Member of the Professional Staff
Associate Director of Technical Operations, Kavli Nanoscience Institute
California Institute of Technology, Pasadena, CA USA
(O) 1-626-395-3423 (M) 1-626-676-8529
http://kni.caltech.edu
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From somenath.mitra at njit.edu  Fri Jan 31 15:40:34 2020
From: somenath.mitra at njit.edu (Mitra, Somenath)
Date: Fri, 31 Jan 2020 15:40:34 -0500
Subject: [labnetwork] please post
Message-ID: <CAC0t7YvU7CCNujnPTmHJ5PuAiu5fiwPpmzY1kFL8geTHP=9HsA@mail.gmail.com>

Please post the following
------------------------------------------


*Associate Director of Material Characterization and Microfabrication at
New Jersey Institute of Technology*



The Material Characterization Laboratory (MCL) and Microfabrication Center
(MFC) at the New Jersey Institute of Technology (NJIT) invites applications
for the positions of  Associate Director at their core facilities. The MCL
core facilities comprise of extensive laboratories in Electron Microscopy,
Optical Spectroscopy, and Chemical/Environmental Analysis (
http://centers.njit.edu/york/index.php). The newly built Microfabrication
laboratory comprises of Class 100 clean room, Photo Lithography equipment
and Microfluidic facility. The Associate Director will oversee the day to
day operations of the core facilities at MCL and MFC, and will interface
with industry and academia to market MCL/MFC services to generate revenue.



Minimum qualifications are a Ph.D. from an accredited institution in
relevant field such as chemistry, chemical engineering, physics, material
science, electrical engineering or a closely related field. The successful
candidates are expected to work with faculty, students and research staff
 to facilitate funded research, provide instrument training, and work with
industrial clients to generate revenue.



Inquiries can be sent to Prof. Mitra at mitra at njit.edu.


-------------------------------------------------------------------------
*Somenath Mitra*
Exec. Director
Otto York Center for Environmental Engineering and Science
http://centers.njit.edu/york/index.php

Distinguished Professor of  Chemistry and Environmental Science
New Jersey Institute of Technology
(973)596 5611
http://centers.njit.edu/separationscience/welcome/
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