From grallion at ncsu.edu Wed Jul 1 10:50:01 2020 From: grallion at ncsu.edu (Greg Allion) Date: Wed, 1 Jul 2020 10:50:01 -0400 Subject: [labnetwork] virtual wide bandgap short course Message-ID: Hi all, Please see below for info and the attached flier. The course is free. The NC State Nanofabrication Facility (NNF) and Analytical Instrumentation Facility (AIF) are pleased to offer a virtual three-day short course which will explore the science and technology underpinning wide bandgap (specifically, GaN and SiC) power devices. This short course will be an avenue to develop critical skills for wide bandgap (WBG) device manufacturers and researchers, particularly in the area of power applications. The short course will include lectures on the fundamentals of WBG power devices; overviews and demonstrations of WBG power device fabrication, characterization, and packaging; panel discussions surrounding future applications and challenges; and a keynote seminar by NC State Distinguished Professor Jay Baliga, an internationally-recognized expert on power semiconductor devices. To learn more about the course and see the schedule visit the event page here: https://go.ncsu.edu/wbg_june To register for the short course please visit the registration page here: https://go.ncsu.edu/wbg_register If you have any issues with the hyperlinks, let me know. Best, Greg -- Greg Allion NC State University Nanofabrication Facility (NNF) Lithography Engineer -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: PowerAmerica short course flier virtual.pdf Type: application/pdf Size: 534971 bytes Desc: not available URL: From kmcpeak at lsu.edu Sun Jul 5 18:51:39 2020 From: kmcpeak at lsu.edu (Kevin M McPeak) Date: Sun, 5 Jul 2020 22:51:39 +0000 Subject: [labnetwork] Thoughts on a DAD522 Dicing Saw Message-ID: Dear Colleagues, The LSU nanofabrication facility is interested in purchasing a dicing saw. Our community would be dicing silicon, glass, and quartz wafers (to the best of my knowledge). We are currently considering buying a refurbished Disco DAD522 tool. It seems like a lot of university facilities own a DAD321. The 522 has comparable specs to the 321 but with a larger footprint. I welcome your input on the DAD522 model or more general advice on purchasing a refurbished dicing saw. Thank you. Regards, Kevin -- Kevin M. McPeak Assistant Professor | LSU Dept. of Chemical Engineering 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication From J_Hagopian at comcast.net Fri Jul 10 12:06:22 2020 From: J_Hagopian at comcast.net (John Hagopian) Date: Fri, 10 Jul 2020 12:06:22 -0400 Subject: [labnetwork] Looking for collaborative partners Message-ID: <29552964-54C5-4E87-BBB2-C8F603C70A24@comcast.net> Need access to following equipment and processes in case our access is limited due to pandemic 1. Heidelburg laser writer, developing and lift off 2. Sputtering capability for iron, inconel, AlOx (3? targets, 6? platen) Let me know of availability of personnel and equipment John H. From hang.chen at ien.gatech.edu Fri Jul 10 16:51:45 2020 From: hang.chen at ien.gatech.edu (Chen, Hang) Date: Fri, 10 Jul 2020 20:51:45 +0000 Subject: [labnetwork] Looking for collaborative partners In-Reply-To: <29552964-54C5-4E87-BBB2-C8F603C70A24@comcast.net> References: <29552964-54C5-4E87-BBB2-C8F603C70A24@comcast.net> Message-ID: Hi, John This is Hang Chen from Georgia Tech. We do have the Heidelberg laser writer and the various sputtering capability. Can you let me know more details of your need? Hang Get Outlook for iOS ________________________________ From: labnetwork-bounces at mtl.mit.edu on behalf of John Hagopian Sent: Friday, July 10, 2020 12:06:22 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Looking for collaborative partners Need access to following equipment and processes in case our access is limited due to pandemic 1. Heidelburg laser writer, developing and lift off 2. Sputtering capability for iron, inconel, AlOx (3? targets, 6? platen) Let me know of availability of personnel and equipment John H. _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From scholvin at mit.edu Mon Jul 13 11:02:05 2020 From: scholvin at mit.edu (Jorg Scholvin) Date: Mon, 13 Jul 2020 15:02:05 +0000 Subject: [labnetwork] Looking for PECVD TEOS capability Message-ID: <36a307e0cdee4df9ac83f8eb27c66fc5@oc11expo12.exchange.mit.edu> Hi Labnetwork: We have a small group of users who are in need of periodic PECVD TEOS deposition (400C or below), on pieces or up to 6" wafers. Our PECVD TEOS tool has not been as reliable as we like, and it would be great to offer our users an alternative during tool downtime. If you have PECVD TEOS capabilities, and are able to process samples on behalf of outside users (shipping back and forth), please let me know - we'd be delighted. If preferred we can also facilitate the interactions so you'd only have to deal with one point of contact (for instructions, shipping, billing etc). Thanks! -Jorg -------------- next part -------------- An HTML attachment was scrubbed... URL: From Thomas_Ferraguto at uml.edu Mon Jul 13 09:59:20 2020 From: Thomas_Ferraguto at uml.edu (Ferraguto, Thomas S) Date: Mon, 13 Jul 2020 13:59:20 +0000 Subject: [labnetwork] Looking for collaborative partners In-Reply-To: <29552964-54C5-4E87-BBB2-C8F603C70A24@comcast.net> References: <29552964-54C5-4E87-BBB2-C8F603C70A24@comcast.net> Message-ID: <9534ab9d9ea54eaaa517d81389920578@uml.edu> We have a micropg 101 and 2 sputtering tools. (both with Load Locks (AJA and Lesker) We've done direct write Image reversal for lift off. Give me a call... Thomas S. Ferraguto Saab ETIC Nanofabrication Laboratory Director Saab ETIC Building Director 1 University Avenue Lowell MA 01854 Mobile 617-755-0910 Land 978-934-1809 Fax 978-934-1014 -----Original Message----- From: labnetwork-bounces at mtl.mit.edu On Behalf Of John Hagopian Sent: Friday, July 10, 2020 12:06 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Looking for collaborative partners This e-mail originated from outside the UMass Lowell network. ---------------------------------------------------------------------- Need access to following equipment and processes in case our access is limited due to pandemic 1. Heidelburg laser writer, developing and lift off 2. Sputtering capability for iron, inconel, AlOx (3? targets, 6? platen) Let me know of availability of personnel and equipment John H. _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- A non-text attachment was scrubbed... Name: NFL video.mp4 Type: video/mp4 Size: 7417635 bytes Desc: NFL video.mp4 URL: From julia.aebersold at louisville.edu Mon Jul 13 10:58:30 2020 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Mon, 13 Jul 2020 14:58:30 +0000 Subject: [labnetwork] Looking for collaborative partners In-Reply-To: <29552964-54C5-4E87-BBB2-C8F603C70A24@comcast.net> References: <29552964-54C5-4E87-BBB2-C8F603C70A24@comcast.net> Message-ID: Hello John. We have the capabilities you mention. They are: Heidelberg DWL 66FS UV laser patterning system Lesker PVD 75 three source tool Sputtering Targets http://louisville.edu/micronano/files/documents/characterization-data/Available_deposition_materials.pdf We do not have the Inconel target. Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville Shumaker Research Building, Room 233 2210 South Brook Street Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ -----Original Message----- From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of John Hagopian Sent: Friday, July 10, 2020 12:06 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Looking for collaborative partners CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. Need access to following equipment and processes in case our access is limited due to pandemic 1. Heidelburg laser writer, developing and lift off 2. Sputtering capability for iron, inconel, AlOx (3? targets, 6? platen) Let me know of availability of personnel and equipment John H. _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://nam03.safelinks.protection.outlook.com/?url=https%3A%2F%2Fmtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork&data=02%7C01%7Cjulia.aebersold%40louisville.edu%7C493827ff99624ca2165a08d8250c5497%7Cdd246e4a54344e158ae391ad9797b209%7C0%7C0%7C637300082181947050&sdata=1GRahcc97PASEgyw2Iy%2BlM%2FVAkeUKOhpT2pf6kOVuKM%3D&reserved=0 From julia.aebersold at louisville.edu Mon Jul 13 13:19:19 2020 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Mon, 13 Jul 2020 17:19:19 +0000 Subject: [labnetwork] Looking for PECVD TEOS capability In-Reply-To: <36a307e0cdee4df9ac83f8eb27c66fc5@oc11expo12.exchange.mit.edu> References: <36a307e0cdee4df9ac83f8eb27c66fc5@oc11expo12.exchange.mit.edu> Message-ID: Jorg, our Oxford PECVD has TEOS capabilities and we work with external clients all the time. We'd be glad to assist you with this process. Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville Shumaker Research Building, Room 233 2210 South Brook Street Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Jorg Scholvin Sent: Monday, July 13, 2020 11:02 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Looking for PECVD TEOS capability CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. Hi Labnetwork: We have a small group of users who are in need of periodic PECVD TEOS deposition (400C or below), on pieces or up to 6" wafers. Our PECVD TEOS tool has not been as reliable as we like, and it would be great to offer our users an alternative during tool downtime. If you have PECVD TEOS capabilities, and are able to process samples on behalf of outside users (shipping back and forth), please let me know - we'd be delighted. If preferred we can also facilitate the interactions so you'd only have to deal with one point of contact (for instructions, shipping, billing etc). Thanks! -Jorg -------------- next part -------------- An HTML attachment was scrubbed... URL: From lvchang at Central.UH.EDU Mon Jul 13 17:36:56 2020 From: lvchang at Central.UH.EDU (Chang, Long) Date: Mon, 13 Jul 2020 21:36:56 +0000 Subject: [labnetwork] Mask Aligner Reflector Scratches Message-ID: Hi All, Last week our mask aligner lamp exploded because the cooling fan failed. After cleaning up, I noticed some scratches on the reflector. It?s really hard to take a photo of it, but see attached. Has anyone used a scratched reflector with experiences to share? Thanks, Long [cid:CBC1F355-6E64-4E0C-8FC5-E3C78BB85068 at serc.dhcp.e.uh.edu][cid:8D1CF2CC-B2E5-444A-B3E9-9C77A655F654 at serc.dhcp.e.uh.edu] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Screen Shot 2020-07-13 at 4.30.58 PM.png Type: image/png Size: 470840 bytes Desc: Screen Shot 2020-07-13 at 4.30.58 PM.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Screen Shot 2020-07-13 at 4.30.51 PM.png Type: image/png Size: 422102 bytes Desc: Screen Shot 2020-07-13 at 4.30.51 PM.png URL: From thejohnnicholson at gmail.com Tue Jul 14 09:17:13 2020 From: thejohnnicholson at gmail.com (John Nicholson) Date: Tue, 14 Jul 2020 09:17:13 -0400 Subject: [labnetwork] UMass/Amherst Roll to Roll Fab Technician Position Opening Message-ID: This position is for an equipment technician in a class 10,000 R2R facility (https://www.umass.edu/ials/roll-to-roll-fabrication). All inquiries should be directed to the UMass Human Resources Department: https://www.umass.edu/ials/roll-to-roll-fabrication Best, -- John Nicholson Nanofabrication Laboratory Manager Silvio O. Conte Center for Polymer Research, Rm. B111 University of Massachusetts Amherst 120 Governor's Drive Amherst,MA 01003-9305 -------------- next part -------------- An HTML attachment was scrubbed... URL: From cecil at anl.gov Tue Jul 14 12:02:24 2020 From: cecil at anl.gov (Cecil, Thomas W.) Date: Tue, 14 Jul 2020 16:02:24 +0000 Subject: [labnetwork] Cleanroom manager position - Argonne National Lab Message-ID: <43BEFF52-34B3-4567-96A4-9F8A6D67AF8D@anl.gov> Hi Everyone, I?d like to draw your attention to the open position for a cleanroom manager at Argonne. Please share with anyone that might be interested. Link below for more details and to apply. https://careers.peopleclick.com/careerscp/client_argonnelab/external/gateway.do?functionName=viewFromLink&jobPostId=9281&localeCode=en-us Best, Tom ----------------------------------------- Thomas Cecil, Ph.D. Argonne National Laboratory cecil at anl.gov 630-252-9775 -------------- next part -------------- An HTML attachment was scrubbed... URL: From rmorrison at draper.com Wed Jul 15 10:02:25 2020 From: rmorrison at draper.com (Morrison, Richard H., Jr) Date: Wed, 15 Jul 2020 14:02:25 +0000 Subject: [labnetwork] resist suppliers Message-ID: HI everyone, Looking for a list of suppliers of 193nm immersion resist, anybody have this info? Rick Richard H. Morrison Principal Member of the Technical Staff Draper 555 Technology Square Cambridge, MA 02139-3573 Work 617-258-3420 Cell 508-930-3461 www.draper.com ________________________________ Notice: This email and any attachments may contain proprietary (Draper non-public) and/or export-controlled information of Draper. If you are not the intended recipient of this email, please immediately notify the sender by replying to this email and immediately destroy all copies of this email. ________________________________ -------------- next part -------------- An HTML attachment was scrubbed... URL: From price.798 at osu.edu Wed Jul 15 15:47:25 2020 From: price.798 at osu.edu (Price, Aimee) Date: Wed, 15 Jul 2020 19:47:25 +0000 Subject: [labnetwork] MAEBL meeting series announcement Message-ID: Lab Network Community, MAEBL 2020 (Meeting for Advanced Ebeam Lithography) is going virtual. Since we cannot gather at Caltech as planned, we have a new format for this year with monthly webinars. We will host the first webinar on 7/23 along with a common topics session focusing on EBL in the time of COVID-19. This meeting is meant to be an information sharing, networking, and community building event for electron beam lithography tool owners and users. If you have any questions about the meeting or MAEBL in general, please reach out to me. We're excited to share that MAEBL 2020 is returning as a webinar series. Register to attend all 6 webinars that will occur once a month through December 2020. The first webinar takes place on Thursday, July 23, 2020, from 3 PM to 5 PM EDT. We hope that you and/or your team can join the MAEBL community. Register at www.maebl.org. We're happy to answer any questions you might have. Best, Aimee, Kevin and Gerald -- Aimee Price Co-Founder and President Kevin Lister, Ph.D. Co-Founder and Vice President Gerald G. Lopez, Ph.D. Co-Founder and Board Chair Register at www.maebl.org Sr. Research Associate The Ohio State University Nanotech West Lab Institute for Materials Research 1381 Kinnear Road Suite 100 Columbus, OH 43212 614-292-2753 -------------- next part -------------- An HTML attachment was scrubbed... URL: From G.C.A.M.Janssen at tudelft.nl Fri Jul 17 04:30:07 2020 From: G.C.A.M.Janssen at tudelft.nl (Guido Janssen - 3ME) Date: Fri, 17 Jul 2020 08:30:07 +0000 Subject: [labnetwork] laboratory sputter deposition equipment Message-ID: Dear colleagues Here in Delft we are in the proces of replacing our 16 years old AJA sputter tool, used for proces development and materials science studies. We?re looking for a system with three 2? targets in sputter down configuration able to handle small samples as well as 100 mm wafers. DC and RF, heated substrate holder with sample bias option, turbo pumped and equiped with a load lock. Do you know of any supplier other than AJA that offers such a system? Sincerely Guido Janssen TU Delft g.c.a.m.janssen at tudelft.nl From shimonel at savion.huji.ac.il Fri Jul 17 09:01:08 2020 From: shimonel at savion.huji.ac.il (Shimon Eliav) Date: Fri, 17 Jul 2020 13:01:08 +0000 Subject: [labnetwork] laboratory sputter deposition equipment In-Reply-To: References: Message-ID: Hi Guido, I recommend Angstrom Engineering: https://angstromengineering.com/ They are great. Contact person: Mike Miller (Cc). Regards, Shimon -----Original Message----- From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Guido Janssen - 3ME Sent: Friday, 17 July 2020 11:30 To: labnetwork at mtl.mit.edu Subject: [labnetwork] laboratory sputter deposition equipment Dear colleagues Here in Delft we are in the proces of replacing our 16 years old AJA sputter tool, used for proces development and materials science studies. We?re looking for a system with three 2? targets in sputter down configuration able to handle small samples as well as 100 mm wafers. DC and RF, heated substrate holder with sample bias option, turbo pumped and equiped with a load lock. Do you know of any supplier other than AJA that offers such a system? Sincerely Guido Janssen TU Delft g.c.a.m.janssen at tudelft.nl _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork From devito.richard at gmail.com Fri Jul 17 09:45:57 2020 From: devito.richard at gmail.com (RIchard DeVito) Date: Fri, 17 Jul 2020 09:45:57 -0400 Subject: [labnetwork] laboratory sputter deposition equipment In-Reply-To: References: Message-ID: try PVD products On Fri, Jul 17, 2020 at 8:51 AM Guido Janssen - 3ME < G.C.A.M.Janssen at tudelft.nl> wrote: > Dear colleagues > > Here in Delft we are in the proces of replacing our 16 years old AJA > sputter tool, used for proces development and materials science studies. > We?re looking for a system with three 2? targets in sputter down > configuration able to handle small samples as well as 100 mm wafers. DC and > RF, heated substrate holder with sample bias option, turbo pumped and > equiped with a load lock. > Do you know of any supplier other than AJA that offers such a system? > > Sincerely > Guido Janssen > TU Delft > g.c.a.m.janssen at tudelft.nl > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From julia.aebersold at louisville.edu Fri Jul 17 11:46:43 2020 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Fri, 17 Jul 2020 15:46:43 +0000 Subject: [labnetwork] laboratory sputter deposition equipment In-Reply-To: References: Message-ID: Our Lesker PVD 75 fits all of your options, but ours is outfitted with a cryo rather than turbo. Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville Shumaker Research Building, Room 233 2210 South Brook Street Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of RIchard DeVito Sent: Friday, July 17, 2020 9:46 AM To: Guido Janssen - 3ME Cc: labnetwork at mtl.mit.edu Subject: Re: [labnetwork] laboratory sputter deposition equipment CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. try PVD products On Fri, Jul 17, 2020 at 8:51 AM Guido Janssen - 3ME > wrote: Dear colleagues Here in Delft we are in the proces of replacing our 16 years old AJA sputter tool, used for proces development and materials science studies. We?re looking for a system with three 2? targets in sputter down configuration able to handle small samples as well as 100 mm wafers. DC and RF, heated substrate holder with sample bias option, turbo pumped and equiped with a load lock. Do you know of any supplier other than AJA that offers such a system? Sincerely Guido Janssen TU Delft g.c.a.m.janssen at tudelft.nl _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From Dwayne.Chrusch at umanitoba.ca Fri Jul 17 12:07:12 2020 From: Dwayne.Chrusch at umanitoba.ca (Dwayne Chrusch) Date: Fri, 17 Jul 2020 16:07:12 +0000 Subject: [labnetwork] laboratory sputter deposition equipment In-Reply-To: References: Message-ID: <10575D82-AF76-4ABF-9C31-4E2B882582C7@umanitoba.ca> Angstrom Eng., Kurt J. Lesker, Semicore. https://angstromengineering.com/tech/magnetron-sputtering/ https://www.lesker.com/newweb/ped/physical-vapor-deposition-systems.cfm http://www.semicore.com/sputtering-systems Regards, Dwayne D. Chrusch, MSc. Operations Manager, Training & Safety Coordinator Nanosystem Fabrication Lab (NSFL) E3-471 Engineering 75A Chancellor's Circle University of Manitoba Winnipeg, Manitoba Canada, R3T 5V6 Tel: +1 (204) 474-8246 Fax +1 (204) 261-4639 > On Jul 17, 2020, at 3:30 AM, Guido Janssen - 3ME wrote: > > ******************************************************** > Caution: This message was sent from outside the University of Manitoba. > ******************************************************** > > Dear colleagues > > Here in Delft we are in the proces of replacing our 16 years old AJA sputter tool, used for proces development and materials science studies. > We?re looking for a system with three 2? targets in sputter down configuration able to handle small samples as well as 100 mm wafers. DC and RF, heated substrate holder with sample bias option, turbo pumped and equiped with a load lock. > Do you know of any supplier other than AJA that offers such a system? > > Sincerely > Guido Janssen > TU Delft > g.c.a.m.janssen at tudelft.nl > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork From peterggordon at gmail.com Fri Jul 17 12:08:16 2020 From: peterggordon at gmail.com (Peter Gordon) Date: Fri, 17 Jul 2020 12:08:16 -0400 Subject: [labnetwork] laboratory sputter deposition equipment In-Reply-To: References: Message-ID: I have worked with Angstrom a fair bit and highly recommend them as well. Cheers, Peter On Fri, 17 Jul 2020 at 11:41, Shimon Eliav wrote: > [External Email] > > Hi Guido, > I recommend Angstrom Engineering: https://angstromengineering.com/ > They are great. > Contact person: Mike Miller (Cc). > Regards, > Shimon > > -----Original Message----- > From: labnetwork-bounces at mtl.mit.edu [mailto: > labnetwork-bounces at mtl.mit.edu] On Behalf Of Guido Janssen - 3ME > Sent: Friday, 17 July 2020 11:30 > To: labnetwork at mtl.mit.edu > Subject: [labnetwork] laboratory sputter deposition equipment > > Dear colleagues > > Here in Delft we are in the proces of replacing our 16 years old AJA > sputter tool, used for proces development and materials science studies. > We?re looking for a system with three 2? targets in sputter down > configuration able to handle small samples as well as 100 mm wafers. DC and > RF, heated substrate holder with sample bias option, turbo pumped and > equiped with a load lock. > Do you know of any supplier other than AJA that offers such a system? > > Sincerely > Guido Janssen > TU Delft > g.c.a.m.janssen at tudelft.nl > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > > This email contains links to content or websites. Always be cautious when > clicking on external links or attachments. If in doubt, please forward > suspicious emails to phishing at carleton.ca. > > -----End of Disclaimer----- > > -- Peter G. Gordon, PhD CU NanoFab Facility Administrator Department of Chemistry Carleton University (613) 520-2600 ext.7561 https://carleton.ca/fanssi/ -------------- next part -------------- An HTML attachment was scrubbed... URL: From cecil at anl.gov Fri Jul 17 12:31:24 2020 From: cecil at anl.gov (Cecil, Thomas W.) Date: Fri, 17 Jul 2020 16:31:24 +0000 Subject: [labnetwork] Cleanroom manager position - Argonne National Lab Message-ID: Hi Everyone, I?d like to draw your attention to the open position for a cleanroom manager at Argonne. Please share with anyone that might be interested. Link below for more details and to apply. https://careers.peopleclick.com/careerscp/client_argonnelab/external/gateway.do?functionName=viewFromLink&jobPostId=9281&localeCode=en-us Best, Tom ----------------------------------------- Thomas Cecil, Ph.D. Argonne National Laboratory cecil at anl.gov 630-252-9775 -------------- next part -------------- An HTML attachment was scrubbed... URL: From saeid.soltanian at ubc.ca Fri Jul 17 13:36:42 2020 From: saeid.soltanian at ubc.ca (Soltanian, Saeid) Date: Fri, 17 Jul 2020 17:36:42 +0000 Subject: [labnetwork] laboratory sputter deposition equipment In-Reply-To: References: Message-ID: <0B63EF43-A067-4271-95C1-D2A631B51C97@ubc.ca> I also recommend https://angstromengineering.com/ I have it here and very happy with the performance. Saeid -- Saeid Soltanian, PhD Research Associate, Manager Centre for Flexible Electronics and Textiles (CFET) University of British Columbia 117-2355 East Mall, Vancouver, BC V6T 1Z4 Tel: +1-604-827-1573 Email: saeid.soltanian at ubc.ca http://cfet.ubc.ca/ On Jul 17, 2020, at 8:39 AM, Shimon Eliav wrote: ?Hi Guido, I recommend Angstrom Engineering: https://angstromengineering.com/ They are great. Contact person: Mike Miller (Cc). Regards, Shimon -----Original Message----- From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Guido Janssen - 3ME Sent: Friday, 17 July 2020 11:30 To: labnetwork at mtl.mit.edu Subject: [labnetwork] laboratory sputter deposition equipment Dear colleagues Here in Delft we are in the proces of replacing our 16 years old AJA sputter tool, used for proces development and materials science studies. We?re looking for a system with three 2? targets in sputter down configuration able to handle small samples as well as 100 mm wafers. DC and RF, heated substrate holder with sample bias option, turbo pumped and equiped with a load lock. Do you know of any supplier other than AJA that offers such a system? Sincerely Guido Janssen TU Delft g.c.a.m.janssen at tudelft.nl _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From bill_flounders at berkeley.edu Fri Jul 17 15:48:32 2020 From: bill_flounders at berkeley.edu (Albert William (Bill) Flounders) Date: Fri, 17 Jul 2020 12:48:32 -0700 Subject: [labnetwork] laboratory sputter deposition equipment In-Reply-To: References: Message-ID: I encourage evaluation of KJ Lesker Bill Flounders UC Berkeley Contact: Pierre Hraiz Regional Sales Manager Tel: *408-335-5779* <408-335-5779> (direct) | Cell: *(408) 335-5779* <(408)%20335-5779> | Email: *pierreh at lesker.com* On Fri, Jul 17, 2020 at 5:49 AM Guido Janssen - 3ME < G.C.A.M.Janssen at tudelft.nl> wrote: > Dear colleagues > > Here in Delft we are in the proces of replacing our 16 years old AJA > sputter tool, used for proces development and materials science studies. > We?re looking for a system with three 2? targets in sputter down > configuration able to handle small samples as well as 100 mm wafers. DC and > RF, heated substrate holder with sample bias option, turbo pumped and > equiped with a load lock. > Do you know of any supplier other than AJA that offers such a system? > > Sincerely > Guido Janssen > TU Delft > g.c.a.m.janssen at tudelft.nl > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From jpalmer at princeton.edu Fri Jul 17 16:08:06 2020 From: jpalmer at princeton.edu (Joseph Palmer) Date: Fri, 17 Jul 2020 16:08:06 -0400 Subject: [labnetwork] laboratory sputter deposition equipment In-Reply-To: <0B63EF43-A067-4271-95C1-D2A631B51C97@ubc.ca> References: <0B63EF43-A067-4271-95C1-D2A631B51C97@ubc.ca> Message-ID: <7BE57449-CF34-4986-91BE-0A5D6B071EE8@princeton.edu> As do I. We have 6 systems. Joe Sent from my iPad > On Jul 17, 2020, at 4:04 PM, Soltanian, Saeid wrote: > > ? > I also recommend https://angstromengineering.com/ > I have it here and very happy with the performance. > > Saeid > >> -- >> Saeid Soltanian, PhD >> Research Associate, Manager >> Centre for Flexible Electronics and Textiles (CFET) >> University of British Columbia >> 117-2355 East Mall, Vancouver, BC V6T 1Z4 >> Tel: +1-604-827-1573 >> Email: saeid.soltanian at ubc.ca >> http://cfet.ubc.ca/ >>> On Jul 17, 2020, at 8:39 AM, Shimon Eliav wrote: >>> >> ?Hi Guido, >> I recommend Angstrom Engineering: https://angstromengineering.com/ >> They are great. >> Contact person: Mike Miller (Cc). >> Regards, >> Shimon >> >> -----Original Message----- >> From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Guido Janssen - 3ME >> Sent: Friday, 17 July 2020 11:30 >> To: labnetwork at mtl.mit.edu >> Subject: [labnetwork] laboratory sputter deposition equipment >> >> Dear colleagues >> >> Here in Delft we are in the proces of replacing our 16 years old AJA sputter tool, used for proces development and materials science studies. >> We?re looking for a system with three 2? targets in sputter down configuration able to handle small samples as well as 100 mm wafers. DC and RF, heated substrate holder with sample bias option, turbo pumped and equiped with a load lock. >> Do you know of any supplier other than AJA that offers such a system? >> >> Sincerely >> Guido Janssen >> TU Delft >> g.c.a.m.janssen at tudelft.nl >> _______________________________________________ >> labnetwork mailing list >> labnetwork at mtl.mit.edu >> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork >> _______________________________________________ >> labnetwork mailing list >> labnetwork at mtl.mit.edu >> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From lvchang at Central.UH.EDU Fri Jul 17 16:54:57 2020 From: lvchang at Central.UH.EDU (Chang, Long) Date: Fri, 17 Jul 2020 20:54:57 +0000 Subject: [labnetwork] RIE Lower Electrode Question Message-ID: <159FA036-C6F3-4F0F-9FF8-4B6137BDBCEB@cougarnet.uh.edu> Hi All, The lower electrode to our RIE system has taken quite a bit of abuse over the decade, see photo. There are scratches and pits caused by wafer shards. There?s also a film of something (probably PTFE oil) in the middle. Does anyone know how these scratches and pits might affect the Bosch Process? Any recommendations for cleaning this up? Thanks, Long [cid:CEAD01E3-468C-431D-A3F3-56276537FAEC at serc.dhcp.e.uh.edu] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: IMG_1386 2.jpeg Type: image/jpeg Size: 72565 bytes Desc: IMG_1386 2.jpeg URL: From andrew.lingley at montana.edu Fri Jul 17 17:10:32 2020 From: andrew.lingley at montana.edu (Lingley, Andrew) Date: Fri, 17 Jul 2020 21:10:32 +0000 Subject: [labnetwork] laboratory sputter deposition equipment In-Reply-To: References: Message-ID: We are also very happy with Angstrom Engineering. We have two evaporators and one sputter tool. They provide great service and their instrumetns are simple and easy to operate. Best regards, Andy Lingley Montana Microfabrication Facility From: labnetwork-bounces at mtl.mit.edu On Behalf Of Peter Gordon Sent: Friday, July 17, 2020 10:08 AM To: Shimon Eliav Cc: labnetwork at mtl.mit.edu; Mike Miller Subject: Re: [labnetwork] laboratory sputter deposition equipment I have worked with Angstrom a fair bit and highly recommend them as well. Cheers, Peter On Fri, 17 Jul 2020 at 11:41, Shimon Eliav > wrote: [External Email] Hi Guido, I recommend Angstrom Engineering: https://angstromengineering.com/ They are great. Contact person: Mike Miller (Cc). Regards, Shimon -----Original Message----- From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Guido Janssen - 3ME Sent: Friday, 17 July 2020 11:30 To: labnetwork at mtl.mit.edu Subject: [labnetwork] laboratory sputter deposition equipment Dear colleagues Here in Delft we are in the proces of replacing our 16 years old AJA sputter tool, used for proces development and materials science studies. We?re looking for a system with three 2? targets in sputter down configuration able to handle small samples as well as 100 mm wafers. DC and RF, heated substrate holder with sample bias option, turbo pumped and equiped with a load lock. Do you know of any supplier other than AJA that offers such a system? Sincerely Guido Janssen TU Delft g.c.a.m.janssen at tudelft.nl _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork This email contains links to content or websites. Always be cautious when clicking on external links or attachments. If in doubt, please forward suspicious emails to phishing at carleton.ca. -----End of Disclaimer----- -- Peter G. Gordon, PhD CU NanoFab Facility Administrator Department of Chemistry Carleton University (613) 520-2600 ext.7561 https://carleton.ca/fanssi/ -------------- next part -------------- An HTML attachment was scrubbed... URL: From aali at eng.ucsd.edu Mon Jul 20 11:49:19 2020 From: aali at eng.ucsd.edu (Ahdam Ali) Date: Mon, 20 Jul 2020 08:49:19 -0700 Subject: [labnetwork] RIE Lower Electrode Question In-Reply-To: <159FA036-C6F3-4F0F-9FF8-4B6137BDBCEB@cougarnet.uh.edu> References: <159FA036-C6F3-4F0F-9FF8-4B6137BDBCEB@cougarnet.uh.edu> Message-ID: Chang, Not sure about the effects on your process. I may recommend cleaning with a scotch-brite + PTFE specific solvent before running an O2 clean. Best, On Fri, Jul 17, 2020 at 4:43 PM Chang, Long wrote: > Hi All, > > The lower electrode to our RIE system has taken quite a bit of abuse over > the decade, see photo. There are scratches and pits caused by wafer shards. > There?s also a film of something (probably PTFE oil) in the middle. > > Does anyone know how these scratches and pits might affect the Bosch > Process? Any recommendations for cleaning this up? > > Thanks, > Long > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -- Ahdam Ali R&D Engineer UCSD Calit2 Nano3 Facility Atkinson Hall M/C0436 9500 Gilman Drive La Jolla, CA 92093-0436 Email: aali at eng.ucsd.edu Phone: (858)-534-4768 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: IMG_1386 2.jpeg Type: image/jpeg Size: 72565 bytes Desc: not available URL: From sean.rinehart at yale.edu Mon Jul 20 11:57:23 2020 From: sean.rinehart at yale.edu (Rinehart, Sean) Date: Mon, 20 Jul 2020 15:57:23 +0000 Subject: [labnetwork] RIE Lower Electrode Question In-Reply-To: <159FA036-C6F3-4F0F-9FF8-4B6137BDBCEB@cougarnet.uh.edu> References: <159FA036-C6F3-4F0F-9FF8-4B6137BDBCEB@cougarnet.uh.edu> Message-ID: Hi Long, One metric for how much those scratches actually matter is your helium leak rate with a wafer installed. Do you find it's been drifting up over the years, even with fresh wafers? Regarding cleaning, if you're comfortable with removing the electrode I would recommend using IPA with a scotch-brite sanding pad (green), then finish with an ultra fine scotch brite polishing pad (gray). I'd recommend against doing this with the electrode installed, as IPA could easily carry debris into the wafer lift/helium cooling channel. It looks like your system is an Oxford, and they also sell replacement electrodes. We replace ours about once a decade in our Cl2/BCl3 ICP RIE. Best, Sean Rinehart (he, him, his) Assistant Director, Cleanroom Operations Yale University ________________________________ From: labnetwork-bounces at mtl.mit.edu on behalf of Chang, Long Sent: Friday, July 17, 2020 4:54 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] RIE Lower Electrode Question Hi All, The lower electrode to our RIE system has taken quite a bit of abuse over the decade, see photo. There are scratches and pits caused by wafer shards. There?s also a film of something (probably PTFE oil) in the middle. Does anyone know how these scratches and pits might affect the Bosch Process? Any recommendations for cleaning this up? Thanks, Long [cid:CEAD01E3-468C-431D-A3F3-56276537FAEC at serc.dhcp.e.uh.edu] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: IMG_1386 2.jpeg Type: image/jpeg Size: 72565 bytes Desc: IMG_1386 2.jpeg URL: From codreanu at udel.edu Mon Jul 20 13:54:55 2020 From: codreanu at udel.edu (Iulian Codreanu) Date: Mon, 20 Jul 2020 13:54:55 -0400 Subject: [labnetwork] Tm3Fe5O12 (TIG) Message-ID: <3a2fdeed-1ccb-ccde-9c74-dd7d648b604f@udel.edu> Good Afternoon, I have a request to use Tm3Fe5O12 in our PLD tool. Does anyone have experience with in? I am considering things like toxicity, contamination, fire hazards, etc. It seems that Thulium dust and powder can be toxic and can lead to explosions. Thank you, Iulian -- iulian Codreanu, Ph.D. Director, Nanofabrication Facility University of Delaware Harker ISE Lab, Room 163 221 Academy Street Newark, DE 19716 302-831-2784 http://udnf.udel.edu From cekendri at mtu.edu Mon Jul 20 16:40:09 2020 From: cekendri at mtu.edu (Chito Kendrick) Date: Mon, 20 Jul 2020 16:40:09 -0400 Subject: [labnetwork] Spinable CNT fibers Message-ID: A faculty member installed an Easytube CVD system in our microfab for producing CNTs, with the plan to produce spinable CNT fibers. They are just using out electron beam for producing the catalyst substrates - currently electron beam of 10 nm Al that they then oxidize and then 2 nm of Fe - all on 300 nm of thermal SiO2/Si. They did investigate sputtering Al2O3 instead. So far they have produced CNTs, but have not found the recipe that will produce long spinable fibers. They are using a H2 and C2H4 gas mixture and grow around 750degC. I was wanting to see if anyone runs a user system that they guarantee spinable CNTs. If so I was wanting to talk, offline, about tuning the process and possibly getting some of their catalyst substrates to compare. I have been letting the student work on the recipe development as I have other issues to worry about and it is their system. Chito Kendrick -- Chito Kendrick Ph.D. Managing Director of the Microfabrication Facility Research Assistant Professor Electrical and Computer Engineering Michigan Technological University Room 436 M&M Building 1400 Townsend Dr. Houghton, Michigan 49931-1295 814-308-4255 -------------- next part -------------- An HTML attachment was scrubbed... URL: From jmteshima at gmail.com Thu Jul 23 14:14:48 2020 From: jmteshima at gmail.com (Janet Teshima) Date: Thu, 23 Jul 2020 11:14:48 -0700 Subject: [labnetwork] Safety precautions when Cleaving GaAs Message-ID: I am interested in what safety precautions are considered best practices when cleaving GaAs using scribers or other cleaving equipment that is open to the atmosphere. The question is more about inhalation versus particle contamination. Can you refer me to your policies? -------------- next part -------------- An HTML attachment was scrubbed... URL: From abdelilah.safir at gmail.com Thu Jul 23 16:32:01 2020 From: abdelilah.safir at gmail.com (abdelilah safir) Date: Thu, 23 Jul 2020 16:32:01 -0400 Subject: [labnetwork] Sputtering Plasma Characterization tools? Message-ID: Dear Labnetwork team, Has anyone had good experience characterizing plasma parameters? like plasma density, Energy distribution and ions and neutral currents within the sputtering chamber? I use ions assisted sputtering of oxides. I do know that people use RFEA and LP and I read that Faraday cups are also used by some researchers as well. REFA is the best but it has a temperature limitation. I appreciated any recommendation. Best regards, Abdelilah Safir -------------- next part -------------- An HTML attachment was scrubbed... URL: From pnsharma at unm.edu Mon Jul 27 12:02:03 2020 From: pnsharma at unm.edu (Pallavi Sharma) Date: Mon, 27 Jul 2020 16:02:03 +0000 Subject: [labnetwork] Deep Reactive Ion Etch Problems Message-ID: Hello all, I am having problem with anisotropic etching of silicon by Deep Reactive ion etch. Grass or black silicon is the issue all the time, attaching some of the SEM pictures of the sample. Every recipe I tried to fine tune result in grass formation, even as the process initiates in tool wafer surface starts to turn brown and ultimately black. I tried varying SF6 gas flow, Bias power, Substrate temperature but every time I see is highly dense grass with no clean surface. Any help will be greatly appreciated. Thank you, Pallavi -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: 10min 7.2 20c DRIE std.with o20001.jpg Type: image/jpeg Size: 395349 bytes Desc: 10min 7.2 20c DRIE std.with o20001.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: 10min 7.2 20c DRIE std.with o20004.jpg Type: image/jpeg Size: 705624 bytes Desc: 10min 7.2 20c DRIE std.with o20004.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: 10min 7.2 20c DRIE std.with o20009.jpg Type: image/jpeg Size: 672622 bytes Desc: 10min 7.2 20c DRIE std.with o20009.jpg URL: From mmoneck at andrew.cmu.edu Mon Jul 27 16:11:38 2020 From: mmoneck at andrew.cmu.edu (Matthew Moneck) Date: Mon, 27 Jul 2020 20:11:38 +0000 Subject: [labnetwork] Deep Reactive Ion Etch Problems In-Reply-To: References: Message-ID: <149286259c4f42048f1bcdc8ce005282@andrew.cmu.edu> Hi Pallavi, What is the make and model of your DRIE? Also, what is the mask you are using for the etch? The grass is typically a result of micromasking that occurs when either the chamber needs to be conditioned (i.e. you have an abundance of polymer in the chamber) or when you have an etch mask that re-sputters onto the wafer surface. If it is due to the chamber conditions, you will need to perform a cleaning followed by a conditioning process. The vendor will typically have a recommended procedure. There are other potential causes too, but the chamber conditions and/or re-sputtering are the two most common in my experience. Best Regards, Matt -- Matthew T. Moneck, Ph.D Executive Manager, Claire & John Bertucci Nanotechnology Laboratory Electrical & Computer Engineering | Carnegie Mellon University 5000 Forbes Avenue, Pittsburgh, PA 15213-3890 Phone: 412-268-5430 ece.cmu.edu nanofab.ece.cmu.edu From: labnetwork-bounces at mtl.mit.edu On Behalf Of Pallavi Sharma Sent: Monday, July 27, 2020 12:02 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Deep Reactive Ion Etch Problems Hello all, I am having problem with anisotropic etching of silicon by Deep Reactive ion etch. Grass or black silicon is the issue all the time, attaching some of the SEM pictures of the sample. Every recipe I tried to fine tune result in grass formation, even as the process initiates in tool wafer surface starts to turn brown and ultimately black. I tried varying SF6 gas flow, Bias power, Substrate temperature but every time I see is highly dense grass with no clean surface. Any help will be greatly appreciated. Thank you, Pallavi -------------- next part -------------- An HTML attachment was scrubbed... URL: From usha at stanford.edu Mon Jul 27 16:13:00 2020 From: usha at stanford.edu (Usha Raghuram) Date: Mon, 27 Jul 2020 20:13:00 +0000 Subject: [labnetwork] Deep Reactive Ion Etch Problems In-Reply-To: References: Message-ID: Pallavi, Grass can be the result of the following - 1. Recipe conditions - balance between etch & deposition that can be controlled by recipe parameters. 2. Chamber condition - If the chamber is dirty doing plasma clean will help. Sometimes, wet clean of the chamber may be required to recover the chamber. 3. Micromasking - If there is any sputtering from the mask of metal masks are used, incomplete etch of the hard mask if it is used, resist scum left behind after litho, insufficient breakthrough, etc. I would suggest doing a qualification run with patterned Silicon wafer to verify the machine condition first and see how it compares to the normal times to eliminate equipment / chamber condition related issues first followed by troubleshooting of the wafer processing. Regards, Usha ________________________________ From: labnetwork-bounces at mtl.mit.edu on behalf of Pallavi Sharma Sent: Monday, July 27, 2020 9:02 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Deep Reactive Ion Etch Problems Hello all, I am having problem with anisotropic etching of silicon by Deep Reactive ion etch. Grass or black silicon is the issue all the time, attaching some of the SEM pictures of the sample. Every recipe I tried to fine tune result in grass formation, even as the process initiates in tool wafer surface starts to turn brown and ultimately black. I tried varying SF6 gas flow, Bias power, Substrate temperature but every time I see is highly dense grass with no clean surface. Any help will be greatly appreciated. Thank you, Pallavi -------------- next part -------------- An HTML attachment was scrubbed... URL: From james.beall at nist.gov Mon Jul 27 16:51:52 2020 From: james.beall at nist.gov (Beall, James A. (Fed)) Date: Mon, 27 Jul 2020 20:51:52 +0000 Subject: [labnetwork] Deep Reactive Ion Etch Problems In-Reply-To: References: Message-ID: When we see that it often means you are overdue for chamber cleaning and reconditioning. For us (SPTS Pegasus 150 mm tool) that is a long O2 chamber clean with a wafer on the chuck) followed by running our standard Bosch process on bare silicon full wafers until they come out shiny. If that fails then you need manual chamber wall clean (iso and scotchbrite) followed by the above. Best of luck, Jim ________________________________ From: labnetwork-bounces at mtl.mit.edu on behalf of Pallavi Sharma Sent: Monday, July 27, 2020 10:02 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Deep Reactive Ion Etch Problems Hello all, I am having problem with anisotropic etching of silicon by Deep Reactive ion etch. Grass or black silicon is the issue all the time, attaching some of the SEM pictures of the sample. Every recipe I tried to fine tune result in grass formation, even as the process initiates in tool wafer surface starts to turn brown and ultimately black. I tried varying SF6 gas flow, Bias power, Substrate temperature but every time I see is highly dense grass with no clean surface. Any help will be greatly appreciated. Thank you, Pallavi -------------- next part -------------- An HTML attachment was scrubbed... URL: From julia.aebersold at louisville.edu Mon Jul 27 17:34:33 2020 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Mon, 27 Jul 2020 21:34:33 +0000 Subject: [labnetwork] Deep Reactive Ion Etch Problems In-Reply-To: References: Message-ID: Pallavi, make sure you have performed a decent chamber clean before processing and that your photoresist is completely developed. Both problems among others will contribute significantly to grass. Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville 2210 South Brook Street Shumaker Research Building, Room 233 Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ ________________________________ From: labnetwork-bounces at mtl.mit.edu on behalf of Pallavi Sharma Sent: Monday, July 27, 2020 12:02 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Deep Reactive Ion Etch Problems CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. Hello all, I am having problem with anisotropic etching of silicon by Deep Reactive ion etch. Grass or black silicon is the issue all the time, attaching some of the SEM pictures of the sample. Every recipe I tried to fine tune result in grass formation, even as the process initiates in tool wafer surface starts to turn brown and ultimately black. I tried varying SF6 gas flow, Bias power, Substrate temperature but every time I see is highly dense grass with no clean surface. Any help will be greatly appreciated. Thank you, Pallavi -------------- next part -------------- An HTML attachment was scrubbed... URL: From fabien at edgehogtech.com Mon Jul 27 17:48:10 2020 From: fabien at edgehogtech.com (Fabien Dauzou) Date: Mon, 27 Jul 2020 21:48:10 +0000 Subject: [labnetwork] Deep Reactive Ion Etch Problems In-Reply-To: References: Message-ID: Hi Pallavi, 10min might be long for the gas to proper evacuate and that's why you will observed self-masking hence black-silicon. You might need to do some break in your etching recipe to see what happen. Best regards, Bien cordialement, Fabien Dauzou Photovoltaic Enthusiast | Edgehog Eng./Entrepreneur | Cleantech Optimist fabien at edgehogtech.com Mob: 438-868-1657 780 Av. Brewster, RC-016, Montreal, QC, Canada, H4C 2K1 [cid:image001.png at 01D6643E.168D7E90][A close up of a sign Description automatically generated][cid:image003.png at 01D6643E.168D7E90] https://www.edgehogtech.com||https://www.linkedin.com/company/edgehog Think green, before printing this email. From: labnetwork-bounces at mtl.mit.edu On Behalf Of Pallavi Sharma Sent: July 27, 2020 12:02 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Deep Reactive Ion Etch Problems Hello all, I am having problem with anisotropic etching of silicon by Deep Reactive ion etch. Grass or black silicon is the issue all the time, attaching some of the SEM pictures of the sample. Every recipe I tried to fine tune result in grass formation, even as the process initiates in tool wafer surface starts to turn brown and ultimately black. I tried varying SF6 gas flow, Bias power, Substrate temperature but every time I see is highly dense grass with no clean surface. Any help will be greatly appreciated. Thank you, Pallavi -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 277446 bytes Desc: image001.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image002.jpg Type: image/jpeg Size: 89866 bytes Desc: image002.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image003.png Type: image/png Size: 36695 bytes Desc: image003.png URL: From vamsinittala at gmail.com Mon Jul 27 18:21:14 2020 From: vamsinittala at gmail.com (N P VAMSI KRISHNA) Date: Mon, 27 Jul 2020 17:21:14 -0500 Subject: [labnetwork] Deep Reactive Ion Etch Problems In-Reply-To: References: Message-ID: Hi Pallavi, If all of a sudden you are seeing grass in all the recipes (without any open chamber repairs): 1. Do long oxygen clean: This will help you in removing excess polymer on the chuck or any metal contamination in the chamber. Observe the plasma for any sparks or fluctuations in Vpp or DcBias. 2. Use your standard recipe and try increasing platen temperature. Inspect your platen temperature. 3. Check the condition of ESC for any black spots or particles (open chamber). If there is any change in the chamber conditions like recently AMC done or ESC replacement? The picture below might help you tuning the recipe. 1. First I would try increasing the platen temperature (In most of the cases this will work) 2. Then try to reduce polymer flow. If there is a change in profile, increase it. [image: Screen Shot 2020-07-27 at 4.47.23 PM.png] Hope this helps. Thanks & Regards, Vamsi On Mon, Jul 27, 2020 at 2:53 PM Pallavi Sharma wrote: > Hello all, > > I am having problem with anisotropic etching of silicon by Deep Reactive > ion etch. Grass or black silicon is the issue all the time, attaching some > of the SEM pictures of the sample. Every recipe I tried to fine tune result > in grass formation, even as the process initiates in tool wafer surface > starts to turn brown and ultimately black. I tried varying SF6 gas flow, > Bias power, Substrate temperature but every time I see is highly dense > grass with no clean surface. > Any help will be greatly appreciated. > > Thank you, > Pallavi > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -- ___________________________________________________ N.P. Vamsi Krishna, PhD Postdoctoral Fellow Pritzker School of Molecular Engineering, *The University of Chicago * Center for Nanoscale Materials, *Argonne National Laboratory * Phone: 1 (331) 757-8565 -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Screen Shot 2020-07-27 at 4.47.23 PM.png Type: image/png Size: 256802 bytes Desc: not available URL: From chen.zhang at nist.gov Wed Jul 29 11:02:50 2020 From: chen.zhang at nist.gov (Zhang, Jessie (Fed)) Date: Wed, 29 Jul 2020 15:02:50 +0000 Subject: [labnetwork] Deep Reactive Ion Etch Problems In-Reply-To: References: Message-ID: Agree with Jim. If after chamber clean and reconditioning, the problem still exists, check all the MFC and make sure there is no leak and calibrated. We ended up replaced one of the MFCs last spring to end the battle with black silicon on our Unaxis DSE. Jessie From: labnetwork-bounces at mtl.mit.edu On Behalf Of Beall, James A. (Fed) Sent: Monday, July 27, 2020 4:52 PM To: Pallavi Sharma ; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Deep Reactive Ion Etch Problems When we see that it often means you are overdue for chamber cleaning and reconditioning. For us (SPTS Pegasus 150 mm tool) that is a long O2 chamber clean with a wafer on the chuck) followed by running our standard Bosch process on bare silicon full wafers until they come out shiny. If that fails then you need manual chamber wall clean (iso and scotchbrite) followed by the above. Best of luck, Jim ________________________________ From: labnetwork-bounces at mtl.mit.edu > on behalf of Pallavi Sharma > Sent: Monday, July 27, 2020 10:02 AM To: labnetwork at mtl.mit.edu > Subject: [labnetwork] Deep Reactive Ion Etch Problems Hello all, I am having problem with anisotropic etching of silicon by Deep Reactive ion etch. Grass or black silicon is the issue all the time, attaching some of the SEM pictures of the sample. Every recipe I tried to fine tune result in grass formation, even as the process initiates in tool wafer surface starts to turn brown and ultimately black. I tried varying SF6 gas flow, Bias power, Substrate temperature but every time I see is highly dense grass with no clean surface. Any help will be greatly appreciated. Thank you, Pallavi -------------- next part -------------- An HTML attachment was scrubbed... URL: From mpleil at unm.edu Wed Jul 29 15:01:25 2020 From: mpleil at unm.edu (Matthias Pleil) Date: Wed, 29 Jul 2020 19:01:25 +0000 Subject: [labnetwork] Deep Reactive Ion Etch Problems In-Reply-To: References: , Message-ID: Thank you for all of your input, Pallavi and I ran a wafer with the passivation cycle off (SF6 only, no C4F8) - no grass. The grass must be coming from the passivation step, so she is going to run a series of experiments progressively increasing the passivation cycle to see when grass starts to grow. Kind Regards, Matthias Pleil, Ph.D. Research Professor & Senior Lecturer III of Mech. Eng - UNM UNM MTTC Cleanroom Manager PI - Support Center for Microsystems Education Find great curriculum at: www.scme-support.org (505)272-7157 Join the MNTeSIG Team at www.mntesig.net [cid:065de0b5-43f6-48c8-bfda-05f5b170da28] ________________________________ From: labnetwork-bounces at mtl.mit.edu on behalf of Zhang, Jessie (Fed) Sent: Wednesday, July 29, 2020 9:02 AM To: Beall, James A. (Fed) ; Pallavi Sharma ; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Deep Reactive Ion Etch Problems [EXTERNAL] Agree with Jim. If after chamber clean and reconditioning, the problem still exists, check all the MFC and make sure there is no leak and calibrated. We ended up replaced one of the MFCs last spring to end the battle with black silicon on our Unaxis DSE. Jessie From: labnetwork-bounces at mtl.mit.edu On Behalf Of Beall, James A. (Fed) Sent: Monday, July 27, 2020 4:52 PM To: Pallavi Sharma ; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Deep Reactive Ion Etch Problems When we see that it often means you are overdue for chamber cleaning and reconditioning. For us (SPTS Pegasus 150 mm tool) that is a long O2 chamber clean with a wafer on the chuck) followed by running our standard Bosch process on bare silicon full wafers until they come out shiny. If that fails then you need manual chamber wall clean (iso and scotchbrite) followed by the above. Best of luck, Jim ________________________________ From: labnetwork-bounces at mtl.mit.edu > on behalf of Pallavi Sharma > Sent: Monday, July 27, 2020 10:02 AM To: labnetwork at mtl.mit.edu > Subject: [labnetwork] Deep Reactive Ion Etch Problems Hello all, I am having problem with anisotropic etching of silicon by Deep Reactive ion etch. Grass or black silicon is the issue all the time, attaching some of the SEM pictures of the sample. Every recipe I tried to fine tune result in grass formation, even as the process initiates in tool wafer surface starts to turn brown and ultimately black. I tried varying SF6 gas flow, Bias power, Substrate temperature but every time I see is highly dense grass with no clean surface. Any help will be greatly appreciated. Thank you, Pallavi -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Outlook-vuqwqz4v.png Type: image/png Size: 13711 bytes Desc: Outlook-vuqwqz4v.png URL: