From sieb at 4dlabs.ca Thu Nov 5 15:30:33 2020 From: sieb at 4dlabs.ca (Nathanael Sieb) Date: Thu, 5 Nov 2020 12:30:33 -0800 Subject: [labnetwork] setting up NEMO Message-ID: <02e5277d-0142-d0a4-f926-7de7a4d55fe0@4dlabs.ca> An HTML attachment was scrubbed... URL: From robert.ilic at nist.gov Fri Nov 6 09:31:01 2020 From: robert.ilic at nist.gov (Ilic, Robert (Fed)) Date: Fri, 6 Nov 2020 14:31:01 +0000 Subject: [labnetwork] setting up NEMO In-Reply-To: <02e5277d-0142-d0a4-f926-7de7a4d55fe0@4dlabs.ca> References: <02e5277d-0142-d0a4-f926-7de7a4d55fe0@4dlabs.ca> Message-ID: Hi Nathanael, We have quite a bit getting started info on GitHub wiki (https://github.com/usnistgov/NEMO/wiki). Please contact me, we can setup a conference call to discuss details. Also, we currently have contractors from Prometheus developing NEMO for us. You could also contact them at nemo at prometheuscomputing.com. Regards, rob B. Robert Ilic, PhD National Institute of Standards and Technology, Physical Measurement Laboratory Physicist ? Microsystems and Nanotechnology Division Acting Group Leader and Manager ? Center for Nanoscale Science and Technology NanoFab 100 Bureau Drive, Mail Stop 6201, building 216 Gaithersburg, MD 20899 (301)975-3712 robert.ilic at nist.gov https://www.nist.gov/cnst http://scholar.google.com/citations?user=FxzEsBQAAAAJ&hl=en From: labnetwork-bounces at mtl.mit.edu On Behalf Of Nathanael Sieb Sent: Thursday, November 5, 2020 3:31 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] setting up NEMO Hi all, I hope that everyone is doing well. We have been looking at implementing a new user and facility management software in our facility since our current system is starting to have difficulty scaling as we grow. We have been looking at NEMO since it is open source and appears to be highly configurable. However, our IT team is looking for some assistance from anyone that may have experience setting up and configuring this system. Is there anyone out there in the lab network universe that might be able to help? Thanks in advance! Nathanael Nathanael Sieb Director of Operations and Administration | 4D LABS Simon Fraser University 8888 University Dr., Burnaby, B.C. V5A 1S6 T: 778.782.8084 | F: 778.782.3765 | www.4dlabs.ca Facebook | Twitter | LinkedIn [http://www.4dlabs.ca/content/dam/sfu/4dlabs/images/SFU_4DLabs_logo.png] -------------- next part -------------- An HTML attachment was scrubbed... URL: From dcchrist at wisc.edu Mon Nov 9 13:54:02 2020 From: dcchrist at wisc.edu (Daniel Christensen) Date: Mon, 9 Nov 2020 18:54:02 +0000 Subject: [labnetwork] search for a Director of Shared Research Facilities West Virginia University Message-ID: Search for a Director of Shared Research Facilities West Virginia University. Posted on behalf of WVU see below. Dan C Daniel C. Christensen Laboratory Manager Nanoscale Fabrication Center University of Wisconsin-Madison Hello, I work for West Virginia University's Research Administration under Dr. Sheena Murphy, Associate Vice President of Research Development. We received your names from Trina Wafle who has managed our Shared Research Facilities with a dual role as the Deputy Director of our NRCCE. With her responsibilities expanding as Deputy Director she will no longer be able to expertly provided service to both roles so the research administration has decided to search for a Director of Shared Research Facilities. Trina mentioned that you may be able to assist in getting the word out with the UGIM listserv. If you are willing to do this here is the listing: https://wvu.taleo.net/careersection/wvu_research/jobdetail.ftl?job=15832&tz=GMT-05%3A00&tzname=America%2FNew_York If you need any additional information please do not hesitate to contact me. Thank you, Lisa Lisa Hunt-Turner, PMP Senior Manager Strategic Research Initiatives WVU Research Office 304-293-4817 (office) 585-978-9815 (cell) lisa.hunt at mail.wvu.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From wjkiethe at ncsu.edu Tue Nov 10 16:11:25 2020 From: wjkiethe at ncsu.edu (Bill Kiether) Date: Tue, 10 Nov 2020 16:11:25 -0500 Subject: [labnetwork] Nanospec 180 repair help Message-ID: Hello, We have an ancient Nanospec 180 that is having some problems with measurement. Does anyone know a good repair shop that still works on these? Bill Kiethe wjkiethe at ncsu.edu NCSU Nanofabrication Facility -------------- next part -------------- An HTML attachment was scrubbed... URL: From tony.olsen at utah.edu Tue Nov 10 22:03:01 2020 From: tony.olsen at utah.edu (Tony L Olsen) Date: Wed, 11 Nov 2020 03:03:01 +0000 Subject: [labnetwork] Nanospec 180 repair help In-Reply-To: References: Message-ID: <2e4bf9f729c84397b7f31b26100c9361@utah.edu> I?d try Brumley South in Mooresville, NC (http://www.brumleysouth.com/). They saved a 3000 for me about 10 years ago in one try - after giving the guy we bought it from several chances and months to fix a supposedly functional system. Haven?t had a problem with it since. My guess is they can help on a 180, too. tonyO Tony Olsen Nanofab Cleanroom Supervisor/Process Engineer University of Utah 36 S Wasatch Drive, Suite 2500 Salt Lake City, UT 84112 801-587-0651 www.nanofab.utah.edu From: Bill Kiether Sent: Tuesday, November 10, 2020 14:11 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Nanospec 180 repair help Hello, We have an ancient Nanospec 180 that is having some problems with measurement. Does anyone know a good repair shop that still works on these? Bill Kiethe wjkiethe at ncsu.edu NCSU Nanofabrication Facility -------------- next part -------------- An HTML attachment was scrubbed... URL: From mmoneck at andrew.cmu.edu Tue Nov 10 22:22:18 2020 From: mmoneck at andrew.cmu.edu (Matthew Moneck) Date: Wed, 11 Nov 2020 03:22:18 +0000 Subject: [labnetwork] Nanospec 180 repair help In-Reply-To: References: Message-ID: <256923dfeca243338848627109e17fc1@andrew.cmu.edu> Hi Bill, Have you tried Brumley South (http://brumleysouth.com/crisis-support/995)? They do a lot of work with Nanometrics tools. Not sure they handle the 180, but it?s worth a try. They?re actually located just a few hours from NCSU. Best Regards, Matt -- Matthew T. Moneck, Ph.D Executive Manager, Claire & John Bertucci Nanotechnology Laboratory Electrical & Computer Engineering | Carnegie Mellon University 5000 Forbes Avenue, Pittsburgh, PA 15213-3890 Phone: 412-268-5430 ece.cmu.edu nanofab.ece.cmu.edu From: labnetwork-bounces at mtl.mit.edu On Behalf Of Bill Kiether Sent: Tuesday, November 10, 2020 4:11 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Nanospec 180 repair help Hello, We have an ancient Nanospec 180 that is having some problems with measurement. Does anyone know a good repair shop that still works on these? Bill Kiethe wjkiethe at ncsu.edu NCSU Nanofabrication Facility -------------- next part -------------- An HTML attachment was scrubbed... URL: From rharlan at purdue.edu Wed Nov 11 09:17:27 2020 From: rharlan at purdue.edu (Harlan, Richard D) Date: Wed, 11 Nov 2020 14:17:27 +0000 Subject: [labnetwork] Nanospec 180 repair help In-Reply-To: References: Message-ID: Hi Bill, You might give Bruce Paterson a call at DB Patterson Associates (http://dbpattersonassociates.com ). Contact info: D.B. Patterson Associates Inc. 9716 Fox Shores Drive Algonquin, Illinois. 60102 847-658-0800 Chicago Office 847-658-0885 FAX 651-649-0187 Minn. Office Regards, Rich Harlan Research Engineering Birck Nanotechnology Center | Room 2287C Office: 765.494.6697 | Email: rharlan at purdue.edu [cid:image001.png at 01D6B80B.77EF2280] From: labnetwork-bounces at mtl.mit.edu On Behalf Of Bill Kiether Sent: Tuesday, November 10, 2020 4:11 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Nanospec 180 repair help Hello, We have an ancient Nanospec 180 that is having some problems with measurement. Does anyone know a good repair shop that still works on these? Bill Kiethe wjkiethe at ncsu.edu NCSU Nanofabrication Facility -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 14241 bytes Desc: image001.png URL: From jd at gcemarket.com Wed Nov 11 12:38:26 2020 From: jd at gcemarket.com (Jaydeep Patel) Date: Wed, 11 Nov 2020 12:38:26 -0500 Subject: [labnetwork] Nanospec 180 repair help In-Reply-To: References: Message-ID: Hello Bill, Although I am not sure if he is still active, try Brian Jamrus in Santa Cruz, CA. He had repaired couple of old Nanospec tools for us many years ago. Brian Jamrus 321 Ingalls Street Santa Cruz, CA 95060 ph: 831-454-0713 alt: 831-212-1660 bjamrus at aol.com http://bandjspecialties.com/services ---------------------------------------------------------- Jaydeep Patel GCE Market, Inc. (Global Capital Equipment Market) 1001 Lower Landing Rd, Suite 307 Blackwood, NJ 08012 USA ph: + 1.856.401.8900 email: jd at GCEmarket.com http://www.GCEmarket.com LinkedIn: http://www.linkedin.com/in/JaydeepPatel Our Photolithography lab is located in Livermore, CA USA From: "Bill Kiether" To: labnetwork at mtl.mit.edu Date: 11/10/2020 08:14 PM Subject: [labnetwork] Nanospec 180 repair help Sent by: labnetwork-bounces at mtl.mit.edu Hello, We have an ancient Nanospec 180 that is having some problems with measurement. Does anyone know a good repair shop that still works on these? Bill Kiethe wjkiethe at ncsu.edu NCSU Nanofabrication Facility _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From RobertVandusen at cunet.carleton.ca Sun Nov 15 09:53:15 2020 From: RobertVandusen at cunet.carleton.ca (Robert Vandusen) Date: Sun, 15 Nov 2020 14:53:15 +0000 Subject: [labnetwork] Pedot pss in Cmos lab? Message-ID: Hi all. Hope everyone is staying safe. The question about processing with Pedot Pss in our CMOS lab has came up again. I was curious how others deal with this material in terms of cross contamination to cmos tools and processes. Thanks Rob Robert Vandusen Microfabrication Cleanlab Facility Manager Electronics Department Carleton University room: 4184 Mackenzie Building 613-520-2600 ext 5761 Robert_vandusen at cunet.carleton.ca -------------- next part -------------- An HTML attachment was scrubbed... URL: From lino.eugene at uwaterloo.ca Mon Nov 16 09:29:51 2020 From: lino.eugene at uwaterloo.ca (Lino Eugene) Date: Mon, 16 Nov 2020 14:29:51 +0000 Subject: [labnetwork] Resist coating of tiny pieces Message-ID: Dear colleagues, We are having more users who work on tiny pieces to be coated with photo and e-beam resist. I am thinking of different ways to coat these pieces: ? custom chucks with a recess of the size of the chip ? Si carrier wafer with recess etched by SF6 plasma ? MicroSpray photoresist I am wondering if you could share the techniques you use to get uniform coating on very small pieces. Best, Lino Eugene, P.Eng., Ph.D., Micro/nanofabrication process engineer Quantum-Nano Fabrication and Characterization Facility QNC 1611 University of Waterloo 200 University Avenue West Waterloo, ON, Canada N2L 3G1 Ph: +1 519-888-4567 #37788 Cell: +1 226-929-1685 Website: https://fab.qnc.uwaterloo.ca/ -------------- next part -------------- An HTML attachment was scrubbed... URL: From fabien at edgehogtech.com Mon Nov 16 13:31:23 2020 From: fabien at edgehogtech.com (Fabien Dauzou) Date: Mon, 16 Nov 2020 18:31:23 +0000 Subject: [labnetwork] ALD SIS service contract and equipment to buy Message-ID: Dear Labnetwork, Hope everyone is doing great. We are looking for sequential infiltration synthesis (SIS) using ALD (in soaking mode) for alumina deposition to process up to 6" wafer and preferably in batch process. Anyone interesting to provide a service contract? We are also looking to buy such equipment (ALD or custom SIS) but for Gen. 2 glass (370 mm x 470 mm dimension) and which can accommodate 10 to 20 pieces. Any available equipment or company that can make one? Best regards, Bien cordialement, Fabien Dauzou Photovoltaic Enthusiast | Edgehog Eng./Entrepreneur | Cleantech Optimist | Father Aug. 27 fabien at edgehogtech.com Mob: 438-868-1657 780 Av. Brewster, RC-016, Montreal, QC, Canada, H4C 2K1 [cid:image001.png at 01D6BC1C.C620C1B0][A close up of a sign Description automatically generated][cid:image003.jpg at 01D6BC1C.C620C1B0] https://www.edgehogtech.com||https://www.linkedin.com/company/edgehog Think green, before printing this email. -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 48001 bytes Desc: image001.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image002.jpg Type: image/jpeg Size: 8350 bytes Desc: image002.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image003.jpg Type: image/jpeg Size: 4695 bytes Desc: image003.jpg URL: From michael.rooks at yale.edu Mon Nov 16 13:52:08 2020 From: michael.rooks at yale.edu (Michael Rooks) Date: Mon, 16 Nov 2020 13:52:08 -0500 Subject: [labnetwork] Resist coating of tiny pieces In-Reply-To: References: Message-ID: How tiny are the pieces? When we do lithography on little diamonds, we use crystalbond wax to stick them to silicon wafers, then we just drip resist (pmma) over the diamonds. It's not very uniform, but it does the job. Larger, flat, millimeter-range pieces can also be waxed to the center of silicon wafers, without any etched recesses. Spinning resist will not provide a very uniform layer, but it's usually good enough for e-beam. Contact photolithography requires good uniformity; my advice is don't do it. When the pieces are > 5mm then they can be spun just like tiny wafers, with tiny spinner vacuum chucks. If the pieces have silicon nitride windows then you can avoid the vacuum chuck by making a spinner chuck with a simple recess, and no suction. -------------------------------- Michael Rooks nano.yale.edu On Mon, Nov 16, 2020 at 11:45 AM Lino Eugene wrote: > Dear colleagues, > > > > We are having more users who work on tiny pieces to be coated with photo > and e-beam resist. > > > > I am thinking of different ways to coat these pieces: > > ? custom chucks with a recess of the size of the chip > > ? Si carrier wafer with recess etched by SF6 plasma > > ? MicroSpray photoresist > > > > I am wondering if you could share the techniques you use to get uniform > coating on very small pieces. > > > > Best, > > > > *Lino Eugene, P.Eng., Ph.D.,* > > Micro/nanofabrication process engineer > > Quantum-Nano Fabrication and Characterization Facility > > QNC 1611 > > University of Waterloo > > 200 University Avenue West > > Waterloo, ON, Canada > > N2L 3G1 > > > > Ph: +1 519-888-4567 #37788 > > Cell: +1 226-929-1685 > > Website: https://fab.qnc.uwaterloo.ca/ > > > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From orad at reshef.ca Mon Nov 16 16:19:21 2020 From: orad at reshef.ca (Orad Reshef) Date: Mon, 16 Nov 2020 16:19:21 -0500 Subject: [labnetwork] Resist coating of tiny pieces In-Reply-To: References: Message-ID: Dear Lino, We need a little more context for what you consider a "tiny piece". I routinely work with 1x1 cm pieces, and for those we use chucks that have an o-ring about 0.5 cm in diameter. I have colleagues who have worked with 1mm x 1mm square diced samples. They mounted those on a large si handle wafer using double-sided carbon tape, like you would use to mount a sample on an SEM stub. Hope this helps, Orad Orad Reshef, PhD D?partement de physique | Department of Physics Universit? d?Ottawa | University of Ottawa boydnlo.ca | reshef.ca On Mon, Nov 16, 2020 at 11:44 AM Lino Eugene wrote: > Dear colleagues, > > > > We are having more users who work on tiny pieces to be coated with photo > and e-beam resist. > > > > I am thinking of different ways to coat these pieces: > > ? custom chucks with a recess of the size of the chip > > ? Si carrier wafer with recess etched by SF6 plasma > > ? MicroSpray photoresist > > > > I am wondering if you could share the techniques you use to get uniform > coating on very small pieces. > > > > Best, > > > > *Lino Eugene, P.Eng., Ph.D.,* > > Micro/nanofabrication process engineer > > Quantum-Nano Fabrication and Characterization Facility > > QNC 1611 > > University of Waterloo > > 200 University Avenue West > > Waterloo, ON, Canada > > N2L 3G1 > > > > Ph: +1 519-888-4567 #37788 > > Cell: +1 226-929-1685 > > Website: https://fab.qnc.uwaterloo.ca/ > > > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From lino.eugene at uwaterloo.ca Mon Nov 16 17:39:16 2020 From: lino.eugene at uwaterloo.ca (Lino Eugene) Date: Mon, 16 Nov 2020 22:39:16 +0000 Subject: [labnetwork] Resist coating of tiny pieces In-Reply-To: References: Message-ID: Dear Orad, Michael, Nathanael and Carsen, Thanks for your reply. It is good to know that mounting a tiny piece on a carrier wafer is sufficient for EBL. Sorry for not providing the context . We have currently an user who wants to plasma etch several microns of dielectric on a diced chip of ~3 mmx 3 mm. A thick photoresist is needed and I think that just mounting the chip on a carrier wafer would not work well. I was suggested to use dummy pieces placed all around the chip, which should work well for this process. Also, I believe that this would avoid also to break the chip or the carrier wafer (or the photomask?) because of the pressure applied during the wedge compensation on the mask aligner but maybe there is nothing to be worried about. Best, Lino Eugene, P.Eng., Ph.D., Micro/nanofabrication process engineer Quantum Nano-Fabrication and Characterization Facility QNC 1611 University of Waterloo 200 University Avenue West Waterloo, ON, Canada N2L 3G1 Ph: +1 519-888-4567 #37788 Cell: +1 226-929-1685 Website: https://qnfcf.uwaterloo.ca/ From: Orad Reshef [mailto:orad at reshef.ca] Sent: November 16, 2020 16:19 To: Lino Eugene Cc: labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Resist coating of tiny pieces Dear Lino, We need a little more context for what you consider a "tiny piece". I routinely work with 1x1 cm pieces, and for those we use chucks that have an o-ring about 0.5 cm in diameter. I have colleagues who have worked with 1mm x 1mm square diced samples. They mounted those on a large si handle wafer using double-sided carbon tape, like you would use to mount a sample on an SEM stub. Hope this helps, Orad Orad Reshef, PhD D?partement de physique | Department of Physics Universit? d'Ottawa | University of Ottawa boydnlo.ca | reshef.ca On Mon, Nov 16, 2020 at 11:44 AM Lino Eugene > wrote: Dear colleagues, We are having more users who work on tiny pieces to be coated with photo and e-beam resist. I am thinking of different ways to coat these pieces: * custom chucks with a recess of the size of the chip * Si carrier wafer with recess etched by SF6 plasma * MicroSpray photoresist I am wondering if you could share the techniques you use to get uniform coating on very small pieces. Best, Lino Eugene, P.Eng., Ph.D., Micro/nanofabrication process engineer Quantum-Nano Fabrication and Characterization Facility QNC 1611 University of Waterloo 200 University Avenue West Waterloo, ON, Canada N2L 3G1 Ph: +1 519-888-4567 #37788 Cell: +1 226-929-1685 Website: https://fab.qnc.uwaterloo.ca/ _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From price.798 at osu.edu Mon Nov 16 18:21:51 2020 From: price.798 at osu.edu (Price, Aimee) Date: Mon, 16 Nov 2020 23:21:51 +0000 Subject: [labnetwork] Resist coating of tiny pieces In-Reply-To: References: Message-ID: Hi Lino, You are getting good ideas for the resist but you are correct that you'll need to do something to level the sample during contact, if you are in fact using a contact aligner. We were less concerned about breaking the sample/mask (although that is of course a concern) but more with the uniformity of the contact, which leads to poor resolution and/or definition. We had a post doc work out this plan. 1) Pattern and etch a grid with alpha numeric labels across a full wafer. 2) Place your sample piece onto the wafer above using a VERY small drop of DI water on the back of your sample (make sure it doesn't wick to the front of the sample). We use the size of a drip from the end of a pipette, so that it just barely spreads out across the sample (when in contact). 3) Place dummy samples of the same thickness on the patterned alpha numeric wafer to ensure the mask/wafer pieces are level during wedge compensation. This has worked VERY well for me, even in the case of thin flexible materials (Kapton). The reason for the labeled wafer is that you can use it again if you need to do alignment. You have to note where you placed the sample the first time but it reduces the "search and find" alignment strategy on your subsequent layers. If you are interested I'll look for those wafers tomorrow and send you a few images. We made some to keep on hand. Good luck! Aimee Bross Price Sr. Research Associate The Ohio State University Nanotech West Lab Institute for Materials Research 1381 Kinnear Road Suite 100 Columbus, OH 43212 614-292-2753 From: labnetwork-bounces at mtl.mit.edu On Behalf Of Lino Eugene Sent: Monday, November 16, 2020 5:39 PM To: Orad Reshef ; Nathanael Sieb ; Michael Rooks ; Carsen Kline Cc: 'labnetwork at mtl.mit.edu' Subject: Re: [labnetwork] Resist coating of tiny pieces Dear Orad, Michael, Nathanael and Carsen, Thanks for your reply. It is good to know that mounting a tiny piece on a carrier wafer is sufficient for EBL. Sorry for not providing the context . We have currently an user who wants to plasma etch several microns of dielectric on a diced chip of ~3 mmx 3 mm. A thick photoresist is needed and I think that just mounting the chip on a carrier wafer would not work well. I was suggested to use dummy pieces placed all around the chip, which should work well for this process. Also, I believe that this would avoid also to break the chip or the carrier wafer (or the photomask?) because of the pressure applied during the wedge compensation on the mask aligner but maybe there is nothing to be worried about. Best, Lino Eugene, P.Eng., Ph.D., Micro/nanofabrication process engineer Quantum Nano-Fabrication and Characterization Facility QNC 1611 University of Waterloo 200 University Avenue West Waterloo, ON, Canada N2L 3G1 Ph: +1 519-888-4567 #37788 Cell: +1 226-929-1685 Website: https://qnfcf.uwaterloo.ca/ From: Orad Reshef [mailto:orad at reshef.ca] Sent: November 16, 2020 16:19 To: Lino Eugene > Cc: labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Resist coating of tiny pieces Dear Lino, We need a little more context for what you consider a "tiny piece". I routinely work with 1x1 cm pieces, and for those we use chucks that have an o-ring about 0.5 cm in diameter. I have colleagues who have worked with 1mm x 1mm square diced samples. They mounted those on a large si handle wafer using double-sided carbon tape, like you would use to mount a sample on an SEM stub. Hope this helps, Orad Orad Reshef, PhD D?partement de physique | Department of Physics Universit? d'Ottawa | University of Ottawa boydnlo.ca | reshef.ca On Mon, Nov 16, 2020 at 11:44 AM Lino Eugene > wrote: Dear colleagues, We are having more users who work on tiny pieces to be coated with photo and e-beam resist. I am thinking of different ways to coat these pieces: * custom chucks with a recess of the size of the chip * Si carrier wafer with recess etched by SF6 plasma * MicroSpray photoresist I am wondering if you could share the techniques you use to get uniform coating on very small pieces. Best, Lino Eugene, P.Eng., Ph.D., Micro/nanofabrication process engineer Quantum-Nano Fabrication and Characterization Facility QNC 1611 University of Waterloo 200 University Avenue West Waterloo, ON, Canada N2L 3G1 Ph: +1 519-888-4567 #37788 Cell: +1 226-929-1685 Website: https://fab.qnc.uwaterloo.ca/ _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From demis at ucsb.edu Mon Nov 16 20:58:42 2020 From: demis at ucsb.edu (Demis D. John) Date: Mon, 16 Nov 2020 17:58:42 -0800 Subject: [labnetwork] Resist coating of tiny pieces In-Reply-To: References: Message-ID: <687666FA-8505-4014-997D-6F6D2E03619D@ucsb.edu> In our lab, users will often do the following (I?ve just seen them do this, and asked about it): ? dice shim pieces that are of similar thickness (eg. Within 50-100\microns) of the main sample piece. These will be re-used throughout the ?fab process. ? shim pieces are same width as the real piece. Eg. If the real piece is 3x3mm 500?m thick, the shim pieces (of any material) would also be 3mmx3mm and 450-550?m thick or so. ? on Nitto Denko Blue tape, low adhesion, sticky side up: place the real piece in the middle, and a number of the shim pieces around the real piece, placed as close as possible to the real piece. I don?t remember if they do only 4 shims (edges only), or all 8 shims (fully surrounding). Probably cut off some excess tape around the edges to match the vacuum chuck in next step, although I?ve seen them spin with excess tape hanging off. ? place this assembly onto the vacuum chuck, where the vacuum chuck is large enough to support all the pieces - eg. 2.5cm wide. ? after spinning, un mount and bake the small piece by itself. The blue tape assembly can be reused to spin other pieces, although I imagine this can be tricky. Mostly our GaN users have done this, those who really needed to recover the edge bead regions. It obviously takes a good amount of extra effort (additional 5-10min per spin), but it appears the point is to reduce the thicker edge bead and produce a larger area of good die, improving contact uniformity as well. If they were ok with the the thicker/wider edge bead, they?d just use the chuck that has a small vacuum pedestal (eg. 2mm wide). I hope that helps! -- Demis > On Nov 16, 2020, at 14:39, Lino Eugene wrote: > > ? > Dear Orad, Michael, Nathanael and Carsen, > > Thanks for your reply. It is good to know that mounting a tiny piece on a carrier wafer is sufficient for EBL. > > Sorry for not providing the context . We have currently an user who wants to plasma etch several microns of dielectric on a diced chip of ~3 mmx 3 mm. A thick photoresist is needed and I think that just mounting the chip on a carrier wafer would not work well. I was suggested to use dummy pieces placed all around the chip, which should work well for this process. Also, I believe that this would avoid also to break the chip or the carrier wafer (or the photomask?) because of the pressure applied during the wedge compensation on the mask aligner but maybe there is nothing to be worried about. > > Best, > > Lino Eugene, P.Eng., Ph.D., > Micro/nanofabrication process engineer > Quantum Nano-Fabrication and Characterization Facility > QNC 1611 > University of Waterloo > 200 University Avenue West > Waterloo, ON, Canada > N2L 3G1 > > Ph: +1 519-888-4567 #37788 > Cell: +1 226-929-1685 > Website: https://qnfcf.uwaterloo.ca/ > > > > From: Orad Reshef [mailto:orad at reshef.ca] > Sent: November 16, 2020 16:19 > To: Lino Eugene > Cc: labnetwork at mtl.mit.edu > Subject: Re: [labnetwork] Resist coating of tiny pieces > > Dear Lino, > > We need a little more context for what you consider a "tiny piece". I routinely work with 1x1 cm pieces, and for those we use chucks that have an o-ring about 0.5 cm in diameter. > > I have colleagues who have worked with 1mm x 1mm square diced samples. They mounted those on a large si handle wafer using double-sided carbon tape, like you would use to mount a sample on an SEM stub. > > Hope this helps, > Orad > > Orad Reshef, PhD > > D?partement de physique | Department of Physics > Universit? d?Ottawa | University of Ottawa > boydnlo.ca | reshef.ca > > > On Mon, Nov 16, 2020 at 11:44 AM Lino Eugene wrote: > Dear colleagues, > > We are having more users who work on tiny pieces to be coated with photo and e-beam resist. > > I am thinking of different ways to coat these pieces: > ? custom chucks with a recess of the size of the chip > > ? Si carrier wafer with recess etched by SF6 plasma > > ? MicroSpray photoresist > > > I am wondering if you could share the techniques you use to get uniform coating on very small pieces. > > Best, > > Lino Eugene, P.Eng., Ph.D., > Micro/nanofabrication process engineer > Quantum-Nano Fabrication and Characterization Facility > QNC 1611 > University of Waterloo > 200 University Avenue West > Waterloo, ON, Canada > N2L 3G1 > > Ph: +1 519-888-4567 #37788 > Cell: +1 226-929-1685 > Website: https://fab.qnc.uwaterloo.ca/ > > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From johnkym at ee.columbia.edu Tue Nov 17 11:46:29 2020 From: johnkym at ee.columbia.edu (Ioannis (John) Kymissis) Date: Tue, 17 Nov 2020 11:46:29 -0500 Subject: [labnetwork] Resist coating of tiny pieces In-Reply-To: References: Message-ID: Lots of good advice here - I can offer two other small observations. 1. Shimming really helps...this has worked much better than trying to make a recessed holder, using scrap pieces works well 2. Spinning the piece off-center also helps - the shims then only need to be on the outside. This is discussed a bit here: https://doi.org/10.1109/JMEMS.2017.2691585 (Fig 11) There is another trick for contact lithography on these size pieces if the shimming does not work for whatever reason and you can afford to lose the edges.... You can make a mask pattern that removes the edge bead (we have a mask with all relevant rectangles on it in 100 micron steps), shoot that without contact and develop it. Without that edge, establishing contact is easier. I've used this in the past, but we've moved to the shimming/off center approach for more recent work. Thanks, -John ----- Ioannis (John) Kymissis Kenneth Brayer Professor of Electrical Engineering Chair, Department of Electrical Engineering Columbia University SEAS 500 W120th Street Room 1300/MC 4712 New York, NY 10027 Tel: 347-850-0235 Fax: 212-932-9421 johnkym at ee.columbia.edu http://kymissis.columbia.edu On Mon, Nov 16, 2020 at 9:23 PM Price, Aimee wrote: > > Hi Lino, > > You are getting good ideas for the resist but you are correct that you?ll need to do something to level the sample during contact, if you are in fact using a contact aligner. We were less concerned about breaking the sample/mask (although that is of course a concern) but more with the uniformity of the contact, which leads to poor resolution and/or definition. > > > > We had a post doc work out this plan. > > 1) Pattern and etch a grid with alpha numeric labels across a full wafer. > > 2) Place your sample piece onto the wafer above using a VERY small drop of DI water on the back of your sample (make sure it doesn?t wick to the front of the sample). We use the size of a drip from the end of a pipette, so that it just barely spreads out across the sample (when in contact). > > 3) Place dummy samples of the same thickness on the patterned alpha numeric wafer to ensure the mask/wafer pieces are level during wedge compensation. > > > > This has worked VERY well for me, even in the case of thin flexible materials (Kapton). The reason for the labeled wafer is that you can use it again if you need to do alignment. You have to note where you placed the sample the first time but it reduces the ?search and find? alignment strategy on your subsequent layers. > > > > If you are interested I?ll look for those wafers tomorrow and send you a few images. We made some to keep on hand. > > > > Good luck! > > > > Aimee Bross Price > > > > Sr. Research Associate > > The Ohio State University > > Nanotech West Lab > > Institute for Materials Research > > 1381 Kinnear Road > > Suite 100 > > Columbus, OH 43212 > > 614-292-2753 > > > > > > > > > > > > From: labnetwork-bounces at mtl.mit.edu On Behalf Of Lino Eugene > Sent: Monday, November 16, 2020 5:39 PM > To: Orad Reshef ; Nathanael Sieb ; Michael Rooks ; Carsen Kline > Cc: 'labnetwork at mtl.mit.edu' > Subject: Re: [labnetwork] Resist coating of tiny pieces > > > > Dear Orad, Michael, Nathanael and Carsen, > > > > Thanks for your reply. It is good to know that mounting a tiny piece on a carrier wafer is sufficient for EBL. > > > > Sorry for not providing the context . We have currently an user who wants to plasma etch several microns of dielectric on a diced chip of ~3 mmx 3 mm. A thick photoresist is needed and I think that just mounting the chip on a carrier wafer would not work well. I was suggested to use dummy pieces placed all around the chip, which should work well for this process. Also, I believe that this would avoid also to break the chip or the carrier wafer (or the photomask?) because of the pressure applied during the wedge compensation on the mask aligner but maybe there is nothing to be worried about. > > > > Best, > > > > Lino Eugene, P.Eng., Ph.D., > > Micro/nanofabrication process engineer > > Quantum Nano-Fabrication and Characterization Facility > > QNC 1611 > > University of Waterloo > > 200 University Avenue West > > Waterloo, ON, Canada > > N2L 3G1 > > > > Ph: +1 519-888-4567 #37788 > > Cell: +1 226-929-1685 > > Website: https://qnfcf.uwaterloo.ca/ > > > > > > > > From: Orad Reshef [mailto:orad at reshef.ca] > Sent: November 16, 2020 16:19 > To: Lino Eugene > Cc: labnetwork at mtl.mit.edu > Subject: Re: [labnetwork] Resist coating of tiny pieces > > > > Dear Lino, > > > > We need a little more context for what you consider a "tiny piece". I routinely work with 1x1 cm pieces, and for those we use chucks that have an o-ring about 0.5 cm in diameter. > > > > I have colleagues who have worked with 1mm x 1mm square diced samples. They mounted those on a large si handle wafer using double-sided carbon tape, like you would use to mount a sample on an SEM stub. > > > > Hope this helps, > > Orad > > > Orad Reshef, PhD > > > D?partement de physique | Department of Physics > Universit? d?Ottawa | University of Ottawa > boydnlo.ca | reshef.ca > > > > > > On Mon, Nov 16, 2020 at 11:44 AM Lino Eugene wrote: > > Dear colleagues, > > > > We are having more users who work on tiny pieces to be coated with photo and e-beam resist. > > > > I am thinking of different ways to coat these pieces: > > ? custom chucks with a recess of the size of the chip > > ? Si carrier wafer with recess etched by SF6 plasma > > ? MicroSpray photoresist > > > > I am wondering if you could share the techniques you use to get uniform coating on very small pieces. > > > > Best, > > > > Lino Eugene, P.Eng., Ph.D., > > Micro/nanofabrication process engineer > > Quantum-Nano Fabrication and Characterization Facility > > QNC 1611 > > University of Waterloo > > 200 University Avenue West > > Waterloo, ON, Canada > > N2L 3G1 > > > > Ph: +1 519-888-4567 #37788 > > Cell: +1 226-929-1685 > > Website: https://fab.qnc.uwaterloo.ca/ > > > > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork From eva.rose at gno.de Tue Nov 17 14:10:11 2020 From: eva.rose at gno.de (Eva Rose) Date: Tue, 17 Nov 2020 20:10:11 +0100 Subject: [labnetwork] Who is selling this old DWL66fs through CAEOnline? Message-ID: <341d9d68-ce9a-37ce-e127-a4f9a3219902@gno.de> Dear all, does anybody of you sell this old DWL66 through CAEonline (or knows who is selling it?) It would be great if I could get in contact with a responsible of this institution. Please send me an email. I would like to give you a call. Thanks a lot and stay all well! Eva From julia.aebersold at louisville.edu Wed Nov 18 10:34:34 2020 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Wed, 18 Nov 2020 15:34:34 +0000 Subject: [labnetwork] Who is selling this old DWL66fs through CAEOnline? In-Reply-To: <341d9d68-ce9a-37ce-e127-a4f9a3219902@gno.de> References: <341d9d68-ce9a-37ce-e127-a4f9a3219902@gno.de> Message-ID: Link? Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville Shumaker Research Building, Room 233 2210 South Brook Street Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ -----Original Message----- From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Eva Rose Sent: Tuesday, November 17, 2020 2:10 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Who is selling this old DWL66fs through CAEOnline? CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. Dear all, does anybody of you sell this old DWL66 through CAEonline (or knows who is selling it?) It would be great if I could get in contact with a responsible of this institution. Please send me an email. I would like to give you a call. Thanks a lot and stay all well! Eva _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://nam03.safelinks.protection.outlook.com/?url=https%3A%2F%2Fmtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork&data=04%7C01%7Cjulia.aebersold%40louisville.edu%7Cd3b62a46f2fa43a054f008d88b5c3eea%7Cdd246e4a54344e158ae391ad9797b209%7C0%7C1%7C637412575599365498%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C2000&sdata=BPl61plyUi%2FWVE9eu8fW6pEhBm6uOU0V5DEHaWAo18I%3D&reserved=0 From johnkym at ee.columbia.edu Wed Nov 18 13:10:55 2020 From: johnkym at ee.columbia.edu (Ioannis (John) Kymissis) Date: Wed, 18 Nov 2020 13:10:55 -0500 Subject: [labnetwork] Advice on fine pitch laser trimming services? Message-ID: Hello, I was wondering if there is any advice regarding a service for high resolution laser fuse trimming - we used to use a service that had an ESI 9820 system to program 1 micron scale serialization fuses (on a 5um pitch), but that service is unfortunately no longer available. I'd appreciate any pointers to a service that has an ESI 9820/ESI 9850 or similar system that could handle this small spot size. Thanks, -John ----- Ioannis (John) Kymissis Kenneth Brayer Professor of Electrical Engineering Chair, Department of Electrical Engineering Columbia University SEAS 500 W120th Street Room 1300/MC 4712 New York, NY 10027 Tel: 347-850-0235 Fax: 212-932-9421 johnkym at ee.columbia.edu http://kymissis.columbia.edu From lino.eugene at uwaterloo.ca Wed Nov 18 16:42:56 2020 From: lino.eugene at uwaterloo.ca (Lino Eugene) Date: Wed, 18 Nov 2020 21:42:56 +0000 Subject: [labnetwork] Resist coating of tiny pieces In-Reply-To: References: Message-ID: Thank you everyone for your valuable input. Best, Lino Eugene, P.Eng., Ph.D., Micro/nanofabrication process engineer Quantum Nano-Fabrication and Characterization Facility QNC 1611 University of Waterloo 200 University Avenue West Waterloo, ON, Canada ? N2L 3G1 Ph: +1 519-888-4567 #37788 Cell: +1 226-929-1685 Website: https://qnfcf.uwaterloo.ca/ -----Original Message----- From: Ioannis (John) Kymissis [mailto:johnkym at ee.columbia.edu] Sent: November 17, 2020 11:46 To: Price, Aimee Cc: Lino Eugene ; Orad Reshef ; Nathanael Sieb ; Michael Rooks ; Carsen Kline ; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Resist coating of tiny pieces Lots of good advice here - I can offer two other small observations. 1. Shimming really helps...this has worked much better than trying to make a recessed holder, using scrap pieces works well 2. Spinning the piece off-center also helps - the shims then only need to be on the outside. This is discussed a bit here: https://doi.org/10.1109/JMEMS.2017.2691585 (Fig 11) There is another trick for contact lithography on these size pieces if the shimming does not work for whatever reason and you can afford to lose the edges.... You can make a mask pattern that removes the edge bead (we have a mask with all relevant rectangles on it in 100 micron steps), shoot that without contact and develop it. Without that edge, establishing contact is easier. I've used this in the past, but we've moved to the shimming/off center approach for more recent work. Thanks, -John ----- Ioannis (John) Kymissis Kenneth Brayer Professor of Electrical Engineering Chair, Department of Electrical Engineering Columbia University SEAS 500 W120th Street Room 1300/MC 4712 New York, NY 10027 Tel: 347-850-0235 Fax: 212-932-9421 johnkym at ee.columbia.edu http://kymissis.columbia.edu On Mon, Nov 16, 2020 at 9:23 PM Price, Aimee wrote: > > Hi Lino, > > You are getting good ideas for the resist but you are correct that you'll need to do something to level the sample during contact, if you are in fact using a contact aligner. We were less concerned about breaking the sample/mask (although that is of course a concern) but more with the uniformity of the contact, which leads to poor resolution and/or definition. > > > > We had a post doc work out this plan. > > 1) Pattern and etch a grid with alpha numeric labels across a full wafer. > > 2) Place your sample piece onto the wafer above using a VERY small drop of DI water on the back of your sample (make sure it doesn't wick to the front of the sample). We use the size of a drip from the end of a pipette, so that it just barely spreads out across the sample (when in contact). > > 3) Place dummy samples of the same thickness on the patterned alpha numeric wafer to ensure the mask/wafer pieces are level during wedge compensation. > > > > This has worked VERY well for me, even in the case of thin flexible materials (Kapton). The reason for the labeled wafer is that you can use it again if you need to do alignment. You have to note where you placed the sample the first time but it reduces the "search and find" alignment strategy on your subsequent layers. > > > > If you are interested I'll look for those wafers tomorrow and send you a few images. We made some to keep on hand. > > > > Good luck! > > > > Aimee Bross Price > > > > Sr. Research Associate > > The Ohio State University > > Nanotech West Lab > > Institute for Materials Research > > 1381 Kinnear Road > > Suite 100 > > Columbus, OH 43212 > > 614-292-2753 > > > > > > > > > > > > From: labnetwork-bounces at mtl.mit.edu > On Behalf Of Lino Eugene > Sent: Monday, November 16, 2020 5:39 PM > To: Orad Reshef ; Nathanael Sieb ; > Michael Rooks ; Carsen Kline > > Cc: 'labnetwork at mtl.mit.edu' > Subject: Re: [labnetwork] Resist coating of tiny pieces > > > > Dear Orad, Michael, Nathanael and Carsen, > > > > Thanks for your reply. It is good to know that mounting a tiny piece on a carrier wafer is sufficient for EBL. > > > > Sorry for not providing the context . We have currently an user who wants to plasma etch several microns of dielectric on a diced chip of ~3 mmx 3 mm. A thick photoresist is needed and I think that just mounting the chip on a carrier wafer would not work well. I was suggested to use dummy pieces placed all around the chip, which should work well for this process. Also, I believe that this would avoid also to break the chip or the carrier wafer (or the photomask?) because of the pressure applied during the wedge compensation on the mask aligner but maybe there is nothing to be worried about. > > > > Best, > > > > Lino Eugene, P.Eng., Ph.D., > > Micro/nanofabrication process engineer > > Quantum Nano-Fabrication and Characterization Facility > > QNC 1611 > > University of Waterloo > > 200 University Avenue West > > Waterloo, ON, Canada > > N2L 3G1 > > > > Ph: +1 519-888-4567 #37788 > > Cell: +1 226-929-1685 > > Website: https://qnfcf.uwaterloo.ca/ > > > > > > > > From: Orad Reshef [mailto:orad at reshef.ca] > Sent: November 16, 2020 16:19 > To: Lino Eugene > Cc: labnetwork at mtl.mit.edu > Subject: Re: [labnetwork] Resist coating of tiny pieces > > > > Dear Lino, > > > > We need a little more context for what you consider a "tiny piece". I routinely work with 1x1 cm pieces, and for those we use chucks that have an o-ring about 0.5 cm in diameter. > > > > I have colleagues who have worked with 1mm x 1mm square diced samples. They mounted those on a large si handle wafer using double-sided carbon tape, like you would use to mount a sample on an SEM stub. > > > > Hope this helps, > > Orad > > > Orad Reshef, PhD > > > D?partement de physique | Department of Physics Universit? d'Ottawa | > University of Ottawa boydnlo.ca | reshef.ca > > > > > > On Mon, Nov 16, 2020 at 11:44 AM Lino Eugene wrote: > > Dear colleagues, > > > > We are having more users who work on tiny pieces to be coated with photo and e-beam resist. > > > > I am thinking of different ways to coat these pieces: > > ? custom chucks with a recess of the size of the chip > > ? Si carrier wafer with recess etched by SF6 plasma > > ? MicroSpray photoresist > > > > I am wondering if you could share the techniques you use to get uniform coating on very small pieces. > > > > Best, > > > > Lino Eugene, P.Eng., Ph.D., > > Micro/nanofabrication process engineer > > Quantum-Nano Fabrication and Characterization Facility > > QNC 1611 > > University of Waterloo > > 200 University Avenue West > > Waterloo, ON, Canada > > N2L 3G1 > > > > Ph: +1 519-888-4567 #37788 > > Cell: +1 226-929-1685 > > Website: https://fab.qnc.uwaterloo.ca/ > > > > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork From lino.eugene at uwaterloo.ca Thu Nov 19 10:15:09 2020 From: lino.eugene at uwaterloo.ca (Lino Eugene) Date: Thu, 19 Nov 2020 15:15:09 +0000 Subject: [labnetwork] Electrical properties of PECVD oxide deposited in Oxford System100 Message-ID: Dear colleagues, I have done some CV measurements on a MOS capacitor with 22 nm PECVD oxide deposited in a Oxford System100 system for the first time. I noticed that: ? The as-deposited layer has bad CV characteristics with large flatband voltage, hysteresis and shoulder at low frequency, which indicates the presence of interface traps. ? A post-Aluminum metallization annealing in forming gas substantially improves the CV characteristics with a lower capacitance in accumulation, low flat band voltage, inversion at low frequency and no hysteresis. I am wondering if this is expected for PECVD oxide and if forming gas annealing is always required to improve the characteristics. Has one of you have done these measurements for PECVD oxide deposited in similar systems and could share data for comparison? I can provide the CV curves if required. Best, Lino Eugene, P.Eng., Ph.D., Micro/nanofabrication process engineer Quantum-Nano Fabrication and Characterization Facility QNC 1611 University of Waterloo 200 University Avenue West Waterloo, ON, Canada N2L 3G1 Ph: +1 519-888-4567 #37788 Cell: +1 226-929-1685 Website: https://fab.qnc.uwaterloo.ca/ -------------- next part -------------- An HTML attachment was scrubbed... URL: From betemc at rit.edu Fri Nov 20 11:40:55 2020 From: betemc at rit.edu (Bruce Tolleson) Date: Fri, 20 Nov 2020 16:40:55 +0000 Subject: [labnetwork] 150mm quartz diffusion boat lifting handle Message-ID: Dear Labnetwork, We have been trying to find a source for new Vespel lifting forks to replace our older ones. Does anyone know of a company that can provide. The picture attached is from RECIF but they no longer manufacture them. I have asked for quotes from G2 and H Squared with no response. Any contacts would be welcome. Thank you, Bruce E. Tolleson Rochester Institute of Technology 82 Lomb Memorial Drive, Bldg 17-2627 Rochester, NY 14623-5604 (585) 478-3836 [http://www.rit.edu/~962www/logos/tiger_walking_rit_color.jpg] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 2550 bytes Desc: image001.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: boat fork.jpg Type: image/jpeg Size: 3718356 bytes Desc: boat fork.jpg URL: From tony.olsen at utah.edu Fri Nov 20 15:57:38 2020 From: tony.olsen at utah.edu (Tony L Olsen) Date: Fri, 20 Nov 2020 20:57:38 +0000 Subject: [labnetwork] 150mm quartz diffusion boat lifting handle In-Reply-To: References: Message-ID: <04ecf61e57e44259bdd7c424b4279e29@utah.edu> I bought mine a few years ago from GL Automation (glautomation.com) in Dallas. tonyO Tony Olsen Nanofab Cleanroom Supervisor/Process Engineer University of Utah 36 S Wasatch Drive, Suite 2500 Salt Lake City, UT 84112 801-587-0651 www.nanofab.utah.edu From: Bruce Tolleson Sent: Friday, November 20, 2020 09:41 To: labnetwork at mtl.mit.edu Subject: [labnetwork] 150mm quartz diffusion boat lifting handle Dear Labnetwork, We have been trying to find a source for new Vespel lifting forks to replace our older ones. Does anyone know of a company that can provide. The picture attached is from RECIF but they no longer manufacture them. I have asked for quotes from G2 and H Squared with no response. Any contacts would be welcome. Thank you, Bruce E. Tolleson Rochester Institute of Technology 82 Lomb Memorial Drive, Bldg 17-2627 Rochester, NY 14623-5604 (585) 478-3836 [http://www.rit.edu/~962www/logos/tiger_walking_rit_color.jpg] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 2550 bytes Desc: image001.jpg URL: From dcchrist at wisc.edu Fri Nov 20 16:19:46 2020 From: dcchrist at wisc.edu (Daniel Christensen) Date: Fri, 20 Nov 2020 21:19:46 +0000 Subject: [labnetwork] 150mm quartz diffusion boat lifting handle In-Reply-To: References: Message-ID: Hi Bruce, I'm not sure what your lifting fork is used for, but I made my own for our furnace boats. I welded up SS tubing and attached quartz rods for the actual fork tines using ultratorr fittings welded to the "handle" I attached a picture. The picture shows the right hand tine is moveable for different size boats, in practice, it is just left in one spot and researchers pick up the boats by the top rail of the boat not the slot thru the end rails (we never have full boats). This is also because it is very difficult to weld both the two tines parallel and coplanar. Anyway depending on your application, you may be able to make your own. Good luck, Dan Christensen Univ. Wisconsin-Madison From: labnetwork-bounces at mtl.mit.edu On Behalf Of Bruce Tolleson Sent: Friday, November 20, 2020 10:41 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] 150mm quartz diffusion boat lifting handle Dear Labnetwork, We have been trying to find a source for new Vespel lifting forks to replace our older ones. Does anyone know of a company that can provide. The picture attached is from RECIF but they no longer manufacture them. I have asked for quotes from G2 and H Squared with no response. Any contacts would be welcome. Thank you, Bruce E. Tolleson Rochester Institute of Technology 82 Lomb Memorial Drive, Bldg 17-2627 Rochester, NY 14623-5604 (585) 478-3836 [http://www.rit.edu/~962www/logos/tiger_walking_rit_color.jpg] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.jpg Type: image/jpeg Size: 2550 bytes Desc: image001.jpg URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: UWisc_homemade_fork.JPG Type: image/jpeg Size: 72327 bytes Desc: UWisc_homemade_fork.JPG URL: From jbtausch at uw.edu Mon Nov 23 20:26:48 2020 From: jbtausch at uw.edu (jbtausch) Date: Tue, 24 Nov 2020 01:26:48 +0000 Subject: [labnetwork] CdS deposition Message-ID: Hello, I have a user asking about thick film deposition of GdS or GaP in the 5-100 um range. Does anybody know how people might be doing anything like that? There seem to be a number of techniques in the sub-micron range. I'd love to put them in touch with someone that has previous experience. Thank you. Jason Tauscher Manager, Business Outreach and Customer Development Washington Nanofabrication Facility (WNF) University of Washington (206) 616-9409 jbtausch at UW.edu https://www.wnf.washington.edu/ [cid:image001.png at 01D6C1BD.D208CC60] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 50475 bytes Desc: image001.png URL: From derose at caltech.edu Tue Nov 24 19:34:52 2020 From: derose at caltech.edu (DeRose, Guy A.) Date: Wed, 25 Nov 2020 00:34:52 +0000 Subject: [labnetwork] C4F8 being hard to find? In-Reply-To: References: Message-ID: <07A37D0A-1815-401D-AEA0-5403469EA0F8@caltech.edu> Hello community, From the time we re-opened our cleanroom back in June through now, we have had challenges sourcing C4F8 (Halocarbon C318) gas for our plasma etch tools. We have tried three different vendors, and the lead times have been unusually long. Are there any gas suppliers that any of you have had good luck sourcing this gas within a couple of weeks? I have been waiting for one cylinder to be shipped since October 5 and am still waiting. We have been trying to get enough to have a spare on hand, but sourcing has been an issue to the point of running empty while waiting for a replacement. Thanks, Guy Guy DeRose, PhD, Member of the Professional Staff Associate Director of Technical Operations, Kavli Nanoscience Institute California Institute of Technology, Pasadena, CA USA (O) 1-626-395-3423 (M) 1-626-676-8529 http://kni.caltech.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From glenne at ualberta.ca Wed Nov 25 10:34:35 2020 From: glenne at ualberta.ca (Glenn Elaschuk) Date: Wed, 25 Nov 2020 08:34:35 -0700 Subject: [labnetwork] C4F8 being hard to find? In-Reply-To: <07A37D0A-1815-401D-AEA0-5403469EA0F8@caltech.edu> References: <07A37D0A-1815-401D-AEA0-5403469EA0F8@caltech.edu> Message-ID: Hello, We purchase our C4F8 from Electronic Fluorocarbons. Ryan Dwinal Customer Sales & Service Manager Elecronic Fluorocarbons, LLC 3266 Bergey Rd Hatfield PA 19440 rdwinal at efgases.com Mobile: 508-395-0371 On Wed, Nov 25, 2020 at 6:30 AM DeRose, Guy A. wrote: > Hello community, > > > > From the time we re-opened our cleanroom back in June through now, we have > had challenges sourcing C4F8 (Halocarbon C318) gas for our plasma etch > tools. We have tried three different vendors, and the lead times have been > unusually long. Are there any gas suppliers that any of you have had good > luck sourcing this gas within a couple of weeks? I have been waiting for > one cylinder to be shipped since October 5 and am still waiting. We have > been trying to get enough to have a spare on hand, but sourcing has been an > issue to the point of running empty while waiting for a replacement. > > > > Thanks, > > Guy > > > > Guy DeRose, PhD, Member of the Professional Staff > > Associate Director of Technical Operations, Kavli Nanoscience Institute > > California Institute of Technology, Pasadena, CA USA > > (O) 1-626-395-3423 (M) 1-626-676-8529 > > http://kni.caltech.edu > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -- Glenn Elaschuk, EET Systems/Infrastructure Specialist. University of Alberta - nanoFAB W1-060 ECERF Building 9107-116 Street Edmonton, AB. Canada T6G 2V4 Ph. 587-879-1518 www.nanofab.ualberta.ca -------------- next part -------------- An HTML attachment was scrubbed... URL: From schweig at umich.edu Wed Nov 25 16:55:16 2020 From: schweig at umich.edu (Dennis Schweiger) Date: Wed, 25 Nov 2020 16:55:16 -0500 Subject: [labnetwork] C4F8 being hard to find? In-Reply-To: <07A37D0A-1815-401D-AEA0-5403469EA0F8@caltech.edu> References: <07A37D0A-1815-401D-AEA0-5403469EA0F8@caltech.edu> Message-ID: Guy, We used to purchase C4F8 from Concord Specialty Gases (1-800-818-5109). However back in 2013 we switched and now use our local specialty gas vendor (Cryogenic Gases (313)835-5513) for sourcing this material as it was less hassle to return the empties. I am not sure who they're using as the supplier, but will check with them. Dennis Schweiger University of Michigan/LNF 734.647.2055 Ofc "People can be divided into 3 groups - those that make things happen, those that watch things happen, and those that wonder what happened." Within which group do you belong? On Wed, Nov 25, 2020 at 8:30 AM DeRose, Guy A. wrote: > Hello community, > > > > From the time we re-opened our cleanroom back in June through now, we have > had challenges sourcing C4F8 (Halocarbon C318) gas for our plasma etch > tools. We have tried three different vendors, and the lead times have been > unusually long. Are there any gas suppliers that any of you have had good > luck sourcing this gas within a couple of weeks? I have been waiting for > one cylinder to be shipped since October 5 and am still waiting. We have > been trying to get enough to have a spare on hand, but sourcing has been an > issue to the point of running empty while waiting for a replacement. > > > > Thanks, > > Guy > > > > Guy DeRose, PhD, Member of the Professional Staff > > Associate Director of Technical Operations, Kavli Nanoscience Institute > > California Institute of Technology, Pasadena, CA USA > > (O) 1-626-395-3423 (M) 1-626-676-8529 > > http://kni.caltech.edu > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From aandreib at gmail.com Wed Nov 25 22:06:30 2020 From: aandreib at gmail.com (Andrei Alamariu) Date: Wed, 25 Nov 2020 22:06:30 -0500 Subject: [labnetwork] Electrical properties of PECVD oxide deposited in Oxford System100 In-Reply-To: References: Message-ID: <91FE8CCE-E678-4E0F-BA8A-E57D519EC312@gmail.com> Hello, Yes, this is always expected from PECVD oxides. The Forming Gas 7.5% H2 in N2 Sintering is required for all thermal and deposited oxides after metalisation. For Al you can go as high to 550C. There are 2 issues regarding these films. First you have to do a high temperature anneal ~>800C ( or as high as Your device/ process allows; we did for SiGe a 4 hour anneal at 600C) before the metal processing. This is to allow the excess Oxygen and Silicon molecules to react and to force the H2 and other gases to exdiffuse. This will dramatically improve the oxide dielectric breakdown voltage value. Second this PECVD process inserts a lot of metal contaminants into the deposited thin film, mostly by sputtering of the industrial grade Al or SS gas shower / unless you use an expensive up to date Remote Plasma PECVD machine. You can use the MOS capacitor with HF CV plot to accurately measure the mobile Ions concentration in the oxide by BTS technique. It is very sensitive. Also you can measure the deep level minority carriers killer metals by deep depletion CV lifetime Zerbst test. I would like to see those CV plots, please. Thanks, Bernard aandreib at gmail.com Sent from my iPad > On Nov 19, 2020, at 10:15 AM, Lino Eugene wrote: > > Dear colleagues, > > I have done some CV measurements on a MOS capacitor with 22 nm PECVD oxide deposited in a Oxford System100 system for the first time. I noticed that: > ? The as-deposited layer has bad CV characteristics with large flatband voltage, hysteresis and shoulder at low frequency, which indicates the presence of interface traps. > ? A post-Aluminum metallization annealing in forming gas substantially improves the CV characteristics with a lower capacitance in accumulation, low flat band voltage, inversion at low frequency and no hysteresis. > > I am wondering if this is expected for PECVD oxide and if forming gas annealing is always required to improve the characteristics. Has one of you have done these measurements for PECVD oxide deposited in similar systems and could share data for comparison? > > I can provide the CV curves if required. > > Best, > > Lino Eugene, P.Eng., Ph.D., > Micro/nanofabrication process engineer > Quantum-Nano Fabrication and Characterization Facility > QNC 1611 > University of Waterloo > 200 University Avenue West > Waterloo, ON, Canada > N2L 3G1 > > Ph: +1 519-888-4567 #37788 > Cell: +1 226-929-1685 > Website: https://fab.qnc.uwaterloo.ca/ > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From cwolin at icloud.com Thu Nov 26 02:29:54 2020 From: cwolin at icloud.com (Corey Wolin) Date: Wed, 25 Nov 2020 23:29:54 -0800 Subject: [labnetwork] C4F8 being hard to find? In-Reply-To: References: Message-ID: Check with Advanced Specialty Gases (Reno,NV), can typically have this and other HC gases delivered in 2-3 Days. Prices are competitive. https://www.advancedspecialtygases.com/#footer Corey ?One Test is worth an infinite number of expert opinions? > On Nov 25, 2020, at 4:47 PM, Dennis Schweiger wrote: > > ? > Guy, > > We used to purchase C4F8 from Concord Specialty Gases (1-800-818-5109). However back in 2013 we switched and now use our local specialty gas vendor (Cryogenic Gases (313)835-5513) for sourcing this material as it was less hassle to return the empties. I am not sure who they're using as the supplier, but will check with them. > > Dennis Schweiger > University of Michigan/LNF > > 734.647.2055 Ofc > > "People can be divided into 3 groups - those that make things happen, those that watch things happen, and those that wonder what happened." Within which group do you belong? > > >> On Wed, Nov 25, 2020 at 8:30 AM DeRose, Guy A. wrote: >> Hello community, >> >> >> >> From the time we re-opened our cleanroom back in June through now, we have had challenges sourcing C4F8 (Halocarbon C318) gas for our plasma etch tools. We have tried three different vendors, and the lead times have been unusually long. Are there any gas suppliers that any of you have had good luck sourcing this gas within a couple of weeks? I have been waiting for one cylinder to be shipped since October 5 and am still waiting. We have been trying to get enough to have a spare on hand, but sourcing has been an issue to the point of running empty while waiting for a replacement. >> >> >> >> Thanks, >> >> Guy >> >> >> >> Guy DeRose, PhD, Member of the Professional Staff >> >> Associate Director of Technical Operations, Kavli Nanoscience Institute >> >> California Institute of Technology, Pasadena, CA USA >> >> (O) 1-626-395-3423 (M) 1-626-676-8529 >> >> http://kni.caltech.edu >> >> _______________________________________________ >> labnetwork mailing list >> labnetwork at mtl.mit.edu >> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From christopher_balicki at sfu.ca Fri Nov 27 14:38:36 2020 From: christopher_balicki at sfu.ca (Christopher Balicki) Date: Fri, 27 Nov 2020 19:38:36 +0000 Subject: [labnetwork] Silicon ebeam evaporation Message-ID: Hi All, Hope you are all well and keeping safe. We have received some interest from our users to provide a silicon evaporation process. Based on initial investigation, it appears that thermal evaporation is pretty much impossible and that ebeam evaporation could yield some results. That said, molten silicon is corrosive and pretty much alloys with anything it touches. If we were to use a crucible liner, the top candidate liner materials are copper, tantalum, and tungsten, however, liner lifetime and performance is unknown. And if we were to evaporate directly in the copper hearth, this would permanently assign the pocket to silicon, and potentially necessitate a hearth replacement at some point. Our top concerns are to (of course) maintain the safety and reliability of our PVD systems for our whole userbase. A silicon evaporation process would have to be robust and not cause excessive equipment downtime. Any advice and/or recommendations based on experience would be highly appreciated! Cheers, Chris Christopher Balicki Fabrication and Prototyping Manager | 4D LABS Simon Fraser University | TASC 2 8888 University Dr., Burnaby, B.C. V5A 1S6 T: 778 782 9322 | F: 778 782 3765 | www.4dlabs.ca Facebook | Twitter | LinkedIn [1585691682058] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: OutlookEmoji-158569168205833323425-7984-44ed-b216-c3a088f74322.png Type: image/png Size: 4353 bytes Desc: OutlookEmoji-158569168205833323425-7984-44ed-b216-c3a088f74322.png URL: From shimonel at savion.huji.ac.il Sat Nov 28 10:56:57 2020 From: shimonel at savion.huji.ac.il (Shimon Eliav) Date: Sat, 28 Nov 2020 15:56:57 +0000 Subject: [labnetwork] Silicon ebeam evaporation In-Reply-To: References: Message-ID: Hi Chris, Some months ago I developed an e-beam recipe for Si evaporation. I used FABMATE crucible and very standard procedure for e-beam deposition using a Telemark 6kW source (Soak 1, Ramp1, Ramp2, Soak 2 and Deposition phase). The rate deposition was set to 0.5 A/sec and we use to deposit 80nm layers followed by successful lift-off process. In the end of the process the crucible is cooled down gently to avoid cracks. The crucible survives the process and can be used many times. The deposition process itself is smooth. The chamber receives a brown color by the end of the deposition and for this thickness range we had not flakes. If you need more details feel free to contact me. Regards, Shimon The Unit for Nano Fabrication The Hebrew University of Jerusalem ISRAEL From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Christopher Balicki Sent: Friday, 27 November 2020 21:39 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Silicon ebeam evaporation Hi All, Hope you are all well and keeping safe. We have received some interest from our users to provide a silicon evaporation process. Based on initial investigation, it appears that thermal evaporation is pretty much impossible and that ebeam evaporation could yield some results. That said, molten silicon is corrosive and pretty much alloys with anything it touches. If we were to use a crucible liner, the top candidate liner materials are copper, tantalum, and tungsten, however, liner lifetime and performance is unknown. And if we were to evaporate directly in the copper hearth, this would permanently assign the pocket to silicon, and potentially necessitate a hearth replacement at some point. Our top concerns are to (of course) maintain the safety and reliability of our PVD systems for our whole userbase. A silicon evaporation process would have to be robust and not cause excessive equipment downtime. Any advice and/or recommendations based on experience would be highly appreciated! Cheers, Chris Christopher Balicki Fabrication and Prototyping Manager | 4D LABS Simon Fraser University | TASC 2 8888 University Dr., Burnaby, B.C. V5A 1S6 T: 778 782 9322 | F: 778 782 3765 | www.4dlabs.ca Facebook | Twitter | LinkedIn [1585691682058] -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 4353 bytes Desc: image001.png URL: From J_Hagopian at comcast.net Sat Nov 28 13:26:39 2020 From: J_Hagopian at comcast.net (John Hagopian) Date: Sat, 28 Nov 2020 13:26:39 -0500 Subject: [labnetwork] Silicon ebeam evaporation In-Reply-To: References: Message-ID: We have successfully sputtered silicon if that helps. John Sent from my iPhone > On Nov 28, 2020, at 12:48 PM, Shimon Eliav wrote: > > ? > Hi Chris, > > Some months ago I developed an e-beam recipe for Si evaporation. > > I used FABMATE crucible and very standard procedure for e-beam deposition using a Telemark 6kW source (Soak 1, Ramp1, Ramp2, Soak 2 and Deposition phase). The rate deposition was set to 0.5 A/sec and we use to deposit 80nm layers followed by successful lift-off process. In the end of the process the crucible is cooled down gently to avoid cracks. > > The crucible survives the process and can be used many times. The deposition process itself is smooth. The chamber receives a brown color by the end of the deposition and for this thickness range we had not flakes. > > If you need more details feel free to contact me. > > Regards, > > Shimon > The Unit for Nano Fabrication > The Hebrew University of Jerusalem > ISRAEL > > From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Christopher Balicki > Sent: Friday, 27 November 2020 21:39 > To: labnetwork at mtl.mit.edu > Subject: [labnetwork] Silicon ebeam evaporation > > Hi All, > > Hope you are all well and keeping safe. > > We have received some interest from our users to provide a silicon evaporation process. Based on initial investigation, it appears that thermal evaporation is pretty much impossible and that ebeam evaporation could yield some results. That said, molten silicon is corrosive and pretty much alloys with anything it touches. If we were to use a crucible liner, the top candidate liner materials are copper, tantalum, and tungsten, however, liner lifetime and performance is unknown. And if we were to evaporate directly in the copper hearth, this would permanently assign the pocket to silicon, and potentially necessitate a hearth replacement at some point. > > Our top concerns are to (of course) maintain the safety and reliability of our PVD systems for our whole userbase. A silicon evaporation process would have to be robust and not cause excessive equipment downtime. > > Any advice and/or recommendations based on experience would be highly appreciated! > > Cheers, > Chris > > Christopher Balicki > Fabrication and Prototyping Manager | 4D LABS > Simon Fraser University | TASC 2 > 8888 University Dr., Burnaby, B.C. V5A 1S6 > T: 778 782 9322 | F: 778 782 3765 | www.4dlabs.ca > Facebook | Twitter | LinkedIn > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: