From felix.jaeckel at wisc.edu Tue Sep 1 15:07:15 2020 From: felix.jaeckel at wisc.edu (Felix Jaeckel) Date: Tue, 1 Sep 2020 14:07:15 -0500 Subject: [labnetwork] looking for CF4 RIE Message-ID: Hi everyone, since our local RIE is currently down, we are looking for someone who could perform CF4 etching of SiN (~1um) for us on a few 4" Si wafers. Bonus would be if you had a SPTS Xactix E1 (or similar) XeF2 tool to perform an added etch step. The wafers would come pre-patterned with photoresist (covering Cu/Mo/SiN/SiO2/Si). If you are able to help, please contact me off-list with a rough idea of cost/compensation. We are hoping for a fairly quick turn-around also. Thank you! Felix -- Felix Jaeckel, Ph.D. Associate Scientist McCammon Astrophysics Lab Physics Department University of Wisconsin - Madison 1150 University Avenue Madison, WI 53706-1390 608 265-8958 From julia.aebersold at louisville.edu Wed Sep 2 11:06:37 2020 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Wed, 2 Sep 2020 15:06:37 +0000 Subject: [labnetwork] looking for CF4 RIE In-Reply-To: References: Message-ID: Felix, we can help you and we have both capabilities of CF4 connected to our RIE along with a Xactix XeF2 tool. http://louisville.edu/micronano/equipment-capabilities Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville Shumaker Research Building, Room 233 2210 South Brook Street Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ -----Original Message----- From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Felix Jaeckel Sent: Tuesday, September 1, 2020 3:07 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] looking for CF4 RIE CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. Hi everyone, since our local RIE is currently down, we are looking for someone who could perform CF4 etching of SiN (~1um) for us on a few 4" Si wafers. Bonus would be if you had a SPTS Xactix E1 (or similar) XeF2 tool to perform an added etch step. The wafers would come pre-patterned with photoresist (covering Cu/Mo/SiN/SiO2/Si). If you are able to help, please contact me off-list with a rough idea of cost/compensation. We are hoping for a fairly quick turn-around also. Thank you! Felix -- Felix Jaeckel, Ph.D. Associate Scientist McCammon Astrophysics Lab Physics Department University of Wisconsin - Madison 1150 University Avenue Madison, WI 53706-1390 608 265-8958 _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://nam03.safelinks.protection.outlook.com/?url=https%3A%2F%2Fmtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork&data=02%7C01%7Cjulia.aebersold%40louisville.edu%7C2520bfb159f54c63a0e208d84ed05296%7Cdd246e4a54344e158ae391ad9797b209%7C0%7C0%7C637346003948917672&sdata=bLGBLgAZXVDM1m%2B%2FE52kNYeoIOrQ9CNpF5exXjKNAuk%3D&reserved=0 From fnewman at uw.edu Thu Sep 3 17:01:44 2020 From: fnewman at uw.edu (Fred Newman) Date: Thu, 3 Sep 2020 14:01:44 -0700 Subject: [labnetwork] TiO2 PECVD Message-ID: Does anyone have a TiO2 PECVD or pulsed CVD process available in their lab, or by any chance know who might have one? Cheers Fred -- Fred Newman Research Engineer University of Washington, Washington Nanofabrication Facility 4000 Mason Rd, Fluke Hall Room 115 Seattle WA 98195-2143 office 206-616-3534 mobile 505-450-4447 fnewman at uw.edu https://www.wnf.washington.edu/ -------------- next part -------------- An HTML attachment was scrubbed... URL: From mfcchung at ust.hk Fri Sep 4 09:29:00 2020 From: mfcchung at ust.hk (Wing Leong CHUNG) Date: Fri, 4 Sep 2020 13:29:00 +0000 Subject: [labnetwork] Cleanroom structure Message-ID: <-mry4llctyhb4-hgmawc-fx0020ylhx44-67blf2-3d59od-5jk772-3dn1xcbx98ng65n7hn-wbcx3bgdwaad-4wiw43lzazf0-4dwp1gpj0f451vdi19ldudlq34cmny12fnsnkn74f-v4ffcv63xm4e.1599224737768@email.android.com> Dear all, NFF of HKUST are planning to build a new cleanroom research facility. We want to know the pros and cons of a vertical structure (cleanroom with sub-fab)? Hope can give us some valuable suggestion. May I have some examples of cleanroom with vertical structure as well. Many Thank. Jeff Chung Senior Manager, NFF, HKUST www.nff.ust.hk -------------- next part -------------- An HTML attachment was scrubbed... URL: From agregg at amts.com Fri Sep 4 14:33:22 2020 From: agregg at amts.com (Abbie Gregg) Date: Fri, 4 Sep 2020 18:33:22 +0000 Subject: [labnetwork] Cleanroom structure In-Reply-To: <-mry4llctyhb4-hgmawc-fx0020ylhx44-67blf2-3d59od-5jk772-3dn1xcbx98ng65n7hn-wbcx3bgdwaad-4wiw43lzazf0-4dwp1gpj0f451vdi19ldudlq34cmny12fnsnkn74f-v4ffcv63xm4e.1599224737768@email.android.com> References: <-mry4llctyhb4-hgmawc-fx0020ylhx44-67blf2-3d59od-5jk772-3dn1xcbx98ng65n7hn-wbcx3bgdwaad-4wiw43lzazf0-4dwp1gpj0f451vdi19ldudlq34cmny12fnsnkn74f-v4ffcv63xm4e.1599224737768@email.android.com> Message-ID: HI Wing Leong, Nice to meet you via Labnetwork. Very exciting to build a new research facility at HKUST. I know Greg Raupp very well who used to work there between stints at ASU. Use of a subfab can make the construction and eventual tool hookup much more expensive than a slab on grade or partial subfab type facility (which is also an option) . A full subfab set up on a Waffle Slab with raised access flooring, is not usually necessary for tools to support substrate sizes up to 6 inches or even 8 inches, whether wafers or other substrates. However, many modern production type tools for 200 mm and 300 mm are set up to facilitize the tools from below, using a subfab and raised access floor configuration. These larger substrate tools have a tool footprint in the subfab of a size similar to the fab level footprint configuration. So those will be most cost effective if facilitized with a subfab (a lower cost zone for the support equipment and utility distribution). Decisions on fab level height, use of Raised Access Flooring or not (eg Popouts), Vibration criteria, gas distribution and HPM storage requirements and local building codes (such as building heights and depth below grade allowed) will also play into the optimum configuration along with the tool set. We have evaluated these types of configurations for such University Nanofab facilities as Duke FCIEMAS cleanroom. MIT.nano BRIDG/UCF ASU Macrotechnology works UC Berkeley MTA in Vietnam KAUST U of Chicago WERC USC Michelson Center for Convergent Bioscience And many others. We have lots of photos we can also share. We would be happy to discuss further and you may contact me at the cell number below. I am sure many of our colleagues on this network can chime in also! Abbie Gregg Chief Technology Officer Office: (480) 446-8000 xt 107 | Direct: (480) 530-0403 Cell: (480) 577-5083 Email: agregg at amts.com AM Technical Solutions, 1501 West Fountainhead Parkway, Suite 130 ,Tempe, AZ 85282 [cid:image001.png at 01D682AF.2D9D0080] Please check out the full range of our services at: Facebook | Twitter | LinkedIn | www.amts.com CONFIDENTIALITY NOTICE: All information contained in or attached to this email constitutes confidential information belonging to AM Technical Solutions, Inc., its affiliates and subsidiaries and/or its clients. This email and any attachments are proprietary and/or confidential and are intended for business use of the addressee(s) only. All other uses or disclosures are strictly prohibited. If the reader is not the intended recipient you are hereby notified that the perusal, copying or dissemination of this email is strictly prohibited. If you have received this communication in error, please notify the sender, and delete all copies of this message and its attachments immediately. . From: labnetwork-bounces at mtl.mit.edu On Behalf Of Wing Leong CHUNG Sent: Friday, September 4, 2020 6:29 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Cleanroom structure Dear all, NFF of HKUST are planning to build a new cleanroom research facility. We want to know the pros and cons of a vertical structure (cleanroom with sub-fab)? Hope can give us some valuable suggestion. May I have some examples of cleanroom with vertical structure as well. Many Thank. Jeff Chung Senior Manager, NFF, HKUST www.nff.ust.hk -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 7737 bytes Desc: image001.png URL: From f.karouta at gmail.com Mon Sep 7 04:04:42 2020 From: f.karouta at gmail.com (Fouad Karouta) Date: Mon, 7 Sep 2020 18:04:42 +1000 Subject: [labnetwork] Cleanroom structure In-Reply-To: <-mry4llctyhb4-hgmawc-fx0020ylhx44-67blf2-3d59od-5jk772-3dn1xcbx98ng65n7hn-wbcx3bgdwaad-4wiw43lzazf0-4dwp1gpj0f451vdi19ldudlq34cmny12fnsnkn74f-v4ffcv63xm4e.1599224737768@email.android.com> References: <-mry4llctyhb4-hgmawc-fx0020ylhx44-67blf2-3d59od-5jk772-3dn1xcbx98ng65n7hn-wbcx3bgdwaad-4wiw43lzazf0-4dwp1gpj0f451vdi19ldudlq34cmny12fnsnkn74f-v4ffcv63xm4e.1599224737768@email.android.com> Message-ID: Dear Wing Leong, It is a sensitive topic and here are some comments based on my personal experience and it reflects my personal opinion. First I like to say that I did experience two clean rooms, one having a chase layout with CR and service areas in U form and one vertical structure with a ballroom and subfab. Pros Ballroom/Subfab: 1- better and efficient use of surface area where total ballroom area is used for placing the tools. 2- It allows clustering the tools by functionality and possibly simplifies the installation of services like gaslines. 3- It allows the dirty services to be installed in the subfab and not influence the CR area (think pumps, heater/chillers, power supplies, etc which generate particles, heat, etc). 4- Subfab can be engineered to receive a good portion of the clean air from the ballroom which allows you to install dirty processes in the subfab and still enjoy a certain cleanliness of the environment. Think CMP and some wet etching processes. 5- It allows installation of high resolution EBL and SEM in the ballroom area with the stabilizing scaffold on ground level. Cons Ballroom/Subfab: 1- Long distance between tools and primary pumps which can be overcome by oversizing slightly the pumps (more cost). 2- Possibly you may need to go to the subfab to check things if a process fails. There are possibly other cons and hopefully other reactions will come. To be more concrete I am personally a fervent supporter of the vertical structure. In my time at Eindhoven University of Technology, we had first a small 150m2 clean room (chase layout) at level 8 of our building. Later a bigger clean room was built early 2000's with an 800m2 foot-print in a vertical structure (ballroom and subfab). The ballroom hosted a 100kV EBL and a high resolution SEM. At ANU we are in the process of constructing a new building with a 650m2 clean room in vertical structure. On another note I had the opportunity to visit the HKUST NFF but the subfab was engineered differently than the one I described above. Hope this helps and best regards, Fouad Ex-Manager ANFF ACT Node at the Australian National University On Sat, Sep 5, 2020 at 2:00 AM Wing Leong CHUNG wrote: > Dear all, > > NFF of HKUST are planning to build a new cleanroom research facility. We > want to know the pros and cons of a vertical structure (cleanroom with > sub-fab)? Hope can give us some valuable suggestion. > > May I have some examples of cleanroom with vertical structure as well. > > Many Thank. > Jeff Chung > > Senior Manager, NFF, HKUST > www.nff.ust.hk > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From mfcchung at ust.hk Tue Sep 8 02:31:53 2020 From: mfcchung at ust.hk (Wing Leong CHUNG) Date: Tue, 8 Sep 2020 06:31:53 +0000 Subject: [labnetwork] Cleanroom structure In-Reply-To: References: <-mry4llctyhb4-hgmawc-fx0020ylhx44-67blf2-3d59od-5jk772-3dn1xcbx98ng65n7hn-wbcx3bgdwaad-4wiw43lzazf0-4dwp1gpj0f451vdi19ldudlq34cmny12fnsnkn74f-v4ffcv63xm4e.1599224737768@email.android.com>, Message-ID: Fouad, Many thanks to your input and sharing, we will put all those consideration into account in our planning. Will update to you the latest progress when we have final consensus. My initial thinking prefers vertical design, but budget also is our concern (additional cost for vibration control, some equipment require VC-C and VC-D). I also want to make use of this opportunity to appreciate the seminar which you conduct to HKUST community a few years ago about the etching process. Thank You Jeff ________________________________ From: Fouad Karouta Sent: Monday, September 7, 2020 4:04 PM To: Wing Leong CHUNG Cc: labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Cleanroom structure Dear Wing Leong, It is a sensitive topic and here are some comments based on my personal experience and it reflects my personal opinion. First I like to say that I did experience two clean rooms, one having a chase layout with CR and service areas in U form and one vertical structure with a ballroom and subfab. Pros Ballroom/Subfab: 1- better and efficient use of surface area where total ballroom area is used for placing the tools. 2- It allows clustering the tools by functionality and possibly simplifies the installation of services like gaslines. 3- It allows the dirty services to be installed in the subfab and not influence the CR area (think pumps, heater/chillers, power supplies, etc which generate particles, heat, etc). 4- Subfab can be engineered to receive a good portion of the clean air from the ballroom which allows you to install dirty processes in the subfab and still enjoy a certain cleanliness of the environment. Think CMP and some wet etching processes. 5- It allows installation of high resolution EBL and SEM in the ballroom area with the stabilizing scaffold on ground level. Cons Ballroom/Subfab: 1- Long distance between tools and primary pumps which can be overcome by oversizing slightly the pumps (more cost). 2- Possibly you may need to go to the subfab to check things if a process fails. There are possibly other cons and hopefully other reactions will come. To be more concrete I am personally a fervent supporter of the vertical structure. In my time at Eindhoven University of Technology, we had first a small 150m2 clean room (chase layout) at level 8 of our building. Later a bigger clean room was built early 2000's with an 800m2 foot-print in a vertical structure (ballroom and subfab). The ballroom hosted a 100kV EBL and a high resolution SEM. At ANU we are in the process of constructing a new building with a 650m2 clean room in vertical structure. On another note I had the opportunity to visit the HKUST NFF but the subfab was engineered differently than the one I described above. Hope this helps and best regards, Fouad Ex-Manager ANFF ACT Node at the Australian National University On Sat, Sep 5, 2020 at 2:00 AM Wing Leong CHUNG > wrote: Dear all, NFF of HKUST are planning to build a new cleanroom research facility. We want to know the pros and cons of a vertical structure (cleanroom with sub-fab)? Hope can give us some valuable suggestion. May I have some examples of cleanroom with vertical structure as well. Many Thank. Jeff Chung Senior Manager, NFF, HKUST www.nff.ust.hk _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From RobertVandusen at cunet.carleton.ca Tue Sep 8 09:51:20 2020 From: RobertVandusen at cunet.carleton.ca (Robert Vandusen) Date: Tue, 8 Sep 2020 13:51:20 +0000 Subject: [labnetwork] Cleanroom sanitation options Message-ID: HI all. Hope this finds everyone well. I am curious if anyone has found or come up with a safe and effective way to disinfect CMOS cleanrooms while minimizing the risk of sodium contamination. Thanks in advance. Rob Robert Vandusen Technical Officer, Microfabrication Lab Electronics Department Carleton University room: 4184 Mackenzie Building 613-520-2600 ext 5761 Robert_vandusen at cunet.carleton.ca -------------- next part -------------- An HTML attachment was scrubbed... URL: From fm at fmconsultingresearch.com Tue Sep 8 18:47:04 2020 From: fm at fmconsultingresearch.com (Franklin Monzon) Date: Tue, 08 Sep 2020 15:47:04 -0700 Subject: [labnetwork] Dow ebeam resist delays Message-ID: <20200908154704.31d5264b0b70631825c02694c8542e45.1bf3152222.mailapi@email22.godaddy.com> Hi All, We at HRL are having enormous difficulty with procurement of ebeam resist from Dow, and I wonder if anyone else is having this problem. Specifically, we are trying to acquire XR-1541. We use 2%, 4%, and 6% formulations but are having special problems with 2%. Lead times have increased generally in 2020 (perhaps for some good reasons!), but the distributors we work with now cannot even get a firm timeline from Dow. We told them we are willing to order larger quantities than usual but have been informed that that won't help. The shortage is starting to cause delays on key government programs, so I'd very much appreciate any insight from this group. Thanks for your advice! FM ********************************* Franklin Monzon Director, Microfabrication Technology Laboratory HRL Laboratories -------------- next part -------------- An HTML attachment was scrubbed... URL: From mondol at mit.edu Tue Sep 8 20:06:52 2020 From: mondol at mit.edu (Mark K Mondol) Date: Wed, 9 Sep 2020 00:06:52 +0000 Subject: [labnetwork] Dow ebeam resist delays In-Reply-To: <20200908154704.31d5264b0b70631825c02694c8542e45.1bf3152222.mailapi@email22.godaddy.com> References: <20200908154704.31d5264b0b70631825c02694c8542e45.1bf3152222.mailapi@email22.godaddy.com> Message-ID: <1599610012386.87618@mit.edu> Franklin: This has been an ongoing problem for all ebeam facilities. Dow has been an unreliable source for >1year in my experience. Several of us have been working with DisChem to supply HSQ in 2%, 4%, 6% and other dilutions in MIBK. The do this with dry HSQ from AQM (Applied Quantum Materials) in Canada. EM Resists is doing something similar and they are based in England. I and others have tested the resist and it is almost identical to the product from Dow. As I understand it DiscChem can ship within a couple of weeks or less and often makes the dilutions up to order. As DisChem gets dry material from another supplier the cost is based on the dilution of HSQ, prices are a bit higher than Dow, depending on when you last checked the Dow prices and whether you need 2%, 4% or 6%. Regards, Mark K Mondol ---------------------------------------------------------------------------------- Mark K Mondol Assistant Director NanoStructures Laboratory And Facility Manager Scanning Electron Beam Lithography Facility Bldg 36 Room 229 mondol at mit.edu office - 617-253-9617 cell - 617-224-8756 ________________________________ From: labnetwork-bounces at mtl.mit.edu on behalf of Franklin Monzon Sent: Tuesday, September 8, 2020 6:47 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Dow ebeam resist delays Hi All, We at HRL are having enormous difficulty with procurement of ebeam resist from Dow, and I wonder if anyone else is having this problem. Specifically, we are trying to acquire XR-1541. We use 2%, 4%, and 6% formulations but are having special problems with 2%. Lead times have increased generally in 2020 (perhaps for some good reasons!), but the distributors we work with now cannot even get a firm timeline from Dow. We told them we are willing to order larger quantities than usual but have been informed that that won't help. The shortage is starting to cause delays on key government programs, so I'd very much appreciate any insight from this group. Thanks for your advice! FM ********************************* Franklin Monzon Director, Microfabrication Technology Laboratory HRL Laboratories -------------- next part -------------- An HTML attachment was scrubbed... URL: From michael.rooks at yale.edu Tue Sep 8 20:23:26 2020 From: michael.rooks at yale.edu (Michael Rooks) Date: Tue, 8 Sep 2020 20:23:26 -0400 Subject: [labnetwork] Dow ebeam resist delays In-Reply-To: <20200908154704.31d5264b0b70631825c02694c8542e45.1bf3152222.mailapi@email22.godaddy.com> References: <20200908154704.31d5264b0b70631825c02694c8542e45.1bf3152222.mailapi@email22.godaddy.com> Message-ID: An alternative source for HSQ is discheminc.com XR1541 is Dow's brand name for HSQ. Dischem's product is pretty much a drop-in replacement, except for having to bake it at 120C after spinning. EMResist in the UK also sells HSQ, but I have not tried it. -------------------------------- Michael Rooks nano.yale.edu On Tue, Sep 8, 2020 at 7:40 PM Franklin Monzon wrote: > Hi All, > > We at HRL are having enormous difficulty with procurement of ebeam resist > from Dow, and I wonder if anyone else is having this problem. Specifically, > we are trying to acquire XR-1541. We use 2%, 4%, and 6% formulations but > are having special problems with 2%. > > Lead times have increased generally in 2020 (perhaps for some good > reasons!), but the distributors we work with now cannot even get a firm > timeline from Dow. We told them we are willing to order larger quantities > than usual but have been informed that that won't help. > > The shortage is starting to cause delays on key government programs, so > I'd very much appreciate any insight from this group. > > Thanks for your advice! > FM > ********************************* > Franklin Monzon > Director, Microfabrication Technology Laboratory > HRL Laboratories > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From price.798 at osu.edu Tue Sep 8 21:52:59 2020 From: price.798 at osu.edu (Price, Aimee) Date: Wed, 9 Sep 2020 01:52:59 +0000 Subject: [labnetwork] Dow ebeam resist delays In-Reply-To: <20200908154704.31d5264b0b70631825c02694c8542e45.1bf3152222.mailapi@email22.godaddy.com> References: <20200908154704.31d5264b0b70631825c02694c8542e45.1bf3152222.mailapi@email22.godaddy.com> Message-ID: Hi Franklin, I?m sorry to hear this. Yes Dow has been seemingly having issues for a couple years, which has gotten worse in recent months. I received a notification from my distributor Krayden that they were discontinuing small bottles (see attached). Others at MAEBL have reported strange delays and other oddities with distribution. I can speak about that offline if you want details. If you do go with the larger sizes, which may work better in a production environment, do make sure that the shelf life is appropriate and not close to the expiration date. There have been concerns about this, but I haven?t personally had that issue. It does need to be refrigerated or preferably frozen for better quality and shelf life. There is an alternate supplier that some of us in the MAEBL community are starting to qualify. It is called H-SiQ from Dischem. That might be an option for you, though I realize you?d need to qualify it. Depending on your processes, you may find little difference. Dischem may actually be on this listserve, so maybe they could respond directly. I purchased 4% in February in very small quantities and it has been used for a photonics project. That project uses a high contrast develop strategy with some longer bakes. I?d be happy to talk more about what we have found at Ohio State and as a MAEBL community if you?d like. This is a very popular topic amongst the EBL community globally, so I?m betting you will get quite a bit of feedback. Best, Aimee Bross Price President/Co-founder MAEBL Sr. Research Associate The Ohio State University Nanotech West Lab Institute for Materials Research 1381 Kinnear Road Suite 100 Columbus, OH 43212 614-292-2753 ces at mtl.mit.edu On Behalf Of Franklin Monzon Sent: Tuesday, September 8, 2020 6:47 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Dow ebeam resist delays Hi All, We at HRL are having enormous difficulty with procurement of ebeam resist from Dow, and I wonder if anyone else is having this problem. Specifically, we are trying to acquire XR-1541. We use 2%, 4%, and 6% formulations but are having special problems with 2%. Lead times have increased generally in 2020 (perhaps for some good reasons!), but the distributors we work with now cannot even get a firm timeline from Dow. We told them we are willing to order larger quantities than usual but have been informed that that won't help. The shortage is starting to cause delays on key government programs, so I'd very much appreciate any insight from this group. Thanks for your advice! FM ********************************* Franklin Monzon Director, Microfabrication Technology Laboratory HRL Laboratories -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: HSQ_Krayden_notification.jpg Type: image/jpeg Size: 138092 bytes Desc: HSQ_Krayden_notification.jpg URL: From ahryciw at ualberta.ca Tue Sep 8 22:51:08 2020 From: ahryciw at ualberta.ca (Aaron Hryciw) Date: Tue, 8 Sep 2020 20:51:08 -0600 Subject: [labnetwork] Dow ebeam resist delays In-Reply-To: <20200908154704.31d5264b0b70631825c02694c8542e45.1bf3152222.mailapi@email22.godaddy.com> References: <20200908154704.31d5264b0b70631825c02694c8542e45.1bf3152222.mailapi@email22.godaddy.com> Message-ID: Hi Franklin, This has been an ongoing issue lately, and has come up for discussion in the Labnetwork before; see here for my response to the thread at that time. In brief, at our centre we have switched from Dow Corning XR-1541 to a dry HSQ powder ("AQM SiOx") from Applied Quantum Materials , which has benefits of a much longer shelf life (while dry), and allows you to mix it with MIBK to the required concentration as needed, avoiding the problem of purchasing several concentrations which are not used up by their expiry date. It is made locally (in Edmonton, Canada), but is distributed internationally, and we have had no problems with procurement. The only point I would add to my post linked above is that it is important to use MIBK which is as anhydrous as possible, to ensure the solution does not turn into a gel. AQM recommends using HPLC grade MIBK to mix with their HSQ powders; this is what they supply with their HSQ powders if sold as a HSQ + MIBK kit. Cheers, ? Aaron Aaron Hryciw, PhD, PEng Fabrication Group Manager University of Alberta - nanoFAB W1-060 ECERF Building 9107 - 116 Street Edmonton, Alberta Canada T6G 2V4 Ph: 780-940-7938 www.nanofab.ualberta.ca On Tue, Sep 8, 2020 at 5:38 PM Franklin Monzon wrote: > Hi All, > > We at HRL are having enormous difficulty with procurement of ebeam resist > from Dow, and I wonder if anyone else is having this problem. Specifically, > we are trying to acquire XR-1541. We use 2%, 4%, and 6% formulations but > are having special problems with 2%. > > Lead times have increased generally in 2020 (perhaps for some good > reasons!), but the distributors we work with now cannot even get a firm > timeline from Dow. We told them we are willing to order larger quantities > than usual but have been informed that that won't help. > > The shortage is starting to cause delays on key government programs, so > I'd very much appreciate any insight from this group. > > Thanks for your advice! > FM > ********************************* > Franklin Monzon > Director, Microfabrication Technology Laboratory > HRL Laboratories > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From kamal.yadav at gmail.com Mon Sep 14 12:43:05 2020 From: kamal.yadav at gmail.com (Kamal Yadav) Date: Mon, 14 Sep 2020 09:43:05 -0700 Subject: [labnetwork] Toxic Gases tubing Message-ID: Dear All, We will be installing SS gas tubing for Cl2, BCl3, HBr, SiH4. I have some experience in how industry does it, but wanted to know how different universities do this. From some prior posts, I got to know University of Michigan has co-axial tubing for all these gases and every connector location for these gases is exhausted as well at their facility My queries are: 1. Is this how most of the Universities do it or there are places where these gases are in single tubing [non co-axial or double contained]. 2. Also if you do orbital welding or just bending of the tubes? I have been informed it is based on the fire code of the city or county, but it's not apparent from those documents. Thanks for your help. -- Thanks, Kamal -------------- next part -------------- An HTML attachment was scrubbed... URL: From kamal.yadav at gmail.com Mon Sep 14 15:02:06 2020 From: kamal.yadav at gmail.com (Kamal Yadav) Date: Mon, 14 Sep 2020 12:02:06 -0700 Subject: [labnetwork] Toxic Gases tubing In-Reply-To: References: Message-ID: Dear All, Another query in continuation for gas tubing- 3. How does heat trace constraint impact choosing of single of double contained tubing for Cl2/BCl3. Is the heat tracing as effective on double contained tubing as single. Is the need for heat trace tube length dependent. 4. All process gases with 5N or higher purity are with electropolished tubings? Thanks, Kamal On Mon, Sep 14, 2020 at 9:43 AM Kamal Yadav wrote: > Dear All, > > We will be installing SS gas tubing for Cl2, BCl3, HBr, SiH4. > > I have some experience in how industry does it, but wanted to know how > different universities do this. From some prior posts, I got to know > University of Michigan has co-axial tubing for all these gases and every > connector location for these gases is exhausted as well at their facility > > My queries are: > 1. Is this how most of the Universities do it or there are places where > these gases are in single tubing [non co-axial or double contained]. > 2. Also if you do orbital welding or just bending of the tubes? > > I have been informed it is based on the fire code of the city or county, > but it's not apparent from those documents. > > Thanks for your help. > > -- > Thanks, > Kamal > > -- Thanks, Kamal -------------- next part -------------- An HTML attachment was scrubbed... URL: From deonc69 at illinois.edu Mon Sep 14 16:07:39 2020 From: deonc69 at illinois.edu (Collins, Deon Douglas) Date: Mon, 14 Sep 2020 20:07:39 +0000 Subject: [labnetwork] Toxic Gases tubing In-Reply-To: References: Message-ID: Semi has standards that you can and should refer to for these matters. This will give you a good baseline. After that you should look at your local codes to make sure they don?t take it to a higher level. For me any toxic gas outside of a gas cabinet should be ran in coaxial tubing. Deon D. Collins FACILITY MANAGER Holonyak Lab University of Illinois at Urbana-Champaign 208 N Wright St Rm. 248 | 2250 Urbana, IL 61801 217-300-7531 | deonc69 at illinois.edu [https://webtools.illinois.edu/webservices/js/ds/signature_logo.png] Under the Illinois Freedom of Information Act any written communication to or from university employees regarding university business is a public record and may be subject to public disclosure. I?m so tired of being tired, Sure as night will follow day, Most things I worry about never happen anyway. Tom Petty From: labnetwork-bounces at mtl.mit.edu On Behalf Of Kamal Yadav Sent: Monday, September 14, 2020 11:43 AM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Toxic Gases tubing Dear All, We will be installing SS gas tubing for Cl2, BCl3, HBr, SiH4. I have some experience in how industry does it, but wanted to know how different universities do this. From some prior posts, I got to know University of Michigan has co-axial tubing for all these gases and every connector location for these gases is exhausted as well at their facility My queries are: 1. Is this how most of the Universities do it or there are places where these gases are in single tubing [non co-axial or double contained]. 2. Also if you do orbital welding or just bending of the tubes? I have been informed it is based on the fire code of the city or county, but it's not apparent from those documents. Thanks for your help. -- Thanks, Kamal -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: image001.png Type: image/png Size: 2602 bytes Desc: image001.png URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: Mr_ Deon D_ Collins.vcf Type: text/x-vcard Size: 2025 bytes Desc: Mr_ Deon D_ Collins.vcf URL: From lesjo at dtu.dk Mon Sep 14 16:12:55 2020 From: lesjo at dtu.dk (Leif Steen Johansen) Date: Mon, 14 Sep 2020 20:12:55 +0000 Subject: [labnetwork] Toxic Gases tubing In-Reply-To: References: Message-ID: <406c0060df8f4945ac5971090119bd94@dtu.dk> Hello Kamal, Like University of Michigan we also run all toxic and pyrophoric gases in coaxial pipes. The inner pipe is made of electro polished 316L stainless steel with a surface roughness of 0.25?m. All welding is orbital welding performed by certified welders using certified equipment. We allow our welders to bend the tubes with a dedicated tool. Some sites don?t allow this, since this theoretically could cause a larger surface roughness in the bends. Such sites buy pre-made bends that are welded onto the straight pipes. The outer pipe of the coax line is monitored for gas leaks. We have two systems: One system constantly pumps on the outer pipe and monitors the pumped air for toxics. In the other type of system the outer pipe is pumped to vacuum, sealed off, and then monitored by a vacuum gauge. A coax monitor alarm (sensed gas or loss of vacuum in outer pipe) automatically shuts down the gas line, evacuates the building and calls the fire brigade. All connections are of the VCR type and are placed inside a vented and gas monitored enclosure. We have all the four gases you mention, and all of them are nasty in their own way, so please take good care of yourself. Best regards, Leif [http://www.dtu.dk/-/media/DTU_Generelt/Andet/mail-signature-logo.png] Leif Steen Johansen Head of Operations, Ph.D. Dir. +45 45 25 57 13 Mob. +45 25 34 89 92 lesjo at dtu.dk ?rsteds Plads, Byg. 347 Building 347 2800 Lyngby www.dtu.dk/english From: labnetwork-bounces at mtl.mit.edu On Behalf Of Kamal Yadav Sent: 14. september 2020 18:43 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Toxic Gases tubing Dear All, We will be installing SS gas tubing for Cl2, BCl3, HBr, SiH4. I have some experience in how industry does it, but wanted to know how different universities do this. From some prior posts, I got to know University of Michigan has co-axial tubing for all these gases and every connector location for these gases is exhausted as well at their facility My queries are: 1. Is this how most of the Universities do it or there are places where these gases are in single tubing [non co-axial or double contained]. 2. Also if you do orbital welding or just bending of the tubes? I have been informed it is based on the fire code of the city or county, but it's not apparent from those documents. Thanks for your help. -- Thanks, Kamal -------------- next part -------------- An HTML attachment was scrubbed... URL: From sieb at 4dlabs.ca Mon Sep 14 16:27:10 2020 From: sieb at 4dlabs.ca (Nathanael Sieb) Date: Mon, 14 Sep 2020 13:27:10 -0700 Subject: [labnetwork] Toxic Gases tubing In-Reply-To: References: Message-ID: <76da84d1-2f8a-00a3-06f7-a871b04d7d29@4dlabs.ca> An HTML attachment was scrubbed... URL: From shott at stanford.edu Mon Sep 14 22:29:47 2020 From: shott at stanford.edu (John D Shott) Date: Tue, 15 Sep 2020 02:29:47 +0000 Subject: [labnetwork] Toxic Gases tubing In-Reply-To: <76da84d1-2f8a-00a3-06f7-a871b04d7d29@4dlabs.ca> References: , <76da84d1-2f8a-00a3-06f7-a871b04d7d29@4dlabs.ca> Message-ID: <87CB6254-6C9F-4F2B-A51B-449C523C18E7@stanford.edu> Kamal: Disclaimer: I am retired and have not received a paycheck for 5 years. As a result, you cannot trust/accept anything I say without independently verifying it with someone that is still up to date. But, a few comments: 1. CGA (Compressed Gas Association) produces a document numbered G-13 related to the handling and distribution of Silane. Many, but not all codes, refer to that and use their recommendations as standards. Last I knew (double check this ?) Silane was NOT required to be secondarily contained. 2. For low pressure gases such as DCS and BCl3, I would be remiss if I did not tell you that Steve Paolini at Harvard (AKA The Equipment Dood) would STRONGLY recommend the use of sub-atmospheric regulators to avoid the need for heating these lines to prevent condensation. While I never had a chance to specify/buy/work on such a system, I would ABSOLUTELY explore that option. Heating gas lines is never fun! 3. For the chlorinated gases such as Cl2, BCl3, HCl ? and maybe their brominated brethren ? you used to be able to run them in a single-wall line of Hastelloy (AKA C-22) instead of double walled 316L. Note: this may no longer be true ? don?t trust my word. The downside is that Hastelloy tubing makes 316L look cheap ? although single-wall Hastelloy may be comparable to double-wall 316L. But, if you do have to heat lines, heating single-wall is a LOT easier than trying to heat double-wall. Also, orbital welding of Hastelloy takes a completely different program than they use for 316L. A good welder will have that program ready to go. Beware, however, if they say ?It looks like stainless ? how hard can it be?? Best of luck! John Sent from my iPhone On Sep 14, 2020, at 6:02 PM, Nathanael Sieb wrote: ? Hi Kamal, We used electropolished SS for all of our high purity gas lines. Double wall was used for all toxics, including Cl2, BCl3, and SiH4. The sheath is exhausted through the gas cabinet so we can sense any leaks. I believe that it is a combination of welded and bends depending on the area. We didn't end up heat wrapping any of the lines. Our worksafe code doesn't appear to specify double-walls, but as far as I know it is best practices. https://www.worksafebc.com/en/law-policy/occupational-health-safety/searchable-ohs-regulation/ohs-regulation/part-06-substance-specific-requirements#SectionNumber:6.116 I hope that helps! Thanks, Nathanael On 2020-09-14 12:02 p.m., Kamal Yadav wrote: Dear All, Another query in continuation for gas tubing- 3. How does heat trace constraint impact choosing of single of double contained tubing for Cl2/BCl3. Is the heat tracing as effective on double contained tubing as single. Is the need for heat trace tube length dependent. 4. All process gases with 5N or higher purity are with electropolished tubings? Thanks, Kamal On Mon, Sep 14, 2020 at 9:43 AM Kamal Yadav > wrote: Dear All, We will be installing SS gas tubing for Cl2, BCl3, HBr, SiH4. I have some experience in how industry does it, but wanted to know how different universities do this. From some prior posts, I got to know University of Michigan has co-axial tubing for all these gases and every connector location for these gases is exhausted as well at their facility My queries are: 1. Is this how most of the Universities do it or there are places where these gases are in single tubing [non co-axial or double contained]. 2. Also if you do orbital welding or just bending of the tubes? I have been informed it is based on the fire code of the city or county, but it's not apparent from those documents. Thanks for your help. -- Thanks, Kamal -- Thanks, Kamal _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork Nathanael Sieb Director of Operations and Administration | 4D LABS Simon Fraser University 8888 University Dr., Burnaby, B.C. V5A 1S6 T: 778.782.8084 | F: 778.782.3765 | www.4dlabs.ca Facebook | Twitter | LinkedIn [http://www.4dlabs.ca/content/dam/sfu/4dlabs/images/SFU_4DLabs_logo.png] _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From mtkhbeis at gmail.com Tue Sep 15 02:20:31 2020 From: mtkhbeis at gmail.com (mtkhbeis at gmail.com) Date: Mon, 14 Sep 2020 23:20:31 -0700 Subject: [labnetwork] Toxic Gases tubing In-Reply-To: References: Message-ID: Kamal, 1. Not all jurisdictions require coax tubing by code. Unfortunately, my old university only wanted to pay for what was a code requirement and I had to fight for and pay for coax tubing. Double containment on toxic gasses is a best practice. As a lab owner/manager you should insist on it as secondary containment should not be viewed as a luxury. 2. Both welded elbows and bending are acceptable practices. There are pros and cons to each approach. Bottom line is that you need to run quality control checks on both approaches and have assurance of line integrity. 3. Heat tracing is chemical dependent. It is not based on the length of tubing. If you have a cold spot on an otherwise heated line, you will end up with condensation and problems. Vacuum jacketed tubing will obviously not conduct heat as efficiently; however, you are looking at steady state heating not transient heating. You should have heat trace coupled with insulation jackets from source to endpoint. 4. You mentioned exhausted gas box at any point there is a mechanical connection (eg VCR interface, manifold, etc). This is a requirement. One point you didn?t mention is gas detection. You should be detecting at source, point of use ambient, and any location that has a mechanical connection. Best regards, Dr. Michael Khbeis (C) 443.254.5192 > On Sep 14, 2020, at 12:41 PM, Kamal Yadav wrote: > > ? > Dear All, > > We will be installing SS gas tubing for Cl2, BCl3, HBr, SiH4. > > I have some experience in how industry does it, but wanted to know how different universities do this. From some prior posts, I got to know University of Michigan has co-axial tubing for all these gases and every connector location for these gases is exhausted as well at their facility > > My queries are: > 1. Is this how most of the Universities do it or there are places where these gases are in single tubing [non co-axial or double contained]. > 2. Also if you do orbital welding or just bending of the tubes? > > I have been informed it is based on the fire code of the city or county, but it's not apparent from those documents. > > Thanks for your help. > > -- > Thanks, > Kamal > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From manish.keswani01 at gmail.com Tue Sep 15 11:17:30 2020 From: manish.keswani01 at gmail.com (Manish Keswani) Date: Tue, 15 Sep 2020 08:17:30 -0700 Subject: [labnetwork] Exhaust and makeup air systems Message-ID: Dear all, We are currently evaluating our exhaust and makeup air systems at LLNL and looking into ways that will improve the efficiency and/or optimize the flow rates so that lower CFM is needed. Our solvent stations/wet benches and gas cabinets use about 50% and 25% of exhaust, resp. It seems that one may be able lower the exhaust needs by optimizing the exhaust flow during opening/closing of the gas cabinet doors or fume hood sash using suitable sensors or by determining the actual flow using tracer gas testing, which could be up to 50% lower than the standard flow. Does anyone have any experience with this and suggestions on how to approach this? Thanks in advance. Regards, Manish Manish Keswani Center for Micro and Nano technology Lawrence Livermore National Laboratory -------------- next part -------------- An HTML attachment was scrubbed... URL: From bill_flounders at berkeley.edu Tue Sep 15 12:04:17 2020 From: bill_flounders at berkeley.edu (Albert William (Bill) Flounders) Date: Tue, 15 Sep 2020 09:04:17 -0700 Subject: [labnetwork] Exhaust and makeup air systems In-Reply-To: References: Message-ID: Manish Keswani, Your National Lab colleagues at LBNL have been investigating improved energy efficiency of cleanrooms for many years. I encourage you to communicate with them directly See: https://hightech.lbl.gov/cleanrooms Sample publication from Energy Technologies Area: https://eta.lbl.gov/publications/cleanroom-energy-efficiency-metrics https://eta.lbl.gov/publications/energy-efficiency-strategies Bill Flounders UC Berkeley On Tue, Sep 15, 2020 at 8:34 AM Manish Keswani wrote: > Dear all, > > > We are currently evaluating our exhaust and makeup air systems at LLNL and > looking into ways that will improve the efficiency and/or optimize the flow > rates so that lower CFM is needed. Our solvent stations/wet benches and gas > cabinets use about 50% and 25% of exhaust, resp. > > > > It seems that one may be able lower the exhaust needs by optimizing the > exhaust flow during opening/closing of the gas cabinet doors or fume hood > sash using suitable sensors or by determining the actual flow using tracer > gas testing, which could be up to 50% lower than the standard flow. > > > > Does anyone have any experience with this and suggestions on how to > approach this? > > > Thanks in advance. > > > Regards, > > Manish > > > Manish Keswani > > Center for Micro and Nano technology > > Lawrence Livermore National Laboratory > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork > -------------- next part -------------- An HTML attachment was scrubbed... URL: From jsalzmann at pcb.com Tue Sep 15 12:08:05 2020 From: jsalzmann at pcb.com (Jeff Salzmann) Date: Tue, 15 Sep 2020 16:08:05 +0000 Subject: [labnetwork] Exhaust and makeup air systems In-Reply-To: References: Message-ID: <6082E83331E49D41A9DE3F109A76690C89499731@NYDMS11.pcb.com> Manish, DI water foggers are useful for this sort of work. I made video recordings at different exhaust rates and used them to determine the rates I needed. Jeff From: labnetwork-bounces at mtl.mit.edu On Behalf Of Manish Keswani Sent: Tuesday, September 15, 2020 11:18 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Exhaust and makeup air systems Dear all, We are currently evaluating our exhaust and makeup air systems at LLNL and looking into ways that will improve the efficiency and/or optimize the flow rates so that lower CFM is needed. Our solvent stations/wet benches and gas cabinets use about 50% and 25% of exhaust, resp. It seems that one may be able lower the exhaust needs by optimizing the exhaust flow during opening/closing of the gas cabinet doors or fume hood sash using suitable sensors or by determining the actual flow using tracer gas testing, which could be up to 50% lower than the standard flow. Does anyone have any experience with this and suggestions on how to approach this? Thanks in advance. Regards, Manish Manish Keswani Center for Micro and Nano technology Lawrence Livermore National Laboratory -------------- next part -------------- An HTML attachment was scrubbed... URL: From julia.aebersold at louisville.edu Tue Sep 15 14:04:20 2020 From: julia.aebersold at louisville.edu (Aebersold,Julia W.) Date: Tue, 15 Sep 2020 18:04:20 +0000 Subject: [labnetwork] Toxic Gases tubing In-Reply-To: <406c0060df8f4945ac5971090119bd94@dtu.dk> References: <406c0060df8f4945ac5971090119bd94@dtu.dk> Message-ID: We have the same at the University of Louisville. Coax helps me sleep at night. Cheers! Julia Aebersold, Ph.D. Manager, Micro/Nano Technology Center University of Louisville Shumaker Research Building, Room 233 2210 South Brook Street Louisville, KY 40292 (502) 852-1572 http://louisville.edu/micronano/ From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Leif Steen Johansen Sent: Monday, September 14, 2020 4:13 PM To: Kamal Yadav ; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Toxic Gases tubing CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. Hello Kamal, Like University of Michigan we also run all toxic and pyrophoric gases in coaxial pipes. The inner pipe is made of electro polished 316L stainless steel with a surface roughness of 0.25?m. All welding is orbital welding performed by certified welders using certified equipment. We allow our welders to bend the tubes with a dedicated tool. Some sites don?t allow this, since this theoretically could cause a larger surface roughness in the bends. Such sites buy pre-made bends that are welded onto the straight pipes. The outer pipe of the coax line is monitored for gas leaks. We have two systems: One system constantly pumps on the outer pipe and monitors the pumped air for toxics. In the other type of system the outer pipe is pumped to vacuum, sealed off, and then monitored by a vacuum gauge. A coax monitor alarm (sensed gas or loss of vacuum in outer pipe) automatically shuts down the gas line, evacuates the building and calls the fire brigade. All connections are of the VCR type and are placed inside a vented and gas monitored enclosure. We have all the four gases you mention, and all of them are nasty in their own way, so please take good care of yourself. Best regards, Leif [http://www.dtu.dk/-/media/DTU_Generelt/Andet/mail-signature-logo.png] Leif Steen Johansen Head of Operations, Ph.D. Dir. +45 45 25 57 13 Mob. +45 25 34 89 92 lesjo at dtu.dk ?rsteds Plads, Byg. 347 Building 347 2800 Lyngby www.dtu.dk/english From: labnetwork-bounces at mtl.mit.edu > On Behalf Of Kamal Yadav Sent: 14. september 2020 18:43 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Toxic Gases tubing Dear All, We will be installing SS gas tubing for Cl2, BCl3, HBr, SiH4. I have some experience in how industry does it, but wanted to know how different universities do this. From some prior posts, I got to know University of Michigan has co-axial tubing for all these gases and every connector location for these gases is exhausted as well at their facility My queries are: 1. Is this how most of the Universities do it or there are places where these gases are in single tubing [non co-axial or double contained]. 2. Also if you do orbital welding or just bending of the tubes? I have been informed it is based on the fire code of the city or county, but it's not apparent from those documents. Thanks for your help. -- Thanks, Kamal -------------- next part -------------- An HTML attachment was scrubbed... URL: From Simon.Doe at unisa.edu.au Tue Sep 15 19:16:13 2020 From: Simon.Doe at unisa.edu.au (Simon Doe) Date: Tue, 15 Sep 2020 23:16:13 +0000 Subject: [labnetwork] Toxic Gases tubing In-Reply-To: <406c0060df8f4945ac5971090119bd94@dtu.dk> References: <406c0060df8f4945ac5971090119bd94@dtu.dk> Message-ID: Hello Kamal I?d like to add my view as a certified welding engineer to this. Not about the piping, but the welding. It should be considered an essential requirement if making a pressurized system to be using certified procedures, welders and equipment. The standards ASME IX, ASME B31.3 and SEMI 81:1103 all detail the requirements needed. If they require certified procedures, welders and equipment in industries like dairy or pharmaceutical, then for certain it should be considered the pre-requisite for piping with gases as toxic as these. Regards Simon International Welding Engineer IWE/GB/00273 Simon Doe Facility Manager, Australian National Fabrication Facility-SA Node University of South Australia | Mawson Lakes SA 5095 ': +61 8 8302 5226 | ?: simon.doe at unisa.edu.au www.anff-sa.com From: labnetwork-bounces at mtl.mit.edu On Behalf Of Leif Steen Johansen Sent: Tuesday, 15 September 2020 5:43 AM To: Kamal Yadav ; labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Toxic Gases tubing Hello Kamal, Like University of Michigan we also run all toxic and pyrophoric gases in coaxial pipes. The inner pipe is made of electro polished 316L stainless steel with a surface roughness of 0.25?m. All welding is orbital welding performed by certified welders using certified equipment. We allow our welders to bend the tubes with a dedicated tool. Some sites don?t allow this, since this theoretically could cause a larger surface roughness in the bends. Such sites buy pre-made bends that are welded onto the straight pipes. The outer pipe of the coax line is monitored for gas leaks. We have two systems: One system constantly pumps on the outer pipe and monitors the pumped air for toxics. In the other type of system the outer pipe is pumped to vacuum, sealed off, and then monitored by a vacuum gauge. A coax monitor alarm (sensed gas or loss of vacuum in outer pipe) automatically shuts down the gas line, evacuates the building and calls the fire brigade. All connections are of the VCR type and are placed inside a vented and gas monitored enclosure. We have all the four gases you mention, and all of them are nasty in their own way, so please take good care of yourself. Best regards, Leif [http://www.dtu.dk/-/media/DTU_Generelt/Andet/mail-signature-logo.png] Leif Steen Johansen Head of Operations, Ph.D. Dir. +45 45 25 57 13 Mob. +45 25 34 89 92 lesjo at dtu.dk ?rsteds Plads, Byg. 347 Building 347 2800 Lyngby www.dtu.dk/english From: labnetwork-bounces at mtl.mit.edu > On Behalf Of Kamal Yadav Sent: 14. september 2020 18:43 To: labnetwork at mtl.mit.edu Subject: [labnetwork] Toxic Gases tubing Dear All, We will be installing SS gas tubing for Cl2, BCl3, HBr, SiH4. I have some experience in how industry does it, but wanted to know how different universities do this. From some prior posts, I got to know University of Michigan has co-axial tubing for all these gases and every connector location for these gases is exhausted as well at their facility My queries are: 1. Is this how most of the Universities do it or there are places where these gases are in single tubing [non co-axial or double contained]. 2. Also if you do orbital welding or just bending of the tubes? I have been informed it is based on the fire code of the city or county, but it's not apparent from those documents. Thanks for your help. -- Thanks, Kamal -------------- next part -------------- An HTML attachment was scrubbed... URL: From manish.keswani01 at gmail.com Wed Sep 16 03:13:56 2020 From: manish.keswani01 at gmail.com (Manish Keswani) Date: Wed, 16 Sep 2020 00:13:56 -0700 Subject: [labnetwork] Exhaust and makeup air systems In-Reply-To: References: Message-ID: Thank you everyone for your response on this topic. Per your recommendation, I have emailed a few other facilities and hope to hear back from them soon. We will be looking into a feedback control system between the fan speed and the state of the gas cabinets/solvent wet stations that could reduce the requirements of the FHE/makeup air unit. Look forward to engaging with our ESH team and working on this project. Regards, Manish On Tue, Sep 15, 2020 at 8:17 AM Manish Keswani wrote: > Dear all, > > > We are currently evaluating our exhaust and makeup air systems at LLNL and > looking into ways that will improve the efficiency and/or optimize the flow > rates so that lower CFM is needed. Our solvent stations/wet benches and gas > cabinets use about 50% and 25% of exhaust, resp. > > > > It seems that one may be able lower the exhaust needs by optimizing the > exhaust flow during opening/closing of the gas cabinet doors or fume hood > sash using suitable sensors or by determining the actual flow using tracer > gas testing, which could be up to 50% lower than the standard flow. > > > > Does anyone have any experience with this and suggestions on how to > approach this? > > > Thanks in advance. > > > Regards, > > Manish > > > Manish Keswani > > Center for Micro and Nano technology > > Lawrence Livermore National Laboratory > > > -------------- next part -------------- An HTML attachment was scrubbed... URL: From kamal.yadav at gmail.com Wed Sep 16 12:54:56 2020 From: kamal.yadav at gmail.com (Kamal Yadav) Date: Wed, 16 Sep 2020 09:54:56 -0700 Subject: [labnetwork] Toxic Gases tubing In-Reply-To: References: Message-ID: Dear All, Thank you everyone for all your responses on toxic gas tubing for Cl2/BCl3/HBr. I received many responses and may write directly write to them for subsequent queries. To summarize: Overall recommendation and also mostly required by code as well to have co-axial for these gases, along with heat tracing for BCl3, and scrubbing, with VCR fittings. Thanks, Kamal On Mon, Sep 14, 2020 at 9:43 AM Kamal Yadav wrote: > Dear All, > > We will be installing SS gas tubing for Cl2, BCl3, HBr, SiH4. > > I have some experience in how industry does it, but wanted to know how > different universities do this. From some prior posts, I got to know > University of Michigan has co-axial tubing for all these gases and every > connector location for these gases is exhausted as well at their facility > > My queries are: > 1. Is this how most of the Universities do it or there are places where > these gases are in single tubing [non co-axial or double contained]. > 2. Also if you do orbital welding or just bending of the tubes? > > I have been informed it is based on the fire code of the city or county, > but it's not apparent from those documents. > > Thanks for your help. > > -- > Thanks, > Kamal > > -- Thanks, Kamal -------------- next part -------------- An HTML attachment was scrubbed... URL: From spaolini at cns.fas.harvard.edu Wed Sep 16 17:26:11 2020 From: spaolini at cns.fas.harvard.edu (Paolini, Steven) Date: Wed, 16 Sep 2020 21:26:11 +0000 Subject: [labnetwork] Toxic Gases tubing In-Reply-To: References: Message-ID: Kamal, I have been a little busy to chime my opinion on your questions. I would, however, like to briefly express my experience with heat tracing gas lines. In a nutshell, don?t do it! If your gas is stored in a reasonably climate controlled area where the temperatures are not much less that the area where the tool is, you would be better off delivering your gas at sub-atmospheric or near sub-atmospheric pressures. Simply put, one law of physics states that if you lower the pressure of a gas or liquid, you lower its boiling point. This only effective in vacuum systems where there is a pressure differential. Heat tracing gas lines might, and I emphasize might, work for some folks if the insulation is impeccable but sooner or later, those gases will liquify in the first cool surface that they touch?usually in an MFC. Over the years, I became frustrated with these setups and the downtime it causes and looked into simple physics for a solution. I have been running sub-atmospheric for over 25 years in two different facilities without issue. You need special regulators that will allow and control at 5?Hg-5 PSI. Regular tied diaphragm regulators are too ?jumpy? for this task. I hope this helps. Steve Paolini Equipment Dood Steve Paolini Principal Equipment Engineer Harvard University Center for Nanoscale Systems 11 Oxford St. Cambridge, MA 02138 617- 496- 9816 spaolini at cns.fas.harvard.edu www.cns.fas.harvard.edu From: labnetwork-bounces at mtl.mit.edu On Behalf Of Kamal Yadav Sent: Wednesday, September 16, 2020 12:55 PM To: labnetwork at mtl.mit.edu Subject: Re: [labnetwork] Toxic Gases tubing Dear All, Thank you everyone for all your responses on toxic gas tubing for Cl2/BCl3/HBr. I received many responses and may write directly write to them for subsequent queries. To summarize: Overall recommendation and also mostly required by code as well to have co-axial for these gases, along with heat tracing for BCl3, and scrubbing, with VCR fittings. Thanks, Kamal On Mon, Sep 14, 2020 at 9:43 AM Kamal Yadav > wrote: Dear All, We will be installing SS gas tubing for Cl2, BCl3, HBr, SiH4. I have some experience in how industry does it, but wanted to know how different universities do this. From some prior posts, I got to know University of Michigan has co-axial tubing for all these gases and every connector location for these gases is exhausted as well at their facility My queries are: 1. Is this how most of the Universities do it or there are places where these gases are in single tubing [non co-axial or double contained]. 2. Also if you do orbital welding or just bending of the tubes? I have been informed it is based on the fire code of the city or county, but it's not apparent from those documents. Thanks for your help. -- Thanks, Kamal -- Thanks, Kamal -------------- next part -------------- An HTML attachment was scrubbed... URL: From kamal.yadav at gmail.com Wed Sep 16 19:04:38 2020 From: kamal.yadav at gmail.com (Kamal Yadav) Date: Wed, 16 Sep 2020 16:04:38 -0700 Subject: [labnetwork] Toxic Gases tubing In-Reply-To: References: Message-ID: Thanks Steve, I think John mentioned about you strongly recommending using sub-atmospheric regulators. We will take that into consideration. Thanks for your valuable advice. Kamal On Wed, Sep 16, 2020 at 2:26 PM Paolini, Steven < spaolini at cns.fas.harvard.edu> wrote: > Kamal, > > I have been a little busy to chime my opinion on your questions. I > would, however, like to briefly express my experience with heat tracing gas > lines. In a nutshell, don?t do it! If your gas is stored in a reasonably > climate controlled area where the temperatures are not much less that the > area where the tool is, you would be better off delivering your gas at > sub-atmospheric or near sub-atmospheric pressures. Simply put, one law of > physics states that if you lower the pressure of a gas or liquid, you lower > its boiling point. This only effective in vacuum systems where there is a > pressure differential. Heat tracing gas lines might, and I emphasize might, > work for some folks if the insulation is impeccable but sooner or later, > those gases will liquify in the first cool surface that they touch?usually > in an MFC. Over the years, I became frustrated with these setups and the > downtime it causes and looked into simple physics for a solution. I have > been running sub-atmospheric for over 25 years in two different facilities > without issue. You need special regulators that will allow and control at > 5?Hg-5 PSI. Regular tied diaphragm regulators are too ?jumpy? for this task. > > I hope this helps. > > Steve Paolini Equipment Dood > > > > Steve Paolini > > Principal Equipment Engineer > > Harvard University Center for Nanoscale Systems > > 11 Oxford St. > > Cambridge, MA 02138 > > 617- 496- 9816 > > spaolini at cns.fas.harvard.edu > > www.cns.fas.harvard.edu > > > > *From:* labnetwork-bounces at mtl.mit.edu *On > Behalf Of *Kamal Yadav > *Sent:* Wednesday, September 16, 2020 12:55 PM > *To:* labnetwork at mtl.mit.edu > *Subject:* Re: [labnetwork] Toxic Gases tubing > > > > Dear All, > > > > Thank you everyone for all your responses on toxic gas tubing for > Cl2/BCl3/HBr. > > I received many responses and may write directly write to them for > subsequent queries. > > > > To summarize: Overall recommendation and also mostly required by code as > well to have co-axial for these gases, along with heat tracing for BCl3, > and scrubbing, with VCR fittings. > > > > Thanks, > > Kamal > > > > On Mon, Sep 14, 2020 at 9:43 AM Kamal Yadav wrote: > > Dear All, > > > > We will be installing SS gas tubing for Cl2, BCl3, HBr, SiH4. > > > > I have some experience in how industry does it, but wanted to know how > different universities do this. From some prior posts, I got to know > University of Michigan has co-axial tubing for all these gases and every > connector location for these gases is exhausted as well at their facility > > > > My queries are: > > 1. Is this how most of the Universities do it or there are places where > these gases are in single tubing [non co-axial or double contained]. > > 2. Also if you do orbital welding or just bending of the tubes? > > > > I have been informed it is based on the fire code of the city or county, > but it's not apparent from those documents. > > > > Thanks for your help. > > > > -- > > Thanks, > > Kamal > > > > > > > -- > > Thanks, > > Kamal > > > -- Thanks, Kamal -------------- next part -------------- An HTML attachment was scrubbed... URL: From kmcpeak at lsu.edu Fri Sep 18 01:28:55 2020 From: kmcpeak at lsu.edu (Kevin M McPeak) Date: Fri, 18 Sep 2020 05:28:55 +0000 Subject: [labnetwork] Open Position: Manager LSU Nanofabrication Facility Message-ID: Dear Colleagues, The LSU Nanofabrication Facility (lsu.edu/nanofabrication) has an open position for a manager. The official position has not been posted yet but if you are interested in applying please send me your resume and cover letter. The position description is attached. Regards, Kevin -- Kevin M. McPeak Assistant Professor | LSU Dept. of Chemical Engineering 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication -------------- next part -------------- A non-text attachment was scrubbed... Name: LSU_NFF_cleanroom_manager_job.pdf Type: application/pdf Size: 83149 bytes Desc: LSU_NFF_cleanroom_manager_job.pdf URL: From lambdaconsulting at comcast.net Fri Sep 18 12:29:34 2020 From: lambdaconsulting at comcast.net (Debbie Hagopian) Date: Fri, 18 Sep 2020 12:29:34 -0400 (EDT) Subject: [labnetwork] Looking for AJA sputtering system with load lock for purchase Message-ID: <517791501.18390.1600446575000@connect.xfinity.com> Must be in good condition. Alternatives will be considered. For use in COVID-19 research -------------- next part -------------- An HTML attachment was scrubbed... URL: From juanjo328 at gmail.com Sat Sep 19 08:07:30 2020 From: juanjo328 at gmail.com (juanjo3280) Date: Sat, 19 Sep 2020 14:07:30 +0200 Subject: [labnetwork] Resusictaton of Autoprobe CP AFM Message-ID: Hello Olusoji Ilori, I have seen your message, I am also trying to resurrect an Autoprobe CP, I have bought from Ebay these two instruments: https://www.ebay.es/itm/Thermo-Microscopes-Autoprobe-CP-Research-System-A1/283616083055?ssPageName=STRK%3AMEBIDX%3AIT&_trksid=p2060353.m2749.l2649 https://www.ebay.es/itm/Komplett-PARK-SCIENTIFIC-AUTOPROBE-AP-0100-MICROSCOPE-STAGE-SCANNER-MH113/184208734306?ssPageName=STRK%3AMEBIDX%3AIT&_trksid=p2060353.m2749.l2649 In the first instrument it comes with a PC and maybe with a little bit of luck that inside the PC there is still the software, if so I will send you a copy of the software. On the other hand, if you have got a copy of the software or have interesting information you can give me I would be very grateful. By the end of next week I will get the computer, I will inform you if there is software on the PC. Hopefully Best regards Juanjo -------------- next part -------------- An HTML attachment was scrubbed... URL: From kmcpeak at lsu.edu Sun Sep 20 23:21:50 2020 From: kmcpeak at lsu.edu (Kevin M McPeak) Date: Mon, 21 Sep 2020 03:21:50 +0000 Subject: [labnetwork] Crygenic Plasma Etching of Black Silicon Message-ID: Dear Colleagues, We have a user at the LSU Nanofab that has developed a recipe for etching black Si into 4" Si wafers at cryogenic temperatures (-130 C) using our Oxford ICP100 tool. The user also wants to produce Black Si on small pieces, e.g. 1" x 1" Si pieces which are attached to an Al masked Si carrier wafer. He is currently using Fomblin oil as a heat transfer agent between the Si chip and the carrier wafer (3 - 4 drops). Unfortunately, the small chips are giving him patchy black Si, whereas the whole 4" wafers are very uniform. I suspect this issue is related to heat transfer across the Fomblin layer. He is currently waiting 2 minutes after loading the carrier + Si chip before striking the plasma. 3 - 4 drops of Fomblin between the carrier and 1" x 1" chip. Does anyone have experience with cryogenic etching of Black Si on chips? If so, I would very much appreciate your thoughts on best practices for achieving good heat transfer to the chips. Thanks in advance. Regards, Kevin -- Kevin M. McPeak Assistant Professor | LSU Dept. of Chemical Engineering 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication From RobertVandusen at cunet.carleton.ca Mon Sep 21 11:09:38 2020 From: RobertVandusen at cunet.carleton.ca (Robert Vandusen) Date: Mon, 21 Sep 2020 15:09:38 +0000 Subject: [labnetwork] Crygenic Plasma Etching of Black Silicon In-Reply-To: References: Message-ID: Hi Kevin. In the past on our old ECR etcher we had some success using double sided carbon tape to adhere onto a backing wafer. The tape comes in sheets from SEM supply stores. It was important to trim the tape to ~ 1mm smaller than the sample so it was not exposed to the plasma. For removal we heated the backing wafer on a hotplate up to ~ 75 Deg C as I recall then gently peeled up the sample piece. I know it could could get messy if the sample doesn't some off right away, but acetone would usually clean it up. We were able to get black silicon at temperatures up to -25 deg C. Rob -----Original Message----- From: labnetwork-bounces at mtl.mit.edu On Behalf Of Kevin M McPeak Sent: September 20, 2020 11:22 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Crygenic Plasma Etching of Black Silicon [External Email] Dear Colleagues, We have a user at the LSU Nanofab that has developed a recipe for etching black Si into 4" Si wafers at cryogenic temperatures (-130 C) using our Oxford ICP100 tool. The user also wants to produce Black Si on small pieces, e.g. 1" x 1" Si pieces which are attached to an Al masked Si carrier wafer. He is currently using Fomblin oil as a heat transfer agent between the Si chip and the carrier wafer (3 - 4 drops). Unfortunately, the small chips are giving him patchy black Si, whereas the whole 4" wafers are very uniform. I suspect this issue is related to heat transfer across the Fomblin layer. He is currently waiting 2 minutes after loading the carrier + Si chip before striking the plasma. 3 - 4 drops of Fomblin between the carrier and 1" x 1" chip. Does anyone have experience with cryogenic etching of Black Si on chips? If so, I would very much appreciate your thoughts on best practices for achieving good heat transfer to the chips. Thanks in advance. Regards, Kevin -- Kevin M. McPeak Assistant Professor | LSU Dept. of Chemical Engineering 225-578-0058 | mcpeaklab.com | lsu.edu/nanofabrication _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork This email contains links to content or websites. Always be cautious when clicking on external links or attachments. If in doubt, please forward suspicious emails to phishing at carleton.ca. -----End of Disclaimer----- -------------- next part -------------- An HTML attachment was scrubbed... URL: From Thomas_Ferraguto at uml.edu Tue Sep 22 07:24:16 2020 From: Thomas_Ferraguto at uml.edu (Ferraguto, Thomas S) Date: Tue, 22 Sep 2020 11:24:16 +0000 Subject: [labnetwork] service ALD niobium oxide Message-ID: Colleagues, I have a customer that needs Niobium Oxide deposited in an ALD system. I don't have the capability in our Fiji system (without a capital purchase). If anyone could help them and provide service work for them (Guinevere and Yassine) it would be greatly appreciated. They are copied in this email , or contact me. Best Regards Thomas S. Ferraguto Saab ETIC Nanofabrication Laboratory Director Saab ETIC Building Director 1 University Avenue Lowell MA 01854 Mobile 617-755-0910 Land 978-934-1809 Fax 978-934-1014 -------------- next part -------------- An HTML attachment was scrubbed... URL: From codreanu at udel.edu Tue Sep 22 11:49:51 2020 From: codreanu at udel.edu (Iulian Codreanu) Date: Tue, 22 Sep 2020 11:49:51 -0400 Subject: [labnetwork] Graphitic carbon deposition Message-ID: Dear All, A customer is looking for graphitic carbon deposition capabilities. Can anyone help? Thank you, Iulian -- iulian Codreanu, Ph.D. Director, Nanofabrication Facility University of Delaware Harker ISE Lab, Room 163 221 Academy Street Newark, DE 19716 302-831-2784 http://udnf.udel.edu From crraum at gmail.com Tue Sep 22 14:47:28 2020 From: crraum at gmail.com (Christopher Raum) Date: Tue, 22 Sep 2020 11:47:28 -0700 Subject: [labnetwork] Job Opportunity with the Experimental Cosmology Group at UC Berkeley Message-ID: Hello All, The Experimental Cosmology Group at UC Berkeley is searching for an R&D engineer to perform as a process engineer in the Marvell Nanofabrication Laboratory. The complete job description and application process are accessed via: Research & Development Engineer (7119U) - #10465 Physics at Berkeley is home to faculty who are devoted to scientific discovery and the teaching of future physicists and students, both undergrad and grad, who come to learn and participate in cutting-edge research. The department has the full spectrum of scientists and has growing programs in: biophysics, quantum physics, atomic physics and quantum technologies. The Marvell NanoLab is a shared research center providing more than 100 Principal Investigators and over 500 academic and industrial researchers a complete set of micro- and nano-fabrication tools. Using the Marvell NanoLab facilities, this position involves professional engineering and engineering technician support as part of an academic instructional lab for experimental Cosmology research projects and programs. Engineering activities include the micro-fabrication design and construction of detectors at the Marvell Nanofabrication Laboratory, and detailed documentation of the fabrication processes. Responsibilities - Under general supervision, applicant participates in the micro-fabrication of millimeter wave detectors in the Marvell Nanofabrication Laboratory, including a nine layer, 24 step process flow on silicon wafers with metal and insulating layers. - Process engineering of the following materials: metal, oxide, and nitride deposition; optical lithography; and metal and dielectric etching. - Under general supervision, participates in process characterization, metrology, and analysis; and develops process flow and techniques to improve the yield of detector wafers. - Under general supervision, assists with maintenance and upgrades for tools used in our detector fabrication process. - Gathers and analyzes data; prepares formal engineering reports, drawings and status reports. - Work subject to review by more senior level Engineers. - Assists with implementation of business processes. Required Qualifications - Experience in micro-fabrication is required. - Working knowledge of engineering principles and methods in order to independently perform professional design work of limited scope and complexity. - Organizational abilities and decision-making to prioritize work assignments. - Effective written and verbal communication skills. - Ability to work in a collaborative manner, to assist in identifying any challenges or barriers. Education/Training: - Bachelor?s degree in engineering or science in related discipline and/or equivalent experience/training. Preferred Qualifications - Familiarity with mentioned processes and machines are desirable. - Familiarity with CAD design software such as L-Edit and AutoCAD are also desirable. Salary & Benefits Annual salary is commensurate with experience. For information on the comprehensive benefits package offered by the University visit: https://ucnet.universityofcalifornia.edu/compensation-and-benefits/index.html -Christopher Raum -- R&D Engineer 3 Experimental Cosmology Group Radio Astronomy Lab University of California, Berkeley 151 LeConte Hall Berkeley, CA, 94720 Email: craum at berkeley.edu -------------- next part -------------- An HTML attachment was scrubbed... URL: From chuang.qu at louisville.edu Tue Sep 22 20:04:14 2020 From: chuang.qu at louisville.edu (Qu,Chuang) Date: Wed, 23 Sep 2020 00:04:14 +0000 Subject: [labnetwork] Graphitic carbon deposition In-Reply-To: References: Message-ID: Hi Iulian, I?ve been depositing graphitic carbon at the University of Louisville. Can you give us more details about what you need? Thanks, Chuang Chuang Qu, Ph.D. Postdoctoral Associate, KY Multiscale Manufacturing and Nano Integration Node (MMNIN) RM225, Shumaker Research Building, University of Louisville Office#: 502-852-1868 http://www.kymultiscale.net/ > On Sep 22, 2020, at 7:50 PM, Iulian Codreanu wrote: > > ?CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. > > Dear All, > > A customer is looking for graphitic carbon deposition capabilities. Can > anyone help? > > Thank you, > > Iulian > > -- > iulian Codreanu, Ph.D. > Director, Nanofabrication Facility > University of Delaware > Harker ISE Lab, Room 163 > 221 Academy Street > Newark, DE 19716 > 302-831-2784 > https://nam03.safelinks.protection.outlook.com/?url=http%3A%2F%2Fudnf.udel.edu%2F&data=02%7C01%7Cchuang.qu%40louisville.edu%7C083979714d7d47efcd4008d85f52573f%7Cdd246e4a54344e158ae391ad9797b209%7C0%7C0%7C637364154553472010&sdata=nhjNueHWEpFdKUFaCzbCkroqzmYh%2FHGAdbriqSfDKYY%3D&reserved=0 > > > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://nam03.safelinks.protection.outlook.com/?url=https%3A%2F%2Fmtl.mit.edu%2Fmailman%2Flistinfo.cgi%2Flabnetwork&data=02%7C01%7Cchuang.qu%40louisville.edu%7C083979714d7d47efcd4008d85f52573f%7Cdd246e4a54344e158ae391ad9797b209%7C0%7C0%7C637364154553472010&sdata=So8VAk%2B5iv9fv6nzPIOOQhaVc91LBNTT3FG39vG2EMQ%3D&reserved=0 -------------- next part -------------- An HTML attachment was scrubbed... URL: From cschnitzer at stonehill.edu Wed Sep 23 07:50:01 2020 From: cschnitzer at stonehill.edu (Schnitzer, Cheryl) Date: Wed, 23 Sep 2020 11:50:01 +0000 Subject: [labnetwork] Instructors needed for manufacturing photonics program Message-ID: INSTRUCTORS NEEDED for the Advanced Manufacturing & Integrated Photonics (AMIP) Technician Certificate program, Stonehill College, Easton, MA. Part-time, evening courses, online and lab-based. Some experience in at least one of these areas is preferred: advanced manufacturing, tools and testing, statistical process control in photonics and automation. Contact Professor David Simon ASAP to inquire and apply, dsimon at stonehill.edu. Program information is found at: https://www.stonehill.edu/programs/photonics-certificate/. __________________________ Cheryl Schnitzer, Ph.D. ? Associate Professor, Department of Chemistry, Stonehill College ? co-PI, LEAP, Advanced Manufacturing & Integrated Photonics (AMIP) Technician Certificate Program ? Chair, Environmental Stewardship Council Pronouns: she/her/hers Good chemistry requires all of our elements. The Department of Chemistry and the Biochemistry Program value the perspectives, experiences, and identities of each and every individual. -------------- next part -------------- An HTML attachment was scrubbed... URL: From wjkiethe at ncsu.edu Thu Sep 24 11:05:39 2020 From: wjkiethe at ncsu.edu (Bill Kiether) Date: Thu, 24 Sep 2020 11:05:39 -0400 Subject: [labnetwork] 3M Novec 7200 Fluid Message-ID: Hi all, Anyone have experience with using this solvent? What are your impressions? And, has anyone used it on/in a vacuum system or can comment on its vacuum compatibility? Thanks in advance. See attached for more information on the solvent. Sincerely, Bill Kiether, PhD Senior Research Engineer NCSU Nanofabrication Facility -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: prodinfo_nvc7200.pdf Type: application/pdf Size: 125430 bytes Desc: not available URL: From j_hagopian at comcast.net Thu Sep 24 13:28:39 2020 From: j_hagopian at comcast.net (JOHN HAGOPIAN) Date: Thu, 24 Sep 2020 13:28:39 -0400 (EDT) Subject: [labnetwork] Position still open Carbon Nanotube Based Chemical Sensors Message-ID: <209647550.59747.1600968519675@connect.xfinity.com> Full or part time position in Maryland Developing carbon nanotube based chemical and biological sensors. Must have experience in this field. Appreciate relevant referrals. Materials Science, Bio-engineering, chemist reply to LambdaConsulting at comcast.net mailto:LambdaConsulting at comcast.net -------------- next part -------------- An HTML attachment was scrubbed... URL: From wrightsh at lnf.umich.edu Mon Sep 28 12:01:41 2020 From: wrightsh at lnf.umich.edu (Shawn Wright) Date: Mon, 28 Sep 2020 12:01:41 -0400 Subject: [labnetwork] Plasmatherm ISA Cards Message-ID: Hi Everyone, Does anyone have experience getting Plasmatherm's ISA IO cards to work with a computer that uses an IT8888G PCI-ISA Bridge? A little bit ago our systems 486 motherboard partly died, I lost video and replacing the ISA - VGA card with similar units off of eBay didn?t do the job. I was able to find a new single board computer and an ISA backplane with 8 slots, however I can?t get all of our IO cards to work with it. This new computer has a 2012 vintage CPU with a PCI - ISA bridge chip (IT8888G), and from what I?ve found it looks like pretty much any newer computer with ISA support uses this chip. Our system has 2 digital IO cards (Plasmatherm's 77026 96 channel ), and 3 analog IO cards (2 ROBOTROL ADA88?s and 1 Nova-Research ADS168). In my BIOS I?m able to map memory and IO address space to the ISA bus via the IT8888G chip. If I map IO space for the digital cards (320-32E and 330-33E) they seem to work as expected and I can manually turn things on and off via the software. However if I add in any or all of the analog boards (address space 300-303, 304-307 and 308-30B) my digital cards stop working. It seems like they?ll get one successful read/write cycle when I launch the software then stops because it?ll show the last state of all the digital inputs correctly, but no longer updates any of the d-in?s or d-out?s. It also looks like the SYSMON software does some sort of initialization on the 3 analog cards. Depending on what ones I have installed I can get an error on launch saying can?t initialize board 1, 2, or 3. Where as there doesn?t seem to be any checks to see if the digital cards are actually installed or not. The other weird thing is if I just open up more address space, like 320-39E, I would expect to get a can?t initialize board 1 error since 300-30B isn?t bridged so it shouldn?t be able to communicate with any analog boards. However I actually don?t get any board initialization errors, but the digital cards also don?t work. I also have options for DDMA channels in my BIOS, I?ve tried with them enabled and not enabled and it doesn?t seem to make any difference. The ISA backplane also came with a set of termination resistors, I?ve tried with them all installed and none of them installed and it doesn?t seem to make any difference. This is the SBC I?m using: https://www.advantech.com/products/1-2jkn7b/pca-6763/mod_ed19377c-5db9-4024-bf7b-c556dfb2afac This is the PCI - ISA bridge chip: http://www.ite.com.tw/uploads/product_download/IT8888G_V0.9_05162005.pdf Thanks, Shawn Wright Lurie Nanofabrication Facility University of Michigan -------------- next part -------------- An HTML attachment was scrubbed... URL: From hromans at eng.ucsd.edu Mon Sep 28 22:11:13 2020 From: hromans at eng.ucsd.edu (J Romans) Date: Mon, 28 Sep 2020 19:11:13 -0700 Subject: [labnetwork] Plasmatherm ISA Cards In-Reply-To: References: Message-ID: Just spitballing: you don't mention looking at any interrupt settings. Is it possible you have a conflict? - Hal J. Hal Romans Equipment Engineer Nano3 Cleanroom Facility University of California San Diego ph: (858) 534-6674 On Mon, Sep 28, 2020 at 4:44 PM Shawn Wright wrote: > Hi Everyone, > > Does anyone have experience getting Plasmatherm's ISA IO cards to work > with a computer that uses an IT8888G PCI-ISA Bridge? > > A little bit ago our systems 486 motherboard partly died, I lost video and > replacing the ISA - VGA card with similar units off of eBay didn?t do the > job. I was able to find a new single board computer and an ISA backplane > with 8 slots, however I can?t get all of our IO cards to work with it. > This new computer has a 2012 vintage CPU with a PCI - ISA bridge chip > (IT8888G), and from what I?ve found it looks like pretty much any newer > computer with ISA support uses this chip. > > Our system has 2 digital IO cards (Plasmatherm's 77026 96 channel ), and 3 > analog IO cards (2 ROBOTROL ADA88?s and 1 Nova-Research ADS168). In my BIOS > I?m able to map memory and IO address space to the ISA bus via the IT8888G > chip. If I map IO space for the digital cards (320-32E and 330-33E) they > seem to work as expected and I can manually turn things on and off via the > software. However if I add in any or all of the analog boards (address > space 300-303, 304-307 and 308-30B) my digital cards stop working. It > seems like they?ll get one successful read/write cycle when I launch the > software then stops because it?ll show the last state of all the digital > inputs correctly, but no longer updates any of the d-in?s or d-out?s. > > It also looks like the SYSMON software does some sort of initialization on > the 3 analog cards. Depending on what ones I have installed I can get an > error on launch saying can?t initialize board 1, 2, or 3. Where as there > doesn?t seem to be any checks to see if the digital cards are actually > installed or not. The other weird thing is if I just open up more address > space, like 320-39E, I would expect to get a can?t initialize board 1 error > since 300-30B isn?t bridged so it shouldn?t be able to communicate with any > analog boards. However I actually don?t get any board initialization > errors, but the digital cards also don?t work. > > I also have options for DDMA channels in my BIOS, I?ve tried with them > enabled and not enabled and it doesn?t seem to make any difference. The > ISA backplane also came with a set of termination resistors, I?ve tried > with them all installed and none of them installed and it doesn?t seem to > make any difference. > > This is the SBC I?m using: > https://www.advantech.com/products/1-2jkn7b/pca-6763/mod_ed19377c-5db9-4024-bf7b-c556dfb2afac > > > This is the PCI - ISA bridge chip: > http://www.ite.com.tw/uploads/product_download/IT8888G_V0.9_05162005.pdf > > > > Thanks, > Shawn Wright > Lurie Nanofabrication Facility > University of Michigan > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > > https://urldefense.com/v3/__https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!Mih3wA!Q9yNwQcUGHJ3Vh-NGSCXqIA7vggIyan4UeYOM3wM4fgVHh3rj8GzV2XyEwtA1jQ$ > -------------- next part -------------- An HTML attachment was scrubbed... URL: From matt at 3ctechnical.com Tue Sep 29 12:23:45 2020 From: matt at 3ctechnical.com (Matt Pace) Date: Tue, 29 Sep 2020 16:23:45 +0000 Subject: [labnetwork] Plasmatherm ISA Cards In-Reply-To: References: Message-ID: <5f735a7cb372f532f6000006@polymail.io> Hi Shawn - not sure if this is helpful or not, but I know we had many struggles with timing on the GCA Steppers we work on when we implemented "newer" computers than the OEM used. We would see a number of strange things happen due to timing. I am not sure how you would prove that other than some serious timing measurements on an original setup (or maybe documentation) vs. what you have now. Best, Matt --- Matt Pace 3c Technical matt at 3ctechnical.com ( matt at 3ctechnical.com ) www.3ctechnical.com ( http://www.3ctechnical.com/ ) 480-963-4559?voice On Mon, Sep 28th, 2020 at 7:11 PM, J Romans wrote: > > Just spitballing: you don't mention?looking at any interrupt settings. Is > it possible you have a conflict? > - Hal > ? > J. Hal Romans > Equipment Engineer > Nano3 Cleanroom Facility > University of California San Diego > ph: (858) 534-6674 > > > > > On Mon, Sep 28, 2020 at 4:44 PM Shawn Wright < wrightsh at lnf.umich.edu > > wrote: > > >> Hi Everyone, >> >> >> Does anyone have experience getting Plasmatherm's ISA IO cards to work >> with a computer that uses an IT8888G PCI-ISA Bridge? >> >> >> A little bit ago our systems 486 motherboard partly died, I lost video and >> replacing the ISA - VGA card with similar units off of eBay didn?t do the >> job.? I was able to find a new single board computer and an ISA backplane >> with 8 slots, however I can?t get all of our IO cards to work with it.? >> This new computer has a 2012 vintage CPU with a PCI - ISA bridge chip >> (IT8888G), and from what I?ve found it looks like pretty much any newer >> computer with ISA support uses this chip. >> >> >> Our system has 2 digital IO cards (Plasmatherm's 77026 96 channel ), and 3 >> analog IO cards (2 ROBOTROL ADA88?s and 1 Nova-Research ADS168). In my >> BIOS I?m able to map memory and IO address space to the ISA bus via the >> IT8888G chip.? If I map IO space for the digital cards (320-32E and >> 330-33E) they seem to work as expected and I can manually turn things on >> and off via the software.? However if I add in any or all of the analog >> boards (address space 300-303, 304-307 and 308-30B) my digital cards stop >> working.? It seems like they?ll get one successful read/write cycle when I >> launch the software then stops because it?ll show the last state of all >> the digital inputs correctly, but no longer updates any of the d-in?s or >> d-out?s. >> >> >> It also looks like the SYSMON software does some sort of initialization on >> the 3 analog cards.? Depending on what ones I have installed I can get an >> error on launch saying can?t initialize board 1, 2, or 3.? Where as there >> doesn?t seem to be any checks to see if the digital cards are actually >> installed or not.? The other weird thing is if I just open up more address >> space, like 320-39E, I would expect to get a can?t initialize board 1 >> error since 300-30B isn?t bridged so it shouldn?t be able to communicate >> with any analog boards.? However I actually don?t get any board >> initialization errors, but the digital cards also don?t work. >> >> >> I also have options for DDMA channels in my BIOS, I?ve tried with them >> enabled and not enabled and it doesn?t seem to make any difference.? The >> ISA backplane also came with a set of termination resistors, I?ve tried >> with them all installed and none of them installed and it doesn?t seem to >> make any difference. >> >> >> This is the SBC I?m using:?https://www.advantech.com/products/1-2jkn7b/pca-6763/mod_ed19377c-5db9-4024-bf7b-c556dfb2afac >> ( >> https://urldefense.com/v3/__https://www.advantech.com/products/1-2jkn7b/pca-6763/mod_ed19377c-5db9-4024-bf7b-c556dfb2afac__;!!Mih3wA!Q9yNwQcUGHJ3Vh-NGSCXqIA7vggIyan4UeYOM3wM4fgVHh3rj8GzV2Xy-7dXjWw$ >> ) >> >> >> This is the PCI - ISA bridge chip:?http://www.ite.com.tw/uploads/product_download/IT8888G_V0.9_05162005.pdf >> ( >> https://urldefense.com/v3/__http://www.ite.com.tw/uploads/product_download/IT8888G_V0.9_05162005.pdf__;!!Mih3wA!Q9yNwQcUGHJ3Vh-NGSCXqIA7vggIyan4UeYOM3wM4fgVHh3rj8GzV2XyDStyCOY$ >> ) >> >> >> >> >> Thanks, >> Shawn Wright >> Lurie Nanofabrication Facility >> University of Michigan >> _______________________________________________ >> labnetwork mailing list >> labnetwork at mtl.mit.edu >> https://urldefense.com/v3/__https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork__;!!Mih3wA!Q9yNwQcUGHJ3Vh-NGSCXqIA7vggIyan4UeYOM3wM4fgVHh3rj8GzV2XyEwtA1jQ$ >> >> > > -------------- next part -------------- An HTML attachment was scrubbed... URL: From eric at dssurplus.com Wed Sep 30 10:20:12 2020 From: eric at dssurplus.com (eric at dssurplus.com) Date: Wed, 30 Sep 2020 10:20:12 -0400 Subject: [labnetwork] Plasmatherm ISA Card- Computer Motherboards & full Computer replacements for Plasmatherm systems. Message-ID: <082301d69734$cfbf6990$6f3e3cb0$@dssurplus.com> Shawn, I saw your note on Labnetwork regarding the Plasmatherm computer, Motherboard & Analog/Digital cards. The problem you are experiencing is due to the fact Plasmatherm older software was key coded due to the technology back then. So you are limited to the type of Motherboards, hard drive size, graphic & ethernet drivers you can use as replacements. That is why Plasmatherm offers an upgrade which will cost you approx. $45K. Direct Source Surplus specializes and Plasmatherm computers with software, Analog, Digital cards and other spares parts for all types of Plasmatherm systems at a less expensive alternative. We have several already set up and tested computers for both 790 and SLR type systems. Please give us a call or send me an email if you have any questions or need spares. My contact information is listed below. Direct Source Surplus, LLC 5101 Deerchase Trail Wake Forest, NC 27587 (919) 556-8930 Email: eric at dssurplus.com www.dssurplus.com From: Shawn Wright > Date: September 28, 2020 at 19:45:03 EDT To: labnetwork at mtl.mit.edu Subject: [labnetwork] Plasmatherm ISA Cards ? Hi Everyone, Does anyone have experience getting Plasmatherm's ISA IO cards to work with a computer that uses an IT8888G PCI-ISA Bridge? A little bit ago our systems 486 motherboard partly died, I lost video and replacing the ISA - VGA card with similar units off of eBay didn?t do the job. I was able to find a new single board computer and an ISA backplane with 8 slots, however I can?t get all of our IO cards to work with it. This new computer has a 2012 vintage CPU with a PCI - ISA bridge chip (IT8888G), and from what I?ve found it looks like pretty much any newer computer with ISA support uses this chip. Our system has 2 digital IO cards (Plasmatherm's 77026 96 channel ), and 3 analog IO cards (2 ROBOTROL ADA88?s and 1 Nova-Research ADS168). In my BIOS I?m able to map memory and IO address space to the ISA bus via the IT8888G chip. If I map IO space for the digital cards (320-32E and 330-33E) they seem to work as expected and I can manually turn things on and off via the software. However if I add in any or all of the analog boards (address space 300-303, 304-307 and 308-30B) my digital cards stop working. It seems like they?ll get one successful read/write cycle when I launch the software then stops because it?ll show the last state of all the digital inputs correctly, but no longer updates any of the d-in?s or d-out?s. It also looks like the SYSMON software does some sort of initialization on the 3 analog cards. Depending on what ones I have installed I can get an error on launch saying can?t initialize board 1, 2, or 3. Where as there doesn?t seem to be any checks to see if the digital cards are actually installed or not. The other weird thing is if I just open up more address space, like 320-39E, I would expect to get a can?t initialize board 1 error since 300-30B isn?t bridged so it shouldn?t be able to communicate with any analog boards. However I actually don?t get any board initialization errors, but the digital cards also don?t work. I also have options for DDMA channels in my BIOS, I?ve tried with them enabled and not enabled and it doesn?t seem to make any difference. The ISA backplane also came with a set of termination resistors, I?ve tried with them all installed and none of them installed and it doesn?t seem to make any difference. This is the SBC I?m using: https://www.advantech.com/products/1-2jkn7b/pca-6763/mod_ed19377c-5db9-4024-bf7b-c556dfb2afac This is the PCI - ISA bridge chip: http://www.ite.com.tw/uploads/product_download/IT8888G_V0.9_05162005.pdf Thanks, Shawn Wright Lurie Nanofabrication Facility University of Michigan _______________________________________________ labnetwork mailing list labnetwork at mtl.mit.edu https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork Eric Traphagen 919-556-8930 eric at dssurplusc.om www.dssurplus.com -------------- next part -------------- An HTML attachment was scrubbed... URL: From michael.martin at louisville.edu Wed Sep 30 11:05:09 2020 From: michael.martin at louisville.edu (Martin,Michael David) Date: Wed, 30 Sep 2020 15:05:09 +0000 Subject: [labnetwork] Plasmatherm ISA Cards In-Reply-To: References: Message-ID: Similar to what Hal mentioned, you might want to pay some attention to IRQs and other resources. Specifically, I remember having ISA boards that wanted a specific IRQ that would get reassigned when you added a new board. There used to be an option to reverve an IRQ in Win98 (or that vintage of OS's). So you might note which resources (IRQ, memory addr, etc) the boards are using when functional and reserve those before you add the new boards. ________________________________ From: labnetwork-bounces at mtl.mit.edu on behalf of Shawn Wright Sent: Monday, September 28, 2020 12:01 PM To: labnetwork at mtl.mit.edu Subject: [labnetwork] Plasmatherm ISA Cards CAUTION: This email originated from outside of our organization. Do not click links, open attachments, or respond unless you recognize the sender's email address and know the contents are safe. Hi Everyone, Does anyone have experience getting Plasmatherm's ISA IO cards to work with a computer that uses an IT8888G PCI-ISA Bridge? A little bit ago our systems 486 motherboard partly died, I lost video and replacing the ISA - VGA card with similar units off of eBay didn?t do the job. I was able to find a new single board computer and an ISA backplane with 8 slots, however I can?t get all of our IO cards to work with it. This new computer has a 2012 vintage CPU with a PCI - ISA bridge chip (IT8888G), and from what I?ve found it looks like pretty much any newer computer with ISA support uses this chip. Our system has 2 digital IO cards (Plasmatherm's 77026 96 channel ), and 3 analog IO cards (2 ROBOTROL ADA88?s and 1 Nova-Research ADS168). In my BIOS I?m able to map memory and IO address space to the ISA bus via the IT8888G chip. If I map IO space for the digital cards (320-32E and 330-33E) they seem to work as expected and I can manually turn things on and off via the software. However if I add in any or all of the analog boards (address space 300-303, 304-307 and 308-30B) my digital cards stop working. It seems like they?ll get one successful read/write cycle when I launch the software then stops because it?ll show the last state of all the digital inputs correctly, but no longer updates any of the d-in?s or d-out?s. It also looks like the SYSMON software does some sort of initialization on the 3 analog cards. Depending on what ones I have installed I can get an error on launch saying can?t initialize board 1, 2, or 3. Where as there doesn?t seem to be any checks to see if the digital cards are actually installed or not. The other weird thing is if I just open up more address space, like 320-39E, I would expect to get a can?t initialize board 1 error since 300-30B isn?t bridged so it shouldn?t be able to communicate with any analog boards. However I actually don?t get any board initialization errors, but the digital cards also don?t work. I also have options for DDMA channels in my BIOS, I?ve tried with them enabled and not enabled and it doesn?t seem to make any difference. The ISA backplane also came with a set of termination resistors, I?ve tried with them all installed and none of them installed and it doesn?t seem to make any difference. This is the SBC I?m using: https://www.advantech.com/products/1-2jkn7b/pca-6763/mod_ed19377c-5db9-4024-bf7b-c556dfb2afac This is the PCI - ISA bridge chip: http://www.ite.com.tw/uploads/product_download/IT8888G_V0.9_05162005.pdf Thanks, Shawn Wright Lurie Nanofabrication Facility University of Michigan -------------- next part -------------- An HTML attachment was scrubbed... URL: From brian.wajdyk at uky.edu Wed Sep 30 13:41:10 2020 From: brian.wajdyk at uky.edu (Wajdyk, Brian L.) Date: Wed, 30 Sep 2020 17:41:10 +0000 Subject: [labnetwork] Cee 100x filter Message-ID: Hello all, CEE (Cost effective equipment) fails to respond about a replacement vacuum reservoir for a C100x part number 90010B. It looks simple to make. Does anyone know if there is any magic involved? What is the filter medium? Is there one or is it a mere chamber? Thanks for your help, Brian Wajdyk [cid:168f5906-71f5-42be-b8d9-d71ed7f7ca92] ********************************************* Brian Wajdyk Facility Manager / Research Center for Nanoscale Science and Engineering. University of Kentucky Office: ASTeCC 372 Email: Brian.Wajdyk at uky.edu Ph: 859-218-6548 ********************************************* -------------- next part -------------- An HTML attachment was scrubbed... URL: -------------- next part -------------- A non-text attachment was scrubbed... Name: IMG_20200922_100053037.jpg Type: image/jpeg Size: 3455528 bytes Desc: IMG_20200922_100053037.jpg URL: From jeanne.guo at rice.edu Wed Sep 30 17:04:24 2020 From: jeanne.guo at rice.edu (Jing Guo) Date: Wed, 30 Sep 2020 16:04:24 -0500 Subject: [labnetwork] Cee 100x filter In-Reply-To: References: Message-ID: <395D5D4D-A4CF-4B68-924B-0B161371C466@rice.edu> Hi Brian, How are you! You need to talk to Fred. He is the customer support engineer at CEE. The contact information on their website takes a little bit long to reach. Here is the contact information. Usually Fred will response immediately. You could also call him. Fred Stevenson Customer Support Engr. Cost Effective Equipment, LLC Phone: +1(573) 466-4310 Email: support at costeffectiveequipment.com Website: https://www.costeffectiveequipment.com I am glad that you have been back to Kentucky again. Let me know if you still have problem to reach CEE. Go Cats! Best, Jing --------------------------------------- Jing Guo Ph.D. Research Scientist SEA Cleanroom (SST 017) Rice University Houston, TX jeanne.guo at rice.edu 713-348-8227 > On Sep 30, 2020, at 12:41 PM, Wajdyk, Brian L. wrote: > > Hello all, > > CEE (Cost effective equipment) fails to respond about a replacement vacuum reservoir for a C100x part number 90010B. It looks simple to make. Does anyone know if there is any magic involved? What is the filter medium? Is there one or is it a mere chamber? > > Thanks for your help, > Brian Wajdyk > > > > > > > > ********************************************* > Brian Wajdyk > Facility Manager / Research > Center for Nanoscale Science and Engineering. > University of Kentucky > Office: ASTeCC 372 > Email: Brian .Wajdyk @uky.edu > Ph: 859-218-6548 > ********************************************* > _______________________________________________ > labnetwork mailing list > labnetwork at mtl.mit.edu > https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork -------------- next part -------------- An HTML attachment was scrubbed... URL: From wrightsh at lnf.umich.edu Wed Sep 30 18:53:50 2020 From: wrightsh at lnf.umich.edu (Shawn Wright) Date: Wed, 30 Sep 2020 18:53:50 -0400 Subject: [labnetwork] Plasmatherm ISA Cards In-Reply-To: References: Message-ID: <042F56B2-63C5-4418-B07B-B7C2EE58F19C@lnf.umich.edu> Hi Everyone, Thanks for the help and suggestions, we?re back online now. It turns out the old analog boards (ADA88?s from ROBOTROL) weren?t able to run at the normal speed of an ISA bus and need more like 4.77MHz. Luckily Plasmatherm sells more modern replacements from Nova Research (ADS168) and those are fine at the higher speed (8.25 MHz in this case since the PCI-ISA bridge chip divides the PCI clock by 4). Shawn > On Sep 28, 2020, at 12:01 PM, Shawn Wright wrote: > > Hi Everyone, > > Does anyone have experience getting Plasmatherm's ISA IO cards to work with a computer that uses an IT8888G PCI-ISA Bridge? > > A little bit ago our systems 486 motherboard partly died, I lost video and replacing the ISA - VGA card with similar units off of eBay didn?t do the job. I was able to find a new single board computer and an ISA backplane with 8 slots, however I can?t get all of our IO cards to work with it. This new computer has a 2012 vintage CPU with a PCI - ISA bridge chip (IT8888G), and from what I?ve found it looks like pretty much any newer computer with ISA support uses this chip. > > Our system has 2 digital IO cards (Plasmatherm's 77026 96 channel ), and 3 analog IO cards (2 ROBOTROL ADA88?s and 1 Nova-Research ADS168). In my BIOS I?m able to map memory and IO address space to the ISA bus via the IT8888G chip. If I map IO space for the digital cards (320-32E and 330-33E) they seem to work as expected and I can manually turn things on and off via the software. However if I add in any or all of the analog boards (address space 300-303, 304-307 and 308-30B) my digital cards stop working. It seems like they?ll get one successful read/write cycle when I launch the software then stops because it?ll show the last state of all the digital inputs correctly, but no longer updates any of the d-in?s or d-out?s. > > It also looks like the SYSMON software does some sort of initialization on the 3 analog cards. Depending on what ones I have installed I can get an error on launch saying can?t initialize board 1, 2, or 3. Where as there doesn?t seem to be any checks to see if the digital cards are actually installed or not. The other weird thing is if I just open up more address space, like 320-39E, I would expect to get a can?t initialize board 1 error since 300-30B isn?t bridged so it shouldn?t be able to communicate with any analog boards. However I actually don?t get any board initialization errors, but the digital cards also don?t work. > > I also have options for DDMA channels in my BIOS, I?ve tried with them enabled and not enabled and it doesn?t seem to make any difference. The ISA backplane also came with a set of termination resistors, I?ve tried with them all installed and none of them installed and it doesn?t seem to make any difference. > > This is the SBC I?m using: https://www.advantech.com/products/1-2jkn7b/pca-6763/mod_ed19377c-5db9-4024-bf7b-c556dfb2afac > > This is the PCI - ISA bridge chip: http://www.ite.com.tw/uploads/product_download/IT8888G_V0.9_05162005.pdf > > > Thanks, > Shawn Wright > Lurie Nanofabrication Facility > University of Michigan -------------- next part -------------- An HTML attachment was scrubbed... URL: From psharris at trilicium.ca Wed Sep 30 22:06:58 2020 From: psharris at trilicium.ca (P. Scott Harris) Date: Wed, 30 Sep 2020 22:06:58 -0400 Subject: [labnetwork] Plasmatherm ISA Cards In-Reply-To: <042F56B2-63C5-4418-B07B-B7C2EE58F19C@lnf.umich.edu> References: <042F56B2-63C5-4418-B07B-B7C2EE58F19C@lnf.umich.edu> Message-ID: Hi Shawn, Just for future reference and anybody else who runs into this kind of thing, since you found that you needed to adjust the I/O speed of the bus, I looked more closely at the ITE8888G chip documentation (http://www.ite.com.tw/uploads/product_download/IT8888G_V0.9_05162005.pdf) and found that there is a register that you could set that would slow down the bus accesses by extending the recovery time. It's on page 30, and called the 'IO recovery register' #51. By default it looks like the ISA bus runs at top speed (3.5 BCLK cycles where a BCLK cycle is 1/4 of the PCICLK which seems to be 33MHz). So the ISA bus clock is running at 8.25 MHz and the recovery time looks to be about 425 nsec which might be too fast for your old boards. You could, with some simple DOS code, extend the recovery time to as much as 1.4 usec (8-bit I/O) or? 900 nsec (16-bit I/O) which might possibly make your boards happy. Usually this sort of control is provided by the BIOS but that doesn't seem to be the case for this motherboard. You would have to play a little bit with this timing register in order to confirm that this actually fixes your original problem. You have no real incentive to play since you now have a working system but the information might be useful for some other applications in the future. On 9/30/2020 6:53 PM, Shawn Wright wrote: > Hi Everyone, > > Thanks for the help and suggestions, we?re back online now. ?It turns out the > old analog boards (ADA88?s from ROBOTROL) weren?t able to run at the normal > speed of an ISA bus and need more like 4.77MHz. ?Luckily Plasmatherm sells > more modern replacements from Nova Research (ADS168) and those are fine at the > higher speed (8.25 MHz in this case since the PCI-ISA bridge chip divides the > PCI clock by 4). > > Shawn > -- Best regards, P. Scott Harris, M.Eng., P.Eng. H&L Associates 21 Parkmount Crescent, Ottawa, Ontario K2H 5T3 (613) 828-1462